JP2008521205A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008521205A5 JP2008521205A5 JP2007543284A JP2007543284A JP2008521205A5 JP 2008521205 A5 JP2008521205 A5 JP 2008521205A5 JP 2007543284 A JP2007543284 A JP 2007543284A JP 2007543284 A JP2007543284 A JP 2007543284A JP 2008521205 A5 JP2008521205 A5 JP 2008521205A5
- Authority
- JP
- Japan
- Prior art keywords
- switch
- electrical circuit
- deformation element
- fixed
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 claims 3
Claims (2)
(a)相対する固定端縁を有するくぼみ部が形成されたベース素子と、
(b)前記ベース素子により支持される間隔保持構造と、
(c)前記間隔保持構造によって支持される第一のスイッチ電極と、前記第一のスイッチ電極と離間させて配置される第二のスイッチ電極と、前記第一と第二のスイッチ電極を電気的に連結して前記電気回路を閉じるための制御電極と、
(d)前記相対する固定端縁に接合され、前記制御電極を圧迫して前記第一と第二のスイッチ電極と電気的に接触させる変形素子であって、低い熱膨張率を有する第一の材料の第一の層と高い熱膨張率を有する第二の材料の第二の層とを含む平坦積層構造として構成され、前記固定端縁に隣接する固定部分と前記固定部分の間の中央部分を有し、前記固定部分の曲げ剛性が前記中央部分の曲げ剛性より実質的に低い変形素子と、
(e)前記変形素子に熱パルスを印加し、前記変形素子の温度を急上昇させる装置であって、前記変形素子が前記制御電極を前記第一のスイッチ電極と接触させない方向にたわみ、それによって前記電気回路を開け、その後、温度が下降すると、たわみが解放され、前記電気回路を閉じるようにする装置と、
を備えることを特徴とするノーマリークローズマイクロスイッチ。 A normally closed microswitch for controlling an electrical circuit,
(A) a base element formed with a recess having an opposite fixed edge;
(B) a spacing structure supported by the base element;
(C) electrically connecting the first switch electrode supported by the spacing structure, the second switch electrode spaced apart from the first switch electrode, and the first and second switch electrodes; A control electrode coupled to the electrical circuit to close the electrical circuit;
(D) A deformation element joined to the opposing fixed edges and pressing the control electrode to make electrical contact with the first and second switch electrodes, the first having a low coefficient of thermal expansion A central portion between the fixed portion adjacent to the fixed edge and configured as a flat laminated structure comprising a first layer of material and a second layer of a second material having a high coefficient of thermal expansion A deformation element having a bending stiffness of the fixed portion substantially lower than that of the central portion;
(E) a device for applying a heat pulse to the deformation element to rapidly increase the temperature of the deformation element, wherein the deformation element bends in a direction not to contact the control electrode with the first switch electrode; A device that opens an electrical circuit and then releases the deflection when the temperature drops, and closes the electrical circuit;
A normally closed micro switch.
(a)相対する固定端縁を有するくぼみ部が形成されたベース素子と、
(b)前記ベース素子により支持される間隔保持構造と、
(c)前記間隔保持構造によって支持される第一のスイッチ電極と、前記第一のスイッチ電極と離間させて配置される第二のスイッチ電極と、前記第一と第二のスイッチ電極を電気的に連結して前記電気回路を閉じるための制御電極と、
(d)前記相対する固定端縁に接合され、前記制御電極を前記第一のスイッチ電極の近位に位置づける変形素子であって、低い熱膨張率を有する第一の材料の第一の層と高い熱膨張率を有する第二の材料の第二の層とを含む平坦積層構造として構成され、前記固定端縁に隣接する固定部分と前記固定部分の間の中央部分を有し、前記固定部分の曲げ剛性が前記中央部分の曲げ剛性より実質的に低い変形素子と、
(e)前記変形素子に熱パルスを印加し、前記変形素子の温度を急上昇させる装置であって、前記変形素子が前記制御電極を前記第一のスイッチ電極及び第二のスイッチ電極と接触させる方向にたわみ、それによって前記電気回路を閉じ、その後、温度が下降すると、たわみが解放され、前記電気回路を開けるようにする装置と、
を備えることを特徴とするノーマリーオープンマイクロスイッチ。
A normally open microswitch for controlling electrical circuits ,
(A) a base element formed with a recess having an opposite fixed edge;
(B) a spacing structure supported by the base element;
(C) electrically connecting the first switch electrode supported by the spacing structure, the second switch electrode spaced apart from the first switch electrode, and the first and second switch electrodes; A control electrode coupled to the electrical circuit to close the electrical circuit;
(D) a deformation element joined to the opposed fixed edges and positioning the control electrode proximal to the first switch electrode, the first layer of a first material having a low coefficient of thermal expansion; A fixed layer structure comprising a second layer of a second material having a high coefficient of thermal expansion, having a fixed part adjacent to the fixed edge and a central part between the fixed parts, the fixed part A deformation element whose bending stiffness is substantially lower than the bending stiffness of the central portion;
(E) A device for applying a heat pulse to the deformation element to rapidly increase the temperature of the deformation element, wherein the deformation element makes the control electrode contact the first switch electrode and the second switch electrode. A device that causes the deflection to be released and the electrical circuit to be opened when the temperature drops, thereby closing the electrical circuit;
A normally open micro switch, characterized in that it comprises a.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/999,645 | 2004-11-22 | ||
US10/999,645 US7283030B2 (en) | 2004-11-22 | 2004-11-22 | Doubly-anchored thermal actuator having varying flexural rigidity |
PCT/US2005/041867 WO2006057910A1 (en) | 2004-11-22 | 2005-11-18 | Doubly-anchored thermal actuator having varying flexural rigidity |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008521205A JP2008521205A (en) | 2008-06-19 |
JP2008521205A5 true JP2008521205A5 (en) | 2008-12-18 |
JP4846728B2 JP4846728B2 (en) | 2011-12-28 |
Family
ID=36102544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007543284A Expired - Fee Related JP4846728B2 (en) | 2004-11-22 | 2005-11-18 | Two-point fixed thermal actuator with varying bending stiffness |
Country Status (4)
Country | Link |
---|---|
US (2) | US7283030B2 (en) |
EP (1) | EP1815488A1 (en) |
JP (1) | JP4846728B2 (en) |
WO (1) | WO2006057910A1 (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2857153B1 (en) * | 2003-07-01 | 2005-08-26 | Commissariat Energie Atomique | BISTABLE MICRO-SWITCH WITH LOW CONSUMPTION. |
US7858891B2 (en) * | 2006-04-24 | 2010-12-28 | Volkswagen Group Of America, Inc. | Shape-changing control panel button based on activation/deactivation |
US7495368B2 (en) * | 2006-08-31 | 2009-02-24 | Evigia Systems, Inc. | Bimorphic structures, sensor structures formed therewith, and methods therefor |
US7994892B2 (en) * | 2007-06-21 | 2011-08-09 | Jpa Inc. | Oxidative opening switch assembly and methods |
US8154378B2 (en) * | 2007-08-10 | 2012-04-10 | Alcatel Lucent | Thermal actuator for a MEMS-based relay switch |
US20090210103A1 (en) * | 2007-12-03 | 2009-08-20 | Mr. Michael Cook | Controlling aircraft aerial movements, defeating icing on aircraft surfaces, aiding decontamination, and damping turbulence effects on aircraft by the method of micro-perforated airfoil coordinated precision flow management |
US8232858B1 (en) * | 2008-02-20 | 2012-07-31 | Sandia Corporation | Microelectromechanical (MEM) thermal actuator |
US7972865B2 (en) * | 2008-08-26 | 2011-07-05 | Ut-Battelle, Llc | Sensor for detecting and differentiating chemical analytes |
TW201012043A (en) * | 2008-09-10 | 2010-03-16 | Micro Star Int Co Ltd | Movement device |
US8190402B2 (en) * | 2009-05-04 | 2012-05-29 | King Fahd University Of Petroleum & Minerals | Method of modeling flexural characteristics of a bar subjected to local heating |
US9511995B2 (en) * | 2012-02-15 | 2016-12-06 | Massachusetts Institute Of Technology | Method and apparatus for building three-dimensional MEMS elements |
US9217755B2 (en) | 2012-02-15 | 2015-12-22 | Massachusetts Institute Of Technology | Method and apparatus for building three-dimensional MEMS elements |
US9573802B2 (en) | 2012-02-15 | 2017-02-21 | Massachusetts Institute Of Technology | Method and apparatus for building three-dimensional MEMS elements |
ITTO20120691A1 (en) * | 2012-08-01 | 2014-02-02 | Milano Politecnico | IMPACT SENSOR WITH BISTABLE MECHANISM AND METHOD FOR DETECTING IMPACTS |
US10330564B2 (en) * | 2013-05-03 | 2019-06-25 | The Boeing Company | System and method for predicting distortion of a workpiece resulting from a peening machine process |
WO2018132910A1 (en) | 2017-01-19 | 2018-07-26 | Eliuk Grant J | Thermal-sensitive appearance-changing label |
FR3086386B1 (en) * | 2018-09-21 | 2020-12-04 | Commissariat Energie Atomique | MEASURING DEVICE CONTAINING A SUSPENDED SEMICONDUCTOR WIRE |
JP2023057348A (en) * | 2021-10-11 | 2023-04-21 | 株式会社リコー | Liquid discharge device, liquid discharge apparatus, and liquid discharge head |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3538379A (en) * | 1968-05-06 | 1970-11-03 | Irving Berlin | Photo-electric light-activated switch apparatus |
US3946398A (en) * | 1970-06-29 | 1976-03-23 | Silonics, Inc. | Method and apparatus for recording with writing fluids and drop projection means therefor |
SE349676B (en) * | 1971-01-11 | 1972-10-02 | N Stemme | |
US4296421A (en) * | 1978-10-26 | 1981-10-20 | Canon Kabushiki Kaisha | Ink jet recording device using thermal propulsion and mechanical pressure changes |
US4423401A (en) * | 1982-07-21 | 1983-12-27 | Tektronix, Inc. | Thin-film electrothermal device |
DE3814150A1 (en) * | 1988-04-27 | 1989-11-09 | Draegerwerk Ag | VALVE ARRANGEMENT MADE FROM MICROSTRUCTURED COMPONENTS |
US5058856A (en) * | 1991-05-08 | 1991-10-22 | Hewlett-Packard Company | Thermally-actuated microminiature valve |
WO1993022140A1 (en) * | 1992-04-23 | 1993-11-11 | Seiko Epson Corporation | Liquid jet head and production thereof |
JPH07285221A (en) * | 1994-04-19 | 1995-10-31 | Sharp Corp | Ink jet head |
US5599695A (en) * | 1995-02-27 | 1997-02-04 | Affymetrix, Inc. | Printing molecular library arrays using deprotection agents solely in the vapor phase |
EP0974466B1 (en) * | 1995-04-19 | 2003-03-26 | Seiko Epson Corporation | Ink jet recording head and method of producing same |
JP3257340B2 (en) * | 1995-05-24 | 2002-02-18 | 松下電器産業株式会社 | Liquid coating method, liquid coating apparatus and slit nozzle |
SE9503141D0 (en) * | 1995-09-12 | 1995-09-12 | Siemens Elema Ab | Anesthesia apparatus |
EP0923099B1 (en) | 1996-08-27 | 2006-02-01 | Omron Corporation | Micro-relay and method for manufacturing the same |
AUPO807497A0 (en) * | 1997-07-15 | 1997-08-07 | Silverbrook Research Pty Ltd | A method of manufacture of an image creation apparatus (IJM23) |
AUPO794797A0 (en) * | 1997-07-15 | 1997-08-07 | Silverbrook Research Pty Ltd | A device (MEMS07) |
US6254793B1 (en) * | 1997-07-15 | 2001-07-03 | Silverbrook Research Pty Ltd | Method of manufacture of high Young's modulus thermoelastic inkjet printer |
US6180427B1 (en) * | 1997-07-15 | 2001-01-30 | Silverbrook Research Pty. Ltd. | Method of manufacture of a thermally actuated ink jet including a tapered heater element |
US6087638A (en) * | 1997-07-15 | 2000-07-11 | Silverbrook Research Pty Ltd | Corrugated MEMS heater structure |
US5980571A (en) | 1997-12-11 | 1999-11-09 | Colin Corporation | Substitute-heart control apparatus |
FR2772512B1 (en) * | 1997-12-16 | 2004-04-16 | Commissariat Energie Atomique | MICROSYSTEM WITH DEFORMABLE ELEMENT UNDER THE EFFECT OF A THERMAL ACTUATOR |
US6229121B1 (en) * | 1999-07-23 | 2001-05-08 | Industrial Technology Research Institute | Integrated thermal buckling micro switch with electric heater and sensor |
US6212939B1 (en) * | 1999-09-24 | 2001-04-10 | Lockheed Martin Energy Research Corporation | Uncoated microcantilevers as chemical sensors |
US6239685B1 (en) * | 1999-10-14 | 2001-05-29 | International Business Machines Corporation | Bistable micromechanical switches |
US6561627B2 (en) * | 2000-11-30 | 2003-05-13 | Eastman Kodak Company | Thermal actuator |
FR2818795B1 (en) * | 2000-12-27 | 2003-12-05 | Commissariat Energie Atomique | MICRO-DEVICE WITH THERMAL ACTUATOR |
US6911891B2 (en) * | 2001-01-19 | 2005-06-28 | Massachusetts Institute Of Technology | Bistable actuation techniques, mechanisms, and applications |
JP4202765B2 (en) * | 2001-04-26 | 2008-12-24 | 株式会社アドバンテスト | Microswitch and method for manufacturing microswitch |
EP1419511B1 (en) * | 2001-08-20 | 2006-06-28 | Honeywell International Inc. | Snap action thermal switch |
US7011288B1 (en) * | 2001-12-05 | 2006-03-14 | Microstar Technologies Llc | Microelectromechanical device with perpendicular motion |
US6631979B2 (en) * | 2002-01-17 | 2003-10-14 | Eastman Kodak Company | Thermal actuator with optimized heater length |
US6621392B1 (en) * | 2002-04-25 | 2003-09-16 | International Business Machines Corporation | Micro electromechanical switch having self-aligned spacers |
US6869169B2 (en) * | 2002-05-15 | 2005-03-22 | Eastman Kodak Company | Snap-through thermal actuator |
US6598960B1 (en) * | 2002-05-23 | 2003-07-29 | Eastman Kodak Company | Multi-layer thermal actuator with optimized heater length and method of operating same |
US6657525B1 (en) * | 2002-05-31 | 2003-12-02 | Northrop Grumman Corporation | Microelectromechanical RF switch |
JP4206856B2 (en) * | 2002-07-30 | 2009-01-14 | パナソニック株式会社 | Switch and switch manufacturing method |
TW593125B (en) * | 2002-08-09 | 2004-06-21 | Ind Tech Res Inst | MEMS type differential actuator |
US7012491B1 (en) * | 2002-09-10 | 2006-03-14 | Zyvex Corporation | Storing mechanical potential in a MEMS device using a mechanically multi-stable mechanism |
FR2857153B1 (en) * | 2003-07-01 | 2005-08-26 | Commissariat Energie Atomique | BISTABLE MICRO-SWITCH WITH LOW CONSUMPTION. |
-
2004
- 2004-11-22 US US10/999,645 patent/US7283030B2/en not_active Expired - Fee Related
-
2005
- 2005-11-18 EP EP05824965A patent/EP1815488A1/en not_active Withdrawn
- 2005-11-18 JP JP2007543284A patent/JP4846728B2/en not_active Expired - Fee Related
- 2005-11-18 WO PCT/US2005/041867 patent/WO2006057910A1/en active Application Filing
-
2007
- 2007-09-04 US US11/849,378 patent/US7508294B2/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2008521205A5 (en) | ||
JP4130736B2 (en) | Microdevice with thermal actuator | |
JP4109992B2 (en) | Switch and integrated circuit device | |
JP4202765B2 (en) | Microswitch and method for manufacturing microswitch | |
WO1998009312A1 (en) | Micro-relay and method for manufacturing the same | |
JP2009503867A5 (en) | ||
US20170060243A1 (en) | Bilayer haptic feedback actuator | |
CN101621261A (en) | Flexible composite beam electric heating microdriver based on U+V shape | |
WO2007127079A3 (en) | A bonding plate mechanism for use in anodic bonding | |
JP2006221761A5 (en) | ||
Dahmardeh et al. | High‐power MEMS switch enabled by carbon‐nanotube contact and shape‐memory‐alloy actuator | |
WO2004089814A3 (en) | Thermal actuator | |
JP5548525B2 (en) | Method for manufacturing a current converter device structure comprising a cooling device | |
US20080106360A1 (en) | Microsystem With Electromagnetic Control | |
JP2003502873A (en) | Piezoelectric actuator | |
JP2003179085A (en) | Electronic component | |
JP2012045757A5 (en) | ||
JPWO2008136316A1 (en) | Multilayer substrate structure and manufacturing method thereof | |
JP2019501485A (en) | Thermal management with high power RF MEMS switches | |
JP6791501B2 (en) | Manufacturing method of micro breaker for preventing momentary interruption and micro breaker for preventing momentary interruption | |
TW493043B (en) | Semiconductor device | |
JP2013533592A (en) | Bimetal controller | |
JP2008118080A5 (en) | ||
JP2003062798A (en) | Actuator and switch | |
CN208240552U (en) | A kind of contact device of disconnecting switch conduction plug-in strip |