JP2008310572A - Antenna for radio tag communication - Google Patents

Antenna for radio tag communication Download PDF

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JP2008310572A
JP2008310572A JP2007157449A JP2007157449A JP2008310572A JP 2008310572 A JP2008310572 A JP 2008310572A JP 2007157449 A JP2007157449 A JP 2007157449A JP 2007157449 A JP2007157449 A JP 2007157449A JP 2008310572 A JP2008310572 A JP 2008310572A
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electromagnetic wave
antenna
tag communication
conductive material
circuit board
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Hidekazu Mori
英一 森
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Toshiba TEC Corp
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Toshiba TEC Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an antenna for radio tag communication which is excellent in heat dissipation property and does not occur any radio interference. <P>SOLUTION: This antenna for radio tag communication is provided with a heat dissipation case formed of an electromagnetic wave shielding wall including thermal conductive materials and electromagnetic wave absorbing materials on a second face opposite to a first face on which the antenna main body part of a ground contact material is arranged, and composed to store an electronic circuit board. Heat generated in the electronic circuit board is radiated from the thermal conductive materials and the ground member. Meanwhile, an electromagnetic wave generated in the electronic circuit board is absorbed by the electromagnetic wave absorbing member. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、無線タグと信号を送受信する無線タグ通信用アンテナに係り、特に接地部材を放熱のために用いる無線タグ通信用アンテナに関する。   The present invention relates to an RFID tag communication antenna that transmits and receives signals to and from a wireless tag, and more particularly to an RFID tag communication antenna that uses a ground member for heat dissipation.

無線タグと信号を送受信する無線タグリーダライタにおいては、この無線タグリーダライタが内蔵する電子回路基板、特にパワーアンプが発熱し、通信の品質を維持するためにこの熱を放熱することが必要となる。   In a wireless tag reader / writer that transmits and receives signals to and from a wireless tag, an electronic circuit board built in the wireless tag reader / writer, particularly a power amplifier, generates heat, and it is necessary to dissipate this heat in order to maintain communication quality.

図6に示すように、従来の無線タグリーダライタにおいては、無線タグ通信用アンテナ300と放熱用の構造物を電子回路用放熱ケース202,電源装置用放熱ケース203のように別に設けていた。このため、部品点数が多くなり、無線タグリーダライタ201の大きさも大きくならざるを得ないという問題点があった。   As shown in FIG. 6, in the conventional RFID tag reader / writer, the RFID tag communication antenna 300 and the heat radiating structure are separately provided as an electronic circuit heat radiating case 202 and a power supply heat radiating case 203. For this reason, there are problems that the number of parts increases and the size of the wireless tag reader / writer 201 must be increased.

この点に関し、接地部材のアンテナ本体が設けられる面と対向する面に電子回路基板を設け、この電子回路基板が発生させる熱をアンテナ本体から放熱する技術が提案されている(例えば、特許文献1)。   In this regard, a technique has been proposed in which an electronic circuit board is provided on the surface of the ground member that faces the surface on which the antenna body is provided, and heat generated by the electronic circuit board is radiated from the antenna body (for example, Patent Document 1). ).

また、接地部材のアンテナ本体が設けられる面と対向する面に電子回路基板を設け、この電子回路基板が発生させる熱を接地部材から放熱する技術が提案されている(例えば、特許文献2)。
特開2004−215152号公報 特開2005−236586号公報
Further, a technique has been proposed in which an electronic circuit board is provided on the surface of the grounding member that faces the surface on which the antenna body is provided, and heat generated by the electronic circuit board is radiated from the grounding member (for example, Patent Document 2).
JP 2004-215152 A JP 2005-236586 A

しかし、特許文献1に記載の技術によっては、放熱する熱量に応じてアンテナの形状を構成しなければならず、発熱量が大きくなるとアンテナの大きさを実用的な範囲を超えて大きくしなければならなくなるという問題点があった。   However, depending on the technique described in Patent Document 1, the shape of the antenna must be configured according to the amount of heat to be radiated, and when the amount of heat generation increases, the size of the antenna must be increased beyond a practical range. There was a problem that it would not be.

また、特許文献2に記載の技術においては、放熱する熱量に応じて接地部材の形状を構成しなければならず、発熱量が大きくなると接地部材の大きさを実用的な範囲を超えて大きくしなければならなくなるという問題点があった。   In the technique described in Patent Document 2, the shape of the grounding member must be configured according to the amount of heat to be radiated. When the amount of heat generation increases, the size of the grounding member is increased beyond the practical range. There was a problem that it had to be.

また、いずれの技術においても、電子回路基板から放射される電波がアンテナ本体から放射される電波と干渉してしまうという問題点があった。   In any of the techniques, there is a problem that radio waves radiated from the electronic circuit board interfere with radio waves radiated from the antenna body.

本発明は上記のような問題点に鑑みてなされたものであり、無線タグリーダライタの大きさ小さくすることが可能であり、放熱性に優れ、電波干渉を起さない無線タグ通信用アンテナを提供することを目的とする。   The present invention has been made in view of the above problems, and provides an RFID tag communication antenna that can reduce the size of an RFID tag reader / writer, has excellent heat dissipation, and does not cause radio wave interference. The purpose is to do.

この目的を達成するために本発明は、金属によって形成された接地部材と、熱伝導性材と電磁波吸収材を含む電磁波遮蔽部層と、を積層形成したベース基板と;接地部材又は電磁波遮蔽部層の熱伝導性材の何れかの面に設けられた、無線タグと信号を送受信するアンテナ本体部と;を備える、ことを特徴とする無線タグ通信用アンテナを提供する。   In order to achieve this object, the present invention provides a base substrate formed by laminating a grounding member made of metal and an electromagnetic wave shielding part layer including a heat conductive material and an electromagnetic wave absorbing material; a grounding member or an electromagnetic wave shielding part There is provided a radio tag communication antenna, comprising: a radio tag and an antenna main body that transmits and receives signals, provided on any surface of a heat conductive material of a layer.

また本発明は、金属によって形成された接地部材と;接地部材の第1の面に設けた、無線タグと信号を送受信するアンテナ本体部と;接地部材の第1の面と対向する第2の面に、熱伝導性材と電磁波吸収材を含む電磁波遮蔽壁が形成された、電子回路基板を収納する放熱ケースと;を備える、無線タグ通信用アンテナを提供する。   The present invention also provides a grounding member made of metal; an antenna main body that transmits and receives signals to and from the wireless tag provided on the first surface of the grounding member; and a second that faces the first surface of the grounding member. An antenna for wireless tag communication, comprising: a heat radiating case for accommodating an electronic circuit board, on which an electromagnetic wave shielding wall including a heat conductive material and an electromagnetic wave absorbing material is formed.

本発明によれば、部品点数が減少して無線タグリーダライタの大きさ小さくすることが可能であるという効果がある。また、電子回路基板において発生した熱は熱伝導性材及び接地部材から放熱され、電子回路基板において発生した電磁波は電磁波吸収材により吸収される。このため、放熱性に優れ、電波干渉を起さないという効果がある。   According to the present invention, there is an effect that the number of parts can be reduced and the size of the wireless tag reader / writer can be reduced. The heat generated in the electronic circuit board is dissipated from the heat conductive material and the ground member, and the electromagnetic wave generated in the electronic circuit board is absorbed by the electromagnetic wave absorber. For this reason, it has the effect that it is excellent in heat dissipation and does not cause radio wave interference.

以下、本発明による無線タグ通信用アンテナの一実施の形態を、図面を用いて詳細に説明する。   Hereinafter, an embodiment of an antenna for RFID tag communication according to the present invention will be described in detail with reference to the drawings.

図1は、本実施形態の無線タグ通信用アンテナの構成の概要を示した図である。図1(a)は本実施形態の無線タグ通信用アンテナ101を無線タグと信号を送受信するアンテナ本体部102の側から見た斜視図であり、図1(b)は図1(a)におけるAA線断面図であり、図1(d)は無線タグ通信用アンテナ101を図1(a)とは逆側から見た斜視図である。   FIG. 1 is a diagram showing an outline of the configuration of the RFID tag communication antenna of the present embodiment. FIG. 1A is a perspective view of the RFID tag communication antenna 101 of the present embodiment as viewed from the side of the antenna main body 102 that transmits and receives signals to and from the RFID tag, and FIG. 1B is a diagram in FIG. FIG. 1D is a cross-sectional view taken along the line AA, and FIG. 1D is a perspective view of the RFID tag communication antenna 101 as viewed from the side opposite to FIG.

図1(a)、(b)及び(c)に示すように、本実施形態の無線タグ通信用アンテナ101は、金属によって形成された接地部材110Aと、熱伝導性材110Bhと電磁波吸収材110Bsを含む電磁波遮蔽部層110Bと、を積層形成したベース基板110と、接地部材110A又は電磁波遮蔽部層110Bの熱伝導性材110Bhの何れかの表面に設けられた、無線タグと信号を送受信するアンテナ本体部102とを備える。また、ベース基板110を接地部材と電磁波吸収材110Bsで形成してもよい。   As shown in FIGS. 1A, 1B, and 1C, the RFID tag communication antenna 101 of the present embodiment includes a grounding member 110A made of metal, a heat conductive material 110Bh, and an electromagnetic wave absorbing material 110Bs. A signal is transmitted to and received from a wireless tag provided on the surface of either the base substrate 110 formed by stacking the electromagnetic wave shielding part layer 110B including the base member 110 and the heat conductive material 110Bh of the grounding member 110A or the electromagnetic wave shielding part layer 110B. An antenna main body 102. Further, the base substrate 110 may be formed of a ground member and an electromagnetic wave absorber 110Bs.

電磁波遮蔽部層110Bは、ベース基板110の接地部材110Aに、電磁波吸収材110Bs,熱伝導性材110Bhの順にて熱伝導性材110Bsと電磁波吸収材110Bsが積層し形成される。また、図1(b)に示す構成の場合は、熱伝導性材110Bhを削除してもよい。さらに、アンテナ本体部102がベース基板110内に積層される場合もある。つまり、図示しないが、接地部材110A、アンテナ本体部102、電磁波吸収材110Bs及び熱伝導性材110Bhの順に構成してもよい。この場合も熱伝導材110Bhを削除してもよい。   The electromagnetic wave shielding portion layer 110B is formed by laminating the heat conductive material 110Bs and the electromagnetic wave absorber 110Bs on the ground member 110A of the base substrate 110 in the order of the electromagnetic wave absorber 110Bs and the heat conductive material 110Bh. In the case of the configuration shown in FIG. 1B, the heat conductive material 110Bh may be deleted. Further, the antenna main body 102 may be stacked in the base substrate 110. That is, although not shown, the ground member 110A, the antenna main body 102, the electromagnetic wave absorber 110Bs, and the heat conductive material 110Bh may be configured in this order. Also in this case, the heat conductive material 110Bh may be deleted.

図1(c)に、電磁波遮蔽部層110Bの熱伝導性材110Bh面にアンテナ本体部102を設置した他の実施形態を示した。   FIG. 1C shows another embodiment in which the antenna main body 102 is installed on the surface of the heat conductive material 110Bh of the electromagnetic wave shielding layer 110B.

また、図1(d)に示すように、無線タグ通信用アンテナ101は、ベース基板110のアンテナ本体部102を設置する面と対向する面に、熱伝導性材と電磁波吸収材を含む電磁波遮蔽壁が形成された、パワーアンプや信号制御回路を含む電子回路基板を収納する放熱ケース103をさらに備えるように構成することもできる。   In addition, as shown in FIG. 1D, the RFID tag communication antenna 101 includes an electromagnetic wave shielding material including a heat conductive material and an electromagnetic wave absorbing material on a surface of the base substrate 110 facing the surface on which the antenna main body 102 is installed. A heat dissipation case 103 for housing an electronic circuit board including a power amplifier and a signal control circuit, on which walls are formed, can also be provided.

なお、この場合には、電磁波遮蔽部層110Bは設けなくてもよい。すなわち、ベース基板110は接地部材110Aのみからなっていてもよい。   In this case, the electromagnetic wave shielding layer 110B may not be provided. That is, the base substrate 110 may be composed only of the ground member 110A.

図2は、図1(d)のBB線断面図の拡大図である。図2(a)に示すように、本実施形態の無線タグ通信用アンテナ101は、金属によって形成された接地部材110Aと、接地部材110Aの第1の面に設けた、無線タグと信号を送受信するアンテナ本体部102と、接地部材110Aの第1の面と対向する第2の面に、熱伝導性材401Aと電磁波吸収材403を含む電磁波遮蔽壁が形成された、電子回路基板404を収納する放熱ケース103とを備えるように構成することができる。   FIG. 2 is an enlarged view of a cross-sectional view taken along line BB in FIG. As shown in FIG. 2 (a), the RFID tag communication antenna 101 of this embodiment transmits and receives signals to and from the wireless tag provided on the first surface of the grounding member 110A and the grounding member 110A. An electronic circuit board 404 having an electromagnetic shielding wall including a heat conductive material 401A and an electromagnetic wave absorbing material 403 formed on a second surface opposite to the first surface of the antenna main body 102 and the grounding member 110A is accommodated. And a heat radiating case 103 to be configured.

ここで、アンテナ本体部102を設置する接地部材110Aの第1の面と対向する第2の面に電磁波遮蔽部層110Bが設けられるときは、放熱ケース103はベース基板110の電磁波遮蔽部層110B側の面に設けられる。すなわち、アンテナ本体部102,接地部材110A,電磁波遮蔽部層110B,放熱ケース103の順にて構成される。     Here, when the electromagnetic shielding layer 110B is provided on the second surface opposite to the first surface of the grounding member 110A on which the antenna main body 102 is installed, the heat radiating case 103 has the electromagnetic shielding layer 110B of the base substrate 110. It is provided on the side surface. That is, the antenna main body 102, the ground member 110 </ b> A, the electromagnetic wave shielding layer 110 </ b> B, and the heat dissipation case 103 are configured in this order.

また、放熱ケース103を用いずに電回路基板404を電磁波遮蔽部層110Bに設置してもよい。   Further, the electric circuit board 404 may be installed on the electromagnetic wave shielding layer 110B without using the heat radiating case 103.

さらに、図1(c)に示すように、無線タグ通信用アンテナ101のアンテナ本体部102を電磁波遮蔽部層の熱伝導性材110Bhの第1の面に設置してもよい。この場合、アンテナ本体部102、電磁波遮蔽部層110Bの熱伝導性材110Bh、電磁波吸収材110Bs、接地部材110A、放熱ケース103の順に構成され、アンテナ本体部102を設置する面と前記電子回路基板404を設置する面との間に電磁波吸収材403を有している。   Further, as shown in FIG. 1C, the antenna main body 102 of the RFID tag communication antenna 101 may be installed on the first surface of the heat conductive material 110Bh of the electromagnetic wave shielding portion layer. In this case, the antenna main body 102, the heat conductive material 110Bh of the electromagnetic wave shielding portion layer 110B, the electromagnetic wave absorbing material 110Bs, the grounding member 110A, and the heat dissipation case 103 are configured in this order, and the surface on which the antenna main body 102 is installed and the electronic circuit board An electromagnetic wave absorbing material 403 is provided between the surface on which 404 is installed.

また、無線タグ通信用アンテナ101は、アンテナ本体部102,接地部材110A,放熱ケース103の順にて設置してもよい。   The RFID tag communication antenna 101 may be installed in the order of the antenna main body 102, the ground member 110A, and the heat dissipation case 103.

放熱ケース103は、パワーアンプや信号制御回路を含む電子回路基板を内部に収納するために十分な大きさであり、例えば直方体に構成することができる。   The heat radiating case 103 is large enough to accommodate an electronic circuit board including a power amplifier and a signal control circuit, and can be configured in a rectangular parallelepiped, for example.

図2(a)に示すように、本実施形態の無線タグ通信用アンテナ101の放熱ケース103の電磁波遮蔽壁は、電子回路基板404(以下、電子部品の図示を省略する。)と対面する側、すなわち内側に電磁波吸収材403を有し、電子回路基板404と対面する側とは反対側、すなわち外側に熱伝導性材401Aを有する。   As shown in FIG. 2A, the electromagnetic wave shielding wall of the heat dissipation case 103 of the RFID tag communication antenna 101 of the present embodiment faces the electronic circuit board 404 (hereinafter, illustration of electronic components is omitted). In other words, the electromagnetic wave absorbing material 403 is provided on the inner side, and the heat conductive material 401A is provided on the side opposite to the side facing the electronic circuit board 404, that is, the outer side.

放熱ケース103は、電子回路基板404を載置した第1の熱伝導性材110Bhに、内側に電磁波吸収材403を有する第2の熱伝導性材401Aを、電子回路基板404が内部に収納されるように覆いかぶせ、ビス402によって接地部材110Aに係止される。   In the heat dissipation case 103, the first thermal conductive material 110Bh on which the electronic circuit board 404 is placed, the second thermal conductive material 401A having the electromagnetic wave absorbing material 403 inside, and the electronic circuit board 404 are housed inside. And is locked to the grounding member 110 </ b> A by screws 402.

電子回路基板404において発生した熱は、第1の熱伝導性材110Bhを伝わり、第2の熱伝導性材401A及び接地部材110Aから放熱される。第1の熱伝導性材110Bhは、第1の熱伝導性材110Bhの熱伝導率が接地部材110Aの熱伝導率より大きいときに、電子回路基板404において発生した熱をいち早く第2の熱伝導性材401Aに伝える役割をする。従って、第1の熱伝導性材110Bhは、第1の熱伝導性材110Bhの熱伝導率が接地部材110Aの熱伝導率より大きくないときは設けなくてもよい。   The heat generated in the electronic circuit board 404 is transmitted through the first heat conductive material 110Bh and is radiated from the second heat conductive material 401A and the ground member 110A. When the thermal conductivity of the first thermal conductive material 110Bh is higher than the thermal conductivity of the grounding member 110A, the first thermal conductive material 110Bh quickly transfers the heat generated in the electronic circuit board 404 to the second thermal conductivity. It plays a role of transmitting to the property material 401A. Therefore, the first thermal conductive material 110Bh may not be provided when the thermal conductivity of the first thermal conductive material 110Bh is not greater than the thermal conductivity of the ground member 110A.

一方、電子回路基板404において発生した電磁波は、電磁波吸収材403,110Bsにより吸収される。   On the other hand, electromagnetic waves generated in the electronic circuit board 404 are absorbed by the electromagnetic wave absorbers 403 and 110Bs.

電磁波吸収材403は、図2(a)に示すように、第2の熱伝導性材401Aの内側に均一に設けてもよい。また、電磁波吸収材403は、図2(b)に示すように、第2の熱伝導性材401Aの内側にモールド状、すなわち中空に設けてもよい。   As shown in FIG. 2A, the electromagnetic wave absorbing material 403 may be provided uniformly inside the second thermal conductive material 401A. Further, as shown in FIG. 2B, the electromagnetic wave absorbing material 403 may be provided inside the second heat conductive material 401A in a mold shape, that is, in a hollow shape.

電磁波吸収材403は、例えばカーボンを含浸させたポリウレタン,フェライト,カーボンを含浸させた発泡スチロールから1種類以上選ばれる材質を含むが、これらに限られるものではない。   The electromagnetic wave absorbing material 403 includes, for example, one or more materials selected from polyurethane impregnated with carbon, ferrite, and expanded polystyrene impregnated with carbon, but is not limited thereto.

熱伝導性材110Bh,401Aは、金属又は合成樹脂を含むが、これらに限られるものではない。熱伝導性材110Bh,401Aは、熱伝導率が空気よりも大きければよく、例えば、銅、アルミニウム、公知の熱伝導性樹脂などが挙げられる。   The heat conductive materials 110Bh and 401A include a metal or a synthetic resin, but are not limited thereto. The thermal conductive materials 110Bh and 401A only have to have a thermal conductivity higher than that of air, and examples thereof include copper, aluminum, and known thermal conductive resins.

図3は、本実施形態の無線タグ通信用アンテナ101の応用例を示した図である。図3に示すように、本応用例の無線タグ通信用アンテナ101は、接地部材110Aが第2の面に放熱用のフィン104を有する。   FIG. 3 is a diagram showing an application example of the RFID tag communication antenna 101 of the present embodiment. As shown in FIG. 3, in the RFID tag communication antenna 101 of this application example, the ground member 110A has the fins 104 for heat dissipation on the second surface.

図4は、本実施形態の無線タグ通信用アンテナ101の他の応用例を示した図である。図4に示すように、本応用例の無線タグ通信用アンテナ101は、放熱ケース103が電子回路基板404を収納する側とは反対側、すなわち放熱ケース103の外側に放熱用のフィン105を有する。本応用例の無線タグ通信用アンテナ101は、接地部材110A又は熱伝導性材110Bhのアンテナ本体部102を設置する面と対向する面に放熱用のフィン104を有していてもよい。   FIG. 4 is a diagram showing another application example of the RFID tag communication antenna 101 of the present embodiment. As shown in FIG. 4, the RFID tag communication antenna 101 of this application example has the heat radiation fins 105 on the side opposite to the side where the heat radiation case 103 houses the electronic circuit board 404, that is, outside the heat radiation case 103. . The RFID tag communication antenna 101 of this application example may have a heat radiation fin 104 on a surface of the ground member 110A or the heat conductive material 110Bh that faces the surface on which the antenna main body 102 is installed.

図5は、本実施形態の無線タグ通信用アンテナ101を用いた無線タグリーダライタ201を示した図である。このように、本実施形態の無線タグ通信用アンテナ101を用いた無線タグリーダライタ201は、部品点数を減少させることが可能となり、大きさを小さくすることが可能となる。   FIG. 5 is a diagram showing a wireless tag reader / writer 201 using the wireless tag communication antenna 101 of the present embodiment. As described above, the RFID tag reader / writer 201 using the RFID tag communication antenna 101 according to the present embodiment can reduce the number of components and can be reduced in size.

<本実施形態の効果>
以上述べたように、本実施形態の無線タグ通信用アンテナは、接地部材のアンテナ本体部が設けられる第1の面と対向する第2の面に、熱伝導性材と電磁波吸収材を含む電磁波遮蔽部層を備え、この電磁波遮蔽部層の接地部材と対向する面に、電子回路基板を備える。又は、接地部材のアンテナ本体部が設けられる第1の面と対向する第2の面に、熱伝導性材と電磁波吸収材を含む電磁波遮蔽壁が形成された、電子回路基板を収納する放熱ケースを備える。このため、部品点数が減少して無線タグリーダライタの大きさ小さくすることが可能であり、放熱性に優れ、電波干渉を起さないという効果がある。
<Effect of this embodiment>
As described above, the RFID tag communication antenna according to the present embodiment includes an electromagnetic wave including a heat conductive material and an electromagnetic wave absorbing material on the second surface facing the first surface on which the antenna main body of the ground member is provided. A shielding layer is provided, and an electronic circuit board is provided on the surface of the electromagnetic shielding layer facing the grounding member. Alternatively, a heat dissipation case for storing an electronic circuit board, in which an electromagnetic wave shielding wall including a heat conductive material and an electromagnetic wave absorbing material is formed on a second surface opposite to the first surface on which the antenna main body portion of the grounding member is provided. Is provided. For this reason, the number of parts can be reduced and the size of the wireless tag reader / writer can be reduced, and there is an effect that heat radiation is excellent and radio wave interference does not occur.

<本発明の具体化における可能性>
なお、本発明は上記実施形態そのままに限定されるものではなく、実施段階ではその要旨を逸脱しない範囲で構成要素を変形して具体化できる。また、上記実施形態に開示されている複数の構成要素の適宜な組み合わせにより、種々の発明を形成できる。例えば、実施形態に示される全構成要素から幾つかの構成要素を削除してもよい。さらに、異なる実施形態にわたる構成要素を適宜組み合わせてもよい。
<Possibility in the embodiment of the present invention>
Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

本実施形態の無線タグ通信用アンテナの構成の概要を示した図である。It is the figure which showed the outline | summary of the structure of the antenna for RFID tag communication of this embodiment. 図1(b)のAA線断面図の拡大図である。It is an enlarged view of the AA line sectional view of Drawing 1 (b). 本実施形態の無線タグ通信用アンテナの応用例を示した図である。It is the figure which showed the application example of the antenna for radio | wireless tag communication of this embodiment. 本実施形態の無線タグ通信用アンテナの他の応用例を示した図である。It is the figure which showed the other application example of the antenna for RFID tag communication of this embodiment. 本実施形態の無線タグ通信用アンテナを用いた無線タグリーダライタを示した図である。It is the figure which showed the wireless tag reader / writer using the antenna for wireless tag communication of this embodiment. 従来の無線タグ通信用アンテナを用いた無線タグリーダライタを示した図である。It is the figure which showed the wireless tag reader / writer using the conventional antenna for wireless tag communication.

符号の説明Explanation of symbols

101:無線タグ通信用アンテナ、
102:アンテナ本体部、
103:放熱ケース、
104,105:放熱用フィン
401A,401B:熱伝導性材、
403:電磁波吸収材。
101: RFID tag communication antenna,
102: Antenna main body,
103: heat dissipation case,
104, 105: heat dissipation fins 401A, 401B: thermally conductive material,
403: Electromagnetic wave absorber.

Claims (10)

金属によって形成された接地部材と、
熱伝導性材と電磁波吸収材を含む電磁波遮蔽部層と、
を積層形成したベース基板と;
前記接地部材又は前記電磁波遮蔽部層の熱伝導性材の何れかの面に設けられた、無線タグと信号を送受信するアンテナ本体部と;
を備える、ことを特徴とする無線タグ通信用アンテナ。
A grounding member formed of metal;
An electromagnetic shielding layer including a thermally conductive material and an electromagnetic wave absorbing material;
A base substrate formed by stacking layers;
An antenna body provided on either surface of the grounding member or the heat conductive material of the electromagnetic wave shielding portion layer, for transmitting and receiving signals to and from the wireless tag;
An antenna for wireless tag communication, comprising:
前記アンテナ本体部を設置する前記ベース基板が、接地部材、電磁波吸収部材、熱伝導性材の順、または接地部材、電磁波吸収材の順にて積層されることを特徴とする、請求項1記載の無線タグ通信用アンテナ。   The base substrate on which the antenna main body is installed is laminated in the order of a grounding member, an electromagnetic wave absorbing member, and a heat conductive material, or a grounding member and an electromagnetic wave absorbing material in this order. Antenna for wireless tag communication. 前記ベース基板のアンテナ本体部を設置する面と対向する面に、
熱伝導性材と電磁波吸収材を含む電磁波遮蔽壁が形成された、電子回路基板を収納する放熱ケースをさらに備えることを特徴とする、請求項1又は請求項2に記載の無線タグ通信用アンテナ。
On the surface facing the surface on which the antenna main body of the base substrate is installed,
The antenna for RFID tag communication according to claim 1 or 2, further comprising a heat dissipation case for accommodating an electronic circuit board, on which an electromagnetic wave shielding wall including a heat conductive material and an electromagnetic wave absorbing material is formed. .
前記ベース基板のアンテナ本体部を設置する面と対向する面に、
前記電磁波遮蔽部層が形成され、前記電子回路基板を設置する側から熱伝導性材、電磁波吸収材、接地部材の順、または接地部材、電磁波吸収材、熱伝導性材の順に積層され、前記アンテナ本体部を設置する面と前記電子回路基板を設置する面との間に電磁波吸収材を有する、ことを特徴とする請求項3に記載の無線タグ通信用アンテナ。
On the surface facing the surface on which the antenna main body of the base substrate is installed,
The electromagnetic wave shielding part layer is formed and laminated in the order of a heat conductive material, an electromagnetic wave absorbing material, a grounding member, or a grounding member, an electromagnetic wave absorbing material, and a heat conductive material from the side where the electronic circuit board is installed, The antenna for RFID tag communication according to claim 3, further comprising an electromagnetic wave absorbing material between a surface on which the antenna main body is installed and a surface on which the electronic circuit board is installed.
金属によって形成された接地部材と;
前記接地部材の第1の面に設けた、無線タグと信号を送受信するアンテナ本体部と;
前記接地部材の第1の面と対向する第2の面に、
熱伝導性材と電磁波吸収材を含む電磁波遮蔽壁が形成された、電子回路基板を収納する放熱ケースと;
を備える、無線タグ通信用アンテナ。
A grounding member formed of metal;
An antenna main body for transmitting and receiving signals to and from a wireless tag, provided on the first surface of the ground member;
On the second surface facing the first surface of the grounding member,
A heat dissipation case for storing an electronic circuit board, on which an electromagnetic wave shielding wall including a heat conductive material and an electromagnetic wave absorbing material is formed;
An antenna for wireless tag communication, comprising:
前記電磁波遮蔽壁が、前記電子回路基板と対面する側に前記電磁波吸収材を有し、前記電子回路基板と対面する側とは反対側に熱伝導性材を有する、ことを特徴とする請求項3乃至請求項5のいずれか1項に記載の無線タグ通信用アンテナ。   The electromagnetic wave shielding wall has the electromagnetic wave absorbing material on a side facing the electronic circuit board, and has a heat conductive material on a side opposite to the side facing the electronic circuit board. The wireless tag communication antenna according to any one of claims 3 to 5. 前記放熱ケースが、前記電子回路基板と対面する側とは反対側に放熱用のフィンを有する、ことを特徴とする請求項3乃至請求項6のいずれか1項に記載の無線タグ通信用アンテナ。   7. The RFID tag communication antenna according to claim 3, wherein the heat dissipation case has a heat dissipation fin on a side opposite to a side facing the electronic circuit board. . 前記接地部材又は熱伝導性材の前記アンテナ本体部を設置する面と対向する面に放熱用のフィンを有する、ことを特徴とする請求項1乃至請求項7のいずれか1項に記載の無線タグ通信用アンテナ。   The radio according to any one of claims 1 to 7, further comprising a heat dissipation fin on a surface of the grounding member or a heat conductive material facing a surface on which the antenna main body is installed. Antenna for tag communication. 前記電磁波吸収材が、カーボンを含浸させたポリウレタン,フェライト,カーボンを含浸させた発泡スチロールから1種類以上選ばれる材質を含むことを特徴とする、請求項1乃至請求項8のいずれか1項に記載の無線タグ通信用アンテナ。   9. The electromagnetic wave absorbing material according to claim 1, wherein the electromagnetic wave absorbing material includes one or more materials selected from polyurethane impregnated with carbon, ferrite, and expanded polystyrene impregnated with carbon. RFID tag communication antenna. 前記熱伝導性材が、金属又は合成樹脂を含むことを特徴とする、請求項1乃至請求項9のいずれか1項に記載の無線タグ通信用アンテナ。   The wireless tag communication antenna according to claim 1, wherein the thermal conductive material includes a metal or a synthetic resin.
JP2007157449A 2007-06-14 2007-06-14 Antenna for radio tag communication Pending JP2008310572A (en)

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