JP2008309590A - Nozzle inspection apparatus and nozzle inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To acquire a nozzle inspection apparatus for simplifying a constitution, and accurately and easily inspecting a processing nozzle without damaging the processing nozzle. <P>SOLUTION: The nozzle inspection apparatus for inspecting the processing nozzle in a laser processing machine for implementing laser processing of a workpiece by using the processing nozzle corresponding to a type of a processing treatment comprises: an electrostatic capacitance measuring section 14 for measuring an electrostatic capacitance between the processing nozzle and a tapered gauge 32 having an upper end thinner than a lower end; a processing head control section 12 for controlling a height of the processing nozzle relative to the gauge 32 so as to insert the gauge 32 into a laser exit aperture; a Z-coordinate detecting section 13 for detecting the height of the processing nozzle when the electrostatic capacitance indicates a predetermined preset value; a nozzle determining section 16 for determining whether the processing nozzle has a nozzle inside diameter corresponding to the processing nozzle to be mounted, based on the detected height of the processing nozzle; and a determination result outputting section 18 for outputting a determination result obtained in the nozzle determining section 16. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a nozzle inspection apparatus and a nozzle inspection method for inspecting a processing nozzle of a laser processing apparatus.

  In a laser processing apparatus, a processing nozzle corresponding to a processing process is mounted on a processing head, and laser processing is performed on the workpiece by irradiating the workpiece with laser light through the mounted processing nozzle. In such a laser processing apparatus, when each laser processing is started, the processing nozzle attached to the processing head is replaced.

  Conventionally, the type of processing nozzle attached to the processing head has been confirmed by visual observation or the like by a user (operator) of the laser processing apparatus. For this reason, even when an incorrect processing nozzle is attached to the processing head, the error may not be noticed.

  The processing nozzle has a different nozzle diameter (inner diameter) of the laser emission port for each type of processing nozzle. Therefore, if the nozzle inner diameter of the processing nozzle is measured, the type of the processing nozzle attached to the processing head can be determined.

  Further, during the laser processing, if the processing nozzle comes into contact with the workpiece, or spatter from the workpiece adheres to the processing nozzle, the laser emission port of the processing nozzle is soiled. At this time, if the nozzle inner diameter of the contaminated processing nozzle is measured, the measured value of the nozzle inner diameter becomes smaller due to the influence of the contaminated material. Therefore, if the nozzle inner diameter of the machining nozzle is measured, it can be determined whether or not the machining nozzle is fouled.

  In the disk inner diameter inspection method described in Patent Document 1, a limit gauge having a predetermined dimension having a taper is inserted into a disk hole. When the limit gauge cannot pass through the hole of the disk and the disk is displaced, the inner diameter of the disk is inspected by detecting the displacement of the disk.

JP-A-2-213701

  However, the above conventional technique has a problem that the gauge or the measurement object may be damaged because the gauge is pressed against the hole of the disk (measurement object) to measure the inner diameter of the measurement object. It was.

  Further, when the inner diameter of the measurement object is too larger than the reference range, there is a problem that the inner diameter of the measurement object cannot be inspected. Moreover, when measuring a measurement object having various inner diameters, it is necessary to prepare a gauge having a predetermined outer diameter for each measurement object, and the apparatus for measuring the inner diameter of the measurement object is complicated. In addition, there is a problem that the measurement process is troublesome.

  The present invention has been made in view of the above, and it is an object of the present invention to obtain a nozzle inspection device and a nozzle inspection method capable of easily inspecting an accurate processing nozzle with a simple configuration without damaging the processing nozzle. Objective.

  In order to solve the above-described problems and achieve the object, the present invention provides the processing nozzle of a laser processing machine that performs laser processing of a workpiece by irradiating laser light from a processing nozzle corresponding to the type of processing. In the nozzle inspection apparatus to be inspected, the upper end portion has a taper-shaped measuring element that is thinner than the lower end portion, and the capacitance measuring unit that measures the capacitance between the processing nozzle and the measuring element, and the measurement A position control unit that controls the height of the machining nozzle relative to the measuring element in a direction perpendicular to the main surface of the workpiece so that a child is inserted into the laser emission port of the machining nozzle from the upper end side; A position detection unit for detecting, as position information, a position in the height direction of the processing nozzle when the measuring element is inserted into the laser emission port and the capacitance shows a predetermined value set in advance; and the position detection unit includes To detect A nozzle determination unit that determines whether or not the processing nozzle has a nozzle inner diameter corresponding to a processing nozzle to be mounted based on position information; a determination result output unit that outputs a determination result of the nozzle determination unit; .

  According to the present invention, the processing nozzle is mounted on the processing target to be mounted based on the position in the height direction of the processing nozzle when the capacitance between the tapered probe and the processing nozzle shows a predetermined value set in advance. Since it is determined whether or not the nozzle has an inner diameter corresponding to the nozzle, there is an effect that an accurate inspection of the processing nozzle can be easily performed with a simple configuration without damaging the processing nozzle.

  Embodiments of a nozzle inspection apparatus and a nozzle inspection method according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. Hereinafter, for convenience of explanation, a direction parallel to the main surface of the workpiece will be described as an XY direction, and a direction perpendicular to the main surface of the workpiece will be described as a Z-axis direction.

Embodiment FIG. 1 is a perspective view showing a schematic configuration of a laser processing apparatus having a nozzle inspection apparatus according to an embodiment of the present invention. In addition, although it has various members, such as a dust collection part, as a structural member of the laser processing apparatus 100, description is abbreviate | omitted in the member which is not directly related to this invention.

  A laser processing apparatus 100 according to the present embodiment includes a processing mechanism 2 that performs laser processing of a workpiece (workpiece) 25, a nozzle inspection apparatus 1 that inspects a processing nozzle 31, and a processing nozzle 31 that is attached to the processing head 20. And a plurality of nozzle changers (nozzle replacement devices) 50 for performing the replacement. The nozzle inspection device 1 and the nozzle changer 50 are provided, for example, in an external region of the processing mechanism 2.

  The nozzle inspection apparatus 1 controls a capacitance measuring unit 30 that measures a change in capacitance between the machining head 20 and the machining nozzle 31, and controls the capacitance measuring unit 30 to calculate the inner diameter of the machining nozzle 31. A nozzle inspection mechanism 40 is provided. The capacitance measuring unit 30 is connected to the nozzle inspection mechanism 40.

  The capacitance measuring unit 30 includes a tapered gauge (measuring element) 32 that is inserted into the laser emission port of the processing nozzle 31 to be measured. The gauge 32 is disposed in the capacitance measuring unit 30 such that the tip end (upper end) extends to the plus side (upper side) in the Z-axis direction (vertical direction). The gauge 32 has a tapered shape whose upper end side is narrower than the lower end side. The processing nozzle 31 is attached to the processing head 20 so that the laser emission port faces the negative side (downside) in the Z-axis direction.

  The nozzle inspection apparatus 1 uses the capacitance measuring unit 30 to change the capacitance between the machining nozzle 31 and the gauge 32 while lowering the machining nozzle 31 attached to the machining head 20 to the gauge 32 side. Based on the measured value, the processing nozzle 31 (such as the inner diameter of the laser emission port) is inspected.

  The nozzle inspection apparatus 1 according to the present embodiment inspects the processing nozzle 31 before replacing the processing nozzle 31 attached to the processing head 20 with a new processing nozzle 31 and starting a new laser processing.

  The nozzle inspection mechanism 40 is connected to the capacitance measurement unit 30 and the machining head 20 and controls the operation of the capacitance measurement unit 30 and the operation of the machining head 20. Here, illustration of an apparatus for controlling the machining mechanism 2 when the machining mechanism 2 performs laser machining is omitted. Here, the configuration of the laser processing apparatus 100 when the processing head 20 is moved on the processing table 22 to perform laser processing on the workpiece 25 has been described. However, the laser processing apparatus 100 performs processing instead of the processing head 20. The table 22 may be moved to perform laser processing on the workpiece 25.

  Each nozzle changer 50 stores one processing nozzle 31 that is detachably attached to the processing head 20 and replaces the processing nozzle 31 attached to the processing head 20. Each processing nozzle 31 stored in each nozzle changer 50 has various laser emission ports (inner diameters) for each processing nozzle 31.

  For example, when the machining head 20 is stopped above the nozzle changer 50 without the machining nozzle 31 being attached to the machining head 20, the nozzle changer 50 attaches the machining nozzle 31 to the machining head 20. Further, when the processing head 20 is stopped above the nozzle changer 50 with the nozzle changer 50 not storing the processing nozzle 31, the nozzle changer 50 removes the processing nozzle 31 from the processing head 20 and moves the processing nozzle 31. Store in own device.

  The processing mechanism 2 includes a processing table 23, a processing table (work support) 22, and a processing head 20. The processing table 23 is a base portion of the processing mechanism 2, and a processing table 22 is disposed on the upper surface thereof. The processing table 22 places the workpiece 25 in contact with the back surface of the workpiece 25 at a plurality of convex portions (support points), for example.

  The machining head 20 moves on the workpiece 25 (in the XY plane) while securing a distance in a predetermined height direction (Z-axis direction) with the workpiece 25 and stops at a predetermined processing position. Then, laser processing of the workpiece 25 is performed. The processing head 20 attaches any of the processing nozzles 31 and sends (irradiates) laser light or assist gas to the workpiece 25 through the attached processing nozzle 31.

  Next, the configuration and operation procedure of the nozzle inspection apparatus 1 which is the main feature of the present invention will be described. FIG. 2 is a block diagram showing the configuration of the nozzle inspection apparatus. The nozzle inspection apparatus 1 includes an input unit 11, a processing head control unit (position control unit) 12, a Z coordinate detection unit (position detection unit) 13, a capacitance measurement unit 14, a nozzle diameter calculation unit 15, a nozzle determination unit 16, A nozzle information storage unit 17, a determination result output unit 18, and a control unit 19 are provided.

  The input unit 11 includes a mouse and a keyboard, and inputs information (nozzle type information) for identifying the type of the processing nozzle 31 attached to the processing head 20. The input of the nozzle type information to the input unit 11 may be performed manually by the user of the laser processing apparatus 100, or by reading the NC program stored in the external apparatus and extracting the nozzle type information. You may go.

  The machining head control unit 12 controls the movement of the machining head 20 in the XY plane and the movement of the machining head 20 in the Z-axis direction. When the machining head control unit 12 inspects the machining nozzle 31 attached to the machining head 20, the machining head controller 12 moves the machining head 20 onto the gauge 32 and inserts the gauge 32 into the laser emission port of the machining nozzle 31. Then, the machining nozzle 31 is lowered by electrostatic copying.

  The Z coordinate detection unit 13 lowers the machining nozzle 31 to the gauge 32 side and inspects the machining nozzle 31, the absolute value (position information) of the Z coordinate of the machining nozzle 31 according to the lowered position of the machining nozzle 31. Is detected.

  The capacitance measuring unit 14 includes a gauge 32 having a tapered shape, and measures the capacitance between the machining nozzle 31 and the gauge 32 when the machining nozzle 31 is lowered to the gauge 32 side. To do.

  The nozzle diameter calculation unit 15 performs processing based on the Z coordinate detected by the Z coordinate detection unit 13 when the capacitance (measurement result) measured by the capacitance measurement unit 14 shows a predetermined value (for example, 0). The nozzle inner diameter of the nozzle 31 is calculated. The nozzle diameter calculation unit 15 stores nozzle diameter information 101 (correspondence between Z coordinates and nozzle inner diameter), which will be described later, as information related to the shape of the gauge 32 in advance. The nozzle diameter calculation unit 15 calculates the nozzle inner diameter of the processing nozzle 31 based on the information related to the shape of the gauge 32 and the Z coordinate (height of the processing nozzle 31) detected by the Z coordinate detection unit 13.

  The nozzle information storage unit 17 is a storage unit such as a memory that stores information on the processing nozzle 31 (processing nozzle information 102 described later). The processing nozzle information is information related to the nozzle inner diameter for each processing nozzle 31.

  The nozzle determination unit 16 uses the nozzle inner diameter calculated by the nozzle diameter calculation unit 15 and the processing nozzle information 102 (nozzle inner diameter) in the nozzle information storage unit 17 to process the processing nozzle 31 that has performed the nozzle inner diameter inspection. It is determined whether or not the processing nozzle 31 is the correct processing nozzle 31 to be mounted on the head 20 (processing nozzle 31 corresponding to the processing processing).

  The determination result output unit 18 includes voice output means such as a speaker and character and image display means such as a liquid crystal monitor. The determination result output unit 18 outputs the determination result of the nozzle determination unit 16 and the calculation result (nozzle inner diameter) of the nozzle diameter calculation unit 15. The determination result output unit 18 outputs, for example, the nozzle inner diameter (calculated value) of the processing nozzle 31 calculated by the nozzle diameter calculation unit 15 by voice or text. The determination result output unit 18 outputs an alarm when, for example, the nozzle determination unit 16 determines that an incorrect processing nozzle 31 is attached to the processing head 20.

  The control unit 19 includes an input unit 11, a machining head control unit 12, a Z coordinate detection unit 13, a capacitance measurement unit 14, a nozzle diameter calculation unit 15, a nozzle determination unit 16, a nozzle information storage unit 17, and a determination result output unit 18. To control.

  An input unit 11, a machining head control unit 12, a Z coordinate detection unit 13, a capacitance measurement unit 14, a nozzle diameter calculation unit 15, a nozzle determination unit 16, a nozzle information storage unit 17, a determination result output unit 18, and a control unit 19 This corresponds to the nozzle inspection mechanism 40 in FIG. The capacitance measuring unit 14 corresponds to the capacitance measuring unit 30 in FIG.

  Here, the shape of the gauge 32 of the capacitance measuring unit 14 and the shape of the processing nozzle 31 will be described. FIG. 3 is a diagram showing the configuration of the gauge and the configuration of the machining nozzle. FIG. 3 shows a cross-sectional configuration of the gauge 32 and the processing nozzle 31.

  The gauge 32 has a substantially conical shape (generally frustoconical shape), and the bottom surface side of the generally conical shape is in contact with the pedestal 35 and the apex of the generally conical shape is electrostatically directed to the upper side in the vertical direction (Z axis). It is disposed in the capacity measuring unit 30.

  The processing nozzle 31 is provided with a laser emission port for emitting laser light in the central axis direction of the processing nozzle 31. When the processing nozzle 31 is inspected, a gauge 32 is inserted into the laser emission port of the processing nozzle 31. The processing nozzle 31, the gauge 32, the pedestal 35, and the like have conductivity, and by applying a voltage between the processing nozzle 31 and the gauge 32, the capacitance between the processing nozzle 31 and the gauge 32 is increased. Measured. When the gauge 32 (outer wall surface) contacts the laser emission port (inner wall surface) of the processing nozzle 31, the capacitance between the processing nozzle 31 and the gauge 32 becomes zero. In the present embodiment, based on the Z coordinate of the machining nozzle 31 when the capacitance between the machining nozzle 31 and the gauge 32 reaches a predetermined threshold value (0 or a value close to 0), Measure the inner diameter.

  Next, a processing procedure of the laser processing apparatus having the nozzle inspection apparatus according to the embodiment of the present invention will be described. FIG. 4 is a flowchart showing a processing procedure of the laser processing apparatus according to the embodiment of the present invention.

  In FIG. 4, after the laser processing apparatus 100 performs the processing A1 as the laser processing, the processing nozzle 31 attached to the processing head 20 is changed from the processing nozzle 31 used in the processing A1 to the processing nozzle 31 used in the processing A2. Will be described, and then the processing procedure when performing the processing A2 will be described.

  The laser machining apparatus 100 performs the machining process A1 by mounting the machining nozzle 31 corresponding to the machining process A1 on the machining head 20 (step S110). When the processing A1 ends, the processing head 20 moves onto the nozzle changer 50 for storing the processing nozzle 31 used in the processing A1. Then, the machining nozzle 31 used in the machining process A1 is stored in the nozzle changer 50, and is moved onto the nozzle changer 50 in which the machining nozzle 31 used in the next machining process A2 is stored. Then, the machining nozzle 31 used for the machining process A2 is attached to the machining head 20. Thereby, the laser processing apparatus 100 replaces the processing nozzle 31 attached to the processing head 20 (step S120).

  The machining head 20 equipped with the new machining nozzle 31 moves onto the gauge 32 of the capacitance measuring unit 14 (capacitance measuring unit 30). Then, the change in capacitance between the processing nozzle 31 and the gauge 32 is measured while bringing the processing nozzle 31 close to the gauge 32. The nozzle inspection apparatus 1 measures the inner diameter of the laser emission port of the processing nozzle 31 based on the measured capacitance. The nozzle inspection apparatus 1 determines (confirms) whether or not the processing nozzle 31 attached to the processing head 20 is the correct processing nozzle 31 based on the measured inner diameter of the laser emission port (step S130). At this time, the determination result output unit 18 outputs the determination result of the nozzle determination unit 16, the calculation result (nozzle inner diameter) of the nozzle diameter calculation unit 15, and the like.

  When the nozzle determination unit 16 of the nozzle inspection apparatus 1 determines that the correct processing nozzle 31 is mounted on the processing head 20 (step S140, Yes), the laser processing apparatus 100 performs the processing nozzle 31 mounted on the processing head 20. The scanning calibration in the Z-axis direction is performed (step S150). This scanning calibration is a calibration for correcting an error for each processing nozzle 31 when the processing nozzle 31 is moved to a predetermined height. For example, the machining head 20 is moved to a calibration plate (calibration plate), and the machining nozzle 31 is brought into contact with the calibration plate. The processing nozzle 31 is raised with the position where the processing nozzle 31 contacts the calibration plate as a reference position. Then, the relationship between the distance between the machining nozzle 31 and the calibration plate (the height of the machining nozzle 31) and the capacitance between the machining nozzle 31 and the calibration plate is acquired at a plurality of positions. The laser processing apparatus 100 performs control (electrostatic copying) in the Z-axis direction of the processing nozzle 31 during laser processing based on the acquired relationship between the height data of the processing nozzle 31 and the capacitance.

  On the other hand, when the nozzle determination unit 16 of the nozzle inspection apparatus 1 determines that the wrong processing nozzle 31 is attached to the processing head 20 (step S140, No), the determination result output unit 18 of the laser processing apparatus 100 outputs an alarm or the like. Is output (step S160).

  And the laser processing apparatus 100 repeats the process of step S120-S140, S160 until the nozzle determination part 16 judges that the correct process nozzle 31 is mounted | worn with the process head 20. FIG. When the wrong machining nozzle 31 is attached to the machining head 20, the user of the laser machining apparatus 100 gives an instruction to replace the machining nozzle 31 attached to the machining head 20 (an instruction to specify the correct machining nozzle 31). Enter 100. Then, the laser processing apparatus 100 replaces the processing nozzle 31 attached to the processing head 20 from the incorrect processing nozzle 31 to the correct processing nozzle 31 (step S120). Thereafter, the nozzle inspection apparatus 1 confirms the nozzle inner diameter of the processing nozzle 31 using the gauge 32, and determines whether or not the processing nozzle 31 mounted on the processing head 20 is the correct processing nozzle 31 (step S130). , S140).

  When it is determined that the correct processing nozzle 31 is attached to the processing head 20, and the laser processing apparatus 100 performs the scanning calibration of the processing nozzle 31 in the Z-axis direction, the laser processing apparatus 100 performs the following processing A2. (Step S170).

  Next, an inspection processing procedure for the processing nozzle 31 by the nozzle inspection apparatus 1 will be described in detail. FIG. 5 is a flowchart showing a processing procedure for processing nozzle inspection processing. FIG. 5 shows a process for determining whether or not the machining nozzle 31 attached to the machining head 20 is the correct machining nozzle 31 (the process in step S130).

  The processing head control unit 12 of the laser processing apparatus 100 moves the processing head 20 equipped with the processing nozzle 31 in the XY plane, and moves the processing nozzle 31 onto the gauge 32 of the capacitance measuring unit 14 (step S210). .

  Further, the machining head control unit 12 lowers the machining head 20 toward the gauge 32 with the machining nozzle 31 mounted, and brings the laser irradiation port of the machining nozzle 31 closer to the gauge 32 (step S220). Then, the machining head control unit 12 inserts the gauge 32 into the laser irradiation port of the machining nozzle 31. While the processing nozzle 31 is lowered toward the gauge 32, the Z coordinate detection unit 13 detects the Z coordinate of the processing nozzle 31, and the capacitance measurement unit 14 detects the static between the processing nozzle 31 and the gauge 32. Measure the capacitance.

  The nozzle diameter calculation unit 15 monitors whether or not the capacitance between the processing nozzle 31 and the gauge 32 has become equal to or less than a predetermined threshold value t1 (step S230). If the capacitance between the processing nozzle 31 and the gauge 32 is not less than or equal to the threshold value t1 (No at Step S230), the nozzle diameter calculation unit 15 repeats the processes at Steps S220 and S230.

  When the capacitance between the processing nozzle 31 and the gauge 32 becomes equal to or less than the threshold value t1 (step S230, Yes), the nozzle diameter calculation unit 15 detects the Z coordinate (absolute value) of the processing nozzle 31 at this time as the Z coordinate. Obtained from the unit 13 (step S240).

  Here, the relationship between the electrostatic capacitance between the processing nozzle 31 and the gauge 32 and the Z coordinate of the processing nozzle 31 will be described. FIG. 6 is a diagram showing the relationship between the capacitance and the Z coordinate of the machining nozzle. In FIG. 6, the vertical axis represents the capacitance value between the processing nozzle 31 and the gauge 32, and the horizontal axis represents the Z coordinate value (absolute value) of the processing nozzle 31.

  The capacitance between the processing nozzle 31 and the gauge 32 decreases as the Z coordinate (absolute value) of the processing nozzle 31 increases (as the processing nozzle 31 approaches the gauge 32). When the Z coordinate of the machining nozzle 31 reaches a predetermined value z1, the capacitance value becomes smaller than a predetermined threshold value t1 set in advance.

  The nozzle diameter calculation unit 15 calculates the nozzle inner diameter of the processing nozzle 31 based on the Z coordinate of the processing nozzle 31 when the electrostatic capacitance between the processing nozzle 31 and the gauge 32 becomes equal to or less than the threshold value t1. The nozzle diameter calculation unit 15 stores nozzle diameter information (nozzle inner diameter information) 101 as information indicating the relationship between the Z coordinate and the nozzle inner diameter.

  Here, the nozzle diameter information 101 stored in the nozzle diameter calculation unit 15 will be described. FIG. 7 is a diagram showing nozzle diameter information. The nozzle diameter information 101 is information indicating a correspondence relationship between the Z coordinate of the processing nozzle 31 and the nozzle inner diameter of the processing nozzle 31 when the capacitance reaches the threshold value t1. In the present embodiment, the Z coordinate of the processing nozzle 31 when the electrostatic capacitance between the processing nozzle 31 and the gauge 32 is the threshold value t1 is z1. The nozzle diameter calculation unit 15 calculates the nozzle inner diameter r1 (the inner diameter of the laser emission port of the processing nozzle 31) corresponding to the Z coordinate (z1) based on the nozzle diameter information 101 (step S250).

  The nozzle determination unit 16 attaches the nozzle inner diameter calculated by the nozzle diameter calculation unit 15 to the processing head 20 based on the nozzle inner diameter calculated by the nozzle diameter calculation unit 15 and the processing nozzle information 102 in the nozzle information storage unit 17. It is determined whether or not the nozzle inner diameter corresponds to the machining nozzle 31 to be processed. Thereby, the nozzle determination unit 16 determines whether or not the processing nozzle 31 that has been inspected for the nozzle inner diameter is the correct processing nozzle 31 (processing nozzle 31 corresponding to the processing processing) to be attached to the processing head 20. (Step S260).

  Here, the processing nozzle information (position information) 102 stored in the nozzle information storage section (position information storage section) 17 will be described. FIG. 8 is a diagram illustrating an example of the configuration of processing nozzle information. The processing nozzle information 102 is information for identifying the type of the processing nozzle 31 (nozzle type), the nozzle inner diameter of the processing nozzle 31, and the processing nozzle 31 when the electrostatic capacity between the processing nozzle 31 and the gauge 32 becomes the threshold value t1. The Z coordinate is an information table associated with each processing nozzle 31.

  For example, the processing nozzle 31 with the nozzle type “N001” has a “nozzle diameter” of 1.05 (mm), and the processing nozzle when the capacitance between the processing nozzle 31 and the gauge 32 is the threshold value t1. The “Z coordinate” of 31 is 11.0.

  When the nozzle inner diameter calculated by the nozzle diameter calculator 15 is the nozzle inner diameter corresponding to the processing nozzle 31 to be mounted on the processing head 20 (Yes at Step S260), the nozzle determination unit 16 determines that the correct processing nozzle 31 is the processing head. 20 (step S270). When the nozzle inner diameter calculated by the nozzle diameter calculation unit 15 is within a predetermined error range with respect to the “nozzle diameter” in the nozzle diameter information 101, the nozzle determination unit 16 determines that the correct processing nozzle 31 is in the processing head 20. It is determined that it is attached. For example, when the “nozzle diameter” in the nozzle diameter information 101 is 1.05 (mm), the nozzle determining unit 16 has a nozzle inner diameter calculated by the nozzle diameter calculating unit 15 of 1.05 (mm) ± 0.05. In the case of (mm), it is determined that the correct processing nozzle 31 is mounted on the processing head 20.

  On the other hand, when the nozzle inner diameter calculated by the nozzle diameter calculation unit 15 is not the nozzle inner diameter corresponding to the processing nozzle 31 to be mounted on the processing head 20 (No in step S260), the nozzle determination unit 16 determines that the wrong processing nozzle 31 is It is determined that the processing head 20 is mounted (step S280).

  When the nozzle inner diameter calculated by the nozzle diameter calculation unit 15 is not within a predetermined error range with respect to the “nozzle diameter” in the nozzle diameter information 101, the nozzle determination unit 16 determines that the wrong processing nozzle 31 is in the processing head 20. It is determined that it is attached. For example, when the “nozzle diameter” in the nozzle diameter information 101 is 1.05 (mm), the nozzle determining unit 16 has a nozzle inner diameter calculated by the nozzle diameter calculating unit 15 of 1.05 (mm) ± 0.05. In cases other than (mm), it is determined that the wrong machining nozzle 31 is mounted on the machining head 20.

  In this embodiment, the nozzle determination unit 16 uses the “nozzle diameter” in the processing nozzle information 102 to determine whether or not the correct processing nozzle 31 is attached to the processing head 20. 16 may use the “Z coordinate” in the processing nozzle information 102 to determine whether or not the correct processing nozzle 31 is attached to the processing head 20. In this case, the nozzle diameter calculation unit 15 does not need to calculate the nozzle inner diameter of the processing nozzle 31 according to the Z coordinate of the processing nozzle 31. The nozzle determination unit 16 determines that the machining nozzle 31 that has inspected the nozzle inner diameter is based on the Z coordinate of the machining nozzle 31 detected by the Z coordinate detection unit 13 and the “Z coordinate” in the machining nozzle information 102. It is determined whether or not the processing nozzle 31 is the correct processing nozzle 31 to be mounted.

  When the nozzle determination unit 16 uses the “nozzle diameter” in the processing nozzle information 102 to inspect the processing nozzle 31 (inspection of whether or not the correct processing nozzle 31 is mounted), the processing nozzle information 102 includes “Z Information on “coordinates” is not necessary. When the nozzle determination unit 16 uses the “Z coordinate” in the processing nozzle information 102 to inspect the processing nozzle 31, the information on “nozzle diameter” is not necessary in the processing nozzle information 102.

  The nozzle inspection apparatus 1 is not limited to inspecting whether or not the correct processing nozzle 31 is mounted on the processing head 20, but also inspecting whether or not spatter or the like is attached to the processing nozzle 31 (fouling inspection). Good. Also in this case, the nozzle inspection apparatus 1 calculates the nozzle inner diameter of the processing nozzle 31 and inspects the processing nozzle 31 based on the calculated nozzle inner diameter.

  FIG. 9 is a flowchart illustrating a processing procedure of the laser processing apparatus when inspecting the processing nozzle for contamination. FIG. 9 shows a processing procedure in the case where the laser processing apparatus 100 inspects the processing nozzle 31 for contamination during the processing A3 as the laser processing.

  The laser processing apparatus 100 mounts the processing nozzle 31 corresponding to the processing process A3 on the processing head 20 and starts the processing process A3 (step S310). The laser processing apparatus 100 monitors whether the processing nozzle 31 has contacted the workpiece 25 during the processing A3 (step S320).

  When the processing nozzle 31 comes into contact with the workpiece 25 during the processing A3 (step S320, Yes), the laser processing apparatus 100 moves the processing head 20 equipped with the processing nozzle 31 outside the processing area (outside the processing table 22). ), And the machining head 20 is moved to a location for cleaning the machining nozzle 31. Then, the laser processing apparatus 100 cleans the processing nozzle 31 (step S330).

  Thereafter, the processing head 20 equipped with the cleaned processing nozzle 31 moves onto the gauge 32 of the capacitance measuring unit 14. Then, the change in capacitance between the processing nozzle 31 and the gauge 32 is measured while bringing the processing nozzle 31 close to the gauge 32. The nozzle inspection apparatus 1 measures the inner diameter of the laser emission port of the processing nozzle 31 based on the measured capacitance. The nozzle inspection apparatus 1 determines (confirms) whether the processing nozzle 31 attached to the processing head 20 is clean or sputter deposits remain based on the calculated nozzle inner diameter of the processing nozzle 31 (step). S340). The inspection processing of the processing nozzle 31 by the nozzle inspection apparatus 1 is performed according to the processing procedure shown in FIG.

  When the nozzle determination unit 16 determines that the nozzle inner diameter calculated by the nozzle diameter calculation unit 15 is not the nozzle inner diameter corresponding to the processing nozzle 31 attached to the processing head 20 (the calculated nozzle inner diameter is within the processing nozzle information 102). In the case where it is smaller than the “nozzle diameter”, it is determined that the sputter adheres to the processing nozzle 31. If the nozzle determination unit 16 determines that the sputter has adhered to the processing nozzle 31 (step S350, Yes), the processing nozzle 31 is cleaned again (step S330). Thereafter, the laser processing apparatus 100 repeats the processes of steps S330 to S350 until the nozzle determination unit 16 determines that the processing nozzle 31 is clean.

  When the nozzle determining unit 16 determines that the nozzle inner diameter calculated by the nozzle diameter calculating unit 15 is the nozzle inner diameter corresponding to the processing nozzle 31 attached to the processing head 20, the nozzle determining unit 16 determines that the processing nozzle 31 is clean. To do. When the nozzle determination unit 16 determines that the processing nozzle 31 is clean (No at Step S350), the laser processing apparatus 100 resumes the processing A3 (Step S360).

  Hereinafter, the laser processing apparatus 100 repeats the processing of steps S320 to S360 when the processing nozzle 31 and the workpiece 25 come into contact with each other. That is, when the processing nozzle 31 and the workpiece 25 come into contact with each other, the processing nozzle 31 is cleaned, and when the spatter adhesion can be removed from the processing nozzle 31, the processing A3 is resumed.

  If the processing nozzle 31 is not in contact with the workpiece 25 during the processing A3 (step S320, No), the laser processing apparatus 100 monitors whether the processing A3 is completed (step S370). When the processing A3 is not finished (No at Step S370), the laser processing apparatus 100 continuously executes the processing A3 and monitors whether or not the processing nozzle 31 has contacted the workpiece 25 (Step S320). ). When finishing the processing A3 (step S370, Yes), the inspection processing of the processing nozzle 31 in the processing A3 by the nozzle inspection apparatus 1 is also ended.

  Although the case where the laser processing apparatus 100 includes one gauge 32 has been described in the present embodiment, the laser processing apparatus 100 may include a plurality of gauges 32. In this case, the type of the gauge 32 for inspecting the processing nozzle 31 is selected based on the type of the processing nozzle 31 attached to the processing head 20. For example, a gauge 32 for measuring the processing nozzle 31 with a thin nozzle inner diameter, a gauge 32 for measuring the processing nozzle 31 with a large nozzle inner diameter, and the like are provided in the laser processing apparatus 100. When the laser processing apparatus 100 includes a plurality of gauges 32, the nozzle diameter calculation unit 15 stores nozzle diameter information 101 for each gauge 32, and the nozzle information storage unit 17 stores the processing nozzle information 102 for each gauge 32. The “Z coordinate” is stored.

  Further, when the machining head 20 is lowered toward the gauge 32 while the machining nozzle 31 is mounted, the lowering speed of the machining head 20 may be slowed when the electrostatic capacity is close to the threshold value t1. This makes it possible to accurately measure the capacitance near the threshold t1.

  Further, when the machining head 20 is lowered toward the gauge 32 with the machining nozzle 31 mounted, the descent speed of the machining head 20 may be controlled based on the shape (taper angle, size, etc.) of the gauge 32. For example, when the taper shape (curve) of the gauge 32 is such that the rate of increase in thickness of the gauge 32 is smaller toward the lower part of the gauge 32 (the bus bar of the gauge 32 is more outward than when the bus bar of the gauge 32 is a straight line). When the gauge 32 is raised (when the side surface of the gauge 32 has a curved surface of a convex lens), the lowering speed of the machining head 20 at the lower part is made lower than the lowering speed of the machining head 20 at the upper part of the gauge 32.

  On the other hand, the taper shape of the gauge 32 is such that the rate of increase in the thickness of the gauge 32 is larger toward the lower part of the gauge 32 (the bus bar of the gauge 32 sinks inward than when the bus bar of the gauge 32 is a straight line). (When the side surface of the gauge 32 has a curved surface of a concave lens), the lowering speed of the processing head 20 at the upper part is made lower than the lowering speed of the processing head 20 at the lower part of the gauge 32. As a result, the machining nozzle 31 descends toward the gauge 32 while the gap between the laser irradiation port (inner wall) of the machining nozzle 31 and the gauge 32 (outer wall) decreases at a substantially constant speed. Therefore, it is possible to accurately measure the capacitance between the processing nozzle 31 and the gauge 32 regardless of the position (height) of the processing nozzle 31 with respect to the gauge 32.

  In the present embodiment, the processing nozzle 31 attached to the processing head 20 is replaced by the nozzle changer 50. However, the processing nozzle 31 attached to the processing head 20 may be replaced manually.

  In the present embodiment, the case where the processing nozzle 31 is inspected after the processing nozzle 31 is cleaned has been described. However, the processing nozzle 31 may be inspected before the processing nozzle 31 is cleaned.

  Further, in this embodiment, the case where the nozzle diameter information 101 is a correspondence relationship between the Z coordinate and the nozzle inner diameter has been described. However, the nozzle diameter information 101 includes the shape of the gauge 32 (taper angle, size, arrangement position (high It may be information on a)). In this case, the nozzle diameter calculation unit 15 calculates the nozzle inner diameter of the processing nozzle 31 based on the shape of the gauge 32 and the Z coordinate detected by the coordinate detection unit 13.

  Further, in the present embodiment, the nozzle inspection device 1 calculates the nozzle inner diameter of the processing nozzle 31, but the nozzle inspection device 1 calculates the inner diameter of a measurement object other than the processing nozzle 31 such as a bearing or a disk. Also good.

  As described above, according to the embodiment, the gauge 32 has a tapered shape, and the Z coordinate of the machining nozzle 31 detected when the capacitance between the machining nozzle 31 and the gauge 32 reaches a predetermined threshold value. Since the inner diameter of the machining nozzle 31 is calculated based on the above, it is possible to easily inspect the machining nozzle 31 accurately with a simple configuration without damaging the machining nozzle 31.

  Further, the Z coordinate of the machining nozzle 31 when the capacitance between the machining nozzle 31 and the gauge 32 becomes a threshold value is stored in advance, and based on this Z coordinate and the detected Z coordinate of the machining nozzle 31. Since the processing nozzle 31 is inspected, the processing nozzle 31 can be inspected quickly and easily.

  Further, since the nozzle inner diameter corresponding to the Z coordinate of the processing nozzle 31 is stored in advance and the inner diameter of the processing nozzle 31 is calculated based on this nozzle inner diameter, the inner diameter of the processing nozzle 31 can be calculated quickly and easily. It becomes possible.

  Moreover, since the information regarding the nozzle inner diameter calculated by the nozzle diameter calculator 15 is output from the determination result output unit 18, it is possible to easily notify the user of the nozzle inspection apparatus 1 of the nozzle inner diameter of the processing nozzle 31.

  Further, since the machining nozzle 31 is inspected when the machining nozzle 31 attached to the machining head 20 is replaced, it is possible to prevent the workpiece 25 from being machined while the wrong machining nozzle 31 is mounted. In addition, since the processing nozzle 31 is inspected after the processing nozzle 31 is washed, the contaminated processing nozzle 31 can be quickly found.

  As described above, the nozzle inspection apparatus and the nozzle inspection method according to the present invention are suitable for the inspection of the processing nozzle of the laser processing apparatus.

It is a perspective view which shows schematic structure of the laser processing apparatus which has the nozzle test | inspection apparatus which concerns on embodiment. It is a block diagram which shows the structure of a nozzle test | inspection apparatus. It is a figure which shows the structure of a gauge, and the structure of a process nozzle. It is a flowchart which shows the process sequence of the laser processing apparatus which concerns on embodiment. It is a flowchart which shows the process sequence of the inspection process of a process nozzle. It is a figure which shows the relationship between an electrostatic capacitance and the Z coordinate of a process nozzle. It is a figure which shows nozzle diameter information. It is a figure which shows an example of a structure of process nozzle information. It is a flowchart which shows the process sequence of the laser processing apparatus at the time of test | inspecting the stain | pollution | contamination of a process nozzle.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Nozzle inspection apparatus 2 Processing mechanism 11 Input part 12 Processing head control part 13 Coordinate detection part 14 Capacitance measurement part 15 Nozzle diameter calculation part 16 Nozzle determination part 17 Nozzle information storage part 18 Determination result output part 19 Control part 20 Processing head DESCRIPTION OF SYMBOLS 22 Processing table 23 Processing stand 25 Workpiece 30 Capacitance measurement unit 31 Processing nozzle 32 Gauge 35 Base 40 Nozzle inspection mechanism 50 Nozzle changer 100 Laser processing apparatus 101 Nozzle diameter information 102 Processing nozzle information

Claims (7)

In a nozzle inspection apparatus that inspects the processing nozzle of a laser processing machine that performs laser processing of a workpiece by irradiating a laser beam from a processing nozzle according to the type of processing processing,
The upper end portion has a taper-shaped measuring element that is thinner than the lower end portion, and a capacitance measuring unit that measures the capacitance between the processing nozzle and the measuring element,
A position control unit for controlling the height of the machining nozzle relative to the measuring element in a direction perpendicular to the main surface of the workpiece so that the measuring element is inserted into the laser emission port of the machining nozzle from the upper end side; ,
A position detection unit that detects, as position information, a position in the height direction of the processing nozzle when the measuring element is inserted into the laser emission port and the capacitance indicates a predetermined value set in advance;
A nozzle determination unit that determines whether or not the processing nozzle has a nozzle inner diameter corresponding to a processing nozzle to be mounted, based on position information detected by the position detection unit;
A determination result output unit that outputs a determination result of the nozzle determination unit;
A nozzle inspection apparatus comprising: A position information storage unit that stores in advance position information for each processing nozzle;
The nozzle determination unit compares the position information stored in the position information storage unit with the position information detected by the position detection unit, so that the nozzle inner diameter corresponding to the processing nozzle to be mounted is the processing nozzle. 2. The nozzle inspection device according to claim 1, wherein it is determined whether or not the nozzle inspection device is provided. The nozzle inner diameter information related to the nozzle inner diameter corresponding to the position information is stored, the nozzle inner diameter information is further calculated using the nozzle inner diameter information and the nozzle inner diameter information corresponding to the position information is calculated. The position information to be stored includes information on the nozzle inner diameter for each processing nozzle,
The nozzle determination unit compares the nozzle inner diameter of the position information stored in the position information storage unit with the nozzle inner diameter calculated by the nozzle diameter calculation unit, so that the processing nozzle corresponds to the mounting target processing nozzle. It is determined whether it has a nozzle internal diameter, The nozzle test | inspection apparatus of Claim 1 or 2 characterized by the above-mentioned.   The nozzle inspection apparatus according to claim 3, wherein the determination result output unit outputs information on the nozzle inner diameter calculated by the nozzle diameter calculation unit.   The nozzle determination unit determines whether or not the processing nozzle has a nozzle inner diameter corresponding to a processing nozzle to be mounted when the processing nozzle attached to the processing head is replaced. The nozzle test | inspection apparatus as described in any one of 1-4.   The said nozzle determination part determines whether the said process nozzle has the nozzle internal diameter corresponding to the process nozzle of mounting | wearing after washing | cleaning the said process nozzle. The nozzle inspection apparatus as described in any one. In a nozzle inspection method for inspecting the processing nozzle of a laser processing machine that performs laser processing of a workpiece by irradiating a laser beam from a processing nozzle according to the type of processing,
The measuring element of the machining nozzle in a direction perpendicular to the main surface of the workpiece so that a tapered measuring element whose upper end is thinner than the lower end is inserted into the laser emission port of the processing nozzle from the upper end side. A position control step for controlling the height relative to
A capacitance measuring step for measuring a capacitance between the processing nozzle and the probe;
A position detecting step for detecting, as position information, a position in the height direction of the processing nozzle when the measuring element is inserted into the laser emission port and the capacitance shows a predetermined value set in advance;
A nozzle determination step for determining whether the processing nozzle has a nozzle inner diameter corresponding to the processing nozzle to be mounted based on the detected position information;
A determination result output step of outputting a determination result of whether or not the processing nozzle has a nozzle inner diameter corresponding to the processing nozzle to be mounted;
A nozzle inspection method comprising:

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