JP2008283109A - Supporter, electric component mounting printed wiring substrate using the supporter and manufacturing method of the electric component mounting printed wiring substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a supporter or the like which easily realizes good electrical connection with a printed wiring substrate even if an electric component is warped, enables the electric component to be repaired any number of times without damaging the printed wiring substrate and an adjacent mounting component, realizes easy supply of preliminary solder, easily miniaturizes the printed wiring substrate and improves electrical characteristics. <P>SOLUTION: A supporter 1a is disposed between a printed wiring substrate 10 and an electric component (semiconductor device 11). The supporter has a sheet member 14 having a plurality of through holes 113 which are filled with solder pastes 15a, 15b, 15c inside and a heater circuit (heater element 111) interconnected to enclose a periphery of the through hole 113 inside the sheet member 14 and a voltage applying part 12 for applying a voltage to the heater element 111. The fill of the solder pastes 15a, 15b, 15c is controlled in accordance with a position of the through hole 113 in the sheet member 1a. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a support, an electric component-mounted printed wiring board using the support, a method for manufacturing the electric component-mounted printed wiring board, and a method for repairing the electric component-mounted printed wiring board.

  Many electrical devices represented by computers and the like are configured using an electrical component-mounted printed wiring board in which various electrical components are mounted on the printed wiring board. There are various electrical components mounted on a printed wiring board, but a typical example is a semiconductor device such as a large scale integrated circuit (LSI).

  Electrical parts represented by these semiconductor devices may be delayed in the early stages of development or may not be stable even if they are available, causing failures. Since mounting of electrical components on a printed wiring board usually needs to be performed when all the electrical components to be mounted are ready, if the acquisition of some electrical components is delayed, assembly of the printed wiring board with electrical components mounted is necessary. There is a problem in that it cannot be performed and the manufacturing schedule is delayed.

  Moreover, the printed wiring board mounted with electrical components has a very high added value in which many components other than the semiconductor device are mounted. For this reason, in the case where there is a failure only in the semiconductor device, discarding the entire printed wiring board with a high added value is a big problem in terms of development schedule and cost.

  In order to avoid such a situation, there is a method in which only a semiconductor device is individually mounted on a printed wiring board, but this method has a problem that it is difficult to use in terms of cost. In view of this, means for repairing (repairing or exchanging) only the faulty semiconductor device and improving the quality of the printed wiring board is used.

  More specifically, as a repair means for removing such a semiconductor device from the printed wiring board with electrical components mounted thereon, the part on which the semiconductor device is mounted on the printed wiring board mounted with electrical components can be removed from above and below the printed wiring board with a heater or hot air. There is a method in which solder that electrically connects a terminal of a semiconductor device and a printed wiring board is melted while being locally heated, and after removing the semiconductor device, a good semiconductor device is mounted again (Patent Document 1). 2).

  As another repair means, a heat-resistant insulating sheet member having a plurality of small holes is interposed between the semiconductor device and the printed board, and when the semiconductor device is replaced, the bumps of the semiconductor device are heated by external heating. There is a method of separating a semiconductor device and a printed wiring board by melting a heat-resistant insulating sheet member while melting (see Patent Document 2). Further, as a method similar to this method, there is a method of removing a package by melting a solder ball provided on the package using a heating wire incorporated in a heat-resistant insulating sheet member (see Patent Document 3).

  As another repair means, there is a method of separating the semiconductor device from the mounting substrate by inserting a comb-like heater into the ball portion of the semiconductor device and melting the solder at the joint (see Patent Document 4).

As another repair means, there is a method using a socket connector for a semiconductor device. In this method, a socket connector for a semiconductor device is mounted on a printed wiring board at the time of component assembly. The semiconductor device can be repaired after assembling the components on the printed wiring board by installing and removing the semiconductor device from the socket connector.
JP 2002-57453 A (paragraph 0017, FIG. 2) JP-A-9-246714 (paragraphs 0024 and 0032, FIG. 1) JP-A-11-87906 (paragraphs 0024, 0026, 0033 to 0035, FIGS. 1 to 4) Japanese Patent Laid-Open No. 2002-9432 (paragraph 0023, FIGS. 1 and 2)

  However, the semiconductor device repairing means has several problems.

  The first problem is that when the part on which the semiconductor device to be repaired is mounted is locally heated from above and below the printed wiring board with a heater or hot air to melt the solder, heat damages the printed wiring board greatly. It is to give. Due to such large damage, the printed wiring board may cause delamination, pattern disconnection, and the like due to heat stress, and thus there is a problem that it cannot withstand many repairs. In addition, in heating with a heater or hot air, the heating range tends to be widened, and damage to electrical components mounted adjacent to the semiconductor device may occur. There is a problem that parts need to be replaced.

  The above problem will be described more specifically. FIG. 8 is a schematic cross-sectional view showing a means for repairing the semiconductor device by heating the printed wiring board using a heater. As shown in the figure, an electric component-mounted printed wiring board 69 is in the form of a BGA (ball grid array, which may be simply referred to as “BGA” in this specification) on the printed wiring board 60. A semiconductor device 63 is mounted. More specifically, the solder ball 62 of the semiconductor device 63 is electrically connected to the solder ball pad 61 on the printed wiring board 60. In the electric component mounting printed wiring board 69, a chip component 66 is mounted adjacent to the periphery of the semiconductor device 63. The chip component 66 is connected by forming a solder fillet 65 on the chip component mounting pad 68.

  Here, when the semiconductor device 63 is repaired (replaced) on the printed wiring board 69 mounted with electrical components, the heater 64 is used to heat the periphery of the mounting portion of the semiconductor device 63 from the back surface of the printed wiring board 60. Then, the solder ball 62 at the connection portion is melted by the heat 67, the semiconductor device 63 is removed, and a new semiconductor device is repaired. However, such heating from the back surface of the printed wiring board 60 is likely to cause troubles such as delamination and pattern breakage of the printed wiring board 60 because the stress applied to the printed wiring board 60 is large. Further, as shown in the figure, since the heating range of the heater 64 is likely to be larger than the periphery of the mounting portion of the semiconductor device 63, damage may be caused to adjacent mounting components such as the chip component 66 that is not a repair target. In some cases, adjacent components must be replaced at the same time.

  The second problem is that a heat-resistant insulating sheet member having a plurality of small holes is interposed between the semiconductor device and the printed wiring board, and a heating wire incorporated in the heat-resistant insulating sheet member or heating from the outside. When using a repair means for melting a semiconductor device bunf or the like to separate the semiconductor device from the printed circuit board, or inserting a comb-like heater into the ball portion of the semiconductor device to melt the solder at the joint, In the case of using repair means for separating the semiconductor device from the semiconductor device, it is difficult to supply preliminary solder onto the printed wiring board. That is, when the repair means is used, when a new semiconductor device is mounted again at a location where the semiconductor device is removed, it is necessary to supply preliminary solder on the printed wiring board. This preliminary solder plays an important role in properly mounting a semiconductor device having warpage on a printed wiring board. However, when other electrical components are mounted adjacent to each other, there is a problem that it is difficult to supply a predetermined preliminary solder onto the printed wiring board with a narrow work area.

  The above problem will be described more specifically. FIG. 9 is a schematic cross-sectional view showing a means for repairing a semiconductor device when a heat-resistant insulating sheet member having a plurality of small holes is interposed between the semiconductor device and the printed wiring board. As shown in the figure, a printed circuit board 79 mounted with an electrical component has a semiconductor device 71 in the form of a BGA mounted on a printed circuit board 70 with a heat-resistant insulating sheet 73 interposed therebetween. More specifically, the structure is such that the bumps 72 of the semiconductor device 71 are electrically connected to the printed wiring board 70. In the electric component mounting printed wiring board 79, a chip component 76 is mounted adjacent to the periphery of the semiconductor device 71. The chip component 76 is connected by forming a solder fillet 75 on the chip component mounting pad 77.

  Here, when the semiconductor device 71 is repaired (replaced) on the printed wiring board 79 mounted with electrical components, a heat-resistant insulating sheet 73 having a plurality of small holes 74 is interposed between the semiconductor device 71 and the printed wiring board 70. The heat-resistant insulating sheet 73 is externally heated to melt the bumps 72 and remove the semiconductor device 71 from the printed wiring board 70. When the semiconductor device 71 is mounted, a new semiconductor device (not shown in FIG. 9) is again connected to the printed wiring board 70 by the same method as described above. However, such a repair means of the semiconductor device 71 makes it very difficult to supply necessary preliminary solder when a new semiconductor device is connected again. This is because it is difficult to supply a predetermined amount of preliminary solder onto the printed wiring board 70 because the work area is narrow when other electrical components such as the chip component 76 are mounted adjacent to each other. Although the semiconductor device 71 shown in FIG. 9 does not have a warp, the semiconductor device usually has a warp. Therefore, when the semiconductor device having such a warp is satisfactorily connected to a printed wiring board, the amount of preliminary solder is severe. However, the repair means shown in FIG. 7 cannot accurately supply this preliminary solder.

  The third problem is that when the socket connector for a semiconductor device is used as a repair method, the area required for mounting the semiconductor device on the printed wiring board is greatly increased because the area of the socket connector needs to be secured. It is in the point that it ends up. The adoption of such a socket connector not only deprives the mounting area of other electrical components to be mounted, but also has the problem that the size of the printed wiring board must be increased and miniaturization is difficult. In addition, the use of a socket connector causes the connection between the semiconductor device and the printed wiring board to be connected via a contact, which may cause a mismatch in characteristic impedance at the contact portion, and the electrical characteristics are likely to deteriorate. is there. Furthermore, when the package form of the semiconductor device is BGA, the solder ball is very fragile in strength, which makes it difficult to realize a socket contact having connection reliability.

  The above problem will be described more specifically. FIG. 10 is a schematic cross-sectional view showing a means for repairing the semiconductor device when the socket connector is provided on the printed wiring board. As shown in the figure, an electric component-mounted printed wiring board 90 has input / output pins 85 of a semiconductor device 86 in the form of a PGA (pin grid array) mounted on a printed wiring board 80 via a socket connector 83. It is a structure. A chip component 88 is mounted adjacent to the periphery of the semiconductor device 86. The chip component 88 is connected by forming a solder fillet 87 on the chip component mounting pad 89. The mounting form of the socket connector 83 on the printed wiring board 80 is a BGA connected to the solder ball pad 81 via the solder ball 82.

  Here, the semiconductor device 86 has a structure that can be freely repaired via the socket connector 83. However, since the socket connector 83 is wider than the semiconductor device 86, the area required for mounting the semiconductor device 86 on the printed wiring board 80 is greatly increased. As a result, not only the chip component 88 and other mounting parts for electric components to be mounted are taken away, but also the size of the printed wiring board 80 has to be increased, which makes it difficult to reduce the size. Further, by using the socket connector 83, the connection between the semiconductor device 86 and the printed wiring board 80 becomes a connection through the socket contact 84. For this reason, there is a problem that not only the connection electrical length becomes long and the delay characteristic is deteriorated, but also the impedance impedance mismatch at the socket contact 84 portion and the high frequency transmission characteristic is deteriorated. Further, when the form of the semiconductor device 86 is BGA, since the solder ball is very fragile in strength, it is difficult to realize a socket contact having connection reliability.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electrical component mounting printed wiring board in which an electrical component such as a semiconductor device is mounted on a printed wiring board via a support. It is easy to achieve good electrical connection with the printed wiring board even if the parts are warped, and it is possible to repair electrical parts many times without damaging the printed wiring board or adjacent mounted parts, and supply of spare solder , A printed wiring board that is easy to downsize and that has good electrical characteristics, an electrical component-mounted printed wiring board using the support, a method of manufacturing the electrical component-mounted printed wiring board, and the An object of the present invention is to provide a method for repairing an electric component-mounted printed wiring board.

  The support of the present invention for solving the above problems is a support disposed between a printed wiring board and an electrical component, and is a sheet member provided with a plurality of through holes filled with solder paste inside A heater circuit wired to surround the periphery of the through hole inside the sheet member, and a voltage application unit for applying a voltage to the heater circuit, and the through hole of the sheet member According to the position, the filling amount of the solder paste is controlled.

  In a preferred aspect of the support of the present invention, the sheet member is provided with a cut line provided across the sheet member so as to pass through at least one or more through-holes, and the sheet member continuous with the cut line. And an incision portion provided at the end.

  In the preferable aspect of the support body of this invention, the said sheet | seat member further has the alignment hole for the alignment on the said printed wiring board.

  In the preferable aspect of the support body of this invention, the said heater circuit is formed with the heating wire which has different thickness according to the wiring position inside the said sheet | seat member.

  In the preferable aspect of the support body of this invention, the said heater circuit is formed with the some heating wire which crosses the said sheet | seat member in parallel.

  In a preferred embodiment of the support of the present invention, the filling amount of the solder paste is controlled in accordance with the shape of the electrical component.

  In order to solve the above problems, an electric component-mounted printed wiring board of the present invention is characterized in that the support is provided between the printed wiring board and the electric component.

  In a preferred aspect of the electric component-mounted printed wiring board of the present invention, the electric component is a semiconductor device.

  An electrical component mounting printed wiring board manufacturing method of the present invention for solving the above problems is a manufacturing method of an electrical component mounting printed wiring board in which a printed wiring board, a support, and electrical components are laminated in this order, A sheet member provided with a plurality of through holes filled with solder paste, a heater circuit wired around the through hole inside the sheet member, and a voltage for applying a voltage to the heater circuit And a preparatory step of preparing a support body in which the filling amount of the solder paste is controlled according to the position of the through hole in the sheet member, and the electrical component is disposed on the printed wiring board An installation step of installing the support at a position to be placed; an arrangement step of arranging an electrical component on the support; and operating the voltage application unit to power the heater circuit. And a heating step for melting the solder paste provided in the through hole to secure an electrical connection between the electrical component and the printed wiring board. .

  In a preferred aspect of the method for producing an electrical component-mounted printed wiring board of the present invention, the sheet member is provided with a cut line provided across the sheet member so as to pass through at least one or more through holes, and the cut line. A cut portion provided at the end of the sheet member continuously, and after the connecting step, the voltage application portion is cut from the heater circuit, and then from the cut portion along the cut line. It further includes a removing step of cutting the sheet member and removing the sheet member from between the printed wiring board and the electrical component.

  In a preferred aspect of the method for manufacturing an electrical component-mounted printed wiring board of the present invention, the sheet member further has an alignment hole for alignment on the printed wiring board, and the printed wiring board has the position described above. Projections corresponding to the alignment holes are installed, and the support is installed on the printed circuit board so that the alignment holes and the projections are fitted in the installation step.

  An electrical component-mounted printed wiring board repair method of the present invention for solving the above-mentioned problem is a method for repairing an electrical component-mounted printed wiring board, wherein a voltage is applied to the heater circuit by operating the voltage application unit. And generating heat, melting the solder paste provided in the through hole, and removing the electrical component from the printed wiring board.

  According to the support of the present invention, good electrical connection with the printed wiring board is realized even if the electrical parts are warped, and the electrical parts are hardly damaged thermally by the printed wiring board or adjacent mounting parts. Can be repaired many times, the supply of spare solder is easy, the printed wiring board can be miniaturized, and the electrical characteristics are also good. In particular, by controlling the filling amount of the solder paste in each through-hole according to the warpage amount of the electrical component, a predetermined amount of preliminary solder corresponding to the shape of the electrical component to be mounted is provided in the work area where the adjacent component is mounted. Can be easily supplied on a printed wiring board even in a state where there is little. In addition, by applying a voltage to the heater circuit built in the sheet member, the connection part of the electrical component can be locally heated, and the electrical component is hardly damaged due to thermal damage to the printed wiring board and adjacent components. And a good electrical connection with the printed wiring board.

  According to the printed wiring board mounted with an electrical component of the present invention, a good electrical connection with the printed wiring board is realized even if the electrical component is warped, and the printed wiring board and adjacent mounted components are almost thermally damaged. Thus, the electrical parts can be repaired many times, the spare solder can be easily supplied, the printed wiring board can be reduced in size, and the electrical characteristics can be improved.

  According to the method for manufacturing an electrical component-mounted printed wiring board of the present invention, good electrical connection with the printed wiring board is realized even if the electrical component is warped, and it is easy to supply preliminary solder. Miniaturization is possible, and electrical characteristics are also good.

  According to the method for repairing a printed wiring board mounted with an electrical component of the present invention, it is possible to repair the electrical component many times with little thermal damage to the printed wiring substrate and adjacent mounted components, and it is easy to supply spare solder. Thus, the printed wiring board can be miniaturized and the electrical characteristics can be improved.

  Next, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following examples, and it goes without saying that various modifications can be made within the scope of the gist thereof.

[Electrical component mounted printed circuit board, support]
FIG. 1 is a schematic cross-sectional view showing an example of an electric component-mounted printed wiring board according to the present invention. FIG. 2 is a schematic plan view showing an example of a support used for the electric component-mounted printed wiring board of FIG. Although FIG. 2 is a plan view, for convenience of explanation, a heater circuit disposed inside the sheet member is shown through. This also applies to FIGS. 3 to 5 described below. 1 and 2, a semiconductor device is used as an example of an electrical component, and a heater element is used as an example of a heater circuit. This point is the same in all embodiments. Therefore, in the following description, the electrical component is a semiconductor device, and the heater circuit is a heater element.

  The electrical component-mounted printed wiring board 2 a has a support 1 a between the printed wiring board 10 and the semiconductor device 11. More specifically, the electrical component-mounted printed wiring board 2 a has a structure in which a support 1 a is interposed between the printed wiring board 10 and the semiconductor device 11 on the printed wiring board 10 on which the semiconductor device 11 is mounted. Then, by using the support 1a in which the filling amount of the solder pastes 15a, 15b, and 15c is controlled according to the position of the through hole 113 in the sheet member 14, the printed wiring board 10 and the semiconductor device 11 can be warped. Excellent electrical connection is realized, the semiconductor device 11 can be repaired many times without damaging the printed wiring board 10 and adjacent mounting components, the preliminary solder can be easily supplied, and the printed wiring board 10 can be reduced in size. And electrical characteristics are also improved.

  The printed wiring board 10 is formed with solder ball pads 17 for receiving the solder balls 13 of the semiconductor device 11. Further, in the printed wiring board 10, a chip component 18 exists adjacent to the periphery of the semiconductor device 11. The chip component 18 is mounted on the chip component mounting pad 110 by forming a solder fillet 19.

  The semiconductor device 11 has a package form of BGA, and has a plurality of solder balls 13 on the mounting surface to the printed wiring board 10. The diameter of the solder ball 13 is formed to be larger than the thickness of the sheet member 14. The semiconductor device 11 is warped, and is in a convex state in which the corner portion is lifted with respect to the printed wiring board 10. That is, since the cross section of the semiconductor device 11 has a warp and has a convex shape so that the end of the semiconductor device 11 is lifted, the end surface of the solder ball 13 on the printed wiring board 10 side does not become horizontal. More specifically, the distance between the printed wiring board 10 and the end face of the solder ball 13 near the center of the semiconductor device 11 and the printed wiring board 10 is such that the printed wiring board of the solder ball 13 near the corner of the semiconductor device 11 is. The distance between the end face on the 10 side and the printed wiring board 10 is smaller.

  The support 1a is disposed between the printed wiring board 10 and the semiconductor device 11, and includes a sheet member 14 provided with a plurality of through holes 113 filled therein with solder pastes 15a, 15b, and 15c, and the inside of the sheet member 14 The heater element 111 wired so as to surround the periphery of the through hole 113, and the voltage application unit 12 for applying a voltage to the heater element 111, according to the position of the through hole 113 in the sheet member 14, The filling amount of the solder paste 15a, 15b, 15c is controlled.

  Thereby, it becomes possible to change the amount of the solder paste 15a, 15b, 15c filled in the through hole 113 provided corresponding to each terminal of the semiconductor device 11 according to the shape of the semiconductor device 11, Even if the semiconductor device 11 is warped, good electrical connection with the printed wiring board 10 is realized, and the semiconductor device 11 is repaired many times without causing any thermal damage to the printed wiring board 10 or adjacent mounting components. Therefore, it is easy to supply preliminary solder, the printed wiring board 10 can be reduced in size, and the electrical characteristics are also improved.

  The sheet member 14 further has an alignment hole 112 for alignment on the printed wiring board 10 and is positioned by a guide post 16 formed on the printed wiring board 10. More specifically, positioning holes 112 are provided at the four corners of the sheet member 14, and the printed circuit board 10 of the sheet member 14 is aligned with the guide posts 16 formed on the printed circuit board 10. Positioning with respect to is possible. The guide post 16 is formed as a protrusion on the printed wiring board 10.

  The sheet member 14 includes a through hole 113 for each solder ball 13 of the semiconductor device 11, and the through hole 113 is filled with a predetermined amount of solder paste 15 a, 15 b, 15 c serving as preliminary solder. The through hole 113 is formed in a size larger than the solder ball pad 17. The filling amounts of the solder pastes 15 a, 15 b and 15 c in the through holes 113 are controlled according to the shape of the semiconductor device 11. More specifically, as described above, since the semiconductor device 11 is warped in a downwardly convex state, the end surface of the solder ball 13 on the printed wiring board 10 side is not horizontal. For this reason, in order to absorb this warp of the semiconductor device 11, the amount of solder paste in the through hole 113 is filled so as to decrease as it approaches the center of the sheet member 14. More specifically, as shown in FIGS. 1 and 2, the through hole 113 provided on the outer periphery of the sheet member 14 is filled with more solder paste 15 a than the other through holes 113. In the through hole 113 near the center of the sheet member 14, the smallest amount of solder paste 15c is filled. Further, the through hole 113 located in the middle between the through hole 113 filled with the solder paste 15a located on the outermost peripheral side of the sheet member 14 and the through hole 113 near the center portion filled with the solder paste 15c. Is filled with an intermediate amount of solder paste 15b. This is a filling configuration of solder paste corresponding to the semiconductor device 11 warped downward with respect to the printed wiring board 10, and is controlled to be a predetermined filling amount in order to absorb the warpage amount of the semiconductor device 11. ing.

  In the sheet member 14, the heater element 111 wired so as to surround the periphery of each through hole 113 is disposed. More specifically, a heater element 111 is provided around each through hole 113 filled with the solder pastes 15a, 15b, and 15c so as to surround the through hole 113. In more detail, as shown in FIG. 2, the heating wire which comprises the heater element 111 is wired so that each through-hole 113 may be enclosed in a U-shape. By adopting such a configuration, it becomes possible to efficiently melt the solder pastes 15a, 15b, 15c in each through hole 113 and the solder balls 13 to be located in each through hole 113.

  A voltage application unit 12 is connected to both ends of the heater element 111 in the support 1a. A conventionally known element can be used as the voltage application unit 12. When the voltage is applied to the voltage application unit 12, the heater element 111 generates heat, and the solder pastes 15a, 15b, 15c in the through holes 113 and the solder balls 13 of the semiconductor device 11 are melted. Local heating to the 10 connections is performed. As a result, the semiconductor device 11 can be mounted with almost no thermal damage to the printed wiring board 10 or the chip component 18 mounted adjacent thereto. Moreover, even if the semiconductor device 11 is warped, the warp of the semiconductor device 11 is absorbed by setting the amount of solder paste in each through-hole 113 to the solder paste 15a, 15b, 15c at the stage of manufacturing the sheet member 14. Since it can be controlled to a predetermined amount, a good electrical connection between the semiconductor device 11 and the printed wiring board 10 becomes possible. By adopting such a configuration, a predetermined amount of preliminary solder necessary for mounting the semiconductor device 11 is applied to the printed wiring board 10 even when adjacent components are already mounted around the place where the semiconductor device 11 is to be mounted. There is also an effect that can be supplied to. In addition, when the semiconductor device 11 is mounted on the sheet member 14, the solder ball 13 of the semiconductor device 11 falls into the through hole 113 of the sheet member 14, so that the semiconductor device 11 can be easily mounted. is there. Further, since the sheet member 14 is interposed between the solder balls 13 of the semiconductor device 11, an effect of preventing the adjacent solder balls 13 from being short-circuited at the time of melting when the semiconductor device 11 and the printed wiring board 10 are connected. There is also.

  FIG. 3 is a schematic view showing another example of the support of the present invention. More specifically, FIG. 3A shows a plan view of the support, and FIG. 3B shows a cross-sectional view taken along the line A-A ′ of FIG.

  The support 1b is provided at the end of the sheet member 20 in succession to the cut line 27 provided across the sheet member 20 so that the sheet member 20 passes through at least one or more through holes 25. The cut portion 26 is further provided. Thus, by cutting the sheet member 20 along the cut line 27 from the cut portion 26, the sheet member 20 and thus the support 1b can be easily taken out from between the printed wiring board and the semiconductor device. The support 1b basically adopts the same configuration as the support 1a except for the above points. Hereinafter, the support 1b will be described in more detail.

  The sheet member 20 includes a through hole 25 formed for each terminal of a semiconductor device mounted on the sheet member 20. A predetermined amount of solder paste 23a, 23b, 23c is filled in the through hole 25. The filling amounts of the solder pastes 23a, 23b, and 23c in the through holes 25 are controlled in accordance with the shape of the semiconductor device. More specifically, the amount of solder paste in the through hole 25 is filled so as to decrease as it approaches the center of the sheet member 20. More specifically, the through hole 25 in the outer peripheral portion of the support is filled with more solder paste 23 a than the other through holes 25. In the through hole 25 near the center of the sheet member 20, the smallest amount of solder paste 23c is filled. Further, the through hole 25 located in the middle between the through hole 25 filled with the solder paste 23a located on the outermost peripheral side of the sheet member 20 and the through hole 25 near the center part filled with the solder paste 23c. Is filled with an intermediate amount of the solder paste 23b. This is a filling configuration of solder paste corresponding to a semiconductor device warped downward with respect to the printed wiring board, and is controlled to a predetermined filling amount in order to absorb the warpage amount of the semiconductor device.

  The sheet member 20 is provided with heater elements 21 that are wired so as to surround the peripheries of the through holes 25 therein. More specifically, the heater element 21 is disposed around each through hole 25 filled with the solder pastes 23a, 23b, and 23c so as to surround the through hole 25. More specifically, as shown in FIG. 3A, the heating wire constituting the heater element 21 is wired so as to surround each through hole 25 in a U-shape. By adopting such a configuration, it becomes possible to efficiently melt the solder pastes 23a, 23b, 23c in each through hole 25 and the solder balls of the semiconductor device that are located in each through hole 25.

  A voltage application unit 22 is connected to both ends of the heater element 21 in the support 1b. As such a voltage application unit 22, a conventionally known element can be used. When the voltage is applied to the voltage application unit 22, the heater element 21 generates heat, the solder at the connection portion between the printed wiring board and the semiconductor device is melted, and the semiconductor device can be mounted. As a result, the connection portion under the semiconductor device can be locally heated, so that the semiconductor device can be mounted and repaired (repaired / repaired) with little thermal damage to the printed wiring board and adjacent mounting components. Exchange) becomes possible. Moreover, even if the mounted semiconductor device is warped, the warp of the semiconductor device is absorbed by changing the amount of solder paste in each through-hole 25 to the solder pastes 23a, 23b, and 23c at the stage of manufacturing the sheet member 20. Since it can be controlled to a predetermined amount, a good electrical connection between the semiconductor device and the printed wiring board becomes possible. By adopting such a configuration, it is possible to supply a predetermined amount of pre-solder necessary for mounting the semiconductor device onto the printed circuit board even when adjacent components are already mounted around the place where the semiconductor device is to be mounted. There is also an effect.

  As shown in FIG. 3A, the sheet member 20 includes a cut portion 26 on the outer periphery, more specifically, an upper side and a lower side, and a cut line 27 on the through hole 25 so as to connect the two cut portions 26. Yes. By adopting the cut portion 26 and the cut line 27, when the quality of the semiconductor device mounted on the support 1b is stabilized and there is no need to repair the semiconductor device, the support 1b portion is mounted with the semiconductor device mounted. It can be removed. Such a removal method will be described.

  The removal of the support 1b is performed using the following removal process. That is, the voltage application unit 22 is cut from the heater element 21, and then the sheet member 20 is cut from the cut portion 26 along the cut line 27 to remove the sheet member 20 from between the printed wiring board and the electrical component. In the case where the quality of the semiconductor device is sufficiently stable, such a removal process is performed immediately after the semiconductor device is electrically connected to the printed wiring board via the support in the manufacturing process of the printed wiring board mounted with electrical components. May be.

  As described above, the removal step of the support 1b is performed by removing the support 1b while the semiconductor device is mounted. More specifically, the heater element 21 is first cut by the heater element cut portion 28 and the voltage application portion 22 is removed. Next, the heater element 21 is pulled out from the sheet member 20. Next, the sheet member 20 is split for each of the cut lines 27 on the through holes 25 from the cut portions 26 located on the outer peripheral portion of the sheet member 20 and pulled out from the lower part of the semiconductor device. Through the above steps, the sheet member 20 and thus the support 1b can be removed while the semiconductor device is mounted. If the support 1b is interposed under the semiconductor device for a long period of time, dust or the like may be involved, and it may be better to remove it from the viewpoint of ensuring long-term reliability. In such a case, the use of the support 1b and the removal process described above are effective.

  The sheet member 20 further includes an alignment hole 24 for alignment on the printed wiring board. More specifically, as shown in FIG. 3A, there are positioning holes 24 at the four corners of the sheet member 20.

  FIG. 4 is a schematic view showing still another example of the support of the present invention. More specifically, FIG. 4A shows a plan view of the support, and FIG. 4B shows a cross-sectional view taken along the line B-B ′ in FIG.

  The support 1c is formed of a plurality of heating wires in which the heater element 31 crosses the sheet member 30 in parallel. And with the adoption of a plurality of heating wires, a plurality of voltage application sections 32 are also arranged. By employing a plurality of heating wires traversing in parallel, the sheet member 30 can be easily removed from under the semiconductor device in the above-described removal process. Further, in the support 1 c, the amount of solder paste in the through hole 38 is filled more as it approaches the center of the sheet member 30. The support 1c basically has the same configuration as the support 1b except for the above points. Hereinafter, the support 1c will be described in more detail.

  In the support 1c, as the sheet member 30, a flexible printed wiring board (FPC) interposed between the printed wiring board and the semiconductor device is used. The sheet member 30 includes a through hole 38 formed for each terminal of a semiconductor device mounted on the sheet member 30. The through-hole 38 is filled with a predetermined amount of solder paste. The filling amount of the solder pastes 33a, 33b, and 33c in the through hole 38 is controlled in accordance with the shape of the semiconductor device. More specifically, the amount of solder paste in the through hole 38 is filled so as to increase toward the center of the sheet member 30. More specifically, the outer peripheral through hole 38 is filled with less solder paste 33 a than the other through holes 38. In the through hole 38 near the center of the sheet member 30, the largest amount of solder paste 33c is filled. Further, the through hole 38 located in the middle between the through hole 38 filled with the solder paste 33a located on the outermost peripheral side of the sheet member 30 and the through hole 38 near the center portion filled with the solder paste 33c. Is filled with an intermediate amount of solder paste 33b. This is a filling configuration of solder paste corresponding to the case where the semiconductor device mounted on the sheet member 30 is warped upward with respect to the printed wiring board. In order to absorb the warp amount of the semiconductor device, The amount of solder paste filled in the through hole 38 is controlled.

  The sheet member 30 is provided with a heater element 31 wired so as to surround each through hole 38 inside. Actually, the heater element 31 is formed of a plurality of heating wires that cross the sheet member 30 in parallel. More specifically, as shown in FIG. 4A, a plurality of heater elements 31 are arranged in parallel for each row of through-holes 38 filled with solder pastes 33a, 33b, 33c. By adopting such a configuration, it becomes possible to efficiently melt the solder pastes 33a, 33b, 33c in each through hole 38 and the solder balls of the semiconductor device that are positioned in each through hole 38, It becomes easy to remove the sheet member 30 from under the semiconductor device.

  A voltage application unit 32 is connected to each end of the heating wires arranged in parallel constituting the heater element 31 in the support 1c. A conventionally known element can be used as the voltage application unit 32. Then, by applying a voltage to the voltage application unit 32, each heating wire and thus the heater element 31 generates heat, and the solder at the connection portion between the semiconductor device and the printed wiring board is melted, so that the semiconductor device can be mounted. By arranging a plurality of heating wires in parallel, a plurality of circuits of the heater element 31 can be provided, and the lower part of the semiconductor device is locally heated while suppressing temperature variation depending on the location in the sheet member 30. Therefore, the semiconductor device can be repaired with little thermal damage to the printed wiring board and adjacent mounted components. Moreover, when the semiconductor device is remounted, it is possible to fill the through hole 38 with a preliminary solder necessary in the manufacturing stage of the sheet member 30, so that a good preliminary solder can be provided even when adjacent parts are mounted around the through hole 38. It can be supplied on a printed wiring board. Furthermore, even if the semiconductor device is warped by controlling the amount of solder paste filled in the through-hole 38 to a predetermined amount, it is possible to achieve good electrical connection between the semiconductor device and the printed wiring board.

  As shown in FIG. 4A, the sheet member 30 includes a cut portion 34 on the outer peripheral portion and a cut line 35 on the through hole 38. By adopting the notch 34 and the cut line 35, when the quality of the semiconductor device mounted on the support 1c is stabilized and there is no need to repair the semiconductor device, the support 1c portion is mounted with the semiconductor device mounted. It can be removed. Such a removal method will be described.

  The removal of the support 1c is performed using the following removal process. That is, the voltage application unit 32 is cut from each heating wire constituting the heater element 31, and then the sheet member 30 is cut from the cut portion 34 along the cut line 35, so that the sheet member 30 is connected to the printed wiring board and the electrical component. Remove from between. In the case where the quality of the semiconductor device is sufficiently stable, such a removal process is performed immediately after the semiconductor device is electrically connected to the printed wiring board via the support in the manufacturing process of the printed wiring board mounted with electrical components. May be.

  As described above, the removal process of the support 1c is performed by removing the support 1c while the semiconductor device is mounted. More specifically, first, each heating wire constituting the heater element 31 is cut by the heater element cut portion 37. Thereafter, the heater element 31 and the heater element 31 are pulled out from the lower part of the semiconductor device while tearing the sheet member 30 for each cut line 35 on the through hole 38 from the notch 34 on the outer periphery of the sheet member 30. Here, by providing the heating wires of the heater elements 31 in parallel for each row of the through holes 38, the sheet member 30 can be easily taken out. Through the above steps, the sheet member 30 and thus the support 1c can be removed while the semiconductor device is mounted. If the support 1c is interposed under the semiconductor device for a long period of time, dust or the like may be involved, and it may be better to remove it from the viewpoint of ensuring long-term reliability. In such a case, the adoption of the support 1c and the removal step described above are effective.

  The sheet member 30 further includes an alignment hole 36 for alignment on the printed wiring board. More specifically, as shown in FIG. 3A, there are positioning holes 36 at the four corners of the sheet member 30.

  FIG. 5 is a schematic view showing still another example of the support of the present invention. More specifically, FIG. 5A shows a plan view of the support, and FIG. 5B shows a cross-sectional view taken along C-C ′ of FIG.

  In the support 1d, the heater element 41 is formed of heating wires having different thicknesses depending on the wiring position inside the sheet member 40. Adoption of heating wires having different thicknesses makes it easy to suppress temperature variations due to locations in the sheet member 40 when the heater element 41 is heated. The support 1d basically adopts the same configuration as that of the support 1b except for the above points. Hereinafter, the support 1d will be described in more detail.

  The sheet member 40 of the support 1d is provided with a through hole 48 formed for each terminal of the semiconductor device mounted on the sheet member 40. The through-hole 48 is filled with a predetermined amount of solder paste. The filling amount of the solder paste 43a, 43b, 43c in the through hole 48 is controlled in accordance with the shape of the semiconductor device. More specifically, the amount of solder paste in the through hole 48 is filled so as to decrease as it approaches the center of the sheet member 40. More specifically, the outer peripheral through hole 48 is filled with more solder paste 43 a than the other through holes 48. In the through hole 48 near the center of the sheet member 40, the smallest amount of solder paste 43c is filled. Further, the through hole 48 located in the middle between the through hole 48 filled with the solder paste 43a located on the outermost peripheral side of the sheet member 40 and the through hole 48 near the center portion filled with the solder paste 43c. Is filled with an intermediate amount of solder paste 43b. This is a filling structure of solder paste corresponding to the case where the semiconductor device mounted on the sheet member 40 is warped downward with respect to the printed wiring board. In order to absorb the warp amount of the semiconductor device, The amount of solder paste filled in the through hole 48 is controlled.

  The sheet member 40 is provided with heater elements 41 that are wired so as to surround the peripheries of the through holes 48 therein. Actually, the heater element 41 is formed of heating wires having different thicknesses depending on the wiring position inside the sheet member 40. By adopting such a configuration, it becomes easy to suppress temperature variation due to the location in the sheet member 40 when the heater element 41 is heated.

  A voltage application unit 42 is connected to both ends of the heater element 41 in the support 1d. As such a voltage application unit 42, a conventionally known element can be used. The heater element 41 has a structure in which the thickness varies depending on the distance from the voltage application unit 42. This is because the temperature distribution under the semiconductor device to be mounted can be made uniform by controlling the thickness of the heater element 41 as described above.

  In the support 1d, the heater element 41 generates heat by applying a voltage to the voltage application unit 42, the solder paste in the through hole 48 and the terminals of the semiconductor device mounted on the sheet member 40 are melted, and the mounting of the semiconductor device is performed. Is possible. Since the heater element 41 is formed of a heating wire having a different thickness according to the wiring position inside the support 1d, the lower part of the semiconductor device can be locally heated while suppressing temperature variation. The semiconductor device can be repaired with little thermal damage to the wiring board and adjacent mounted components. In addition, when the semiconductor device is mounted again, it is possible to fill the through-hole 48 with a preliminary solder necessary in the manufacturing stage of the sheet member 40, so that a good preliminary solder can be obtained even when adjacent components are mounted around the hole. Can be supplied onto the printed wiring board. Furthermore, even when the semiconductor device is warped by controlling the amount of solder paste filled in the through-hole 48 to a predetermined amount, it is possible to achieve good electrical connection between the semiconductor device and the printed wiring board.

  As shown in FIG. 5A, the sheet member 40 includes a cut portion 45 on the outer peripheral portion and a cut line 46 on the through hole 48. By adopting the cut portion 45 and the cut line 46, when the quality of the semiconductor device mounted on the support 1d is stabilized and it is no longer necessary to repair the semiconductor device, the support 1d portion is mounted with the semiconductor device mounted. It can be removed. Such a removal method will be described.

  The removal of the support 1d is performed using the following removal process. That is, the voltage application unit 42 is cut from the heater element 41, and then the sheet member 40 is cut from the cut portion 45 along the cut line 46, thereby removing the sheet member 40 from between the printed wiring board and the electrical component. In the case where the quality of the semiconductor device is sufficiently stable, such a removal process is performed immediately after the semiconductor device is electrically connected to the printed wiring board via the support in the manufacturing process of the printed wiring board mounted with electrical components. May be.

  As described above, the step of removing the support 1d is performed by removing the support 1d while the semiconductor device is mounted. More specifically, the heater element 41 is first cut by the heater element cut portion 47 and the voltage application portion 42 is removed. Next, the heater element 41 is pulled out from the sheet member 40. Next, the support body 40 is pulled out from the lower part of the semiconductor device while tearing the support body 40 for each cut line 46 on the through hole 48 from the cut portion 45 in the outer peripheral portion of the sheet member 40. Through the above steps, the sheet member 40 and thus the support 1d can be removed while the semiconductor device is mounted. If the support 1d is interposed under the semiconductor device for a long period of time, dust or the like may be involved, and it may be better to remove it from the viewpoint of ensuring long-term reliability. In such a case, the use of the above-described support 1d and the removal step are effective.

  The sheet member 40 further includes an alignment hole 44 for alignment on the printed wiring board. More specifically, as shown in FIG. 5A, there are positioning holes 44 at the four corners of the sheet member 40.

[Method of manufacturing printed circuit board with electrical components]
The method for manufacturing an electric component-mounted printed wiring board of the present invention includes a sheet member provided with a plurality of through holes filled with solder paste therein, and a heater circuit wired so as to surround the periphery of the through holes inside the sheet member And a voltage applying section for applying a voltage to the heater circuit, and a preparation step for preparing a support body in which the filling amount of the solder paste is controlled according to the position of the through hole in the sheet member, and printing An installation process for installing the support at a position where the electrical component is arranged on the wiring board, an arrangement process for arranging the electrical component on the support, and a voltage application unit that operates to apply a voltage to the heater circuit to generate heat. And a connecting step of melting the solder paste provided in the through hole to ensure an electrical connection between the electrical component and the printed wiring board.

  As a result, good electrical connection with the printed wiring board is realized even if the electrical components are warped, the supply of spare solder is easy, the printed wiring board can be downsized, and the electrical characteristics are also good. . Hereinafter, an example of a manufacturing method in an example in which an electrical component is a semiconductor device and a heater circuit is a heater element will be described.

  FIG. 6 is a schematic cross-sectional view showing an example of a method for manufacturing an electric component-mounted printed wiring board according to the present invention. More specifically, FIG. 6 shows a mounting method of the semiconductor device 59 in which the support 1 e is interposed between the printed wiring board 50 and the semiconductor device 59.

  First, a preparation process is performed. In the preparation step, as shown in FIG. 6A, first, a printed wiring board 50 and a support 1e are prepared.

  The support 1e includes a sheet member 53 provided with a plurality of through holes 54 filled therein with solder pastes 57a, 57b, and 57c, and a heater element wired so as to surround the through hole 54 inside the sheet member 53. 56 and a voltage application unit 55 for applying a voltage to the heater element 56, and the filling amount of the solder pastes 57a, 57b, 57c is controlled according to the position of the through hole 54 in the sheet member 53. .

  The sheet member 53 includes a through hole 54 at a position corresponding to the solder ball 510 of the semiconductor device 59 to be mounted, and the through hole 54 is filled with a predetermined amount of solder paste 57a, 57b, 57c. More specifically, the amount of solder paste is filled so as to approach the center of the sheet member 53. More specifically, as shown in FIG. 6A, the through hole 54 provided on the outer periphery of the sheet member 53 is filled with more solder paste 57 a than the other through holes 54. In the through hole 54 near the center of the sheet member 53, the smallest amount of solder paste 57c is filled. Further, the through hole 54 located in the middle between the through hole 54 filled with the solder paste 57a located on the outermost peripheral side of the sheet member 53 and the through hole 54 near the center portion filled with the solder paste 57c. Is filled with an intermediate amount of solder paste 57b. This is a filling configuration of solder paste corresponding to mounting of the semiconductor device 59 that is warped downward with respect to the printed wiring board 50, so that a predetermined filling amount is obtained to absorb the warpage amount of the semiconductor device 59. It is controlled.

  The sheet member 53 is provided with heater elements 56 that are wired so as to surround the peripheries of the through holes 54 therein. More specifically, a heater element 56 is provided around each through hole 54 filled with the solder pastes 57a, 57b, and 57c so as to surround the through hole 54.

  The sheet member 53 further has an alignment hole 58 for alignment on the printed wiring board.

  The sheet member 53 can be manufactured with a base substrate, usually using an FPC manufacturing technique or the like. The solder paste is usually filled in each through-hole 54 with paste-like solder using a device such as a dispenser, and control may be performed so that a predetermined filling amount is obtained at the time of filling.

  A voltage application unit 55 is connected to both ends of the heater element 56 in the support 1e.

  The printed wiring board 50 includes solder ball pads 51 for mounting the semiconductor device 59 and guide posts 52 for positioning the support 53. The guide post is formed on the printed wiring board 50 as a cylindrical protrusion.

  Next, an installation process is performed. In the installation process, the support 1e is installed at a position where the semiconductor device 59 is arranged on the printed wiring board 50 prepared in the preparation process. At this time, as described above, the sheet member 53 has the alignment hole 58 for alignment on the printed wiring board 50, and the guide post 52 corresponding to the alignment hole 58 is installed in the printed wiring board 50. ing. For this reason, as shown in FIGS. 6A and 6B, the support 1e is installed on the printed circuit board 50 so that the alignment hole 58 and the guide post 52 are fitted. More specifically, as shown in FIG. 6B, the support 53 is attached to the printed wiring board 50 while guiding the positioning holes 58 of the sheet member 53 into the guide posts 52 on the printed wiring board 50. At this time, the solder paste filled in the through holes 54 of the support 53 is applied onto the solder ball pads 51 on the printed wiring board 50. In FIG. 6, the size of the through hole 54 is equal to or larger than that of the solder ball pad 51.

  Next, an arrangement process is performed. In the arranging step, the semiconductor device 59 is arranged on the support 1e. More specifically, as shown in FIG. 6C, the solder ball 510 of the semiconductor device 59 that is warped downward with respect to the printed wiring board 50 is mounted so as to be guided into the through hole 54 of the sheet member 53. .

  Next, a connection process is performed. In the connecting step, the voltage applying unit 55 is operated to apply a voltage to the heater element 56 to generate heat, and the solder pastes 57a, 57b, 57c provided in the through hole 54 are melted to print the semiconductor device 59 and the print. Electrical connection with the wiring board 50 is ensured.

  More specifically, as shown in FIG. 5C, the heater element 56 is caused to generate heat by applying a voltage to the voltage application unit 55. Then, by locally heating the mounting portion of the semiconductor device 59 where the solder balls 510 and the solder pastes 57a, 57b, 57c are present, the solder pastes 57a, 57b, 57c and the solder balls 510 in the through hole 54 are melted. The semiconductor device 59 and the printed wiring board 50 are electrically connected. Here, since the sheet member 53 is interposed between the solder balls 510, it is easy to prevent a short circuit between the adjacent solder balls 510.

  Although not shown in FIG. 6, as shown in FIGS. 3 to 5, a cut line provided across the sheet member so that the sheet member passes through at least one or more through holes, and the cut line In addition, the removal step described above may be performed by further including a cut portion provided at the end of the sheet member. That is, after the connection process described above, the voltage application part is cut from the heater element, and then the sheet member is cut from the cut part along the cutting line, and the sheet member is removed from between the printed wiring board and the electrical component. A removing step may be further performed. For example, when the quality of the semiconductor device is sufficiently stable, it is significant to perform the above removal step.

[How to repair printed circuit boards with electrical components]
The method for repairing (repairing) an electric component-mounted printed wiring board according to the present invention uses the electric component-mounted printed wiring board described above, operates the voltage application unit to apply voltage to the heater circuit to generate heat, and penetrates. A step of melting the solder paste provided in the hole and removing the electrical component from the printed wiring board;

  This makes it possible to repair electrical components many times with little thermal damage to the printed wiring board and adjacent mounted components, making it easy to supply spare solder, enabling the printed wiring board to be downsized, The characteristics are also good. Hereinafter, an example of a repair method in an example in which an electrical component is a semiconductor device and a heater circuit is a heater element will be described.

  FIG. 7 is a schematic cross-sectional view showing an example of a method for repairing a printed wiring board mounted with an electric component according to the present invention. As shown in FIG. 7, when the semiconductor device 59 has a failure or the like and is repaired, a voltage is applied to the voltage application unit 55 of the sheet member 53 to heat the heater element 56, and the semiconductor device 59 and the printed wiring board 50 are repaired. The solder 511 that connects them is melted, and the semiconductor device 59 is lifted together with the support 1 e (sheet member 53) and removed from the printed wiring board 50. Thereby, the semiconductor device 59 can be removed from the printed wiring board 50.

  Next, the solder 511 remaining on the ball pad 51 on the printed wiring board 50 is cleaned. Then, the semiconductor device can be repaired by mounting a new semiconductor device on the printed wiring board 50 by a method similar to the method described in FIG.

[Others]
As described above, the support of the present invention, the printed wiring board mounted with an electrical component using the support, the manufacturing method of the printed wiring board mounted with the electrical component, and the repair method of the printed wiring board mounted with the electrical component are described using specific examples. However, the present invention is not limited to the above specific examples, and various variations are conceivable. Some of these variations are described below.

  The sheet member used for the support may be a material having a predetermined heat resistance, and may be a flexible printed board using a polyimide material, cloth, paper, ceramic, or the like.

  As a method for heating the printed wiring board, external heating can be used supplementarily in the heating method of the present invention.

  The form of electrical parts such as a semiconductor device mounted on the support is not limited to BGA, and can be used in general when mounting other forms of electrical parts such as a pin grid array (PGA). is there.

  In order to absorb the shape of the semiconductor device (electrical component), the change in the amount of solder paste filled in the through hole according to the position of the through hole in the sheet member was used in the above specific example in a three-stage method. . However, the present invention is not limited to the above-described three stages, and a predetermined number of stages can be properly used depending on the amount of warp of an electrical component such as a semiconductor device to be mounted.

  The size of the through hole can be formed with a predetermined size with respect to the pad size on the printed wiring board depending on the terminal shape of the electric component to be mounted.

  The method for aligning the support and the printed wiring board according to the present invention is not limited to the method for combining the guide pin and the alignment hole. For example, the method using the alignment mark, the method using the alignment jig, etc. You may perform by the positioning method of.

  The printed wiring board mounted with an electrical component of the present invention has a configuration in which a support is interposed between an electrical component (electronic component) such as a semiconductor device to be mounted and the printed wiring board, and the support is provided for each terminal of the mounted semiconductor device. A plurality of through-holes filled with a predetermined amount of solder paste and a heater circuit formed so as to surround the through-hole, and the filling amount of the solder paste depends on deformation such as the amount of warp of the mounted semiconductor device It is controlled. In addition, by adopting the above configuration, it is possible to mount and repair electrical components (electronic components) such as semiconductor devices. For this reason, the support of the present invention, the printed wiring board mounted with an electrical component, the method for manufacturing the printed wiring board loaded with an electrical component, and the repair method for the printed wiring board loaded with an electrical component are printed circuit boards mounted with electrical components such as semiconductor devices Applicable to all electrical equipment using

It is typical sectional drawing which shows an example of the printed wiring board with an electrical component of this invention. It is a typical top view which shows an example of the support body used for the electrical component mounting printed wiring board of FIG. It is a schematic diagram which shows another example of the support body of this invention. It is a schematic diagram which shows another example of the support body of this invention. It is a schematic diagram which shows another example of the support body of this invention. It is typical sectional drawing which shows an example of the manufacturing method of the electrical component mounting printed wiring board of this invention. It is typical sectional drawing which shows an example of the repair method of the printed wiring board with an electrical component of this invention. It is typical sectional drawing which shows the means to repair a semiconductor device by heating a printed wiring board using a heater. It is typical sectional drawing which shows a means to repair a semiconductor device, when the heat resistant insulating sheet member provided with a some small hole is interposed between a semiconductor device and a printed wiring board. FIG. 5 is a schematic cross-sectional view showing a means for repairing a semiconductor device when a socket connector is provided on a printed wiring board.

Explanation of symbols

1a, 1b, 1c, 1d, 1e Support bodies 2a, 69, 79, 90 Printed wiring boards with electrical components 10, 50, 60, 70, 80 Printed wiring boards 11, 59, 63, 71, 86 Semiconductor devices 12, 22 , 32, 42, 55 Voltage application unit 13, 62, 82, 510 Solder balls 14, 20, 30, 40, 53 Sheet members 15, 23, 33, 43, 57 Solder paste 16, 52 Guide posts 17, 51, 61 , 81 Solder ball pads 18, 66, 76, 88 Chip components 68, 77, 89, 110 Chip component mounting pads 19, 65, 75, 87 Solder fillets 25, 38, 48, 54, 113 Through holes 21, 31 , 41, 56, 111 Heater element 24, 36, 44, 58, 112 Alignment hole 26, 34, 45 Notch 27, 35 46 cutoff line 28,37,47 heater element cutting unit 64 heater 67 heat 72 bumps 73 refractory insulating sheet 74 small holes 83 Socket connector 84 socket contact 85 input and output pins 511 Solder

Claims (12)

A support disposed between a printed wiring board and an electrical component,
A sheet member provided with a plurality of through-holes filled with solder paste therein, a heater circuit wired around the through-hole inside the sheet member, and a voltage for applying a voltage to the heater circuit A voltage application unit,
The support body, wherein the filling amount of the solder paste is controlled in accordance with the position of the through hole in the sheet member.   A cut line provided across the sheet member so that the sheet member passes through at least one or more of the through holes, and a cut portion provided at an end of the sheet member continuously to the cut line; The support according to claim 1, further comprising:   The support according to claim 1 or 2, wherein the sheet member further has an alignment hole for alignment on the printed wiring board.   The support body according to any one of claims 1 to 3, wherein the heater circuit is formed of a heating wire having a different thickness depending on a wiring position inside the sheet member.   The support body according to any one of claims 1 to 3, wherein the heater circuit is formed of a plurality of heating wires traversing the sheet member in parallel.   The support body according to claim 1, wherein a filling amount of the solder paste is controlled in accordance with a shape of the electric component.   An electrical component-mounted printed wiring board comprising the support according to any one of claims 1 to 6 between the printed wiring board and the electrical component.   The printed wiring board with electrical components according to claim 7, wherein the electrical components are semiconductor devices. A printed wiring board, a support, and a method for manufacturing an electrical component-mounted printed wiring board in which electrical components are laminated in this order,
A sheet member provided with a plurality of through-holes filled with solder paste therein, a heater circuit wired around the through-hole inside the sheet member, and a voltage for applying a voltage to the heater circuit A preparatory step of preparing a support body having a voltage application section, and the filling amount of the solder paste being controlled according to the position of the through hole in the sheet member;
An installation step of installing the support at a position where an electrical component is arranged on the printed wiring board;
An arrangement step of arranging an electrical component on the support;
The voltage application unit is operated to apply a voltage to the heater circuit to generate heat, melt the solder paste provided in the through hole, and electrically connect the electrical component and the printed wiring board. A connection process to ensure;
The manufacturing method of the printed wiring board mounted with an electrical component characterized by comprising. A cut line provided across the sheet member so that the sheet member passes through at least one or more of the through-holes, and a cut portion provided at an end of the sheet member continuously to the cut line. In addition,
After the connecting step, the voltage application unit is cut from the heater circuit, and then the sheet member is cut from the cut unit along the cut line, and the sheet member is connected to the printed wiring board and the electrical component. The manufacturing method of the electrical component mounting printed wiring board of Claim 9 further equipped with the removal process removed from between. The sheet member further has an alignment hole for alignment on the printed wiring board, and the printed wiring board is provided with a protrusion corresponding to the alignment hole,
The manufacturing method of the printed wiring board with an electrical component according to claim 9 or 10, wherein, in the installation step, the support is installed on the printed circuit board so that the alignment hole and the protrusion are fitted.   It is the repair method of the electrical component mounting printed wiring board of Claim 7 or 8, Comprising: The said voltage application part was operated, the voltage was applied to the said heater circuit, it was made to heat | fever, and the said provided in the said through-hole A method of repairing an electric component-mounted printed wiring board, comprising: melting a solder paste and removing the electric component from the printed wiring board.

Images