JP2008305849A - Method of detecting splicing of carrier tape in electronic component mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of detecting the splicing of a carrier tape in an electronic component mounting apparatus which can realize a lower manufacturing cost and a simple component supply apparatus and prevent a decrease in productivity. <P>SOLUTION: There is provided the method of detecting the splicing of carrier tape in an electronic component mounting apparatus for mounting an electronic component supplied from a component supply apparatus on a printed-circuit board. The trailer of a carrier tape and the leader of another carrier tape are connected in such a manner that a splicing tape enclosing a splicing component is sandwiched. The electronic component is sucked by a suction nozzle at the component supply position of the component supply apparatus in the first step. In the subsequent step, the suction nozzle is transported and the electronic component is transported to a component recognition position. In steps S20-23, the splicing component is recognized by an image pickup apparatus for recognizing the electronic component. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a carrier tape splicing detection method in an electronic component mounting apparatus for mounting an electronic component supplied from a component supply apparatus on a printed circuit board.

  Conventionally, a carrier tape splicing detection method in an electronic component mounting apparatus described in Patent Document 1 is known. In this carrier tape splicing detection method, a notch is provided in the vicinity of the old and new joints of the carrier tape, and this notch is detected by using an optical or mechanical detection device provided for each feeder. New and old joints of carrier tape are detected.

Also, a carrier tape splicing detection method in an electronic component mounting apparatus described in Patent Document 2 is known. In this carrier tape splicing detection method, an empty cavity from which electronic components have been removed is provided at the old and new joint positions of the carrier tape. When the suction nozzle sucks an electronic component from the feeder, if a suction mistake occurs continuously for a predetermined number of times or more, the old and new joints of the carrier tape are detected by determining that the cavity is an empty cavity.
JP 2003-332789 A JP 2004-228442 A

  However, in the carrier tape splicing detection method described in Patent Document 1, an optical or mechanical detection device must be provided for each feeder, which increases manufacturing costs and complicates the component supply device. There is a drawback of inviting.

  On the other hand, in the carrier tape splicing detection method described in Patent Document 2, a detection device must be provided for each feeder in order to detect the old and new seams of the carrier tape when the suction nozzle sucks the electronic component. There is no increase in manufacturing cost and complexity of the component supply apparatus. However, in this carrier tape splicing detection method, it is necessary to distinguish between a normal electronic component suction error and a carrier tape new and old seam suction error. Cannot detect the old and new seams. Therefore, in this carrier tape splicing detection method, it takes time to detect the old and new joints of the carrier tape, and the productivity may be reduced.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above-described conventional problems, and realizes a reduction in manufacturing cost and simplification of a component supply apparatus, and a carrier in an electronic component mounting apparatus that can prevent a decrease in productivity. A method for detecting splicing of a tape is provided.

  In order to solve the above problems, the splicing detection method of the carrier tape in the electronic component mounting apparatus according to claim 1 is characterized in that the carrier in the electronic component mounting apparatus that mounts the electronic component supplied from the component supply apparatus on the printed circuit board. In the method of detecting splicing of a tape, a splicing component representing the connection of the carrier tape, wherein the end portion of the carrier tape wound on the first supply reel and the start end portion of the carrier tape wound on the second supply reel A splicing tape for sandwiching and connecting a splicing tape encapsulated, a component suction step for sucking an electronic component by a suction nozzle at a component supply position of a component supply device, and moving the suction nozzle to move the electronic component A component moving step for moving to a component recognition position; and By recognizing the image pickup device is to and a splicing component recognizing step of recognizing the splicing components.

  The splicing detection method of the carrier tape in the electronic component mounting apparatus according to claim 2 is characterized in that, in claim 1, when the splicing component is recognized in the splicing component recognition step, the splicing component is discarded.

  A feature of the splicing detection method of the carrier tape in the electronic component mounting apparatus according to claim 3 is that, in claim 1 or 2, traceability information is attached to the splicing component.

  In the method for detecting splicing of the carrier tape in the electronic component mounting apparatus according to claim 1, in the tape connecting step, the carrier tape is wound around the first supply reel and the carrier tape is wound around the second supply reel. A splicing tape that encloses a splicing component representing the connection of the carrier tape is sandwiched and connected to the starting end of the carrier tape, and the splicing component is recognized by the imaging device that recognizes the electronic component in the splicing component recognition process. Is used to detect the old and new joints of the carrier tape. That is, in this carrier tape splicing detection method, the suction nozzle sucks an electronic component from the feeder, recognizes the electronic component by the imaging device, and then mounts it on the printed circuit board. Therefore, it is not necessary to provide a detection device for each feeder, so that the manufacturing cost is not increased and the component supply device is not complicated. Also, in this carrier tape splicing detection method, the splicing parts are recognized by the imaging device in the continuous mounting process, so that the old and new seams of the carrier tape can be detected immediately, and the productivity is improved. There is no decline. Therefore, according to the splicing detection method of the carrier tape in the electronic component mounting apparatus, it is possible to realize a reduction in manufacturing cost and simplification of the component supply apparatus and to prevent a decrease in productivity.

  In the splicing detection method of the carrier tape in the electronic component mounting apparatus according to claim 2, since the splicing component is discarded when the splicing component is recognized in the splicing component recognition step, the same as when the electronic component is defective. Splicing parts can be processed. Therefore, no special processing is required, and this can also prevent a decrease in productivity.

  In the carrier tape splicing detection method in the electronic component mounting device according to claim 3, since the traceability information is attached to the splicing component, it is easy to check the consistency of the electronic component and track the production history. It can be carried out.

  DESCRIPTION OF EMBODIMENTS Embodiments embodying a carrier tape splicing detection method in an electronic component mounting apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 shows an electronic component mounting apparatus 100 employing this carrier tape splicing detection method. The electronic component mounting apparatus 100 includes a component supply device 10, a substrate transfer device 80, and a component transfer device 90.

  The component supply apparatus 10 is configured by arranging a plurality of cassette-type feeders 11 on a base frame 99. The cassette type feeder 11 includes a main body 12 that is detachably attached to the base frame 99, a supply reel 13 that is detachably attached to a rear portion of the main body 12, and a component supply position 14 that is provided at the tip of the main body 12. ing. As shown in FIG. 2, a supply reel 13 is rotatably and detachably attached to the main body 12 of the cassette type feeder 11. A carrier tape 20 that holds a predetermined number of electronic components 25 at a constant pitch is wound around the supply reel 13.

  As shown in FIG. 3, the carrier tape 20 is composed of a resin embossed tape 21 that is formed to be elongated with a predetermined width, and a cover tape 24 that is bonded to the embossed tape 21. In the longitudinal direction of the embossed tape 21, cavities 22 in which the electronic components 25 are enclosed are recessed at a predetermined pitch, and on one end side in the width direction of the embossed tape 21, feed holes 23 have the same pitch as the cavities 22. It is penetrated at intervals. In the present embodiment, an embossed carrier type is used as the carrier tape 20, but a punch carrier type in which cavities and feed holes are formed in a paper body can also be used.

  As shown in FIG. 2, the carrier tape 20 wound around the supply reel 13 is sent to the main body 12 of the cassette type feeder 11 one pitch at a time, and the electronic components 25 are transferred one by one to the component supply position 14. A device 15 is provided. The transfer device 15 includes a guide portion 16 that guides the carrier tape 20 to the component supply position 14, a sprocket 17 that is rotatably supported by the main body 12 and engages with a feed hole 23 of the carrier tape 20, and the sprocket 17 for one pitch. And a motor (not shown) that rotates each time. The main body 12 is provided with a plurality of rollers 18 for guiding the cover tape 24 to be peeled off before the component supply position 14 and discharged to a predetermined position.

  As shown in FIG. 1, the board | substrate conveyance apparatus 80 is what is called a double conveyor type which arranged the 1st conveyance apparatus 81 and the 2nd conveyance apparatus 82 in parallel, and conveys the printed circuit board 75 to the X-axis direction. The first transport device 81 (second transport device 82) has a pair of guide rails 84a and 84b (85a and 85b) arranged parallel to each other on the base 83 in parallel with each other. A pair of conveyor belts (not shown) that support and convey the printed circuit board 75 guided by 84b (85a, 85b) are arranged in parallel to face each other. Also, the substrate transport device 80 is provided with a clamp device (not shown) that pushes up and clamps the printed circuit board 75 transported to a predetermined position, and the printed circuit board 75 is positioned and fixed at the mounting position by the clamp device. In addition, an imaging device 70 and a disposal box 110 are provided between the component supply device 10 and the substrate transfer device 80. The pickup state of the electronic component 25 sucked by the suction nozzle provided in the mounting head 93 described later is recognized by the imaging device 70, and the defective product and the splicing component 35 described later are discarded in the disposal box 110.

  The component transfer device 90 is of the XY robot type, is mounted on the base frame 99, is disposed above the substrate transfer device 80 and the component supply device 10, and is moved in the Y-axis direction by the Y-axis motor 91. Y-axis slider 92 is provided. A mounting head 93 is attached to the Y-axis slider 92 to attract electronic components and mount them on the printed circuit board 75.

  In the electronic component mounting apparatus 100 configured as described above, an outline of an operation for mounting the electronic component 25 on the printed circuit board 75 will be described with reference to a flowchart of the electronic component mounting program shown in FIG. This electronic component mounting program is loaded into a control device (not shown) of the electronic component mounting apparatus 100. When the electronic component mounting program is executed, in step S 1, the mounting head 93 is moved to the component supply position 14, and the electronic component 25 is sucked by the suction nozzle of the mounting head 93. That is, when the sprocket 17 is rotated by one pitch by the motor, the carrier tape 20 is fed by one pitch by the sprocket 17 and the electronic components 25 stored in the cavity 22 are supplied to the component supply position 14 one by one. . The electronic component 25 is sucked by the suction nozzle of the mounting head 93. Here, step S1 is a “component suction step”.

  In step S2, the mounting head 93 is moved, and the electronic component 25 sucked by the suction nozzle is moved to the component recognition position. Here, step S2 is a “part movement process”.

  In step S3, the suction state of the electronic component 25 is imaged by the imaging device 70 at the component recognition position. In step S4, a predetermined coordinate indicating the mounting position of the electronic component 25 on the printed circuit board 75 is corrected based on the captured image data. In step S <b> 5, the mounting head 93 is moved to the corrected coordinate position, and the electronic component 25 is mounted at a predetermined position on the printed circuit board 75.

  Next, the carrier tape splicing detection method will be described with reference to the flowchart of the splicing instruction program shown in FIG. 5 and the flowchart of the splicing detection program shown in FIG. The splicing instruction program and the splicing detection program are loaded in the control device of the electronic component mounting apparatus 100 as in the above-described electronic component mounting program. The splicing instruction program is executed in parallel with the electronic component mounting program, and the splicing detection program is incorporated and executed as part of the electronic component mounting program.

  When the execution of the splicing instruction program shown in FIG. 5 is started, the remaining amount of the electronic component 25 of the carrier tape 20 is checked in step S10. If the remaining amount is equal to or less than a predetermined amount (YES), step S11 is executed. Is done. If the remaining amount is greater than the predetermined amount (NO), the execution of the splicing instruction program is terminated. In the electronic component mounting program, the usage amount of the electronic component 25 is integrated every time the electronic component 25 is sucked by the suction nozzle of the mounting head 93, and thereby the remaining amount of the electronic component 25 can be known.

  In step S11, the user is notified to perform the splicing work. As this notification means, an LED, a buzzer, or the like can be used. In step S12, the worker performs off-line splicing work. Specifically, as shown in FIG. 6, the end portion of the carrier tape 20 a wound around the supply reel 13 and the start end portion of the carrier tape 20 b wound around another supply reel 13 are connected to the splicing component 35. In a state where the splicing tape 30 in which is sealed is sandwiched, the splicing tape 30 is connected by the connecting metal fitting 37. Here, the shape of the splicing component 35 is different from the shape of the electronic component 25. For this reason, the splicing component 35 and the electronic component 25 can be easily distinguished from the image data acquired by the imaging device 70. On the surface of the splicing component 35, traceability information such as the serial number of the supply reel 13, the product number of the electronic component 25, the lot number, the dimensions, the date of manufacture, and the number of pieces is described. The details of the electronic component 25 to be replaced can be known, and the consistency of the electronic component 25 can be checked and the production history can be traced. As shown in FIG. 3, the carrier tapes 20a, 20b and the splicing tape 30 are embossed tapes 21a, 21b, 31 and cover tapes 24a, 24b, 34 bonded to the embossed tapes 21a, 21b, 31. It is made up of. In the longitudinal direction of the embossed tapes 21a, 21b, 31, cavities 22a, 22b, 32 for enclosing the electronic component 25 and the splicing component 35 are recessed, and one end side in the width direction of the embossed tapes 21a, 21b, 31 Are provided with feed holes 23a, 23b, 33. Further, caulking pins (not shown) are erected on the connecting metal fitting 37, and the caulking pins are caulked through the embossed tapes 21 a, 21 b, 31, so that the carrier tapes 20 a, 20 b are spliced tape 30. It is connected in the state which pinched | interposed.

  After the carrier tapes 20a and 20b are connected while the splicing tape 30 is sandwiched, the cover tapes 24a, 24b and 34 are joined together by the connecting tape 36 as shown in FIG. 7, and the splicing operation is completed. Thereby, the execution of the splicing instruction program is terminated. FIG. 7 shows a cross section of the splicing tape 30 perpendicular to the longitudinal direction. Since the splicing instruction program is executed in parallel with the electronic component mounting program, it does not affect a series of cycle times from the suction of the electronic component 25 of the suction nozzle to the mounting on the printed circuit board 75 by the electronic component mounting program. Absent. Here, step S11 is a “tape connecting step”.

  Examples of splicing when a punch carrier type carrier tape is employed are shown in FIGS. As shown in FIG. 8, the carrier tapes 40a, 40b and the splicing tape 50 are made of paper main bodies 41a, 41b, 41, and cover tapes 44a, 44b, 44 and bottom tape 48a bonded to the main bodies 41a, 41b, 41. , 48b, 58 (see FIG. 9). In the longitudinal direction of the main bodies 41 a, 41 b, 51, cavities 42 a, 42 b, 52 in which the electronic component 45 and the splicing component 55 are enclosed are penetrated, and at the one end side in the width direction of the main bodies 41 a, 41 b, 51 , Feed holes 43a, 43b, 53 are provided. Cover tapes 44 a, 44 b, 44 and bottom tapes 48 a, 48 b, 58 are bonded to the front and back surfaces of the main bodies 41 a, 41 b, 51, whereby the electronic parts 45 and splicing parts are placed in the cavities 42 a, 42 b, 52. 55 is enclosed. Further, the shape of the splicing component 55 is different from the shape of the electronic component 45. For this reason, the splicing component 55 and the electronic component 45 can be easily distinguished from the image data acquired by the imaging device 70. On the surface of the splicing component 55, traceability information such as the serial number of the supply reel 13, the product number of the electronic component 45, the lot number, the dimensions, the date of manufacture, and the number of pieces is described.

  The end portion of the carrier tape 40a and the start end portion of another carrier tape 40b are connected by an adhesive tape 57 with the splicing tape 50 enclosing the splicing component 55 sandwiched therebetween. Thereafter, as shown in FIG. 9, the cover tapes 44 a, 44 b, 54 are joined together by the connecting tape 56, and the splicing operation is completed. Thereby, the execution of the splicing instruction program is terminated. FIG. 9 shows a cross section of the splicing tape 50 perpendicular to the longitudinal direction.

  Next, the splicing detection program shown in FIG. 10 will be described. This splicing detection program is executed after the pickup state of the electronic component 25 or the splicing component 35 sucked by the suction nozzle of the mounting head 93 is imaged by the imaging device 70 at the component recognition position. In step S20, it is checked whether or not a component recognition error has occurred. If it is determined that the image captured by the imaging device 70 is not the electronic component 25 (YES), it is a component recognition error and step S21 is executed. If it is determined that the electronic component 25 is present (NO), the splicing detection program is terminated instead of the component recognition error. In this case, the mounting head 93 is moved to a predetermined position, and the electronic component 25 is mounted at a predetermined position on the printed circuit board 75 (normal cycle).

  In step S <b> 21, it is checked whether or not the image picked up by the image pickup device 70 is the splicing component 35. If it is the splicing component 35 (YES), step S22 is executed. If it is not the splicing component 35 (NO), component recognition error processing is performed in step S24. In this case, since it is considered that something other than the electronic component 25 and the splicing component 35 is mixed, the electronic component mounting apparatus 100 is stopped and the operator is notified.

  In step S22, the traceability information described on the surface of the splicing component 35 is read. The traceability information and the detection of the splicing component 35 are stored in the memory of the control device and used by the electronic component mounting program (FIG. 4). In step S23, the splicing component 35 is discarded in the disposal box 110, and the splicing detection program is terminated. Thereby, the process when the splicing component 35 is detected can be handled in the same manner as the process when a defective product is detected. Here, steps S20 to S23 are a “splicing part recognition process”.

  In the carrier tape splicing detection method in the electronic component mounting apparatus according to the embodiment, the carrier tape 20a wound around the supply reel 13 and the carrier tape wound around another supply reel 13 in step S12. The splicing tape 30 enclosing the splicing component 35 representing the connection of the carrier tapes 20a and 20b is sandwiched and connected to the starting end of the 20b. In steps S20 to S23, the new and old seams of the carrier tapes 20a and 20b are detected by recognizing the splicing component 35 by the imaging device 70 recognizing the electronic component 25. In other words, in this carrier tape splicing detection method, a series of cycles in which the suction nozzle sucks the electronic component 25 from the cassette-type feeder 11, recognizes the electronic component 25 by the imaging device 70, and then mounts it on the printed circuit board 75. Since it is possible to detect the old and new joints of the carrier tapes 20a and 20b, it is not necessary to provide a detection device for each cassette type feeder 11, so that the manufacturing cost is not increased and the component supply device is not complicated. Further, in this carrier tape splicing detection method, the splicing component 35 is recognized by the imaging device 70 in a continuous mounting process, so that the old and new seams of the carrier tapes 20a and 20b can be immediately detected. And productivity is not reduced. Therefore, according to the splicing detection method of the carrier tape in the electronic component mounting apparatus, it is possible to realize a reduction in manufacturing cost and simplification of the component supply apparatus and to prevent a decrease in productivity.

  Further, in the splicing detection method of the carrier tape in the electronic component mounting apparatus, when the splicing component 35 is recognized in steps S20 to S23, the splicing component 35 is discarded in the disposal box 110, so that the electronic component 25 is defective. The splicing part 35 can be processed in the same way as if there were. Therefore, no special processing is required, and this can also prevent a decrease in productivity.

  Furthermore, in the splicing detection method of the carrier tape in this electronic component mounting apparatus, since the traceability information is attached to the splicing component 35, it is possible to easily check the consistency of the electronic component 25 and track the production history. It can be carried out.

  In the above, the splicing detection method of the carrier tape in the electronic component mounting apparatus of the present invention has been described according to the embodiment. However, the present invention is not limited to these, and is not contrary to the technical idea of the present invention. Needless to say, the present invention can be appropriately changed and applied.

The perspective view of the electronic component mounting apparatus according to the splicing detection method of the carrier tape of the embodiment. The front view of a cassette type feeder in connection with the splicing detection method of the carrier tape of the embodiment. The perspective view of the carrier tape wound by the supply reel in connection with the splicing detection method of the carrier tape of embodiment. 6 is a flowchart of an electronic component mounting program according to the carrier tape splicing detection method of the embodiment. The flowchart of the splicing instruction | indication program in connection with the splicing detection method of the carrier tape of embodiment. The perspective view which shows the connection of the carrier tape of an embossed carrier type according to the splicing detection method of the carrier tape of embodiment. Sectional drawing of the carrier tape of an embossed carrier type in connection with the splicing detection method of the carrier tape of embodiment. The perspective view which shows the connection of the carrier tape of a punch carrier type according to the splicing detection method of the carrier tape of embodiment. Sectional drawing of the carrier tape of a punch carrier type in connection with the splicing detection method of the carrier tape of embodiment. 7 is a flowchart of a splicing detection program according to the carrier tape splicing detection method of the embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Component supply apparatus, 13 ... Supply reel, 14 ... Component supply position, 20 (20a, 20b, 40a, 40b) ... Carrier tape, 25, 45 ... Electronic component, 30, 50 ... Splicing tape, 35, 55 ... Splicing Component: 70 ... Imaging device, 75 ... Printed circuit board, 100 ... Electronic component mounting device, S1 ... Component adsorption process, S2 ... Component movement process, S12 ... Tape connection process, S20-S23 ... Splicing component recognition process.

Claims (3)

In the splicing detection method of the carrier tape in the electronic component mounting apparatus for mounting the electronic component supplied from the component supply apparatus on the printed circuit board,
A splicing tape in which a splicing component representing a connection of the carrier tape is sealed between a terminal portion of the carrier tape wound on the first supply reel and a start end portion of the carrier tape wound on the second supply reel. A tape connecting process for holding and connecting;
A component suction step of sucking electronic components by a suction nozzle at a component supply position of the component supply device;
A component moving step of moving the suction nozzle and moving the electronic component to a component recognition position;
And a splicing component recognition step for recognizing the splicing component by an imaging device for recognizing the electronic component at the component recognition position.   2. The method of claim 1, wherein, when the splicing component is recognized in the splicing component recognition step, the splicing component is discarded.   3. The method for detecting splicing of a carrier tape in an electronic component mounting apparatus according to claim 1, wherein traceability information is attached to the splicing component.

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