JP2008278029A5 - - Google Patents

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Publication number
JP2008278029A5
JP2008278029A5 JP2007117456A JP2007117456A JP2008278029A5 JP 2008278029 A5 JP2008278029 A5 JP 2008278029A5 JP 2007117456 A JP2007117456 A JP 2007117456A JP 2007117456 A JP2007117456 A JP 2007117456A JP 2008278029 A5 JP2008278029 A5 JP 2008278029A5
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JP
Japan
Prior art keywords
outer peripheral
electronic device
metal plate
metal
peripheral portion
Prior art date
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Granted
Application number
JP2007117456A
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Japanese (ja)
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JP2008278029A (en
JP4891143B2 (en
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Publication date
Application filed filed Critical
Priority to JP2007117456A priority Critical patent/JP4891143B2/en
Priority claimed from JP2007117456A external-priority patent/JP4891143B2/en
Publication of JP2008278029A publication Critical patent/JP2008278029A/en
Publication of JP2008278029A5 publication Critical patent/JP2008278029A5/ja
Application granted granted Critical
Publication of JP4891143B2 publication Critical patent/JP4891143B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (7)

マイクを備える電子機器であって、
前記マイクを内部空間に保持すると共に、外部から伝達される振動を吸収する振動吸収体と、
底面部及び外周部を有するコップ形状を有し、前記底面部が前記マイクの前面を覆い且つ前記外周部が前記マイクの側面を覆うように配され、前記外周部の一部が前記振動吸収体に挿通される金属筐体と、
前記振動吸収体に対して前記金属筐体の前記底面部とは反対側に配され、前記金属筐体の前記外周部の一部の端部と係合する金属板と、
前記金属板に当接して設けられ、前記金属板と当該電子機器の本体とを導通させる導電性部材と、
を備えることを特徴とする電子機器。 An electronic device equipped with a microphone,
A vibration absorber that holds the microphone in the internal space and absorbs vibrations transmitted from the outside,
Has a cup shape having a bottom portion and a peripheral portion, the bottom portion is disposed to and the outer peripheral portion covering the front surface of the microphone cover the side of the microphone, the part of the outer peripheral portion vibrating absorber A metal casing inserted into the
Wherein the said bottom portion of said against the vibration absorber metal housing disposed on the opposite side, a metal plate which engages the part of the end portion of the outer peripheral portion of the metal housing,
Provided in contact with the metal plate, and a conductive member that Ru is conduction between the body of the metal plate and the electronic device,
An electronic device comprising: 前記振動吸収体の外周部に貫通孔が形成されており、前記金属筐体の前記外周部の一部は前記貫通孔に挿通されることを特徴とする請求項１記載の電子機器。 The vibrating outer peripheral portion into the through hole of the absorbing member, is formed, an electronic apparatus according to claim 1, wherein a portion of the outer peripheral portion of the metal housing, characterized in that is inserted into the through hole. 前記金属筐体の前記底面部に集音用の孔が設けられると共に、前記金属筐体の前記外周部の一部の端部に前記金属板を係止する爪部が設けられていることを特徴とする請求項１又は２記載の電子機器。 With holes for sound collection is provided on the bottom surface portion of the metal housing, the Tei Rukoto claw portion for engaging the metal plate portion of the end portion is provided in the outer peripheral portion of the metal housing The electronic device according to claim 1 or 2, characterized in that 前記爪部は、前記金属板が前記金属筐体に対して回動されることにより前記金属板を係止することを特徴とする請求項３記載の電子機器。 The electronic device according to claim 3, wherein the claw portion locks the metal plate when the metal plate is rotated with respect to the metal casing. 前記金属筐体は、前記金属板と電気的に接触していることを特徴とする請求項１乃至４のいずれか１項に記載の電子機器。 The metal housing, the electronic device according to any one of claims 1 to 4, characterized in that in contact with said metal plate and electrically. 前記振動吸収体と前記金属板との間に介装されるスペーサを更に備えることを特徴とする請求項１乃至５のいずれか１項に記載の電子機器。 The electronic apparatus according to claim 1, further comprising a spacer interposed between the vibration absorber and the metal plate. 前記スペーサは、円盤形状を有すると共に、その外周縁部において半径方向に突出する突起部を有し、
前記突起部は、前記振動吸収体の外周縁部から突出するように配置されることを特徴とする請求項６記載の電子機器。 The spacer, which has a circular plate shape, has a projection portion projecting radially at its outer peripheral edge,
The electronic device according to claim 6, wherein the protrusion is disposed so as to protrude from an outer peripheral edge of the vibration absorber .
JP2007117456A 2007-04-26 2007-04-26 Electronics Expired - Fee Related JP4891143B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007117456A JP4891143B2 (en) 2007-04-26 2007-04-26 Electronics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007117456A JP4891143B2 (en) 2007-04-26 2007-04-26 Electronics

Publications (3)

Publication Number Publication Date
JP2008278029A JP2008278029A (en) 2008-11-13
JP2008278029A5 true JP2008278029A5 (en) 2010-06-17
JP4891143B2 JP4891143B2 (en) 2012-03-07

Family

ID=40055496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007117456A Expired - Fee Related JP4891143B2 (en) 2007-04-26 2007-04-26 Electronics

Country Status (1)

Country Link
JP (1) JP4891143B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6832507B2 (en) * 2016-03-01 2021-02-24 パナソニックＩｐマネジメント株式会社 Manufacturing method of microphone array device, microphone array system and microphone array device
JP6664120B2 (en) * 2016-04-13 2020-03-13 パナソニックＩｐマネジメント株式会社 Microphone array system and method of manufacturing microphone array system

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