JP2008255337A - Thermosetting polyimide resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermosetting polyimide resin composition that obtains a cured material having excellent heat resistance, electrical characteristics, mechanical properties and dimensional stability and has excellent storage stability before curing and is publicly useful in the field of various heat-resistant coating materials, electrical insulating materials, and the like. <P>SOLUTION: The thermosetting polyimide resin composition comprises a polyimide resin (A) having a structure represented by general formula (1) and/or general formula (2), wherein X is a residue after removal of a hydrogen atom from each of two phenolic hydroxy groups of a phenolic compound containing two or more phenolic hydroxy groups in one molecule, and an epoxy resin (B), and a phenoxy resin (C). <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention provides a cured product having excellent heat resistance, electrical properties, and flexibility, and excellent storage stability before curing, and various heat resistant coating materials and electrical insulation materials, for example, interlayer insulation materials for printed wiring boards. The present invention relates to a thermosetting polyimide resin composition that can be preferably used in fields such as build-up materials, semiconductor insulating materials, and heat-resistant adhesives.

  Heat resistance of a cured product of a resin composition used in the electric and electronic industries such as a heat resistant coating material, an electrical insulating material, for example, an interlayer insulating material of a printed wiring board, a build-up material, a semiconductor insulating material, a heat resistant adhesive, In addition to electrical characteristics such as low dielectric constant and low dielectric loss tangent and flexibility, there is a demand for improvement in storage stability of the resin composition before curing. In particular, in electronic devices such as computers, transmission characteristics such as signal transmission delay of a printed circuit board and occurrence of crosstalk become a problem as the signal speed and frequency increase. Moreover, about the resin composition used for a printed circuit board, the low dielectric constant material of the hardened | cured material obtained is calculated | required.

  As a resin composition from which a cured product having excellent heat resistance is obtained, for example, a resin composition containing an epoxy resin is often used. Examples of the resin composition include an epoxy resin having a weight average molecular weight of less than 35,000, a polyfunctional phenol resin, a high molecular weight epoxy resin having a weight average molecular weight of 35,000 or more, a curing accelerator, a reducing agent, and a urea compound. An epoxy resin composition is disclosed (for example, see Patent Document 1). However, even a cured product obtained using the epoxy resin composition is not satisfactory in heat resistance, electrical characteristics, and dimensional stability.

  As other resin compositions, for example, many resin compositions containing a polyimide resin are also used. As the resin composition, for example, a thermosetting polyimide resin composition containing a polyimide resin having a carboxyl group and a linear hydrocarbon structure having a number average molecular weight of 300 to 6,000 and an epoxy resin is known. (For example, refer to Patent Document 2). However, even the cured product of the thermosetting polyimide resin composition described in Patent Document 2 is not sufficient in heat resistance and inferior in dimensional stability.

JP-A-5-295090 JP 2003-292575 A

  An object of the present invention is to provide a thermosetting polyimide resin composition in which a cured product having excellent heat resistance, electrical properties, and flexibility is obtained, and storage stability before curing is also excellent.

As a result of intensive studies, the present inventor has found the following knowledge.
(1) A cured product of a resin composition containing a structural residue of a phenolic compound, a polyimide resin having a urethane bond formed by a reaction of a phenolic hydroxyl group and an isocyanate group, an epoxy resin, and a phenoxy resin Is excellent in heat resistance, electrical properties and flexibility.

(2) The resin composition is also excellent in storage stability.
The present invention has been completed based on the above findings.

  That is, the present invention contains a polyimide resin (A) having a structure represented by the following general formula (1) and / or the following general formula (2), an epoxy resin (B), and a phenoxy resin (C). The present invention provides a thermosetting polyimide resin composition.

（式中、Ｘは１分子中に２個以上のフェノール性水酸基を有するフェノール系化合物から２個のフェノール性水酸基を除いた残基を示す。）

(In the formula, X represents a residue obtained by removing two phenolic hydroxyl groups from a phenolic compound having two or more phenolic hydroxyl groups in one molecule.)

  The thermosetting polyimide resin composition of the present invention can provide a cured product having excellent heat resistance, electrical characteristics, and flexibility. Moreover, it is a thermosetting polyimide resin composition having excellent storage stability. Therefore, it can be preferably used in the fields of various heat-resistant coating materials and electrical insulating materials, for example, interlayer insulating materials for printed wiring boards, build-up materials, semiconductor insulating materials, and heat-resistant adhesives. Furthermore, it can be preferably used in the fields of adhesive films, prepreg multilayer printed wiring boards, and resin-coated copper foils.

  The polyimide resin (A) in the thermosetting resin composition used in the present invention has an isocyanate group and a phenolic hydroxyl group as urethane bonds as represented by the general formula (1) and / or the general formula (2). Have a connected structure. As the polyimide resin (A), a polyimide resin that dissolves in an organic solvent is particularly preferable because it is easy to handle.

  Examples of the polyimide resin having the structure represented by the general formula (1) include a polyimide resin having a structure represented by the following general formula (3).

（上記式中Ｒｘ^１およびＲｘ^２は同一でも異なっていても良く、ポリイソシアネート化合物から二つのイソシアネート基を除いた残基を示す。Ｘは１分子中に２個以上のフェノール性水酸基を有するフェノール系化合物から２個のフェノール性水酸基を除いた残基を示す。）

(In the above formula, Rx ¹ and Rx ² may be the same or different and represent a residue obtained by removing two isocyanate groups from a polyisocyanate compound. X is a phenol having two or more phenolic hydroxyl groups in one molecule. (A residue obtained by removing two phenolic hydroxyl groups from a series compound.)

  Moreover, as a polyimide resin which has a structure represented by the said General formula (2), the polyimide resin etc. which have a structure represented by following General formula (4) are mentioned, for example.

（上記式中Ｒｘ^１はポリイソシアネート化合物から二つのイソシアネート基を除いた残基を示す。Ｘは１分子中に２個以上のフェノール性水酸基を有するフェノール系化合物から２個のフェノール性水酸基を除いた残基を示す。）

(In the above formula, Rx ¹ represents a residue obtained by removing two isocyanate groups from a polyisocyanate compound. X represents the removal of two phenolic hydroxyl groups from a phenolic compound having two or more phenolic hydroxyl groups in one molecule. The remaining residues are shown.)

Rx ¹ and Rx ² in the general formula (3) and the general formula (4) may be the same or different.

Here, in the general formula (3), when Rx ¹ and / or Rx ² correspond to R ⁵ of the general formula (15) described later, the general formula (15) was bonded to the general formula (1). It becomes a branched polyimide resin. When Rx ¹ in the general formula (4) corresponds to R ⁵ in the general formula (15), the general formula in formula (15) (2) had a structure bound branched polyimide resin.

  Examples of X in the general formulas (1) to (4) include the following structures.

（式中Ｒ^１は、単結合あるいは２価の連結基であり、Ｒ^２は同一でも異なっていても良く、水素原子または炭素原子数１〜１８のアルキル基を示す。）

(Wherein R ¹ is a single bond or a divalent linking group, and R ² may be the same or different, and represents a hydrogen atom or an alkyl group having 1 to 18 carbon atoms.)

（式中Ｒ^１は、直接結合あるいは２価の連結基であり、Ｒ^２は同一でも異なっていても良く、水素原子または炭素原子数１〜１８のアルキル基を示す。ａとｂとｃとの合計は１以上である。）

(In the formula, R ¹ is a direct bond or a divalent linking group, and R ² may be the same or different, and represents a hydrogen atom or an alkyl group having 1 to 18 carbon atoms. A, b and c; The sum of is 1 or more.)

（式中Ｒ^３は、水素原子または炭素原子数１〜１８のアルキル基または下記一般式（８）で示される構造を示す。）

(In the formula, R ³ represents a hydrogen atom, an alkyl group having 1 to 18 carbon atoms, or a structure represented by the following general formula (8).)

  The polyimide resin (A) used in the present invention is at least one selected from the group consisting of the general formulas (5), (6), (7) and (9) as X in the general formulas (1) and (2). The polyimide resin having the following structure is preferable because a curable polyimide resin composition is obtained from which a cured product having excellent heat resistance is obtained, and among them, the structures represented by the general formulas (5) and (6) are more preferable. . In particular, the polyimide resin (A) used in the present invention has a structure that imparts flexibility to the cured product as described later. For example, in the case of a polyimide resin having a structure such as the general formula (13) described later, the general formula ( As X in 1) and general formula (2), the structure represented by general formula (6) is preferable.

As R ¹ in the structure represented by the general formula (5) or the general formula (6), for example, a direct bond; a carbonyl group, a sulfonyl group, a methylene group, an isopropylidene group, a hexafluoroisopropylidene group, an oxo group, And divalent linking groups such as a dimethylsilylene group, a fluorene-9-diyl group, and a tricyclo [5.2.1.02,8] decane-diyl group. Examples of R ² include a hydrogen atom, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, hexadecyl group, and stearyl group. And an alkyl group having 1 to 18 carbon atoms. Examples of the alkyl group having 1 to 18 carbon atoms as R ³ in the structure represented by the general formula (7) include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, and an octyl group. Group, nonyl group, decyl group, undecyl group, dodecyl group, hexadecyl group, stearyl group and the like.

  In the present invention, the carbonyl group is the following structural formula (1a), the sulfonyl group is the following structural formula (1b), the methylene group is the following structural formula (1c), the isopropylidene group is the following structural formula (1d), and hexafluoroisopropylidene. The redene group has the following structural formula (1e), the oxo group has the following structural formula (1f), the dimethylsilylene group has the following structural formula (1g), the fluorene-9-diyl group has the following structural formula (1h), and tricyclo [5.2. The 1.02,8] decane-diyl group is represented by the following structural formula (1i). These are residues such as biphenol, tetramethylbiphenol, bisphenol A, bisphenol F, bisphenol S, naphthalenediol, and dicyclopentadiene modified bisphenol. (In the figure, * represents a binding site.) In addition, two hydroxyl groups are excluded from polyphenol compounds such as phenol novolac resin, cresol novolac resin, polyphenol resin synthesized from naphthol, alkylphenol and formaldehyde condensate. It may be a structural residue.

Among R ¹ represented by the general formula (5) and the general formula (6), a structure represented by a direct bond, the general formula (1b), the general formula (1c), and the general formula (1d) is provided. A thermosetting polyimide resin composition excellent in solubility and compatibility is obtained, and it is also preferable because synthesis when obtaining the polyimide resin (A) is easy. Of the R ² , a hydrogen atom and a methyl group are preferable. Moreover, among R ^{1 in} the general formula (6), the structure represented by the general formula (1i) is preferable because a thermosetting polyimide resin composition having excellent heat resistance can be obtained. The structure represented by the general formula (1i) is represented as the following general formula (11).

  The polyimide resin (A) used in the present invention may have a structure represented by the general formula (1) and / or a structure represented by the general formula (2), and above all, the general formula (1) And a polyimide resin having a structure represented by the general formula (2) is preferable because a thermosetting resin composition having good curability can be obtained. Here, X in the structure represented by the general formula (1) and the structure represented by the general formula (2) may be the same or different.

  As a polyimide resin which has a structure represented by the said General formula (6), the polyimide resin which has the following structures is mentioned, for example.

R ¹ may be the same or different and is the same as described above. Rx ¹ represents a residue obtained by removing two isocyanate groups from a polyisocyanate compound. R ⁹ represents a residue structure obtained by removing an acid anhydride group from a tetracarboxylic acid anhydride. Each of s and t is an integer of 1 to 10, and each unit of s and t enclosed is randomly connected. 1) When s is 1, the polyphenol structure is present at the end corresponding to the general formula (2). 2) When s is 2, the molecular main chain corresponding to the general formula (1) The polyphenol structure is present and 3) When s is 3 or more, the structure of the polyimide resin is branched. Furthermore, the form in which s is 1, 2, and 3 or more may be present in the molecule simultaneously.

  In the general formula (6-2), as a typical structure when s is 1, for example, a structure represented by the following general formula (6-3) can be exemplified.

In General Formula (6-3), R ⁶ represents a hydrogen atom or an alkyl group having 1 to 18 carbon atoms. R ⁷ is a hydrogen atom or a structure represented by the following general formula (6-4), and R ⁸ is a structure represented by the general formula (6-4). u is an integer of 1 to 100.

（式中Ｒ^１は、直接結合あるいは２価の連結基であり、Ｒ^２は同一でも異なっていても良く、水素原子または炭素原子数１〜１８のアルキル基を示す。ｖは０〜８の整数である。

(In the formula, R ¹ is a direct bond or a divalent linking group, R ² may be the same or different, and represents a hydrogen atom or an alkyl group having 1 to 18 carbon atoms. V is 0-8. It is an integer.

  In the general formula (6-2), as a typical structure when s is 2, for example, a structure represented by the following general formula (6-5) can be exemplified.

In the general formula (6-5), Rx ¹ , R ⁶ , R ⁷ , R ⁸ , and R ⁹ are the same as described above. R ¹⁰ has a structure represented by the following general formula (6-6).

In the general formula (6-6), R ¹ and R ² are the same as described above. W is an integer of 0-8.

  In the general formulas (6-2), (6-3), (6-4), (6-5), and (6-6), when tetracarboxylic dianhydride is used at the time of polyimide resin synthesis , The portion showing an imide bond has a structure represented by the following general formula (6-7). When tricarboxylic acid anhydride is used, the following general formula (6-8) or general formula (6- 9). The structures represented by general formula (6-7), general formula (6-8), and general formula (6-9) may be used alone or in combination.

R ⁹ represents a residue structure obtained by removing an acid anhydride group from a tetracarboxylic acid anhydride. R ¹¹ represents a residue structure obtained by removing an acid anhydride group and a carboxyl group from a tricarboxylic acid anhydride.

  Specific examples of the polyimide resin having the structure represented by the general formula (1) and the structure represented by the general formula (2) as the polyimide resin (A) include, for example, the following general formula (12-1). The polyimide resin etc. which have the structure represented can be mentioned.

一般式（１２−１）においてＸは上記と同じである。Ｒｘ^３はポリイソシアネート化合物から２つのイソシアネート基を除いた残基を示す。一般式（１２−１）中のＡは一般式（１）、一般式（６−７）、一般式（６−８）及び（６−９）で示される構造からなる群から選ばれる構造であるが、全て一般式（１）であることはない。また、ｎは１〜１００である。

In general formula (12-1), X is the same as above. Rx ³ represents a residue obtained by removing two isocyanate groups from a polyisocyanate compound. A in general formula (12-1) is a structure selected from the group consisting of the structures represented by general formula (1), general formula (6-7), general formula (6-8) and (6-9). Although there is no general formula (1). N is 1 to 100.

In the polyimide resin having the structure represented by the general formula (3) and the general formula (4), when Rx ¹ and Rx ² are residues obtained by removing two isocyanate groups from a bifunctional diisocyanate compound, A polyimide resin having a linear structure as represented by the formula (12) is obtained. In addition, when Rx ¹ and Rx ² have a structure that is a residue obtained by removing two isocyanate groups from a trifunctional or higher polyfunctional isocyanate compound, a polyimide resin having a branched structure is obtained.

  Among the polyimide resins (A), the polyimide resin having the structure represented by the general formula (2) has a phenolic hydroxyl group at the terminal and can be cured by reacting with the epoxy resin (B) described later. It is. A cured product of a general phenol compound and an epoxy resin has limitations in terms of glass transition temperature (Tg), heat resistance, dielectric properties, mechanical properties, linear expansion, etc., but is represented by the general formula (2). Since the polyimide resin having the structure has an imide structure in the resin skeleton, it is possible to obtain a cured product having high performance that cannot be obtained by conventional techniques.

  Furthermore, the polyimide resin (A) has a urethane bond structure composed of a phenolic hydroxyl group and an isocyanate group as represented by the general formula (1) and / or the general formula (2). In general, since a urethane bond formed by a phenolic hydroxyl group and an isocyanate group has a low dissociation temperature, a low-molecular monophenol compound such as phenol or cresol may be used as an isocyanate group blocking agent. However, such a blocking agent is not preferable because it dissociates in the curing reaction of the coating film or molded product to become a volatile component and generates bubbles and voids. In the present invention, since a phenolic hydroxyl group is introduced using a polyphenol compound having a valence of 2 or more, it does not volatilize even if it is dissociated from the resin under high temperature conditions during curing, so that it remains in the system. Is hardened more actively by cross-linking reaction with epoxy resin. Furthermore, the isocyanate group further undergoes a urethanation reaction with the hydroxyl group produced by the reaction between the phenol and the epoxy, thereby constructing a new crosslinked structure of the molecule. This is thought to block hydroxyl groups that are disadvantageous for dielectric properties. In other words, the present inventors consider that a network that connects rigid imide structures, which are resin skeletons, is formed by the urethane bonds that are formed, and that excellent heat resistance or mechanical properties are expressed.

  Furthermore, the thermosetting polyimide resin composition of the present invention contains a phenoxy resin (C). When the phenoxy resin (C) enters (wets) the network obtained by the cross-linking reaction between the polyurethane resin (A) and the epoxy resin (B) and develops better heat resistance or mechanical properties, the present inventors thinking.

  Moreover, when the polyimide resin which has a structure represented by the said General formula (2) is used as a polyimide resin (A) used by this invention, a terminal phenolic hydroxyl group also reacts with an epoxy resin and hardens | cures.

  By using a polyimide resin having a structure represented by the following general formula (13) as the polyimide resin (A) used in the thermosetting polyimide resin composition of the present invention, a cured product having high elongation and excellent flexibility. Is obtained. Therefore, for example, among the polyimide resins (A), the thermosetting polyimide resin composition containing the polyimide resin having the structure represented by the general formula (13) is a resin composition for an insulating layer for a flexible substrate. Can be preferably used.

（式中、Ｙは１分子中に少なくとも２個のアルコール性水酸基を有するポリオール化合物から２つの水酸基を除いた残基を示す。）

(In the formula, Y represents a residue obtained by removing two hydroxyl groups from a polyol compound having at least two alcoholic hydroxyl groups in one molecule.)

  Examples of the residue (residue structure) obtained by removing two hydroxyl groups from the polyol compound having at least two alcoholic hydroxyl groups represented by Y in the general formula (13) include at least two in one molecule. Residues obtained by removing two hydroxyl groups from a polyolefin polyol having an alcoholic hydroxyl group, residues obtained by removing two hydroxyl groups from a polyether polyol having at least two alcoholic hydroxyl groups in one molecule, at least two in one molecule Residues obtained by removing two hydroxyl groups from a polycarbonate polyol having one alcoholic hydroxyl group, and residues obtained by removing two hydroxyl groups from a polyester polyol having at least two alcoholic hydroxyl groups in one molecule and at least two in one molecule Of two hydroxy acids from polysiloxane polyols with different alcoholic hydroxyl groups It can be exemplified preferably obtained by removing residues such as the. Furthermore, it is good also as 1 or more types of residue structures chosen from these residue structures, and / or a copolycondensate.

  When it is desired to improve dielectric properties in addition to the flexibility of the coating film, Y in the general formula (13) excludes two hydroxyl groups from a polyolefin polyol having at least two alcoholic hydroxyl groups in one molecule. It is preferable that it is a residue. When it is desired to improve physical properties and hydrolysis resistance, a residue obtained by removing two hydroxyl groups from a polycarbonate polyol having at least two alcoholic hydroxyl groups in one molecule is preferable.

  As Y in the general formula (13), since the elongation of the cured product is large and flexibility can be retained, the number average molecular weight is preferably 300 to 5,000, more preferably 500 to 3,000. Is more preferable. Moreover, as glass transition temperature (Tg) of Y in General formula (13), 0 degrees C or less is preferable and 0-150 degreeC is more preferable.

The polyimide resin having a structure represented by the general formula (1) and / or the general formula (2) and the general formula (13) has, for example, a structure represented by the following general formula (14-1). A polyimide resin etc. are mentioned.

In the general formula (14-1), Rx ³ is the same as above. B is a structure selected from the group consisting of the structures represented by the general formulas (1), (6-7), (6-8), (6-9) and the general formula (13). 6-7), one or more structures selected from the group consisting of (6-8) and (6-9) and a structure represented by the general formula (13). Moreover, m is 1-100.

  The polyimide resin (A) used in the present invention may have a structure represented by the general formula (1) and / or the general formula (2), and above all, a structure represented by the general formula (1). And a polyimide resin having a structure represented by the general formula (2) is more preferable because a cured product having excellent curability and heat resistance can be obtained.

  In the case of the polyimide resin having the structure represented by the general formula (13), the structure represented by the general formula (1) and / or the general formula (2) and the structure represented by the general formula (13). The polyimide resin having all the structure represented by the general formula (1), the structure represented by the general formula (2), and the structure represented by the general formula (13) is flexible. It is more preferable because a cured product that is excellent in heat resistance but excellent in heat resistance can be obtained. Here, X in the structure represented by the general formula (1) and the structure represented by the general formula (2) may be the same or different.

  As the polyimide resin (A) used in the present invention, the polyimide resin branched in the structure represented by the following general formula (15) has improved compatibility with other resin components, improved solvent solubility, and obtained curing. It is preferable because the heat resistance of the coating film is good.

（式中Ｒ^５はジイソシアネート化合物からイソシアネート基を除いた残基構造を示す。）

(In the formula, R ⁵ represents a residue structure obtained by removing an isocyanate group from a diisocyanate compound.)

Examples of R ⁵ in the general formula (15) include an aromatic residue structure, an aliphatic residue structure, and an alicyclic residue structure. Among these, those having 4 to 13 carbon atoms can be preferably used. The structure of R ⁵ is preferably a combination of two or more structures from the viewpoint of preventing crystallization and improving solubility. In particular, the combined use of an aromatic residue structure and an aliphatic or alicyclic residue structure is preferred.

  The polyimide resin branched in the structure represented by the general formula (15) can be obtained, for example, by synthesis using an isocyanurate type polyisocyanate compound as a raw material.

  The polyimide resin (A) used in the present invention is preferably a polyimide resin having an imide bond represented by the following general formula (16), the following general formula (17-1), or the following general formula (17-2).

R ⁹ in the general formula (16) represents a residue structure obtained by removing an acid anhydride group from a tetracarboxylic acid anhydride. R ¹¹ in the general formulas (17-1) and (17-2) represents a residue structure obtained by removing the acid anhydride group and the carboxyl group from the tricarboxylic acid anhydride.

As described above, R ⁹ is a residue obtained by removing the acid anhydride group of the tetracarboxylic acid anhydride. Examples of such a structure include the following structures.

As described above, R ¹¹ is a residue structure obtained by removing an acid anhydride group and a carboxyl group from a tricarboxylic acid anhydride. Examples of such a structure include the following structures.

  Among the polyimide resins (A), examples of the polyimide resin having a structure represented by the general formula (16) include a polyimide resin having a structure represented by the following general formula (18).

（上記式中Ｒｘ^１およびＲｘ^２は同一でも異なっていても良く、ポリイソシアネート化合物から二つのイソシアネート基を除いた残基を示す。Ｒ^６はテトラカルボン酸無水物から酸無水物基を除いた残基構造を示す。）

(In the above formula, Rx ¹ and Rx ² may be the same or different and represent a residue obtained by removing two isocyanate groups from a polyisocyanate compound. R ⁶ is obtained by removing an acid anhydride group from a tetracarboxylic acid anhydride. The residue structure is shown.)

In the general formula (18), when Rx ¹ and / or Rx ² corresponds to R ⁵ in the general formula (15), a branched polyimide resin having a structure in which the general formula (18) is bonded to the general formula (15). It becomes.

  Examples of the polyimide resin having the structure represented by the general formula (17-1) include a polyimide resin having a structure represented by the following general formula (19-1) and general formula (19-2). It is done.

（式中Ｒｘ^１、Ｒｘ^２及びＲ^１１は上記と同じである。）

(Wherein Rx ¹ , Rx ² and R ¹¹ are the same as above)

In the general formula (19-1) and general formula (19-2), when Rx ¹ and / or Rx ² corresponds to R ⁵ in the general formula (15), the general formula (19) is represented in the general formula (15). A branched polyimide resin having a bonded structure is obtained.

  As the polyimide resin (A) used in the present invention, the polyimide resin branched in the structure represented by the general formula (15) has improved compatibility with other resin components, improved solvent solubility, and obtained curing. It is preferable because the heat resistance of the coating film is good.

  The polyimide resin (C) used in the present invention is produced by, for example, a production method in which a polyphenol compound (a1) having two or more phenolic hydroxyl groups, a polyisocyanate compound (a2), and an acid anhydride (a4) are reacted. Can be easily obtained.

  Examples of the polyphenol compound (a1) having two or more phenolic hydroxyl groups include hydroquinone, biphenol, tetramethylbiphenol, ethylidene bisphenol, bisphenol A, bisphenol F, bisphenol S, cyclohexylidene bisphenol (bisphenol Z), and dimethyl. Butylidenebisphenol, 4,4 ′-(1-methylethylidene) bis [2,6-dimethylphenol], 4,4 ′-(1-phenylethylidene) bisphenol, 5,5 ′-(1-methylethylidene) bis [1,1′-biphenyl-2-ol], naphthalenediol, dicyclopentadiene-modified bisphenol, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and hydroquinone Response product, and the like.

  As the polyphenol compound (a1), a trifunctional or higher functional phenol compound such as a novolak resin of an alkylphenol such as a phenol novolak resin, a cresol novolak resin, and a nonylphenol novolak resin can also be used.

  As the polyphenol compound (a1), it is preferable to use a polyphenol compound containing two phenolic hydroxyl groups, that is, a bifunctional polyphenol compound. Among these, bisphenol compounds such as bisphenol A, bisphenol F, and bisphenol S are more preferable.

  Moreover, since the hardened | cured material excellent in a flame retardance and heat resistance is obtained, when obtaining a polyimide resin (A), naphthalene diol, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10 It is preferred to use a reaction product of oxide and hydroquinone.

  In addition, you may use together monofunctional phenolic compounds, such as a phenol and a cresol, in the range which does not impair the effect of this invention.

  Further, as a polyphenol compound other than the polyphenol compound containing two phenolic hydroxyl groups, a polyphenol compound having three or more functional groups, for example, an alkylphenol novolak such as phenol novolak, cresol novolak, nonylphenol novolak, sylock type polyphenol resin, or the like can be used. Furthermore, monofunctional phenolic compounds such as phenol and cresol can be used as long as the effects of the present invention are not impaired.

  As a polyisocyanate compound (a2) used by this invention, an aromatic polyisocyanate compound, an aliphatic polyisocyanate compound, etc. can be used, for example.

  Examples of the aromatic polyisocyanate compound include p-phenylene diisocyanate, m-phenylene diisocyanate, p-xylene diisocyanate, m-xylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4. '-Diphenylmethane diisocyanate, 3,3'-dimethyldiphenyl-4,4'-diisocyanate, 3,3'-diethyldiphenyl-4,4'-diisocyanate, m-xylene diisocyanate, p-xylene diisocyanate, 1,3-bis Aromatic diisocyanates such as (α, α-dimethyl isocyanate methyl) benzene, tetramethylxylylene diisocyanate, diphenylene ether-4,4′-diisocyanate, and naphthalene diisocyanate Over preparative compounds.

  Examples of the aliphatic polyisocyanate compound include hexamethylene diisocyanate, lysine diisocyanate, trimethylhexamethylenemethylene diisocyanate, isophorone diisocyanate, 4,4′-dicyclohexylmethane diisocyanate, hydrogenated xylene diisocyanate, and norbornylene diisocyanate. .

  As the polyisocyanate compound (a2), an isocyanate prepolymer obtained by reacting the polyisocyanate compound (a2) and various polyol components in advance with an excess of isocyanate groups can be used or used in combination.

  The polyimide resin (A) used in the thermosetting polyimide resin composition of the present invention is more preferable because it has a branched structure, thereby improving compatibility with other resin components such as solvent solubility and a curing agent. As the branching method, as the polyisocyanate compound (a2), for example, a tri- or higher functional polyisocyanate compound having an isocyanurate ring, which is an isocyanurate body such as the diisocyanate compound, or such polyisocyanate compound and the diisocyanate is used. Preference is given to using mixtures with compounds.

  The trifunctional or higher functional polyisocyanate compound having an isocyanurate ring is formed by, for example, converting one or two or more diisocyanate compounds into an isocyanurate in the presence or absence of an isocyanuration catalyst such as a quaternary ammonium salt. And those made of a mixture of isocyanurates such as trimer, pentamer, and heptamer. Specific examples of the isocyanurate form of the polyisocyanate compound include isophorone diisocyanate isocyanurate type polyisocyanate, hexamethylene diisocyanate isocyanurate type polyisocyanate, hydrogenated xylene diisocyanate isocyanurate type polyisocyanate, norbornane diisocyanate isocyanurate type. Examples include aliphatic polyisocyanates such as polyisocyanates, isocyanurate type polyisocyanates of diphenylmethane diisocyanate, isocyanurate type polyisocyanates of tolylene diisocyanate, isocyanurate type polyisocyanates of xylene diisocyanate, and isocyanurate type polyisocyanates of naphthalene diisocyanate. It is done.

  When the polyisocyanate compound (a2) is used in combination with a diisocyanate compound and a trifunctional or higher functional diisocyanate compound having an isocyanurate ring, the aromatic diisocyanate as the diisocyanate compound and the trifunctional or higher functional diisocyanate compound having the isocyanurate ring are used. It is preferable to use a mixture containing an isocyanurate type polyisocyanate of an aliphatic diisocyanate and / or an isocyaninate type polyisocyanate of an alicyclic diisocyanate.

  When an aliphatic diisocyanate compound is used as the polyisocyanate compound (a2), a thermosetting polyurethane resin composition having excellent solubility can be obtained, and a cured coating film having good electrical characteristics can be obtained, which is more preferable.

  Furthermore, the polyisocyanate compound (a2) is used in combination with a polyisocyanate compound other than the above, for example, the diisocyanate compound, a buret body, an adduct body, an allohanate body of the diisocyanate, or a polymethylene polyphenyl polyisocyanate (crude MDI). May be.

  The polyisocyanate compound (a2) used in the present invention is preferably a combination of two or more polyisocyanate compounds since a thermosetting polyurethane resin composition having good solvent solubility can be obtained. In addition, since the cured coating film excellent in heat resistance is obtained, it is preferable to use the isocyanurate body in combination. When using an isocyanurate body together, it is preferable to set it to 70 weight% or less of the amount of all the polyisocyanate compounds (a2) in the sense of preventing the high molecular weight and gelation of the resin.

  Examples of the acid anhydride (a4) include an acid anhydride having one acid anhydride group and an acid anhydride having two acid anhydride groups. Examples of the acid anhydride having one acid anhydride group include aromatic tricarboxylic acid anhydrides such as trimellitic anhydride and naphthalene-1,2,4-tricarboxylic acid anhydride.

  Examples of the acid anhydride having two acid anhydride groups include pyromellitic dianhydride, benzophenone-3,3 ', 4,4'-tetracarboxylic dianhydride, diphenyl ether-3,3'. , 4,4'-tetracarboxylic dianhydride, benzene-1,2,3,4-tetracarboxylic dianhydride, biphenyl-3,3 ', 4,4'-tetracarboxylic dianhydride, biphenyl -2,2 ', 3,3'-tetracarboxylic dianhydride, naphthalene-2,3,6,7-tetracarboxylic dianhydride, naphthalene-1,2,4,5-tetracarboxylic dianhydride , Naphthalene-1,4,5,8-tetracarboxylic dianhydride, decahydronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 4,8-dimethyl-1,2,3 5,6,7-Hexahydronaphthalene- , 2,5,6-tetracarboxylic dianhydride, 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1,4,5,8 -Tetracarboxylic dianhydride, 2,3,6,7-tetrachloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, phenanthrene-1,3,9,10-tetracarboxylic dianhydride , Berylene-3,4,9,10-tetracarboxylic dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, 1 , 1-bis (2,3-dicarboxyphenyl) ethane dianhydride, 1,1-bis (3,4-dicarboxyphenyl) ethane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) ) Propane dianhydride, 2 1,3-bis (3,4-carboxyphenyl) propane dianhydride, bis (3,4-carboxyphenyl) sulfone dianhydride, bis (3,4-carboxyphenyl) ether dianhydride,

Ethylene glycol bisanhydro trimellitate, propylene glycol bis anhydro trimellitate, butanediol bis anhydro trimellitate, hexamethylene glycol bis anhydro trimellitate, polyethylene glycol bis anhydro trimellitate, polypropylene lenglycol bis Anhydro trimellitate, other alkylene glycol bisan hydroxy trimellitate, etc. are mentioned.

  Among the acid anhydrides (a4), pyromellitic dianhydride, benzophenone-3,3 ', 4,4'-tetracarboxylic dianhydride, diphenyl ether-3,3', 4,4'-tetra Carboxylic dianhydride, biphenyl-3,3 ', 4,4'-tetracarboxylic dianhydride, biphenyl-2,2', 3,3'-tetracarboxylic dianhydride, and ethylene glycol bisanhydro Trimellitate is preferred.

  As the acid anhydride (a4), one or more of these can be used. Further, an aromatic tricarboxylic acid anhydride or an aromatic tetracarboxylic acid monoacid anhydride may be mixed with an aromatic tetracarboxylic acid dianhydride.

  As explained above, the polyimide resin (A) used in the thermosetting resin composition of the present invention comprises a polyphenol compound (a1) having two or more phenolic hydroxyl groups, a polyisocyanate compound (a2), and an acid. It can be obtained by a production method in which an anhydride (a4) is reacted.

  In the method for producing the polyimide resin, the polyphenol compound (a1) and the acid anhydride (a4) react with the polyisocyanate compound (a2). In order to leave the terminal as a phenolic hydroxyl group, the total number of moles of the phenolic hydroxyl group in the polyphenol compound (a1) and the acid anhydride group in the acid anhydride (a4) is the polyisocyanate compound. It is preferable to make it react on the conditions which become larger than the number of moles of the isocyanate group in (a2). In terms of synthesis stability and various performances of the cured product, [{number of moles of phenolic hydroxyl group in (a1) + number of moles of acid anhydride group in (a4)} / isocyanate group in (a2) The number of moles] is preferably in the range of 1 to 10, more preferably in the range of 1.1 to 7. Further, (a1) and (a4) are preferably present in an amount of 5% or more, and more preferably 10% or more, based on the total weight of the polyphenol compound (a1) and the acid anhydride (a4). More preferably.

  The polyimide resin (A) used in the present invention may be produced by a single-stage reaction or by a reaction having two or more stages.

  In the case of producing in a one-stage reaction, for example, a raw material such as a polyphenol compound (a1), a polyisocyanate compound (a2) and an acid anhydride (a4) is charged in a reaction vessel, and the temperature is raised while stirring. The reaction is allowed to proceed while decarboxylating.

  When the production is carried out by a reaction having two or more reaction steps, for example, an acid anhydride (a4) is charged in the presence of the polyisocyanate compound (a2), and an isocyanate group and a polyphenol compound (a1) remaining during or after the reaction. ) Can be produced by reacting with a phenolic hydroxyl group. The reaction can also be carried out by charging the polyphenol compound (a1) and the polyisocyanate compound (a2) and charging the acid anhydride (a4) during or after the reaction.

  Furthermore, an acid anhydride (a4) may be charged in the presence of the polyphenol compound (a1), and the isocyanate group remaining during or after the reaction may react with the acid anhydride (a4).

  The reaction temperature can be in the range of 50 ° C. to 250 ° C., and is preferably performed at a temperature of 70 ° C. to 180 ° C. in terms of reaction rate and prevention of side reactions.

  In the method for producing a polyimide resin used in the present invention, the polyphenol compound (a1) having two or more phenolic hydroxyl groups, the polyisocyanate compound (a2), and the acid anhydride (a4) are converted into (a1), (a2 ) And (a4) are preferably used so as to be 5 to 50% by weight, 20 to 70% by weight, and 20 to 70% by weight, respectively.

  The reaction is preferable because the stability of the resulting polyimide resin is improved when the reaction is performed until almost all isocyanate groups have reacted. Moreover, you may make it react by adding an alcohol and a phenol compound with respect to the isocyanate group which remains a little.

  Incidentally, among the polyimide resins (C), the polyimide resin further having the structure represented by the general formula (13) includes, for example, the polyphenol compound (a1) having two or more phenolic hydroxyl groups and the polyresin. It can be easily obtained by reacting the isocyanate compound (a2), the acid anhydride (a4), and further the polyol compound (a3).

  Examples of the polyol compound (a3) include polyolefin polyol, polyether polyol, polycarbonate polyol, polyester polyol, and polysiloxane polyol. The polyol compound (a3) may be used alone or in combination of two or more. Moreover, as the polyol compound (a3), polyols having two or more kinds of copolycondensation structures such as the polyolefin polyol, polyether polyol, polycarbonate polyol, polyester polyol, and polysiloxane polyol may be used.

  Examples of the polyolefin polyol include polyol compounds having a polyolefin structure or a polydiene structure. Specific examples include polyethylene polyols, polypropylene polyols, polybutadiene polyols, hydrogenated polybutadiene polyols, polyisoprene polyols, and hydrogenated polyisoprene polyols. Of these, polybutadiene polyol and / or hydrogenated polybutadiene polyol are preferable, and hydrogenated polybutadiene polyol is more preferable, and polyolefin diol is particularly preferable. The number average molecular weight of the aliphatic structure portion of the polyolefin polyol is preferably in the range of 300 to 6,000.

  Examples of the polyether polyol include alkylene ether polyols such as polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and polybutylene glycol, and copolymers of these polyalkylene polyols. Moreover, you may use individually or may use 2 or more types together.

  Examples of the polycarbonate polyol include polyalkylene carbonate polyols obtained from propylene diol, butane diol, pentane diol, hexane diol, methyl pentane diol, cyclohexane dimethanol and the like, and alkylene oxide addition diols such as bisphenol A and bisphenol F and S. Polycarbonate polyols obtained from the above, copolymers thereof, and the like.

  Examples of the polyester polyol include esterification products of alkylene diols and polyvalent carboxylic acids, transesterification products of alkyl esters of polyvalent carboxylic acids, and polylactone polyols such as ε-caprolactone-based polylactone polyols. It is done.

  Examples of the polysiloxane polyol include dimethyl polysiloxane polyol and methylphenyl polysiloxane polyol.

  The polyol compound (a3) used in the present invention is preferably a polyolefin polyol or a polysiloxane polyol, particularly when it is desired to improve dielectric properties, and a polycarbonate polyol is preferred when it is desired to improve physical properties and hydrolysis resistance. .

  As the polyol compound (a3) used in the present invention, a polyol compound having 1.5 to 4 hydroxyl groups is easily synthesized, and among them, a polyol compound having 2 hydroxyl groups, that is, a diol compound is more preferable.

  Among the diol compounds, one or more polyol compounds selected from the group consisting of polyolefin diol, polyether diol, polycarbonate diol, polyester diol, and polysiloxane diol are more preferable.

  The polyol compound (a3) is preferably a polyol compound having a number average molecular weight of 300 to 5,000 because a sufficient elongation and a strong coating film can be obtained. -3,000 is more preferable.

  The Tg of the polyol compound (a3) is preferably 0 ° C. or less in that the degree of elongation and flexibility of the cured product can be designed to be high, and more preferably 0 to −150 ° C.

  Among the polyimide resins (A), the polyimide resin further having the structure represented by the general formula (13) can be specifically produced by, for example, the following method.

  1. In the presence of the polyisocyanate compound (a2), the acid anhydride (a4) is charged (mixed) during or after the imidization reaction, and the remaining isocyanate group and the phenolic hydroxyl group and polyol compound of the polyphenol compound (a1) A method of reacting the alcoholic hydroxyl group of (a3) to carry out a urethanization reaction.

  2. The polyisocyanate compound (a1), the polyol compound (a3), and the polyisocyanate compound (a2) are charged and the remaining isocyanate group and the acid anhydride group of the acid anhydride (a4) are added during or after the urethanization reaction. A method in which an imidization reaction is carried out.

  3. In the presence of the polyphenol compound (a1) and / or the polyol compound (a3), the acid anhydride (a4) is charged (mixed), and during or after the reaction, the polyisocyanate compound (a2) is added to the urethanization reaction. A method of performing an imidization reaction.

  4). The polyisocyanate compound (a2) and the polyol compound (a3) are charged (mixed) to carry out a urethanization reaction, the polyphenol compound (a1) is added and further urethanated, and then an acid anhydride (a4). ) And an imidation reaction between the remaining isocyanate group and acid anhydride group is performed.

  5. After the polyisocyanate compound (a2) and the polyol compound (a3) are charged (mixed) to perform the urethanization reaction, the polyphenol compound (a1) and the acid anhydride (a4) are added and the remaining isocyanate group and acid are added. A method of performing an imidization reaction with an anhydride group and a urethanization reaction between a polyisocyanate compound (a2) and a polyphenol compound (a1).

  6). After the polyisocyanate compound (a2) and the polyol compound (a3) are charged (mixed) to perform a urethanization reaction, an acid anhydride (a4) is added, and imidation of an isocyanate group and an acid anhydride group A method in which a reaction is carried out and a polyphenol compound (a1) is further added and reacted.

  Among the manufacturing methods, 6. This method is preferable because it is highly possible that a polyphenol compound is present at the terminal and the curability with the epoxy resin can be improved.

  The reaction temperature when the polyphenol compound (a1), polyisocyanate compound (a2), polyol compound (a3) and acid anhydride (a4) having two or more phenolic hydroxyl groups are reacted is in the range of 50 ° C to 250 ° C. In view of reaction rate and prevention of side reaction, it is preferable to carry out at a temperature of 70 ° C. to 180 ° C.

  In the above production method, the polyphenol compound (a1), the polyisocyanate compound (a2), the polyol compound (a3) and the acid anhydride (a4) having two or more phenolic hydroxyl groups are converted into (a1), (a2), The reaction is preferably carried out using 5 to 50% by weight, 10 to 70% by weight, 10 to 70% by weight, and 10 to 70% by weight based on the total weight of (a3) and (a4).

When preparing the polyimide resin further having the structure represented by the general formula (13) as the polyimide resin (A) used in the present invention, the polyphenol compound (a1) and the polyol compound with respect to the polyisocyanate compound (a2). (A3) and acid anhydride (a4) each react. In order to leave the terminal as a phenolic hydroxyl group, the number of moles of phenolic hydroxyl group (m (a1) mole) in the polyphenol compound (a1) and the number of moles of alcoholic hydroxyl group in the polyol compound (a3) (m (a3 ) Mol) and the total number of moles of hydroxyl groups of the acid anhydride (a4) and the number of moles of carboxyl groups (m (a4)) is the number of moles of isocyanate groups in the polyisocyanate compound (a2) (m (a2) It is preferable to carry out the reaction under the condition of greater than (mol). Considering the stability in synthesis and various performances of the cured product, {m (a1) + m (a3) + (m (a4))} / m (a2) is in the range of 1 to 10, more preferably 1. The range is from 1 to 7. Further, (a1), (a3) and (a4) are preferably present in an amount of 5% by weight or more, more preferably 10% or more, based on the total weight of (a1), (a3) and (a4). More preferably.

  The reaction is preferable because the stability of the resulting polyimide resin is improved when the reaction is performed until almost all isocyanate groups have reacted. Moreover, you may make it react by adding alcohol, a phenol compound, an oxime compound, etc. with respect to the isocyanate group which remains a little.

  In the method for producing the polyimide resin (A) used in the present invention, it is preferable to use an organic solvent because a uniform reaction can proceed. Here, the organic solvent may be present after being present in the system in advance or may be introduced in the middle. In order to maintain an appropriate reaction rate, the proportion of the organic solvent in the system is preferably 80% by weight or less of the reaction system, and more preferably 10 to 70% by weight. As such an organic solvent, since a compound containing an isocyanate group is used as a raw material component, an aprotic polar organic solvent having no active proton such as a hydroxyl group or an amino group is preferable.

  As the aprotic polar organic solvent, for example, polar organic solvents such as dimethylformamide, dimethylacetamide, N-methyl-2-pyrrolidone, dimethyl sulfoxide, sulfolane, and γ-butyrolactone can be used. In addition to the above solvents, ether solvents, ester solvents, ketone solvents, petroleum solvents and the like may be used as long as they are soluble. Various solvents may be mixed and used.

  Examples of the ether solvent include ethylene glycol dialkyl ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, and ethylene glycol dibutyl ether; diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, triethylene glycol dimethyl ether, and triethylene glycol diethyl. Polyethylene glycol dialkyl ethers such as ether and triethylene glycol dibutyl ether; ethylene glycol monoalkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate and ethylene glycol monobutyl ether acetate; Ethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, polyethylene glycol monoalkyl ether acetates such as triethylene glycol monobutyl ether acetate;

Propylene glycol dialkyl ethers such as propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol dibutyl ether; dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol dibutyl ether, tripropylene glycol dimethyl ether, tripropylene glycol diethyl ether, tripropylene glycol Polypropylene glycol dialkyl ethers such as propylene glycol dibutyl ether; propylene glycol monoalkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether acetate; Polypropylene glycol monoalkyl ether acetate such as triglycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monobutyl ether acetate, tripropylene glycol monomethyl ether acetate, tripropylene glycol monoethyl ether acetate, tripropylene glycol monobutyl ether acetate Dialkyl ethers of copolymerized polyether glycols such as low molecular weight ethylene-propylene copolymers; monoacetate monoalkyl ethers of copolymerized polyether glycols; alkyl esters of copolymerized polyether glycols; Examples include ether glycol monoalkyl esters and monoalkyl ethers. It is.

Examples of the ester solvent include ethyl acetate and butyl acetate.
Examples of the ketone solvent include acetone, methyl ethyl ketone, and cyclohexanone. In addition, as the petroleum solvent, it is also possible to use toluene, xylene, other high-boiling aromatic solvents, and aliphatic and alicyclic solvents such as hexane and cyclohexane.

  The ratio of the organic solvent in the system when the organic solvent is used when producing the polyimide resin (A) used in the present invention is preferably 80% by weight or less of the reaction system, and preferably 10 to 70% by weight. More preferred.

  The weight average molecular weight of the polyimide resin (A) used in the present invention is 800 to 50 because a thermosetting resin composition having good solvent solubility is obtained and a cured coating film having various physical properties is obtained. 1,000 is preferable, and 1,000 to 20,000 is more preferable.

  As for the phenolic hydroxyl group equivalent of the polyimide resin (A) used by this invention, 400-10,000 are preferable.

In addition, the measurement of the weight average molecular weight of resin, such as a polyimide resin (A) used by this invention, was calculated | required by polystyrene conversion on the following conditions using the gel permeation chromatograph.
Measuring device: HLC-8220GPC manufactured by Tosoh Corporation
Column: Guard column SUPER HZ-H manufactured by Tosoh Corporation
+ 4 TSKgel SUPER HZm-m manufactured by Tosoh Corporation Detector; RI (differential refractometer)
Data processing: GPC-8020 manufactured by Tosoh Corporation
Measurement conditions: Column temperature 40 ° C
Solvent tetrahydrofuran
Flow rate 0.35ml / min
Standard: Polystyrene sample: 0.2% by weight tetrahydrofuran solution in terms of resin solids filtered through a microfilter (100 ml)

  The epoxy resin (B) used in the present invention preferably has two or more epoxy groups in the molecule. Examples of such epoxy resins include bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol S type epoxy resin, and bisphenol F type epoxy resin; novolak types such as phenol novolac epoxy resin, cresol novolac type epoxy resin, and bisphenol type novolak. Epoxy resins; epoxidized products of various dicyclopentadiene-modified phenol resins obtained by reacting dicyclopentadiene with various phenols; biphenyl type epoxy resins such as epoxidized products of 2,2 ', 6,6'-tetramethylbiphenol; Epoxy resin having naphthalene skeleton; aromatic epoxy resin such as epoxy resin having fluorene skeleton and hydrogenated product of these aromatic epoxy resins; neopentyl glycol diglycidyl Aliphatic epoxy resins such as ether and 1,6-hexanediol diglycidyl ether; fats such as 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate and bis- (3,4-epoxycyclohexyl) adipate Cyclic epoxy resins; and heterocyclic ring-containing epoxy resins such as triglycidyl isocyanurate. Among these, an aromatic epoxy resin is preferable because a thermosetting polyimide resin composition excellent in opportunity physical properties of a cured coating film can be obtained, and a novolak type epoxy resin is more preferable.

  The blending amount of the polyimide resin (A) and the epoxy resin (B) can be used in a ratio of (A) / (B) of 1/100 to 50/1 as a weight ratio of the resin, more preferably Is from 1/10 to 20/1.

  The phenoxy resin (C) used in the present invention usually has no epoxy group and is thermoplastic, but even those having an epoxy group can be used in the present invention. The phenoxy resin (C) can also be said to be a resin having a polyhydroxy polyether structure.

  The phenoxy resin (C) used in the present invention is excellent in heat resistance, electrical characteristics, and flexibility because the compatibility with the polyimide resin (A) and the epoxy resin (B) is not easily lowered and a uniform resin composition is easily obtained. A phenoxy resin having a weight average molecular weight (Mw) of 5,000 to 200,000 is preferred because a cured product is obtained and a thermosetting polyimide resin composition having excellent storage stability before curing is obtained. The molecular weight (Mw) is more preferably 10,000 to 10,000.

The phenoxy resin (C) used in the present invention can be produced, for example, by the following method.
1. A method of producing an epihalohydrin by reacting with a bifunctional phenol in the presence of an alkali (hereinafter abbreviated as the first method).
2.2 A method for producing a functional epoxy resin and a bifunctional phenol by reacting them in the presence of a catalyst (hereinafter abbreviated as the second method).

  The phenoxy resin (C) used in the present invention may be obtained by either the first method or the second method, but the phenoxy resin (bifunctional epoxy resin and bifunctional phenol compound obtained by the second method) Is preferable because a phenoxy resin having a skeleton in which two or more structural units having different properties are repeatedly arranged can be easily produced.

  Examples of the bifunctional phenol used in the first method and the second method include bisphenols such as bisphenol A, bisphenol F, bisphenol S, and bisphenol fluorene; 4,4′-biphenol, 3,3 ′, 5,5 ′ -Biphenols such as tetramethyl-4,4'-biphenol; monocyclic bifunctional phenols such as catechol, resorcin, hydroquinone; bisphenolacetophenone, dihydroxybiphenyl ether, dihydroxybiphenyl thioether, 1,4-dihydroxynaphthalene, 1,5 -Dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1,1-bi-2-naphthol and the like can be mentioned.

  The bifunctional phenol used in the first method and the second method may be substituted with a substituent that does not have an adverse effect, such as an alkyl group, an aryl group, an ether group, or an ester group. These bifunctional phenols can be used in combination of plural kinds.

  Examples of the epihalohydrin used in the first method include epichlorohydrin and epibromohydrin. Epihalohydrin can be used in combination of two or more.

  Examples of the bifunctional epoxy resin used in the second method include bisphenol type epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy resin; diglycidyl ether of 4,4′-biphenol, Biphenol type epoxy resins such as diglycidyl ether of 3,3 ′, 5,5′-tetramethyl-4,4′-biphenol; diglycidyl ether of monocyclic bifunctional phenols such as catechol, resorcin, hydroquinone; bisphenol fluorene Epoxy resins such as diglycidyl ether, diglycidyl ether of bisphenolacetophenone, dihydroxybiphenyl ether, diglycidyl ether of dihydroxybiphenylthioether; cyclohexanedimethanol, 1,6- Epoxy resins such as diglycidyl ethers of bifunctional alcohols such as hexane and neopentyl glycol; Epoxy resins such as diglycidyl esters of divalent carboxylic acids such as phthalic acid, isophthalic acid, tetrahydrophthalic acid and hexahydrophthalic acid; 1 , 4-dihydroxynaphthalene diglycidyl ether, 1,5-dihydroxynaphthalene diglycidyl ether, 1,6-dihydroxynaphthalene diglycidyl ether, 2,6-dihydroxynaphthalene diglycidyl ether, 2,7-dihydroxynaphthalene Examples include diglycidyl ether and 1,1-bi-2-naphthol diglycidyl ether.

  As the phenoxy resin (C) used in the present invention, a phenoxy resin containing a bisphenol S skeleton or a naphthalene skeleton has a high glass transition point (Tg), and as a result, a cured product having excellent heat resistance can be obtained. The phenoxy resin containing a bisphenol S skeleton and a naphthalene skeleton is more preferable. A phenoxy resin containing a bisphenol S skeleton can be produced, for example, by the following method.

3. A method of producing an epihalohydrin by reacting a bifunctional phenol having a bisphenol S skeleton in the presence of an alkali (hereinafter abbreviated as Method 1-1).
4. When reacting a bifunctional epoxy resin and a bifunctional phenol, a method of reacting under a condition using a compound in which at least one of the bifunctional epoxy resin and the bifunctional phenol has a bisphenol S skeleton (hereinafter referred to as the first) Abbreviated 2-1 method).

  The phenoxy resin containing the bisphenol S skeleton used in the present invention may be obtained by either the above-mentioned method 1-1 or the method 2-1, but the phenoxy resin obtained by the method 2-1, This is preferable because a phenoxy resin having a skeleton in which two or more kinds of structural units having different properties are repeatedly arranged can be easily produced.

  Examples of the bifunctional epoxy resin having a bisphenol S skeleton include a bisphenol S type epoxy resin. Examples of the bifunctional phenol having a bisphenol S skeleton include bisphenol S.

A phenoxy resin containing a naphthalene skeleton can be produced, for example, by the following method.
5. A method of producing an epihalohydrin by reacting a bifunctional phenol having a naphthalene skeleton in the presence of an alkali (hereinafter abbreviated as method 1-2).
6. A method of reacting a bifunctional epoxy resin and a bifunctional phenol under the conditions using a compound in which at least one of the bifunctional epoxy resin and the bifunctional phenol has a naphthalene skeleton (hereinafter, second -2 method).

  The phenoxy resin containing a naphthalene skeleton used in the present invention may be obtained by either the above-mentioned method 1-2 or method 2-2, but the phenoxy resin obtained by the method 2-2 is 2 It is preferable because a phenoxy resin having a skeleton in which structural units having different kinds of properties or more are repeatedly arranged can be easily produced.

  Examples of the bifunctional phenol having a naphthalene skeleton include 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1,1. -Bi-2-naphthol and the like.

  Examples of the bifunctional epoxy resin having a naphthalene skeleton include diglycidyl ether of 1,4-dihydroxynaphthalene, diglycidyl ether of 1,5-dihydroxynaphthalene, diglycidyl ether of 1,6-dihydroxynaphthalene, 2,6 -Diglycidyl ether of dihydroxynaphthalene, diglycidyl ether of 2,7-dihydroxynaphthalene, diglycidyl ether of 1,1-bi-2-naphthol, and the like.

A phenoxy resin containing a bisphenol S skeleton and a naphthalene skeleton can be produced, for example, by the following method.
7). A method in which an epihalohydrin, a bifunctional phenol containing a bisphenol S skeleton and a bifunctional phenol containing a naphthalene skeleton are reacted in the presence of an alkali (hereinafter abbreviated as the first to third methods).
8. When the bifunctional epoxy resin is reacted with the bifunctional phenol, the bifunctional epoxy resin and the bifunctional phenol are selectively used so that the obtained phenoxy resin contains a bisphenol S skeleton and a naphthalene skeleton (hereinafter referred to as “the phenoxy resin”). (Abbreviated as Method 2-3)).

  The phenoxy resin containing a bisphenol S skeleton and a naphthalene skeleton used in the present invention may be obtained by either the above-mentioned method 1-3 or method 2-3, but the phenoxy obtained by method 2-3 above. The resin is preferable because a phenoxy resin having a skeleton in which structural units having two or more different properties are repeatedly arranged can be easily produced.

  As the phenoxy resin (C) used in the present invention, a phenoxy resin containing a bisphenol skeleton or a naphthalene skeleton and a biphenyl skeleton has a high glass transition point (Tg), and as a result a cured product having excellent heat resistance can be obtained. Therefore, a phenoxy resin containing a bisphenol skeleton, a naphthalene skeleton, and a biphenyl skeleton is more preferable.

  A phenoxy resin containing a bisphenol S skeleton and a biphenyl skeleton can be produced, for example, by the following method.

9. A method in which an epihalohydrin, a bifunctional phenol containing a biphenyl skeleton and a bifunctional phenol containing a bisphenol S skeleton are reacted in the presence of an alkali (hereinafter abbreviated as the first to fourth methods).
When reacting a 10.2 functional epoxy resin with a bifunctional phenol, a bifunctional epoxy resin and a bifunctional phenol are selectively used so that the resulting phenoxy resin contains a bisphenol S skeleton and a biphenyl skeleton (hereinafter referred to as “the phenoxy resin”). (Abbreviated as Method 2-4).

  The phenoxy resin containing a bisphenol S skeleton and a biphenyl skeleton used in the present invention may be obtained by either the above-mentioned methods 1-4 or 2-4, but it is obtained by the method 2-3 above. The resin is preferable because a phenoxy resin having a skeleton in which structural units having two or more different properties are repeatedly arranged can be easily produced.

  Examples of the bifunctional phenol containing a biphenyl skeleton used in Method 1-4 or Method 2-4 include 4,4′-biphenol, 3,3 ′, 5,5′-tetramethyl-4,4 ′. -Biphenols, such as biphenol, etc. are mentioned. Examples of the bifunctional epoxy resin containing a biphenol skeleton used in Method 2-3 include diglycidyl ether of 4,4′-biphenol, 3,3 ′, 5,5′-tetramethyl-4, 4 Examples include biphenol type epoxy resins such as diglycidyl ether of '-biphenol.

  A phenoxy resin containing a naphthalene skeleton and a biphenyl skeleton can be produced, for example, by the following method.

11. A method of producing an epihalohydrin by reacting a bifunctional phenol containing a biphenyl skeleton and a bifunctional phenol having a naphthalene skeleton in the presence of an alkali (hereinafter abbreviated as method 1-5).
12. A method of selectively using a bifunctional epoxy resin and a bifunctional phenol so that the resulting phenoxy resin contains a biphenyl skeleton and a naphthalene skeleton when the 12.2 functional epoxy resin is reacted with the bifunctional phenol (hereinafter referred to as “the phenoxy resin”). (Abbreviated as Method 2-5).

  The phenoxy resin containing a naphthalene skeleton and a biphenyl skeleton used in the present invention may be obtained by either the above-mentioned method 1-4 or the method 2-4, but the phenoxy resin obtained by the method 2-4 Is preferable because a phenoxy resin having a skeleton in which two or more kinds of structural units having different properties are repeatedly arranged can be easily produced.

A phenoxy resin containing a bisphenol S skeleton, a naphthalene skeleton, and a biphenyl skeleton can be produced, for example, by the following method.
13. A method for producing epihalohydrin, bisphenol S, a bifunctional phenol having a naphthalene skeleton and a bifunctional phenol having a biphenyl skeleton in the presence of an alkali (hereinafter abbreviated as Method 1-6).
14. When the bifunctional epoxy resin is reacted with the bifunctional phenol, the bifunctional epoxy resin and the bifunctional phenol are selectively used so that the obtained phenoxy resin contains a bisphenol S skeleton, a naphthalene skeleton, and a biphenyl skeleton. Method (hereinafter abbreviated as Method 2-6).

  The phenoxy resin containing a bisphenol S skeleton, a naphthalene skeleton, and a biphenol skeleton used in the present invention may be obtained by either the above-mentioned methods 1-6 or 2-6. The obtained phenoxy resin is preferable because a phenoxy resin having a skeleton in which two or more kinds of structural units having different properties are repeatedly arranged can be easily produced.

  In addition, as a synthesis condition of the phenoxy resin in the second method, the method 2-1 to the method 2-6, the mixing equivalent ratio of the bifunctional epoxy resin and the bifunctional phenol is epoxy group / phenolic property. It is preferable that the hydroxyl group = 1: 0.9 to 1.1 because the resulting phenoxy resin has a high molecular weight in a straight chain, and crosslinking due to side reactions hardly occurs and a phenoxy resin that is easily dissolved in a solvent is obtained. 1: 0.95 to 1: 1.05 is more preferable.

  The polymerization reaction temperature of the phenoxy resin in the second method, method 2-1 to method 2-6 is usually performed in a temperature range in which the catalyst is not decomposed in a nitrogen atmosphere. The reaction temperature is preferably from 60 to 200 ° C., more preferably from 100 to 170 ° C., and even more preferably from 120 to 160 ° C. because the high molecular weight reaction proceeds favorably and side reactions do not easily occur. In addition, when using a low boiling point solvent such as acetone or methyl ethyl ketone, the reaction temperature can be ensured by carrying out the reaction under high pressure using an autoclave.

  When a phenoxy resin containing a naphthalene skeleton and a biphenyl skeleton is used as the phenoxy resin (C) used in the present invention, a bifunctional epoxy resin and a bifunctional phenol compound are used, and at least one of the bifunctional epoxy resin and the bifunctional phenol compound is used. What was obtained by making it react with the combination in which a seed | species contains a naphthalene skeleton is preferable. As the bifunctional epoxy resin used here, an epoxy resin containing a 3,3 ′, 5,5′-tetramethylbiphenol skeleton is preferred, and a phenol compound containing a naphthalene skeleton is more preferred as the bifunctional phenol compound.

  The blending amount of the polyimide resin (A) and the epoxy resin (B) can be used in a ratio of (A) / (B) of 1/100 to 50/1 as a weight ratio of the resin, more preferably Is from 1/10 to 20/1.

  Moreover, the compounding quantity of phenoxy resin (C) in the thermosetting polyimide resin composition of this invention is weight with respect to the total [(A) + (B)] of a polyimide resin (A) and an epoxy resin (B). The ratio [(A) + (B)] / (C) = 95/5 to 5/95 is preferable. More preferably, [(A) + (B)] / (C) = 90/10 to 10/90, and still more preferably [(A) + (B)] / (C) = 80/20 to 20 /. 80.

  A compound that reacts with the phenolic hydroxyl group of the polyimide resin (A) can be further added to the thermosetting polyimide resin composition of the present invention. Specific examples include epoxy compounds other than the epoxy resin (B), isocyanate compounds, silicates, and alkoxysilane compounds.

  Examples of the isocyanate compound include aromatic isocyanate compounds, aliphatic isocyanate compounds, and alicyclic isocyanate compounds. Preferably, a polyisocyanate compound having two or more isocyanate groups in one molecule is preferable. A blocked isocyanate compound can also be used.

  Further, the thermosetting polyimide resin composition of the present invention includes binder resins such as polyester, phenoxy resin, PPS resin, PPE resin, polyarylene resin, phenol resin, melamine resin, alkoxysilane curing agent, polybasic acid anhydride, cyanate. Curing agents such as compounds or reactive compounds, melamine, dicyandiamide, guanamine and derivatives thereof, imidazoles, amines, phenols having one hydroxyl group, organic phosphines, phosphonium salts, quaternary ammonium salts, photocationic catalysts, etc. It is also possible to add a curing catalyst, a curing accelerator, a filler, and other additives.

  Further, as the curing accelerator, a urethanization catalyst is preferably used in combination. Examples of such a urethanization catalyst include 1,8-diazabicyclo [5,4,0] undecene-7 (hereinafter DBU) and its organic salt compounds, dialkyltin alkyls such as triethylenediamine, dibutyltin diacetate, and dibutyltin dilaurate. Examples thereof include esters and carboxylates of bismuth.

  The method for preparing the thermosetting polyimide resin composition of the present invention is not particularly limited, but various components may be mechanically mixed, mixed by hot melting, or diluted after being mixed with a solvent. good.

  Moreover, the thermosetting polyimide resin composition of this invention can add a various filler, an organic pigment, an inorganic pigment, an extender pigment, a rust preventive agent, etc. further as needed. These may be used alone or in combination of two or more.

  Examples of the filler include barium sulfate, barium titanate, silicon oxide powder, fine particulate silicon oxide, silica, talc, clay, magnesium carbonate, calcium carbonate, aluminum oxide, aluminum hydroxide, mica and the like. It is done.

  Examples of the organic pigment include azo pigments; copper phthalocyanine pigments such as phthalocyanine blue and phthalocyanine green, and quinacridone pigments.

  Examples of the inorganic pigment include chromates such as chrome lead, zinc chromate and molybdate orange; ferrocyanides such as bitumen, titanium oxide, zinc white, bengara, iron oxide; metal oxides such as chromium carbide green, Cadmium yellow, cadmium red; metal sulfides such as mercury sulfide; selenides; sulfates such as lead sulfate; silicates such as ultramarine; carbonates, cobalt biored; phosphates such as manganese purple; aluminum powder, zinc dust Metal powders such as brass powder, magnesium powder, iron powder, copper powder and nickel powder; carbon black and the like.

  In addition, any of other coloring, rust prevention, and extender pigments can be used. These may be used alone or in combination of two or more.

  The thermosetting polyimide resin composition of the present invention is usually applied to a textile substrate such as an organic or inorganic-metal film substrate or glass cloth or polyaramid cloth by a method such as casting, impregnation or coating. The coating is enforced. The curing temperature is 80 to 300 ° C., and the curing time is 20 minutes to 5 hours.

  By using the thermosetting polyimide resin composition of the present invention, an adhesive film, a prepreg, a multilayer printed wiring board, a laminated board and the like can be produced.

  The adhesive film is, for example, a support base film as a support, and a resin varnish obtained by dissolving the thermosetting polyimide resin composition of the present invention in a predetermined organic solvent is applied to the surface of the adhesive film, followed by heating and / or hot air spraying. Can be made into a thin film by drying.

  Examples of the supporting base film include polyolefins such as polyethylene and polyvinyl chloride, polyesters such as polyethylene terephthalate, polycarbonates and polyimides, and metal foils such as release paper, copper foil, and aluminum foil. Note that the support base film may be subjected to a release treatment in addition to the mud treatment and the corona treatment.

  The organic solvent is usually a solvent, for example, ketones such as acetone, methyl ethyl ketone, cyclohexanone, acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, carbitol acetate, cellosolves such as cellosolve, butylcellosolve, etc. In addition to carbitols such as carbitol and butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide and the like can be used alone or in combination.

  Specifically, the thickness of the thermosetting polyimide resin composition layer of the present invention is equal to or greater than the conductor thickness of the inner circuit board to be laminated on the support base film having a thickness of 10 to 200 μm, and is in the range of 10 to 150 μm. A protective film such as a support film having a thickness of 1 to 40 μm is further laminated on the other surface, wound into a roll and stored.

  The prepreg can be prepared, for example, by coating and impregnating the thermosetting polyimide resin composition of the present invention to a sheet-like reinforcing substrate made of fibers by a hot melt method or a solvent method, heating, and semi-curing. it can. As the sheet-like reinforcing substrate made of fibers, known and commonly used prepreg fibers such as glass cloth and aramid fibers can be used. In the hot melt method, a solvent-free resin is used, and a method of coating the resin once with a resin having good releasability and laminating it, or directly coating with a die coater is known. Also, the solvent method is a method of obtaining a prepreg by immersing and impregnating a sheet-like reinforcing substrate in a resin varnish obtained by dissolving the thermosetting polyimide resin composition of the present invention in an organic solvent in the same manner as an adhesive film, and then drying. It is.

  In the multilayer printed wiring board, for example, a plated conductor layer is formed on the roughened surface of the layer cured product of the thermosetting polyimide resin composition of the present invention, and the other surface is in close contact with the patterned inner layer circuit board. Multilayer printed wiring boards that are laminated together. The manufacturing method of the multilayer printed wiring board using this thermosetting polyimide resin composition of this invention is demonstrated. The thermosetting polyimide resin composition of the present invention is applied to a patterned inner layer circuit board, and when it contains an organic solvent, it is dried and then cured by heating. As the inner layer circuit board, a glass epoxy, metal substrate, polyester substrate, polyimide substrate, BT resin substrate, thermosetting polyphenylene ether substrate or the like can be used, and the circuit surface may be roughened in advance. Good. The drying conditions are preferably 70 to 130 ° C. for 5 to 40 minutes, and the heat curing conditions are preferably 130 to 180 ° C. for 15 to 90 minutes. After heat-curing, drilling and / or laser and plasma drill holes in predetermined through holes and via holes as required. Next, roughening treatment is performed with an oxidizing agent such as permanganate, dichromate, ozone, hydrogen peroxide / sulfuric acid, nitric acid, etc., and uneven anchors are formed on the surface of the adhesive layer. Further, the conductor layer is formed by electroless and / or electrolytic plating. At this time, a plating resist having a pattern opposite to that of the conductor layer may be formed, and the conductor layer may be formed only by electroless plating. After the conductor layer is formed in this manner, the remaining unreacted epoxy resin is cured by annealing at 150 to 180 ° C. for 20 to 60 minutes, and the peel strength of the conductor layer can be further improved. .

In order to produce a multilayer printed wiring board using an adhesive film obtained by using the thermosetting polyimide resin composition of the present invention, for example, first, the adhesive film is laminated on a patterned inner layer circuit board. When the protective film is present, the laminate is bonded to the thin film of the thermosetting polyimide resin composition of the present invention having the performance of an adhesive while applying pressure and heat after removing the protective film. As for the lamination conditions, the film and the inner layer circuit board are preheated as necessary, the pressure bonding temperature is 70 to 130 ° C., the pressure bonding pressure is 1 to 11 Kg / cm ² , and lamination is preferably performed under reduced pressure. Further, the laminate may be a batch type or a continuous type using a roll. After the lamination, the support film is peeled off after cooling to around room temperature, the thermosetting polyimide resin composition of the present invention is transferred onto the inner circuit board, and then cured by heating. Moreover, when using the support film in which the mold release process was performed, you may peel a support film, after making it heat-harden. Thereafter, as in the above method, the surface of the film is roughened with an oxidizing agent, and the conductor layer is formed by plating to produce a multilayer printed wiring board.

On the other hand, in order to produce a multilayer printed wiring board using a prepreg comprising the thermosetting polyimide resin composition of the present invention, for example, one or several sheets of the prepreg are stacked on a patterned inner layer circuit board, A metal plate is sandwiched through a release film and laminated and pressed under pressure and heating conditions. The pressure condition is preferably 5 to 40 kgf / cm ² , and the temperature condition is preferably 120 to 180 ° C. for 20 to 100 minutes. It can also be manufactured by the laminating method. Thereafter, as in the above method, the surface of the prepreg is roughened with an oxidizing agent, and the conductor layer is formed by plating to produce a multilayer printed wiring board. When the manufactured multilayer printed wiring board has two or more inner layer circuits patterned in the same direction on the inner layer circuit board, an insulation that is a cured product of the thermosetting polyimide resin composition of the present invention is provided between the inner layer circuits. Will have layers. The patterned inner layer circuit board referred to in the present invention is a relative name to the multilayer printed wiring board. For example, when a circuit is formed on both surfaces of the substrate and a thin film obtained by curing the thermosetting polyimide resin composition of the present invention is formed as an insulating layer on both circuit surfaces, then four layers are formed on each surface. A printed wiring board can be formed. In this case, the inner layer circuit board refers to a printed wiring board having circuits formed on both sides formed on the board. Further, a six-layer printed wiring board can be obtained by additionally forming a single-layer circuit on both surfaces of the four-layer printed wiring board via an insulating layer. The inner layer circuit board in this case refers to the above-described four-layer printed wiring board.

  As a laminated board obtained using the thermosetting polyimide resin composition of the present invention, for example, a surface obtained by etching out the thermosetting polyimide resin composition of the present invention from a copper foil of a double-sided copper-clad laminated board or an unclad board Coating on at least one side of the laminate, a laminate obtained by heating and curing, pressing the adhesive film on the side of the copper foil of the double-sided copper-clad laminate or on at least one side of the unclad plate, Laminate obtained by laminating under heating conditions, peeling support base film if necessary, heat-curing, surface of copper foil of double-sided copper-clad laminate etched from above prepreg, or at least one surface of unclad plate Examples thereof include a laminate obtained by laminating under pressure and heating conditions, and a laminate obtained by laminating prepregs under pressure and heating conditions. The manufacturing method of a laminated board is described below.

  The thermosetting polyimide resin composition of the present invention can be applied to at least one surface of the copper clad laminate on which the copper foil of the double-sided copper clad laminate is etched out or at least one surface of the unclad plate to obtain a laminate. . The said unclad board is obtained by using a release film etc. instead of copper foil at the time of copper clad laminated board manufacture. The laminated plate thus obtained is subjected to roughening treatment with an oxidizing agent such as permanganate, dichromate, ozone, hydrogen peroxide / sulfuric acid, nitric acid, etc. Further, the conductor layer can be directly formed on the surface of the laminate by electroless and / or electrolytic plating.

  In addition, the laminate is obtained by laminating the adhesive film comprising the thermosetting polyimide resin composition of the present invention on at least one side of the copper foil of the double-sided copper-clad laminate or the unclad plate, and then heat-curing the laminate. Can be obtained. The laminated plate thus obtained is subjected to roughening treatment with an oxidizing agent such as permanganate, dichromate, ozone, hydrogen peroxide / sulfuric acid, nitric acid, etc. Further, the conductor layer can be directly formed on the surface of the laminate by electroless and / or electrolytic plating.

  Further, a predetermined number of prepregs made of the thermosetting polyimide resin composition of the present invention are stacked, or the copper foil of the double-sided copper clad laminate is placed on the etched-out surface or at least one surface of the unclad plate, and separated. A laminated plate can be obtained by sandwiching a metal plate through a mold film and performing lamination pressing under pressure and heating conditions. The laminated plate thus obtained is subjected to roughening treatment with an oxidizing agent such as permanganate, dichromate, ozone, hydrogen peroxide / sulfuric acid, nitric acid, etc. Further, the conductor layer can be directly formed on the surface of the laminate by electroless and / or electrolytic plating.

  Next, the present invention will be described more specifically with reference to examples and comparative examples. In the following, all parts and “%” are “% by weight” unless otherwise specified.

Synthesis Example 1 [Production of Polyimide Resin (A)]
In a flask equipped with a stirrer, a thermometer and a condenser, 140 g of DMAC (dimethylacetamide), 98.4 g (0.24 mol) of TMEG (ethylene glycol bisanhydrotrimellitate), and 40 g of BPS (bisphenol S) ( 0.16 mol), 40 g (0.16 mol) of MDI (diphenylmethane diisocyanate) and 26.9 g (0.16 mol) of HDI (hexamethylene diisocyanate), and paying attention to heat generation while stirring. The temperature was raised to 0 ° C., dissolved and reacted at this temperature for 1 hour, further heated to 120 ° C. over 2 hours, and then reacted at this temperature for 1 hour. The reaction proceeded with the foaming of carbon dioxide, and the system became a brown liquid. The resin solid content concentration was adjusted to 55% with DMAC to obtain a polyimide resin (A-1) solution having a viscosity at 25 ° C. of 100 Pa · s.

  As a result of coating the obtained polyimide resin (A-1) solution on a KBr plate and measuring the infrared absorption spectrum of the sample in which the solvent was volatilized, 2270 cm-1 which is the characteristic absorption of the isocyanate group completely disappeared, Characteristic absorption of the imide ring was confirmed at 725 cm −1, 1780 cm −1 and 1720 cm −1. Further, the amount of carbon dioxide generated was 21.1 g (0.48 mol), which was traced by the change in the weight charged to the flask. From this, it is concluded that the total amount of 0.48 mol of TMEG acid anhydride groups has been converted to imide bonds, and the remaining isocyanate groups are linked to the resin by forming urethane bonds with BPS.

Synthesis example 2 (same as above)
A flask equipped with a stirrer, thermometer and condenser was charged with 156.8 g of DMAC, 65.6 g (0.16 mol) of TMEG, 29.8 g (0.16 mol) of BP (biphenol), and 40 g of MDI (0 .16 mol) and a polyisocyanate having an isocyanurate ring derived from 1,6-hexane diisocyanate (hereinafter abbreviated as HDI-N. Isocyanurate ring-containing triisocyanate content) 63.3%) 21.4 g (0.12 mol as an isocyanate group) was charged, and the temperature was raised to 100 ° C. with attention to heat generation while stirring, and the mixture was reacted at this temperature for 7 hours. The reaction proceeded with foaming, and the system became a clear brown liquid. A solution of a polyimide resin (A-2) having a viscosity at 25 ° C. of 15 Pa · s was obtained.

  As a result of coating the obtained polyimide resin (A-2) solution on a KBr plate and measuring the infrared absorption spectrum of the sample in which the solvent was volatilized, 2270 cm-1 which is the characteristic absorption of the isocyanate group completely disappeared, Characteristic absorption of the imide ring was confirmed at 725 cm −1, 1780 cm −1 and 1720 cm −1. Further, characteristic absorption of the isocyanurate ring was confirmed at 1690 cm −1 and 1460 cm −1.

  The amount of carbon dioxide generated was 12.3 g (0.28 mol), which was monitored by the change in the weight charged to the flask. Thus, 0.28 mol (87.5%) of the total amount of acid anhydride groups of TMEG was converted to imide bonds, and the total amount of isocyanate groups of MDI and HDI-N was 0.44. It is concluded that 0.28 mole (63.6%) of the moles are converted to imide bonds and the remaining isocyanate groups are linked to the resin by forming urethane bonds with BP.

Synthesis example 3 (same as above)
In a flask equipped with a stirrer, a thermometer and a condenser, 203.5 g of γ-butyrolactone, 57.4 g (0.14 mol) of TMEG (ethylene glycol bisanhydrotrimellitate), BPF (bisphenol F) 28. 28 g (0.14 mol), 48.72 g (0.28 mol) of TDI (toluene diisocyanate), and HGMPD-C (polycarbonate diol obtained from 1,6-hexanediol and methylpentanediol: hydroxyl group equivalent = 113. 7KOH-mg / g) 69.08 g (0.14 mol as the amount of hydroxyl group), and while stirring, paying attention to heat generation, the temperature was raised to 80 ° C. and dissolved and reacted at this temperature for 1 hour. The temperature was further raised to 120 ° C. over 2 hours, and the reaction was carried out at this temperature for 4 hours. The reaction proceeded with the foaming of carbon dioxide, and the system became a black-brown liquid. A solution (resin content: 48.4%) of a polyimide resin (A-3) having a viscosity at 25 ° C. of 15 Pa · s was obtained.

  As a result of coating the obtained polyimide resin (A-3) solution on a KBr plate and measuring the infrared absorption spectrum of the sample in which the solvent was volatilized, 2270 cm-1 which is the characteristic absorption of the isocyanate group completely disappeared, Characteristic absorption of the imide ring was confirmed at 725 cm −1, 1780 cm −1 and 1720 cm −1. The amount of carbon dioxide gas generated was 12.32 g (0.28 mol), which was traced by the change in the weight charged to the flask. Accordingly, the total amount of TMEG acid anhydride groups of 0.28 mol (0.14 mol of TMEG has 0.14 mol of acid anhydride groups) is converted to imide bonds, and the remaining isocyanate groups Is concluded to be linked to the resin by a urethane bond between BPF and HGMPD-C.

Synthesis Example 4 [Synthesis of Phenoxy Resin (C)]
In a flask equipped with a stirrer, a thermometer and a condenser, EPICLON 850 [bisphenol A type epoxy resin manufactured by Dainippon Ink & Chemicals, Inc., epoxy equivalent 188 g / eq] and bisphenol S 125 g (0 0.5 mol) and 730.3 g of cyclohexanone, nitrogen was blown and stirred, and the temperature was raised to 80 ° C. while paying attention to heat generation. Then, 3.1 g of triphenylphosphine was added as a reaction catalyst and 150 ° C. was added over 1 hour. Then, the reaction was continued at 150 ° C. for 3 hours until the solid equivalent epoxy equivalent reached 10,000. By this reaction, a phenoxy resin having a bisphenol skeleton was obtained (non-volatile content: 30%). This is abbreviated as phenoxy resin (C-1). The weight average molecular weight (Mw) of the phenoxy resin (C-1) was 45000.

Synthesis example 5 (same as above)
In a flask equipped with a stirrer, a thermometer and a condenser, Epiklon HP4032D (Naphthalene type epoxy resin manufactured by Dainippon Ink & Chemicals, Inc.) 100 g (0.355 mol) and dihydroxynaphthalene 55.6 g (0.348 mol) 233.4 g of cyclohexanone was charged, heated to 80 ° C. while paying attention to heat generation while blowing nitrogen and stirring, and then added 1.55 g of triphenylphosphine as a reaction catalyst, and further heated to 150 ° C. over 1 hour. The mixture was reacted at 150 ° C. for 3 hours until the solid equivalent epoxy equivalent reached 10,000. By this reaction, a resin solution containing a naphthalene / naphthalene phenoxy resin having a secondary hydroxyl group was obtained (nonvolatile content: 40%). This is abbreviated as phenoxy resin (C-2). The weight average molecular weight (Mw) of the phenoxy resin (C-2) was 36000.

Synthesis example 6 (same as above)
To a flask equipped with a stirrer, a thermometer and a condenser, Epicoat YX4000H (3,3 ′, 5,5′-tetramethylbiphenyl type epoxy resin manufactured by Japan Epoxy Resin Co., Ltd.) 100 g (0.259 mol) and dihydroxynaphthalene 40.6 g (0.254 mol) and cyclohexanone 210.9 g were charged and heated to 80 ° C. while paying attention to heat generation while blowing nitrogen and stirring, and 1.41 g of triphenylphosphine was added as a reaction catalyst. After heating up to 150 degreeC over time, it was made to react at 150 degreeC for 6 hours. By this reaction, a resin solution containing a 3,3 ′, 5,5′-tetramethylbiphenyl / naphthalene phenoxy resin having a secondary hydroxyl group was obtained (nonvolatile content: 40%). This is abbreviated as phenoxy resin (C-3). The weight average molecular weight (Mw) of the phenoxy resin (C-3) was 44000.

Synthesis example 7 (same as above)
A flask equipped with a stirrer, a thermometer and a condenser was charged with 100 g (0.355 mol) of epiclone HP4032D and 88.7 g (0.355 mol) of bisphenol S as naphthalene epoxy resin, and 283.1 g of cyclohexanone, and nitrogen was blown into the flask. While stirring, the temperature was raised to 80 ° C. while paying attention to heat generation, 1.89 g of triphenylphosphine was added as a reaction catalyst, and the temperature was further raised to 150 ° C. over 1 hour, followed by reaction at 150 ° C. for 8 hours. By this reaction, a resin solution containing a naphthalene / bisphenol S-based phenoxy resin having a secondary hydroxyl group was obtained (nonvolatile content: 40%). This is abbreviated as phenoxy resin (C-4). The weight average molecular weight (Mw) of the phenoxy resin (C-4) was 18000.

Synthesis example 8 (same as above)
To a flask equipped with a stirrer, a thermometer and a condenser, 193 g (0.5 mol) of Epicoat YX4000H (3,3 ′, 5,5′-tetramethylbiphenyl type epoxy resin manufactured by Japan Epoxy Resin Co., Ltd.) and bisphenol S 125 g (0.5 mol) and 742 g of cyclohexanone were charged and heated to 80 ° C. while paying attention to heat generation while blowing nitrogen and stirring, and then 3.18 g of triphenylphosphine was added as a reaction catalyst, and 150 hours were added over 1 hour. After raising the temperature to 0 ° C., the reaction was conducted at 150 ° C. for 6 hours. By this reaction, a resin solution containing 3,3 ′, 5,5′-tetramethylbiphenyl / bisphenol S-based phenoxy resin was obtained (nonvolatile content: 30%). This is abbreviated as phenoxy resin (C-5). The weight average molecular weight (Mw) of the phenoxy resin (C-5) was 45000.

Synthesis example 9 (same as above)
A phenoxy resin having a bisphenol S skeleton, a biphenyl skeleton, and a naphthalene skeleton.
A flask equipped with a stirrer, a thermometer and a condenser was charged with 100 g (0.259 mol) of Epicoat YX4000H, 39.7 g (0.159 mol) of bisphenol S, 16 g (0.1 mol) of dihydroxynaphthalene and 364 g of cyclohexanone. The temperature was raised to 80 ° C. while paying attention to heat generation while blowing nitrogen and stirring, 1.5 g of triphenylphosphine was added as a reaction catalyst, the temperature was further raised to 150 ° C. over 1 hour, and the reaction was conducted at 150 ° C. for 6 hours. I let you. By this reaction, a resin solution containing 3,3 ′, 5,5′-tetramethylbiphenyl / bisphenol S / naphthalene phenoxy resin was obtained (nonvolatile content: 30%). This is abbreviated as phenoxy resin (C-6). The weight average molecular weight (Mw) of the phenoxy resin (C-6) was 38000.

Example 1
The thermosetting polyimide resin composition 1 of the present invention was prepared with the formulation shown in Table 1. The electrical characteristics, heat resistance, dimensional stability of the cured coating film of the obtained thermosetting polyimide resin composition 1 and the dimensional stability of the thermosetting polyimide resin composition 1 were evaluated according to the following methods. The results are shown in Table 4.

(1) Evaluation of electrical characteristics The electrical characteristics were evaluated by measuring the dielectric constant (ε) and dielectric loss (Tanδ) of the coating film. The thermosetting resin composition 1 was coated on a tinplate substrate so that the film thickness after curing was 80 μm, dried for 20 minutes with a dryer at 70 ° C., cured for 1 hour at 200 ° C., cooled, and then peeled off. The measurement sample obtained by cutting out the cured coating film was measured using a 4291B manufactured by Agilent Technologies, with a frequency of 100 MHz and a measurement atmosphere temperature of 23 degrees, and a dielectric constant (ε) and dielectric loss (Tanδ). Was measured.

(2) Evaluation of heat resistance and evaluation of dimensional stability Evaluation of heat resistance was performed by measuring the glass transition point (Tg) of the cured coating film. The dimensional stability was evaluated by measuring the linear expansion coefficient.
<Preparation of test specimen>
The thermosetting resin composition 1 was coated on a tin plate so that the film thickness after curing was 50 μm, dried for 20 minutes with a dryer at 70 ° C., cured for 1 hour at 200 ° C., cooled, and then peeled off. The cured coating film was cut into a width of 5 mm and a length of 30 mm to obtain a measurement sample.

<Tg measurement method>
Using a thermal analysis system TMA-SS6000 manufactured by Seiko Electronics Co., Ltd., measurement was performed by the TMA (Thermal Mechanical Analysis) method under the conditions of a sample length of 10 mm, a heating rate of 10 ° C./min, and a load of 30 mN. In addition, Tg calculated | required the inflection point from the temperature-dimensional change curve in TMA measurement, and made the temperature Tg. It represents that it is excellent in heat resistance, so that Tg is high. The linear expansion coefficient was determined from the displacement of the sample length in the temperature range of 50 to 60 ° C. and 110 to 120 ° C. The smaller the linear expansion coefficient, the better the dimensional stability.
In Tables 4 and 5, the measurement result of the linear expansion coefficient in the temperature range of 50 to 60 ° C. is “linear expansion coefficient 1”, and the measurement result of the linear expansion coefficient in the temperature range of 110 to 120 ° C. is “linear expansion coefficient”. 2 ”. The unit of linear expansion coefficient is PPM (cm / cm / ° C.) × 10 ⁶ .

(3) Storage stability (storage stability of thermosetting resin composition 1)
The thermosetting polyurethane resin composition 1 was stored in a sealed glass bottle, and the state after one week at 40 ° C. was observed. Visual evaluation was made according to the following criteria.
○: There are no aggregates and precipitates, and there is fluidity without increasing the viscosity.
Δ: A tailing or a high-viscosity product having no aggregate or precipitate.
X: Gelation occurred.

Examples 2-12 and Comparative Examples 1-5
The thermosetting resin compositions 2 to 12 and the comparative thermosetting resin compositions 1 'to 5' are the same as in Example 1 except that the compositions shown in Tables 1, 2 and 4 are added. Was prepared. Using this, various evaluations were performed in the same manner as in Example 1, and the results are shown in Tables 5-8.

Examples 13-15
Thermosetting resin compositions 13 to 15 were prepared in the same manner as in Example 1 except that the compositions shown in Table 3 were used. The compatibility of the cured coating film of the obtained thermosetting resin composition, coating film forming property, heat resistance, mechanical properties, and storage stability of the thermosetting resin composition were evaluated according to the following methods. The results are shown in Table 7.

(1) Evaluation of compatibility The coating state after coating the glass plate with the thermosetting polyimide resin composition 1 after the preparation and the thermosetting polyimide resin composition 1 after the thermosetting resin composition was prepared. The state of was evaluated according to the following evaluation criteria.
Evaluation criteria ○: In the preparation of the thermosetting resin composition, it becomes uniform by stirring, and no foreign matter or the like is seen on the coating surface.
(Triangle | delta): It becomes difficult to become uniform by stirring in preparation of a thermosetting resin composition, and a foreign material etc. are seen a little on the coating-film surface.
X: In preparation of a thermosetting resin composition, it does not melt | dissolve uniformly but a coating surface can confirm a repelling, a foreign material, and an insoluble matter.

(2) Evaluation of film-forming property Test piece obtained by applying thermosetting resin composition 10 to a tin plate with an applicator so that the film thickness after drying was 30 μm, and then drying at 110 ° C. for 30 minutes. Was allowed to stand at room temperature for 24 hours, and the appearance of the coating film was evaluated according to the following evaluation criteria.
Evaluation criteria ○: No abnormalities such as cracks are observed in the coating film.
Δ: Some cracks are observed in the coating film.
X: Cracks occurred on the entire surface of the coating film.

(3) Evaluation of heat resistance The heat resistance was evaluated by conducting a solder bath test of the cured coating film.
<Preparation of test specimen>
The thermosetting resin composition 10 was coated on a tinplate substrate so that the film thickness after curing was 50 μm, dried with a dryer at 70 ° C. for 30 minutes, and then cured at 200 ° C. for 1 hour, respectively. After a film was prepared and cooled to room temperature, the cured coating film was cut out from the coated plate and used as a solder bath test sample.

<Solder bath test method>
The cured coating film was immersed in a molten solder bath at 260 ° C. for 30 seconds, and then cooled to room temperature. This dipping operation was performed three times in total, and the appearance of the cured coating film was evaluated according to the following evaluation criteria.
○: Appearance abnormality is not observed in the coating film.
Δ: Abnormalities such as swelling and peeling are slightly observed in the coating film.
X: Abnormalities such as swelling and peeling are observed in the coating film.

(4) Evaluation of mechanical properties Mechanical properties were evaluated by conducting a tensile test of the coating film.
<Preparation of test piece>
The thermosetting resin composition 10 was coated on a tinplate substrate so that the film thickness after curing was 50 μm. Next, this coated plate was dried with a dryer at 70 ° C. for 20 minutes and then cured at 200 ° C. for 1 hour to prepare a cured coating film. After cooling to room temperature, the cured coating film was cut into a predetermined size, isolated from the substrate, and used as a measurement sample.

<Tensile test measurement method>
Five samples for measurement were prepared and subjected to a tensile test under the following conditions to determine the breaking strength and breaking elongation. It represents that it is a coating film which is excellent in mechanical physical property, so that the value of breaking strength and breaking elongation is high.
Measuring instrument: Tensilon manufactured by Toyo Baldwin, Inc. Sample shape: 10 mm x 70 mm
Between chucks: 20 mm
Tensile speed: 10 mm / min
Measurement atmosphere: 22 ° C., 45% RH
(5) Storage stability (storage stability of thermosetting polyurethane resin composition)
Evaluation was performed in the same manner as in Example 1.

Table footnote N680: Cresol novolac epoxy resin, epoxy equivalent 214 Softening point 81 ° C
EP2050: Solid bisphenol A type epoxy resin, epoxy equivalent 640
DBTL: Dibutyltin dilaurate 2E4MZ: 2-ethyl-4-methyl-imidazole DBTA: Dibutyltin acetate CNR: Orthocresol novolac resin Melting point 90 ° C. Hydroxyl equivalent = 105
BPF: Bisphenol F

Claims (18)

It contains a polyimide resin (A) having a structure represented by the following general formula (1) and / or the following general formula (2), an epoxy resin (B), and a phenoxy resin (C). Thermosetting polyimide resin composition.

(In the formula, X represents a residue obtained by removing two phenolic hydroxyl groups from a phenolic compound having two or more phenolic hydroxyl groups in one molecule.) The thermosetting polyimide resin according to claim 1, wherein the polyimide resin (A) is a polyimide resin containing a structural unit represented by the following general formula (16) and / or a structure represented by the general formula (17). Composition.

(Wherein R ⁹ represents a residue structure obtained by removing an acid anhydride group from a tetracarboxylic acid anhydride, and R ¹¹ represents a residue structure obtained by removing an acid anhydride group and a carboxyl group from a tricarboxylic acid anhydride. ) X in the general formula (1) and / or the general formula (2) is one or more structures selected from the group of structures represented by the general formula (5), the general formula (7), and the general formula (9). The thermosetting polyimide resin composition according to claim 1.

(In the formula, R ¹ is a direct bond or a divalent linking group, and R ² may be the same or different, and represents a hydrogen atom or an alkyl group having 1 to 16 carbon atoms.)

(In the formula, R ³ represents a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, or a structure represented by the following general formula (8).)

The thermosetting polyimide resin composition according to claim 1, wherein X in the general formula (1) and / or the general formula (2) has a structure represented by the general formula (6).

(In the formula, R ¹ is a direct bond or a divalent linking group, and R ² may be the same or different, and represents a hydrogen atom or an alkyl group having 1 to 18 carbon atoms. A, b and c; The sum of is 1 or more.) The thermosetting polyimide resin composition according to claim 4, wherein R ¹ in the general formula (6) has a methylene group and / or a structure represented by the following general formula (11).

The thermosetting polyimide resin composition according to claim 1, wherein the polyimide resin (A) is a polyimide resin branched in a structure represented by the following general formula (15).

(In the formula, R ⁵ represents a residue structure obtained by removing an isocyanate group from a diisocyanate compound.) The thermosetting polyimide resin composition according to claim 1, wherein the polyimide resin (A) is a polyimide resin having a structure represented by the following general formula (13).

(In the formula, Y represents a residue obtained by removing two hydroxyl groups from a polyol compound having at least two alcoholic hydroxyl groups in one molecule.) The structure represented by the general formula (13) is a structure having a residue obtained by removing two hydroxyl groups from a polyol compound having a number average molecular weight of 300 to 5,000 as Y in the structure. Thermosetting polyimide resin composition. The thermosetting polyimide resin composition according to claim 7, wherein the structure represented by the general formula (13) has a residue having a glass transition temperature of −150 to 0 ° C. as Y in the structure. Polyether having at least two alcoholic hydroxyl groups in one molecule, wherein Y in the general formula (13) is a residue obtained by removing two hydroxyl groups from a polyolefin polyol having at least two alcoholic hydroxyl groups in one molecule. Residue obtained by removing two hydroxyl groups from a polyol, Residue obtained by removing two hydroxyl groups from a polycarbonate polyol having at least two alcoholic hydroxyl groups in one molecule, Polyester having at least two alcoholic hydroxyl groups in one molecule One or more residues selected from the group consisting of a residue obtained by removing two hydroxyl groups from a polyol and a residue obtained by removing two hydroxyl groups from a polysiloxane polyol having at least two alcoholic hydroxyl groups in one molecule. The thermosetting polyimide resin composition according to claim 7. The thermosetting polyimide resin composition according to any one of claims 1 to 10, wherein the epoxy resin (B) is an aromatic epoxy resin. The thermosetting polyimide resin composition according to claim 11, wherein the aromatic epoxy resin is a novolac type epoxy resin. The thermosetting polyimide resin composition according to any one of claims 1 to 10, wherein the phenoxy resin (C) is a phenoxy resin containing a bisphenol S skeleton or a naphthalene skeleton. The thermosetting polyimide resin composition according to any one of claims 1 to 10, wherein the phenoxy resin (C) is a phenoxy resin containing a bisphenol S skeleton and a naphthalene skeleton. The thermosetting polyimide resin composition according to claim 13 or 14, wherein the phenoxy resin (C) is a phenoxy resin further containing a biphenyl skeleton. The polyimide resin composition according to any one of claims 13 to 15, wherein the phenoxy resin (C) is a phenoxy resin having a weight average molecular weight of 5,000 to 200,000. The thermosetting polyimide resin composition according to any one of claims 1 to 10, comprising a curing catalyst. Furthermore, the thermosetting polyimide resin composition of any one of Claims 1-10 containing a urethanization catalyst.