JP2008257314A - Process management system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a process management system that can quickly analyze information acquired by an apparatus. <P>SOLUTION: The process management system has a first acquisition means (control and monitoring part 20) for acquiring state information representing the state of each part of a vacuum process apparatus 1, a second acquisition means (control and monitoring part 20) for acquiring control information on the control of the vacuum process apparatus, an association means (timer 34) for associating the state information and control information acquired by the first and second acquisition means, a storage means (log storage device 2) for storing the state information and control information associated by the association means, an analysis means (analysis apparatus 4) for analyzing the state information by referring to the control information, and a presentation means (analysis apparatus 4) for presenting the information resulting from the analysis by the analysis means. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a process management system.

  In recent years, for example, when processing an object to be processed using a process apparatus (for example, a CVD apparatus) as disclosed in Patent Document 1, high process accuracy has been required.

JP 2003-17437 A (FIG. 1)

  By the way, in a process apparatus as shown in Patent Document 1, conventionally, an analog waveform indicating the state of each part of the apparatus is sampled and stored in a storage device. The cause was analyzed based on the stored information.

  However, since these operations are performed manually, there is a problem that analysis takes time. In addition, as described above, in recent years, a slight difference in the process greatly affects the performance of the processing object in connection with the increase in process accuracy. In order to detect manually, there exists a problem that much time is required.

  The present invention has been made based on the above circumstances, and an object of the present invention is to provide a process management system capable of quickly analyzing information obtained by an apparatus.

  In order to achieve the above object, the process management system of the present invention includes a first acquisition unit that acquires state information indicating the state of each unit of the apparatus, and a second acquisition unit that acquires control information related to control of the apparatus. The association means for associating the state information and the control information acquired by the first and second acquisition means, the storage means for storing the state information and the control information associated by the association means, and the control information Referring to FIG. 4, there is provided analysis means for performing analysis processing on the state information, and presentation means for presenting information obtained as a result of analysis by the analysis means. For this reason, the process management system which can analyze rapidly the information obtained by an apparatus can be provided.

  In addition to the above-described invention, in the process management system of another invention, the associating means associates each of the status information and the control information by giving a time stamp. Thereby, these information can be reliably and simply matched by the time stamp. In addition, the processing date can be easily specified by using the time stamp.

  In addition to the above-described invention, in the process management system of another invention, the first acquisition unit acquires state information at a predetermined cycle, and the association unit corresponds to the state information at a predetermined cycle. In addition, a time stamp corresponding to a predetermined period is given to the control information, and a synchronized time stamp is also given to the control information. As a result, since the state information and the control information are synchronized and have the same time unit time stamp, both can be easily associated.

  In addition to the above-described invention, the process management system according to another aspect of the invention may be configured such that the first acquisition unit acquires the state information in the first cycle when the apparatus is executing the process, If is not being executed, the state information is acquired in a second period that is longer than the first period. Thereby, when the process processing is not executed, the storage capacity of the storage unit can be reduced by acquiring the state information in the long second cycle.

  In addition to the above-described invention, the process management system of another invention performs processing for extracting predetermined state information using predetermined control information as a start point or an end point, in addition to the above-described invention. The predetermined state information extracted by is presented. As a result, the state information can be specified with reference to the control information, so that the state information belonging to a specific process can be extracted easily and quickly.

  In addition to the above-described invention, the process management system according to another aspect of the invention executes a process of extracting predetermined state information using predetermined control information as a start point or an end point, and extracting the predetermined state. A process for calculating a time when the information meets a predetermined condition is executed, and the presenting means presents the time calculated by the analyzing means. Thereby, it is possible to easily determine whether or not the process state satisfies a desired condition by examining the length of time corresponding to the condition.

  In addition to the above-described invention, the process management system according to another aspect of the invention executes a process of extracting predetermined state information using predetermined control information as a start point or an end point, and extracting the predetermined state. A process of calculating at least one of the maximum value, minimum value, average value, and median value of information is executed, and the presenting means presents these values calculated by the analyzing means. Thereby, the validity of the process state can be determined from the maximum value, the minimum value, the average value, and the median value.

  In addition to the above-described invention, the process management system according to another aspect of the invention may be configured such that the storage unit includes processing target identification information for identifying a processing target to be processed by the apparatus together with control information and status information. The storing and analyzing means refers to the processing object identification information and executes the analysis processing. As a result, even when there are a plurality of processing objects, the analysis process can be quickly executed with the processing objects limited.

  In addition to the above-described invention, in the process management system of another invention, the processing object identification information includes at least information for specifying a lot and information for specifying a processing order in the lot. The analysis means refers to the information for specifying the lot and the information for specifying the processing order in the lot, and executes the analysis process. Therefore, the analysis process can be executed with reference to the lot unit and the processing order in the lot. Thereby, the variation for each lot and the variation due to the processing order in the lot can be known.

  In addition to the above-described invention, in the process management system of another invention, when there are a plurality of devices, the storage means stores device specifying information for specifying the device together with control information and status information. Then, the analysis means refers to the device identification information and executes analysis processing. For this reason, even when there are a plurality of process devices, the analysis processing can be quickly executed by limiting the process devices.

  ADVANTAGE OF THE INVENTION According to this invention, the process management system which can analyze rapidly the information obtained by an apparatus can be provided.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following, (A) a configuration example of the embodiment, (B) an outline of the operation of the embodiment, (C) details of the operation of the embodiment, and (D) a modified implementation mode will be described in this order.

(A) Configuration example of the embodiment

  FIG. 1 is a diagram showing a configuration example of an embodiment of a process management system of the present invention. As shown in this figure, the process management system includes a vacuum process device 1, a log storage device 2, a network 3, and an analysis device 4 as main components.

  Here, the vacuum process apparatus 1 includes, for example, a PVD (Physical Vapor Deposition) apparatus, a CVD (Chemical Vapor Deposition) apparatus, an etching apparatus, an implanter apparatus, a photolithography apparatus, and the like. In this example, as will be described later, a PVD apparatus is taken as an example.

  The log storage device 2 acquires and stores the log data generated in the vacuum process device 1 via the network 3 and stores the stored log data in the network 3 when requested by the analysis device 4. To send through.

  The network 3 is configured by, for example, a LAN (Local Area Network) or the like, and electrically connects the vacuum process device 1, the log storage device 2, and the analysis device 4 to each other. Is possible.

  The analysis device 4 is configured by a personal computer, for example, acquires log data stored in the log storage device 2 via the network 3, and executes various analysis processes.

  FIG. 2 is a diagram showing a detailed configuration example of the vacuum process apparatus 1 shown in FIG. In the example of this figure, the vacuum process apparatus 1 includes a chamber 10, a wafer stage 11, a wafer 12, a target 13, an ion reflector 14, a magnet 15, a control monitoring unit 20, a DC (Direct Current) power supply unit 21, and a gas supply unit 22. , Gas flow rate control unit 23, pressure detection unit 24, heater control unit 25, RF (Radio Frequency) power supply unit 26, temperature detection unit 27, electrostatic chuck unit 28, dry pump 29, turbo pump 30, dry pump 31, IR (Ion Reflector) The power supply unit 32, the communication unit 33, and the timer 34 are main components.

  Here, the chamber 10 is a hollow container made of, for example, quartz, stainless steel, aluminum, copper, alumina, titanium, or the like, shuts off the atmosphere, and creates a high vacuum / internal atmosphere corresponding to each process. Hold.

  The wafer stage 11 is a stage for placing the wafer 12 thereon. An electrostatic chuck mechanism (not shown) for adsorbing the wafer 12 by electrostatic force is disposed on the wafer stage 11 (upward in the figure). In addition, a heater and a temperature detection sensor (both not shown) are disposed inside.

  The wafer 12 to be processed is, for example, a silicon substrate, and in this apparatus, copper wiring is formed on the silicon substrate by PVD.

  The target 13 is made of, for example, a copper plate. When the argon plasma collides with the target 13, the constituent particles recoil and are deposited on the wafer 12.

  The ion reflector 14 is a cylindrical member configured to surround the target 13 and the wafer stage 11, and has a function of reflecting (accelerating) the ion by applying an electrical repulsive force to the ions.

  The magnet 15 is disposed above the target 13 and has a function of accelerating the application of Lorentz force to the argon ions in the plasma and increasing the efficiency with which copper molecules are released from the target 13.

  The control monitoring unit 20 as a part of the first acquisition unit, the second acquisition unit, and the association unit includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. The microcomputer is configured to control each unit of the apparatus based on a program stored in the ROM, generate log data, and transmit the log data to the log storage apparatus 2 via the communication unit 33 and the network 3.

  The DC power supply unit 21 applies a DC voltage between them so that the target 13 is negative and the ground is positive, and turns argon gas filled in the space between the target 13 and the wafer 12 into plasma.

  The gas supply unit 22 supplies argon gas into the chamber 10 via the gas flow rate control unit 23.

  The gas flow rate control unit 23 is constituted by, for example, a mass flow controller or the like, and controls the flow rate of the gas supplied from the gas supply unit 22 according to the control of the control monitoring unit 20, and also controls the gas flow rate at that time. 20 is notified.

  The pressure detection unit 24 includes, for example, an ion gauge, a Pirani gauge, etc., measures the pressure inside the chamber 10, and notifies the control monitoring unit 20 of the measurement result.

  The heater control unit 25 controls the heater built in the wafer stage 11 according to the control of the control monitoring unit 20 so that the temperature of the wafer 12 becomes a desired temperature.

  The RF power supply unit 26 applies high-frequency power between the ground and the wafer stage, and applies an RF bias to the wafer 12 to charge the wafer 12 negatively and between the copper ions having a positive charge. Cause electrical attraction. Thereby, since copper ions collide with the wafer 12 at high speed, the copper ions reach the deep part of the recess formed in the wafer 12.

  The temperature detection unit 27 detects the temperature of the wafer stage 11 and notifies the control monitoring unit 20 of the detection result.

  The electrostatic chuck unit 28 controls the chuck mechanism provided on the wafer stage 11 according to the control of the control monitoring unit 20 to attract and fix the wafer 12.

  The dry pump 29 discharges the air existing inside the chamber 10 to the outside according to the control of the control monitoring unit 20, and puts the inside of the chamber 10 into a vacuum state.

  The turbo pump 30 is a pump for achieving a higher degree of vacuum than the dry pump 29 and discharges the gas inside the chamber 10 to the outside.

  The dry pump 31 is connected to the exhaust side of the turbo pump 30 and increases the efficiency of the turbo pump 30 by discharging the gas discharged from the turbo pump 30 to the outside.

  The IR power supply unit 32 applies a DC voltage so that the ion reflector 14 becomes positive and the ground becomes negative in accordance with the control of the control monitoring unit 20, and the ion reflector 14 reflects (accelerates) copper ions.

  When the communication unit 33 performs communication between the log storage device 2 and the control monitoring unit 20 via the network 3, for example, the communication unit 33 performs control related to a communication protocol.

  For example, the timer 34 as a part of the association means generates information such as date information (year, month, time) and supplies the information to the control monitoring unit 20. The control monitoring unit 20 uses the date / time information generated by the timer 34 as a time stamp.

  FIG. 3 is a diagram illustrating a detailed configuration example of the log storage device 2 illustrated in FIG. 1. As shown in this figure, the log storage device 2 includes a CPU 2a, a ROM 2b, a RAM 2c, an HDD (Hard Disk Drive) 2d, an I / F (Interface) 2f, and a bus 2g as main components.

  Here, the CPU 2a controls each part of the apparatus based on a program 2d1 stored in the HDD 2d and a program (not shown) stored in the ROM 2b, and executes various arithmetic processes. Further, the CPU 2a acquires and stores log data from the vacuum process apparatus 1 based on the program 2d1 stored in the HDD 2d, and reads and supplies the log data in response to a request from the analysis apparatus 4.

  The ROM 2b is a semiconductor storage device that stores basic programs and data executed by the CPU 2a. The RAM 2c is a semiconductor storage device that temporarily stores programs and data executed by the CPU 2a.

  The HDD 2d as a storage unit is a storage device that stores information in a hard disk, which is a magnetic storage medium, and reads out stored information. In this example, the HDD 2d stores a program 2d1 and log data 2d2. Here, the program 2d1 includes a program such as an operating system for controlling the log storage device 2, an application program for acquiring and storing log data, and the like. The log data 2d2 stores log data acquired from the vacuum process apparatus 1 by an application program started by executing the program 2d1.

  The I / F (Interface) 2 f executes processing related to a protocol when exchanging information with the vacuum process apparatus 1 via the network 3. The bus 2g is a signal line group that electrically connects the CPU 2a, the ROM 2b, the RAM 2c, the HDD 2d, and the I / F 2f, and enables information exchange between them.

  FIG. 4 is a diagram showing a detailed configuration example of the analysis apparatus 4 shown in FIG. As shown in this figure, the analysis device 4 is mainly configured by a CPU 4a, a ROM 4b, a RAM 4c, an HDD 4d, an image processing unit 4e, an I / F 4f, a bus 4g, a display device 4h, and an input device 4i.

  Here, the CPU 4a as the analysis unit controls each part of the apparatus and executes various arithmetic processes based on the program 4d1 stored in the HDD 4d and the program stored in the ROM 4b. Further, the CPU 4a acquires log data stored in the log storage device 2 based on the program 4d1, and executes analysis processing.

  The ROM 4b is a semiconductor storage device that stores basic programs and data executed by the CPU 4a. The RAM 4c is a semiconductor storage device that temporarily stores programs and data to be processed by the CPU 4a.

  The HDD 4d is a storage device that writes information to a hard disk, which is a magnetic storage medium, and reads the written information. In this example, a program 4d1 is stored. The program 4d1 includes, for example, a program such as an operating system for controlling the analysis device 4 and an application program for acquiring and analyzing log data.

  The image processing unit 4e executes a drawing process according to a drawing command supplied from the CPU 4a, converts the obtained image into a video signal, and supplies the video signal to the display device 4h. The I / F 4f converts the data representation format and the like when exchanging information between the input device 4i and the network 3. The bus 4g is a signal line group that electrically connects the CPU 4a, the ROM 4b, the RAM 4c, the HDD 4d, the image processing unit 4e, and the I / F 4f, and enables information exchange between them.

  The display device 4h as the presenting means is configured by, for example, an LCD (Liquid Crystal Display) or a CRT (Cathode Ray Tube) display, and displays a video corresponding to the video signal supplied from the image processing unit 4e (not shown). ).

  The input device 4i is composed of, for example, a keyboard or a mouse, and generates information according to the operation of the administrator of the vacuum process management system and supplies it to the CPU 4a via the I / F 4f.

(B) Overview of operation of the embodiment

  In the vacuum process management system of the present embodiment, when process processing on the wafer 12 is started in the vacuum process apparatus 1, the control monitoring unit 20 controls each part (DC power supply) of the apparatus based on a preset control program. Control unit 21, gas flow rate control unit 23, etc.) to execute process processing. At that time, the control monitoring unit 20 generates data (event data) as control information related to control, and adds an ID (hereinafter referred to as “wafer ID”) for specifying the wafer 12 to be processed. At the same time, the time stamp supplied from the timer 34 is pasted, and the control monitoring unit 20 sets data (trace data) indicating the state of each part of the apparatus as a predetermined period (for example, 1/10). (Second interval), and a time stamp supplied from the timer 34 is pasted, and the obtained information is transmitted to the log storage device 2 as log data.

  The log storage device 2 stores the log data supplied from the vacuum process device 1 in the HDD 2d as log data 2d2.

  For example, when a defect occurs in the manufactured wafer 12, the administrator of the vacuum process management system (hereinafter simply referred to as “manager”) operates the input device 4 i of the analyzer 4 to store the log. The log data 2d2 stored in the device 2 is acquired, subjected to analysis processing, and analyzed from various viewpoints to identify the cause of the malfunction.

  That is, the administrator first operates the input device 4i of the analysis device 4 to download the log data 2d2 onto the RAM 4c. Then, a process of associating the trace data and the event data included in the downloaded log data 2d2 with reference to the time stamp is executed. Here, the event data includes, for example, data indicating the start of gas supply from the gas supply unit 22, the wafer ID of the wafer 12 to be processed, and a time stamp indicating the date and time when the gas supply is started. It is out. The trace data is data including data indicating the gas flow rate at each time point and a time stamp at that time point. The analysis device 4 associates the two pieces of data on the time axis by associating the event data with the time stamp of the same date and time with the trace data.

  Next, the administrator operates the input device 4i of the analysis device 4, designates the analysis target, the analysis range, and the analysis content, and causes the analysis processing to be executed. Specifically, the analysis target designates the wafer ID of the wafer to be analyzed (for example, the wafer ID of a wafer manufactured one month ago) and the type of trace data (for example, trace data indicating pressure). To do. As the analysis range, a range from a predetermined event (for example, gas supply start) included in the event data to another predetermined event (for example, process end) is designated as a start point and an end point. As the analysis contents, the contents of the analysis processing for the target trace data (for example, displaying a graph or obtaining the maximum value, minimum value, average value, and median value of the trace data) are designated.

  As a result, the analysis device 4 extracts information in the range specified by the analysis range from the specified analysis target, and executes analysis processing of the content specified by the analysis content. Specifically, in the above-described example, the trace data indicating the pressure in the range from the start of gas supply to the end of the process is extracted from the trace data of the wafer manufactured one month ago. The displayed trace data is displayed as a graph on the display device 4h, and the maximum value, minimum value, average value, and median value are calculated and similarly displayed on the display device 4h.

  The administrator can identify the cause of the malfunction by referring to the information displayed in this way. Moreover, it is possible to prevent the problem from occurring again by changing the control program stored in the control monitoring unit 20 based on the identified problem.

(C) Details of operation of embodiment

  Next, the detailed operation of the embodiment of the present invention will be described. Hereinafter, (C-1) event data generation processing in the vacuum process apparatus 1, (C-2) trace data generation processing in the vacuum process apparatus 1, and (C-3) analysis processing in the analysis apparatus 4 will be described in this order. I do.

(C-1) Event data generation processing in the vacuum process apparatus 1

  FIG. 5 is an example of a flowchart for explaining details of processing for generating event data in the vacuum process apparatus 1 shown in FIG. Before explaining the flowchart shown in FIG. 5, an event occurring in the vacuum process apparatus 1 will be described with reference to FIG.

  In the vacuum process apparatus 1, copper as a target 13 is sputtered by plasma generated by argon gas and deposited on the wafer 12. In the vacuum process apparatus 1, a wafer cassette (not shown) that holds a plurality of wafers 12 is set in the vacuum process apparatus 1, and when the start of the process is instructed, the wafers 12 are extracted from the wafer cassette one by one. Then, it is placed on the wafer stage 11 in the chamber 10. Next, the dry pump 29 is driven until the inside of the chamber 10 reaches a predetermined degree of vacuum. When a predetermined degree of vacuum is reached, the turbo pump 30 and the dry pump 31 are driven continuously. As a result, when the inside of the chamber 10 reaches a predetermined degree of vacuum, the process shown in FIG. 6 is started (ST1: a process start event occurs).

  Next, the control monitoring unit 20 controls the IR power source unit 32 to start supplying IR power, and controls the electrostatic chuck unit 28 to function the electrostatic chuck mechanism (ST2). As a result, a DC voltage is applied so that the ion reflector 14 is positive and the ground is negative. Further, when the electrostatic chuck portion 28 functions, the wafer 12 is attracted and fixed to the wafer stage 11.

  Next, the control monitoring unit 20 starts the gas flow by controlling the gas flow rate control unit 23 (ST3). As a result, the argon gas supplied from the gas supply unit 22 is introduced into the chamber 10 after the flow rate is adjusted by the gas flow rate control unit 23.

  Subsequently, the control monitoring unit 20 controls the DC power supply unit 21 and applies a DC voltage (sputtering power) so that the target 13 is negative and the ground is positive (ST4: sputtering power on). As a result, glow discharge is started between the target 13 and the wafer stage 11, and as a result, the argon gas enters a plasma state. Since the atomic nucleus of argon gas (argon ions) in a plasma state has a positive charge, an attractive force works with the target to which a negative voltage is applied, so it is attracted and accelerated, Collides with the target 13. As a result, copper molecules are recoiled from the copper constituting the target 13. The recoiled copper molecules are deposited on the surface of the wafer 12.

  Subsequently, the control monitoring unit 20 controls the gas flow rate control unit 23 to decrease the flow rate of argon gas (ST5). Next, the control monitoring unit 20 controls the RF power supply unit 26 to apply high frequency power (RF power) between the wafer stage 11 and the ground (ST6: RF power on). In the plasma, since electrons have a higher mobility than ions, the electrons are separated from the copper molecules and ionized (to become copper ions). Since the separated electrons are collected on the wafer 12, the wafer 12 is negatively charged. As a result, an electrical attractive force acts between the positively charged copper ions and the negatively charged wafer 12, and the copper ions are accelerated and collide with the wafer 12. For this reason, copper ions reach the deep part of the recess formed in the wafer 12. Moreover, it is possible to prevent burr-like copper from being formed in the opening of the recess by colliding at high speed. Furthermore, since the speed toward the lower direction (the direction of the wafer 12) is larger than the speed toward the lateral direction in FIG. 2, the copper ions are uniform with respect to the inside of the recess having a high aspect ratio. A copper film can be formed.

  Since ionized copper has a positive charge, a repulsive force acts between the ion reflector 14 to which a positive voltage is applied, so that the copper ions are reflected (accelerated) by the ion reflector 14 and the inside of the plasma Pulled back to. Thereby, the efficiency of forming the copper film can be increased.

  Then, when a predetermined time elapses after the sputtering is started and the film thickness of the copper deposited on the wafer 12 reaches a predetermined thickness, the control monitoring unit 20 controls the DC power source unit 21 to perform the sputtering. The power is turned off, and the RF power supply unit 26 is controlled to turn off the RF power (ST7). Thereby, sputtering is completed.

  Subsequently, the control monitoring unit 20 controls the electrostatic chuck unit 28 to turn off the electrostatic chuck (ST8). Next, the control monitoring unit 20 controls the gas flow rate control unit 23 to stop the supply of argon gas from the gas supply unit 22 (ST9). Then, the control monitoring unit 20 ends the process (ST10).

  Thus, the process processing for one wafer 12 is completed. Thereafter, the wafer 12 that has been processed is removed from the chamber 10, the next wafer 12 is extracted from the wafer cassette and placed on the wafer stage 11 in the chamber 10, and the same processing as described above is performed. Is repeated. When processing for all the wafers 12 arranged in the wafer cassette is completed, processing for one lot is completed.

  Next, a process for acquiring event data when the above process is performed in the vacuum process apparatus 1 will be described with reference to FIG. When the processing of the flowchart shown in FIG. 5 is started, the following steps are executed.

  Step S10: The control monitoring unit 20 determines whether or not an event has occurred. If an event has occurred, the process proceeds to step S11. Otherwise, the same processing is repeated. That is, the control monitoring unit 20 proceeds to step S11 when any of the events shown in FIG. 6 occurs when performing control according to a control program (not shown), and otherwise, the control monitoring unit 20 proceeds to step S10. Repeat the process.

  Step S11: The control monitoring unit 20 generates event data. FIG. 7 shows an example of event data. In this example, each row shows event data for one record. The event data for one record has a time stamp (details will be described later), an actual module ID, a processing ID, a wafer ID, and a message. Here, the time stamp is information pasted in the process of step S12 described later. The actual module ID as the vacuum process apparatus identification information is an ID for specifying the chamber 10. In the embodiment of FIG. 1, the vacuum process apparatus 1 has only one chamber 10, but when the vacuum process apparatus 1 has a plurality of chambers, the system includes a plurality of vacuum process apparatuses. If it is, it is an ID assigned to each of the plurality of chambers. In this example, since there is one vacuum process apparatus 1, all the module IDs are “F1”.

  The process ID is an ID for specifying the type of process. In this example, “SP-S”, “IR-ON”, “SC-ON”, “GF-S”, and “DC-ON” are listed. Here, SP-S indicates “sputtering process start” in ST1 of FIG. IR-ON indicates “IR power supply start” in ST2 of FIG. SC-ON indicates “electrostatic chuck on” in ST2 of FIG. GF-S indicates “gas flow start” in ST3 of FIG. DC-ON indicates “sputtering power on” in ST4 of FIG.

  The wafer ID as the processing target identification information is an ID for specifying the wafer 12. Here, the number on the left side of the hyphen is a value for specifying the wafer cassette (lot). The number on the right side of the hyphen is a value indicating the processing order (wafer cassette slot) in the wafer cassette. In this example, since all the event data relates to the same wafer 12, “1-2” is stored as the wafer ID.

  The message is incidental information used in the analysis process. In this example, information such as STEP 1 and STEP 2 is given.

  In the process of step S11, among the information for one record shown in FIG. 7, “process ID” corresponding to the event is generated, and “actual module ID” and “wafer ID” corresponding to the chamber and the wafer are generated. Is further added, and a “message” corresponding to the process ID is added to generate event data.

  Step S12: The control monitoring unit 20 acquires date and time information at the time when the event occurs from the timer 34, and pastes it on the event data generated in step S11. At this time, the minimum unit of date and time information generated by the timer 34 is 1/10 second. For this reason, times less than 1/100 second are automatically rounded down or rounded off. Specifically, when the date and time information generated by the timer 34 is “2007/01/15 13: 11: 16.51”, “1” at the end of “13: 11: 16.51” is set. For example, the time stamp is rounded to “13: 11: 16.5”. Thereby, as will be described later, the unit of time coincides with the trace data.

  Through the above processing, as shown in FIG. 7, a time stamp composed of year, month, day, and time is added to the event data. Specifically, in the event data in the first row in FIG. 7, “2007/01/15 13: 11: 16.5” is added as a time stamp.

  Step S13: The control monitoring unit 20 transmits the event data generated in step S12 to the log storage device 2 via the communication unit 33 and the network 3. In the log storage device 2, the event data transmitted via the network 3 is received by the I / F 2f and stored as log data 2d2 in the HDD 2d. Thus, event data is stored in the HDD 2d in the form as shown in FIG. The event data transmission unit in step S13 may be transmitted, for example, when data for one record is completed, or may be transmitted when data for a predetermined number of records is collected. Alternatively, it may be transmitted collectively from the end of the process shown in FIG. 6 to the start of the next process (free time).

  Step S14: The control monitoring unit 20 determines whether or not to end the process. If it is determined that the process is not ended, the process returns to step S10 to repeat the same process, and otherwise the process ends. For example, if the administrator gives an instruction to end the process, the process ends. Otherwise, the process returns to step S10 and the same process is repeated.

  Through the above processing, an event log is generated and stored in the HDD 2d of the log storage device 2.

(C-2) Trace data generation processing in the vacuum process apparatus 1

  Next, with reference to FIG. 8, a generation process of trace data in the vacuum process apparatus 1 will be described. When the processing of the flowchart of FIG. 8 is started, the following steps are executed.

  Step S20: The control monitoring unit 20 refers to the date and time information generated by the timer 34, and determines whether or not a predetermined time has elapsed. For example, the control monitoring unit 20 refers to the date and time information generated by the timer 34, determines whether or not 1/10 second has elapsed since the end of the previous process, and determines that it has elapsed In step S21, the same processing is repeated in other cases. More specifically, when the date and time information generated by the timer 34 in the previous process is “2007/01/15 13: 11: 16.4”, the date and time information is “2007/01/15 13:11”. : 16.5 ", it is determined that a predetermined time has elapsed, and the process proceeds to step S21. Note that this processing may be executed by periodic interrupt processing (in units of 1/10 second) from the timer 34.

  Step S21: The control monitoring unit 20 acquires trace data as information indicating the state of each unit of the vacuum process apparatus 1. FIG. 9 shows an example of the trace data. In this example, each line shows trace data for one record. The trace data for one record is composed of “vacuum degree”, “IR voltage”, “gas flow rate”, “DC voltage”, “RF power”, “wafer temperature” and others.

  Here, “degree of vacuum” is information measured by the pressure detector 24 shown in FIG. The “IR voltage” is information indicating the voltage value of the DC voltage applied between the ion reflector 14 and the ground by the IR power supply unit 32. The “gas flow rate” is information indicating the flow rate per unit time of the gas supplied from the gas supply unit 22 into the chamber 10 by the gas flow rate control unit 23. “DC voltage” is information indicating a voltage value of a DC voltage applied between the target 13 and the ground by the DC power supply unit 21. “RF power” is information indicating the power value of the AC power applied between the wafer stage 11 and the ground by the RF power supply unit 26. The “wafer temperature” is information indicating the temperature of the wafer 12 detected by the temperature detection unit 27. Note that FIG. 9 is an example, and other information may be used.

  Since these pieces of information are sampled and acquired substantially at the same time, they are information indicating the state of each part of the vacuum process apparatus 1 at the moment of the date and time indicated by the time stamp described later.

  Step S22: The control monitoring unit 20 acquires date and time information at that time from the timer 34, and pastes it on the trace data acquired in step S21. At this time, since the minimum unit of the date and time information generated by the timer 34 is 1/10 second, for example, “2007/01/15 13: 11: 16.5” is pasted as the time stamp. Become. As a result, the time unit and the period coincide with the event data described above.

  Through the above processing, as shown in FIG. 9, a time stamp composed of year, month, day, and time is added to the trace data. Specifically, in the event data on the first line in FIG. 9, “2007/01/15 13: 11: 16.5” is added as a time stamp, which is the same as the time stamp on the first line in FIG. Match.

  Step S23: The control monitoring unit 20 transmits the trace data with the time stamp attached in Step S22 to the log storage device 2 via the communication unit 33 and the network 3. In the log storage device 2, the trace data transmitted via the network 3 is received by the I / F 2f and stored as log data 2d2 in the HDD 2d. Thereby, the trace data is stored in the HDD 2d in the form as shown in FIG. In addition, as a transmission unit of the trace data in step S23, for example, it may be transmitted when data for one record is completed, or may be transmitted when a predetermined number of records are collected. Alternatively, it may be transmitted collectively from the end of the process shown in FIG. 6 to the start of the next process (free time).

  Step S24: The control monitoring unit 20 determines whether or not to end the process. If it is determined not to end the process, the process returns to step S20 to repeat the same process, and otherwise the process ends. For example, if the administrator gives an instruction to end the process, the process ends. Otherwise, the process returns to step S20 to repeat the same process.

  Through the above processing, trace data is generated and stored in the HDD 2d of the log storage device 2.

  Note that the event data and the trace data generated as described above may be held in the log storage device 2 for about two months, for example, and these data after two months may be sequentially deleted from the HDD 2d. . At that time, the data to be deleted can be easily identified by referring to the time stamp. In addition, the holding period may be set according to a period during which a defect with respect to the wafer 12 is found. For example, when a defect is found in about one month, for example, it is held for about two months, and when a defect is found in about three months, it is held for about four months. Needless to say, the period may be other than this.

(C-3) Analysis processing in analysis device 4

  Next, with reference to FIG. 10, an analysis process executed in the analysis device 4 shown in FIG. 4 will be described. The processing of this flowchart is executed when the administrator operates the input device 4i of the analysis device 4 to activate the analysis application program included in the program 4d1. When the processing of this flowchart is started, the following steps are executed.

  Step S40: The CPU 4a of the analysis device 4 acquires event data from the log storage device 2. That is, the CPU 4 a requests the log storage device 2 to transmit event data via the I / F 4 f and the network 3. The CPU 2a of the log storage device 2 receives this request via the I / F 2f, acquires event data from the log data 2d2 stored in the HDD 2d, and transmits it by the I / F 2f. As a result, the CPU 4a of the analysis device 4 receives event data via the I / F 4a.

  Step S41: The CPU 4a stores the event data received in step S40 in a predetermined area of the RAM 4c.

  Step S42: The CPU 4a acquires trace data from the log storage device 2. That is, the CPU 4 a requests the log storage device 2 to transmit trace data via the I / F 4 f and the network 3. The CPU 2a of the log storage device 2 receives this request via the I / F 2f, acquires trace data from the log data 2d2 stored in the HDD 2d, and transmits it by the I / F 2f. As a result, the CPU 4a of the analysis device 4 receives the trace data via the I / F 4a.

  Step S43: The CPU 4a stores the trace data received in step S42 in a predetermined area of the RAM 4c.

  Step S44: The CPU 4a executes a process of associating the event data stored in the RAM 4c and the trace data with reference to time stamps attached to each record unit. That is, a process of associating the event data with the time stamp having the same date and time information with the trace data is executed. Note that the trace data is periodically sampled in units of 1/10 second, but the event data is aperiodic data because it is generated when the event occurs. Therefore, when these are associated with each other, the state shown in FIG. 11 is obtained. In the example of this figure, the process ID shown in FIG. 7 and the trace data shown in FIG. 9 are associated with each other. The dots between the lines indicate that the trace data between them is omitted.

  In this way, the trace data is labeled by associating the trace data with the event data with reference to the time stamp. By using the labeled trace data, data analysis processing can be performed easily and quickly as described later.

  Step S45: The CPU 4a accepts an input to be analyzed. That is, the CPU 4a receives information generated by operating the input device 4i by the administrator. As an analysis target, for example, an actual module ID that is information for specifying a chamber to be analyzed or a wafer ID for specifying a wafer to be analyzed is input. Further, the type of trace data to be analyzed is input.

  A plurality of IDs may be input as the actual module ID and wafer ID, or IDs in a predetermined range may be input. Specifically, taking an actual module ID as an example, for example, a plurality of modules may be designated as F1, F2, and F5, or a range of modules may be designated as F1 to F4. Also good. Taking the wafer ID as an example, for example, a slot range such as 1-1 to 1-25 is designated, a lot range is designated such as 1-1 to 10-1, or 1 The range of both the lot and the slot may be designated like -1 to 10-25. In addition to this, for example, a specific range may be specified using a wild card. Specifically, 1-? By doing so, an arbitrary slot belonging to the lot “1” may be designated.

  As the trace data, for example, individual items such as a degree of vacuum, an IR voltage, and a DC voltage may be designated, or a plurality of items may be designated collectively.

  Step S46: The CPU 4a receives an input of the analysis range. That is, the CPU 4a receives information generated by operating the input device 4i by the administrator. As the analysis range, for example, the start point and the end point are directly specified based on the event data, such as data for a period from the start of the process (ST1 in FIG. 6) to the end (ST10 in FIG. 6). Data for a period of time after 1 second has elapsed from the start of gas flow until the gas flow rate is changed (ST5 in FIG. 6) (or until 2 seconds have elapsed since the gas flow rate was changed). As described above, the event data can be indirectly used to specify the start point and end point. Alternatively, the start point and the end point using both event data and trace data, such as data for a period from when the sputtering power is turned on (ST4 in FIG. 6) until the DC voltage reaches a predetermined voltage. There is also a way to specify.

  Step S47: The CPU 4a accepts input of analysis contents. That is, the CPU 4a receives information generated by operating the input device 4i by the administrator. The analysis contents include, for example, sampling of trace data for the analysis target input in step S45 and the analysis range input in step S46, or the maximum value, minimum value of trace data, The average value or the median value may be obtained, or the trace data may be compared (for example, a correlation function is calculated).

  In addition to the above contents, for example, the time when the trace data is greater than or equal to a predetermined value (or less than a predetermined value), the time within a predetermined range, or the time when the predetermined time has elapsed It may be input that the value of the trace data is obtained.

  Further, in addition to the above information, information regarding how to output the obtained analysis result may be input together. For example, when the obtained result is output as a file in a predetermined format or output as a graph (screen display or printing), the format can be specified.

  Step S48: The CPU 4a performs an analysis process on the event data and the trace data associated in step S44 based on the information input in steps S45 to S47.

  Specifically, for example, the process ends from the gas flow start (ST3 in FIG. 6) of the wafer 12 whose wafer ID is “1-2” that has been processed in the chamber whose actual module ID is “F1”. A case is assumed in which it is designated to display the trace data relating to the degree of vacuum in a graph up to (ST10 in FIG. 6). In this case, the CPU 4a first searches the event data for a record in which the actual module ID is “F1” and the wafer ID is “1-2”. As a result, since the data shown in FIG. 7 is applicable, the data shown in FIG. 7 is acquired.

  Next, the CPU 4a searches the acquired data for “GF-S” that is a process ID corresponding to the start of gas flow and “SP-E” that is a process ID corresponding to the end of the process. In FIG. 7, since the record (GF-S) on the fourth line and the record (SP-E) displayed at the end in the figure correspond, these are acquired. Subsequently, the CPU 4a acquires a time stamp attached to each event data of the process ID “GF-S” and the process ID “SP-E”. In this example, “2007/01/15 13: 11: 19.7” and “2007/01/15 13: 11: 26.3” are acquired.

  Subsequently, the CPU 4a acquires the trace data of the degree of vacuum included in the period indicated by the two acquired time stamps. That is, when the two time stamps described above are used as the start point and the end point from the trace data shown in FIG. 9, the CPU 4a acquires the trace data related to the degree of vacuum included in these ranges. Through the above processing, trace data relating to the degree of vacuum belonging to the specified range of the specified wafer in the specified chamber is acquired.

  In the present example, the trace data related to one wafer 12 is acquired. However, when there are a plurality of objects, the above-described process may be repeatedly executed for each wafer. When a plurality of trace data are targeted, a corresponding trace data group belonging to the period specified by the time stamp may be acquired.

  In addition, when a range is set based on the case where a certain amount of time has elapsed from a predetermined point in the trace data, the above-mentioned certain time is added to the time stamp of the corresponding trace data. The same process as described above may be executed with the given time as a reference. Specifically, when 1 second has elapsed after “GF-S” is set as the start point of the range, “2007/01/15 13: 11: 20.7” may be set as the start point.

  When determining the range using both event data and trace data, the range is determined with the trace data specified by the above-described processing satisfying a predetermined condition as a start point or an end point. What should I do?

  In addition, when obtaining the maximum value, minimum value, average value, and median value of the acquired trace data, the maximum value, minimum value, average value, and median value of the acquired trace data What is necessary is just to obtain | require the value which becomes. Further, when comparing the trace data (for example, calculating the correlation function), the correlation function may be calculated between the trace data.

  Step S49: The CPU 4a supplies the information obtained by the analysis process in step S48 to the image processing unit 4e, and executes a drawing process. As a result, the image obtained by the drawing process is converted into a video signal, supplied to the display device 4h, and displayed on a display unit (not shown).

  12 and 13 show an example of information displayed on the display unit of the display device 4h by the above processing. FIG. 12A shows the gas flow start (ST3 in FIG. 6) of the wafer 12 whose wafer ID is “1-2” that has been processed in the chamber whose actual module ID is “F1”. FIG. 7 is a graph relating to the degree of vacuum in the period until the end of the process (ST10 in FIG. 6). The horizontal axis of this graph represents time, and the vertical axis represents the degree of vacuum. Also, ST3 to ST10 on the horizontal axis correspond to ST3 to ST10 shown in FIG. By referring to such a graph, it is possible to know the degree of vacuum of a predetermined wafer 12 in a specified period.

  FIG. 12B shows, for example, the process from the start of the process of the wafer 12 with the wafer ID “1-2” that has been processed in the chamber with the actual module ID “F1” (ST1 in FIG. 6). It is a graph regarding DC voltage in the period until the end (ST10 in FIG. 6). The horizontal axis of this graph indicates time, and the vertical axis indicates voltage. Further, ST1 to ST10 on the horizontal axis correspond to ST1 to ST10 shown in FIG. By referring to such a graph, it is possible to know the DC voltage applied to the target 13 during a specified period of the predetermined wafer 12.

  FIG. 13A is a graph in which DC voltage temporal changes with respect to the wafers 12 whose wafer IDs are “1-1” and “90-1” are overlaid in the same manner as FIG. 12B. It is. In this example, the solid line indicates the graph of the wafer 12 with the wafer ID “1-1”, and the broken line indicates the graph of the wafer 12 with the wafer ID “90-1”. As shown in this figure, a change for each lot can be known by displaying a plurality of trace data in an overlapping manner. Thereby, for example, it is possible to know the presence or absence of aging of the apparatus. In this example, a difference in characteristics due to a difference in lots is displayed. However, for example, a difference in different slots in the same lot may be displayed. For example, trace data with wafer IDs “1-1” and “1-25” may be displayed in an overlapping manner. According to such display, it is possible to know the difference in characteristics depending on the processing order in the lot.

  In FIG. 13B, the sputtering power is turned on (ST4 in FIG. 6) until the DC voltage applied to the target 13 is stabilized within a predetermined range (for example, 500 V plus or minus 5 V). It is a histogram which shows time until it becomes. The horizontal axis of this graph indicates the time until stabilization, and the vertical axis indicates the number of corresponding processes (trace data). In this example, the most stable case is 1.7 seconds, followed by 1.6 seconds, 1.5 seconds, and 1.8 seconds. By referring to such a histogram, it is possible to know the distribution state of time until stabilization, and for example, it is possible to know how many processes fall outside the standard. In this example, all the trace data is displayed in one graph. For example, a plurality of similar graphs (histograms) are generated for each lot, and the histograms are compared by comparing the plurality of histograms. You may make it possible to know changes over time.

  Step S50: The CPU 4a determines whether or not to end the process. If the process is not ended, the process returns to step S45 to repeat the same process, and otherwise the process ends. For example, when an operation to end the process is performed on the input device 4i by the administrator, the process ends.

  As described above, according to the embodiment of the present invention, it is possible to obtain desired trace data by using event data as a trigger by attaching a time stamp to each of event data and trace data and associating them with each other. Since it did in this way, the data of a desired timing can be searched quickly.

  In addition, according to the embodiment of the present invention, the trace data in a predetermined range is designated based on the event data, and the trace data included in this range is displayed or analyzed. Trace data in a specific range can be acquired and analyzed quickly and easily.

  Further, according to the embodiment of the present invention, since the wafer ID is added to the event data and stored, the trace data relating to the desired wafer can be retrieved easily and quickly. Further, since the lot and the code indicating the processing order (slot) in the lot are used as the wafer ID, it is possible to easily and quickly retrieve the trace data regarding the wafer in the predetermined processing order of the predetermined lot. it can. Similarly, since the real module ID for the chamber is added, even when there are a plurality of chambers, the trace data of the desired chamber can be searched and analyzed easily and quickly.

  Further, according to the embodiment of the present invention, the obtained trace data is used to display a graph, or to obtain a result obtained by executing processing for obtaining a maximum value, minimum value, average value, median value, etc. Since the information is displayed, it is possible to quickly know the cause of the failure based on the displayed information.

(D) Modified embodiment

  The above-described embodiments are preferred examples of the present invention, but the present invention is not limited to these, and various modifications and changes can be made without departing from the scope of the present invention. is there.

  For example, in the above embodiment, as the vacuum process apparatus 1, an apparatus that performs copper sputtering by PVD has been described as an example, but other process apparatuses may be used. Specifically, as described above, a CVD apparatus, an etching apparatus, an implanter apparatus, and a photolithography apparatus can be used as the vacuum process apparatus 1. In the above description, the process apparatus under vacuum has been described as an example, but the process apparatus is not necessarily limited to vacuum.

  Moreover, although the case where there was one vacuum process apparatus 1 was described as an example in the above embodiment, a plurality of vacuum process apparatuses may exist. In that case, a plurality of vacuum process apparatuses may be distinguished by the actual module ID.

  Further, in the above embodiment, the log storage device 2 is configured independently of the vacuum process device 1, but these may be integrated. That is, the log storage device 2 may be configured as a part of the vacuum process device 1.

  In the above embodiment, the analysis device 4 is configured independently of the vacuum process device 1 and the log storage device 2. However, the analysis device 4 is configured as a part of the vacuum process device 1 or the log storage device 2. May be.

  In the above embodiment, the vacuum process apparatus 1, the log storage apparatus 2, and the analysis apparatus 4 are connected to each other via the network 3, but these are directly connected without using the network 3. You may make it do. Specifically, it can be directly connected by a USB (Universal Serial Bus) or other interface.

  Further, in the above embodiment, as shown in FIG. 8, the trace data is always acquired at a constant cycle. However, for example, the acquisition cycle is changed during process processing and in other cases. You may do it. Specifically, during process processing, trace data is acquired at a short cycle (for example, 1/10 second), and trace data is acquired at a long cycle (for example, 1 second) in other cases. May be. Thereby, since the amount of trace data can be reduced, the required capacity of the HDD 2d can be reduced.

  In the above embodiment, the event data and the trace data are stored separately. However, for example, they may be stored after being associated in advance as shown in FIG. According to such a method, it is not necessary to perform the association process on the analysis device 4 side, so that the waiting time for the analysis process can be shortened.

  In the above embodiment, the analysis device 4 acquires all event data and trace data from the log storage device 2 (S40 to S43), and narrows down the range and target after acquisition (S45, S46). However, after receiving the designation of the target and the range, only necessary data may be acquired from the log storage device 2. According to such a method, analysis processing can be executed even when the amount of event data and trace data is larger than the capacity of the RAM 4c.

  In the above embodiment, the case of using the event data message is not mentioned, but the range may be specified using the message. Specifically, for example, the range can be specified using messages such as “STEP1” and “STEP2” shown in FIG.

  The present invention can be applied to a management system for managing a vacuum process apparatus such as a PVD apparatus or a CVD apparatus, for example.

It is a block diagram which shows the structural example of the process management system which concerns on embodiment of this invention. It is a figure which shows the structural example of the vacuum process apparatus shown in FIG. It is a block diagram which shows the structural example of the log storage apparatus shown in FIG. It is a block diagram which shows the structural example of the analyzer shown in FIG. 3 is a flowchart showing an example of processing for generating event data in the vacuum process apparatus shown in FIG. 2. It is a figure which shows an example of the event performed in the vacuum process apparatus shown in FIG. It is a figure which shows an example of the event data produced | generated by the flowchart shown in FIG. It is a flowchart which shows an example of the process which acquires trace data in the vacuum process apparatus shown in FIG. It is a figure which shows an example of the trace data produced | generated by the flowchart shown in FIG. It is a flowchart explaining an example of the analysis process performed in the analyzer shown in FIG. It is an example of the event data matched with the flowchart shown in FIG. 10, and trace data. It is an example of the information displayed on a display apparatus with the flowchart shown in FIG. It is another example of the information displayed on a display apparatus with the flowchart shown in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Vacuum process apparatus, 2 log storage apparatus, 2d HDD (storage means), 3 network, 4 analysis apparatus, 4a CPU (analysis means), 4h display apparatus (presentation means), 12 wafer (processing object), 20 control monitoring part (First acquisition means, second acquisition means, part of correspondence means), 34 timer (part of correspondence means)

Claims (10)

First acquisition means for acquiring state information indicating the state of each part of the device;
Second acquisition means for acquiring control information relating to control of the device;
Association means for associating the state information acquired by the first and second acquisition means with the control information;
Storage means for storing the state information and the control information associated by the association means;
Referring to the control information, analysis means for performing analysis processing on the state information;
Presenting means for presenting information obtained as a result of the analysis of the analyzing means;
A process management system comprising:   2. The process management system according to claim 1, wherein the association means associates the state information and the control information by assigning a time stamp to each of the state information and the control information. The first acquisition means acquires the state information at a predetermined cycle,
The associating means assigns a time unit corresponding to the predetermined period to the state information, and also applies a time unit corresponding to the predetermined period to the control information. Give a synchronized timestamp,
The process management system according to claim 2, wherein:   The first acquisition unit acquires the state information at a first period when the apparatus is executing a process process, and has a period that is longer than the first period when the apparatus is not executing a process process. The process management system according to claim 1, wherein the state information is acquired at a long second period. The analysis means executes a process of extracting the predetermined state information with the predetermined control information as a start point or an end point,
The presenting means presents the predetermined state information extracted by the analyzing means;
The process management system according to claim 1. The analysis means executes a process of extracting the predetermined state information using the predetermined control information as a start point or an end point, and calculating a time when the extracted predetermined state information satisfies a predetermined condition Run,
The presenting means presents the time calculated by the analyzing means;
The process management system according to claim 1. The analysis means executes a process of extracting the predetermined state information with the predetermined control information as a start point or an end point, and the maximum value, the minimum value, the average value, and the median value of the extracted predetermined state information. Execute a process of calculating at least one or more,
The presenting means presents these values calculated by the analyzing means,
The process management system according to claim 1. The storage means stores processing target identification information for identifying a processing target to be processed by the apparatus together with the control information and the state information,
The analysis means refers to the processing object identification information and executes an analysis process.
The process management system according to claim 1. The processing target identification information includes at least information for specifying a lot and information for specifying a processing order in the lot,
The analysis means performs analysis processing with reference to information for specifying the lot and information for specifying a processing order in the lot.
9. The process management system according to claim 8, wherein: The storage means stores device specifying information for specifying a device together with the control information and the state information when there are a plurality of the devices,
The analysis means refers to the device identification information and executes an analysis process.
The process management system according to claim 1.

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