JP2008307601A - Soldering method and soldering device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering method and a soldering device capable of performing the soldering while correctly detecting a solder melted by a solder melting means such as a soldering iron. <P>SOLUTION: In the soldering method and the soldering device for performing the soldering by arranging a solder melting means such as a soldering iron in a soldering area for performing the soldering and feeding a solder to the soldering melting means, the image of the solder melted by the soldering melting means is successively picked up by a camera at a predetermined timing, and the image data by the light of the wavelength longer than that of the red color reflected from the solder is generated. The differential image data are successively generated by taking the difference between at least two image data with the different timing of image pickup, and the synthesized image data are generated by successively superposing the differential image data and synthesizing the superposed differential image data. Further, the area of the solder in the soldering area of the synthesized image data is detected, and the feed amount of the solder to be fed to the solder melting means is detected based on the area of the solder. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a soldering method and a soldering apparatus, and in particular, by automatically supplying solder to a solder melting means such as a soldering iron that melts the solder, soldering can be automatically performed. The present invention relates to a soldering method and a soldering apparatus.

  In recent years, when electronic components are mounted on a mounting board, a paste-like solder is applied in advance to a predetermined position of the mounting board, and the required electronic component is mounted on the mounting board in a predetermined position via the paste-like solder. The solder is melted by performing a reflow process in which the mounting substrate is heated to a temperature higher than the melting temperature of the solder, and the electronic component is soldered to the mounting substrate.

  However, when joining a member that is always in a state of stress, such as an electrode body in contact with the electrode of the battery, to a mounting board, or when joining a so-called power electronics component used at high power to a mounting board In order to utilize the stress relaxation property of the solder, it is necessary to join using a relatively large amount of solder, not by reflow processing, but by melting the solder while feeding the thread solder processed into a thread shape, etc. It was necessary to solder while forming a raised shape.

  As described above, since a relatively high skill is required to make the solder into a raised shape, until recently, it was often done manually by a worker using a soldering iron. Since the supply of solder can be performed smoothly due to the improvement of soldering, automatic soldering equipment has become possible, and manual soldering replaces soldering by automatic soldering equipment. As a result, productivity is improved.

  In addition, when soldering with an automatic soldering device, it is necessary to monitor whether the soldering is performed accurately, and the soldering state is measured in real time by measuring the temperature distribution of the soldering area with an infrared sensor. Has been proposed (see, for example, Patent Document 1).

  As described above, when the soldering state is monitored in real time with the infrared sensor, the solder detection accuracy can be improved as compared with the case where the soldering state is monitored with the CCD camera, but it is relatively expensive. Therefore, it has been desired to use a CCD camera that can be introduced at a lower cost.

  When the soldering state is monitored by the CCD camera, at least first image data and second image data are generated by photographing the soldering state with a predetermined time difference, and the first image data and By taking the difference between the second image data and generating difference image data, the amount of solder melted by the soldering iron between the generation timing of the first image data and the generation timing of the second image data Can be detected, and the soldering state can be monitored based on the detected amount of solder.

In the generation of the difference image data, image data generated by photographing at a timing immediately after the start of melting of the solder by the soldering iron or at a timing immediately before the start is added to at least one of the first image data and the second image data. It is common to generate difference image data by using a difference from the basic image data by using the image data generated by photographing at sequential timing as the other image data. Difference data may be generated by taking a difference from three or more image data.
JP 07-270239 A

  However, since the solder melted by a solder melting means such as a soldering iron generally has a spherical shape due to its extremely high surface tension, when the melted solder is photographed with a CCD camera, The surface of the melted solder that becomes the front surface is a surface that can be regarded as an approximately flat surface, and even if the solder is further melted, the surface change is extremely small.

  Therefore, the portion of the surface that can be regarded as an approximately flat surface is not changed over time in the same manner as the substrate portion other than the soldering region, and therefore can be extracted in the differential processing for generating the differential image data. There is a problem in that the solder specified by the difference image data may not represent all the solder melted by the solder melting means.

  That is, the CCD camera has a problem that the soldering state cannot be monitored because the solder melted by the solder melting means cannot be accurately detected.

  In addition, since smoke generated during soldering is reflected in an image taken by a CCD camera, the soldering state cannot be monitored by smoke. In particular, when soldering using a so-called lead-free solder in recent years, a larger amount of smoke is generated, so that it has been difficult to accurately photograph the solder in the soldered portion with a CCD camera.

  In view of such a current situation, the present inventor conducted research and development to perform soldering while reliably monitoring the soldering state even when soldering using lead-free solder, and completed the present invention. Is.

  In the soldering method of the present invention, in the soldering method in which the solder melting means for melting the solder is disposed in the soldering area where soldering is performed and the solder is supplied to the solder melting means, the solder melting means is melted by the solder melting means. A step of sequentially photographing the solder with a camera at a predetermined timing to generate image data with light having a wavelength longer than that of red reflected from the solder; and at least two pieces of image data having different photographing timings among the image data A step of sequentially generating difference image data by taking the difference, a step of generating the composite image data by sequentially superposing the difference image data on each other, and a step of detecting the solder area in the soldering region of the composite image data And a step of detecting the supply amount of the solder supplied to the solder melting means based on the area of the solder.

  In the soldering apparatus of the present invention, a solder feeder for supplying solder to the solder melting means in the soldering apparatus for soldering a component to a predetermined position of the substrate by melting the solder with a solder melting means for melting the solder A camera that sequentially generates image data based on light having a wavelength longer than that of the red light reflected from the solder melted by the solder melting means, and at least two image data having different generation timings among the image data The difference image data is sequentially generated by taking the difference between the generated difference image data, and the generated difference image data is sequentially overlapped and synthesized to generate composite image data, and the solder melted by the solder melting means from the composite image data It was decided to provide a control unit for detecting the area.

Furthermore, the soldering apparatus of the present invention is also characterized by the following points. That is,
(1) The camera is equipped with a filter that transmits only light having a longer wavelength than red.
(2) The substrate and the camera are covered with a light shielding cover made of a sheet that transmits only light having a wavelength longer than red.
(3) A light source for projecting light having a wavelength longer than red toward the solder melted by the solder melting means is provided.
(4) The light source is placed close to the camera.

  In the present invention, image data is generated by sequentially photographing the solder melted by the solder melting means for melting the solder in the soldering area at a predetermined timing with a camera, and a difference between at least two image data having different photographing timings is obtained. Differential image data is sequentially generated, and the generated differential image data is sequentially superimposed and combined to generate composite image data. By detecting solder from the composite image data, the difference image data is generated. The non-detection of the generated solder can be supplemented with other difference image data, and the area of the solder can be reliably detected from the composite image data.

  In addition, the camera generates image data with light having a wavelength longer than that of the red color reflected from the solder melted by the solder melting means, so that smoke generated during soldering can be reflected in the image taken by the camera. The image data obtained by accurately photographing the solder melted by the solder melting means can be generated.

  In the soldering method and the soldering apparatus of the present invention, the soldering of the portion soldered using an imaging device such as a relatively inexpensive CCD camera is monitored instead of an expensive infrared sensor, and the soldering is completed. Alternatively, the occurrence of a soldering abnormality can be detected. Hereinafter, an imaging apparatus using a semiconductor imaging device such as a CCD camera or a CMOS camera is simply referred to as a “camera”.

  In particular, the camera can detect light in the infrared region, and generates image data with light having a longer wavelength than red reflected from solder melted by a soldering iron.

  By using light having a wavelength longer than that of red as described above, the influence of smoke generated during soldering can be reduced and the soldering state can be monitored.

  That is, the smoke generated during soldering is composed of particles having a size of 300 nm or more, as estimated from the performance of the dust collecting filter interposed in the duct provided to eliminate the smoke. These particles cause visible light scattering called so-called Mie scattering in the space, and appear as whitish smoke accompanying the scattering.

  Therefore, when the camera shoots in the visible light range, smoke generated during soldering is also shot. If smoke is present between the solder melted by the solder melting means and the camera, However, it was not possible to shoot clearly because it was hidden in the smoke.

  However, when shooting with light having a wavelength longer than that of red, which is longer than visible light, smoke generated during soldering to light in this wavelength range causes so-called Rayleigh scattering. Since the intensity of the scattering is proportional to one fourth power of the wavelength, the scattering is easily suppressed, and it is possible to monitor the soldering state by suppressing the reflection of smoke during photographing with the camera.

  In this way, by generating image data with light having a wavelength longer than that of red, the influence of smoke generated during soldering can be reduced and the solder melted by the solder melting means can be clearly photographed. By being able to reliably monitor the state of the solder in the soldering area, it is possible to determine whether soldering has been completed and to detect an abnormality.

  As light having a longer wavelength than red, in the case of smoke generated as the solder melts, it is experimental for the first time that the intensity of Rayleigh scattering due to smoke becomes smaller than the reflected light from the solder from around 670 nm. Since it was confirmed, it is desirable to use light having a wavelength longer than 670 nm.

  Furthermore, when a conventional camera with a built-in CCD image sensor is used to perform image processing up to a wavelength of several μm, image data can be generated even at wavelengths up to the sensitivity region of the CCD image sensor, which is a silicon sensor. Since it was found experimentally for the first time that it was sufficiently possible, it was confirmed that at least 1100 nm, which is the wavelength of the sensitivity range of a silicon imaging device having a band gap of 1.17 eV, can be used.

  Therefore, it is desirable to use infrared light of at least 670 nm to 1100 nm as light having a longer wavelength than red.

  On the other hand, in soldering, the melted solder tends to spheroidize due to the surface tension acting on the solder melted by the solder melting means, so that it can be obtained by photographing the solder melted by the solder melting means with a camera. The amount of solder can be estimated from the two-dimensional image of the solder, and it is only necessary to monitor the solder melted by the solder melting means with a camera.

  However, in order to detect the amount of solder melted by the solder melting means from the image photographed by the camera, the first image data is generated by photographing the state before starting the supply of solder to the solder melting means, The supply of solder to the solder melting means is started and a state in which a predetermined amount of solder is melted is photographed with a camera to generate second image data, and the difference between the first image data and the second image data is taken. When the difference image data is generated and the amount of solder is detected from the difference image data, an error due to the influence of the soldering iron or the soldered lead as the solder melting means in the first image data occurs. When it is desired to accurately detect the amount of solder melted by the solder melting means, it is not preferable to use image data consisting of an image in a state before starting the supply of solder to the solder melting means as the first image data.

  In such a case, normally, at least two image data obtained by continuously capturing images at a time interval as short as possible are used in order to suppress extraction of changes other than the change of the observation target. In the case of solder, as described above, a region with a small amount of change is generated in the difference processing with respect to the region where the solder is present, so that a region where solder cannot be extracted correctly is generated.

  In other words, in the case of solder, the surface of the melted solder that is in front of the camera is a surface that can be regarded as a flat surface, and even if the solder is further melted, the surface change is extremely small. In the binarization, the threshold cannot be exceeded, and as shown in FIGS. 1C and 1D, an undetected region L in which no solder can be detected is generated at the center.

  Therefore, according to the present invention, when performing soldering, image data is sequentially generated by a camera, and among the generated image data, a difference between at least two image data having different shooting timings is obtained. As shown in 1 (a) to (d), differential image data Pa, Pb, Pc, and Pd are sequentially generated, and these differential image data Pa, Pb, Pc, and Pd are sequentially superimposed and synthesized. As shown in 1 (e), the composite image data Pe is generated.

  Thus, by generating the composite image data Pe by combining the difference image data Pa, Pb, Pc, and Pd, the undetected region L can be eliminated with other difference image data, and the composite image data Pe is used. Thus, the amount of solder melted by the solder melting means can be accurately detected.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 2 is a schematic diagram of the soldering apparatus according to the first embodiment. In the following, the solder melting means will be described as a general soldering iron, but recently, solder melting means using a laser light source is also known. Instead of the soldering iron, a solder melting device equipped with a laser light source is used. Any solder melting means that can sequentially melt the supplied solder may be used.

  In the soldering apparatus A1, the base 10 provided with the mounting portion 11 on which the mounting substrate 20 on which the required electronic component 21 is temporarily mounted is mounted and the soldering area to be soldered of the mounting substrate 20 are photographed. As a camera 13, a light 14 for illuminating the soldering area, a soldering iron 15 as a solder melting means arranged in the soldering area, and a solder supply means for supplying the thread solder 16 toward the soldering iron 15 A solder supplier 17 and a control unit 18 for controlling the solder supplier 17 and analyzing the output signal of the camera 13 are provided.

  Although not shown, the soldering apparatus A1 is provided with a transfer device that transfers the mounting substrate 20 to the mounting portion 11 and transfers the mounting substrate 20 that has undergone the soldering process to a subsequent process. Specifically, the transfer device is provided with a rectangular lift body (not shown) that moves in the transfer direction and can be moved up and down, and the lift body has a tip that contacts the mounting substrate 20 from below. A plurality of support pillars (not shown) to be contacted are provided, and when the mounting board 20 is transferred to the mounting portion 11, the support pillar is brought into contact with the mounting board 20 and lifted by raising the elevating body. In this state, the elevating body is moved in the horizontal direction to transfer the mounting substrate 20 to the mounting unit 11, and the elevating body is lowered to place the mounting substrate 20 on the mounting unit 11. With the same transfer device, the mounting substrate 20 of the placement unit 11 can be transferred to a subsequent process.

  In this embodiment, the mounting portion 11 is composed of a plurality of pillars 11a projectingly contacting the upper surface of the base 10, and the mounting bodies 20 can be supported in a horizontal state by arranging the pillars 11a at predetermined intervals. It is said.

  As the camera 13, a CCD camera capable of photographing in the infrared region is used. As this CCD camera, for example, one that is generally used as a surveillance camera can be used. When a commercially available CCD camera is used, an infrared cut filter may be built in depending on the case, and it is desirable to remove the infrared cut filter.

  Further, the camera 13 is equipped with a filter F that transmits only light having a longer wavelength than red. In particular, it is preferable to use a filter F that has the highest transmittance in the infrared light region of 800 to 900 nm. This filter F prevents light in the visible light range from entering the image sensor of the camera 13 and suppresses the reflection of smoke generated during soldering.

  The light 14 is provided in order to increase the amount of reflected light composed of light having a longer wavelength than the red color from the solder melted by the soldering iron 15, and emits light having a longer wavelength than the red color. It is desirable to irradiate light having a wavelength longer than 600 nm, and preferably irradiate light having a wavelength of about 800 to 900 nm. Even if the light 14 is not irradiated, the light 14 may not be provided if a sufficient amount of light having a longer wavelength than the red color from the solder melted by the soldering iron 15 is reflected.

  In some cases, it is not always necessary to use a light of a special light source. For example, a continuous lamp such as a tungsten lamp, a halogen lamp, or sunlight may be used to simply increase the amount of infrared component. In particular, in the case of a tungsten lamp, a halogen lamp, etc., irradiation may be performed in a state where the proportion of the infrared component is increased by using it at a rated current or lower.

  Further, when the solder melting means is a solder melting means using a laser light source, halation occurs in the melted solder portion due to the laser light spot from the laser light source, and it is difficult to generate appropriate image data with the camera 13. For example, when using a 670 nm red laser with a GaInP semiconductor laser as the heating laser light, the light 14 is irradiated with 780 nm light using a GaAlAs semiconductor laser, It is desirable to irradiate light of 800 to 900 nm using a GaAs semiconductor laser. Further, when a laser beam having a wavelength of 780 nm or 800 nm is used as the laser beam for heating, it is desirable to use a light source that can emit light having a longer wavelength as the light 14.

  The camera 13 and the light 14 are not arranged at a position immediately above the placement unit 11, but are arranged apart from the position directly above the placement unit 11, and smoke generated by soldering is generated by the camera 13 and the light 14 It is desirable that the camera 13 does not hit the camera, and the camera 13 needs to take an image of the solder melted by the soldering iron 15. Therefore, the camera 13 is disposed obliquely above the mounting portion 11.

  Further, in the present embodiment, the light 14 is mounted on the camera 13 and arranged as close to the camera 13 as possible. Therefore, the light 14 can be easily arranged, and the camera 13 can easily obtain strong reflected light from the solder, so that the camera 13 can surely shoot the solder.

  The soldering iron 15 is mounted on a lifting device (not shown) so that the soldering iron 15 can be raised and lowered. The soldering iron 15 is lowered after the mounting substrate 20 is placed on the placement portion 11 so that the supplied solder wire can be melted. When soldering at a plurality of locations on one mounting board 20 is necessary, moving means in the XY directions may be provided in the lifting device so that the position of the soldering iron 15 can be moved as appropriate. You may move 20 suitably with an XY table.

  The solder feeder 17 can feed out the thread solder 16 processed into a thread shape by a predetermined amount at a predetermined timing. The thread solder 16 fed out from the solder feeder 17 is guided by a guide (not shown) and supplied to the soldering iron 15 at the joint.

  The control unit 18 can execute an appropriate program. In this embodiment, the control unit 18 is configured by a personal computer, analyzes the output signal of the camera 13, and detects the end timing of the feeding of the thread solder 16 from the solder supplier 17. Accordingly, a control signal for stopping the operation of the solder supplier 17 is output in accordance with the detection of the end timing.

  In the following, based on the flowchart of FIG. 3, the solder joining process by the soldering apparatus A1 will be described.

  First, in the soldering apparatus A1, the mounting board 20 is transferred and placed on the mounting portion 11 (step S1), and light having a wavelength longer than red is applied to the soldering area of the mounting board 20 by the light 14 as the light source. Irradiate (step S2).

  Next, in the soldering apparatus A1, supply of the thread solder 16 is started by the solder supplier 17 (step S3), and photographing of the soldering area with the camera 13 is started (step S4). At this time, smoke is generated due to soldering, but it is suppressed that smoke is reflected in the image taken with the camera 13 by shooting using light having a wavelength longer than red, A clear image can be obtained.

  The camera 13 sequentially and sequentially photographs the soldering area at a predetermined timing and inputs an output signal to the control unit 18 of the soldering apparatus A1, and the control unit 18 obtains image data from the input output signal of the camera 13. It is generated sequentially. Further, the control unit 18 obtains the difference image data by taking a difference from the first image data generated from the output signal of the camera 13 and the second image data whose shooting timing is later than the first image data. (Step S5).

  Since the first image data and the second image data are different in photographing timing, only the shape of the solder in the soldering area is different, and the difference in the shape of the solder is extracted from the difference image data. . In the difference image data of the present embodiment, the area where the difference value between the first image data and the second image data is smaller than a predetermined threshold is “0”, and the area greater than or equal to the threshold is “1”.

  Next, the control unit 18 reads the stored image data stored from the image data memory provided for temporarily storing the image data (step S6). The stored image data is composite image data generated by superimposing difference image data as will be described later. The image data memory stores image data that is “0” in all areas as a default.

  The control unit 18 performs difference OR processing between the difference image data generated from the first image data and the second image data and the saved image data (synthesized image data) read from the image data memory. Are combined to generate new composite image data (step S7).

  After generating the composite image data, the control unit 18 detects the area of the solder melted by the soldering iron 15 in the soldering area from the composite image data (step S8). Specifically, “1” areas in the synthesized difference image are counted.

  The control unit 18 compares the detected solder area with a preset threshold value of the end condition (step S9). If the detected solder area is smaller than the threshold value of the end condition, the control unit 18 performs step S7. The generated composite image data is stored in the image data memory (step S10), and the process returns to step S5, and the second image data and the third image capturing timing later than the second image data. Differences are taken from the image data to generate new difference image data.

  Then, the control unit 18 synthesizes the difference image data with the saved image data (synthesized image data) stored in the image data memory read out in step S6 to generate new synthesized image data (step S7). The area of the solder is detected from the composite image data (step S8).

  As described above, the control unit 18 sequentially generates the difference image data, and sequentially generates the combined image data by synthesizing the generated difference image data, whereby the solder melted by the soldering iron 15 in the soldering region. When the solder area becomes larger than the preset threshold value in step S9, a control signal for stopping the operation of the solder supplier 17 is output (step S11).

  Thereafter, in the soldering apparatus A1, the mounting substrate 20 is removed from the mounting portion 11 and transferred to the subsequent process (step S12).

  In the soldering apparatus A1 of the present embodiment, the solder 13 is photographed by the camera 13 equipped with the filter F that transmits only light having a wavelength longer than that of red. In addition to being able to monitor the state of solder by reducing the effect of smoke generated by detecting the area of the solder based on the composite image data generated by overlaying the difference image data, the solder can be detected with high accuracy Can do.

  Therefore, in the soldering apparatus A1 of the present embodiment, it is possible to perform soldering with the minimum necessary solder, and to shorten the soldering work time.

  Moreover, in the soldering apparatus A1 of the present embodiment, since it is possible to detect the soldering abnormality by being able to detect the solder with high accuracy, it is possible to eliminate the need for the inspection process of the soldered portion after the soldering. It is also possible to reduce the manufacturing cost by shortening the process.

  The detection of the soldering abnormality at the time of soldering may be a shape abnormality detected from the image photographed by the camera 13, or the feeding time of the thread solder 16 by the solder feeder 17 is measured, You may determine with the abnormality having arisen when the feeding time becomes more than predetermined time.

  FIG. 4 is a schematic diagram of a soldering apparatus A2 according to the second embodiment. In the soldering apparatus A2 of the second embodiment, the filter F is not mounted on the camera 13 as in the soldering apparatus A1 of the first embodiment, but the light shielding that covers the mounting substrate 20 mounted on the mounting portion 11 is performed. A cover 12 is provided. The configuration is the same as that of the soldering apparatus A1 of the first embodiment except that a light shielding cover 12 is provided instead of the filter F, and the same reference numerals are used for the same parts as the soldering apparatus A1 of the first embodiment. Detailed description is omitted.

  The light shielding cover 12 is composed of a sheet body that transmits only light having a longer wavelength than red, and in this embodiment, only light having a longer wavelength than red is formed on a base formed in a box shape with a transparent acrylic plate. The sheet body which permeate | transmits was stuck and formed. The sheet body preferably has the highest transmittance in the infrared light region of 800 to 900 nm.

  The light shielding cover 12 is sized to cover not only the mounting substrate 20 placed on the placement unit 11 but also the camera 13, and depending on the case, the solder feeder 17 and the control unit 18 may be covered with the light shielding cover 12.

  Thus, by covering the mounting substrate 20 and the camera 13 with the light shielding cover 12, the light that passes through the light shielding cover 12 and enters the light shielding cover 12 is melted by the soldering iron 15 as light having a longer wavelength than red. Since the reflected light from the solder that has been used can be made to have a wavelength longer than that of red, it is possible to suppress the reflection of smoke generated by soldering when shooting the solder by the camera 13, and to securely solder the solder. You can shoot.

  In the present embodiment, a light 14 that irradiates light having a wavelength longer than red is provided in the light shielding cover 12, and when the amount of light that passes through the light shielding cover 12 and enters the light shielding cover 12 is not sufficient, The light emitted from the light 14 is used to ensure that the camera 13 can photograph the solder. The light 14 is preferably irradiated with light having a wavelength longer than 600 nm, and is preferably irradiated with light having a wavelength of about 800 to 900 nm.

  In the present embodiment, the light shielding cover 12 can be moved up and down by a lifting device (not shown), and when the mounting substrate 20 is transferred to the placement unit 11, the light shielding cover 12 is retracted upward to transfer the mounting substrate 20, At the time of soldering, the light shielding cover 12 is lowered to cover the mounting substrate 20.

  Note that the present invention is not limited to the case where the elevating device is provided in the light shielding cover 12, and a feed opening (not shown) for introducing the mounting substrate 20 into the light shielding cover 12 is provided in a part of the wall surface of the light shielding cover 12. At the same time, a delivery opening (not shown) for delivering the mounting board 20 after soldering to the outside of the light shielding cover 12 may be provided so that the mounting board 20 can be taken in and out of the light shielding cover 12.

  Further, it is desirable that an exhaust device such as an exhaust fan (not shown) is attached to the light shielding cover 12 to prevent smoke generated by soldering from filling the light shielding cover 12.

  By covering the soldering area with the light-shielding cover 12 in this way, the influence of visible light can be eliminated, so the influence of smoke generated by soldering can be easily eliminated, while the worker can visually recognize the soldering area. If possible, it is desirable to use the filter F as in the first embodiment.

  Alternatively, the filter F and the light shielding cover 12 are used in combination, and the light shielding cover 12 suppresses extraneous light from entering the soldering area while ensuring a certain degree of visibility, and the filter F has a longer wavelength band than red. The light shielding effect by the filter F may be improved by making the light incident on the image sensor of the camera 13.

It is explanatory drawing of the detection method of the area of solder. It is a schematic explanatory drawing of the soldering apparatus of 1st Embodiment. It is a flowchart of the soldering process by the soldering apparatus of 1st Embodiment. It is a schematic explanatory drawing of the soldering apparatus of 2nd Embodiment.

Explanation of symbols

A1 Soldering equipment
A2 Soldering equipment F Filter
10 base
11 Place
12 Shading box
13 Infrared camera
14 lights
15 Soldering iron
16 Thread solder
17 Solder feeder
18 Control unit
20 Mounting board
21 Electronic components

In the soldering method of the present invention, in the soldering method in which the solder melting means for melting the solder is disposed in the soldering area where soldering is performed and the solder is supplied to the solder melting means, the solder melting means is melted by the solder melting means. Solder is photographed sequentially at a predetermined timing in the visible light range with a camera equipped with a filter that has the highest transmittance in the infrared light region, which has a longer wavelength than red , and occurs when the solder is melted by the solder melting means. Sequentially generating image data that suppresses the reflection of smoke, a step of sequentially generating difference image data by taking a difference between at least two image data having different shooting timings among the image data, and difference image data Are sequentially superimposed on each other and combined to generate composite image data, and the solder area in the soldering area of the composite image data is detected. A step, was to have a step of detecting a solder supply amount supplied to the solder melting means based on the solder area.
Further, in the soldering method of the present invention, in the soldering method in which a laser beam for melting solder is irradiated to a soldering area where soldering is performed and the solder is supplied to the light spot of the laser beam, melting with the laser beam is performed. The captured solder is sequentially photographed at a predetermined timing with a camera equipped with a filter that has the highest transmittance in the infrared light region having a wavelength longer than that of red, and the light having a wavelength longer than that of red reflected from the solder is used. A step of generating image data, a step of sequentially generating difference image data by taking a difference between at least two pieces of image data having different shooting timings in the image data, and sequentially superimposing the difference image data on each other. Generating composite image data; detecting a solder area in a soldering region of the composite image data; and light based on the solder area. It was to have a step of detecting a supply amount of solder supplied to the pot.

In the soldering apparatus of the present invention, a solder feeder for supplying solder to the solder melting means in the soldering apparatus for soldering a component to a predetermined position of the substrate by melting the solder with a solder melting means for melting the solder And mounting a light source for projecting light having a wavelength longer than red toward the solder melted by the solder melting means, and a filter having the highest transmittance in the infrared region of the light source. The difference between at least two image data with different generation timings among the image data and the camera that sequentially generates the image data that suppresses the reflection of smoke generated due to melting of the solder by the predetermined timing. The composite image data is generated by sequentially generating the image data and combining the generated difference image data by sequentially superposing each other. And a control unit for detecting the solder area is melted by Luo solder melting means, the solder is melted in the solder melting means, sequentially captured at a predetermined timing in the visible light region by the camera to generate image data that It was.

In the soldering apparatus of the present invention, in the soldering apparatus for soldering a component to a predetermined position on the substrate by melting the solder with laser light, a solder feeder for supplying solder to the light spot of the laser light; A camera that attaches a filter that has the highest transmittance in the infrared light region of a longer wavelength than that, and sequentially generates image data by light reflected from the solder melted with laser light and transmitted through the filter at a predetermined timing. The difference image data is sequentially generated by taking a difference between at least two image data having different generation timings among the image data, and the generated difference image data is sequentially superimposed on each other to be combined to be combined image data. And a control unit for detecting the area of the solder melted by the light spot from the composite image data.

According to the first to fourth aspects of the present invention, image data is generated by sequentially photographing the solder melted by the solder melting means such as laser light or a soldering iron at a predetermined timing in the visible light range by the camera, and the photographing timing. The difference image data is sequentially generated by taking the difference between at least two image data having different values, and the generated difference image data is sequentially overlapped and combined to generate combined image data, and the solder is detected from the combined image data. By doing so, the undetected solder that occurs when the difference image data is generated can be supplemented with other difference image data, and the area of the solder can be reliably detected from the composite image data.

In addition, the camera is equipped with a filter that has the highest transmittance in the infrared light region having a longer wavelength than red , and the image is reflected by light having a longer wavelength than red reflected from the solder melted by the solder melting means. by generating data can smoke generated during soldering to prevent the visible on captured image captured by a camera to generate image data that is an exact photographed molten solder in the solder melting means.

In the soldering method of the present invention, in the soldering method in which the solder melting means for melting the solder is disposed in the soldering area where soldering is performed and the solder is supplied to the solder melting means, the solder melting means is melted by the solder melting means. Using the solder melting means, the solder is sequentially photographed at a predetermined timing using a continuous spell light of sunlight with a camera equipped with a filter having the highest transmittance in the infrared light region having a wavelength longer than that of red. Sequentially generating image data that suppresses the appearance of smoke generated during soldering, and sequentially generating difference image data by taking a difference between at least two image data having different shooting timings. A step of sequentially superimposing the difference image data on each other to generate composite image data, and a soldering area of the composite image data Detecting a kick solder area was to have a step of detecting a solder supply amount supplied to the solder melting means based on the solder area.
Further, in the soldering method of the present invention, in the soldering method in which a laser beam for melting solder is irradiated to a soldering area where soldering is performed and the solder is supplied to the light spot of the laser beam, melting with the laser beam is performed. The captured solder is sequentially photographed at a predetermined timing with a camera equipped with a filter that has the highest transmittance in the infrared light region having a wavelength longer than that of red, and the light having a wavelength longer than that of red reflected from the solder is used. A step of generating image data, a step of sequentially generating difference image data by taking a difference between at least two pieces of image data having different shooting timings in the image data, and sequentially superimposing the difference image data on each other. Generating composite image data; detecting a solder area in a soldering region of the composite image data; and light based on the solder area. It was to have a step of detecting a supply amount of solder supplied to the pot.

In the soldering apparatus of the present invention, a solder feeder for supplying solder to the solder melting means in the soldering apparatus for soldering a component to a predetermined position of the substrate by melting the solder with a solder melting means for melting the solder And a solar light projecting light having a wavelength longer than red toward the solder melted by the solder melting means, and a filter having the highest transmittance in the infrared light region of the solar light. A difference between at least two image data having different generation timings among the image data and a camera that sequentially generates image data that suppresses the reflection of smoke generated as the solder melts by the melting means is obtained. Differential image data is generated sequentially, and the generated differential image data is sequentially overlapped and synthesized to generate composite image data. And a control unit for detecting the solder area which is melted in the solder melting means from the data, has been molten solder in the solder melting means, sequentially captured at the timing of by Risho constant in the camera to generate image data that It was.

In the invention of claim 1, wherein, to generate image data by a solder which is melted in the solder melting means such as a laser beam or a soldering iron sequentially captured at the timing of by Risho constant the camera, the photographing timing The difference image data is sequentially generated by taking a difference between at least two different image data, and the generated difference image data is sequentially superimposed and combined to generate combined image data, and solder is detected from the combined image data. As a result, the undetected solder that is generated when the difference image data is generated can be compensated by the other difference image data, and the area of the solder can be reliably detected from the composite image data.

Claims (6)

In a soldering method in which solder melting means for melting solder is disposed in a soldering region where soldering is performed and solder is supplied to the solder melting means,
Steps of sequentially photographing the solder melted by the solder melting means at a predetermined timing with a camera, and generating image data with light having a wavelength longer than red reflected from the solder;
A step of sequentially generating difference image data by taking a difference between at least two image data having different shooting timings among the image data;
Generating the composite image data by sequentially superimposing the difference image data on each other and combining them;
Detecting an area of solder in the soldering region of the composite image data;
Detecting the amount of solder supplied to the solder melting means based on the area of the solder;
A soldering method characterized by comprising: In a soldering apparatus for soldering a component to a predetermined position of a substrate by melting the solder with a solder melting means for melting the solder,
A solder feeder for supplying solder to the solder melting means;
A camera that sequentially generates image data with light having a wavelength longer than red reflected from the solder melted by the solder melting means at a predetermined timing;
Of the image data, the difference image data is sequentially generated by taking a difference between at least two image data having different generation timings, and the generated difference image data is sequentially overlapped with each other to be synthesized. A soldering apparatus, comprising: a control unit that generates and detects an area of the solder melted by the solder melting means from the composite image data.   The soldering apparatus according to claim 2, wherein a filter that transmits only light having a longer wavelength than red is attached to the camera.   The soldering apparatus according to claim 2, wherein the substrate and the camera are covered with a light shielding cover made of a sheet member that transmits only light having a wavelength longer than red.   5. The soldering apparatus according to claim 2, further comprising: a light source that projects light having a wavelength longer than red toward the solder melted by the solder melting unit.   The soldering apparatus according to claim 5, wherein the light source is disposed close to the camera.

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