JP2008271034A - Imaging apparatus, and control method - Google Patents

Imaging apparatus, and control method Download PDF

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JP2008271034A
JP2008271034A JP2007109496A JP2007109496A JP2008271034A JP 2008271034 A JP2008271034 A JP 2008271034A JP 2007109496 A JP2007109496 A JP 2007109496A JP 2007109496 A JP2007109496 A JP 2007109496A JP 2008271034 A JP2008271034 A JP 2008271034A
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imaging device
state imaging
beat noise
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JP5025314B2 (en
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Tsutomu Ogasawara
努 小笠原
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Canon Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of making beat noise and linear scratches inconspicuous, and to provide a control method. <P>SOLUTION: The imaging apparatus is provided with a solid-state imaging element 102 and a digital signal processing part 107. The digital signal processing part 107 is provided with a vertical line/horizontal line detection circuit 204 and a contour emphasis circuit 205. The vertical line/horizontal line detection circuit 204 detects beat noise components or linear scratches in the light shielding part of the solid-state imaging element 102. The contour emphasis circuit 205 controls a contour emphasis amount in contour emphasis processing when generating images on the basis of the signals of the light receiving part of the solid-state imaging element 102 corresponding to the detected result of the beat noise components or the linear scratches by the vertical line/horizontal line detection circuit 204. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、固体撮像素子を備えた撮像装置及び制御方法に関する。   The present invention relates to an imaging device including a solid-state imaging device and a control method.

従来、固体撮像素子を用いて被写体を撮像する撮像装置がある。この種の撮像装置において撮像した被写体の画像を基に、固体撮像素子の画像配列における縦方向に生じる縦線/横方向に生じる横線の有無を判別し、その判別結果を輝度信号処理に反映させる技術が提案されている(例えば、特許文献1参照)。   2. Description of the Related Art Conventionally, there is an imaging device that images a subject using a solid-state imaging device. Based on the image of the subject imaged by this type of imaging device, the presence / absence of vertical lines / horizontal lines generated in the vertical direction in the image array of the solid-state imaging device is determined, and the determination result is reflected in the luminance signal processing. A technique has been proposed (see, for example, Patent Document 1).

また、撮像装置においてスミア(まぶしく光る被写体を撮像した際に光のスジが生じる現象)を補正するスミア補正を行い、固体撮像素子の遮光部の情報を受光部に反映させる技術が提案されている(例えば、特許文献2参照)。
特開昭63-028190号公報 特開2006-024985号公報
In addition, a technique has been proposed in which smear correction (a phenomenon in which light streaks occur when an image of a brightly shining subject is imaged) is corrected in the imaging device, and the information of the light shielding part of the solid-state imaging device is reflected in the light receiving part (For example, refer to Patent Document 2).
JP 63-028190 A JP 2006-024985 A

近年、固体撮像素子の高画素化により駆動周波数の高周波化が進展すると共に、撮像装置の小型化により基板に実装する部品の高密度化が進展している。これに伴い、ビートノイズが撮像装置で処理する映像信号にのりやすくなっているという問題がある。また、固体撮像素子の画素配列における画素ピッチを狭くする狭ピッチ化により、画素配列に線状のキズが発生しやすくなっているという問題がある。ビートノイズに関しては発生源である撮像装置回路内のビートノイズ発生を抑え込むのが大前提であるが、ビートノイズ発生を抑え込むには限界がある。また、固体撮像素子内のビートノイズ発生についても同様である。   In recent years, the driving frequency has been increased due to the increase in the number of pixels of the solid-state imaging device, and the density of components mounted on the substrate has been increased due to the downsizing of the imaging device. Along with this, there is a problem that beat noise tends to be applied to the video signal processed by the imaging apparatus. In addition, there is a problem that linear scratches are likely to occur in the pixel array due to narrowing the pixel pitch in the pixel array of the solid-state imaging device. Regarding beat noise, it is a major premise to suppress the occurrence of beat noise in the imaging device circuit that is the generation source, but there is a limit to suppressing the occurrence of beat noise. The same applies to the generation of beat noise in the solid-state imaging device.

本発明の目的は、ビートノイズや線状のキズを目立たなくすることを可能とした撮像装置及び制御方法を提供することにある。   An object of the present invention is to provide an imaging device and a control method that can make beat noise and linear scratches inconspicuous.

上述の目的を達成するために、本発明の撮像装置は、受光部と遮光部を有する固体撮像素子により被写体の光学像を光電変換することで撮像を行う撮像装置において、前記固体撮像素子の前記遮光部におけるビートノイズ成分もしくは線状のキズの有無を検出する検出手段と、前記固体撮像素子の前記受光部の信号から画像を生成する際の輪郭強調処理における輪郭強調量を、前記検出手段の検出結果に応じて制御する制御手段と、を備えることを特徴とする。   In order to achieve the above-described object, an imaging apparatus according to the present invention is an imaging apparatus that performs imaging by photoelectrically converting an optical image of a subject using a solid-state imaging element having a light-receiving unit and a light-shielding unit. The detection means for detecting the presence or absence of beat noise components or linear flaws in the light shielding portion, and the contour enhancement amount in the contour enhancement processing when generating an image from the signal of the light receiving portion of the solid-state imaging device, And a control means for controlling according to the detection result.

本発明によれば、固体撮像素子の遮光部におけるビートノイズ成分もしくは線状のキズの検出結果を基に、輪郭強調処理における輪郭強調量を制御する。これにより、撮像装置に搭載される固体撮像素子の高画素化や部品の高密度化に起因するビートノイズもしくは線状のキズを目立たなくすることが可能となる。   According to the present invention, the amount of contour enhancement in the contour enhancement processing is controlled based on the detection result of beat noise components or linear flaws in the light shielding portion of the solid-state imaging device. Thereby, it becomes possible to make the beat noise or the linear flaw caused by the increase in the number of pixels of the solid-state image pickup device mounted on the image pickup device and the increase in the density of parts inconspicuous.

以下、本発明の実施の形態を図面に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図1は、本発明の実施の形態に係る撮像装置の構成を示すブロック図である。   FIG. 1 is a block diagram showing a configuration of an imaging apparatus according to an embodiment of the present invention.

図1において、撮像装置は、光学系101、光学系制御部102、固体撮像素子103、撮像系制御部104、アナログ信号処理部105、A/D変換部106を備えている。更に、撮像装置は、デジタル信号処理部107(検出手段、制御手段)、内部記憶部108、インタフェース(以下I/F)部109、画像表示部110、クロック発生回路110、不図示の制御部(制御手段)を備えている。撮像装置は、受光部と遮光部を有する固体撮像素子103により被写体の光学像を光電変換することで撮像を行う。   In FIG. 1, the imaging apparatus includes an optical system 101, an optical system control unit 102, a solid-state imaging device 103, an imaging system control unit 104, an analog signal processing unit 105, and an A / D conversion unit 106. Further, the imaging apparatus includes a digital signal processing unit 107 (detection unit, control unit), an internal storage unit 108, an interface (hereinafter referred to as I / F) unit 109, an image display unit 110, a clock generation circuit 110, and a control unit (not shown). Control means). The imaging apparatus performs imaging by photoelectrically converting an optical image of a subject using a solid-state imaging device 103 having a light receiving unit and a light shielding unit.

光学系101は、撮像装置による被写体の撮影に伴い入射した光を固体撮像素子103に結像させる。光学系制御部102は、光学系101における露出動作、ズーム動作、フォーカス動作等を制御する。固体撮像素子103は、画像生成領域が含まれる受光部と遮光部とを有し、光学系101を介して結像された被写体の光学像を電気信号に変換する光電変換を行う。撮像系制御部104は、固体撮像素子103を駆動する。アナログ信号処理部105は、固体撮像素子103から出力される信号をクランプする処理、ゲインをかける処理等を行う。   The optical system 101 forms an image of incident light on the solid-state image sensor 103 as the subject is imaged by the imaging apparatus. The optical system control unit 102 controls the exposure operation, zoom operation, focus operation, and the like in the optical system 101. The solid-state imaging device 103 includes a light receiving unit and a light shielding unit including an image generation region, and performs photoelectric conversion that converts an optical image of a subject formed through the optical system 101 into an electric signal. The imaging system control unit 104 drives the solid-state imaging device 103. The analog signal processing unit 105 performs a process of clamping a signal output from the solid-state image sensor 103, a process of applying a gain, and the like.

A/D変換部106は、アナログ信号処理部105から出力されるアナログ信号をデジタル信号にアナログ/デジタル(A/D)変換する。デジタル信号処理部107は、A/D変換部106によりA/D変換されたデジタル信号から出力対象の画像データを生成する。内部記憶部108は、デジタル信号処理部107により出力対象の画像データを生成する際に一時的に画像データを格納する。   The A / D conversion unit 106 performs analog / digital (A / D) conversion of the analog signal output from the analog signal processing unit 105 into a digital signal. The digital signal processing unit 107 generates image data to be output from the digital signal A / D converted by the A / D conversion unit 106. The internal storage unit 108 temporarily stores image data when the digital signal processing unit 107 generates image data to be output.

I/F部109は、デジタル信号処理部107により生成された画像データを最終的に保存するための外部記憶装置とのインタフェースを司る。画像表示部110は、デジタル信号処理部107により生成された画像データを表示する電子ファインダとしての表示部である。クロック発生回路110は、アナログ系の構成素子とデジタル系の構成素子にそれぞれ駆動クロックを供給する。制御部(不図示)は、撮像装置全体の制御を司ると共に、制御プログラムに基づき図3のフローチャートに示す処理を実行する。   The I / F unit 109 manages an interface with an external storage device for finally storing the image data generated by the digital signal processing unit 107. The image display unit 110 is a display unit as an electronic viewfinder that displays the image data generated by the digital signal processing unit 107. The clock generation circuit 110 supplies drive clocks to analog components and digital components, respectively. A control unit (not shown) controls the entire imaging apparatus and executes the processing shown in the flowchart of FIG. 3 based on the control program.

更に、図1では、アナログ系の構成素子とデジタル系の構成素子の駆動クロックが異なることにより、33.75MHz(アナログ系)と27MHz(デジタル系)の差分の周波数がアナログ系の構成素子にビートノイズ成分として乗ることを示している。ビートノイズ成分は、構成素子の配置、信号線の配線上の問題、電源の揺れ(電圧変動)などにより発生し、そのレベルは構成により大きく異なる。   In addition, in FIG. 1, the difference between 33.75 MHz (analog) and 27 MHz (digital) differs between the analog component and the digital component because the drive clock of the analog component is different from that of the analog component. It shows riding as a component. The beat noise component is generated due to the arrangement of the constituent elements, the problem of the wiring of the signal line, the fluctuation of the power supply (voltage fluctuation), and the level varies greatly depending on the configuration.

図2は、撮像装置のデジタル信号処理部107の構成を示すブロック図である。   FIG. 2 is a block diagram illustrating a configuration of the digital signal processing unit 107 of the imaging apparatus.

図2において、デジタル信号処理部107の構成のうち、画像データの生成と固体撮像素子の遮光部の縦線・横線検出を行う部分の構成を示している。デジタル信号処理部107は、色変換回路201、色処理回路202、輝度処理回路203、縦線・横線検出回路204(検出手段)、輪郭強調回路205(制御手段)、合成回路206を備えている。   FIG. 2 shows the configuration of the digital signal processing unit 107 that generates image data and detects the vertical and horizontal lines of the light shielding unit of the solid-state imaging device. The digital signal processing unit 107 includes a color conversion circuit 201, a color processing circuit 202, a luminance processing circuit 203, a vertical / horizontal line detection circuit 204 (detection means), an outline enhancement circuit 205 (control means), and a synthesis circuit 206. .

色変換回路201は、A/D変換部106によりA/D変換され入力された画像信号(RGB信号)から輝度信号Yと色差信号Cr、Cbを生成し分離する。色処理回路202は、色差信号Cr、Cbに対してホワイトバランス処理、高輝度/低輝度の色の濃さを薄くする色消し処理、ガンマ処理等を行う。輝度処理回路203は、輝度信号Yに対してフィルタ処理、輝度補正処理、ガンマ処理等を行う。   The color conversion circuit 201 generates and separates a luminance signal Y and color difference signals Cr and Cb from the image signal (RGB signal) input after A / D conversion by the A / D conversion unit 106. The color processing circuit 202 performs white balance processing, achromatic processing for reducing the intensity of high / low luminance colors, gamma processing, and the like on the color difference signals Cr and Cb. The luminance processing circuit 203 performs filter processing, luminance correction processing, gamma processing, and the like on the luminance signal Y.

縦線・横線検出回路204は、固体撮像素子103の遮光部における縦方向のビートノイズ成分もしくは線状のキズ(縦線)の有無の検出と、横方向のビートノイズ成分もしくは線状のキズ(横線)の有無の検出を行う。本実施の形態では、固体撮像素子103の画素配列における露光する前の縦線・横線を検出する。輪郭強調回路205は、輝度信号Yに対してフィルタ処理を施し、縦線・横線検出回路204の縦線・横線判定を考慮して輪郭強調を行う。本実施の形態では、縦線・横線を判定すると共に縦線・横線別に輪郭強調を行う。合成回路206は、輝度信号Yと色差信号Cr、Cbを合成してYCrCb信号として出力する。   The vertical line / horizontal line detection circuit 204 detects the presence or absence of a vertical beat noise component or a linear flaw (vertical line) in the light-shielding portion of the solid-state image sensor 103, and detects a horizontal beat noise component or a linear flaw ( Detection of the presence or absence of horizontal lines). In the present embodiment, vertical lines and horizontal lines before exposure in the pixel array of the solid-state image sensor 103 are detected. The contour emphasis circuit 205 performs filter processing on the luminance signal Y, and performs contour emphasis in consideration of the vertical line / horizontal line determination of the vertical line / horizontal line detection circuit 204. In this embodiment, vertical lines and horizontal lines are determined, and contour enhancement is performed for each vertical line and horizontal line. The synthesizing circuit 206 synthesizes the luminance signal Y and the color difference signals Cr and Cb and outputs them as YCrCb signals.

本実施の形態は以下の特徴を有する。   This embodiment has the following features.

縦線・横線検出回路204は、固体撮像素子の遮光部におけるビートノイズ成分もしくは線状のキズの有無を検出する。輪郭強調回路205は、固体撮像素子の受光部の信号から画像を生成する際の輪郭強調処理における輪郭強調量を、縦線・横線検出回路204の検出結果に応じて制御する。   The vertical / horizontal line detection circuit 204 detects the presence or absence of beat noise components or linear flaws in the light-shielding portion of the solid-state imaging device. The contour emphasis circuit 205 controls the amount of contour emphasis in the contour emphasis process when generating an image from the signal of the light receiving unit of the solid-state imaging device according to the detection result of the vertical line / horizontal line detection circuit 204.

後述する図4の場合は、固体撮像素子の受光部と遮光部をそれぞれ単一の領域とする。縦線・横線検出回路204は、固体撮像素子の遮光部の単一の領域についてビートノイズ成分もしくは線状のキズの有無を検出する。輪郭強調回路205は、縦線・横線検出回路204により遮光部の単一の領域においてビートノイズ成分もしくは線状のキズが検出された場合、次の制御を行う。固体撮像素子の受光部の単一の領域について輪郭強調処理における輪郭強調量を弱める制御を行う。   In the case of FIG. 4 to be described later, the light receiving portion and the light shielding portion of the solid-state imaging device are each set as a single region. The vertical / horizontal line detection circuit 204 detects the presence or absence of beat noise components or linear flaws in a single region of the light-shielding portion of the solid-state imaging device. The contour emphasis circuit 205 performs the following control when a beat noise component or a linear flaw is detected in a single region of the light shielding portion by the vertical line / horizontal line detection circuit 204. Control is performed to weaken the contour enhancement amount in the contour enhancement processing for a single region of the light receiving unit of the solid-state imaging device.

後述する図5の場合は、固体撮像素子の受光部と遮光部をそれぞれ複数の領域に分割する。縦線・横線検出回路204は、固体撮像素子の遮光部の各領域についてビートノイズ成分もしくは線状のキズの有無を検出する。輪郭強調回路205は、縦線・横線検出回路204により遮光部の各領域のうち該当領域においてビートノイズ成分もしくは線状のキズが検出された場合、次の制御を行う。固体撮像素子の受光部の各領域のうち遮光部の該当領域に対応する領域について輪郭強調処理における輪郭強調量を弱める制御を行う。   In the case of FIG. 5 to be described later, the light receiving portion and the light shielding portion of the solid-state imaging device are each divided into a plurality of regions. The vertical / horizontal line detection circuit 204 detects the presence or absence of beat noise components or linear flaws in each region of the light-shielding portion of the solid-state imaging device. The contour emphasis circuit 205 performs the following control when a beat noise component or a linear flaw is detected in the corresponding area among the areas of the light shielding portion by the vertical line / horizontal line detection circuit 204. Control is performed to weaken the contour enhancement amount in the contour enhancement processing for the region corresponding to the corresponding region of the light shielding portion among the regions of the light receiving unit of the solid-state imaging device.

また、縦線・横線検出回路204は、固体撮像素子の遮光部を構成する複数の画素ごとにビートノイズ成分もしくは線状のキズの有無を検出する。輪郭強調回路205は、縦線・横線検出回路204により遮光部の各画素のうち該当画素においてビートノイズ成分もしくは線状のキズが検出された場合、次の制御を行う。固体撮像素子の受光部を構成する複数の画素のうち遮光部の該当画素に対応する画素について輪郭強調処理における輪郭強調量を弱める制御を行う。   The vertical line / horizontal line detection circuit 204 detects the presence or absence of beat noise components or linear flaws for each of a plurality of pixels constituting the light-shielding portion of the solid-state imaging device. The contour emphasis circuit 205 performs the following control when the vertical line / horizontal line detection circuit 204 detects a beat noise component or a linear flaw in a corresponding pixel among the pixels of the light shielding portion. Control is performed to weaken the edge enhancement amount in the edge enhancement processing for the pixels corresponding to the corresponding pixels of the light shielding portion among the plurality of pixels constituting the light receiving portion of the solid-state imaging device.

また、縦線・横線検出回路204は、固体撮像素子の遮光部におけるビートノイズ成分もしくは線状のキズとして、固体撮像素子における一方向の線(縦線)の有無、該一方向に交差する他方向の線(横線)の有無を検出する。輪郭強調回路205は、縦線・横線検出回路204により一方向の線あるいは他方向の線が検出された場合、次の制御を行う。一方向の輪郭強調量あるいは他方向の輪郭強調量を個別に弱める制御を行う。   In addition, the vertical line / horizontal line detection circuit 204 detects whether or not there is a line (vertical line) in one direction in the solid-state image sensor as a beat noise component or a linear flaw in the light-shielding portion of the solid-state image sensor, and crosses the one direction. The presence or absence of a direction line (horizontal line) is detected. The outline emphasis circuit 205 performs the following control when the vertical line / horizontal line detection circuit 204 detects a line in one direction or a line in the other direction. Control is performed to individually weaken the contour enhancement amount in one direction or the contour enhancement amount in the other direction.

次に、上記構成を有する本実施の形態の撮像装置における動作を図1乃至図5を参照しながら詳細に説明する。   Next, the operation of the imaging apparatus according to the present embodiment having the above-described configuration will be described in detail with reference to FIGS.

図3は、固体撮像素子の横線・縦線検出に関するフローチャートである。(a)は、横線検出処理を示すフローチャート、(b)は、縦線検出処理を示すフローチャートである。本フローチャートに示す処理は、撮像装置の制御部がデジタル信号処理部107の縦線・横線検出回路204と輪郭強調回路205を用いて制御プログラムに基づき実行する。   FIG. 3 is a flowchart regarding horizontal / vertical line detection of the solid-state imaging device. (A) is a flowchart which shows a horizontal line detection process, (b) is a flowchart which shows a vertical line detection process. The processing shown in this flowchart is executed based on a control program by the control unit of the imaging apparatus using the vertical / horizontal line detection circuit 204 and the contour enhancement circuit 205 of the digital signal processing unit 107.

図3(a)において、撮像装置の制御部は、固体撮像素子103の水平OB部に関して横方向に画素の平均値を求め(ステップS301)、画素の平均値と予め設定されている閾値とを比較する(ステップS302)。比較の比較から閾値より大きい画素が存在した場合、制御部は、垂直輪郭強調量(垂直輪郭強調パラメータ)を一定量弱める判定(制御)を行う(ステップS303)。   3A, the control unit of the imaging apparatus obtains an average value of pixels in the horizontal direction with respect to the horizontal OB portion of the solid-state image sensor 103 (step S301), and calculates the average value of pixels and a preset threshold value. Compare (step S302). If there is a pixel larger than the threshold value from the comparison, the control unit performs determination (control) to weaken the vertical contour enhancement amount (vertical contour enhancement parameter) by a certain amount (step S303).

図3(b)において、撮像装置の制御部は、固体撮像素子103の垂直OB部に関して縦方向に画素の平均値を求め(ステップS304)、画素の平均値と予め設定されている閾値とを比較する(ステップS305)。比較の比較から閾値より大きい画素が存在した場合、制御部は、水平輪郭強調量(水平輪郭強調パラメータ)を一定量弱める判定(制御)を行う(ステップS306)。   In FIG. 3B, the control unit of the imaging apparatus obtains the average value of the pixels in the vertical direction with respect to the vertical OB part of the solid-state image sensor 103 (step S304), and calculates the average value of the pixels and a preset threshold value. Compare (step S305). If there is a pixel larger than the threshold value from the comparison, the control unit performs determination (control) to weaken the horizontal contour enhancement amount (horizontal contour enhancement parameter) by a certain amount (step S306).

尚、図3(a)と図3(b)に示す処理では閾値を1つ設定し、変更可能とする輪郭強調量も2値であるが、これに限定されるものではなく、閾値を複数設定してもよい。   In the processes shown in FIGS. 3A and 3B, one threshold is set and the amount of contour enhancement that can be changed is also binary. However, the present invention is not limited to this. It may be set.

図4は、固体撮像素子の画面一律輪郭強調量を変更可能とする場合の動作を説明する図である。図4(a)は、固体撮像素子の画素配列を示す図、図4(b)は、水平、垂直OB演算領域を示す図、図4(c)は、垂直輪郭強調量を示す図、図4(d)は、水平輪郭強調量を示す図である。   FIG. 4 is a diagram for explaining an operation in a case where the uniform outline enhancement amount of the screen of the solid-state imaging device can be changed. 4A is a diagram showing a pixel arrangement of a solid-state imaging device, FIG. 4B is a diagram showing horizontal and vertical OB calculation areas, and FIG. 4C is a diagram showing vertical contour enhancement amounts. 4 (d) is a diagram showing the amount of horizontal contour emphasis.

図4(a)に示すように、固体撮像素子は、出力する画像を生成する画像生成領域401、受光部402、遮光部403を備えている。図示の例では、固体撮像素子の画素配列において、横線A、横線B、縦線Cの3本のビートノイズ成分もしくは線状のキズがある場合を示している。   As shown in FIG. 4A, the solid-state imaging device includes an image generation region 401 for generating an output image, a light receiving unit 402, and a light shielding unit 403. In the illustrated example, there is shown a case where there are three beat noise components of a horizontal line A, a horizontal line B, and a vertical line C or a linear scratch in the pixel array of the solid-state imaging device.

図4(b)に示すように、固体撮像素子には、画像生成領域401の横方向の辺と縦方向の辺にそれぞれ対応して、水平OB(Optical Black:遮光部)演算領域404(HOB)と垂直OB演算領域405(VOB)が設けられている。水平OB演算領域404では横線の検出を行い、垂直OB演算領域405では縦線の検出を行う。ここで、横線Aと縦線Cが低いレベルの線状のキズ、横線Bが高いレベルの線状のキズであると仮定する。   As shown in FIG. 4B, the solid-state imaging device has a horizontal OB (Optical Black: light-shielding portion) calculation area 404 (HOB) corresponding to the horizontal side and the vertical side of the image generation area 401, respectively. ) And a vertical OB calculation area 405 (VOB). In the horizontal OB calculation area 404, horizontal lines are detected, and in the vertical OB calculation area 405, vertical lines are detected. Here, it is assumed that the horizontal line A and the vertical line C are low-level linear scratches, and the horizontal line B is a high-level linear scratch.

このとき、水平OB演算領域404に高いレベルの横線Bがあるため、図4(c)に示すように、垂直輪郭強調量はかなり弱める制御を行う(−2と表現)。また、垂直OB演算領域405には低いレベルの縦線Cがあるため、図4(d)に示すように、水平輪郭強調量は少なめにやや弱める制御を行う(−1と表現)。以上のように、固体撮像素子の画素配列において高いレベルの横線と低いレベルの縦線が検出された場合、輪郭強調回路205は、垂直輪郭強調量を−2、水平輪郭強調量を−1にそれぞれ設定する。   At this time, since there is a high level horizontal line B in the horizontal OB calculation area 404, as shown in FIG. 4C, the vertical outline enhancement amount is controlled to be considerably weakened (expressed as -2). Further, since there is a low level vertical line C in the vertical OB calculation area 405, the horizontal outline emphasis amount is controlled to be slightly weakened (expressed as -1) as shown in FIG. As described above, when a high-level horizontal line and a low-level vertical line are detected in the pixel array of the solid-state imaging device, the contour enhancement circuit 205 sets the vertical contour enhancement amount to −2 and the horizontal contour enhancement amount to −1. Set each.

図5は、固体撮像素子の領域ごとに輪郭強調量を変更可能とする場合の動作を説明する図である。図5(a)は、固体撮像素子の画素配列を示す図、図5(b)は、水平、垂直OB演算領域を示す図、図5(c)は、垂直輪郭強調量を示す図、図5(d)は、水平輪郭強調量を示す図である。   FIG. 5 is a diagram for explaining the operation when the contour enhancement amount can be changed for each region of the solid-state imaging device. 5A is a diagram showing a pixel arrangement of a solid-state imaging device, FIG. 5B is a diagram showing horizontal and vertical OB calculation regions, and FIG. 5C is a diagram showing vertical contour enhancement amounts. FIG. 5D is a diagram illustrating the amount of horizontal contour enhancement.

図5(a)に示すように、固体撮像素子は、画面が複数の領域に分割されると共に、画像生成領域501、受光部502、遮光部503を備えている。図示の例では、固体撮像素子の画素配列において、横線A、横線B、縦線Cの3本のビートノイズ成分もしくは線状のキズがある場合を示している。   As illustrated in FIG. 5A, the solid-state imaging device includes an image generation region 501, a light receiving unit 502, and a light shielding unit 503 while the screen is divided into a plurality of regions. In the illustrated example, there is shown a case where there are three beat noise components of a horizontal line A, a horizontal line B, and a vertical line C or a linear scratch in the pixel array of the solid-state imaging device.

図5(b)に示すように、固体撮像素子には、画像生成領域501を縦横各4つに分割した各分割部分にそれぞれ対応して、水平OB演算領域504(HOB1〜4)と垂直OB演算領域505(VOB1〜4)が設けられている。水平OB演算領域504では横線の検出を行い、垂直OB演算領域505では縦線の検出を行う。ここで、横線Aと縦線Cが低いレベルの線状のキズ、横線Bが高いレベルの線状のキズであると仮定する。   As shown in FIG. 5B, the solid-state imaging device includes a horizontal OB calculation area 504 (HOB1 to 4) and a vertical OB corresponding to each of the divided parts obtained by dividing the image generation area 501 into four in each direction. Calculation areas 505 (VOB1 to VOB4) are provided. In the horizontal OB calculation area 504, horizontal lines are detected, and in the vertical OB calculation area 505, vertical lines are detected. Here, it is assumed that the horizontal line A and the vertical line C are low-level linear scratches, and the horizontal line B is a high-level linear scratch.

このとき、水平OB演算領域HOB2には低いレベルの横線A、水平OB演算領域HOB3には高いレベルの横線Bがあるため、図5(c)に示すように、垂直輪郭強調量をブロックごとに設定する。即ち、輪郭強調回路205は、横線Aがある領域は垂直輪郭強調量を−1、横線Bがある領域は垂直輪郭強調量を−2、横線が検出されなかった領域は垂直輪郭強調量を0にそれぞれ設定する。   At this time, since the horizontal OB calculation area HOB2 has a low level horizontal line A and the horizontal OB calculation area HOB3 has a high level horizontal line B, as shown in FIG. Set. That is, the contour emphasis circuit 205 sets the vertical contour emphasis amount to −1 for the region with the horizontal line A, −2 to the vertical contour emphasis amount for the region with the horizontal line B, and sets the vertical contour emphasis amount to 0 for the region where the horizontal line is not detected. Set to each.

また、垂直OB演算領域VOB3には低いレベルの縦線Cがあるため、図5(d)に示すように、水平輪郭強調量をブロックごとに設定する。即ち、輪郭強調回路205は、縦線Cがある領域は水平輪郭強調量を−1、縦線が検出されなかった領域は水平輪郭強調量を0にそれぞれ設定する。   Further, since there is a low level vertical line C in the vertical OB calculation area VOB3, as shown in FIG. 5D, the horizontal outline emphasis amount is set for each block. That is, the contour emphasizing circuit 205 sets the horizontal contour emphasis amount to −1 for the region with the vertical line C, and 0 to the horizontal contour emphasis amount for the region where the vertical line is not detected.

尚、図5では固体撮像素子の画像生成領域501を複数の領域に分割したが、これに限定されるものではなく、固体撮像素子の各画素ごとに縦線・横線を検出し、輪郭強調量(輪郭強調パラメータ)に反映させてもよい。   In FIG. 5, the image generation area 501 of the solid-state image sensor is divided into a plurality of areas. However, the present invention is not limited to this, and vertical and horizontal lines are detected for each pixel of the solid-state image sensor, and the amount of contour enhancement is determined. It may be reflected in (contour emphasis parameter).

以上説明したように、本実施の形態によれば、固体撮像素子の遮光部における縦方向のビートノイズ成分もしくは線状のキズ(縦線)と、横方向のビートノイズ成分もしくは線状のキズ(横線)の検出を行う。そして、ビートノイズ成分もしくは線状のキズの検出結果に応じて、固体撮像素子の受光部の信号から画像を生成する際の輪郭強調処理における輪郭強調量を制御する。これにより、撮像装置に搭載される固体撮像素子の高画素化や部品の高密度化に起因するビートノイズもしくは線状のキズを目立たなくすることが可能となる。   As described above, according to the present embodiment, the beat noise component or linear scratch (vertical line) in the vertical direction and the beat noise component or linear scratch (in the horizontal direction) in the light-shielding portion of the solid-state imaging device ( (Horizontal line) is detected. Then, according to the detection result of the beat noise component or the linear flaw, the amount of contour enhancement in the contour enhancement processing when generating an image from the signal of the light receiving unit of the solid-state imaging device is controlled. Thereby, it becomes possible to make the beat noise or the linear flaw caused by the increase in the number of pixels of the solid-state image pickup device mounted on the image pickup device and the increase in the density of parts inconspicuous.

本発明の実施の形態に係る撮像装置の構成を示すブロック図である。It is a block diagram which shows the structure of the imaging device which concerns on embodiment of this invention. 撮像装置のデジタル信号処理部の構成を示すブロック図である。It is a block diagram which shows the structure of the digital signal processing part of an imaging device. 固体撮像素子の横線・縦線検出に関するフローチャートである。(a)は、横線検出処理を示すフローチャート、(b)は、縦線検出処理を示すフローチャートである。It is a flowchart regarding horizontal line and vertical line detection of a solid-state image sensor. (A) is a flowchart which shows a horizontal line detection process, (b) is a flowchart which shows a vertical line detection process. 固体撮像素子の画面一律輪郭強調量を変更可能とする場合の動作を説明する図である。(a)は、固体撮像素子の画素配列を示す図、(b)は、水平、垂直OB演算領域を示す図、(c)は、垂直輪郭強調量を示す図、(d)は、水平輪郭強調量を示す図である。It is a figure explaining operation | movement in the case of enabling change of the screen uniform outline emphasis amount of a solid-state image sensor. (A) is a figure which shows the pixel arrangement | sequence of a solid-state image sensor, (b) is a figure which shows a horizontal and vertical OB calculation area | region, (c) is a figure which shows the amount of vertical outline emphasis, (d) is a horizontal outline. It is a figure which shows the emphasis amount. 固体撮像素子の領域ごとに輪郭強調量を変更可能とする場合の動作を説明する図である。(a)は、固体撮像素子の画素配列を示す図、(b)は、水平、垂直OB演算領域を示す図、(c)は、垂直輪郭強調量を示す図、(d)は、水平輪郭強調量を示す図である。It is a figure explaining operation | movement in the case of enabling change of an outline emphasis amount for every area | region of a solid-state image sensor. (A) is a figure which shows the pixel arrangement | sequence of a solid-state image sensor, (b) is a figure which shows a horizontal and vertical OB calculation area | region, (c) is a figure which shows the amount of vertical outline emphasis, (d) is a horizontal outline. It is a figure which shows the emphasis amount.

符号の説明Explanation of symbols

103 固体撮像素子
104 撮像系制御部
107 デジタル信号処理部
111 クロック発生回路
201 色変換回路
202 色処理回路
203 輝度処理回路
204 縦線・横線検出回路
205 輪郭強調回路
401 画像生成領域
402 受光部
403 遮光部
404 水平OB演算領域
405 垂直OB演算領域
DESCRIPTION OF SYMBOLS 103 Solid-state image sensor 104 Imaging system control part 107 Digital signal processing part 111 Clock generation circuit 201 Color conversion circuit 202 Color processing circuit 203 Luminance processing circuit 204 Vertical line / horizontal line detection circuit 205 Outline enhancement circuit 401 Image generation area 402 Light receiving part 403 Light shielding Section 404 Horizontal OB calculation area 405 Vertical OB calculation area

Claims (10)

受光部と遮光部を有する固体撮像素子により被写体の光学像を光電変換することで撮像を行う撮像装置において、
前記固体撮像素子の前記遮光部におけるビートノイズ成分もしくは線状のキズの有無を検出する検出手段と、
前記固体撮像素子の前記受光部の信号から画像を生成する際の輪郭強調処理における輪郭強調量を、前記検出手段の検出結果に応じて制御する制御手段と、
を備えることを特徴とする撮像装置。
In an imaging device that performs imaging by photoelectrically converting an optical image of a subject by a solid-state imaging device having a light receiving unit and a light shielding unit,
Detecting means for detecting the presence or absence of beat noise components or linear flaws in the light-shielding portion of the solid-state imaging device;
Control means for controlling the amount of contour enhancement in contour enhancement processing when generating an image from the signal of the light receiving unit of the solid-state imaging device according to the detection result of the detection means;
An imaging apparatus comprising:
前記固体撮像素子の前記受光部と前記遮光部をそれぞれ単一の領域とし、
前記検出手段は、前記固体撮像素子の前記遮光部の前記単一の領域についてビートノイズ成分もしくは線状のキズの有無を検出し、
前記制御手段は、前記検出手段により前記遮光部の前記単一の領域においてビートノイズ成分もしくは線状のキズが検出された場合、前記固体撮像素子の前記受光部の前記単一の領域について前記輪郭強調処理における輪郭強調量を弱める制御を行うことを特徴とする請求項1記載の撮像装置。
Each of the light receiving portion and the light shielding portion of the solid-state image sensor is a single region,
The detection means detects the presence or absence of beat noise components or linear flaws for the single region of the light-shielding portion of the solid-state imaging device,
When the detection means detects a beat noise component or a linear flaw in the single region of the light shielding unit, the contour of the single region of the light receiving unit of the solid-state imaging device is the contour. The imaging apparatus according to claim 1, wherein control for weakening an edge enhancement amount in the enhancement processing is performed.
前記固体撮像素子の前記受光部と前記遮光部をそれぞれ複数の領域に分割し、
前記検出手段は、前記固体撮像素子の前記遮光部の前記各領域についてビートノイズ成分もしくは線状のキズの有無を検出し、
前記制御手段は、前記検出手段により前記遮光部の前記各領域のうち該当領域においてビートノイズ成分もしくは線状のキズが検出された場合、前記固体撮像素子の前記受光部の前記各領域のうち前記遮光部の前記該当領域に対応する領域について前記輪郭強調処理における輪郭強調量を弱める制御を行うことを特徴とする請求項1記載の撮像装置。
Dividing the light-receiving portion and the light-shielding portion of the solid-state image sensor into a plurality of regions,
The detection means detects the presence or absence of beat noise components or linear flaws for each region of the light-shielding portion of the solid-state imaging device,
When the beat noise component or the linear flaw is detected in the corresponding region among the regions of the light shielding unit by the detecting unit, the control unit includes the region of the light receiving unit of the solid-state imaging device. The imaging apparatus according to claim 1, wherein control is performed to weaken a contour emphasis amount in the contour emphasis processing for a region corresponding to the corresponding region of the light shielding unit.
前記検出手段は、前記固体撮像素子の前記遮光部を構成する複数の画素ごとにビートノイズ成分もしくは線状のキズの有無を検出し、
前記制御手段は、前記検出手段により前記遮光部の前記各画素のうち該当画素においてビートノイズ成分もしくは線状のキズが検出された場合、前記固体撮像素子の前記受光部を構成する複数の画素のうち前記遮光部の前記該当画素に対応する画素について前記輪郭強調処理における輪郭強調量を弱める制御を行うことを特徴とする請求項1記載の撮像装置。
The detecting means detects the presence or absence of beat noise components or linear flaws for each of a plurality of pixels constituting the light shielding portion of the solid-state imaging device,
When the detection means detects a beat noise component or a linear flaw in the corresponding pixel among the pixels of the light shielding unit, the control unit detects a plurality of pixels constituting the light receiving unit of the solid-state imaging device. The image pickup apparatus according to claim 1, wherein control is performed to weaken a contour enhancement amount in the contour enhancement processing for a pixel corresponding to the corresponding pixel of the light shielding unit.
前記検出手段は、前記固体撮像素子の前記遮光部におけるビートノイズ成分もしくは線状のキズとして、前記固体撮像素子における一方向の線の有無、該一方向に交差する他方向の線の有無を検出し、
前記制御手段は、前記検出手段により前記一方向の線あるいは前記他方向の線が検出された場合、前記一方向の輪郭強調量あるいは前記他方向の輪郭強調量を個別に弱める制御を行うことを特徴とする請求項2乃至4のいずれかに記載の撮像装置。
The detection means detects the presence or absence of a line in one direction and the presence or absence of a line in the other direction intersecting the one direction as a beat noise component or a linear flaw in the light shielding portion of the solid-state image sensor. And
The control means performs control to individually weaken the contour enhancement amount in the one direction or the contour enhancement amount in the other direction when the line in the one direction or the line in the other direction is detected by the detection means. The imaging apparatus according to claim 2, wherein the imaging apparatus is characterized.
受光部と遮光部を有する固体撮像素子により被写体の光学像を光電変換することで撮像を行う撮像装置の制御方法において、
前記固体撮像素子の前記遮光部におけるビートノイズ成分もしくは線状のキズの有無を検出する検出ステップと、
前記固体撮像素子の前記受光部の信号から画像を生成する際の輪郭強調処理における輪郭強調量を、前記検出ステップの検出結果に応じて制御する制御ステップと、
を有することを特徴とする制御方法。
In a control method of an imaging device that performs imaging by photoelectrically converting an optical image of a subject by a solid-state imaging device having a light receiving unit and a light shielding unit,
A detection step of detecting the presence or absence of beat noise components or linear flaws in the light-shielding portion of the solid-state imaging device;
A control step of controlling the amount of contour enhancement in the contour enhancement processing when generating an image from the signal of the light receiving unit of the solid-state imaging device according to the detection result of the detection step;
A control method characterized by comprising:
前記固体撮像素子の前記受光部と前記遮光部をそれぞれ単一の領域とし、
前記検出ステップでは、前記固体撮像素子の前記遮光部の前記単一の領域についてビートノイズ成分もしくは線状のキズの有無を検出し、
前記制御ステップでは、前記検出ステップにより前記遮光部の前記単一の領域においてビートノイズ成分もしくは線状のキズが検出された場合、前記固体撮像素子の前記受光部の前記単一の領域について前記輪郭強調処理における輪郭強調量を弱める制御を行うことを特徴とする請求項6記載の制御方法。
Each of the light receiving portion and the light shielding portion of the solid-state image sensor is a single region,
In the detection step, the presence or absence of a beat noise component or a linear scratch is detected for the single region of the light-shielding portion of the solid-state imaging device,
In the control step, when a beat noise component or a linear flaw is detected in the single region of the light shielding unit by the detection step, the contour of the single region of the light receiving unit of the solid-state imaging device is detected. The control method according to claim 6, wherein control for weakening a contour enhancement amount in the enhancement processing is performed.
前記固体撮像素子の前記受光部と前記遮光部をそれぞれ複数の領域に分割し、
前記検出ステップでは、前記固体撮像素子の前記遮光部の前記各領域についてビートノイズ成分もしくは線状のキズの有無を検出し、
前記制御ステップでは、前記検出ステップにより前記遮光部の前記各領域のうち該当領域においてビートノイズ成分もしくは線状のキズが検出された場合、前記固体撮像素子の前記受光部の前記各領域のうち前記遮光部の前記該当領域に対応する領域について前記輪郭強調処理における輪郭強調量を弱める制御を行うことを特徴とする請求項6記載の制御方法。
Dividing the light-receiving portion and the light-shielding portion of the solid-state image sensor into a plurality of regions,
In the detection step, the presence or absence of a beat noise component or a linear scratch is detected for each region of the light-shielding portion of the solid-state imaging device,
In the control step, when a beat noise component or a linear flaw is detected in the corresponding region among the regions of the light shielding unit in the detection step, the region of the light receiving unit of the solid-state imaging device The control method according to claim 6, wherein control is performed to weaken a contour emphasis amount in the contour emphasis processing for a region corresponding to the corresponding region of the light shielding unit.
前記検出ステップでは、前記固体撮像素子の前記遮光部を構成する複数の画素ごとにビートノイズ成分もしくは線状のキズの有無を検出し、
前記制御ステップでは、前記検出ステップにより前記遮光部の前記各画素のうち該当画素においてビートノイズ成分もしくは線状のキズが検出された場合、前記固体撮像素子の前記受光部を構成する複数の画素のうち前記遮光部の前記該当画素に対応する画素について前記輪郭強調処理における輪郭強調量を弱める制御を行うことを特徴とする請求項6記載の制御方法。
In the detection step, the presence or absence of a beat noise component or a linear flaw is detected for each of a plurality of pixels constituting the light-shielding portion of the solid-state image sensor,
In the control step, when a beat noise component or a linear flaw is detected in the corresponding pixel among the pixels of the light shielding unit in the detection step, a plurality of pixels constituting the light receiving unit of the solid-state imaging device are detected. The control method according to claim 6, wherein control is performed to weaken a contour emphasis amount in the contour emphasis processing for a pixel corresponding to the corresponding pixel of the light shielding portion.
前記検出ステップでは、前記固体撮像素子の前記遮光部におけるビートノイズ成分もしくは線状のキズとして、前記固体撮像素子における一方向の線の有無、該一方向に交差する他方向の線の有無を検出し、
前記制御ステップでは、前記検出ステップにより前記一方向の線あるいは前記他方向の線が検出された場合、前記一方向の輪郭強調量あるいは前記他方向の輪郭強調量を個別に弱める制御を行うことを特徴とする請求項7乃至9のいずれかに記載の制御方法。
In the detection step, the presence or absence of a line in one direction in the solid-state image sensor and the presence or absence of a line in another direction intersecting the one direction are detected as beat noise components or linear flaws in the light-shielding portion of the solid-state image sensor. And
In the control step, when the line in the one direction or the line in the other direction is detected in the detection step, control for individually weakening the contour enhancement amount in the one direction or the contour enhancement amount in the other direction is performed. The control method according to claim 7, wherein the control method is characterized in that:
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0686098A (en) * 1992-08-31 1994-03-25 Matsushita Electric Ind Co Ltd Contour correcting device
JP2002247445A (en) * 2001-02-16 2002-08-30 Matsushita Electric Ind Co Ltd Video signal processor and video signal processing method
JP2006148414A (en) * 2004-11-18 2006-06-08 Konica Minolta Photo Imaging Inc Imaging apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0686098A (en) * 1992-08-31 1994-03-25 Matsushita Electric Ind Co Ltd Contour correcting device
JP2002247445A (en) * 2001-02-16 2002-08-30 Matsushita Electric Ind Co Ltd Video signal processor and video signal processing method
JP2006148414A (en) * 2004-11-18 2006-06-08 Konica Minolta Photo Imaging Inc Imaging apparatus

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