JP2008298842A - Method for manufacturing substrate for display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate for display panel having a region partitioned by an electrode and a bulkhead inexpensively in a simple process without requiring a complicated manufacturing facility and manufacturing the substrate for display panel with less electric power consumption. <P>SOLUTION: This method for manufacturing the substrate 2 provided with the electrode 10a in the region 8 partitioned by the bulkhead 6 comprises a process 1 for adhering a conductive material 10 to an upper face 32a of a projecting part 32 of a mold having a projecting part 32 for forming the bulkhead 6, a process 2 for molding the bulkhead 6 by pressurizing a substrate material 10 by using the mold 30 with the conductive material 10 adhered on its upper face 32a of the projecting part 32, and a process 3 for releasing the mold 30 from the substrate material 10. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a display panel substrate having a region partitioned by electrodes and partition walls, and a display medium including the display panel substrate manufactured by the manufacturing method.

  In recent years, various display panels including an electrophoretic display panel and a liquid crystal display panel have become widespread, and a substrate for the display panel has been widely used. In many cases, the display panel substrate includes an electrode for applying a predetermined voltage or current to the inside of the substrate filled with a display liquid such as an electrophoretic ink or liquid crystal, a toner, or a light emitter. A partition for dividing the display portion into predetermined areas is provided.

Various proposals have been made so far for methods for manufacturing a substrate for a display panel having such a region partitioned by electrodes and partitions. Among them, for example, a substrate manufacturing method for forming a partition wall using etching, a substrate manufacturing method for forming a partition wall using an inkjet device, and a substrate manufacturing method for forming a partition wall using a stamper are proposed. (For example, refer to Patent Document 1).
JP 2001-343672 A

Of the methods for forming the partition walls described in Patent Document 1, when the partition walls are formed by etching, expensive equipment such as a coating apparatus and an exposure apparatus is required, and many manufacturing processes are required. The manufacturing cost is also high. Further, since etching is used, there is a problem of environmental pollution due to waste liquid.
In addition, when the partition is formed using the ink jet apparatus, it is necessary to discharge the liquid material from the ink jet apparatus and to cure while gradually depositing the liquid material. The manufacturing cost of the substrate is also expensive.
On the other hand, when the partition is formed using a stamper, the partition can be formed by pressing the partition material with a mold having unevenness, and therefore, compared with the above two methods, relatively few operations can be performed with simple equipment. A partition can be formed in time.

  However, in the case of forming the partition wall by any method, it is necessary to perform a process of providing an electrode before or after the process of forming the partition wall. In order to provide this electrode, it is necessary to perform a complicated process that requires expensive equipment such as vapor deposition and ion implantation. Therefore, in order to manufacture a display panel substrate having a region partitioned by electrodes and partition walls, any of the above manufacturing methods requires expensive and complicated manufacturing equipment, and a great amount of manufacturing time and Manufacturing cost is required.

Further, in order to perform display on the display panel, it is necessary to apply a voltage to the inside of the substrate filled with the display liquid or the like. To reduce the power consumption for this voltage application, the display panel, This is one of the important technical issues especially for portable display panels. In this case, in order to eliminate a voltage loss due to passing through a substrate or a partition which is an insulator, it is desirable to provide an electrode in a region inside the substrate filled with a display liquid or the like. However, in any of the above manufacturing methods, when an electrode is provided before the partition is formed, there is a high risk of damaging the electrode during the operation of providing the partition. Have difficulty. In addition, when an electrode is provided after a partition is formed, it is difficult to provide an electrode at the bottom of a very narrow region surrounded by the partition due to interference with the partition, and it is also difficult to provide an electrode in a region inside the substrate. It is.
Therefore, even if any of the manufacturing methods described in Patent Document 1 is adopted, it is difficult to provide an electrode in a region inside the substrate partitioned by a partition wall, and a display panel substrate with low power consumption is manufactured. It is difficult.

  Accordingly, an object of the present invention is to solve the above-mentioned problems, and to manufacture a display panel substrate having a region partitioned by electrodes and partition walls by a simple process without requiring complicated manufacturing equipment and at a low manufacturing cost. Another object of the present invention is to provide a method for manufacturing a display panel substrate that can manufacture a display panel substrate with low power consumption. Another object of the present invention is to provide a display medium including a display panel substrate manufactured by this manufacturing method.

In order to solve the above-described problem, an embodiment of a method for manufacturing a display panel substrate according to claim 1 of the present invention includes:
A method of manufacturing a substrate having an electrode in a region partitioned by a partition, wherein a conductive material is attached to an upper surface of the projection of a mold having a projection for forming the partition, and the projection A step 2 in which the partition material is formed by pressurizing the substrate material with the mold having the conductive material attached to the upper surface of the part; and a step 3 in which the mold is separated from the substrate material.

As a display panel to which the “display panel substrate” manufactured in this embodiment can be applied, for example, an electrophoretic display panel or a liquid crystal display panel can be exemplified, and an electrode is provided in a region partitioned by a partition wall. Any other display panel can be used as long as it is a display panel using the provided substrate.
In addition, as the “region partitioned by the partition wall”, a region partitioned for each pixel of the display panel can be considered, a region partitioned for a plurality of pixels can be considered, and any other depending on the application An area partitioned by a range is conceivable.
As the “substrate material”, for example, it is conceivable to use resin or glass, and any other material can be used as long as it has insulating properties and can be deformed by pressurization with a mold having a convex portion to form a partition wall. An organic material, an inorganic material, or an organic-inorganic composite material can be used. In addition, as the material of the “mold having a convex portion”, any organic material such as metal, resin, glass, and ceramic, an inorganic material, or an organic-inorganic composite material can be used.
As the “conductive material”, metals such as copper and silver, alloys and oxides thereof, and various other conductive materials such as carbon can be used. In addition, when the conductive material is attached by coating or the like, it is desirable to use a fluid conductive material in which metal fine powder such as metal paste or carbon fine powder is contained in a solvent. Note that when a display panel substrate is used on the display surface side, it is desirable to use a transparent material as the substrate material and the conductive material.

In the above step 1, as a method of attaching the conductive material to the upper surface of the convex portion, for example, as described later, the upper surface of the convex portion and the conductive material can be brought into contact with each other. With various coating devices, the conductive material can be applied directly to the upper surface of the convex portion, or the conductive material can be attached to the upper surface of the convex portion by vapor deposition or sputtering. Any attachment method can be employed. Note that the conductive material may be attached to the entire upper surface of the convex portion, or the conductive material may be attached to only a part of the upper surface of the convex portion. Alternatively, the conductive material may be attached to the upper surface of one convex portion in a plurality of locations.
Further, as an embodiment in which the partition wall is formed by pressurizing a mold having a convex portion, for example, when a thermoplastic resin or glass is used as the substrate material, the substrate material is heated to a pressure equal to or higher than the softening temperature. Thus, it is conceivable to form partition walls and then cool and harden the substrate material. In addition, as the substrate material, an ultraviolet curable resin, a thermosetting resin, or a soluble resin that dissolves in a solvent such as water may be used.

According to this embodiment, the partition material is formed by pressurizing the substrate material with a mold in which the conductive material is attached to the upper surface of the convex portion, and the conductive material is attached to the surface of the substrate in the region partitioned by the partition wall. Electrodes can be provided. Therefore, a complicated manufacturing facility is not required, and a display panel substrate having a region partitioned by electrodes and partition walls can be manufactured at a low manufacturing cost by a simple process. Further, since the electrode can be provided in a region inside the substrate partitioned by the partition wall (that is, a region filled with display liquid, liquid crystal, or the like), a display panel substrate with low power consumption can be provided.
In addition, the display panel substrate manufactured in this embodiment has a substrate part and a partition part integrally formed, so there is no fear that the substrate part and the partition part will be peeled off, and chemicals used for manufacturing, etc. Therefore, this embodiment is a manufacturing method suitable for environmental protection.

An embodiment of a method for manufacturing a display panel substrate according to claim 2 of the present invention is as follows:
In the step 1, the conductive material is adhered to the upper surface of the convex portion by bringing the upper surface of the convex portion into contact with the conductive material adhered to the upper surface of the flat plate.

According to this embodiment, a conductive material is attached to the upper surface of the flat plate, and the conductive material is attached to the upper surface of the convex portion by bringing the upper surface of the convex portion into contact with the conductive material attached to the upper surface of the flat plate. Can be made. Here, as a method of attaching the conductive material to the upper surface of the flat plate, for example, the conductive material can be attached by coating, or can be attached by vapor deposition or sputtering. In addition, as the material of the flat plate, any organic material such as silicon, glass, metal, and resin, inorganic material, or organic-inorganic composite material can be used.
According to this embodiment, the conductive material can be easily and reliably adhered to the upper surface of the convex portion of the mold without using a special device.

An embodiment of a method for manufacturing a display panel substrate according to claim 3 of the present invention is:
In the step 1, the upper surface of the convex portion is brought into contact with the conductive material attached to the upper surface of the flat plate having a surface energy lower than the surface energy of the upper surface of the convex portion.

Here, in the inside of the solid, the molecules are attracted to each other by the intermolecular force. However, on the surface of the solid, the half surface of the molecule is surrounded by different molecules, so that the energy is excessive. This excess energy is generally referred to as solid surface energy, but it can be said that the higher the surface energy, the greater the force that attracts objects attached to the surface.
In this embodiment, since the surface energy of the upper surface of the flat plate is lower than the surface energy of the upper surface of the convex portion of the mold, when the upper surface of the convex portion is brought into contact with the conductive material attached to the upper surface of the flat plate, the conductive material Can be reliably separated from the upper surface of the flat plate having a low surface energy and adhered to the upper surface of the convex portion of the mold having a high surface energy.

An embodiment of a method for manufacturing a display panel substrate according to claim 4 of the present invention is:
In the step 1, the upper surface of the convex portion is brought into contact with the conductive material attached to the upper surface of the flat plate through a layer of a release material.

  According to this embodiment, by providing a layer of a release material between the upper surface of the flat plate and the conductive material, the surface energy of the upper surface of the flat plate is reduced, so that the surface energy of the upper surface of the flat plate becomes the mold. It is possible to form a state lower than the surface energy of the upper surface of the convex portion. It should be noted that providing a release material layer between the upper surface of the flat plate and the conductive material means that, for example, a release material layer such as fluorine is provided on the upper surface of the flat plate by coating or the like, and the conductive material is provided thereon. On the other hand, it is also conceivable to bring a conductive material having a separator layer on the surface thereof into contact with the upper surface of the flat plate.

An embodiment of a method for manufacturing a display panel substrate according to claim 5 of the present invention is as follows:
In the step 1, the upper surface of the roughened convex portion is brought into contact with the conductive material attached to the upper surface of the flat plate.

According to the present embodiment, the surface energy of the upper surface of the convex portion of the mold is increased by roughening the upper surface of the convex portion of the mold, so that the surface energy of the upper surface of the flat plate becomes higher than that of the convex portion of the mold. A state lower than the surface energy of the upper surface can be formed. In addition, as a processing method for roughening the upper surface of the convex portion, for example, it can be physically roughened by blasting or pressing a fine uneven surface, or can be roughened by chemical treatment. In addition, any other roughening treatment can be performed.
The embodiment according to claim 5 in which the upper surface of the convex portion of the mold is roughened, and the release material layer is provided between the upper surface of the flat plate and the conductive material. In this case, the conductive material can be more reliably separated from the upper surface of the flat plate having a low surface energy and attached to the upper surface of the convex portion of the mold having a high surface energy.

An embodiment of a method for manufacturing a display panel substrate according to claim 6 of the present invention is:
In the step 2, the substrate material having a surface energy higher than the surface energy of the upper surface of the convex portion is pressed with the mold.

  In the present embodiment, since the surface energy of the substrate material is higher than the surface energy of the upper surface of the convex portion, when the substrate material is pressurized on the upper surface of the convex portion, the conductive material is surely made of the convex portion having a low surface energy. It can be detached from the top surface and attached to a substrate material having a high surface energy.

An embodiment of a method for manufacturing a display panel substrate according to claim 7 of the present invention is:
In the step 2, the substrate material is pressed with a mold in which the conductive material is attached to the upper surface of the convex portion through a layer of a release material.

According to this embodiment, the surface energy of the surface of the substrate material is reduced by reducing the surface energy of the upper surface of the mold protrusion by providing a release material layer between the upper surface of the mold protrusion and the conductive material. A state in which the energy is higher than the surface energy of the upper surface of the convex portion of the mold can be formed. Providing a release material layer between the upper surface of the convex portion of the mold and the conductive material may be, for example, providing a release material layer on the upper surface of the convex portion by application or the like, and attaching the conductive material thereon. However, any other method can be used.
The present embodiment according to claim 7 is provided with a layer of release material between the upper surface of the convex portion and the conductive material, and the present invention according to claim 7 is provided with a layer of release material between the upper surface of the flat plate and the conductive material. 4. In this case, the thickness of the release material layer or the type of the release material may be changed, or the upper surface of the convex portion of the mold may be roughened. By doing so, it is possible to form a state in which the surface energy of the upper surface of the flat plate is lower than the surface energy of the upper surface of the convex portion of the mold.

An embodiment of a method for manufacturing a display panel substrate according to claim 8 of the present invention is:
In the step 2, the substrate material whose surface is roughened is pressed with the mold.

According to this embodiment, the surface energy of the surface of the substrate material is increased by roughening the surface of the substrate material, and the surface energy of the substrate material is higher than the surface energy of the upper surface of the convex portion. Can be formed. As the processing method for roughening the surface of the substrate material, as described above, for example, physical roughening by blasting or pressing of a fine uneven surface, roughening by chemical treatment, or any other arbitrary The surface roughening treatment can be carried out by this method.
The present embodiment according to claim 8 for roughening the surface of the substrate material is carried out together with the embodiment according to claim 7 in which a release material layer is provided between the upper surface of the convex portion and the conductive material. In this case, the conductive material can be more reliably separated from the upper surface of the convex portion of the low surface energy type and attached to the surface of the substrate material having the high surface energy.
Further, the present embodiment according to claim 8 for roughening the surface of the substrate material may be carried out together with the embodiment according to claim 5 for roughening the upper surface of the convex portion of the mold. In this case, the surface energy of the surface of the substrate material is changed to that of the convex portion of the mold by changing the roughness to be roughened on both surfaces or by providing a release material layer on the upper surface of the convex portion of the mold. A state higher than the surface energy of the upper surface can be formed.

An embodiment of a method for manufacturing a display panel substrate according to claim 9 of the present invention is:
In the step 3, vibration is applied to at least one of the mold and the substrate material.

  According to this embodiment, by applying vibration to at least one of the mold and the substrate material, the mold can be released from the substrate material without damaging the substrate material. Further, a lubricant can be used in combination between the mold and the substrate material.

An embodiment of a method for manufacturing a display panel substrate according to claim 10 of the present invention is:
In the step 1, when viewed from the front, the conductive material is attached to the mold in which the convex portions are integrally connected. In the step 2, the conductive material is attached to the upper surface of the integrally connected convex portions. The substrate material is pressurized with a mold to which a conductive material is attached.

  According to the present embodiment, the partition wall is formed by pressurizing the substrate material and the conductive material is adhered to the surface of the substrate material by pressurizing the substrate material with a mold in which the upper surface of the integrally connected convex portions is adhered. Thus, an electrode can be provided in a region partitioned by the partition walls, and a connecting portion that can electrically connect the electrodes can be provided. Therefore, the electrode formed in this embodiment can function as a common electrode. In addition, the partition formed by this embodiment has a shape in which only a portion provided with a connecting portion between each electrode is cut out.

An embodiment of a method for manufacturing a display panel substrate according to claim 11 of the present invention is:
The method further includes a step 4 of forming a through hole having one opening at a position facing the convex portion in the substrate material, and a step 5 of filling the through hole with the conductive material.

In this embodiment, a through hole can be formed only at a position facing one convex part, or a through hole can be formed at a position facing all the convex parts, or a part of the convex parts can be opposed. It is also possible to make a through-hole at a position to be. Moreover, the process 4 which opens a through-hole, and the process 5 which fills a conductive material to a through-hole can also be performed before said process 1-process 3, and can also be performed after process 1-process 3, It can also be performed in the middle of steps 1 to 3.
According to this embodiment, each electrode provided in a region inside the substrate partitioned by the partition walls (that is, a region filled with display liquid, liquid crystal, or the like) is electrically connected to the outside (back side) of the substrate. Since they are connected, the voltage value applied to each electrode can be controlled to a desired value. Further, in the case of a common electrode in which electrodes are connected by a connecting portion, a desired voltage can be applied to the common electrode from the outside (back side) of the substrate using at least one through hole.

  An embodiment of a display medium according to a twelfth aspect of the present invention is a display medium including a display panel substrate manufactured by any one of the manufacturing methods described above.

  As described above, in the method for manufacturing a display panel substrate according to the present invention, a complicated manufacturing facility is not required, and a display panel substrate having a region partitioned by electrodes and partition walls can be manufactured at a low manufacturing cost by a simple process. Further, since the electrode can be provided in a region inside the substrate partitioned by the partition walls (that is, a region filled with display liquid or liquid crystal), a display panel substrate with low power consumption is provided. can do.

Embodiments of a method for manufacturing a display panel substrate according to the present invention will be described below in detail with reference to the drawings.
(Description of One Embodiment of Manufacturing Method of Display Panel Substrate)
First, an embodiment of a method for manufacturing a display panel substrate according to the present invention will be described with reference to FIG. Here, FIG. 1 is a cross-sectional view schematically showing each manufacturing process relating to a method for manufacturing a display panel substrate according to the present invention. In this embodiment, the case where a substrate used for an electrophoretic display panel or a liquid crystal display panel is manufactured is shown as an example, but the present invention is not limited to this.

<Description of step 1>
First, Step 1 is performed in which the conductive material 10 is attached to the upper surface 32a of the projection 32 using the mold 30 having the projection 32 for forming the partition 4a. This process 1 is shown to Fig.1 (a) and (b). First, as shown in FIG. 1A, the conductive material 10 is attached to the upper surface 20 a of the flat plate 20. In the present embodiment, a silicon plate is used as the flat plate 20, but the present invention is not limited to this, and flat plates made of various other materials such as a glass plate and a metal plate can be used.
Further, the upper surface 20a of the flat plate 20 to which the conductive material 10 adheres is coated with fluorine or coated with fluorine. The surface energy of the upper surface 20a can be reduced by a layer of a release material such as fluorine, and the attached conductive material 10 can be easily separated from the upper surface 20a. Further, by providing not only the fluorine layer as in the present embodiment but also any other release material layer, the surface energy of the upper surface 20a can be reduced.
In this embodiment, as the conductive material 10 attached to the upper surface 20a of the flat plate 20, a copper paste containing copper fine powder as a main component or a silver paste containing silver fine powder as a main component is used. However, the present invention is not limited to this, and any other material can be used as long as it has conductivity and can be solidified.

In the present embodiment, the conductive material 10 is deposited on the upper surface 20a of the flat plate 20 by vapor deposition, and the conductive material 10 having a uniform thickness is attached to the upper surface 20a of the flat plate 20. However, the method of attaching the conductive material 10 to the upper surface 20a of the flat plate 20 is not limited to this, and it is applied using a spray device or other application device according to the thickness of the conductive material 10 to be attached. It can also be deposited by sputtering or the like.
Here, as the thickness of the conductive material 10 to be attached to the upper surface 20a of the flat plate 20, the conductive material 10 having an arbitrary thickness can be attached depending on the thickness of the electrode 10a provided on the display panel substrate 2, as an example. A thickness of 50 nm to 300 nm can be exemplified.

Next, as shown in the left diagram of FIG. 1B, a mold 30 having a plurality of convex portions 32 is prepared so that the upper surface 32a of the convex portions 32 and the upper surface 20a of the flat plate 20 face each other. The mold 30 and the flat plate 20 are disposed. Then, the conductive material 10 is attached to the upper surface 32 a of the convex portion 32 by bringing the upper surface 32 a of the convex portion 32 into contact with the conductive material 10 attached to the upper surface 20 a of the flat plate 20. Next, as shown in the right diagram of FIG. 1B, the mold 30 and the flat plate 20 are separated to obtain the mold 30 in which the conductive material 10 adheres to the upper surface 32 a of the convex portion 32.
In the present embodiment, a mold made of a metal material is used as the mold 30, but the present invention is not limited to this, and a mold made of any other material including resin, ceramic, and glass can be used. The optimum material can be determined in consideration of conditions, temperature conditions, corrosion resistance conditions, dimensional accuracy, and the like. Although only a part of the convex portions 32 is shown in FIG. 1, in the present embodiment, a large number of convex portions 32 are arranged in a matrix at predetermined intervals in the mold 30. As a dimension of the convex part 32, although arbitrary magnitude | sizes can be set according to a use, if the example is given, a bottom face will be a square of 50 micrometers-500 micrometers of one side, and height is 5 micrometers-50 micrometers. A rectangular parallelepiped-shaped convex part can be illustrated.

  As described above, in the present embodiment, since a layer of a release material such as fluorine exists between the upper surface 20a of the flat plate 20 and the attached conductive material 10, the surface energy of the upper surface 20a is determined by the mold. It is lower than the surface energy of the upper surface 32a of the 30 convex portions 32. Therefore, by bringing the upper surface 32a of the convex portion 32 of the mold 30 into contact with the conductive material 10 attached to the upper surface 20a of the flat plate 20, the conductive material 10 is separated from the upper surface 20a of the flat plate 20, and It can be attached to the upper surface 32a.

The means for making the surface energy of the upper surface 20a of the flat plate 20 lower than the surface energy of the upper surface 32a of the convex portion 32 of the mold 30 is not limited to the means for providing the release material layer as described above. For example, it can also be realized by depositing the conductive material 10 on the upper surface 20a of the flat plate 20 with weak adhesion by weak vapor deposition or sputtering.
Specifically, when vapor deposition is performed, weak vapor deposition can be realized by reducing the degree of vacuum or changing the concentration of gas to be filled. In addition, when using a magnetron sputtering apparatus, weak sputtering can be realized by reducing the RF power.

In addition to reducing the surface energy of the upper surface 20a of the flat plate 20 as in the present embodiment, conversely, by increasing the surface energy of the upper surface 32a of the convex portion 32 of the mold 30, the upper surface of the flat plate 20 is increased. A state in which the surface energy of 20a is lower than the surface energy of the upper surface 32a of the convex portion 32 of the mold 30 can also be formed. As one method for increasing the surface energy of the upper surface 32a of the convex portion 32, it is conceivable to roughen the upper surface 32a of the convex portion 32 of the mold 30. Specifically, the surface can be physically roughened by blasting or pressing on a fine uneven surface, or can be roughened by chemical treatment, or any other roughening treatment can be performed. Can do.
Furthermore, the surface energy of the upper surface 32a can be increased by increasing the temperature of the upper surface 32a of the convex portion 32 of the mold 30.

  In this embodiment, the conductive material 10 is attached to the upper surface 32a of the convex portion 32 by bringing the upper surface 32a of the convex portion 32 of the mold 30 into contact with the conductive material 10, but the present invention is not limited to this. For example, the conductive material 10 can be directly attached to the upper surface 32a of the convex portion 32 of the mold 30 by spraying or vapor deposition. In this case, it is preferable to mask the region other than the upper surface 32a of the convex portion 32.

<Description of step 2>
Subsequent to the above step 1, step 2 is performed in which the substrate material 4 is pressed with a mold 30 in which the conductive material 10 is adhered to the upper surface 32a of the convex portion 32 to form the partition 4a.
Here, as shown in the left diagram of FIG. 1C, the substrate material 4 is prepared, and the mold 30 and the substrate material are arranged so that the upper surface 32a of the convex portion 32 and the upper surface 4a of the substrate material 4 face each other. 4 is arranged. In this embodiment, a PEN (polyethylene naphthalate) film excellent in heat resistance and insulation is used as the substrate material 4, but other resin films such as a PES (polyethersulfone) film, and others A film member or a flat plate member made of an organic, inorganic, or organic-inorganic composite material can be used.
Next, heating is performed until the substrate material 4 made of this PEN film is softened. As shown in the right figure of FIG. 1C, the substrate material is made of the mold 30 in which the conductive material 10 is attached to the upper surface 32a of the convex portion 32. 4 is pressed downward to form the substrate 4 having the partition walls 6, and at the same time, the conductive material 10 is deposited on the surface of the substrate 4 partitioned by the partition walls 6.

<Description of step 3>
Subsequent to step 2 described above, step 3 is performed to separate the mold 30 from the substrate material 4. Specifically, as indicated by an arrow in FIG. 1D, the mold 30 is lifted upward and released from the substrate material 4, thereby dividing the region 8 defined by the partition wall 6 and the partition wall 6. An electrode 10 a can be provided on the surface 4 a of the substrate 4 inside the region 8. When releasing the mold 30 from the substrate material 4, for example, by applying vibration to at least one of the mold 30 and the substrate material 4, the substrate material 4 can be easily released without being damaged. It is also conceivable to release the mold smoothly by applying a lubricant or the like to the side surface of the convex portion 32 of the mold 30.
In addition, about the time which the board | substrate material 4 is cooled and hardened, and the time which hardens the electrically-conductive material 10 which comprises the electrode 10a, after forming the partition 6 in said process 2, it is before releasing in process 3. It can also be cured, or it can be cured after being released in step 3.

In the present embodiment, the surface 4a of the substrate material 4 is roughened, whereby the surface energy of the surface 4a of the substrate material 4 can be increased. In the present embodiment, the surface roughening treatment of the surface 4a of the substrate material 4 is performed using a blasting device, but is not limited to this. The surface can be roughened by chemical treatment, or any other roughening treatment can be performed.
By roughening the surface 4a of the substrate material 4, the surface energy of the surface 4a of the substrate material 4 can be higher than the surface energy of the upper surface 32a of the convex portion 32 of the mold 30. When the mold is released from the substrate material 4, the conductive material 10 can be separated from the upper surface 32 a of the convex portion 32 of the mold 30 and can be held on the surface 4 a of the substrate material 4.

However, the means for forming a state in which the surface energy of the surface 4a of the substrate material 4 is higher than the surface energy of the upper surface 32a of the convex portion 32 of the mold 30 is roughened on the surface 4a of the substrate material 4 as in this embodiment. In addition, for example, by providing a layer of a release material such as fluorine between the upper surface 32a of the convex portion 32 and the attached substrate material 10, the surface energy of the upper surface 32a of the convex portion 32 of the mold 30 is reduced. It can also be realized. Moreover, the surface energy of the upper surface 32a of the convex part 32 of the mold 30 is reduced by depositing the conductive material 10 on the upper surface 32a of the convex part 32 of the mold 30 using weak vapor deposition or sputtering. It can also be realized.
Furthermore, the surface energy of the surface 4a of the substrate material 4 can be increased by increasing the temperature of the substrate material 4.

As described above, the display panel substrate 2 in which a large number of regions 8 partitioned by the partition walls 6 are arranged in a matrix and the electrodes 10 are provided on the surface 4a of the substrate 4 inside each region 8 is manufactured. Can do. The size of the region 8 partitioned by the partition wall 6 formed in this way is, for example, partitioned by the partition wall 4a having a square bottom surface with a side of 50 μm to 500 μm and a height of 5 μm to 50 μm. The case can be exemplified, and as the thickness dimension of the electrode 10 provided on the surface 4a of the substrate 4 inside the region 8, for example, 50 nm to 300 nm can be exemplified.
As described above, in the present embodiment, there is no need for complicated manufacturing equipment, and the display panel substrate 4 having the region 8 defined by the electrodes 10 and the partition walls 6 is manufactured at a low manufacturing cost by a simple process. Can do. In particular, since the electrode 10 can be provided in the region 8 inside the substrate partitioned by the partition walls 6 (that is, the region filled with display liquid, liquid crystal, etc.), the voltage loss due to the substrate material 4 does not occur, and the inside of the substrate Thus, a display panel substrate 2 with low power consumption can be provided.
In the case where transparent materials are used as the substrate material 4 and the conductive material 10, a transparent substrate having a transparent electrode 10a can be obtained, which is suitable for use on the display surface side of the display panel.

(Description of Other Embodiment of Method for Manufacturing Display Panel Substrate Part 1)
Next, another embodiment of the method for manufacturing a display panel substrate according to the present invention will be described with reference to FIGS. In this embodiment, a display panel substrate having a common electrode can be manufactured. Here, the left figure of FIG. 2 is the top view which looked at the type | mold 30 which pressurizes the substrate material 4 from the front. If it demonstrates in detail, it is the figure seen from the upper surface 32a side of the convex part 32 of the type | mold 30, and shows the area | region where the colored part of FIG. 2 protrudes. Moreover, the right figure of FIG. 2 is the side view seen from the direction of arrow A of the left figure of FIG.
3 is a plan view of the display panel substrate 2 manufactured using the mold 30 as viewed from the front. The colored portion in FIG. 3 shows the partition wall 6, and the blank area is partitioned by the partition wall 6. The region 8, the electrode 10a, and the connecting portion 10b are shown. Moreover, the right figure of FIG. 3 is the side view seen from the direction of arrow B of the left figure of FIG.

  In the mold 30 of the present embodiment, convex portions 32 having the same shape as the mold 30 shown in FIG. 1 are arranged in a matrix, and further, a connecting convex portion 34 that connects the adjacent convex portions 32 and the convex portions 32 is provided. Is provided. Moreover, as shown in the right figure of FIG. 2, the height of the convex part 32 and the connection convex part 34 is the same height. 2 and 3 show only a small part of the mold 30 and the substrate material 4.

Using the mold 30 having the connecting convex portion 34, first, in Step 1, the conductive material 10 is attached to the upper surface 32 a of the convex portion 32 of the mold 30 and the upper surface 34 a of the connecting convex portion 34. Next, in step 2, the substrate material 4 is pressed with a mold 30 in which the conductive material 10 adheres to the upper surface 32 a of the convex portion 32 and the upper surface 34 a of the connecting convex portion 34 to form the partition wall 6. The conductive material 10 on the upper surface 32 a and the upper surface 34 a of the connecting projection 34 is attached to the surface 4 a of the substrate material 4. Then, in step 3, the mold 30 is released from the substrate material 4, whereby the regions 8 partitioned by the partition walls 6 as shown in the left diagram of FIG. It is possible to manufacture the display panel substrate 2 in which the electrode 10a is disposed on the surface 4a of the substrate 4 and the adjacent electrodes 10a are electrically connected by the connecting portion 10b made of the conductive material 10. As is clear from the left diagram of FIG. 3, the partition wall 6 has a shape that is cut out in a region through which the connecting portion 4 passes.
Due to the structure as described above, in this embodiment, the electrodes 10a electrically connected to each other by the connecting portion 10b can be used as a common electrode of the display panel. Note that by using a transparent material as the substrate material 4 or the conductive material 10, it can be used as a substrate on the display surface side of the display panel.

(Description of Other Embodiment of Method for Manufacturing Display Panel Substrate Part 2)
Next, another embodiment of the method for manufacturing a display panel substrate according to the present invention will be described with reference to FIG. According to the present embodiment, it is possible to provide an electrical route (hereinafter referred to as “lead wiring”) that can supply power to the electrode disposed inside the substrate partitioned by the partition walls from the back side of the substrate. Here, FIG. 4 is a cross-sectional view schematically showing each manufacturing process for providing a lead wiring capable of supplying power to the electrode.
First, as shown in the above step 2, the substrate material 4 is pressed with the mold 30 in which the conductive material 10 adheres to the upper surface 32a of the convex portion 32 to form the substrate 4 having the partition walls 6. A state is formed in which the conductive material 10 is adhered on the surface 4 a of the partitioned substrate 4. In this state, as shown by an arrow in FIG. 4A, from the back side of the substrate 4 (opposite the surface on which the electrode 10a is provided) at a position facing the center of the convex portion 32, Step 4 of opening the through hole 40 by irradiating a laser pulse is performed. 4 (a) shows the same state as the right diagram of FIG. 1 (c), but since the through hole is formed from the back side of the substrate 4, the upper and lower sides are compared with the right diagram of FIG. 1 (c). The reverse is shown.

After the through hole 40 is formed in step 4, the lead electrically connected to the electrode 10a from the back side of the substrate material 4 by filling the inside of the through hole 40 with the liquid conductive material 10 using an ink jet apparatus. Step 5 of forming the wiring 42 is performed. Further, it is desirable that the conductive material 10 filling the inside of the through hole 40 is slightly raised from the back surface of the substrate material 4 to form the contact 42a. The amount of the conductive material 10 to be raised can be exemplified by about 1 μm, for example, but is not limited to this, and can be arbitrarily determined according to the application.
As described above, in the present embodiment, a desired voltage can be applied to the electrode 10a inside the substrate from the back side of the display panel substrate 2 using the lead wiring 42 and the contact 42a. When the lead wiring 42 is provided on the electrode 10a in each region 8 partitioned by the partition 6, a different voltage can be applied to the electrode 10a in each region 8. In the case of the common electrode having the connecting portion 10b as shown in FIG. 3, the lead wiring 42 may be provided in at least one electrode 10a.

In the present embodiment, as shown in FIG. 4C, a step 6 of attaching the TFT substrate 12 to the back side of the display panel substrate 2 manufactured in the step 5 is performed. More specifically, the TFT substrate 12 is placed on the back side of the substrate material 4 so that the contacts of the TFTs arranged on the TFT substrate are electrically connected to the contacts 42a arranged on the back side of the substrate material 4. Paste to. As described above, by using the display panel substrate 2 to which the TFT substrate 12 is attached, for example, image display control of an electrophoretic display panel or a liquid crystal display panel by an active matrix method can be realized.
In the above embodiment, the through hole 40 is formed after pressurizing the substrate material 4 with the mold 30. However, the present invention is not limited to this, and before the substrate material 4 is pressurized with the mold 30, the substrate is previously formed. A through hole 40 may be formed in the material 4. In this embodiment, the through hole 40 is formed before the mold 30 is released from the substrate material 4. However, the present invention is not limited to this, and the substrate 30 is released after the mold 30 is released from the substrate material 4. A through hole 40 may be formed in the material 4.

(Description of other embodiments according to the present invention)
By using the display panel substrate manufactured by the manufacturing method of the present invention, various display media with low power consumption such as an electrophoretic display panel and a liquid crystal display panel can be provided. In particular, in electronic paper using an electrophoretic display panel or the like, reducing power consumption is one of the most important technical issues, and a display panel substrate manufactured by the manufacturing method according to the present invention is used. Has a great effect on solving this technical problem.
In addition, the display panel substrate manufacturing method according to the present invention, and the display medium including the display panel substrate manufactured by the manufacturing method are not limited to the above-described embodiments, but may be various other types. Embodiments are included in the present invention.

It is sectional drawing which shows typically each manufacturing process of one Embodiment of the manufacturing method of the board | substrate for display panels which concerns on this invention. It is a figure which shows typically the structure of the type | mold used for other embodiment of the manufacturing method of the board | substrate for display panels which concerns on this invention, and the structure of the board | substrate manufactured using this type | mold. It is other embodiment of the manufacturing method of the board | substrate for display panels which concerns on this invention, Comprising: It is sectional drawing which shows typically each manufacturing process for providing the lead wiring which can be electrically fed from the back side of a board | substrate to the electrode inside a board | substrate. is there. It is sectional drawing which shows typically each manufacturing process of other embodiment of the manufacturing method of the board | substrate for display panels which concerns on this invention.

Explanation of symbols

2 Display panel substrate 4 Substrate material 4a Surface 6 Partition 8 Region 10 partitioned by partition 6 Conductive material 10a Electrode 10b Connecting portion 12 TFT substrate 20 Planar plate 20a Upper surface 30 Mold 32 Convex portion 32a Upper surface 34 Connecting convex portion 34a Upper surface 40 Through hole 42 Lead wiring 42a Contact

Claims (12)

A method of manufacturing a substrate having electrodes in a region partitioned by a partition wall,
A step 1 of attaching a conductive material to the upper surface of the convex part of the mold having the convex part for forming the partition;
A step 2 of forming the partition wall by pressurizing a substrate material with the mold having the conductive material attached to the upper surface of the convex portion;
Separating the mold from the substrate material 3;
A method of manufacturing a display panel substrate, comprising: In the step 1,
The display panel substrate according to claim 1, wherein the conductive material is attached to the upper surface of the convex portion by bringing the upper surface of the convex portion into contact with the conductive material attached to the upper surface of the flat plate. How to manufacture. In the step 1,
3. The display panel according to claim 2, wherein the upper surface of the convex portion is brought into contact with the conductive material attached to the upper surface of the flat plate having a surface energy lower than the surface energy of the upper surface of the convex portion. A method of manufacturing a substrate. In the step 1,
4. The method for manufacturing a display panel substrate according to claim 3, wherein the upper surface of the convex portion is brought into contact with the conductive material attached to the upper surface of the flat plate through a layer of a release material. In the step 1,
The method for manufacturing a display panel substrate according to claim 3 or 4, wherein the upper surface of the roughened convex portion is brought into contact with the conductive material attached to the upper surface of the flat plate. In step 2,
6. The display panel substrate according to claim 1, wherein the substrate material having a surface energy higher than the surface energy of the upper surface of the convex portion is pressed with the mold. Method. In step 2,
The method for manufacturing a display panel substrate according to claim 6, wherein the substrate material is pressed with a mold in which the conductive material is attached to the upper surface of the convex portion through a layer of a release material. The method for manufacturing a display panel substrate according to claim 6 or 7, wherein the substrate material whose surface is roughened is pressed with the mold in the step (2). In the step 3,
The method for manufacturing a display panel substrate according to any one of claims 1 to 8, wherein vibration is applied to at least one of the mold and the substrate material. In the step 1,
The conductive material is attached to the mold in which the convex portions are integrally connected when viewed from the front,
In step 2,
10. The display panel substrate according to claim 1, wherein the substrate material is pressed with a mold in which the conductive material is attached to the upper surface of the integrally connected convex portions. 11. How to manufacture. Step 4 in which the substrate material is provided with a through-hole provided with one opening at a position facing the convex portion;
The method for manufacturing a display panel substrate according to claim 1, further comprising a step 5 of filling the through hole with the conductive material.   A display medium comprising a display panel substrate manufactured by the manufacturing method according to claim 1.

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