JP2008270610A - Semiconductor package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve a semiconductor package with which a forged article can be easily identified. <P>SOLUTION: A semiconductor package of the present invention seals a semiconductor chip with a resin, one surface of the semiconductor package is formed from aventurine 1 with first surface coarseness, characters 12 of a product number or the like formed from aventurine 2 having second surface coarseness are provided on the aventurine 1, and the aventurine 1 and the aventurine 2 have the same reference plane. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a resin-sealed semiconductor package formed by mold molding.

  Conventionally, the display of product numbers and the like in semiconductor packages has been performed by marking the surface of a package with a satin finish or a mirror finish with a laser marker or stamping with ink (see, for example, “Patent Document 1”).

However, such a conventional method has a problem that copying is easy and it can be easily used for a counterfeit product of a semiconductor device.
Japanese Patent No. 2951220

  The present invention provides a semiconductor package capable of easily identifying a counterfeit product.

  According to an aspect of the present invention, there is provided a semiconductor package in which a semiconductor chip is sealed with resin, wherein one surface of the semiconductor package is formed of a first satin having a first surface roughness, and the first pear is formed. A semiconductor package comprising characters such as a product number formed of a second satin having a second surface roughness on the ground, wherein the first satin and the second satin have the same reference surface Is provided.

  According to another aspect of the present invention, there is provided a semiconductor package in which a semiconductor chip is resin-sealed, wherein one surface of the semiconductor package is formed of a first satin having a first surface roughness, A character region formed of a second satin having a second surface roughness on the first pear surface; and a character such as a product number formed of the first pear texture in the character region, the first There is provided a semiconductor package characterized in that the satin and the second satin have the same reference surface.

  Further, according to another aspect of the present invention, there is provided a semiconductor package in which a semiconductor chip is sealed with a resin, wherein one surface of the semiconductor package is formed with a mirror finish and has a predetermined surface roughness on the mirror surface. There is provided a semiconductor package comprising characters such as a product number formed in satin, wherein the mirror surface and the satin have the same reference surface.

  Furthermore, according to another aspect of the present invention, there is provided a semiconductor package in which a semiconductor chip is sealed with resin, wherein one surface of the semiconductor package is formed with a satin surface having a predetermined surface roughness, and is mirror-finished on the pear surface. There is provided a semiconductor package having characters such as a product number formed by finishing, wherein the satin finish and the mirror surface have the same reference surface.

  According to the present invention, since the characters such as the product number are formed on the same reference surface as the base with a surface roughness different from the surroundings, a forged product can be easily identified.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a view showing a semiconductor package according to Embodiment 1 of the present invention. Here, as an example, a drawing in which a product number (ABC012-3) is formed on the surface of a 32-pin DIP (Dual In-line Package) is shown.

  The semiconductor package according to the first embodiment of the present invention is formed of the satin 2 having the second surface roughness on the package upper surface 11 (hereinafter referred to as “base 11”) of the satin 1 having the first surface roughness. The character 12 is provided.

  The satin 1 and the satin 2 are integrally formed by a die formed by electrical discharge machining or spraying with diamond or the like. Specifically, desired scratches are made on the surface of the mold by electric discharge machining or spraying with diamond, etc., and then chemically etched to make microscopically smooth and different in surface roughness. A satin 1 and a satin 2 are formed.

  When the mold surface is processed by spraying, the surface roughness of the satin 1 and the satin 2 is controlled by masking the character 12 portion such as the product number.

  Thus, the package mold is first formed, and the surface is processed to integrally form the satin 1 and the satin 2, so that the reference surface (surface before processing) of the satin 1 and the satin 2 is the same surface, and the package The unevenness due to the formation of the character 12 on the surface hardly occurs.

FIG. 2 is a schematic view showing a cross section near the surface of the semiconductor package according to the first embodiment of the present invention.
As shown in FIG. 2, the character 12 portion is formed of a satin 2 having a surface roughness of 2, and the base 11 portion is formed of a satin 1 having a surface roughness of 1. The difference in surface roughness is attributed to the difference in the average pitch of small recesses having a depth of about 5 to 20 μm existing on the reference surface 13.

  That is, in the satin 1, the recesses are scattered two-dimensionally and unevenly at an average pitch of 40 to 50 μm, and in the satin 2, the recesses are scattered two-dimensionally and unevenly at an average pitch of 80 to 100 μm.

  Thus, the character 12 is formed by making the area | region from which the average pitch of a recessed part differs on the same reference surface 13. FIG.

  According to the first embodiment, since the characters 12 such as product numbers are formed on the same reference surface 13 as the base 11 with a surface roughness different from the surroundings, the forged product in which the characters 12 are formed by printing, laser processing, or the like. Can be easily identified.

  In the first embodiment described above, the base 11 and the characters 12 are formed of satin having different surface roughnesses. However, the present invention is not limited to this. For example, either the satin 1 or the satin 2 is mirrored. It can also be finished (without satin finish).

  FIG. 3 is a plan view showing a semiconductor package according to Embodiment 2 of the present invention. Here, as an example, a plan view of a 32-pin DIP similar to that of the first embodiment is shown.

  The semiconductor package according to the second embodiment of the present invention is formed of the satin 2 having the second surface roughness on the package upper surface 21 (hereinafter referred to as “base 21”) of the satin 1 having the first surface roughness. The character region 23 is provided, and the satin 1 character 22 is formed in the character region 23.

  Similarly to Example 1, the satin 1 and the satin 2 are integrally formed by a die formed by electric discharge machining or spraying with diamond or the like. Therefore, the reference planes of the base 21, the character 22 and the character area 23, that is, the reference planes of the satin 1 and the satin 2 are the same surface, and the unevenness due to the formation of the character 22 and the character area 23 on the package surface almost occurs. Absent.

  Since the cross-sectional structures of the satin 1 and the satin 2 are the same as those in the first embodiment, detailed description thereof is omitted.

  According to the second embodiment, the character 22 such as the product number is formed on the same reference surface 13 as the character region 23 with a surface roughness different from that of the surrounding area. Therefore, the forgery in which the character 22 is formed by printing, laser processing, or the like. The product can be easily identified.

  In the above-described second embodiment, the base 21 and the characters 22 and the character regions 23 are formed of satin having different surface roughnesses. However, the present invention is not limited to this. For example, the satin 1 or the satin 2 Either of them can be mirror finished (no matte finish).

  In the second embodiment, the base 21 and the character 22 are formed of the same satin 1, but the present invention is not limited to this. For example, the base 21, the character 22, and the character region 23 are provided. All of them can be satin having different surface roughnesses, or any one of them can be mirror-finished.

  Furthermore, in the above description of the first and second embodiments, the package shape is the 32-pin DIP. However, the present invention is not limited to this, and any resin-sealed package that is integrally molded with a resin mold may be used. It can be applied regardless of the shape and the number of pins.

  Furthermore, in the above description of the first and second embodiments, the characters 12 or 22 such as the product number are formed on the upper surface of the package, but the present invention is not limited to this. It may be formed on the package surface.

The figure which shows the semiconductor package concerning Example 1 of this invention. The schematic diagram which shows the cross section of the surface vicinity of the semiconductor package concerning Example 1 of this invention. The top view which shows the semiconductor package concerning Example 2 of this invention.

Explanation of symbols

11, 21 Ground (Pearl 1)
12 characters (nashiji 2)
13 Reference plane 22 characters (Nashiji 1)
23 character area (nashiji 2)

Claims (5)

A semiconductor package in which a semiconductor chip is sealed with resin,
One surface of the semiconductor package is formed of a first satin having a first surface roughness;
Provided with characters such as a product number formed with a second pear surface having a second surface roughness on the first pear surface,
The semiconductor package, wherein the first satin and the second satin have the same reference plane. A semiconductor package in which a semiconductor chip is sealed with resin,
One surface of the semiconductor package is formed of a first satin having a first surface roughness;
A character region formed of a second pear surface having a second surface roughness on the first pear surface;
Provided with characters such as a product number formed in the first satin in the character region,
The semiconductor package, wherein the first satin and the second satin have the same reference plane.   3. The first pear texture has a surface roughness with an average pitch of 40 to 50 [mu] m, and the second pear texture has a surface roughness with an average pitch of 80 to 100 [mu] m. The semiconductor package described. A semiconductor package in which a semiconductor chip is sealed with resin,
One surface of the semiconductor package is formed with a mirror finish,
Provided with characters such as product numbers formed of satin having a predetermined surface roughness on the mirror surface,
The semiconductor package, wherein the mirror surface and the matte surface have the same reference surface. A semiconductor package in which a semiconductor chip is sealed with resin,
One surface of the semiconductor package is formed of satin having a predetermined surface roughness,
With characters such as product numbers formed with a mirror finish on the pear ground,
The semiconductor package, wherein the matte surface and the mirror surface have the same reference surface.

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