JP2008311338A5 - - Google Patents

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Publication number
JP2008311338A5
JP2008311338A5 JP2007156135A JP2007156135A JP2008311338A5 JP 2008311338 A5 JP2008311338 A5 JP 2008311338A5 JP 2007156135 A JP2007156135 A JP 2007156135A JP 2007156135 A JP2007156135 A JP 2007156135A JP 2008311338 A5 JP2008311338 A5 JP 2008311338A5
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JP
Japan
Prior art keywords
detection means
intermittently
low energy
continuously
discharge generated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007156135A
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Japanese (ja)
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JP2008311338A (en
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Publication date
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Priority to JP2007156135A priority Critical patent/JP2008311338A/en
Priority claimed from JP2007156135A external-priority patent/JP2008311338A/en
Publication of JP2008311338A publication Critical patent/JP2008311338A/en
Publication of JP2008311338A5 publication Critical patent/JP2008311338A5/ja
Pending legal-status Critical Current

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Claims (1)

前記真空チャンバー内にて連続的又は断続的に発生する低エネルギー放電を検出する第1の検出手段と、前記第1の検出手段が一定時間に亘り連続的又は断続的に発生する低エネルギー放電を検出したことに応答して前記予知信号を発生する第2の検出手段とを含むことを特徴とする請求項1に記載の異常放電予知装置。


First detection means for detecting low energy discharge generated continuously or intermittently in the vacuum chamber, and low energy discharge generated by the first detection means continuously or intermittently for a fixed time. abnormal discharge prediction apparatus according to claim 1, in response to detected, characterized in that it comprises a second detection means for generating the prediction signal.


JP2007156135A 2007-06-13 2007-06-13 Vacuum treatment apparatus and abnormal discharge precognition device used therefor, and control method of vacuum treatment apparatus Pending JP2008311338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007156135A JP2008311338A (en) 2007-06-13 2007-06-13 Vacuum treatment apparatus and abnormal discharge precognition device used therefor, and control method of vacuum treatment apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007156135A JP2008311338A (en) 2007-06-13 2007-06-13 Vacuum treatment apparatus and abnormal discharge precognition device used therefor, and control method of vacuum treatment apparatus

Publications (2)

Publication Number Publication Date
JP2008311338A JP2008311338A (en) 2008-12-25
JP2008311338A5 true JP2008311338A5 (en) 2010-07-22

Family

ID=40238710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007156135A Pending JP2008311338A (en) 2007-06-13 2007-06-13 Vacuum treatment apparatus and abnormal discharge precognition device used therefor, and control method of vacuum treatment apparatus

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JP (1) JP2008311338A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG176565A1 (en) * 2009-06-30 2012-01-30 Lam Res Corp Methods and apparatus to predict etch rate uniformity for qualification of a plasma chamber
JP6226777B2 (en) * 2014-03-06 2017-11-08 Sppテクノロジーズ株式会社 Abnormal discharge prediction method and apparatus for plasma processing apparatus, and plasma processing apparatus with abnormal discharge prediction function
JP6582292B2 (en) * 2015-07-28 2019-10-02 東京電子交易株式会社 Discharge analysis method and discharge analysis apparatus
JP6807558B2 (en) * 2016-11-08 2021-01-06 パナソニックIpマネジメント株式会社 Plasma processing method and plasma processing equipment

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09266097A (en) * 1996-03-29 1997-10-07 Seiko Epson Corp Plasma processing method and device
JPH09266098A (en) * 1996-03-29 1997-10-07 Seiko Epson Corp Plasma condition detecting device and method, and etching terminating point detecting device and method
JP2002176034A (en) * 2000-12-08 2002-06-21 Yoshio Fujino Automatic device for preventing abnormal discharge in plasma etching
JP2004220923A (en) * 2003-01-15 2004-08-05 Ulvac Japan Ltd Abnormal discharge detection device and method, and plasma treatment device comprising the abnormal discharge detection device
US20060252283A1 (en) * 2003-08-07 2006-11-09 Hitachi Kokusai Electric Inc. Substrate processing apparatus and sustrate processing method
JP2005259941A (en) * 2004-03-11 2005-09-22 Renesas Technology Corp Sputter etching apparatus, sputter etching system, and sputter etching method
JP4673653B2 (en) * 2005-03-30 2011-04-20 オリジン電気株式会社 Abnormal discharge prevention method and vacuum apparatus in vacuum apparatus
JP2006328510A (en) * 2005-05-30 2006-12-07 Ulvac Japan Ltd Plasma treatment method and device
JP5094002B2 (en) * 2005-09-06 2012-12-12 ルネサスエレクトロニクス株式会社 Plasma processing apparatus and method for suppressing abnormal discharge thereof
JP5159055B2 (en) * 2006-03-08 2013-03-06 株式会社EM・Predix AC power supply

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