JP2008520316A5 - - Google Patents

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Publication number
JP2008520316A5
JP2008520316A5 JP2007542429A JP2007542429A JP2008520316A5 JP 2008520316 A5 JP2008520316 A5 JP 2008520316A5 JP 2007542429 A JP2007542429 A JP 2007542429A JP 2007542429 A JP2007542429 A JP 2007542429A JP 2008520316 A5 JP2008520316 A5 JP 2008520316A5
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JP
Japan
Prior art keywords
integrated circuit
circuit
voltage integrated
substrate
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007542429A
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English (en)
Japanese (ja)
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JP2008520316A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/IB2005/053803 external-priority patent/WO2006054260A1/en
Publication of JP2008520316A publication Critical patent/JP2008520316A/ja
Publication of JP2008520316A5 publication Critical patent/JP2008520316A5/ja
Pending legal-status Critical Current

Links

JP2007542429A 2004-11-22 2005-11-17 超音波ビームフォーマプローブのためのハイブリッドｉｃ Pending JP2008520316A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63009004P 2004-11-22 2004-11-22
PCT/IB2005/053803 WO2006054260A1 (en) 2004-11-22 2005-11-17 Hybrid ic for ultrasound beamformer probe

Publications (2)

Publication Number Publication Date
JP2008520316A JP2008520316A (ja) 2008-06-19
JP2008520316A5 true JP2008520316A5 (enExample) 2009-01-15

Family

ID=35842025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007542429A Pending JP2008520316A (ja) 2004-11-22 2005-11-17 超音波ビームフォーマプローブのためのハイブリッドｉｃ

Country Status (5)

Country Link
US (1) US20090146695A1 (enExample)
EP (1) EP1817609A1 (enExample)
JP (1) JP2008520316A (enExample)
CN (1) CN101061392A (enExample)
WO (1) WO2006054260A1 (enExample)

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DE602007004242D1 (de) * 2006-09-25 2010-02-25 Koninkl Philips Electronics Nv Flip-chip-verbindung über chip-durchgangswege
US7687976B2 (en) 2007-01-31 2010-03-30 General Electric Company Ultrasound imaging system
US7892176B2 (en) 2007-05-02 2011-02-22 General Electric Company Monitoring or imaging system with interconnect structure for large area sensor array
US20110201934A1 (en) * 2008-10-20 2011-08-18 Koninklijke Philips Electronics N.V. Low voltage ultrasound system with high voltage transducers
EP2356484B1 (en) * 2008-11-11 2012-09-05 Koninklijke Philips Electronics N.V. Configurable microbeamformer circuit for an ultrasonic diagnostic imaging system
CN102427758B (zh) * 2009-05-15 2015-01-07 皇家飞利浦电子股份有限公司 具有反馈校正的光学探头
US8345508B2 (en) * 2009-09-20 2013-01-01 General Electric Company Large area modular sensor array assembly and method for making the same
JP5689697B2 (ja) * 2011-01-27 2015-03-25 株式会社東芝 超音波プローブ及び超音波診断装置
US9439625B2 (en) * 2013-02-28 2016-09-13 General Electric Company Delta delay approach for ultrasound beamforming on an ASIC
CA2903479C (en) 2013-03-15 2023-10-10 Butterfly Network, Inc. Monolithic ultrasonic imaging devices, systems and methods
EP3013486B1 (en) * 2013-06-26 2024-10-02 Koninklijke Philips N.V. Integrated circuit arrangement for an ultrasound transducer array
CN106461767B (zh) * 2014-04-18 2019-05-28 蝴蝶网络有限公司 单衬底超声成像装置的架构、相关设备和方法
KR101993743B1 (ko) 2014-07-10 2019-06-27 삼성전자주식회사 초음파 프로브 및 초음파 영상장치
CN107107109A (zh) * 2014-12-15 2017-08-29 皇家飞利浦有限公司 具有直接同轴电缆附接的紧凑超声换能器
EP3507618B1 (en) * 2016-09-02 2025-07-09 Koninklijke Philips N.V. Ultrasound probe with low frequency, low voltage digital microbeamformer
KR101925144B1 (ko) * 2017-01-12 2019-02-27 삼성메디슨 주식회사 초음파 프로브, 초음파 영상장치, 및 그 제어방법
DE102017217214B3 (de) * 2017-09-27 2018-11-08 Karlsruher Institut für Technologie Vorrichtung zur Ansteuerung und Auslese einer Gruppe von Ultraschallwandlern für Ultraschall-Computertomographie und Ultraschall-Computertomograph
EP3735594A1 (en) * 2018-01-02 2020-11-11 Koninklijke Philips N.V. High power microbeamformer ultrasound transducer probe

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
US5744898A (en) * 1992-05-14 1998-04-28 Duke University Ultrasound transducer array with transmitter/receiver integrated circuitry
US6043032A (en) * 1993-09-22 2000-03-28 Tosoh Corporation Method of extracting nucleic acids and method of detecting specified nucleic acid sequences
US5906580A (en) * 1997-05-05 1999-05-25 Creare Inc. Ultrasound system and method of administering ultrasound including a plurality of multi-layer transducer elements
US5997479A (en) * 1998-05-28 1999-12-07 Hewlett-Packard Company Phased array acoustic systems with intra-group processors
US6142946A (en) * 1998-11-20 2000-11-07 Atl Ultrasound, Inc. Ultrasonic diagnostic imaging system with cordless scanheads
US6117085A (en) * 1998-11-20 2000-09-12 Atl Ultrasound, Inc. Ultrasonic diagnostic imaging system with cordless scanhead charger
US6380766B2 (en) * 1999-03-19 2002-04-30 Bernard J Savord Integrated circuitry for use with transducer elements in an imaging system
US6969352B2 (en) * 1999-06-22 2005-11-29 Teratech Corporation Ultrasound probe with integrated electronics
US6491634B1 (en) * 2000-10-13 2002-12-10 Koninklijke Philips Electronics N.V. Sub-beamforming apparatus and method for a portable ultrasound imaging system
US6994674B2 (en) * 2002-06-27 2006-02-07 Siemens Medical Solutions Usa, Inc. Multi-dimensional transducer arrays and method of manufacture
US6836159B2 (en) * 2003-03-06 2004-12-28 General Electric Company Integrated high-voltage switching circuit for ultrasound transducer array
JP2006524531A (ja) * 2003-04-15 2006-11-02 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 超音波撮像のための高調波発生可能な二次元（２ｄ）アレイ

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