JP2008300169A - Organic el device, electronic equipment, and manufacturing method of organic el device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL device capable of reducing protrusion of an absorbent generated on the inner side of a barrier rib while suppressing deterioration of the organic EL element by the absorbent which absorbs at least one of moisture and oxygen in the barrier rib. <P>SOLUTION: The organic EL device 1 is provided with a substrate 10, a plurality of organic EL elements 12 formed on the substrate 10, and barrier ribs 14 formed on the substrate 10 so as to mutually divide the plurality of organic EL elements 12. In the barrier ribs 14, a layer containing an absorbent (absorbent containing layer 14b) to absorb at least one of moisture and oxygen and a layer not containing the absorbent (absorbent non-containing layers 14a, 14c) are laminated. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an organic EL device, an electronic apparatus, and a method for manufacturing the organic EL device.

  As a light source capable of realizing a thin and lightweight display, an organic EL element (organic electroluminescent device), that is, an OLED (organic light emitting diode) element has attracted attention. In order to extend the lifetime of the organic EL element, it is necessary to remove water and oxygen mixed in the organic EL element as much as possible. For example, it is known that when water is mixed in an organic thin film, a dark spot (a portion that does not emit light) is generated with driving, and the light emission characteristics deteriorate. In general, since an organic material easily binds to oxygen, it is necessary to prevent oxygen from being mixed in like water. Therefore, the organic EL element is usually produced in an environment free from oxygen and moisture.

  Further, Patent Document 1 proposes a technique in which a desiccant such as silica gel is contained in the resin constituting the partition walls of the pixel in order to reduce the deterioration of the organic EL element. In the area surrounded by the partition walls, an organic light emitting layer and, if necessary, other organic layers such as a hole injection layer are arranged.

JP 2006-228493 A

  However, in the above-described configuration in which the desiccant is dispersed in the partition wall material, the desiccant is exposed on the surface of the partition wall, and the surface may be uneven. The organic light emitting layer and other organic layers are in contact with the inner side surface of the partition wall, but irregularities due to the protrusion of the desiccant are also formed on the inner side surface. When the variation in the number of protrusions of the desiccant is large, the light emission area of some pixels may be greatly deviated from the desired area due to the protrusion of the desiccant. Further, when the variation in the number of protrusions of the desiccant is large, the way in which the emitted light emitted from the organic light emitting layer is reflected on the inner surface of the partition wall is greatly different. If the way in which the emitted light is reflected by the partition walls is greatly different for each pixel, there is a possibility that uniform light emission cannot be obtained in the pixel region.

  Accordingly, the present invention provides an organic material capable of reducing the protrusion of the absorbent formed on the inner surface of the partition wall while suppressing the deterioration of the organic EL element by the absorbent that absorbs at least one of moisture and oxygen in the partition wall. Provided are an EL device, an electronic apparatus, and a method for manufacturing an organic EL device.

  An organic EL device according to the present invention includes a substrate, a plurality of light emitting elements formed on the substrate, and a partition formed on the substrate so as to separate the plurality of light emitting elements from each other. , A layer containing an absorbent that absorbs at least one of moisture and oxygen and a layer not containing the absorbent are laminated. In the present invention, since a layer that does not contain an absorbent is provided in the partition wall, the number of absorbent protrusions that occur on the inner surface of the partition wall can be reduced as compared with the case where the entire partition wall contains the absorbent. it can. Accordingly, it is possible to reduce the difference in the way of reflecting the emitted light reflected on the inner surface of the partition wall between the light emitting elements. Further, in the present invention, it is possible to reduce the variation in the number of the protrusions by reducing the number of the protrusions of the absorbent generated on the inner surface of the partition wall, and only the emission area of some pixels is desired. Can be prevented from greatly deviating from the area.

  In the partition, it is preferable that the layer not containing the absorbent is disposed farthest from the substrate. For example, a common electrode common to a plurality of light emitting elements or other layers (for example, an organic light emitting layer depending on the type of the organic EL device) is in contact with the surface of the partition opposite to the substrate. When the protrusion of the absorber occurs at this interface, unexpected undulation occurs in the layer in contact with this interface, and the path of light passing through the common electrode or other layer or reflected by this layer deviates from the desired path. There is a fear. In the partition wall, if the layer not containing the absorber is disposed farthest from the substrate, the undulation of the layer contacting the surface of the partition opposite to the substrate is reduced, and the light path deviates from the desired path. Things are also reduced. Furthermore, for example, when an organic light emitting layer or other layer is formed by supplying a material solution of the organic light emitting layer or other layer to an area surrounded by a partition wall by a liquid supply method such as an inkjet method or a dispenser method. For this, it is preferable that no material liquid remains on the surface of the partition opposite to the substrate. In the partition wall, if the layer that does not contain the absorbent is arranged farthest from the substrate, the absorbent does not protrude from the surface of the partition opposite to the substrate, reducing the risk of material liquid remaining on the surface. can do.

  Since the electronic apparatus according to the present invention includes the above-described organic EL device, it is possible to prevent only the light emission area of some pixels from greatly deviating from a desired area while suppressing deterioration of the organic EL element. It is possible to reduce a difference in the way of reflecting the emitted light reflected on the inner side surface of the partition wall between the light emitting elements. As such an electronic device, for example, there are various devices including an organic EL device as an image display device, or an electrophotographic printing device including an organic EL device as an exposure device.

  The method of manufacturing the organic EL device includes a step of laminating a layer containing the absorbent and a layer not containing the absorbent to form the partition wall on the substrate, and a plurality of methods on the substrate. Forming the light emitting element. Therefore, while suppressing the deterioration of the organic EL element, it is possible to prevent only the area of some pixels from deviating greatly from the desired area. Further, between the respective light emitting elements, the emission light reflected on the inner surface of the partition wall can be prevented. The difference in the way of reflection can be reduced.

  Preferably, in the step of forming the partition wall, the layer not containing the absorbent is disposed farthest from the substrate, and the step of forming the light emitting element is a material that becomes a layer contributing to light emission in the light emitting element. Supplying a liquid containing a liquid to an area surrounded by the partition wall on the substrate. Here, the layer that contributes to light emission is not only the organic light emitting layer, but also all layers that are disposed between the anode and the cathode and contribute to light emission in the organic light emitting layer, for example, a hole transport layer, hole injection It may be a layer, an electron injection layer, or an electron transport layer. For example, in the case of forming an organic light emitting layer or other layers by supplying a material solution of an organic light emitting layer or other layers to an area surrounded by a partition wall by a liquid supply method such as an inkjet method or a dispenser method, It is preferable that the material liquid does not remain on the surface of the partition opposite to the substrate. In the partition wall, if the layer that does not contain the absorbent is arranged farthest from the substrate, the absorbent does not protrude from the surface of the partition opposite to the substrate, reducing the risk of material liquid remaining on the surface. can do.

Hereinafter, various embodiments according to the present invention will be described with reference to the accompanying drawings. In the drawings, the ratio of dimensions of each part is appropriately different from the actual one.
<First Embodiment>
FIG. 1 is a sectional view showing an organic EL device 1 according to the first embodiment of the present invention. The organic EL device 1 includes a substrate 10 and a plurality of organic EL elements (light emitting elements) 12 formed on the substrate 10. More specifically, a plurality of TFTs (thin film transistors) 32 for supplying power to the organic EL elements 12 to emit light are formed on the substrate 10, and an inorganic insulator layer 30 covering these TFTs 32. Is formed. In addition, although wiring for supplying power to the TFT 32 and causing the organic EL element 12 to emit light is disposed on the substrate 10, illustration of the wiring is omitted. The organic EL device 1 of this embodiment may be a bottom emission type, a top emission type, or a dual emission. The substrate 10 is formed of a light-transmitting material, preferably glass, in the bottom emission type or the dual emission, and in the top emission type. It is made of a translucent material or an opaque material such as ceramic or metal. The inorganic insulator layer 30 is made of, for example, silicon oxide or silicon nitride.

  A base layer 34 made of an inorganic insulator such as silicon oxide or silicon nitride is formed on the inorganic insulator layer 30, and a plurality of organic EL elements 12 are formed on the base layer 34. Partition walls (banks) 14 that are separated from each other are formed. In the partition wall 14, a layer containing an absorbent that absorbs at least one of moisture and oxygen (absorbent-containing layer 14b) and a layer not containing an absorbent (absorbent-free layers 14a and 14c) are laminated. . The absorbent non-containing layers 14a and 14c are formed of an insulating transparent resin material such as acrylic, epoxy, or polyimide. The absorbent-containing layer 14b is formed of a material obtained by mixing an absorbent with this insulating transparent material (main component).

  The absorbent contained in the absorbent-containing layer 14b may be a moisture absorbent (drying agent), an oxygen absorbent (deoxygenating agent), or an absorbent that absorbs both moisture and oxygen. Further, the absorbent may be a mixture of two or more of these. Examples of suitable moisture absorbents include silica gel, molecular sieves, phosphorus pentoxide, or hydraulic materials (eg gypsum). An example of a suitable oxygen absorbent is active iron oxide fine powder. Examples of absorbents that absorb both moisture and oxygen include metals that are highly reactive with water, such as alkali metals and alkaline earth metals, or alloys or compounds containing these metals (eg MgO, BaO, CaO) Is mentioned.

  Preferably, the absorbent is selected so as not to cause a chemical reaction with the main component of the partition wall 14 and to deteriorate the partition wall 14. For example, when the main component of the partition wall 14 is acrylic or polyimide and the absorbent is silica gel, the partition wall 14 is in a chemically stable state over a long period of time. The size, shape, and ratio of the absorbent to the main component are not particularly limited as long as they do not have a significant adverse effect on the formation of the partition wall 14 and the surface roughness. For example, a spherical powder having an average particle size of 10 nm to 1000 nm can be used.

  Each of the organic EL elements 12 includes a pixel electrode 16, a light emitting functional layer 18, and a counter electrode 20. The pixel electrode 16 is formed on the base layer 34, and a part of the partition wall 14 overlaps with the end portion. The pixel electrode 16 is provided in each of the organic EL elements 12, and is connected to the TFT 32 by a conductor in a through hole 36 that extends through the base layer 34 to the TFT 32.

  The light emitting functional layer 18 is disposed in each space partitioned by the partition walls 14. In other words, the partition 14 divides the light emitting functional layers 18 of the plurality of organic EL elements 12. The light emitting functional layer (layer that contributes to light emission) 18 includes at least an organic light emitting layer, and the organic light emitting layer is formed of an organic EL material that emits light by combining holes and electrons. In this embodiment, the organic EL substance is a polymer material. For example, the material is supplied into each space partitioned by the partition wall 14 by a liquid supply method such as an ink jet method or a dispenser method. As another layer constituting the light emitting functional layer 18, a part or all of an electron block layer, a hole injection layer, a hole transport layer, an electron transport layer, an electron injection layer, and a hole block layer may be provided.

  The counter electrode 20 is in contact with the light emitting functional layer 18 of the plurality of organic EL elements 12. That is, the counter electrode 20 extends over the area of the light emitting functional layer 18 defined by the barrier ribs 14 and the barrier ribs 14 so as to be common to the plurality of organic EL elements 12. In this embodiment, the pixel electrode 16 is an anode and the counter electrode 20 is a cathode, but vice versa. The materials of the pixel electrode 16 and the counter electrode 20 can be appropriately selected according to the emission type.

  Although not shown, in order to protect the light emitting functional layer 18 of the organic EL element 12 from moisture and oxygen, the counter electrode 20 may be covered with a known sealing film, or a known sealing cap is bonded to the substrate 10. May be. Further, when the organic EL device 1 is used as a color image display device, a color filter may be disposed on the light emitting side in order to improve the chromaticity of the emitted color.

The entire partition wall 14 or at least the absorbent-free layer 14c farthest from the substrate 10 in the partition wall 14 is preferably subjected to a liquid repellency treatment using, for example, CF ₄ plasma. This liquid repellency treatment is performed by supplying a liquid (material liquid) as a material of the light emitting functional layer 18 to a predetermined position by a liquid supply method (the surface on the side opposite to the substrate 10). ) So that the material liquid does not remain. The liquid repellency of the portion subjected to the liquid repellency treatment is improved.

  Moreover, you may perform a lyophilic process by oxygen plasma, for example only to the absorber non-containing layer 14a, or the absorber non-containing layer 14a and the absorber containing layer 14b. In the lyophilic portion, the lyophilicity with respect to the material liquid of the light emitting functional layer 18 is improved compared to the lyophobic portion of the absorbent non-containing layer 14c. Although not shown, the lyophilic property to the material liquid of the light emitting functional layer 18 is more lyophobic than the acrylic, epoxy, or polyimide between the absorbent non-containing layer 14a and the base layer 34. A lyophilic layer formed from a material higher than the treated part, for example, silicon oxide or silicon nitride, may be provided. In short, it is preferable that the partition wall 14 has high lyophilicity with respect to the material liquid of the light emitting functional layer 18 near the substrate 10 and high liquid repellency with respect to the material liquid of the light emitting functional layer 18 farther from the substrate 10. .

  2A is a partially enlarged cross-sectional view of the organic EL device 1 according to this embodiment, and FIG. 2B is a partially enlarged cross-sectional view of another organic EL device for comparison. . As shown in FIG. 2A, in the organic EL device 1 according to this embodiment, the absorbent 15 is dispersed only in the absorbent-containing layer 14b of the partition wall 14, whereas FIG. In the organic EL device for comparison, the absorbent 15 is dispersed throughout the partition wall 141 as shown in FIG. In any of the organic EL devices shown in FIGS. 2A and 2B, the absorbent 15 is disposed inside the partition wall, so that the deterioration of the organic EL element 12 can be suppressed. However, it is difficult to arrange a large number of absorbents 15 so as not to protrude from the surface of the partition wall 14. Accordingly, the absorbent 15 protrudes from the inner side surface of the partition wall with which the light emitting functional layer 18 comes into contact, and these protruding absorbents 15 reduce the light emitting area of the light emitting functional layer 18 or between the organic EL elements. There is a possibility that the way of reflecting the emitted light reflected on the side surface may be different.

  In this regard, in the comparative organic EL device shown in FIG. 2B, the absorbent 15 is dispersed throughout the partition wall 141, and thus the light emitting functional layer 18 is separated from the partition wall 141 for the plurality of organic EL elements 12. In this case, only the light emitting area of the light emitting functional layer 18 of some of the organic EL elements 12 may be greatly deviated from the desired area, There is a possibility that the manner of reflection of the emitted light reflected on the inner side surface of the partition wall is greatly different between EL elements. In that case, there is a possibility that uniform light emission cannot be obtained in the pixel region of the organic device.

  However, in the organic EL device 1 according to this embodiment, the partition wall 14 is provided with layers that do not contain the absorbent 15 (absorbent non-containing layers 14a and 14c). The number of protrusions of the agent 15 can be reduced. Accordingly, it is possible to reduce the difference in the way of reflecting the emitted light reflected on the inner surface of the partition wall between the organic EL elements. In addition, it is possible to prevent only the area of the light emitting functional layer 18 of some of the organic EL elements 12 from greatly deviating from the desired area.

  In particular, in this embodiment, in the partition wall 14, a layer that does not contain the absorbent 15 (absorbent-free layer 14 a) is disposed as the widest layer, that is, the layer closest to the substrate 10. The influence of the 15 protrusions on the area of the light emitting functional layer 18 can be reduced. Furthermore, in this embodiment, the area occupied by the absorbent-containing layer 14b on the inner surface of the partition wall 14 is the area of one or both of the area of the absorbent-free layer 14a and the area of the absorbent-free layer 14c. Therefore, the area where the absorbent 15 can protrude becomes narrow, and the number of protrusions of the absorbent 15 can be reduced.

Furthermore, in this embodiment, in the partition wall 14, a layer that does not contain the absorbent 15 (absorbent-free layer 14c) is disposed as the layer farthest from the substrate 10. A common electrode (counter electrode 20) common to the plurality of organic EL elements 12 is in contact with the surface of the partition opposite to the substrate 10. In the comparative organic EL device shown in FIG. 2B, the protrusion of the absorbent 15 is generated at the interface between the partition wall 141 and the counter electrode 20, and unexpected undulation occurs in the counter electrode 20 in contact with the interface. There is a possibility that the path of light passing through the electrode 20 (in the case of top emission or dual emission type) or light reflected by the counter electrode 20 (in the case of bottom emission type) may deviate from the desired path. In particular, this problem is remarkable when the size of the absorbent 15 is large. In this embodiment shown in FIG. 2A, in the partition wall 14, the absorbent non-containing layer 14 c that does not contain the absorbent 15 is disposed farthest from the substrate 10. The undulation of the counter electrode 20 in contact with the opposite surface is reduced, and the situation where the light path deviates from the desired path is also reduced. Further, when supplying the liquid as the material of the light emitting functional layer 18 to a predetermined position, the surface of the partition wall 14 is made CF so that the material liquid does not remain on the upper surface of the partition wall 14 (surface opposite to the substrate 10). _{Although the} liquid repellent treatment is performed with ₄ plasma, the absorbent 15 is less liable to be liquid repellent than the surface of the partition wall 14 even when irradiated with CF ₄ plasma. When the material liquid of the light emitting functional layer 18 is supplied, the material liquid of the light emitting functional layer 18 tends to remain on the upper surface of the partition wall 14. However, in this embodiment, since the absorbent non-containing layer 14c is disposed as the layer farthest from the substrate 10 of the partition wall 14, the absorbent 15 does not protrude from the upper surface of the partition wall 14, thereby preventing the above problem. be able to.

  Next, an example of a method for manufacturing the organic EL device 1 according to this embodiment will be described. First, as shown in FIG. 3, a power supply wiring (not shown) to the organic EL element 12 and a TFT 32 are formed on the substrate 10 by a known method, and an insulating layer 30 is formed. Further, the base layer 34 is formed, and the pixel electrode 16 is patterned by a known method using, for example, ITO (indium tin oxide).

Further, as shown in FIG. 4, the material 14am (for example, photosensitive polyimide) of the absorbent non-containing layer 14a of the partition wall 14 is applied on the base layer 34 by a spin coat method so as to cover the pixel electrode 16 and dried. The drying conditions are 1 minute at a temperature of 120 ° C. in N ₂ gas.

Furthermore, as shown in FIG. 5, the photomask 40 is arrange | positioned in the location which should leave the absorber non-containing layer 14a, material 14am is exposed, and the absorber non-containing layer 14a is patterned. Thereafter, the photomask 40 is removed, and the exposed portion of the material 14am is removed by washing with a developer containing water by a spray method or a dip method, so that an absorbent-free layer as shown in FIG. The part which becomes 14a is left. Furthermore, it is heated in N ₂ gas at a temperature of 280 ° C. for 1 hour to form the absorbent non-containing layer 14a.

Next, as shown in FIG. 7, the material 14bm of the absorbent-containing layer 14b of the partition wall 14 is applied onto the structure by a spin coat method and dried. The material 14bm is composed of, for example, photosensitive polyimide as a main component, and is a mixture of silica gel as a moisture absorbent and MgO as a moisture and oxygen absorbent. Silica gel and MgO, for example, have an average particle diameter of 100 nm and are mixed in a weight ratio of 20% with respect to the photosensitive polyimide (when dried). The drying conditions are 1 minute at a temperature of 120 ° C. in N ₂ gas.

Furthermore, as shown in FIG. 8, the photomask 42 is arrange | positioned in the location which should leave the absorber containing layer 14b, material 14bm is exposed, and the absorber containing layer 14b is patterned. Thereafter, the photomask 42 is removed, and the exposed portion of the material 14bm is removed by washing with a developer containing water by a spray method or a dip method, thereby removing the absorbent-containing layer 14b as shown in FIG. The part which becomes becomes remains. Further, heating is performed in N ₂ gas at a temperature of 280 ° C. for 1 hour to form the absorbent-containing layer 14b.

Next, as shown in FIG. 10, a material 14 cm (for example, photosensitive polyimide) of the absorbent non-containing layer 14c of the partition wall 14 is applied onto the structure by a spin coating method and dried. The drying conditions are 1 minute at a temperature of 120 ° C. in N ₂ gas.

Furthermore, as shown in FIG. 11, the photomask 44 is arrange | positioned in the location which should leave the absorber non-containing layer 14c, material 14cm is exposed, and the absorber non-containing layer 14c is patterned. Thereafter, the photomask 44 is removed, and the exposed portion of the material 14 cm is removed by washing with a developer containing water by a spray method or a dip method, thereby removing the absorbent-free layer as shown in FIG. The part which becomes 14c is left. Further, heating is performed in N ₂ gas at a temperature of 280 ° C. for 1 hour to form the absorbent non-containing layer 14 c and the partition wall 14.

Further, the structure is subjected to a liquid repellency treatment using CF ₄ plasma to improve the liquid repellency of the partition wall 14 with respect to the liquid used as the material of the light emitting functional layer 18. Then, as shown in FIG. 13, the material solution 18 </ b> A of the light emitting functional layer 18, that is, the ink is dropped into the space surrounded by the partition wall 14 and dried to form the structure shown in FIG. Thereafter, as shown in FIG. 1, the counter electrode 20 is formed by a known method (for example, vacuum deposition method), and further, if necessary, a sealing film or a sealing cap is joined, and a color filter is disposed. In order to simplify the description, the formation of only the single-layer light emitting functional layer 18 has been described. However, the light emitting functional layer 18 may be composed of a plurality of layers as described above. The material solution supply step and the drying step are performed.

FIG. 15 is a cross-sectional view in one process of manufacturing another organic EL device for comparison. As in FIG. 2B, in the apparatus for comparison, the absorbent is dispersed throughout the partition wall 141. When the absorbent is dispersed throughout the partition wall 141 as described above, the absorbent tends to protrude over the entire surface of the partition wall 141 (the inner surface and the surface opposite to the substrate 10). Even when the absorbent 15 is irradiated with CF ₄ plasma, the absorbent 15 is less liable to be liquid repellent than the surface of the partition wall 14, so that even if the partition wall 141 is subjected to a liquid repellent treatment, the effect is reduced. Therefore, when the material solution 18A is dropped into the space surrounded by the partition walls 14, the material solution 18A may run on the surface of the partition wall 141 opposite to the substrate 10 as shown in FIG. There is. This is in contrast to the absorbent non-containing layer 14c of the partition wall 14 repelling the material solution 18A in the embodiment as shown in FIG.

  In the apparatus for comparison, after the material solution 18A is dried, a part of the light emitting functional layer 18 may remain on the surface of the partition wall 14 opposite to the substrate 10 as shown in FIG. On the other hand, in the embodiment, in the partition wall 14, the absorbent non-containing layer 14 c that does not contain the absorbent is disposed farthest from the substrate 10, so that the partition wall 14 is on the side opposite to the substrate 10. Since the absorbent does not protrude from the surface, it is possible to reduce the possibility that the material solution 18A and thus a part of the light emitting functional layer 18 remain on the surface (see FIG. 14). This effect can be said not only for the ink jet method but also for the dispenser method or other liquid supply methods.

  In the partition 14, the thickness of the absorbent non-containing layer 14a, the absorbent containing layer 14b, and the absorbent non-containing layer 14c is arbitrary. For example, the total thickness of the partition wall 14 may be 2 μm, the thickness of the non-absorbent layers 14a and 14c may be 900 nm, and the thickness of the absorbent-containing layer 14b may be 200 nm, but the thickness of each layer may be changed as necessary. You may let them. The thickness of the absorber-free layer 14a may be made considerably larger than the final thickness of the light-emitting functional layer 18 so that the absorber-containing layer 14b does not contact the light-emitting functional layer 18, or the embodiment shown in FIG. As in the embodiment, the thickness of the absorber non-containing layer 14 a may be made considerably smaller than the final thickness of the light emitting functional layer 18 so that the absorber containing layer 14 b contacts the light emitting functional layer 18. In the illustrated embodiment, the absorbent-containing layer 14b is a single layer, but a plurality of layers may be provided as necessary.

In the above-described manufacturing method, the manufacturing process of the partition wall 14 is preferably performed in N ₂ gas in order to prevent moisture and oxygen from adsorbing to the absorbent. For example, after the partition wall 14 is formed, a heat treatment or a decompression process is performed. In the case where moisture or oxygen can be removed from the absorbent, the partition wall 14 may be formed in the atmosphere.

<Second Embodiment>
FIG. 17 is a sectional view showing an organic EL device 2 according to the second embodiment of the present invention. In FIG. 17, the same reference numerals are used to indicate the same components as those in the first embodiment.

  In this embodiment, the organic EL substance of the light emitting layer of the light emitting functional layer 18 of each organic EL element 12 is a low molecular material, and is formed by vapor deposition, for example. Although the counter electrode 20 is common to the plurality of organic EL elements 12, each pixel electrode 16 is separated from the other pixel electrode 16, and each pixel electrode 16 is defined by the partition wall 14. When a current flows between the electrode 16 and the counter electrode 20, the light emitting functional layer 18 emits light only at a position where it directly contacts and overlaps the pixel electrode 16. Accordingly, the partition wall 14 divides the plurality of organic EL elements 12, and the portion surrounded by the partition wall 14, that is, the pixel electrode 16 portion can be called an area of the organic EL element 12.

  FIG. 18 is a partially enlarged cross-sectional view of another organic EL device for comparison. In the organic EL device 2 according to this embodiment, the absorbent is dispersed only in the absorbent-containing layer 14b of the partition wall 14, whereas, as shown in FIG. 18, in the organic EL device for comparison, The absorbent 15 is dispersed throughout the partition wall 141. In any organic EL device 1, since the absorbent 15 is disposed inside the partition wall, the deterioration of the organic EL element 12 can be suppressed. However, it is difficult to arrange a large number of absorbents 15 so as not to protrude from the range of the partition walls 14. Accordingly, the absorbent 15 protrudes from the inner surface of the partition wall with which the light emitting functional layer 18 contacts, and the area of the light emitting functional layer 18 where the protruding absorbent 15 effectively emits light is reduced, or the light emitting functional layer 18. There is a risk of scattering the light emission at.

  In this regard, in the comparative organic EL device shown in FIG. 18, since the absorbent 15 is dispersed throughout the partition wall 141, absorption of the plurality of organic EL elements 12 from the partition wall 141 to the light emitting functional layer 18 is performed. There is a possibility that the variation in the number of protrusions of the agent 15 may increase. In this case, only the light emitting area of the light emitting functional layer 18 of some of the organic EL elements 12 may greatly deviate from the desired area. Moreover, about the some organic EL element 12, there exists a possibility that the reflection method of the emitted light reflected in the inner surface of a partition may differ greatly between each organic EL element.

  However, in the organic EL device 1 according to this embodiment, the partition wall 14 is provided with layers that do not contain the absorbent 15 (absorbent non-containing layers 14a and 14c). The number of protrusions of the agent can be reduced. Accordingly, it is possible to reduce the variation in the protrusion of the absorbent that occurs on the inner surface of the partition wall 14, and only the area of the light emitting functional layer 18 of the light emitting functional layer 18 of a part of the organic EL elements 12 is from a desired area. It is possible to prevent a significant shift. Moreover, the difference in the reflection method of the emitted light reflected in the inner surface of a partition between each organic EL element can be made small.

  In particular, in this embodiment, in the partition wall 14, a layer that does not contain the absorbent 15 (absorbent-free layer 14 a) is disposed as the widest layer, that is, the layer closest to the substrate 10. The effect of the 15 protrusions on the area of the light emitting functional layer 18 that effectively emits light is small. Furthermore, in this embodiment, the area occupied by the absorbent-containing layer 14b on the inner surface of the partition wall 14 is the area of one or both of the area of the absorbent-free layer 14a and the area of the absorbent-free layer 14c. Therefore, the area where the absorbent 15 can protrude becomes narrow, and the number of protrusions of the absorbent 15 can be reduced.

  Furthermore, in this embodiment, in the partition wall 14, a layer that does not contain the absorbent 15 (absorbent-free layer 14c) is disposed as the layer farthest from the substrate 10. The end of the light emitting functional layer 18 is in contact with the surface of the partition opposite to the substrate 10, and the common electrode (counter electrode 20) common to the plurality of organic EL elements 12 is in contact therewith. In the comparative organic EL device shown in FIG. 18, the protrusion of the absorbent 15 occurs at the interface between the partition wall 141 and the end of the light emitting functional layer 18, and the end of the light emitting functional layer 18 in contact with this interface and the opposing surface thereon. An unexpected undulation occurs in the electrode 20, and the path of light passing through the counter electrode 20 (in the case of top emission or dual emission type) or light reflected by the counter electrode 20 (in the case of bottom emission type) deviates from the desired path. There is a fear. In particular, this problem is remarkable when the size of the absorbent 15 is large. In this embodiment, in the partition wall 14, the absorbent non-containing layer 14 c that does not contain the absorbent 15 is disposed farthest from the substrate 10, so that it contacts the surface of the partition wall 14 opposite to the substrate 10. The waviness of the counter electrode 20 is reduced, and the situation where the light path deviates from the desired path is also reduced.

  The organic EL device 2 is manufactured by stacking a layer containing an absorbent (absorbent-containing layer 14b) and a layer not containing an absorbent (absorbent-free layers 14a and 14c) to form the partition wall 14. A step of forming on the substrate 10 and a step of forming a plurality of organic EL elements 12 on the substrate 10. The step of forming the partition wall 14 on the substrate 10 may be the same as that described in regard to the first embodiment. In the step of forming the plurality of organic EL elements 12 on the substrate 10, the light emitting functional layer 18 is formed by vapor deposition, for example.

  In the partition 14, the thickness of the absorbent non-containing layer 14a, the absorbent containing layer 14b, and the absorbent non-containing layer 14c is arbitrary. In the illustrated embodiment, the absorbent-containing layer 14b is a single layer, but a plurality of layers may be provided as necessary.

<Other variations>
In the above embodiment, the main component of the partition 14 is selected from an insulating transparent resin material such as acrylic, epoxy, or polyimide, but an insulating inorganic material such as silicon oxide or silicon nitride is used for the partition 14. It may be the main component. The following can be considered as a method of forming the absorbent-containing layer 14b.
(1) For example, when the absorbent is a material that can be deposited, the absorbent-containing layer 14b is formed by mixing the insulating inorganic material and depositing the mixed material by vapor deposition.
(2) When the absorbent is a material that cannot be deposited or is inappropriate for mixed deposition, the absorbent particles are placed on the absorbent non-containing layer 14a, and the absorbent particles are partially The absorbent-containing layer 14b is formed by depositing the insulating inorganic material by vapor deposition so as to cover it. In this case, if all the absorbent particles are completely embedded in the insulating inorganic material in all directions, the absorption performance cannot be expected. Therefore, at least some of the particles are partially formed in the absorbent-containing layer 14b. The absorbent particles are arranged in advance so as to be exposed from the wall surface.
(3) The absorbent non-containing layers 14a and 14c are formed of the insulating inorganic material, and the absorbent containing layer 14b is formed of another material. The other material referred to here may be an absorbent alone or an insulating transparent resin material containing the absorbent.

<Application>
Next, an electronic apparatus to which the organic EL device according to the present invention is applied will be described. FIG. 19 is a perspective view showing a configuration of a mobile personal computer using the organic EL device 1 or 2 according to the above embodiment as an image display device. The personal computer 2000 includes an organic EL device 1 as a display device and a main body 2010. The main body 2010 is provided with a power switch 2001 and a keyboard 2002.
FIG. 20 shows a mobile phone to which the organic EL device 1 or 2 according to the above embodiment is applied. The cellular phone 3000 includes a plurality of operation buttons 3001, scroll buttons 3002, and the organic EL device 1 as a display device. By operating the scroll button 3002, the screen displayed on the organic EL device 1 is scrolled.
FIG. 21 shows a portable information terminal (PDA: Personal Digital Assistant) to which the organic EL device 1 or 2 according to the above embodiment is applied. The information portable terminal 4000 includes a plurality of operation buttons 4001, a power switch 4002, and the organic EL device 1 as a display device. When the power switch 4002 is operated, various types of information such as an address book and a schedule book are displayed on the organic EL device 1.

  As electronic devices to which the organic EL device according to the present invention is applied, in addition to those shown in FIGS. 19 to 21, a digital still camera, a television, a video camera, a car navigation device, a pager, an electronic notebook, electronic paper, a calculator, Examples include a word processor, a workstation, a videophone, a POS terminal, a video player, and a device equipped with a touch panel. In addition, an image printing apparatus using an electrophotographic method using the organic EL device 1 or 2 as a light-emitting source such as a printer head that irradiates an image carrier with light to form an electrostatic latent image is also like that. Included in various electronic devices.

1 is a cross-sectional view showing an organic EL device according to a first embodiment of the present invention. (A) is a partial enlarged cross-sectional view of the organic EL device of FIG. 1, and (B) is a partial enlarged cross-sectional view of another organic EL device for comparison. It is a figure which shows 1 process of the manufacturing method of the organic electroluminescent apparatus of FIG. FIG. 4 is a diagram showing a step subsequent to FIG. 3. It is a figure which shows the next process of FIG. It is a figure which shows the next process of FIG. It is a figure which shows the next process of FIG. It is a figure which shows the next process of FIG. It is a figure which shows the next process of FIG. FIG. 10 is a diagram showing a step subsequent to that in FIG. 9. FIG. 11 is a diagram showing a step subsequent to FIG. 10. FIG. 12 is a diagram showing a step subsequent to FIG. 11. FIG. 13 is a diagram showing a step subsequent to FIG. 12. It is a figure which shows the next process of FIG. It is sectional drawing in one process of manufacture of the other organic electroluminescent apparatus for a comparison. FIG. 16 is a diagram showing a step subsequent to that in FIG. 15. It is sectional drawing which shows the organic electroluminescent apparatus which concerns on the 2nd Embodiment of this invention. It is a partially expanded sectional view of another organic EL device for comparison. It is a perspective view which shows the external appearance of the personal computer which has the organic electroluminescent apparatus which concerns on this invention. It is a perspective view which shows the external appearance of the mobile telephone which has the organic electroluminescent apparatus which concerns on this invention. It is a perspective view which shows the external appearance of the portable information terminal which has the organic electroluminescent apparatus which concerns on this invention.

Explanation of symbols

  1, 2 organic EL devices, 10 substrates, 12 organic EL elements (light emitting elements), 32 TFTs (thin film transistors), 14 barrier ribs, 14a, 14c absorber-free layers, 14b absorber-containing layers, 16 pixel electrodes, 18 light emitting functions Layer (layer that contributes to light emission), 20 counter electrode.

Claims (5)

A substrate,
A plurality of light emitting elements formed on the substrate;
A partition formed on the substrate so as to separate the plurality of light emitting elements from each other,
The organic EL device, wherein the partition includes a layer containing an absorbent that absorbs at least one of moisture and oxygen and a layer not containing the absorbent.   2. The organic EL device according to claim 1, wherein a layer that does not contain the absorbent is disposed farthest from the substrate in the partition wall.   An electronic apparatus comprising the organic EL device according to claim 1. A method for producing the organic EL device according to claim 1,
Laminating a layer containing the absorbent and a layer not containing the absorbent to form the partition on the substrate;
Forming a plurality of the light emitting elements on the substrate. In the step of forming the partition wall, the layer not containing the absorbent is disposed farthest from the substrate,
The step of forming the light emitting element includes:
5. The method according to claim 4, further comprising supplying a liquid containing a material to be a layer contributing to light emission of the light emitting element to an area surrounded by the partition on the substrate.

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