JP2008298205A - Vacuum sealing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive vacuum sealing device for improving a yield, by restraining the deterioration in an optical signal, by accurately arranging a relative distance or a relative angle of a lens system and a device in a desired value, even if deformation is caused in a part for forming an airtight sealing space by vacuum sealing. <P>SOLUTION: In a vacuum sealing device for airtightly sealing a hollow part 2 formed by joining a lid 10 having an optical element 11 and a package having a diamond touch surface 4 mounted with the device 3 in a vacuum state, a deformation restraining member for restraining deformation of the lid 10 is arranged in the hollow part 2. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a vacuum sealing apparatus for vacuum-sealing electronic device components mounted therein by a lid and a package having optical elements.

  In recent years, by adding optical functions such as lenses and mirrors to chips or substrates mounted on optical products such as optical communication devices and microscopes, the number of parts used, product size reduction, or high functionality can be achieved. Development with the goal of making it happen is actively underway. These devices often require hermetic sealing with an inert gas or vacuum hermetic sealing in order to effectively exhibit their functions and to ensure reliability. Optical window and condenser lens, etc. that can input and output optical signals to lid parts for forming hermetic space, because the optically sealed device has an optical function. The optical element is required.

In such a hermetic sealing device, Patent Document 1 discloses a technique in which an optical element is provided on a lid to form a vacuum space. With reference to FIG. 9, the technique of Patent Document 1 will be briefly described.
The upper structure 106 of the hermetic container holding the lens system 105 and the lower structure 119 of the hermetic structure on which the infrared imaging element 101 as a device is mounted are combined at the abutting portion 121 of the upper structure and the lower structure of the hermetic container, The upper structure 106 of the container and the lower structure 119 of the airtight structure are joined by laser welding or vacuum hermetic sealing with a brazing material containing solder. The infrared imaging component (infrared imaging element 101) can be miniaturized by mounting necessary components in a space formed by the upper structure 106 of the hermetic container and the lower structure 119 of the hermetic structure. Positioning can be performed without adjusting the height of the lens system 105 with the dimensions of the upper structure 106 of the hermetic container, so that the step of adjusting the distance between the infrared imaging element 101 and the lens system 105 can be omitted, and the cost can be reduced. Can be reduced.

In this way, a component that holds the focusing lens (an upper structure 106 of the airtight container that holds the lens system 105) and a component on which the infrared imaging element is mounted (the lower part of the airtight structure on which the infrared imaging element 101 is mounted). In the structure in which the structure 119) is combined and the inner space is hermetically sealed in a vacuum, miniaturization and simplification of adjustment are achieved, and a product is provided at low cost.
JP 2000-162036 A

  The space formed by the upper structure 106 of the hermetic container and the lower structure 119 of the hermetic container is joined only by the butting portion 121 of the upper structure of the hermetic container and the lower structure. Since these parts are hermetically sealed in a vacuum atmosphere, the rigidity of the upper structure 106 of the hermetic container or the lower structure 119 of the hermetic structure is not sufficiently ensured, for example, the thickness of the parts is thin. In this case, there is a possibility that it is deformed inwardly by being pressed by atmospheric pressure.

When the parts of the upper structure 106 of the hermetic container or the lower structure 119 of the hermetic structure are deformed by atmospheric pressure, the relative distance or relative angle between the lens system 105 and the infrared imaging element 101 held by each changes, It becomes difficult to accurately arrange the distance or angle between the lens system 105 and the infrared imaging element 101 as designed. Therefore, it is difficult to connect a desired optical image to the infrared imaging device 101, and there is a possibility that the image quality is deteriorated. The present invention has been made paying attention to this point, and is hermetically sealed by vacuum sealing. Even if the parts forming the stop space are deformed, the relative distance or relative angle between the lens system and the device is accurately set to a desired value, so that optical signal deterioration is suppressed, yield is improved, and inexpensive vacuum sealing is performed. It aims at providing a stop device.

  In order to achieve the object, the present invention provides a package having an optical element that transmits light, a lid having a frame body that holds the optical element, and a die attach surface on which the device is mounted and that faces the optical element and the frame body In a vacuum sealing device that hermetically seals the lid and the hollow portion formed in the package by joining the lid and the package, when the lid and the package are joined, There is provided a vacuum sealing device comprising: a deformation suppressing member that is disposed in the hollow portion and suppresses deformation of the lid.

  According to the present invention, even if a part forming the hermetic sealing space is deformed by vacuum sealing, the relative distance or relative angle between the lens system and the device is accurately set to a desired value, so that the optical signal Deterioration can be suppressed, yield can be improved, and an inexpensive vacuum sealing device can be provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The first embodiment will be described with reference to FIGS. 1 to 4.
FIG. 1 is a diagram illustrating a configuration of a vacuum sealing device according to the first embodiment. FIG. 2 is a view of FIG. 1 as viewed from the line AA. FIG. 3 is a diagram showing a configuration of a vacuum chamber having a vacuum sealing device. FIG. 4 is a diagram showing the configuration of the vacuum sealing device after sealing. In FIG. 2, the bonding material 9 is not shown.

  As shown in FIG. 1, the vacuum sealing device includes a package 1 and a lid 10. The package 1 and the lid 10 are positioned at positions facing each other, and are sealed and bonded through the bonding material 9. Here, metal films 8 and 12 are respectively formed on the package 1 and the lid 10 in order to melt the bonding material 9 and form an alloy. When the package 1 and the lid 10 are bonded, the bonding material 9 is melted by the metal films 8 and 12 to form an alloy, whereby the package 1 and the lid 10 are bonded. The metal film 8 is formed only on the upper surface 1a of the package 1, and the metal film 12 is formed only on the contact surface 22 facing the upper surface 1a.

  As the bonding material 9, for example, a soft solder material such as gold-tin solder, SnAgCu, SnZn, SnBi, or SnIn solder can be used. The metal films 8 and 12 are made of the same material and can be formed by melting the bonding material 9 by heating to form an alloy, such as a gold plating film provided on the Ni plating film. The metal films 8 and 12 may be of any composition that can form an alloy with solder. For example, Ni / Au formed by plating or sputtering (the side in contact with the bonding material 8 is Au, package 1 or lid). Ni) film can be used on the side contacting 10.

  As shown in FIGS. 1 and 2, a hollow portion (cavity) 2 in which the device 3 can be mounted (built in) is provided inside the package 1. The device 3 is provided in the cavity 2 and is mounted on a substantially central portion of a die attach surface 4 facing an optical element 11 and a frame body 10a described later by a bonding material (not shown). The central portion 3a of the device 3 is preferably located on the optical axis 11a.

  Further, in the cavity 2, a pad 6 is provided for electrical connection with the outside (non-sealed side) of the package 1. Further, the pad 6 is electrically connected with the pad 6 on the outside of the package 1. A lead 5 is provided. As a result, the outside and inside of the package 1 can perform electrical I / O. The device 3 is electrically connected to the pad 6 by a wire bond 7, and further connected to an electric circuit (not shown) provided outside the vacuum sealing device via a lead 5. With such a configuration, the device 3 can be driven by supplying power to the device 3 in the package 1.

  In the cavity 2, the die attach surface 4 is provided with a deformation suppressing member 13 that suppresses deformation of the lid 10 due to pressure described later when the lid 10 is joined to the package 1. When the lid 10 is deformed, the deformation suppressing member 13 has a length that makes contact with the contact surface 22 that is a surface facing in the direction of the optical axis 11a. The deformation suppressing member 13 has a length that allows the optical element 11 to be installed at a desired height from the die attach surface 4 along the optical axis 11a with respect to the die attach surface 4 when the lid 10 is deformed. ing. As described above, the deformation suppressing member 13 has a length for positioning the height of the lid 10 so that the relative distance between the device 3 and the optical element 11 becomes a desired value.

  The outer shape of the deformation suppressing member 13 is preferably a shape similar to the outer shape of the lid 10 (frame body 10a) or the outer shape of the optical element 11 (the outer shape is the same and the magnification is different). Therefore, the deformation suppressing member 13 of the present embodiment has, for example, a cylindrical shape. A contact surface (first contact surface) 15 at the distal end portion 14 of the deformation suppressing member 13 is parallel to the die attach surface 4 and contacts the contact surface 22 described above. Thus, the deformation suppressing member 13 disposed on the die attach surface 4 has the contact surface 15 that faces the contact surface 22 and contacts the contact surface 22 at the distal end portion 14.

  In the present embodiment, a plurality of deformation suppressing members 13 are arranged, and are arranged at equal intervals on the circumference (concentric circle) around the optical axis 11a (center portion 3a of the device 3). As shown in FIG. 2, for example, three deformation suppressing members 13 are preferably arranged at approximately 120 ° intervals.

  As shown in FIG. 1, the lid 10 is disposed at a position facing the package 1 on the opening 2 a side of the cavity 2. The lid 10 has an optical element 11 composed of a transparent member for transmitting and condensing light having a desired wavelength on the device 3. More specifically, the lid 10 is provided with a frame 10a having an opening 10b that transmits light to the device. The optical element 11 is held by the frame body 10a above the opening 10b. The frame body 10a is provided with a contact surface 22 with which the contact surface 15 contacts. Thus, the deformation suppressing member 13 (contact surface 15) contacts the lid 10 (frame body 10a).

  The device 3 described above is mounted below the optical element 11 and the opening 10b and on the die attach surface 4. The lid 10 includes the optical element 11 so that the optical axis 11 a of the optical element 11 is perpendicular to the contact surface 22 when the lid 10 abuts on the package 1. Further, when the lid 10 is disposed at a position facing the package 1, the optical element 11 is disposed at a position facing the device 3.

  As shown in FIG. 3, the vacuum sealing device (the package 1 and the lid 10 bonded by the bonding material 9) is accommodated in the vacuum chamber 16. The vacuum chamber 16 includes a stage 17 on which the package 1 held by a clamper (not shown) is placed, a heater tool 18 that is disposed above and below the lid 10, and a heater that holds the heater tool 18 in an up and down manner. The tool driving mechanism 19 is configured.

  The lid 10 disposed above the package 1 is held so as to be movable up and down to a desired position facing the package 1 by a positioning mechanism (not shown). In addition, when the lid 10 and the package 1 are bonded, the heater tool 18 can raise the temperature to a desired temperature at which the bonding material 9 can be melted on the upper portion of the lid 10 (the side where the optical element 11 is provided). 10 can be contacted so as to apply a desired load.

The vacuum chamber 16 includes an exhaust mechanism 20 and a pressure adjustment mechanism 21. The exhaust mechanism 20 adjusts the internal pressure of the vacuum chamber 16 to a desired reduced-pressure atmosphere (for example, a vacuum state having a pressure lower than the atmospheric pressure). The pressure adjusting mechanism 21 adjusts the internal pressure of the vacuum chamber 16 in a state where an inert gas (for example, N ₂ ) is allowed to flow into the vacuum chamber 16 and the inert gas is filled.

  The electrical connection between the device 3 and an electric circuit (not shown) is not limited to the use of the wire bond 7 or the lead 5, and may be connected by Philip chip mounting or PGA (pin grid array). .

  The bonding method of the package 1 and the lid 10 is not limited to the bonding material 9 using a soft brazing material, and seam welding, laser welding, or the like may be used.

  The number of deformation suppressing members 13 is not limited to three, but may be one or more.

  The optical element 11 may be a glass window or the like that does not have a light collecting function.

  The cavity 2 is provided in the package 1, but may be provided in the lid 10, or may be provided in both the package 1 and the lid 10. Thus, the cavity 2 may be a space that is formed (internally sealed) by the package 1 and the lid 10 when the package 1 and the lid 10 are bonded by the bonding material 9. At that time, the deformation suppressing member 13 may be disposed in the cavity 2 in at least one of the package 1 and the lid 10.

  The deformation suppressing member 13 is disposed in the package 1, but may be disposed in the lid 10 (for example, the frame body 10 b), or may be disposed in both the package 1 and the lid 10. The deformation suppressing member 13 disposed on the lid 10 has a length that makes contact with the die attach surface 4 that is a surface facing in the direction of the optical axis 11a. Further, the contact surface (second contact surface) 15 at the distal end portion 14 of the deformation suppressing member 13 is parallel to the die attach surface 4 and contacts the die attach surface 4. In this way, the deformation suppressing member 13 disposed on the lid 10 has a contact surface 15 that faces the die attach surface 4 at the distal end portion 14 and contacts the die attach surface 4.

  The bonding material 9 does not necessarily have to be provided on the metal film 8 in advance, and may be placed on the metal film 8 individually, or on the metal film 12 formed on the lid 10 in advance. It may be provided.

Next, the operation method of this embodiment will be described.
(Step 1)
The package 1 having the bonding material 9 is carried into the vacuum chamber 16 from a take-out port (not shown) and placed on the stage 17. At that time, the package 1 is held by a clamper (not shown).

(Step 2)
Similarly, the lid 10 is carried into the vacuum chamber 16 and held at a desired position facing the package 1 by a positioning mechanism (not shown).

(Step 3)
After the take-out port (not shown) of the vacuum chamber 16 is closed, the exhaust mechanism 20 exhausts the atmosphere in the vacuum chamber 16. Further, the pressure adjusting mechanism 21 allows an inert gas to flow into the vacuum chamber 16 and adjusts the internal pressure in the vacuum chamber 16 to a desired reduced pressure atmosphere.

(Step 4)
After the internal pressure of the vacuum chamber 16 reaches a desired reduced pressure atmosphere, the lid 10 is positioned at a desired position with respect to the package 1 by a positioning mechanism (not shown). As a result, the metal film 12 comes into contact with the bonding material 9, and the internal pressure of the cavity 2 formed by the package 1 and the lid 10 becomes equal to the internal pressure of the vacuum chamber 16.

(Step 5)
The heater tool drive mechanism 19 lowers the heater tool 18 and brings the heater tool 18 into contact with the lid 10. The heater tool drive mechanism 19 applies a desired load to the lid 10 by pressing the heater tool 18.

(Step 6)
The heater tool 18 generates heat toward the lid 10. The heat generated by the heater tool 18 heats the lid 10 by conduction and radiation. Furthermore, this heat heats and melts the bonding material 9 in contact with the lid 10 (metal film 12).

(Step 7)
After the bonding material 9 is heated and melted at a desired temperature, the bonding material 9 forms an alloy with the metal film 8 and the metal film 12. Thereby, the package 1 and the lid 10 are joined, and the heater tool 18 ends the heating operation. Thereafter, the molten bonding material 9 is cooled to a desired temperature for a desired time and solidified.
The bonding material 9 forms an alloy with the metal film 8 and the metal film 12, and the package 1 and the lid 10 are bonded to each other, so that the cavity 2 formed by the package 1 and the lid 10 has a desired reduced-pressure atmosphere (for example, a vacuum state). And hermetically sealed.

(Step 8)
After the bonding material 9 is cooled and solidified, the heater tool drive mechanism 19 raises the heater tool 18.

(Step 9)
The pressure adjustment mechanism 21 adjusts the pressure inside the vacuum chamber 16 to atmospheric pressure. The internal pressure of the cavity 2 formed by the package 1 and the lid 10 is a desired reduced-pressure atmosphere in Step 3 or Step 7, but the external pressure becomes atmospheric pressure. Therefore, the package 1 and the lid 10 are pressed by the atmospheric pressure corresponding to the differential pressure between the external pressure and the internal pressure.

(Step 10)
At that time, the lid 10 is pressed by the atmospheric pressure as shown in FIG. 4 and is deformed inward (package 1 side). The deformed lid 10 abuts against the abutment surface 15, and the deformation amount (distortion) is suppressed by the deformation suppressing member 13. That is, the deformation amount of the lid 10 is adjusted by the length of the deformation suppressing member 13, and the lid 10 is positioned at a desired position by the length of the deformation suppressing member 13. As a result, the optical element 11 is placed at a desired height from the die attach surface 4 along the optical axis 11a by the deformation suppressing member 13 with the die attach surface 4 as a reference, and is disposed at a desired distance from the die attach surface 4. .
Further, since the optical axis 11 a and the contact surface 22 are perpendicular, the optical axis 11 a is installed perpendicular to the die attach surface 4.

(Step 11)
Since the device 3 is mounted on the die attach surface 4, the vacuum sealing apparatus adjusts and arranges the relative distance between the device 3 and the optical element 11 and the angle of the optical axis 11 a with respect to the device 3 to a desired value. .

(Step12)
The three deformation suppressing members 13 are arranged on the die attach surface 4 at equal intervals of approximately 120 °. When the lid 10 is pressed by atmospheric pressure and deformed inward (package 1 side), each deformation suppressing member 13 is suppressed. The member 13 supports the lid 10 with uniform stress and suppresses deformation of the lid 10.

(Step 13)
The package 1 is removed from the clamper, a take-out port (not shown) of the vacuum chamber 16 is opened, and the vacuum sealing device is taken out. Thereby, the operation of the present embodiment is completed.

  Thus, in the vacuum sealing apparatus of the present embodiment, when the cavity 2 is hermetically sealed in a desired reduced pressure atmosphere (for example, a vacuum state lower than the atmospheric pressure), the atmospheric pressure that is the internal pressure and the external pressure of the cavity 2 is used. The lid 10 is pressed and deformed by the differential pressure. The vacuum sealing device according to the present embodiment causes the lid 10 to be deformed to contact the deformation suppressing member 13 so that the relative distance and the angle have desired values with reference to the die attach surface 4 of the package 1. 10 packages 1 can be arranged.

  Therefore, in the present embodiment, the relative distance and angle between the device 3 mounted on the die attach surface 4 and the optical element 11 can be adjusted and arranged within a desired range, the deterioration of the optical signal can be suppressed, and the yield can be reduced. Therefore, it is possible to provide an inexpensive vacuum sealing device with improved performance.

  In addition, since the vacuum sealing device of the present embodiment supports the lid 10 with equal stress on the contact surface 15 by the three deformation suppressing members 13, the deformation of the lid 10 can be suppressed.

  Note that the deformation suppressing members 13 are not necessarily arranged at equal intervals on the circumference as long as the lid 10 can be supported with equal stress.

Next, a modification of the first embodiment will be described with reference to FIGS.
FIG. 5 is a diagram showing a configuration of a vacuum sealing device according to a modification of the first embodiment of the present invention. FIG. 6 is a diagram showing the configuration of the vacuum sealing device after sealing. In FIG. 2, the bonding material 9 is not shown. 5 and 6, the same reference numerals are given to the same configurations as those in the first embodiment, and the description thereof will be omitted.

  The frame 30 a of the lid 30 of the present embodiment holds the optical element 31 that penetrates the lid 30 in the thickness direction of the lid 30. The projected area of the optical element 31 is formed by the three deformation suppressing members 13 and is larger than the projected area centered on the central portion 3a. Therefore, when the package 1 and the lid 30 are joined and the lid 30 is deformed by the differential pressure as in the first embodiment, the contact surface 15 of the present embodiment contacts the optical element 31. In this way, the deformation suppressing member 13 of the present embodiment disposed on the die attach surface 4 has the contact surface 15 that faces the optical element 31 at the distal end portion 14 and contacts the optical element 31. Further, the deformation suppressing member 13 of the present embodiment suppresses the optical element 31 from being inclined and the optical element 31 has a desired value including the inclination so that the relative distance between the device 3 and the optical element 31 becomes a desired value. It has a length for positioning the height.

Next, an operation method of this modification will be described.
The operation in which the package 1 and the lid 30 are pressed by the atmospheric pressure from the operation in which the package 1 is carried into the vacuum chamber 16 is substantially the same as the operation from Step 1 to Step 9 in the first embodiment described above. Is omitted.

  As shown in FIG. 6, the lid 30 is pressed by the atmospheric pressure and deformed inward (package 1 side). The optical element 31 held on the deformed frame 30 a of the lid 30 abuts on the abutting surface 15, and the deformation amount of the optical element 31 is suppressed by the deformation suppressing member 13. That is, the deformation amount of the optical element 31 is adjusted by the length of the deformation suppressing member 13, and the optical element 31 is positioned at a desired position by the length of the deformation suppressing member 13. Thus, the optical element 31 is installed at a desired height from the die attach surface 4 along the optical axis 11a with the deformation suppressing member 13 as a reference with respect to the die attach surface 4, and is disposed at a desired distance from the die attach surface 4. .

  Since the device 3 is mounted on the die attach surface 4, the vacuum sealing apparatus adjusts and arranges the relative distance between the device 3 and the optical element 31 and the angle of the optical axis 11a with respect to the device 3 to desired values. . Thus, since the optical element 31 is restrained by the deformation restraining member 13, it is arranged at a desired height position and a desired angle.

  The subsequent operations in the present embodiment are substantially the same as the operations from Step 12 to Step 13 in the first embodiment described above, and a description thereof will be omitted.

  Therefore, when the lid 30 having low rigidity is pressed by the atmospheric pressure, the vacuum sealing device according to the present modification increases the deformation amount of the optical element 31 and the lid 30 holding the optical element 31 by the deformation suppressing member 13. It is possible to reduce the deterioration of optical characteristics. In addition, the present embodiment provides an inexpensive vacuum sealing device in which the optical element 31 and the lid 30 that holds the optical element 31 are reduced in deformation, thereby further suppressing deterioration of optical characteristics and improving yield. Things are possible.

  Further, in this modification, the deformation amount of the optical element 31 is directly suppressed by the deformation suppressing member 13, so that the vacuum sealing is performed so that the optical axis 11a is perpendicular to the contact surface 22 as shown in the first embodiment. There is no need to manufacture a stop device. Therefore, this modified example can provide a vacuum sealing device that can improve the yield of the lid 30 at a lower cost than the lid 10 in the first embodiment.

Next, a second embodiment will be described with reference to FIGS.
FIG. 7 is a top view of a package in the vacuum sealing apparatus according to the second embodiment of the present invention. FIG. 8 is a view of FIG. 7 as seen from a cross section taken along line BB. In FIG. 7, the bonding material 9 is not shown. In FIGS. 7 and 8, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Since the lid of this embodiment is substantially the same as that of the first embodiment, illustration and detailed description thereof are omitted.

  As shown in FIG. 7, the outer shape of the deformation suppressing member 43 of the present embodiment is different in size (scale), but is similar to the outer shape of the lid 10 (frame 10a) or the outer shape of the optical element 11 (the outer shape is the same and the magnification is the same). Is different). The deformation suppressing member 43 has, for example, a hollow cylindrical shape and is a hollow ring component. The deformation suppressing member 43 has a length for positioning the height of the lid 10 so that the relative distance between the device 3 and the optical element 11 becomes a desired value.

  The contact surface 45 formed at the distal end portion 44 of the deformation suppressing member 43 of this embodiment is parallel to the die attach surface 4 and contacts the contact surface 22. Thus, the deformation suppressing member 43 suppresses deformation of the lid 10 when the lid 10 is joined to the package 1.

  When the lid 10 of the present embodiment is the lid 30 in the above-described modification, the deformation suppressing member 43 is set so that the relative distance between the device 3 and the optical element 31 becomes a desired value as in the above-described modification. It has a length for positioning the height of the optical element 31. At that time, the abutment surface 45 abuts on the optical element 31, whereby the deformation suppressing member 43 deforms the optical element 31 and the lid 30 holding the optical element 31 when the lid 10 is joined to the package 1. Suppress.

  The deformation suppressing member 43 has a notch 43 a to prevent interference with the wire bond 7. Therefore, the wire bond 7 is connected to the device 3 without interfering with the deformation suppressing member 43.

Since the operation method of this embodiment is substantially the same as the operation method of the first embodiment described above, detailed description thereof is omitted.
In the first embodiment described above, since the deformation suppressing member 13 is in point contact with the contact surface 22 at the contact surface 15, stress concentrates on the contact surface 15. However, in the present embodiment, the deformation suppressing member 43 comes into surface contact with the contact surface 22 at a continuous surface (contact surface 45). Thus, since the deformation | transformation suppression member 43 of this embodiment contact | abuts with an area larger than 1st Embodiment, it can disperse | distribute stress. Moreover, since the contact surface 45 has a shape similar to the outer shape of the optical element 11, the deformation suppressing member 43 of the present embodiment can evenly distribute the stress.

  Therefore, when the lid 10 having low rigidity is pressed by the atmospheric pressure, the vacuum sealing device according to the present embodiment can further reduce the deformation amount of the lid 10 by the deformation suppressing member 43 and suppress deterioration of the optical characteristics. become. Further, according to the present embodiment, it is possible to provide an inexpensive vacuum sealing device that further suppresses deterioration of optical characteristics and improves yield by reducing the deformation amount of the lid 10.

  When the device 3 is flip-chip mounted and the wire bond 7 does not exist, the notch 43a is not necessary.

  In addition, when the contact surface 45 contacts the contact surface 22 or the optical element 11, the deformation suppressing member 43 is hollow if the deformation suppressing member 43 of the present embodiment can evenly distribute the stress. It is not necessary to have a cylindrical shape, for example, it may be a hollow prismatic shape.

  Moreover, the vacuum sealing apparatus of this embodiment can incorporate the modification of 1st Embodiment as mentioned above.

  Further, the present invention is not limited to the above-described embodiments and modifications as they are, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment.

(Appendix 1)
In a vacuum sealing apparatus that hermetically seals the inside of a hollow portion formed by joining a lid having an optical element that transmits light and a package having a die attach surface on which a device is mounted, in a vacuum state,
A deformation suppressing member that is disposed in at least one of the lid or the package in the hollow portion and suppresses deformation of the lid;
A vacuum sealing device comprising:

(Appendix 2)
The front deformation suppressing member disposed in the package has a first contact surface that faces the lid or the optical element at a distal end portion thereof and contacts the lid or the optical element,
The deformation suppressing member disposed on the lid has a second contact surface that faces the die attach surface at the tip portion and contacts the die attach surface,
When the lid is deformed, the deformation suppressing member has a length in which the first surface abuts on the lid or the optical element, and a length in which the second abutment surface abuts on the die attach surface. 2. The vacuum sealing device according to appendix 1, wherein the optical element has a length that is set at a desired height from the die attach surface along the optical axis with respect to the die attach surface.

(Appendix 3)
The vacuum sealing device according to attachment 2, wherein the deformation suppressing member has a columnar shape.

(Appendix 4)
The vacuum sealing device according to appendix 3, wherein a plurality of the deformation suppressing members are provided, and the first contact surface and the second contact surface are parallel to the die attach surface.

(Appendix 5)
The vacuum sealing device according to appendix 4, wherein the plurality of deformation suppressing members are arranged at equal intervals on a circumference around the optical axis.

(Appendix 6)
Three deformation suppressing members are provided, and the three deformation suppressing members are uniformly arranged at intervals of approximately 120 degrees on the circumference around the optical axis. The vacuum sealing device according to appendix 5.

(Appendix 7)
The vacuum sealing device according to attachment 3, wherein the deformation suppressing member has a cylindrical shape.

(Appendix 8)
The vacuum sealing device according to appendix 7, wherein the outer shape of the deformation suppressing member is similar to the outer shape of the lid or the optical element.

(Appendix 9)
The vacuum sealing device according to appendix 2, wherein the outer shape of the deformation suppressing member is similar to the outer shape of the lid or the optical element.

(Appendix 10)
The vacuum sealing device according to appendix 9, wherein the deformation suppressing member has a hollow column shape.

(Appendix 11)
The vacuum sealing device according to appendix 10, wherein the deformation suppressing member has a hollow cylindrical shape.

(Appendix 12)
The vacuum sealing device according to appendix 11, wherein the deformation suppressing member has a hollow ring.

(Appendix 13)
The vacuum sealing apparatus according to appendix 12, wherein the first contact surface and the second contact surface are parallel to the die attach surface.

FIG. 1 is a diagram illustrating a configuration of a vacuum sealing device according to the first embodiment. FIG. 2 is a view of FIG. 1 as viewed from the line AA. FIG. 3 is a diagram showing a configuration of a vacuum chamber having a vacuum sealing device. FIG. 4 is a diagram showing the configuration of the vacuum sealing device after sealing. FIG. 5 is a diagram showing a configuration of a vacuum sealing device according to a modification of the first embodiment of the present invention. FIG. 6 is a diagram showing the configuration of the vacuum sealing device after sealing. FIG. 7 is a top view of a package in the vacuum sealing apparatus according to the second embodiment of the present invention. FIG. 8 is a view of FIG. 7 as seen from a cross section taken along line BB. FIG. 9 is a diagram showing a configuration of a conventional hermetic sealing device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Package, 1a ... Upper surface, 2 ... Hollow part (cavity), 2a ... Opening part, 3 ... Device, 3a ... Center part, 4 ... Die attach surface, 5 ... Lead, 6 ... Pad, 7 ... Wire bond, 8 DESCRIPTION OF SYMBOLS ... Metal film, 9 ... Bonding material, 10 ... Lid, 10a ... Frame, 10b ... Opening part, 11 ... Optical element, 11a ... Optical axis, 12 ... Metal film, 13 ... Deformation suppression member, 14 ... Tip part, 15 DESCRIPTION OF SYMBOLS ... Contact surface, 16 ... Vacuum chamber, 17 ... Stage, 18 ... Heater tool, 19 ... Heater tool drive mechanism, 20 ... Exhaust mechanism, 21 ... Pressure adjustment mechanism, 22 ... Contact surface.

Claims (12)

A lid having an optical element that transmits light and a frame that holds the optical element, and a package on which a device is mounted and having a die attach surface facing the optical element and the frame, In a vacuum sealing device that hermetically seals the hollow portion formed in the package in a vacuum state,
When the lid and the package are joined, a deformation suppressing member that is disposed in the hollow portion of the lid or the package and suppresses deformation of the lid;
A vacuum sealing device comprising:   When the lid is deformed, the deformation suppressing member has a length that abuts against a surface facing the deformation suppressing member in the optical axis direction, and the optical element is aligned along the optical axis with respect to the die attach surface. The vacuum sealing device according to claim 1, wherein the vacuum sealing device has a length installed at a desired height from the die attach surface.   The vacuum sealing device according to claim 1, wherein the deformation suppressing member is disposed in at least one of the lid or the package and has a columnar shape.   A plurality of the deformation suppressing members are provided, and a contact surface at a distal end portion of the deformation suppressing member is in contact with a surface facing the deformation suppressing member in the optical axis direction and is parallel to the die attach surface. The vacuum sealing device according to claim 2.   The vacuum sealing device according to claim 4, wherein the plurality of deformation suppressing members are arranged at equal intervals on a circumference around the optical axis.   The plurality of deformation suppressing members are arranged in three, and the three deformation suppressing members are arranged uniformly at intervals of approximately 120 degrees on the circumference around the optical axis. The vacuum sealing device according to claim 4.   The vacuum sealing device according to claim 1, wherein an outer shape of the deformation suppressing member is similar to an outer shape of the lid or the optical element.   The vacuum sealing device according to claim 7, wherein the deformation suppressing member is disposed on at least one of the lid or the package and has a hollow ring.   The contact surface at the tip portion of the deformation suppressing member is in contact with a surface facing the deformation suppressing member in the optical axis direction, and is parallel to the die attach surface. Vacuum sealing device.   The vacuum sealing device according to claim 1, wherein the deformation suppressing member disposed on the die attach surface of the package has a contact surface that contacts the frame body at a distal end portion.   The vacuum sealing device according to claim 1, wherein the deformation suppressing member disposed on the die attach surface of the package has a contact surface that contacts the optical element at a tip portion.   The vacuum sealing device according to claim 1, wherein the deformation suppressing member disposed on the lid has a contact surface that contacts the die attach surface at a tip portion.

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