JP2012018997A - Sound absorbing structure of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sound absorbing structure capable of improving sound absorbing effect while keeping an installation space small.SOLUTION: In a sound absorbing mechanism, a plurality of sound absorbing materials 4 in prescribed forms are arranged at predetermined intervals in a cooling fluid passage from a blower 3 mounted on an electronic device 2, thereby forming a plurality of penetrating holes 5. The plurality of sound absorbing materials 4 are so arranged that sound coming from the blower 3 and vertically entering penetrating surfaces of the penetrating holes 5 does not directly go out of the electronic device 2. By attaching vibration damping materials 6, 7 and 8 to each of the sound absorbing materials 4, vibration of the sound absorbing materials 4 is suppressed, and the sound is prevented from passing through the sound absorbing materials 4 and directly going out of the electronic device 2 in the horizontal direction.

Description

  The present invention relates to a sound absorbing structure of an electronic device having a structure in which a heating element is cooled by a blower.

  It is a well-known fact that semiconductors used in electronic devices, especially semiconductors represented by CPUs of information processing devices, have been evolving rapidly, and the amount of heat generation and density has been increasing. In connection with this, the noise value of the apparatus is also increasing due to an increase in the number of mounted blowers and the number of rotations for cooling. On the other hand, electronic devices are not installed in a conventional dedicated machine room, but are frequently installed in offices, and there is a strong demand for noise reduction of electronic devices. Therefore, a sound absorbing structure using a sound absorbing material is often installed in the vicinity of a blower inside the electronic device casing or in a rack cabinet or the like in which an electronic device outside the electronic device casing is mounted. The conventional sound absorbing structure in which a sound absorbing path is provided by combining a plurality of sound absorbing materials has a large volume of the sound absorbing structure itself, and there are many restrictions on installation space and handling, and there is a problem that a plurality of sound absorbing materials are not combined. Due to the balanced sound absorbing structure, there is a possibility that the distribution of the cooling medium may vary, which may be an obstacle to uniformly cooling the inside of the electronic device.

  Furthermore, recent electronic devices have been used for a plurality of generations by replacing the CPU mounted therein, while the internal substrate and sheet metal structure are basically the same. Therefore, in order to obtain the cooling performance corresponding to each generation, the rotation speed of the blower is changed, or the sound absorption structure is changed each time according to the allowable fluid resistance of the internal device.

  In order to solve these problems, Japanese Patent Laid-Open No. 2008-235381 discloses that the shape of the sound absorbing material is inclined, V-shaped or U-shaped, and a plurality of sound absorbing materials are arranged at a predetermined interval to thereby form a plurality of through holes. And a sound absorbing structure in which a plurality of sound absorbing materials are arranged so that sound that is perpendicularly incident on the through surface of the through hole from the blower does not directly go out of the electronic device.

  However, the sound path to the outside of the electronic device has a path that passes through the sound-absorbing material horizontally and goes to the outside as it is, other than following the inclined, V-shaped or U-shaped path from the through-hole, and this path depends on the location. Has a problem that it goes out of the electronic device without passing through the sound absorbing material sufficiently. In order to solve this, there was only a method of thickening the sound absorbing material itself and sufficiently absorbing sound even for a path passing through the sound absorbing material horizontally, but this method increases the volume of the sound absorbing structure itself, There was a problem that the installation space expanded.

Japanese Unexamined Patent Publication No. H5-226864 Japanese Utility Model Publication No. 3-48293 Japanese Utility Model Publication No. 63-145392 JP 2008-235381

  FIG. 10 shows a sound absorbing structure of a conventional electronic device. FIG. 10 shows a sound absorbing structure for an electronic device in which a plurality of through holes 105 are provided by arranging a plurality of sound absorbing materials 104 of a predetermined form at predetermined intervals in the flow path of the cooling medium from the blower 103 in the electronic device 102. By making the path of the through-hole 105 inclined, V-shaped or U-shaped, the sound that is perpendicularly incident on the through-surface of the through-hole 105 from the blower 103 directly goes out of the rack 101 on which the electronic device is mounted. I am trying not to. Further, the thickness of the sound absorbing material 104 can be suppressed by making the path of the through-hole 105 inclined, V-shaped or U-shaped, thereby enabling a compact design.

  However, the conventional sound absorbing structure shown in FIG. 10 has the following problems. The sound path to the outside of the electronic device 102 passes through the sound absorbing material 104 in a horizontal direction other than following the inclined, V-shaped or U-shaped path from the through-hole 105, and there is a path to go to the outside as it is. Sound is sufficiently absorbed in the sound path 106 passing horizontally through the sound absorbing material 104, but the sound is not sufficiently passed through the sound absorbing material 104 in the sound path 107 passing horizontally through the sound absorbing material 104, and an electronic device is mounted. There has been a problem of going out of the rack 101. In order to solve this problem, there is only a method of thickening the sound absorbing material 104 itself so that the sound absorbing material 104 has a sufficient thickness even with respect to a path that passes through the sound absorbing material 104 horizontally. There is a problem that the volume of the apparatus increases and the installation space increases.

  Further, since the sound absorbing material 104 itself is fixed only on the side surface of the casing, there is a problem that the sound absorbing material 104 vibrates due to the wind from the blower 103 and hits the door on the exhaust side of the cooling medium, resulting in noise.

  Accordingly, the development of a sound absorbing structure that increases the sound absorbing effect while keeping the installation space small, and the development of a sound absorbing structure that fixes a sound absorbing material and suppresses vibrations have been problems.

  The present invention provides a sound absorbing structure for an electronic device in which a plurality of sound absorbing materials having a predetermined shape are arranged at a predetermined interval in a flow path of a cooling medium from a blower, and a plurality of through holes are provided. The plurality of sound absorbing materials are arranged so that sound perpendicularly incident on the penetrating surface of the mouth does not directly go outside the electronic device, and a vibration damping material is attached to the sound absorbing material, so that the sound absorbing material of the blower In addition to suppressing vibration, sound is insulated so that sound does not pass directly through the sound absorbing material in the horizontal direction.

  By installing the sound absorbing structure of the present invention inside or outside the casing of an electronic device equipped with a blower, the noise of the electronic device is reduced as compared with the conventional sound absorbing structure while maintaining the cooling performance of the electronic device. be able to. Furthermore, by changing the installation position, quantity, or angle of the basic sound-absorbing member of the sound-absorbing structure, it is possible to respond to changes in the rack cabinet size and to the changes in required cooling performance for multiple generations of CPUs inside electronic devices. Become.

  Further, since the through-hole is a space through which the sound collides and is absorbed at the same time as the through-hole of the cooling medium, if the through-hole area is the same, the longer the path of the through-hole, the greater the sound attenuation. Therefore, since the sound absorbing structure of the present invention has a large number of through-holes that form long sound absorbing paths that are inclined or V-shaped, the volume required for the sound absorbing structure can be made compact. Moreover, the sound absorbing structure of the present invention can provide a uniform distribution of the cooling medium before and after the through-hole and the pressure loss when the cooling fluid passes by providing the through-hole in a well-balanced position and size. Does not interfere with cooling performance.

1 is an overall cross-sectional view of a first embodiment of the present invention. It is sectional drawing of the side surface of the sound absorption structure of 1st Example of this invention. It is sectional drawing of the side surface of the sound-absorbing structure of 2nd Example of this invention. It is sectional drawing of the side surface of the sound absorption structure of the 3rd Example of this invention. It is sectional drawing of the side surface of the sound-absorbing structure of the 4th Example of this invention. It is a general view of the 5th example of the present invention. It is a figure of the rear door of the 5th Example of this invention. It is an attachment figure of the fixed sheet metal of a rear door, a sound absorption material, and a damping material of the 5th example of the present invention. It is an attachment figure of the sound-absorbing material and damping material of the 5th example of the present invention. It is a whole sectional view of the conventional sound absorption structure for electronic devices.

  Embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows an overall cross-sectional view of the first embodiment of the present invention. This is a side view of a rack cabinet on which electronic devices are mounted. A plurality of sound absorbing materials 4 of a predetermined form are arranged at predetermined intervals in the flow path of the cooling medium from the blower 3 mounted on the electronic device 2, a plurality of through holes 5 are provided, and the through holes 5 penetrate from the blower 3. A plurality of sound-absorbing materials 4 are arranged so that sound that is perpendicularly incident on the surface does not directly go out of the rack 1 mounted with electronic equipment. Then, as viewed from the electronic device 2, a rack in which the electronic device is directly mounted in the horizontal direction through the sound absorbing material 4 by attaching the damping materials 6, 7, 8 to the outside of each sound absorbing material 4. The sound insulation effect is given so that it may not come out of 1. Further, the damping materials 6, 7, and 8 also have an effect of fixing the sound absorbing material 4 and suppressing the vibration of the sound absorbing material 4. As the sound absorbing material, a sound absorbing structure represented by glass wool or urethane foam is used.

  The mounting position of the electronic device 2 is mounted in the center of the rack 1 in FIG. 1, but the mounting position is because the sound absorbing structure composed of a plurality of sound absorbing materials 4 and through holes 5 is arranged on the entire exhaust side. Does not matter.

  FIG. 2 shows a cross-sectional view of the sound absorbing structure of the first embodiment. Since the cooling fluid is blocked by the sound absorbing material 21, the cooling fluid passes through the through-hole 22 and is exhausted to the outside. On the other hand, the noise is absorbed and attenuated by the sound absorbing material 21 or enters the vertical direction with respect to the through hole 22 and is absorbed and attenuated through the path 23 of the through hole. Furthermore, noise that cannot be attenuated by the sound absorbing material 21 is prevented from passing directly through the sound absorbing material by the damping material 24 attached to the outside of the sound absorbing material 21. In the case where the sound absorbing structure portion is configured by the conventional sound absorbing material 21, the through-hole 22, and the through-hole path 23, noise that could not be attenuated by the sound-absorbing material 21 might come out to the outside. The present invention has an effect of further enhancing sound absorption by combining the sound absorbing material 21 and the damping material 24.

  A second embodiment according to the present invention is shown in FIG. The structure of the sound absorber 31, the through-hole 32, the through-hole path 33 and the damping material 34 is exactly the same as in FIG. 2, and the cooling medium is blocked by the sound-absorbing material. Exhausted outside the street. On the other hand, the noise is absorbed and attenuated by the sound absorbing material 31 or enters perpendicular to the through hole 32 and is absorbed and attenuated by the path 33 of the through hole. Furthermore, noise that cannot be attenuated by the sound absorbing material 31 is prevented from passing directly through the sound absorbing material 31 by the damping material 34 attached to the outside of the sound absorbing material 31. Compared to the first embodiment, the inclination of the sound absorbing material 31 is changed, and the sound absorbing effect can be enhanced by lengthening the sound absorbing path.

  A third embodiment according to the present invention is shown in FIG. Here, since the passage 43 of the through-hole is formed in an inverted V shape, the sound incident on the through surface collides with the wall surface of the inverted V-shaped sound absorbing material 41 and exits to the outside while being attenuated. Compared to Example 2, the sound absorption effect can be enhanced. In addition, a damping material 44 is attached to the outside of the sound absorbing material 41 to prevent sound from directly passing outside through the sound absorbing material 41. In FIG. 4, the shape of the sound absorbing material 41 is an inverted V shape, but a shape in which the sound absorbing material 41 is turned upside down to be a V shape is also conceivable.

  A fourth embodiment according to the present invention is shown in FIG. The structure of the sound absorbing material 51, the through hole 52, the through hole path 53, and the vibration damping material 54 is exactly the same as in FIG. Compared with the third embodiment, the inclination of the sound absorbing material 51 is changed, and the sound absorbing effect can be enhanced by lengthening the sound absorbing path.

  FIG. 6 is a general view of a fifth embodiment according to the present invention, and FIG. 7 is a view of a rear door. In FIG. 6, a rear door 62 equipped with a sound absorbing structure is attached to a rack 61 on which electronic equipment is mounted. FIG. 7 is a view in which the rear door is opened, and a sound absorbing material and a damping material 73 which are sound absorbing structures are provided inside the rear door 72. By attaching the sound absorbing structure of the present invention to the entire rack rear door that is the exhaust side of the cooling medium from the blower in the electronic device, it is possible to maintain the cooling performance of the electronic device and reduce the noise with a compact volume. Become. Further, by using the same sound absorbing structure and increasing or decreasing the number of sound absorbing materials, it can be applied to racks having different heights.

  Next, the attachment and removal of the rear door, the sound absorbing material, and the damping metal plate of the damping material are shown in FIG. 8, and the attachment and removal of the sound absorbing material and the damping material are shown in FIG. The fixed metal plate 82 of the sound absorbing material and damping material has a structure that can be attached and detached from the rear door 81 only by attaching and detaching screws or the like. The sound absorbing material and damping material fixed sheet metal 82 has a plurality of sound absorbing materials and damping materials 83 mounted therein. As shown in FIG. 9, the sound-absorbing goods and damping material 83 are composed of a sound-absorbing material 91 and damping materials 92, 93 and 94. The damping materials 92 and 93 are realized by bending one sheet metal. The sound absorbing material 91 has a structure in which the damping materials 92, 93, 94 are attached with a dedicated adhesive. Both ends of the damping materials 93, 94 are bent by about 1 cm and screwed, and the sound absorbing material of FIG. The damping material can be easily attached to the fixed sheet metal 82. Further, vibration of the sound absorbing material 91 itself can be suppressed. The damping materials 92, 93, and 94 correspond to the damping materials 6, 7, and 8 in the overall cross-sectional view of FIG.

  With the above structure, even if the allowable fluid resistance changes due to the generation change of the CPU of the target electronic device, it is possible to cope without designing a new rear door.

  In the present invention, in order to prevent the blower from being seen when the through surface is viewed from the front, a large number of through holes having a path such as an inclination or a V-shape are provided in the sound absorbing structure, and the light enters the through surface perpendicularly from the blower. The sound absorbing performance is enhanced by arranging a plurality of sound absorbing materials so that the generated sound does not directly go outside the electronic device and attaching a vibration damping material to each of the sound absorbing materials. When installed in the direction of intake / exhaust of a cooling fan for electronic equipment, the through-hole has an inclined or V-shaped path. It collides with the slanted part and V-shaped part and is absorbed and attenuated. In addition, the sound absorption effect can be enhanced by attaching a damping material to the sound absorbing material, even for the sound that passes through the sound absorbing material and goes outside, enabling a compact design and a large volume as a sound absorbing structure. do not need.

DESCRIPTION OF SYMBOLS 1 ... Cross section of the side surface of the rack in which the electronic device is mounted 2 ... Cross section of the side surface of the electronic device 3 ... Cross section of the side surface of the blower in the electronic device 4 ... Cross section 5 of the side surface Character-shaped through-hole 6 ... Damping material side section 21 ... Sound absorbing material side section 22 ... Through hole 23 ... Through hole path 24 ... Damping material 31 ... Sound absorbing material side section 32 ... Through hole 33 ... Through hole 34 ... Damping material 41 ... Sound absorbing material side section 42 ... Through port 43 ... Through port path 44 ... Damping material 51 ... Sound absorbing material side section 52 ... Through port 53 ... Through port path 54 ... Sound absorbing material Side cross section 61 ... Rack 62 with electronic equipment ... Rear door 71 ... Rack 72 with electronic equipment ... Rear door 73 ... Sound absorbing material and damping material 81 ... Rear door 82 ... Fixed metal plate for sound absorbing material and damping material 83 ... Sound absorbing material and damping material 91 ... Sound absorbing material 92 ... Damping material 93 ... Damping material 4 ... Damping material 101 ... Cross section 102 on the side surface of the rack on which the electronic device is mounted ... Cross section 103 on the side surface of the electronic device ... Cross section 104 on the side surface of the blower in the electronic device ... Side surface of the sound absorbing material having a V-shaped path in the through hole Section 105 ... V-shaped through-hole 106 ... Sound path 107 passing through the sound absorbing material horizontally 107 ... Sound path passing through the sound absorbing material horizontally

Claims (5)

A sound absorbing structure for an electronic device in which a plurality of through holes are provided by disposing a plurality of sound absorbing materials of a predetermined form at predetermined intervals in a flow path of a cooling fluid from a blower
The sound absorbing material is provided by arranging the plurality of sound absorbing materials so that sound perpendicularly incident on the through surface of the through hole from the blower does not directly go out of the electronic device, and attaching a damping material to the sound absorbing material. A sound absorbing structure for an electronic device, wherein vibration of the material is suppressed and sound passing through the sound absorbing material is prevented from directly coming out of the electronic device in a horizontal direction. In the sound absorption structure of an electronic device having a cooling structure for introducing air from the back or front of the rack cabinet by a blower and exhausting from the front or back of the rack cabinet,
A sound absorbing structure for an electronic device in which a plurality of through holes are provided by arranging a plurality of sound absorbing materials in a predetermined form in the height direction of the rack cabinet in a flow path of a cooling fluid from the blower. A sound absorbing structure for an electronic device, wherein the plurality of sound absorbing materials are arranged so that the blower cannot be seen when the through surface of the through hole is viewed from the front, and a vibration damping material is attached to the sound absorbing material. In the sound absorption structure of an electronic device having a cooling structure for introducing air from the back or front of the rack cabinet by a blower and exhausting from the front or back of the rack cabinet,
A plurality of inclined sound absorbing materials are arranged at predetermined intervals in the height direction of the rack cabinet in a cooling fluid flow path from the blower, and a damping material is attached to the outer surface of the sound absorbing material. Sound absorption structure of electronic equipment. In the sound absorption structure of an electronic device having a cooling structure for introducing air from the back or front of the rack cabinet by a blower and exhausting from the front or back of the rack cabinet,
A plurality of V-shaped or inverted V-shaped sound absorbing materials are arranged at predetermined intervals in the height direction of the rack cabinet in the flow path of the cooling fluid from the blower, and are arranged on the outer surface of the sound absorbing material. A sound-absorbing structure for electronic equipment, characterized by attaching a damping material.   An electronic device mounted in a rack cabinet, wherein the sound absorbing structure according to any one of claims 1 to 4 is provided on a rack door on an exhaust side or an intake side.

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