JP2008268669A - Defect correction method and manufacturing method of alignment layer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a defect correction method and a manufacturing method of an alignment layer, which can contribute to yield improvement of a liquid crystal display panel, a manufacturing method of a liquid crystal display panel, a manufacturing method of a liquid crystal display device, and an alignment layer defect correction device. <P>SOLUTION: The defect correction method for correcting defects of the alignment layer provided in the liquid crystal display panel includes a removing step of removing a part having a defect from the alignment layer so that edges of a removed part are placed in an area not contributing to display and an applying step of applying a correction material into the removed part of the alignment layer, which is formed in the removing step, in a range narrower than the removed part. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to an alignment film defect correction method, a manufacturing method, and the like. More specifically, in a liquid crystal display device, a method and a method for correcting a defect of an alignment film provided for the purpose of aligning liquid crystal molecules in a liquid crystal layer in a predetermined direction, a method for manufacturing a liquid crystal display panel, and a method for manufacturing a liquid crystal display device And an alignment film defect correcting apparatus.

In general, the basic structure of a liquid crystal display panel is that an electrode is formed on a substrate made of glass or the like, and a pair of substrates on which an alignment film is formed is bonded via a sealing material, and the sealing is performed. It is configured by enclosing liquid crystal inside the material. Among them, the alignment film plays a role of controlling the alignment of the liquid crystal according to the voltage applied between the substrates, and greatly affects the display performance, display quality, yield and reliability of the liquid crystal display panel. Therefore, it can be said that the manufacturing process of the alignment film is the most important in the manufacturing process of the liquid crystal display panel. Currently, there are roughly two types of alignment film materials: a solution of a polyamic acid that is a precursor of polyimide (prepolymer type) and a solution of a soluble polyimide that has been completely imidized in advance (polymer type). Usually, the alignment film is formed by applying an alignment film material of polyamic acid or polyimide by flexographic printing or the like and baking it.

However, when the alignment film material is applied, a crease or the like is generated, resulting in defects such as insufficient film thickness (causing dents on the film surface), pinholes (causing a film thickness of zero), and contamination with foreign matter. As a result, the yield of the liquid crystal display panel may not be sufficiently obtained. As countermeasures against this, conventionally, in order to prevent the occurrence of alignment film defects themselves, a polymer having a specific structure and a liquid crystal alignment agent containing a silicon-containing compound having a polyether bond can be used. The composition of the color filter which can prevent the repelling of the color is disclosed (for example, refer patent document 1 and 2). However, according to these methods, although the yield can be improved by improving the wettability of materials such as alignment agents and color filter materials, the occurrence of alignment film defects caused by the process is sufficiently suppressed. There was room for improvement in that it was not possible. Further, it does not disclose how to deal with defects in the alignment film.

On the other hand, as a method of correcting fine pattern defects, a coating process in which correction liquid is applied to defective defects where a pattern is missing, and correction liquid that has risen from the normal pattern surface is removed with a polishing tape to be almost the same as a normal part. A defect correction method including a polishing step for increasing the height is disclosed (for example, see Patent Document 3). Moreover, a defect correction method including a laser cutting process for irradiating a defective part with a laser beam to remove the defective part, and an application process for applying a correction liquid at a position where the defective part has been removed with the laser beam is disclosed ( For example, see the same document.) However, when correcting the defects in the alignment film by using the former method, it is preferable to perform baking after fixing the defects to fix the correction liquid. However, the correction liquid adhered to the normal part after baking. Is difficult to remove with an abrasive tape, but there is room for improvement in that if the correction liquid applied to the normal part is not removed, the part may appear as black spots. In addition, when the defect correction of the alignment film is performed using the latter method, not only the alignment film but also the pattern of the color filter substrate or the array substrate when removing the defective portion by irradiating the laser beam. There was room for improvement in that there was a possibility that another defect would occur due to the influence of the laser beam.
JP 2003-49069 A JP 2001-91729 A JP 2006-7295 A

The present invention has been made in view of the above-described present situation, and a defect correction method and manufacturing method for an alignment film, a liquid crystal display panel manufacturing method, and a liquid crystal display manufacturing method that can contribute to improving the yield of a liquid crystal display panel. In addition, an object of the present invention is to provide an alignment film defect correcting device.

The present inventor has conducted various studies on methods for correcting defects in the alignment film provided on the liquid crystal display panel, particularly insufficient film thickness and pinholes. When correcting defects in the alignment film after the main baking step, the polyamic acid is used. Since the material is completely imidized, only by applying the correction material to the defect portion, the correction material rides on the normal portion around the defect portion (the portion where the film thickness is normal and imidized), and the above As a result of increasing the film thickness of the part, it was found that the above part appears as a black stain in the orientation confirmation.

Therefore, when the correction material is applied and corrected by performing a removal step of removing the portion having the film thickness shortage and the pinhole from the alignment film so that the end of the removal portion is located in a region that does not contribute to the display. The present inventors have found that since the portion around the removed portion, which is likely to cause black stain, can be driven into a region that does not contribute to display, deterioration in display quality due to defect correction of the alignment film can be suppressed. In addition, the correction material is applied in a range narrower than the removal portion in the removal portion of the alignment film formed in the removal step, so that the correction material is prevented from running on a portion around the removal portion. In addition, the present invention has found that an alignment film having a uniform thickness can be obtained because the correction material can be wetted and spread throughout the removal portion. Furthermore, it has been found that such a defect correction method for alignment films is applicable not only to insufficient film thickness and pinholes but also to the correction of all defects such as contamination of foreign matters, and the above-mentioned problems are admitted. The inventors have arrived at the present invention by conceiving that the problem can be solved.

That is, the present invention is a method for correcting a defect in an alignment film provided in a liquid crystal display panel, wherein the defect correction method is such that a portion having a defect from the alignment film is positioned in a region where the end of the removal portion does not contribute to display. The alignment film defect correcting method includes a removing step for removing the alignment film and a coating step for applying a correction material in a narrower range than the removal portion in the removal portion of the alignment film formed in the removal step.
The present invention is described in detail below.

The defect correction method for an alignment film according to the present invention corrects a defect in an alignment film provided in a liquid crystal display panel. The alignment film has a function of aligning liquid crystal molecules in the liquid crystal layer in a predetermined direction. Usually, in a liquid crystal display panel having a pair of substrates and a liquid crystal layer sandwiched between the pair of substrates, Provided on the surface of the substrate on the liquid crystal layer side. The material of the alignment film is not particularly limited, but polyimide is preferable from the viewpoint of mechanical strength, solvent resistance, heat resistance, and the like. The alignment film is usually formed by applying a polyamic acid or polyimide solution and baking. The alignment film defect is not particularly limited, but representative examples include insufficient film thickness at the time of solution coating, pinholes, foreign matter contamination, and the like.

The defect correcting method includes a removal step of removing a portion having a defect from the alignment film so that an end (edge) of the removal portion is located in a region not contributing to display, and an inside of the removal portion of the alignment film formed in the removal step. And an application step of applying the correction material in a narrower range than the removal portion. The removal process allows the area around the removed area, which is likely to cause black spots when applied with correction material, to be placed in the area that does not contribute to display. The decrease can be suppressed. In addition, the coating process can spread the correction material over the entire removal portion by using the wet spread while preventing the correction material from running on the periphery of the removal portion, so that the film thickness is highly uniform. An alignment film can be obtained. That is, according to the defect correction method for the alignment film of the present invention, the yield of the liquid crystal display panel can be improved by appropriately correcting the defect of the alignment film generated at the time of manufacture.

The end of the removed portion of the alignment film formed in the above removal process may be located in a region where at least a part does not contribute to display. However, in order to sufficiently suppress deterioration in display quality due to defect correction of the alignment film. It is preferable that the entire end of the removal portion is located in a region that does not contribute to display. Moreover, it is preferable that the edge of a removal part is located in the removal part side among the area | regions which do not contribute to a display. Thereby, even when the area that does not contribute to the display is narrow, it is possible to suppress the portion around the removed portion that tends to cause black staining from protruding outside the area that does not contribute to the display.

In this specification, the “region that does not contribute to display” refers to a region that can be evaluated as having substantially no influence on display and not contributing to display in a liquid crystal display device. Examples of such a region include a region provided with a light shielding member such as a black matrix, a region provided with various wirings such as a gate wiring, a source wiring, and an auxiliary capacitance wiring, a region provided with a switching element, and the like.

The area in which the correction material is applied in the application step is preferably 50 to 95% of the area of the removed portion of the alignment film. If it is less than 50%, there is a possibility that the correction material does not spread over the entire removal portion and cannot be properly corrected, and if it exceeds 95%, the correction material rides on the normal part or overcoating. Or a uniform alignment film cannot be formed, and another defect may occur. The contact angle between the correction material and the bottom surface of the removal portion is preferably 10 to 70 °. If the angle is less than 10 °, the correction material may be too wet and spread, and an alignment film having a sufficient film thickness may not be obtained. If the angle exceeds 70 °, the correction material may not be sufficiently wet or spread. Therefore, there is a possibility that it cannot be appropriately corrected. As the correction material, from the viewpoint of forming a homogeneous alignment film, it is preferable to use a solution such as polyamic acid used for forming the alignment film. In addition, from the viewpoint of spreading the correction material with the pad and the wetting spread of the correction material after spreading, the solid content concentration of the correction material is the same as or more than that used for forming the alignment film. It is preferable to use a low solid content concentration (solid content concentration of 0.25 to 7%).

The defect correction of the alignment film is performed between (1) a step of pre-baking the applied alignment film (pre-firing step) and a step of main baking the pre-baked alignment film (main baking step). (2) It may be performed after the main baking step, but (2) it is preferably performed after the main baking step. (1) Since the alignment film is not completely cured between the pre-baking step and the main baking step, the film thickness shortage and the pinhole are easily corrected by applying a correction material (retrofit). However, contamination with foreign matter may not be properly corrected depending on the properties of the foreign matter (solubility in the alignment film, etc.). On the other hand, (2) after the main baking step, the alignment film is completely cured, so that the film thickness shortage, pinholes, foreign matter contamination, and the like can be corrected collectively. The alignment film defect correction method of the present invention is not limited to film thickness deficiency and pinholes, but can be applied uniformly to correction of all defects such as foreign matter contamination. It can be suitably used for defect correction.

In the present specification, the term “main baking step” refers to imidizing a temporarily dried polyamic acid solution coating film by heat dehydration condensation when a polyamic acid solution is used as a solution for forming an alignment film. Refers to a process. On the other hand, when a polyimide solution is used as the solution for forming the alignment film, it indicates a step for completely removing the solvent in the polyimide coating film. Therefore, in any case, the alignment film after the main baking step is in a completely cured state.

The defect correcting method of the alignment film of the present invention is not particularly limited as long as it has the above-described removal process and coating process as constituent elements, and may or may not have other constituent elements. is not.

As a preferred embodiment of the defect correction method for the alignment film according to the present invention, the removing step, the coating step, and the correction material applied in the coating step are fired (main firing, or both preliminary firing and main firing). And the like having a firing step. According to this embodiment, defects of the alignment film can be removed, and an alignment film that is not different from a normal alignment film formed without causing defects can be formed. In addition, the inspection process for confirming whether or not the alignment film has a defect may be performed after the main baking process and before the removing process. However, from the viewpoint of easy detection of defects, the main baking is performed. It is preferably performed before the step, and more preferably performed after the pre-baking step. If it is performed after the main baking step and before the removing step, the alignment film cleaning step and other existing steps can be removed, and defects that do not need to be corrected may be detected.

A preferred embodiment of the alignment film defect correcting method of the present invention will be described in detail below.
In the removing step, it is preferable to remove a defective portion from the alignment film in units of subpixels. The subpixel is usually surrounded by a light shielding region. Therefore, by removing in units of subpixels, a portion that is likely to cause black stain is disposed in a light-shielding region that does not contribute to display, so that deterioration in display quality due to defect correction of the alignment film can be further suppressed. .

In this specification, “pixel” refers to the minimum display unit of the screen, and “sub-pixel (sub-pixel)” refers to a finer monochrome point that constitutes a pixel. The area of the removal portion formed in the removal step may be one subpixel or a plurality of subpixels. Accordingly, the area of the removal portion formed in the removal step may be for one pixel or for a plurality of pixels.

The removing step is preferably performed using at least one method selected from the group consisting of a tape polishing method, a wet etching method, and a plasma processing method. According to these methods, since the treatment can be performed locally, the defective portion can be easily removed from the alignment film. When the tape polishing method is used, since the polishing tape is thin and uniform, the variation in the height of the abrasive cutting edge is reduced, so that a good finished surface can be obtained.

The polishing tape used in the tape polishing method is not particularly limited. For example, a tape-shaped polishing in which abrasive grains having a particle size of submicron to several tens of μm are uniformly applied with an adhesive on a polyester film. A tool etc. are mentioned. The etchant used in the wet etching method is not particularly limited, and examples thereof include an alkaline solution such as a sodium hydroxide solution. Examples of the reactive gas used in the plasma processing method include ozone. When the wet etching method using an alkaline solution is used, there is a possibility that a part of the pattern may be peeled off in the color filter (CF) substrate. May cause defects. In addition, when the ozone plasma processing method is used, there is a risk that not only a defective portion but also a normal portion is removed from the alignment film. Therefore, from the viewpoint of preventing such a problem, the removing step is preferably performed using a tape polishing method.

In the application step, it is preferable that a pad having an area smaller than that of the removal portion is placed in the removal portion of the alignment film formed in the removal step, and the correction material is applied through the pad. According to this, unlike the case where the correction material is directly applied to the alignment film removal portion with a dispenser or the like, the alignment material can be formed with a uniform film thickness without the correction material being splashed or excessively applied. . In addition, by adjusting the size of the pad, the area where the correction material is applied can be easily adjusted, so that the correction material can be effectively prevented from climbing around the removal portion. The wide area can be corrected at once, and the application amount of the correction material can be easily adjusted.

As a method of applying the correction material, (1) a pad in which the correction material has been soaked (immersed in advance) is placed in the removal portion of the alignment film formed in the removal step, and the pad is placed on the pad. A method of applying the correction material by bringing the correction material soaked into contact with the bottom surface of the removal portion; (2) after the pad is placed in the removal portion of the alignment film formed in the removal step, the correction material is applied to the pad; In the case of (1), when the pad is moved to the removal portion, the correction material soaked in the pad is brought into contact with the bottom surface of the removal portion. (2) is preferable because the correction material may drip on a normal part or the correction material may be dried. Note that if the pad is brought into contact with the bottom surface of the removal portion of the substrate, the substrate may be damaged. Therefore, when applying the correction material, the pad is preferably not in contact with the bottom surface of the removal portion. Even if the pad is not in contact with the bottom surface of the opening, if the correction material is brought into contact, the correction material is transferred to the bottom surface of the opening due to surface tension or the like.

The pad material is not particularly limited, and examples thereof include a UV curable resin. Further, the area of the pad is preferably 10 to 95% of the area of the removed portion of the alignment film. If it is less than 10%, the correction material may not spread over the entire bottom surface of the removed portion, or partial application may be insufficient, and an alignment film having a sufficient film thickness may not be obtained. If it exceeds 95%, the correction material may be placed on a normal part or excessively applied, and an alignment film having a uniform thickness may not be formed. In addition, since the amount of the correction material immersed in proportion to the area of the pad also increases and the correction area can be increased, the area of the pad is preferably adjusted according to the area of the removal portion. When is large, it is preferable to use a pad having a large area. Furthermore, examples of the shape of the pad include a square and a circle. From the viewpoint of evenly applying the correction material, the shape of the pad is preferably similar to the removed portion of the alignment film.

The present invention is also an alignment film manufacturing method using the alignment film defect correction method. According to the defect correction method of the alignment film of the present invention, since the defect correction of the alignment film can be performed while ensuring good film thickness uniformity, the alignment film defect correction method of the present invention is used as the alignment film defect correction method. By appropriately incorporating the defect correction method into the alignment film manufacturing method, an alignment film having a uniform thickness can be manufactured with a high yield. As a preferred embodiment of the method for producing an alignment film of the present invention, a substrate cleaning process for cleaning the substrate on which the alignment film is formed, an alignment film application process for applying the alignment film on the substrate, and the applied alignment film are temporarily used. A pre-baking step of baking, a main baking step of baking the pre-baked alignment film, an alignment treatment step of aligning the main-baked alignment film (if necessary), and an alignment-treated alignment film. And the like having a washing step.

The present invention is also a method for manufacturing a liquid crystal display panel and a liquid crystal display device using the defect correcting method for the alignment film. According to the defect correction method of the alignment film of the present invention, since the defect correction of the alignment film can be performed while ensuring good film thickness uniformity, the alignment film defect correction method of the present invention is used as the alignment film defect correction method. By incorporating the defect correction method into the manufacturing method of the liquid crystal display panel and the liquid crystal display device as appropriate, a highly reliable liquid crystal display panel and a liquid crystal display device can be provided with a high yield.

Examples of the form of the liquid crystal display panel include a form in which a liquid crystal layer is sandwiched between a pair of substrates via an alignment film. The liquid crystal display device may be a transmissive type, a transflective type, or a reflective type. As a form of the transmissive liquid crystal display device, for example, a form in which linear polarizing plates are attached to both the front side (observation surface side) and the back side of the liquid crystal display panel can be mentioned. As a form of the transflective liquid crystal display device, for example, a form in which circularly polarizing plates are attached to both the front side and the back side of the liquid crystal display panel can be mentioned. As a form of the reflective liquid crystal display device, for example, a form in which a circularly polarizing plate is attached only to the front side of the liquid crystal display panel can be mentioned.

The present invention relates to an alignment film defect correction apparatus used for correcting defects in an alignment film provided in a liquid crystal display panel, wherein the alignment film defect correction apparatus displays a portion having a defect from the alignment film at the end of a removal unit. An alignment film defect comprising: a removal member that is removed so as to be located in a region that does not contribute to the film; and an application member that applies a correction material in a narrower range than the removal portion in the removal portion of the alignment film formed by the removal member It is also a correction device. By using such an alignment film defect correcting device, it is possible to correct the alignment film defect without degrading the display quality. The alignment film defect correcting apparatus of the present invention is suitable for the alignment film defect correcting method of the present invention. The alignment film defect correcting device of the present invention is not particularly limited as long as it includes the removal member and the application member as components, and may or may not include other components. As a preferred embodiment of the alignment film defect correcting device of the present invention, the correction material applied by the application member is baked (both main baking, or both preliminary baking and main baking) in addition to the removal member and the application member. The form etc. which have a baking member (baking furnace etc.) are mentioned.

According to the defect correction method of the alignment film of the present invention, it is possible to obtain an alignment film having a uniform film thickness by correcting insufficient film thickness, pinholes, foreign matters, etc. Can be improved.

Hereinafter, the present invention will be described in more detail with reference to an embodiment, but the present invention is not limited to this embodiment.

(Embodiment 1)
FIG. 1 is a diagram illustrating a method for manufacturing an alignment film according to the first embodiment.
As shown in FIG. 1, the manufacturing process of the alignment film according to this embodiment includes a substrate cleaning process 1, an alignment film coating process 2, a temporary baking process 3, an inspection process 4, a main baking process 5, and a correction process 6 (removal process). 6A, coating process 6B), alignment treatment process 7 and alignment film cleaning process 8.

2A to 2F are schematic plan views illustrating a part of the method for manufacturing the alignment film.
3A to 3F are schematic cross-sectional views taken along the line AB of FIGS. 2A to 2F, respectively.
Hereinafter, a method for manufacturing an alignment film will be described using FIGS. 2A to 2F and 3A to 3F as appropriate.

1. Substrate cleaning process First, a substrate 50 for a liquid crystal display panel is prepared. The substrate 50 is not particularly limited, and examples thereof include a thin film transistor array substrate and a color filter substrate. Subsequently, the surface of the substrate 50 (the surface of the pixel electrode 12) is cleaned by combining ultraviolet ozone cleaning and pure water cleaning. Thereby, dirt, dust, and the like attached to the surface of the substrate 50 can be removed, the surface of the substrate 50 can be cleaned, and the coating property and adhesion property of the alignment film can be improved. The substrate cleaning method is not particularly limited as long as wet cleaning and dry cleaning, or physical cleaning and chemical cleaning are appropriately performed depending on the substrate surface and the type of contaminant.

2. Next, using a flexographic printing method or the like, a polyamic acid solution (a solution obtained by dissolving a polyamic acid, which is a polyimide precursor, in N-methyl-2-pyrrolidone (NMP) is applied to the surface of the substrate 50 using a flexographic printing method or the like. ) With a film thickness of 50-120 nm. Thereby, a thin film of a polyamic acid solution is formed.

3. Pre-baking (pre-baking) step Next, the polyamic acid solution thin film is dried at 80-120 ° C. for 80-180 seconds (pre-baking) for the prevention of dust adhesion to the coating film and pre-baking before the main baking. To do. In addition, it does not specifically limit as a method of temporary baking, The method using a vacuum drying method, a hotplate, etc. are mentioned.

4). Inspection process Next, the pre-baked polyamic acid solution thin film is inspected for defects. In the present embodiment, it is assumed that in this inspection step, pinholes 14 are found in the thin film 13 of the polyamic acid solution, as shown in FIGS. 2 (a) and 3 (a).

5. Next, the pre-fired polyamic acid solution thin film 13 is finally fired at 100 to 250 ° C. for 30 to 50 minutes. As a result, the solvent is completely removed, and the imidization reaction of the polyamic acid proceeds. As shown in FIGS. 2 (b) and 3 (b), it is insoluble and infusible, heat resistance, chemical resistance and electrical insulation. A polyimide film 15 having excellent properties can be obtained. The pinhole 14 remains as it is. The method for the main firing is not particularly limited, and examples thereof include a method using a firing furnace (batch furnace).

6). Correction step 6A. Removal Step Next, as shown in FIGS. 2C and 3C, a portion having the pinholes 14 found in the inspection step is removed from the polyimide film 15 using a tape polishing apparatus. At this time, as shown in FIGS. 2 (c) and 3 (c), by removing the area of 12 sub-pixels 19, an end 16 e of the opening (removal part) 16 of the formed polyimide film 15 is removed. Is positioned on the opening 16 side in the light shielding region formed by the light shielding member 11. That is, the portion 16s around the opening 16 is arranged in the light shielding region. The removal method is not limited to this, and a desired portion can be easily removed by a wet etching method using an alkaline solution such as a sodium hydroxide solution as an etchant or a plasma treatment method using ozone or the like. Can do.

6B. Application Step Next, a pad 17 having an area smaller than the opening 16 is placed in a bag containing a correction alignment solution (a polyamic acid solution having a solid content concentration lower than that of the polyamic acid solution used in the alignment film application step 2). Is soaked in the pad 17 with the correcting alignment solution 18. Thereafter, as shown in FIGS. 2D and 3D, the pad 17 is placed in the opening 16 of the polyimide film 15 formed in the removing step, and the correction alignment solution 18 soaked in the pad 17 is opened. By contacting the bottom surface 16b of 16, the correction alignment solution 18 is applied in a range narrower than the opening 16 as shown in FIGS. 2 (e) and 3 (e). After the application, the correcting alignment solution 18 spreads over the entire opening 16. Thereafter, the correcting alignment solution 18 is baked in a furnace at 100 to 250 ° C. for 5 to 40 minutes, whereby a polyimide film 15a having a uniform film thickness is obtained as shown in FIGS. 2 (f) and 3 (f). Obtainable.

7). Alignment treatment process After the polyimide film 15a is formed, it is not always necessary to perform the alignment treatment, but the film surface of the polyimide film 15a is rubbed in one direction with a buff cloth wound around a rotating metal roller, or the polyimide film 15a is irradiated with light. Then, by performing an alignment process such as a photo-alignment process that partially changes the surface energy, liquid crystal molecules can be aligned in a predetermined direction using the aligned polyimide film 15a.

8). Alignment film cleaning process (cleaning process after rubbing)
Finally, cleaning is performed to remove dust and dirt such as lint from the buff cloth and scraped pieces from the polyimide film 15a adhering to the surface of the alignment-treated polyimide film 15a.
Thus, the manufacturing process of the alignment film is completed.

According to the present embodiment, the removal step 6A can drive the portion 16s around the opening 16 that easily causes black staining into the light shielding region 11, as shown in FIGS. 2C and 3C. For this reason, it is possible to suppress deterioration in display quality due to defect correction of the polyimide film 15. In addition, as shown in FIGS. 2 (d) to (f) and 3 (d) to (f), the coating solution 6B prevents the correction alignment solution 18 from running on the portion 16s around the opening 16, Since the correction alignment solution 18 can be uniformly applied to the entire opening 16 by utilizing the wetting and spreading, defects in the polyimide film 15 can be corrected while ensuring film thickness uniformity. Furthermore, according to the present embodiment, as shown in FIG. 1, since the defect of the alignment film is corrected after the main baking step 5, the preliminary baking step 3 and the preliminary baking step 3 and the main baking step 5 are performed. Unlike the case in which the cured alignment film is performed, defects such as insufficient film thickness, pinholes, and foreign matters can be corrected collectively and uniformly.

FIG. 5 is a schematic diagram illustrating a manufacturing flow of an alignment film according to the first embodiment. (A)-(f) is a plane schematic diagram which shows the manufacturing method of the oriented film which concerns on Embodiment 1. FIG. (A)-(f) is a cross-sectional schematic diagram in the AB line | wire of Fig.2 (a)-(f), respectively.

Explanation of symbols

1: Substrate cleaning process 2: Alignment film application process 3: Temporary baking process 4: Inspection process 5: Main baking process 6: Correction process 6A: Removal process 6B: Application process 7: Alignment treatment process 8: Alignment film cleaning process 10: Glass substrate 11: Shading member 12: Pixel electrode 13: Polyamic acid solution thin film 14: Pinhole 14e: Pinhole end 15: Polyimide film 15a: Modified polyimide film 16: Opening (removal part) of polyimide film
16b: Bottom surface of polyimide film opening 16e: End of polyimide film opening 16s: Periphery of polyimide film opening 17: Pad 18: Correction alignment solution (correction material)
19: Subpixel 50: Substrate for liquid crystal display panel

Claims (8)

A method for correcting defects in an alignment film provided in a liquid crystal display panel,
The defect correcting method includes a removing step of removing a portion having a defect from the alignment film so that the end of the removed portion is located in a region not contributing to display;
And a coating step of applying a correction material in a narrower range than the removal portion in the removal portion of the alignment film formed in the removal step. 2. The alignment film defect correcting method according to claim 1, wherein the removing step removes a defective portion from the alignment film in units of sub-pixels. The alignment film defect correcting method according to claim 1, wherein the removing step is performed using at least one method selected from the group consisting of a tape polishing method, a wet etching method, and a plasma processing method. . 2. The application step is characterized in that a pad having an area smaller than that of the removal portion is placed in the removal portion of the alignment film formed in the removal step, and the correction material is applied through the pad. The defect correction method of the alignment film in any one of -3. An alignment film manufacturing method using the alignment film defect correction method according to claim 1. A method for manufacturing a liquid crystal display panel, wherein the defect correction method for an alignment film according to claim 1 is used. A method for manufacturing a liquid crystal display device, comprising using the defect correction method for an alignment film according to claim 1. An alignment film defect correction device used for defect correction of an alignment film provided in a liquid crystal display panel,
The alignment film defect correcting device includes a removing member that removes a portion having a defect from the alignment film so that the end of the removal portion is located in a region that does not contribute to display;
An alignment film defect correction apparatus comprising: an application member that applies a correction material in a narrower range than the removal portion within the removal portion of the alignment film formed by the removal member.

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