JP2008258494A - Ic chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC chip capable of raising an insulation performance between bumps, when the IC chip is fixed by an ACF. <P>SOLUTION: In bumps 14 which are arranged at a bottom face of an IC chip 12 in a stagger shape, there is provided a gap A between a bump 14 of a primary sequence and a bump 14 of a secondary sequence, and this gap A is set larger than twice the diameter of a conductive particle 20 contained in an ACF 18. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an IC chip attached to a liquid crystal display device or the like.

An IC chip that functions as a source driver or a gate driver is attached to the surface of the liquid crystal panel of the liquid crystal display device. In this connection method, terminals are arranged in a zigzag pattern on a glass substrate constituting the liquid crystal panel, bumps are arranged in a zigzag pattern on the bottom surface of the IC chip, and the bump and the terminal are referred to as an anisotropic conductive film (hereinafter referred to as ACF). ) Are physically and electrically connected (see, for example, Patent Document 1).
JP-A-8-293529

  FIG. 6 is an enlarged view of the bottom surface of the IC chip body 104 of the IC chip 100, and the bumps 102 are arranged in a staggered pattern.

  In such a conventional IC chip 100, there is a problem in that the conductive properties of ACF exist between the bumps 102, resulting in low insulation.

  Accordingly, in view of the above problems, the present invention provides an IC chip that can enhance the insulation between bumps when the IC chip is fixed by ACF.

The present invention is an IC chip in which a plurality of bumps are formed on the bottom surface of the IC chip body, and each of the bumps is connected to a terminal by an anisotropic conductive film.
The plurality of bumps are arranged in a straight line in the horizontal direction, arranged in at least two rows in the vertical direction, and the bumps in the second row are arranged between the adjacent bumps in the first row. A gap is formed between the bumps in the first row and the bumps in the second row, and the gap is at least twice the diameter of the conductive particles contained in the anisotropic conductive film. IC chip.

  According to the present invention, the insulation between the bumps of the IC chip can be improved even if the ACF is used.

  An IC chip 10 according to an embodiment of the present invention will be described with reference to FIGS.

(1) Configuration of IC Chip 10 The IC chip 10 of the present embodiment is a driver IC attached to a liquid crystal panel. As shown in FIG. 1 and FIG. A plurality of bumps 14 are provided on the bottom surface. That is, on the bottom surface of the IC chip body 12, staggered bumps 14a and 14b are arranged along one side, and the bumps 14c are arranged in a row along the other side. The bumps 14 arranged in a staggered manner will be described in detail later.

  Terminals 16 are also provided on the glass substrate 22 of the liquid crystal panel so as to correspond to the arrangement of the bumps 14 of the IC chip 10. For example, corresponding to the staggered bumps 14a and 14b, terminals 16 are arranged in a staggered manner as shown in FIG.

(2) Arrangement of Bumps 14 Next, the bumps 14a, 14b, 14c arranged in a staggered manner will be described in detail.

  The bumps 14a and 14b are arranged in one row along the horizontal direction and arranged in two rows in the vertical direction. A second row of bumps 14b is arranged between adjacent bumps 14a and 14a in the first row. Further, a gap A is provided between the first row of bumps 14a and the second row of bumps 14b. The gap A is set to be twice the diameter of the conductive particles 20 included in the ACF 18 as will be described later.

  The bumps 14a, b, c of the IC chip 10 and the terminal 16 are fixed by the ACF 18.

(3) Reason for Providing Gaps A The reason why the gap A between the first row of bumps 14a and the second row of bumps 14b is twice the diameter of the conductive particles 20 will be described.

  As described in the background art, the bumps 102 arranged in a staggered manner have a problem that the insulation between the bumps 102 and 102 is lowered. As a result of various experiments for this reason, when the gap between the bumps 102 in the first row and the bumps 102 in the second row is 0 or small, the amount of movement of the conductive particles 20 is small and the bumps 102 and 102 are insulated. It turned out to be difficult.

  The state will be described with reference to FIG.

  4A is a bottom view in which the IC chips 10 and 100 are temporarily attached by the ACF 18, FIG. 4B is a bottom view in a state in which the IC chip 10 of the present embodiment is finally press-bonded, and FIG. It is a bottom view in the state where this IC chip 100 was finally press-fitted.

  As shown in this figure, the conductive particles 20 are present in the temporarily attached state, and when the main pressure bonding is performed, the conventional IC chip 100 has a small amount of movement of the conductive particles 20 and the state in which the bumps 102 are electrically connected. Happens. On the other hand, in the IC chip 10 of this embodiment, since the gap A exists, the amount of movement of the conductive particles 20 is large, and the bumps 14a and 14b are not electrically connected.

  FIG. 5 shows the movement amount of the conductive particles 20 with the gap A on the horizontal axis and the vertical axis with the conventional IC chip 100 when A is 0 to 2 μm, and this embodiment is 6 μm or more. The IC chip 10 is shown. The diameter of the conductive particles is 3 μm.

  As shown in this graph, when the gap A is 4 μm or more, the amount of movement of the conductive particles is close to 80 μm, and insulation can be ensured. For this reason, when the distance between the bumps 14 is increased by twice (6 μm) or more of the diameter of the conductive particles 20 in view of the safety of insulation, the amount of movement is surely increased, and the insulation can be ensured.

  As described above, in the case of the IC chip 10 according to the present embodiment, even when the IC chip 10 is fixed to the terminal 16 by the ACF 18, the insulation between the bumps 14 can be reliably ensured.

(A) is a bottom view of the IC chip, and (b) is a partially enlarged view thereof. It is an enlarged plan view of a terminal. It is a longitudinal cross-sectional view of the state which tries to attach an IC chip to a terminal. It is explanatory drawing which shows the state which carried out this pressure bonding of this embodiment and the conventional IC chip from the temporary attachment state. 5 is a graph showing the relationship between the amount of movement of conductive particles and the gap A. It is a bottom view of the conventional IC chip.

Explanation of symbols

10 IC chip 12 IC chip body 14 Bump 16 Terminal 18 ACF
20 Conductive particles

Claims (2)

In an IC chip in which a plurality of bumps are formed on the bottom surface of the IC chip body, and each of the bumps is connected to a terminal by an anisotropic conductive film,
The plurality of bumps are arranged in a straight line in the horizontal direction, arranged in at least two rows in the vertical direction, and the bumps in the second row are arranged between the adjacent bumps in the first row. Arrangement,
A gap is formed between the first row of bumps and the second row of bumps;
The gap is at least twice the diameter of the conductive particles contained in the anisotropic conductive film;
IC chip. The gap is 6 μm or more,
The IC chip according to claim 1.

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