JP2008304308A - Semiconductor device inspecting method and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate a cost increase, to prevent an inspecting jig from being damaged, and to inhibit an unstable inspection due to a fluctuation in a power supply voltage or a grounding voltage if a large current flows in the inspecting jig connected to a semiconductor element in the case where the large current flows to a power supply terminal or a grounding terminal of the semiconductor element when the semiconductor element is inspected. <P>SOLUTION: When the semiconductor element is inspected, the grounding voltage is applied to the terminal 6 unused for the inspection. Since a short-circuiting switch 8 is turned on by inputting an input signal for turning on a short-circuiting switch 8 to an input terminal 7 while short-circuiting the terminal 6 unused for the inspection and the grounding terminal 2, a current intended to flow to the grounding terminal 2 of the semiconductor element is distributed toward the terminal 6 unused for the inspection. When the inspection is conducted, the quantity of an absolute value of the current flowing to the grounding terminal of the semiconductor element is reduced, the inspecting jig is thereby prevented from being damaged, and the unstable inspection is inhibited. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor device inspection method and a semiconductor device for inspection of a semiconductor element.

  When inspecting a semiconductor element, the semiconductor element and the inspection apparatus are connected via an inspection jig. In this state, when a large current flows through the power supply terminal and the ground terminal of the semiconductor element during inspection, the following two problems occur. The first problem is that a large current exceeding the allowable current amount of the inspection jig flows through the inspection jig connecting the semiconductor element and the inspection apparatus, and the inspection jig is damaged. The second problem is that a large current flows through the power supply terminal or ground terminal of the semiconductor element during the inspection, and the voltage applied to the power supply terminal or ground terminal of the semiconductor element fluctuates and the inspection becomes unstable. is there.

  First, as an example of improving the first problem, in Patent Document 1, a fuse is electrically connected to a probe needle of a probe card that is an inspection jig. A specific solution to the above problem according to Patent Document 1 will be described below.

  The probe card is an inspection jig used when inspecting a semiconductor element on a wafer. Inspection is performed by connecting a semiconductor element on a wafer and an inspection device via a probe card. At this time, the probe needle is in contact with the power supply terminal, the ground terminal, and the measurement terminal of the semiconductor element. The current sent from the inspection device to the semiconductor element at the time of inspection or the current sent from the semiconductor element to the inspection device always passes through the probe needle. With this configuration, if a large current flows instantaneously through the probe needle that contacts the power supply terminal or ground terminal of the semiconductor element, the probe needle will be destroyed or burned out, that is, when the current exceeds the allowable current of the probe needle. There was a problem that jigs were damaged and inspection was impossible.

  In order to prevent the inspection jig from being damaged, Patent Document 1 has a fuse electrically connected to the probe needle. Even if a large current flows through the power supply terminal or the ground terminal of the semiconductor element, the large current passes through the fuse, so that the fuse is cut before the current reaches the probe needle. As a result, a large current flowing through the semiconductor element can be physically cut off, and as a result, destruction of the probe needle, that is, damage to the inspection jig can be suppressed.

Next, a conventional method for improving the second problem is to increase the number of power supply terminals or ground terminals of the semiconductor element. As described above, by increasing the number of power supply terminals or ground terminals of the semiconductor element to be inspected, the current flowing through the power supply terminal or ground terminal of the semiconductor element during inspection is distributed to a plurality of power supply terminals or ground terminals. Can be made. Thereby, fluctuations in voltage applied to the power supply terminal or the ground terminal due to a large current flowing through the power supply terminal or the ground terminal of the semiconductor element can be suppressed, and the inspection can be stabilized.
JP 2002-124552 A (P2002-124552A)

  In the conventional method for solving the first problem, since it becomes impossible to continue the inspection when the fuse is cut because an overcurrent flows, the inspection efficiency is lowered. Further, since an overcurrent prevention element such as a fuse is required for each inspection terminal, the number of elements mounted on the probe card increases, and accordingly, the cost for manufacturing the probe card, that is, the inspection jig increases. There is a problem.

  Further, in the above conventional method for solving the second problem, a plurality of power supply pads or ground pads are installed on the semiconductor element, thereby increasing the area of the semiconductor element and the unit price accompanying the increase in area. There is a problem.

  Accordingly, the object of the present invention is to inspect a semiconductor element, when a large current flows through a power supply terminal or a ground terminal of the semiconductor element, and when a large current flows through an inspection jig connected thereto, without incurring costs, An object of the present invention is to provide a semiconductor device inspection method and a semiconductor device capable of suppressing an inspection jig from becoming unstable due to damage to an inspection jig or fluctuations in power supply voltage or ground voltage.

  In order to solve the above-described problem, the inspection method for a semiconductor device according to the first aspect of the present invention applies an inspection by applying a power supply voltage to the power supply terminal of the semiconductor element and applying a ground voltage to the ground terminal of the semiconductor element. The terminal that is not used for the inspection of the semiconductor element and the ground terminal are short-circuited, whereby the current flowing through the ground terminal is distributed to the terminal that is not used for the inspection and the ground terminal.

  According to the above configuration, the current flowing through the ground terminal of the semiconductor element at the time of inspection is distributed to the terminal not used for inspection and the ground terminal to prevent the inspection jig from being damaged due to overcurrent, or the semiconductor device is unstable in inspection. Can be suppressed.

  According to a second aspect of the present invention, there is provided a method of inspecting a semiconductor device in which a power supply voltage is applied to a power supply terminal of a semiconductor element and a ground voltage is applied to a ground terminal of the semiconductor element. By short-circuiting the terminals, the current flowing through the power supply terminals is distributed to the terminals not used for inspection and the power supply terminals.

  According to the above configuration, the current flowing through the power supply terminal of the semiconductor element during the inspection is distributed to the terminal and the power supply terminal that are not used for the inspection, thereby preventing the inspection jig from being damaged due to overcurrent or the instability of the semiconductor device inspection. Can be suppressed.

  According to a third aspect of the present invention, there is provided a semiconductor device in which a power supply voltage is applied to a power supply terminal of a semiconductor element and a ground voltage is applied to a ground terminal of the semiconductor element for inspection, and at least one terminal not used for the inspection is provided. And at least one short-circuit switch circuit that is disposed between a terminal that is not used for inspection and a ground terminal and that is turned on / off by an external input signal, and that has an input signal for turning on / off the short-circuit switch circuit. At least one input terminal to apply, at the time of inspection, a ground potential is applied to a terminal not used for inspection, and an input signal for turning on the short-circuit switch circuit is input to the input terminal to turn on the short-circuit switch circuit Thus, the terminal not used for the inspection and the ground terminal are short-circuited.

  According to the above configuration, when a semiconductor element is inspected, an input signal for turning on the short-circuit switch circuit is input to the input terminal to turn on the short-circuit switch circuit, thereby short-circuiting a terminal not used for inspection with the ground terminal. . When a terminal not used for inspection is short-circuited to the ground terminal, the terminal not used for inspection is fixed to the ground potential through an inspection device or an inspection jig. As a result, the current that flows to the ground terminal of the semiconductor element during inspection is distributed to the terminals that are not used for inspection and the ground terminal to prevent damage to the inspection jig due to overcurrent, or to suppress instability of inspection of the semiconductor device. Can do.

  According to a fourth aspect of the present invention, there is provided a semiconductor device in which a power supply voltage is applied to a power supply terminal of a semiconductor element and a ground voltage is applied to a ground terminal of the semiconductor element, and the semiconductor device is inspected. And at least one short-circuit switch circuit that is disposed between a terminal that is not used for inspection and a ground terminal and that is turned on / off by an external input signal, and that has an input signal for turning on / off the short-circuit switch circuit. An output terminal for supplying, an input terminal to which a potential difference between one point of the wiring connected to the ground terminal and the other point is applied by a current flowing through the wiring connected to the ground terminal, and a constant reference voltage Wiring that has at least one set of voltage detection circuit having an input terminal applied, applies a ground potential to a terminal that is not used for inspection at the time of inspection, and is connected to the ground terminal in the voltage detection circuit When the potential difference between one point and the other point is equal to or higher than a certain reference voltage, a signal to turn on the short-circuit switch circuit is output from the output terminal of the voltage detection circuit to turn on the short-circuit switch circuit. Thus, the terminal not used for the inspection and the ground terminal are short-circuited.

  According to the above configuration, when the semiconductor element is inspected, the voltage detection circuit allows the potential difference between one point of the wiring connected to the ground terminal and the other point to be a voltage value equal to or higher than a certain reference voltage. By turning on the short-circuit switch circuit, a terminal not used for inspection is short-circuited with the ground terminal. When a terminal not used for inspection is short-circuited to the ground terminal, the terminal not used for inspection is fixed to the ground potential through an inspection device or an inspection jig. As a result, the current that flows to the ground terminal of the semiconductor element during inspection is distributed to the terminals that are not used for inspection and the ground terminal to prevent damage to the inspection jig due to overcurrent, or to suppress instability of inspection of the semiconductor device. Can do.

  According to a fifth aspect of the present invention, there is provided a semiconductor device in which a power supply voltage is applied to a power supply terminal of a semiconductor element and a ground voltage is applied to a ground terminal of the semiconductor element for inspection, and at least one terminal not used for the inspection is provided. And at least one short-circuit switch circuit that is disposed between a terminal that is not used for inspection and a ground terminal and that is turned on / off by an external input signal, and that has an input signal for turning on / off the short-circuit switch circuit. A short-circuit switch circuit control circuit having an output terminal for supply is provided in the semiconductor element, and at the time of inspection, a ground potential is applied to a terminal not used for inspection, the short-circuit switch circuit control circuit is operated, and the short-circuit switch circuit control circuit By outputting a signal to turn on the short-circuit switch circuit from the output terminal of, and turning on the short-circuit switch circuit, the terminals not used for inspection and the grounding of the semiconductor element Characterized in that it short-circuits the child.

  According to the above configuration, when the semiconductor element is inspected, the short-circuit switch circuit is turned on by the short-circuit switch circuit control circuit, thereby short-circuiting a terminal not used for the inspection with the ground terminal. When a terminal not used for inspection is short-circuited to the ground terminal, the terminal not used for inspection is fixed to the ground potential through an inspection device or an inspection jig. As a result, the current that flows to the ground terminal of the semiconductor element during inspection is distributed to the terminals that are not used for inspection and the ground terminal to prevent damage to the inspection jig due to overcurrent, or to suppress instability of inspection of the semiconductor device. Can do.

  According to a sixth aspect of the present invention, there is provided a semiconductor device in which a power supply voltage is applied to a power supply terminal of a semiconductor element and a ground voltage is applied to a ground terminal of the semiconductor element for inspection, and at least one terminal not used for the inspection is provided. And having at least one set of short-circuit switch circuits that are arranged between a terminal not used for inspection and a power supply terminal and are turned on / off by an external input signal, and an input signal for turning on / off the short-circuit switch circuit. It has at least one input terminal for applying, and at the time of inspection, a power supply potential is applied to a terminal not used for inspection, and an input signal for turning on the short-circuit switch circuit is input to the input terminal to turn on the short-circuit switch circuit. Thus, the terminal not used for the inspection and the power supply terminal are short-circuited.

  According to the above configuration, when a semiconductor element is inspected, an input signal for turning on the short-circuit switch circuit is input to the input terminal to turn on the short-circuit switch circuit, thereby short-circuiting a terminal not used for inspection with the power supply terminal. . When a terminal not used for inspection is short-circuited with the power supply terminal, the terminal not used for inspection is fixed to the power supply potential through an inspection device or an inspection jig. As a result, the current flowing through the power supply terminal of the semiconductor element during the inspection is distributed to the terminal and the power supply terminal that are not used for the inspection, thereby preventing the inspection jig from being damaged due to overcurrent, or suppressing the unstable inspection of the semiconductor device. Can do.

  According to a seventh aspect of the present invention, there is provided a semiconductor device in which a power supply voltage is applied to a power supply terminal of a semiconductor element and a ground voltage is applied to a ground terminal of the semiconductor element for inspection, and at least one terminal not used for inspection is provided. And having at least one set of short-circuit switch circuits that are arranged between a terminal not used for inspection and a power supply terminal and are turned on / off by an external input signal, and an input signal for turning on / off the short-circuit switch circuit. An output terminal for supplying, an input terminal to which a potential difference between one point of the wiring connected to the power supply terminal and another point is applied by a current flowing through the wiring connected to the power supply terminal, and a constant reference voltage Wiring that has at least one set of voltage detection circuit having an input terminal applied, applies a power supply potential to a terminal that is not used for inspection at the time of inspection, and connects to the power supply terminal in the voltage detection circuit When the potential difference between one point and the other point is equal to or higher than a certain reference voltage, a signal to turn on the short-circuit switch circuit is output from the output terminal of the voltage detection circuit to turn on the short-circuit switch circuit. Thus, the terminal not used for the inspection and the power supply terminal are short-circuited.

  According to the above configuration, when inspecting a semiconductor element, the voltage detection circuit causes the potential difference between one point with a wiring connected to the power supply terminal and the other point to be a voltage value equal to or higher than a certain reference voltage. By turning on the short circuit switch circuit, a terminal not used for inspection is short-circuited with the power supply terminal. When a terminal not used for inspection is short-circuited with the power supply terminal, the terminal not used for inspection is fixed to the power supply potential through an inspection device or an inspection jig. As a result, the current flowing through the power supply terminal of the semiconductor element during the inspection is distributed to the terminal and the power supply terminal that are not used for the inspection, thereby preventing the inspection jig from being damaged due to overcurrent, or suppressing the unstable inspection of the semiconductor device. Can do.

  According to an eighth aspect of the present invention, there is provided a semiconductor device in which a power supply voltage is applied to a power supply terminal of a semiconductor element and a ground voltage is applied to a ground terminal of the semiconductor element for inspection, and at least one terminal not used for the inspection is provided. And having at least one set of short-circuit switch circuits that are arranged between a terminal not used for inspection and a power supply terminal and are turned on / off by an external input signal, and an input signal for turning on / off the short-circuit switch circuit. A short-circuit switch circuit control circuit having an output terminal for supply is provided in the semiconductor element, and at the time of inspection, a power supply potential is applied to a terminal not used for inspection to operate the short-circuit switch circuit control circuit. By outputting a signal to turn on the short-circuit switch circuit from the output terminal, and turning on the short-circuit switch circuit, the terminals not used for inspection and the power supply of the semiconductor element Characterized in that it short-circuits the child.

  According to the above configuration, when the semiconductor element is inspected, the short-circuit switch circuit is turned on by the short-circuit switch circuit control circuit, thereby short-circuiting a terminal not used for the inspection with the power supply terminal. When a terminal not used for inspection is short-circuited with the power supply terminal, the terminal not used for inspection is fixed to the power supply potential through an inspection device or an inspection jig. As a result, the current flowing through the power supply terminal of the semiconductor element during the inspection is distributed to the terminal and the power supply terminal that are not used for the inspection, thereby preventing the inspection jig from being damaged due to overcurrent, or suppressing the unstable inspection of the semiconductor device. Can do.

  According to a ninth aspect of the present invention, there is provided a semiconductor device in which a power supply voltage is applied to a power supply terminal of a semiconductor element and a ground voltage is applied to a ground terminal of the semiconductor element for inspection, and at least two terminals that are not used for inspection are inspected. A short-circuit switch circuit that is disposed between one terminal that is not used for inspection and the ground terminal and between the other terminal that is not used for inspection and the power supply terminal, and is turned ON / OFF by an external input signal At least two sets, at least one input terminal for applying an input signal for turning ON / OFF the short-circuit switch circuit, at the time of inspection, a ground potential is applied to one terminal not used for inspection, and for inspection The power supply potential is applied to the other terminal that is not used, and the input signal that turns on the short-circuit switch circuit is input to the input terminal to turn on the short-circuit switch circuit. There one terminal and to short-circuit the grounding terminal, and wherein the short-circuiting the other terminal and the power supply pins not used for testing.

  According to the above configuration, when a semiconductor element is inspected, an input signal for turning on the short-circuit switch circuit is input to the input terminal to turn on the short-circuit switch circuit. And the other terminal not used for inspection and the power supply terminal are short-circuited. When one terminal that is not used for inspection is short-circuited with the ground terminal, one terminal that is not used for inspection is fixed to the ground potential through an inspection device or inspection jig, and the other terminal that is not used for inspection is the power supply terminal. When the terminal is short-circuited, the other terminal not used for the inspection is fixed to the power supply potential through the inspection device or the inspection jig. As a result, the current flowing through the ground terminal of the semiconductor element during inspection is distributed to one terminal and the ground terminal that are not used for inspection, and the current flowing through the power supply terminal of the semiconductor element is distributed to the other terminal and the power supply terminal that are not used for inspection. It is possible to prevent the inspection jig from being damaged due to overcurrent, or to suppress the instability of inspection of the semiconductor device.

According to the semiconductor device of the present invention, by controlling the semiconductor element and inspecting the semiconductor element, the current sent from the inspection apparatus to the power supply terminal or ground terminal of the semiconductor element at the time of inspection, or the power supply terminal of the semiconductor element or The current sent from the ground terminal to the inspection device can be distributed to the power supply terminal or the ground terminal and the terminal not used for the inspection, thereby reducing the absolute value of the current flowing through the power supply terminal or the ground terminal. From the above,
(1) The inspection efficiency is not lowered, the cost for manufacturing the inspection jig is not increased, and damage to the inspection jig due to a large current can be suppressed. (Solving the first problem of the conventional method)
(2) Without increasing the number of power supply pads or ground pads in the semiconductor element, it is possible to suppress the fluctuation of the voltage applied to the power supply terminal or ground terminal of the semiconductor element and stabilize the inspection. (Solving the second problem of the above conventional method)

(Embodiment 1)
Embodiment 1 of the present invention will be described with reference to FIG. The first embodiment is an embodiment of the invention that can reduce the absolute value of a large current that flows to the ground terminal of a semiconductor element.

  In FIG. 1, 1 indicates a power supply terminal of a semiconductor element to be inspected, and 2 indicates a ground terminal of the semiconductor element to be inspected. At the time of inspection, in order to supply power to the semiconductor element, a ground potential is applied from the inspection apparatus to the ground terminal 2 of the semiconductor element via an inspection jig, and a power supply voltage is applied to the power supply terminal 1 of the semiconductor element. Reference numeral 5 denotes a terminal for inputting an inspection signal when inspecting the semiconductor element. Reference numeral 6 denotes a terminal which is not used for inspection when inspecting the semiconductor element. Reference numeral 13 denotes an operation of the internal circuit 3 of the semiconductor element for the input of the inspection signal. Indicates the terminal that outputs the result. The inspection non-use terminal 6 has at least one terminal. The inspection signal input terminal 5, the inspection signal output terminal 13, and the inspection nonuse terminal 6 are connected to the internal circuit 3 of the semiconductor element via the I / O circuit 4.

  Furthermore, at least one set of short-circuit switch circuits that are turned ON / OFF by an external input signal is provided. That is, the short-circuit switch 8 is provided between the inspection non-use terminal 6 and the ground terminal 2, and the short-circuit switch 8 is turned on by the signal switching of the inspection mode signal input terminal 7 and the inspection non-use terminal 6 and the ground terminal 2 are short-circuited. The circuit is configured as follows. The input terminal 7 has at least one terminal and applies an input signal for turning on / off the short-circuit switch 8.

  When the short-circuit switch 8 is turned on, the short-circuit switch 8 is configured so that the impedance between the wiring 9 and the wiring 10 can be as low as possible, and the polarity of the short-circuit switch 8 being turned on is determined by the configuration of the short-circuit switch 8.

When the semiconductor element having the above configuration is inspected, there are two cases where a large current flows through the ground terminal 2 as follows.
(1) Case where a large current flows from the wiring 12 connected to the ground terminal of the internal circuit 3 or the wirings 11 and 14 connected to the ground terminal of the I / O circuit toward the ground terminal 2 (2) From the ground terminal 2 to the internal A case in which a large current flows toward the wiring 12 connected to the ground terminal 2 of the circuit 3 or the wirings 11 and 14 connected to the ground terminal of the I / O circuit. In any of the above cases, the ground terminal 2 of the semiconductor element, or When a large current is about to flow to the inspection jig connected to the ground terminal 2, the large current can be suppressed by the circuit operation of the present embodiment described below.

  When inspecting the semiconductor element having the above configuration, the inspection is performed by connecting the semiconductor element on the wafer and the inspection apparatus via an inspection jig such as a probe card. At this time, a ground potential is applied to the inspection non-use terminal 6 from the inspection device via the inspection jig in advance, and an arbitrary signal level is applied to the inspection mode signal input terminal 7 for turning on the short-circuit switch 8 from the inspection device. Is input to turn on the short-circuit switch 8 so that the inspection non-use terminal 6 and the ground terminal 2 are short-circuited. At this time, the internal circuit 3 is controlled so that the internal circuit 3 of the semiconductor element does not malfunction even if the state of the inspection non-use terminal 6 changes.

In this state, when a large current is about to flow to the ground terminal 2 during the semiconductor element inspection, the ground terminal 2 and the inspection non-use terminal 6 to which the ground potential is applied from the inspection device via the inspection jig are provided. Since it is short-circuited, the current can be distributed to the ground terminal 2 and the inspection non-use terminal 6. With the above-described operation, the absolute value of the current flowing through the ground terminal 2 of the semiconductor element can be reduced during the inspection, and thus the inspection jig can be prevented from being damaged and the inspection can be prevented from becoming unstable. Note that the above-described embodiment becomes more effective as the number of test non-use terminals 6 that can disperse the current to flow to the ground terminal 2 increases.
(Embodiment 2)
A second embodiment of the present invention will be described with reference to FIG. The second embodiment is an embodiment of the invention that can reduce the absolute value of a large current that flows to the ground terminal of a semiconductor element.

  In FIG. 2, 1 indicates a power supply terminal of a semiconductor element to be inspected, and 2 indicates a ground terminal of the semiconductor element to be inspected. At the time of inspection, in order to supply power to the semiconductor element, a ground potential is applied from the inspection apparatus to the ground terminal 2 of the semiconductor element via an inspection jig, and a power supply voltage is applied to the power supply terminal 1 of the semiconductor element. Reference numeral 5 denotes a terminal for inputting an inspection signal when inspecting the semiconductor element. Reference numeral 6 denotes a terminal which is not used for inspection when inspecting the semiconductor element. Reference numeral 13 denotes an operation of the internal circuit 3 of the semiconductor element for the input of the inspection signal. Indicates the terminal that outputs the result. The inspection non-use terminal 6 has at least one terminal. The inspection signal input terminal 5, the inspection signal output terminal 13, and the inspection nonuse terminal 6 are connected to the internal circuit 3 of the semiconductor element via the I / O circuit 4.

  Furthermore, at least one set of short-circuit switch circuits that are turned ON / OFF by an external input signal is provided. That is, the short-circuit switch 8 is provided between the inspection non-use terminal 6 and the ground terminal 2, and the switch switching signal input terminal of the short-circuit switch 8 and the output terminal 18 of the voltage detection circuit 15 are connected. An output signal for turning ON / OFF the short-circuit switch 8 is supplied to the output terminal 18 of the voltage detection circuit 15.

  The voltage detection circuit 15 has at least one set, and an input terminal to which a potential difference between one point of the wiring connected to the ground terminal 2 and another point is applied when a current flows through the wiring connected to the ground terminal 2. And an input terminal to which a constant reference voltage is applied. In this case, a potential difference between the wiring 16 and the wiring 17 caused by a current flowing through the ground terminal 2 is detected, and a voltage value 19 in which the potential difference between the wiring 16 and the wiring 17 is equal to or greater than a certain value (hereinafter referred to as a detection voltage value). The signal level output to the output terminal 18 of the voltage detection circuit is inverted. By switching the signal output from the output terminal 18 of the voltage detection circuit, the short-circuit switch 8 is turned ON and the wiring 9 and the wiring 10 are short-circuited, whereby the inspection non-use terminal 6 and the ground terminal 2 are short-circuited.

  In addition, when the short-circuit switch 8 is turned on, the short-circuit switch 8 is configured so that the impedance between the wiring 9 and the wiring 10 can be as low as possible, and the polarity of the short-circuit switch 8 being turned on is determined by the configuration of the short-circuit switch 8, The polarity of the signal output from the output terminal 18 of the voltage detection circuit is determined by the configuration of the voltage detection circuit 15, and the detection voltage value 19 when the signal level output from the output terminal 18 of the voltage detection circuit is inverted is also a voltage. It depends on the configuration of the detection circuit 15.

When the semiconductor element having the above configuration is inspected, there are two cases where a large current flows through the ground terminal 2 as follows.
(1) Case where a large current flows from the wiring 12 connected to the ground terminal of the internal circuit 3 or the wirings 11 and 14 connected to the ground terminal of the I / O circuit toward the ground terminal 2 (2) From the ground terminal 2 to the internal A case in which a large current flows toward the wiring 12 connected to the ground terminal 2 of the circuit 3 or the wirings 11 and 14 connected to the ground terminal of the I / O circuit. In any of the above cases, the ground terminal 2 of the semiconductor element, or When a large current is about to flow to the inspection jig connected to the ground terminal 2, the large current can be suppressed by the circuit operation of the present embodiment described below.

When inspecting the semiconductor element having the above configuration, the inspection is performed by connecting the semiconductor element on the wafer and the inspection apparatus via an inspection jig such as a probe card. At this time, a ground potential is applied in advance to the inspection non-use terminal 6 from the inspection device via the inspection jig. Also,
(Potential difference between wiring 16 and wiring 17) <(detection voltage value 19)
At this time, the short-circuit switch 8 is in an OFF state. At this time, the internal circuit 3 is controlled so that the internal circuit 3 of the semiconductor element does not malfunction even if the state of the inspection non-use terminal 6 changes.

In this state, when a large current is about to flow to the ground terminal 2 during the semiconductor element inspection, a current flows between the wiring 16 and the wiring 17,
(Current value flowing between wiring 16 and wiring 17) × (resistance value between wiring 16 and wiring 17)
When the potential difference between the wiring 16 and the wiring 17 determined by (1) becomes equal to or higher than the detection voltage value 19, the signal level output from the output terminal 18 of the voltage detection circuit 15 is inverted and the short-circuit switch 8 is turned on, and the grounding The terminal 2 and the inspection non-use terminal 6 to which the ground potential is applied from the inspection device through the inspection jig are short-circuited, and a large current that tends to flow to the ground terminal 2 is caused to flow to the ground terminal 2 and the inspection non-use terminal 6. Can be dispersed. With the above-described operation, the absolute value of the current flowing through the ground terminal 2 of the semiconductor element can be reduced during the inspection, and thus the inspection jig can be prevented from being damaged and the inspection can be prevented from becoming unstable. Note that the above-described embodiment becomes more effective as the number of test non-use terminals 6 that can disperse the current to flow to the ground terminal 2 increases.
(Embodiment 3)
A third embodiment of the present invention will be described with reference to FIG. The third embodiment is an embodiment of the invention that can reduce the absolute value of a large current that flows to the ground terminal 2 of the semiconductor element.

  In FIG. 3, 1 indicates a power supply terminal of a semiconductor element to be inspected, and 2 indicates a ground terminal of the semiconductor element to be inspected. At the time of inspection, in order to supply power to the semiconductor element, a ground potential is applied from the inspection apparatus to the ground terminal 2 of the semiconductor element via an inspection jig, and a power supply voltage is applied to the power supply terminal 1 of the semiconductor element. Reference numeral 5 denotes a terminal for inputting an inspection signal when inspecting the semiconductor element. Reference numeral 6 denotes a terminal which is not used for inspection when inspecting the semiconductor element. Reference numeral 13 denotes an operation of the internal circuit 3 of the semiconductor element for the input of the inspection signal. Indicates the terminal that outputs the result. The inspection non-use terminal 6 has at least one terminal. The inspection signal input terminal 5, the inspection signal output terminal 13, and the inspection nonuse terminal 6 are connected to the internal circuit 3 of the semiconductor element via the I / O circuit 4.

  Furthermore, at least one set of short-circuit switch circuits that are turned ON / OFF by an external input signal is provided. That is, the short-circuit switch 8 is provided between the inspection non-use terminal 6 and the ground terminal 2, and the switch switching signal input terminal of the short-circuit switch 8 is connected to the output terminal 21 of the short-circuit switch control circuit 20 incorporated in the internal circuit. An output signal for turning ON / OFF the short-circuit switch 8 is supplied to the output terminal 21 of the short-circuit switch control circuit 20.

  The short-circuit switch control circuit 20 is configured to invert the signal level output to the output terminal 21 of the short-circuit switch control circuit by switching the register setting of the internal circuit. By switching the signal output from the output terminal 21 of the short-circuit switch control circuit, the short-circuit switch 8 is turned ON and the wiring 9 and the wiring 10 are short-circuited, whereby the inspection non-use terminal 6 and the ground terminal 2 are short-circuited.

  In addition, when the short-circuit switch 8 is turned on, the short-circuit switch 8 is configured so that the impedance between the wiring 9 and the wiring 10 can be as low as possible, and the polarity of the short-circuit switch 8 being turned on is determined by the configuration of the short-circuit switch 8, The polarity of the signal output from the output terminal 21 of the short-circuit switch control circuit is determined by the configuration of the short-circuit switch control circuit 20.

When the semiconductor element having the above configuration is inspected, there are two cases where a large current flows through the ground terminal 2 as follows.
(1) Case where a large current flows from the wiring 12 connected to the ground terminal of the internal circuit 3 or the wirings 11 and 14 connected to the ground terminal of the I / O circuit toward the ground terminal 2 (2) From the ground terminal 2 to the internal A case in which a large current flows toward the wiring 12 connected to the ground terminal 2 of the circuit 3 or the wirings 11 and 14 connected to the ground terminal of the I / O circuit. In any of the above cases, the ground terminal 2 of the semiconductor element, or When a large current is about to flow to the inspection jig connected to the ground terminal 2, the large current can be suppressed by the circuit operation of the present invention described below.

  When inspecting the semiconductor element having the above configuration, the inspection is performed by connecting the semiconductor element on the wafer and the inspection apparatus via an inspection jig such as a probe card. At this time, a ground potential is applied to the inspection non-use terminal 6 in advance from the inspection device via the inspection jig, and the register setting of the internal circuit of the semiconductor device is switched and output from the output terminal 21 of the short-circuit switch control circuit. The signal is inverted, the short-circuit switch 8 is turned on, and the inspection non-use terminal 6 and the ground terminal 2 are short-circuited. At this time, the internal circuit 3 is controlled so that the internal circuit 3 of the semiconductor element does not malfunction even if the state of the inspection non-use terminal 6 changes.

In this state, when a large current is about to flow to the ground terminal 2 during the semiconductor element inspection, the ground terminal 2 and the inspection non-use terminal 6 to which the ground potential is applied from the inspection device via the inspection jig are provided. Since it is short-circuited, the current can be distributed to the ground terminal 2 and the inspection non-use terminal 6. With the above-described operation, the absolute value of the current flowing through the ground terminal 2 of the semiconductor element can be reduced during the inspection, and thus the inspection jig can be prevented from being damaged and the inspection can be prevented from becoming unstable. The above-described embodiment becomes more effective as the number of non-inspection terminals 6 that can disperse the current that flows to the ground terminal 2 increases.
(Embodiment 4)
Embodiment 4 of the present invention will be described with reference to FIG. The fourth embodiment is an embodiment of the invention that can reduce the absolute value of a large current that flows to the power supply terminal of the semiconductor element.

  In FIG. 4, 1 indicates a power supply terminal of a semiconductor element to be inspected, and 2 indicates a ground terminal of the semiconductor element to be inspected. At the time of inspection, in order to supply power to the semiconductor element, a ground potential is applied from the inspection apparatus to the ground terminal 2 of the semiconductor element via an inspection jig, and a power supply voltage is applied to the power supply terminal 1 of the semiconductor element. Reference numeral 5 denotes a terminal for inputting an inspection signal when inspecting the semiconductor element. Reference numeral 6 denotes a terminal which is not used for inspection when inspecting the semiconductor element. Reference numeral 13 denotes an operation of the internal circuit 3 of the semiconductor element for the input of the inspection signal. Indicates the terminal that outputs the result. The inspection non-use terminal 6 has at least one terminal. The inspection signal input terminal 5, the inspection signal output terminal 13, and the inspection nonuse terminal 6 are connected to the internal circuit 3 of the semiconductor element via the I / O circuit 4.

  Furthermore, at least one set of short-circuit switch circuits that are turned ON / OFF by an external input signal is provided. That is, the short-circuit switch 8 is provided between the inspection non-use terminal 6 and the power supply terminal 1, and the short-circuit switch 8 is turned on by the signal switching of the inspection mode signal input terminal 7, and the inspection non-use terminal 6 and the power supply terminal 1 are short-circuited. The circuit is configured as follows.

  When the short-circuit switch 8 is turned on, the short-circuit switch 8 is configured so that the impedance between the wiring 9 and the wiring 10 can be as low as possible, and the polarity of the short-circuit switch 8 being turned on is determined by the configuration of the short-circuit switch 8.

When the semiconductor element having the above configuration is inspected, there are the following two cases where a large current flows through the power supply terminal 1.
(1) Case where a large current flows from the wiring 22 connected to the power supply terminal of the internal circuit 3 or the wirings 23 and 24 connected to the power supply terminal of the I / O circuit toward the power supply terminal 1 (2) From the power supply terminal 1 to the internal A case where a large current flows toward the wiring 22 connected to the power supply terminal 1 of the circuit 3 or the wirings 23 and 24 connected to the power supply terminal of the I / O circuit. In any of the above cases, the power supply terminal 1 of the semiconductor element, or When a large current is about to flow to the inspection jig connected to the power supply terminal 1, the above-described large current can be suppressed by the circuit operation of the present invention described below.

  When inspecting the semiconductor element having the above configuration, the inspection is performed by connecting the semiconductor element on the wafer and the inspection apparatus via an inspection jig such as a probe card. At this time, an arbitrary signal level is applied to the inspection non-use terminal 6 in advance by applying a power supply potential from the inspection device via the inspection jig, and further to the inspection mode signal input terminal 7 for turning on the short-circuit switch 8 from the inspection device. Is input to turn on the short-circuit switch 8 so that the inspection non-use terminal 6 and the power supply terminal 1 are short-circuited. At this time, the internal circuit 3 is controlled so that the internal circuit 3 of the semiconductor element does not malfunction even if the state of the inspection non-use terminal 6 changes.

In this state, when a large current is about to flow to the power supply terminal 1 during the semiconductor element inspection, the power supply terminal 1 and the inspection non-use terminal 6 to which the power supply potential is applied from the inspection apparatus via the inspection jig are provided. Since they are short-circuited, the current can be distributed to the power supply terminal 1 and the inspection non-use terminal 6. With the above-described operation, the absolute value of the current flowing through the power supply terminal 1 of the semiconductor element can be reduced during the inspection, and thus the inspection jig can be prevented from being damaged and the inspection can be prevented from becoming unstable. Note that the effect of the embodiment described above increases as the number of the inspection non-use terminals 6 that can disperse the current to flow through the power supply terminal 1 increases.
(Embodiment 5)
Embodiment 5 of the present invention will be described with reference to FIG. The fifth embodiment is an embodiment of the invention that can reduce the absolute value of a large current that flows to the power supply terminal of a semiconductor element.

  In FIG. 5, 1 indicates a power supply terminal of a semiconductor element to be inspected, and 2 indicates a ground terminal of the semiconductor element to be inspected. At the time of inspection, in order to supply power to the semiconductor element, a ground potential is applied from the inspection apparatus to the ground terminal 2 of the semiconductor element via an inspection jig, and a power supply voltage is applied to the power supply terminal 1 of the semiconductor element. Reference numeral 5 denotes a terminal for inputting an inspection signal when inspecting the semiconductor element. Reference numeral 6 denotes a terminal which is not used for inspection when inspecting the semiconductor element. Reference numeral 13 denotes an operation of the internal circuit 3 of the semiconductor element for the input of the inspection signal. Indicates the terminal that outputs the result. The inspection non-use terminal 6 has at least one terminal. The inspection signal input terminal 5, the inspection signal output terminal 13, and the inspection nonuse terminal 6 are connected to the internal circuit 3 of the semiconductor element via the I / O circuit 4.

  Furthermore, at least one set of short-circuit switch circuits that are turned ON / OFF by an external input signal is provided. That is, the short-circuit switch 8 is provided between the inspection non-use terminal 6 and the power supply terminal 1, and the switch switching signal input terminal of the short-circuit switch 8 and the output terminal 18 of the voltage detection circuit 15 are connected. An output signal for turning ON / OFF the short-circuit switch 8 is supplied to the output terminal 18 of the voltage detection circuit 15.

  The voltage detection circuit 15 has at least one set, and an input terminal to which a potential difference between one point of the wiring connected to the power supply terminal 1 and another point is applied when a current flows through the wiring connected to the power supply terminal 1. And an input terminal to which a constant reference voltage is applied. In this case, a potential difference between the wiring 16 and the wiring 17 caused by a current flowing through the power supply terminal 1 is detected, and a voltage value 19 in which the potential difference between the wiring 16 and the wiring 17 is equal to or greater than a certain value (hereinafter referred to as a detection voltage value). The signal level output to the output terminal 18 of the voltage detection circuit is inverted. By switching the signal output from the output terminal 18 of the voltage detection circuit, the short-circuit switch 8 is turned ON and the wiring 9 and the wiring 10 are short-circuited, whereby the inspection non-use terminal 6 and the power supply terminal 1 are short-circuited.

  In addition, when the short-circuit switch 8 is turned on, the short-circuit switch 8 is configured so that the impedance between the wiring 9 and the wiring 10 can be as low as possible, and the polarity of the short-circuit switch 8 being turned on is determined by the configuration of the short-circuit switch 8, The polarity of the signal output from the output terminal 18 of the voltage detection circuit is determined by the configuration of the voltage detection circuit 15, and the detected voltage value 19 when the signal level output from the output terminal 18 of the voltage detection circuit is inverted is also a voltage. It depends on the configuration of the detection circuit 15.

When the semiconductor element having the above configuration is inspected, there are the following two cases where a large current flows through the power supply terminal 1.
(1) Case where a large current flows from the wiring 22 connected to the power supply terminal of the internal circuit 3 or the wirings 23 and 24 connected to the power supply terminal of the I / O circuit toward the power supply terminal 1 (2) From the power supply terminal 1 to the internal A case where a large current flows toward the wiring 22 connected to the power supply terminal 1 of the circuit 3 or the wirings 23 and 24 connected to the power supply terminal of the I / O circuit. In any of the above cases, the power supply terminal 1 of the semiconductor element, or When a large current is about to flow to the inspection jig connected to the power supply terminal 1, the above-described large current can be suppressed by the circuit operation of the present invention described below.

When inspecting the semiconductor element having the above configuration, the inspection is performed by connecting the semiconductor element on the wafer and the inspection apparatus via an inspection jig such as a probe card. At this time, a power supply potential is previously applied to the inspection non-use terminal 6 from the inspection device via the inspection jig. Also,
(Potential difference between wiring 16 and wiring 17) <(detection voltage value 19)
At this time, the short-circuit switch 8 is in an OFF state. At this time, the internal circuit 3 is controlled so that the internal circuit 3 of the semiconductor element does not malfunction even if the state of the inspection non-use terminal 6 changes.

In this state, when a large current is about to flow through the power supply terminal 1 during the semiconductor element inspection, a current flows between the wiring 16 and the wiring 17.
(Current value flowing between wiring 16 and wiring 17) × (resistance value between wiring 16 and wiring 17)
When the potential difference between the wiring 16 and the wiring 17 determined by (1) becomes equal to or higher than the detection voltage value 19, the signal level output from the output terminal 18 of the voltage detection circuit 15 is inverted and the short-circuit switch 8 is turned on. The terminal 1 and the inspection non-use terminal 6 to which the power supply potential is applied from the inspection device through the inspection jig are short-circuited, and a large current that tends to flow to the power supply terminal 1 is supplied to the power supply terminal 1 and the inspection non-use terminal. 6 can be dispersed. With the above-described operation, the absolute value of the current flowing through the power supply terminal 1 of the semiconductor element can be reduced during the inspection, and thus the inspection jig can be prevented from being damaged and the inspection can be prevented from becoming unstable. Note that the effect of the embodiment described above increases as the number of the inspection non-use terminals 6 that can disperse the current to flow through the power supply terminal 1 increases.
(Embodiment 6)
Embodiment 6 of the present invention will be described with reference to FIG. The sixth embodiment is an embodiment of the invention that can reduce the absolute value of a large current that flows to the power supply terminal of the semiconductor element.

  In FIG. 6, 1 indicates a power supply terminal of a semiconductor element to be inspected, and 2 indicates a ground terminal of the semiconductor element to be inspected. At the time of inspection, in order to supply power to the semiconductor element, a ground potential is applied from the inspection apparatus to the ground terminal 2 of the semiconductor element via an inspection jig, and a power supply voltage is applied to the power supply terminal 1 of the semiconductor element. Reference numeral 5 denotes a terminal for inputting an inspection signal when inspecting the semiconductor element. Reference numeral 6 denotes a terminal which is not used for inspection when inspecting the semiconductor element. Reference numeral 13 denotes an operation of the internal circuit 3 of the semiconductor element for the input of the inspection signal. Indicates the terminal that outputs the result. The inspection non-use terminal 6 has at least one terminal. The inspection signal input terminal 5, the inspection signal output terminal 13, and the inspection nonuse terminal 6 are connected to the internal circuit 3 of the semiconductor element via the I / O circuit 4.

  Furthermore, at least one set of short-circuit switch circuits that are turned ON / OFF by an external input signal is provided. That is, the short circuit switch 8 is provided between the inspection non-use terminal 6 and the power supply terminal 1, and the switch switching signal input terminal of the short circuit switch 8 and the output terminal 21 of the short circuit switch control circuit 20 incorporated in the internal circuit are connected. An output signal for turning ON / OFF the short-circuit switch 8 is supplied to the output terminal 21 of the short-circuit switch control circuit 20.

  The short-circuit switch control circuit 20 is configured to invert the signal level output to the output terminal 21 of the short-circuit switch control circuit by switching the register setting of the internal circuit. By switching the signal output from the output terminal 21 of the short-circuit switch control circuit, the short-circuit switch 8 is turned ON and the wiring 9 and the wiring 10 are short-circuited, whereby the inspection non-use terminal 6 and the power supply terminal 1 are short-circuited.

  In addition, when the short-circuit switch 8 is turned on, the short-circuit switch 8 is configured so that the impedance between the wiring 9 and the wiring 10 can be as low as possible, and the polarity of the short-circuit switch 8 being turned on is determined by the configuration of the short-circuit switch 8, The polarity of the signal output from the output terminal 21 of the short-circuit switch control circuit is determined by the configuration of the short-circuit switch control circuit 20.

When the semiconductor element having the above configuration is inspected, there are the following two cases where a large current flows through the power supply terminal 1.
(1) Case where a large current flows from the wiring 22 connected to the power supply terminal of the internal circuit 3 or the wirings 23 and 24 connected to the power supply terminal of the I / O circuit toward the power supply terminal 1 (2) From the power supply terminal 1 to the internal A case where a large current flows toward the wiring 22 connected to the power supply terminal 1 of the circuit 3 or the wirings 23 and 24 connected to the power supply terminal of the I / O circuit. In any of the above cases, the power supply terminal 1 of the semiconductor element, or When a large current is about to flow to the inspection jig connected to the power supply terminal 1, the above-described large current can be suppressed by the circuit operation of the present invention described below.

  When inspecting the semiconductor element having the above configuration, the inspection is performed by connecting the semiconductor element on the wafer and the inspection apparatus via an inspection jig such as a probe card. At this time, the power supply potential is applied to the inspection non-use terminal 6 from the inspection device via the inspection jig in advance, and the register setting of the internal circuit of the semiconductor device is switched and output from the output terminal 21 of the short-circuit switch control circuit. The signal is inverted, the shorting switch 8 is turned on, and the inspection non-use terminal 6 and the power supply terminal 1 are short-circuited. At this time, the internal circuit 3 is controlled so that the internal circuit 3 of the semiconductor element does not malfunction even if the state of the inspection non-use terminal 6 changes.

In this state, when a large current is about to flow to the power supply terminal 1 during the semiconductor element inspection, the power supply terminal 1 and the inspection non-use terminal 6 to which the power supply potential is applied from the inspection apparatus via the inspection jig are provided. Since they are short-circuited, the current can be distributed to the power supply terminal 1 and the inspection non-use terminal 6. With the above-described operation, the absolute value of the current flowing through the power supply terminal 1 of the semiconductor element can be reduced during the inspection, and thus the inspection jig can be prevented from being damaged and the inspection can be prevented from becoming unstable. Note that the effect of the embodiment described above increases as the number of the inspection non-use terminals 6 that can disperse the current to flow through the power supply terminal 1 increases.
(Embodiment 7)
A seventh embodiment of the present invention will be described with reference to FIG. In the seventh embodiment, when there are two or more non-inspection terminals in a semiconductor element, the non-inspection terminals are used as a power supply terminal and a ground terminal in the inspection, respectively, so that they flow to the power supply terminal of the semiconductor element. This is an embodiment of the invention that can reduce both the absolute value of a large current and the absolute value of a large current that tends to flow to the ground terminal of the semiconductor element.

  In FIG. 7, 1 indicates a power supply terminal of a semiconductor element to be inspected, and 2 indicates a ground terminal of the semiconductor element to be inspected. At the time of inspection, in order to supply power to the semiconductor element, a ground potential is applied from the inspection apparatus to the ground terminal 2 of the semiconductor element via an inspection jig, and a power supply voltage is applied to the power supply terminal 1 of the semiconductor element. Reference numeral 5 denotes a terminal for inputting an inspection signal when inspecting the semiconductor element, reference numerals 6 and 25 denote terminals which are not used for the inspection during inspection of the semiconductor element, and reference numeral 13 denotes an internal circuit 3 of the semiconductor element for the input of the inspection signal. The terminal which outputs the operation result of is shown. The inspection non-use terminals 6 and 25 have at least two terminals. The inspection signal input terminal 5, the inspection signal output terminal 13, and the inspection nonuse terminals 6 and 25 are connected to the internal circuit 3 of the semiconductor element via the I / O circuit 4.

  Further, at least two sets of short-circuit switch circuits that are turned ON / OFF by an external input signal are provided. That is, a short-circuit switch 8 is provided between the inspection non-use terminal 6 and the ground terminal 2, and a short-circuit switch 26 is provided between the inspection non-use terminal 25 and the power supply terminal 1 so that the inspection mode signal input terminal 7 is turned off. Instead, the circuit is configured such that the short-circuit switch 8 is turned ON to short-circuit the inspection non-use terminal 6 and the ground terminal 2, and the short-circuit switch 26 is ON to short-circuit the inspection non-use terminal 25 and the power supply terminal 1. . The input terminal 7 has at least one terminal and applies an input signal for turning on / off the short-circuit switch 8.

  When the short-circuit switch 8 is turned on, the short-circuit switch 8 is configured so that the impedance between the wiring 9 and the wiring 10 can be as low as possible. When the short-circuit switch 26 is turned on, the impedance between the wiring 27 and the wiring 28 is changed. The short-circuit switch 26 is configured to be as low as possible, and the polarity with which the short-circuit switches 8 and 26 are turned on is determined by the configuration of the short-circuit switches 8 and 26.

  In the above configuration, when a large current is about to flow through the power supply terminal 1 or the ground terminal 2 of the semiconductor element, the large current can be suppressed by the circuit operation of the present embodiment described below.

  When inspecting the semiconductor element having the above configuration, the inspection is performed by connecting the semiconductor element on the wafer and the inspection apparatus via an inspection jig such as a probe card. At this time, a ground potential is previously applied to the inspection non-use terminal 6 from the inspection device via the inspection jig, and a power supply potential is applied to the inspection non-use terminal 25 from the inspection device via the inspection jig. Furthermore, an arbitrary signal level for turning on the short-circuit switches 8 and 26 is input from the inspection device to the inspection mode signal input terminal 7 to turn on the short-circuit switches 8 and 26, and the inspection non-use terminal 6 and the ground terminal 2 are connected. The inspection non-use terminal 25 and the power supply terminal 1 are short-circuited. At this time, the internal circuit 3 is controlled so that the internal circuit 3 of the semiconductor element does not malfunction even if the state of the inspection non-use terminal 6 changes.

  In this state, when a large current is about to flow to the ground terminal 1 during the semiconductor element inspection, the ground terminal 1 and the inspection non-use terminal 6 to which the ground potential is applied from the inspection device via the inspection jig are provided. Since it is short-circuited, the current can be distributed to the ground terminal 2 and the inspection non-use terminal 6. Similarly, when a large current is about to flow through the power supply terminal 1 during inspection, the power supply terminal 1 and the inspection non-use terminal 25 to which the power supply potential is applied from the inspection apparatus via the inspection jig are short-circuited. Therefore, the current can be distributed to the power supply terminal 1 and the inspection nonuse terminal 25.

  With the above operation, the absolute value of the current flowing through the power supply terminal 1 or the ground terminal 2 of the semiconductor element can be reduced during the inspection, thereby preventing the inspection jig from being damaged and preventing the inspection from becoming unstable. Can do. The above-described embodiment becomes more effective as the number of the inspection non-use terminals 6 or the inspection non-use terminals 25 that can disperse the current that flows to the power supply terminal 1 or the ground terminal 2 increases.

  INDUSTRIAL APPLICABILITY The semiconductor device inspection method and the semiconductor device according to the present invention can suppress the inspection jig from being damaged by a large current without lowering the inspection efficiency and without increasing the cost for manufacturing the inspection jig. In addition, there is an effect that the inspection can be stabilized by suppressing the fluctuation of the voltage applied to the power supply terminal or the ground terminal of the semiconductor element without increasing the number of power supply pads or ground pads in the semiconductor element. It is useful for inspection.

1 is a circuit configuration diagram of a large current protection circuit of a semiconductor device according to a first embodiment of the present invention. It is a circuit block diagram of the large current protection circuit of the semiconductor device of Embodiment 2 of this invention. It is a circuit block diagram of the large current protection circuit of the semiconductor device of Embodiment 3 of this invention. It is a circuit block diagram of the large current protection circuit of the semiconductor device of Embodiment 4 of this invention. It is a circuit block diagram of the large current protection circuit of the semiconductor device of Embodiment 5 of this invention. It is a circuit block diagram of the large current protection circuit of the semiconductor device of Embodiment 6 of this invention. It is a circuit block diagram of the large current protection circuit of the semiconductor device of Embodiment 7 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Power supply terminal of semiconductor element 2 Ground terminal of semiconductor element 3 Internal circuit of semiconductor element 4 I / O circuit of semiconductor element 5 Inspection signal input terminal of semiconductor element 6 Non-inspection terminal of semiconductor element 7 Inspection mode signal input of semiconductor element Terminal 8 Short-circuit switch 9 Wiring connected to short-circuit switch 10 Wiring connected to short-circuit switch 11 Wiring connected to ground terminal of I / O circuit 12 Wiring connected to ground terminal of internal circuit 13 Test signal output terminal of semiconductor element 14 I Wiring connected to the ground terminal of the / O circuit 15 Voltage detection circuit 16 Wiring connected to a terminal serving as a voltage reference of the voltage detection circuit 17 Wiring connected to an input terminal of the voltage detection circuit 18 Output terminal of the voltage detection circuit 19 Voltage Reference voltage of detection circuit 20 Short-circuit switch control circuit existing in internal circuit of semiconductor element 21 Short-circuit switch control Terminals for outputting road control signals 22 Wirings connected to power supply terminals of internal circuits 23 Wirings connected to power supply terminals of I / O circuits 24 Wirings connecting to power supply terminals of I / O circuits 25 Non-inspection terminals of semiconductor elements 26 Short-circuit switch 27 Wiring connected to short-circuit switch 28 Wiring connected to short-circuit switch

Claims (9)

  When applying a power supply voltage to the power supply terminal of the semiconductor element and inspecting by applying a ground voltage to the ground terminal of the semiconductor element, by short-circuiting the terminal not used for the inspection of the semiconductor element and the ground terminal, A method for inspecting a semiconductor device, characterized in that a current flowing through a ground terminal is distributed to a terminal not used for the inspection and the ground terminal.   When applying a power supply voltage to the power supply terminal of the semiconductor element and inspecting by applying a ground voltage to the ground terminal of the semiconductor element, by short-circuiting a terminal not used for the inspection of the semiconductor element and the power supply terminal, A method for inspecting a semiconductor device, characterized in that a current flowing through a power supply terminal is distributed to a terminal not used for the inspection and the power supply terminal. A semiconductor device for inspecting by applying a power supply voltage to a power supply terminal of a semiconductor element and applying a ground voltage to a ground terminal of the semiconductor element,
Having at least one terminal not used for inspection, having at least one set of short-circuit switch circuits disposed between the terminal not used for inspection and the ground terminal, and turned ON / OFF by an external input signal; Having at least one input terminal for applying an input signal for turning ON / OFF the short-circuit switch circuit;
At the time of inspection, a ground potential is applied to a terminal not used for the inspection, and an input signal for turning on the short-circuit switch circuit is input to the input terminal to turn on the short-circuit switch circuit. And the ground terminal. A semiconductor device for inspecting by applying a power supply voltage to a power supply terminal of a semiconductor element and applying a ground voltage to a ground terminal of the semiconductor element,
Having at least one terminal not used for inspection, having at least one set of short-circuit switch circuits disposed between the terminal not used for inspection and the ground terminal, and turned ON / OFF by an external input signal; When an electric current flows through an output terminal for supplying an input signal for turning ON / OFF the short-circuit switch circuit and a wiring connected to the ground terminal, a point between one point of the wiring connected to the ground terminal and another point Having at least one set of voltage detection circuits each having an input terminal to which a potential difference is applied and an input terminal to which a constant reference voltage is applied;
At the time of inspection, a ground potential is applied to a terminal that is not used for the inspection, and in the voltage detection circuit, a potential difference between one point of wiring connected to the ground terminal and another point is a voltage that is equal to or higher than the predetermined reference voltage. When the value is reached, a signal for turning on the short-circuit switch circuit is output from the output terminal of the voltage detection circuit to turn on the short-circuit switch circuit, thereby short-circuiting the terminal not used for the inspection and the ground terminal. A semiconductor device characterized by the above. A semiconductor device for inspecting by applying a power supply voltage to a power supply terminal of a semiconductor element and applying a ground voltage to a ground terminal of the semiconductor element,
Having at least one terminal not used for inspection, having at least one set of short-circuit switch circuits disposed between the terminal not used for inspection and the ground terminal, and turned ON / OFF by an external input signal; A short-circuit switch circuit control circuit having an output terminal for supplying an input signal for turning ON / OFF the short-circuit switch circuit in the semiconductor element;
At the time of inspection, a ground potential is applied to a terminal not used for the inspection, the short-circuit switch circuit control circuit is operated, and a signal for turning on the short-circuit switch circuit is output from an output terminal of the short-circuit switch circuit control circuit. A semiconductor device characterized in that, by turning on a short-circuit switch circuit, a terminal not used for the inspection and a ground terminal of the semiconductor element are short-circuited. A semiconductor device for inspecting by applying a power supply voltage to a power supply terminal of a semiconductor element and applying a ground voltage to a ground terminal of the semiconductor element,
At least one terminal that is not used for inspection, at least one set of a short-circuit switch circuit that is disposed between the terminal that is not used for inspection and the power supply terminal, and is turned ON / OFF by an external input signal; Having at least one input terminal for applying an input signal for turning ON / OFF the short-circuit switch circuit;
During inspection, a power supply potential is applied to a terminal not used for the inspection, and an input signal for turning on the short-circuit switch circuit is input to the input terminal to turn on the short-circuit switch circuit. And the power supply terminal are short-circuited. A semiconductor device for inspecting by applying a power supply voltage to a power supply terminal of a semiconductor element and applying a ground voltage to a ground terminal of the semiconductor element,
At least one terminal that is not used for inspection, at least one set of a short-circuit switch circuit that is disposed between the terminal that is not used for inspection and the power supply terminal, and is turned ON / OFF by an external input signal; When a current flows through an output terminal for supplying an input signal for turning on / off the short-circuit switch circuit and a wiring connected to the power supply terminal, a point between one point of the wiring connected to the power supply terminal and another point Having at least one set of voltage detection circuits each having an input terminal to which a potential difference is applied and an input terminal to which a constant reference voltage is applied;
At the time of inspection, a power supply potential is applied to a terminal that is not used for the inspection, and in the voltage detection circuit, a potential difference between one point of wiring connected to the power supply terminal and another point is a voltage that is equal to or higher than the predetermined reference voltage. When the value is reached, a signal for turning on the short-circuit switch circuit is output from the output terminal of the voltage detection circuit to turn on the short-circuit switch circuit, thereby short-circuiting the terminal not used for the inspection and the power supply terminal. A semiconductor device characterized by the above. A semiconductor device for inspecting by applying a power supply voltage to a power supply terminal of a semiconductor element and applying a ground voltage to a ground terminal of the semiconductor element,
At least one terminal that is not used for inspection, at least one set of a short-circuit switch circuit that is disposed between the terminal that is not used for inspection and the power supply terminal, and is turned ON / OFF by an external input signal; A short-circuit switch circuit control circuit having an output terminal for supplying an input signal for turning ON / OFF the short-circuit switch circuit in the semiconductor element;
At the time of inspection, a power supply potential is applied to a terminal not used for the inspection, the short-circuit switch circuit control circuit is operated, and a signal for turning on the short-circuit switch circuit is output from the output terminal of the short-circuit switch circuit control circuit. A semiconductor device characterized by short-circuiting a terminal not used for the inspection and a power supply terminal of the semiconductor element by turning on a short-circuit switch circuit. A semiconductor device for inspecting by applying a power supply voltage to a power supply terminal of a semiconductor element and applying a ground voltage to a ground terminal of the semiconductor element,
There are at least two terminals that are not used for inspection, and are arranged between one terminal that is not used for inspection and the ground terminal and between the other terminal that is not used for inspection and the power supply terminal, respectively. Having at least two sets of short-circuit switch circuits that are turned ON / OFF by an input signal from, and having at least one input terminal for applying an input signal for turning ON / OFF the short-circuit switch circuit
During inspection, a ground potential is applied to one terminal not used for the inspection, a power supply potential is applied to the other terminal not used for the inspection, and an input signal for turning on the short-circuit switch circuit is input to the input terminal. Then, by turning on the short-circuit switch circuit, one terminal not used for the inspection and the ground terminal are short-circuited, and the other terminal not used for the inspection and the power supply terminal are short-circuited. Semiconductor device.

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