JP2008252129A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for a light emitting device having superior thermal dissipation properties, capable of stabilizing light emission operation and improving use efficiency of light, and to provide a light-emitting device that uses the package. <P>SOLUTION: A ceramic substrate 10 having electrical insulation properties is provided. On the surface of the ceramic substrate 10, a first recess portion 10e, forming an outgoing aperture of light, is formed in the thickness direction of the ceramic substrate 10. A second recess portion 10d for mounting a light-emitting element 3 in the first recess portion 10e is formed in the thickness direction of the ceramic substrate 10. Wiring patterns 11a for supplying the light-emitting element 3 with electric power is formed in the first recess portion 10e. On the ceramic substrate 10, situated at a location opposite to the outgoing aperture across the mounting location of the light-emitting element 3 in the second recess portion 10d, a metallized layer 12 having a light reflecting property is formed, in such a way to be electrically insulated from the wiring patterns 11. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting device package for a light source driven by a large current, such as a backlight light source for a light emitting diode (LCD) or an illumination light source, and a light emitting device using the same.

  As shown in FIGS. 33 and 34, a conventional surface-mount light-emitting device has a light-emitting element 3 such as an LED mounted on an insulating substrate 1 made of glass fiber-added epoxy resin or the like on which an electrical wiring pattern is formed. After the Au wire 4 is applied, the light-emitting element 3 and the Au wire 4 are sealed with a transparent resin 5 by transfer molding or the like. The insulating substrate 1 used here is in a flat plate state.

  Alternatively, as shown in FIGS. 35 and 36, another conventional surface-mount light-emitting device includes light-emitting elements 3, 8, and 9 mounted on a resin substrate 7 in which a lead frame 6 is insert-molded. After the wire 4 is applied, the cup portion is sealed with an epoxy resin or the like. In some cases, the lead frame 6 is not used, and the surface of the resin substrate 7 is electrically wired.

FIG. 37 and FIG. 38 show the respective cross-sectional views and the optical paths for light emission. In the structure shown in FIG. 33, a reflective case with a center at the center is mounted on the insulating substrate 1, a light emitting element is mounted therein, and resin sealing is performed. As a result, a structure similar to that shown in FIG. ing.
Japanese Utility Model Publication No. 5-8959 (Publication date: February 5, 1993) JP 2002-8959 A (publication date: August 30, 2002) Japanese Utility Model Publication No. 4-105562 (publication date: September 10, 1992) JP 6-77540 A (publication date: March 18, 1994) JP 2002-314149 A (publication date: October 25, 2002)

  However, conventionally, the light-emitting element 3 such as an LED emits light when an electric current flows, and the luminous intensity increases by increasing the amount of the current, but the amount of heat generation increases accordingly and stress is applied to the light-emitting element 3. As a result, the luminous intensity does not increase as expected, or the reliability is adversely affected.

  Therefore, in order to dissipate heat, the heat dissipating device is attached to the wiring board on which the light emitting device is mounted. In FIG. As with the insulating substrate 1 made of resin having poor properties, the wiring substrate 32 having poor thermal conductivity enters, and the heat dissipation effect is significantly reduced. The same applies to FIG. In addition, as the light emitting device is reduced in size, the thickness of the portion covering the light emitting element is reduced, and depending on the material, light may be transmitted. Has occurred.

  In order to solve the above-described problems, the light emitting device package of the present invention forms a ceramic substrate having electrical insulation and good thermal conductivity, and forms a light emission port on the surface of the ceramic substrate. A first recess formed in the thickness direction of the ceramic substrate; a second recess further formed in the thickness direction of the ceramic substrate for mounting a light emitting element in the first recess; and the light emission A position opposite to the emission port across the wiring pattern formed in at least one of the first recess and the second recess and the light emitting element mounting position in the second recess for supplying power to the element And a metallized layer having light reflectivity, which is electrically insulated from the wiring pattern.

  According to the above configuration, since the first concave portion and the second concave portion are provided, each installation of the light emitting element, the wiring pattern, and the connection thereof can be performed in the first concave portion and the second concave portion, and can be reduced in size. The above connection can be ensured. Moreover, since the metallized layer is made of metal, it has better thermal conductivity than the ceramic substrate.

  In the above configuration, a metallized layer made of a silver plating layer or the like is provided on the opposite side of the emission port across the mounting position of the light emitting element in the ceramic substrate having electrical insulation and good thermal conductivity. Therefore, the heat generated when the light emitting element emits light can be efficiently radiated to the outside through the metallized layer and the ceramic substrate, and the light emitting operation of the light emitting element can be stabilized.

  In addition, in the above configuration, a metallized layer having light reflectivity is provided at a position opposite to the emission port across the mounting position of the light emitting device, so that light from the light emitting element is in a direction opposite to the emission port. Even if it becomes stray light, since the stray light can be reflected in the direction of the emission port by the metallization layer and can be emitted from the emission port, the utilization efficiency of light from the light emitting element can be improved.

  The light emitting device package may further include an insulating layer stacked under the wiring pattern, and the metallized layer may be formed to extend to a position facing the wiring pattern with the insulating layer interposed therebetween. Good.

  According to the above configuration, by providing the metallized layer so as to extend to a position facing the wiring pattern with the insulating layer interposed therebetween, it is possible to increase the reflection efficiency of the stray light and further improve the light utilization efficiency.

  In the light emitting device package, the metallized layer is preferably exposed in the second recess. According to the said structure, since the metallization layer was exposed in the 2nd recessed part, a light emitting element and a metallization layer can be brought close and heat dissipation and light reflectivity can be improved.

  In the light emitting device package, the ceramic substrate preferably includes aluminum nitride. According to the said structure, the package for light-emitting devices can be manufactured more reliably and easily by including the aluminum nitride excellent in heat conductivity and excellent in moldability.

  In the light emitting device package, the metallized layer may also serve as a part of a wiring pattern. According to the above configuration, by electrically connecting the metallized layer to the light emitting element as a part of the wiring pattern, the light emitting element and the metallized layer can be brought closer to each other, further improving heat dissipation and light reflectivity. it can.

  In the said package for light-emitting devices, you may have the printing reflection part which reflects light in parts other than the metallization layer and wiring pattern in a 1st recessed part and a 2nd recessed part further.

  According to the above configuration, the provision of the print reflecting portion makes it possible to increase the reflection efficiency of the stray light and further improve the light use efficiency.

  The light emitting device package may further include a resin dam portion formed along the opening end of the second recess.

  According to the above configuration, by forming the resin dam portion along the opening end portion of the second recess, a white resin, for example, is provided between the opening end portion of the second recess and the opening end portion of the first recess. A resin film having light reflectivity can be formed, the reflection efficiency of the stray light can be increased, and the light use efficiency can be further improved.

  In the above package for a light emitting device, the third recess formed so that a chip component such as a capacitor for stabilizing the operation of the light emitting element can be mounted on the ceramic substrate on the surface opposite to the surface of the opening of the first recess. You may have.

  According to the above configuration, since the third recess is provided, the entire outer shape can be maintained and the size can be increased even when a chip component such as a capacitor for stabilizing the operation of the light emitting element is mounted on the third recess. Can be avoided.

  In order to solve the above problems, a light emitting device of the present invention is mounted in the second recess of the light emitting device package described above, and each electrode is formed on a surface other than the mounting use surface. It has a wire that electrically connects the element, the wiring pattern and each electrode of the light emitting element, and a transparent resin portion with light transmissivity that seals the light emitting element and the wire. Yes.

  According to the above configuration, by using any of the light emitting device packages described above, the heat generated when the light emitting element emits light can be efficiently radiated to the outside through the metallized layer and the ceramic substrate, and the light emitting device can emit light. The light emitting operation of the element can be stabilized.

  In addition, in the above configuration, a light-reflecting metallization layer is provided at a position opposite to the emission port across the mounting position of the light-emitting element, so that light from the light-emitting element is incident on the interface of the transparent resin portion. Even if the stray light is in the direction opposite to the exit port, the stray light can be reflected by the metallization layer in the exit port direction and emitted from the exit port, so that the light use efficiency from the light emitting element can be improved.

  In the light-emitting device, the light-emitting element is mounted in the second recess of the light-emitting device package that also serves as the metallization layer as a part of the wiring pattern, and each electrode is formed on the mounting use surface and the other surface. A conductive adhesive portion for connecting the electrode on the mounting use surface and the metallized layer and fixing the light emitting element on the metallized layer, and an electrode on the surface other than the mounting use surface of the wiring pattern and the light emitting element. An electrically connecting wire, a resin portion having light reflectivity formed on the inner surface of the first recess, between the resin dam portion and the inner wall surface of the first recess, a light emitting element, and a wire And a transparent resin portion having light transmissivity.

  In the light-emitting device, the light-emitting element mounted in the second recess of the light-emitting device package having the resin dam portion, each electrode formed on a surface other than the mounting use surface, and the wiring pattern and each electrode of the light-emitting element A light-reflective resin portion formed on the inner surface of the first recess between the resin dam portion and the inner wall surface of the first recess, and a light emitting element And a transparent resin portion having light transmissivity for sealing the wire and the wire.

  In the light emitting device, the light emitting device is mounted in the second concave portion of the light emitting device package having the third concave portion, the two electrodes are formed on the surface other than the mounting use surface, the wiring pattern, and the light emitting device. A wire electrically connecting each electrode, a transparent resin portion having light transmissivity for sealing the light emitting element and the wire, and a chip component mounted in the third recess; Also good.

  As described above, the light emitting device package of the present invention has a first recess in the ceramic substrate having electrical insulation and good thermal conductivity, a second recess in the first recess, and the second recess. The light emitting device has a metallized layer that is formed on the ceramic substrate at a position opposite to the emission port across the mounting position of the light emitting element in the recess, and has light reflectivity.

  Therefore, in the above configuration, since the metallized layer having good thermal conductivity is provided at a position opposite to the emission port across the mounting position of the light emitting element, heat generated during light emission of the light emitting element is Heat can be efficiently radiated to the outside through the ceramic substrate, and the light emitting operation of the light emitting element can be stabilized.

  In addition, in the above configuration, by providing the metallized layer having light reflectivity, even if light from a light emitting element becomes stray light in a direction opposite to the exit port, the stray light is emitted by the metallized layer. Since the light can be reflected in the direction of the mouth and can be emitted from the emission port, the light use efficiency from the light emitting element can be improved.

  Each embodiment of the present invention will be described with reference to FIGS. 1 to 32 as follows.

(First embodiment)
As shown in FIGS. 1 and 2, the light emitting device according to the present invention includes a plurality of, for example, three light emitting elements 3, 8, 9 in the ceramic substrate type light emitting device package according to the present invention. is doing. Examples of the light emitting elements 3, 8, and 9 include LEDs and semiconductor lasers formed in a substantially rectangular parallelepiped shape.

  The light emitting device package includes a ceramic substrate 10 having electrical insulation and good thermal conductivity and a thickness direction of the ceramic substrate 10 so that a light exit is formed on the surface of the ceramic substrate 10. A first recess 10e formed by drilling, and formed by drilling in the thickness direction of the ceramic substrate 10 for mounting the light emitting elements 3, 8, 9 in the first recess 10e. In order to supply electric power to each of the light emitting elements 3, 8, 9, the wiring pattern 11 a formed in the first recess 10 e is provided.

  Then, the light emitting device package is formed on the ceramic substrate 10 at a position opposite to the emission port across the mounting position of the light emitting elements 3, 8, 9 in the second recess 10 d, and the wiring pattern It has a metallized layer 12 having light reflectivity, which is electrically insulated from 11a. The emission port is an opening end of the first recess 10e formed on the surface of the ceramic substrate 10.

Such a light emitting device package will be further described below along the manufacturing process. The ceramic substrate 10 is formed on a substantially rectangular plate and, as shown in FIGS. 3 and 4, includes, for example, three layers of ceramic substrates 10a, 10b, and 10c that are densely stacked in the thickness direction. ing. For example, silicon carbide (SiC), alumina (Al ₂ O ₃ ), aluminum nitride, which is an electrical insulator and has good thermal conductivity, is used for each of the ceramic substrates 10a, 10b, and 10c. (AlN) is used, and more preferably AlN is used because of its excellent moldability.

Electrically, an insulator means a material having a resistance value (RT) of 10 ¹⁰ (Ω · cm) or more, more preferably 10 ¹² (Ω · cm) or more. Good thermal conductivity means that the thermal conductivity (RT) is 18 (W / m · k) or more, more effective is 60 (W / m · k) or more, and the best is 140 (W / m · k). k) More than that.

  Each of the ceramic substrates 10a, 10b, and 10c is obtained by filling a ceramic material powder into a predetermined mold, molding by hot press molding, and sintering. Similar materials and processing methods are used for other ceramic substrates described below. In the above description, the ceramic substrate 10 has a multilayer structure, but an integral structure is also possible.

  In the ceramic substrate 10b, an inner diameter (a width along the surface direction of the ceramic substrate 10) from the side of the ceramic substrate 10c adjacent to the first through hole penetrating in the thickness direction to the ceramic substrate 10a side at the center thereof. Are formed in a tapered shape, and the above-described second recess 10d is formed with the inner wall surface of the first through hole and one surface of the ceramic substrate 10a as the bottom surface. The shape of the inner surface of the second recess 10d is preferably a truncated cone shape (conical cone shape, cup-shaped structure) that easily reflects light in the direction of the opening from the viewpoint of ease of manufacture and light reflectivity described later.

  Further, in the ceramic substrate 10c, a second through-hole penetrating in the thickness direction is formed at a central portion of the ceramic substrate 10c in a tapered shape that gradually spreads along the thickness direction of the ceramic substrate 10c from the adjacent ceramic substrate 10b side. The first recess 10e described above is formed, with the inner wall surface of the second through hole and one surface of the ceramic substrate 10b as the bottom surface. Therefore, the second recess 10d is further formed on the inner bottom surface of the first recess 10e.

  The first concave portion 10e and the second concave portion 10d are preferably formed so that their symmetrical axes (along the thickness direction of the ceramic substrates 10b and 10c) are coaxial. Further, the inner shape of the first recess 10e is preferably a truncated pyramid shape because it is easy to arrange each wiring pattern 11a described later and facilitate wiring.

  In addition, wiring patterns 11a for supplying power to the light emitting elements 3, 8, and 9 are formed on the periphery of the ceramic substrate 10b on the side adjacent to the ceramic substrate 10c. Each of the wiring patterns 11a is formed so as to extend from the peripheral end of the ceramic substrate 10b to a position exposed on the bottom surface of the first recess 10e. However, each of the wiring patterns 11a is up to a position that does not reach the opening of the second recess 10d (that is, the position immediately before it extends).

  Further, terminal patterns for electrical connection with the outside are provided on the uppermost surface (light irradiation port surface side) of the ceramic substrate 10c, the subsequent peripheral end surface of the ceramic substrate 10c, and the subsequent peripheral end surface of the ceramic substrate 10b. 11b is formed so as to be electrically connected to the corresponding wiring pattern 11a.

  Thereby, electric power can be supplied to each of the light emitting elements 3, 8, and 9 through the terminal patterns 11 b and the wiring patterns 11 a. Further, since the uppermost surface of the ceramic substrate 10c of each terminal pattern 11b can be electrically connected to the outside, even when the heat radiating device is mounted on the ceramic substrate 10a side which is the back side of the irradiation port, the heat dissipation It is not necessary to provide a conventional wiring substrate shown in FIGS. 39 and 40 between the device and the ceramic substrate 10a, and the heat dissipation efficiency of the heat dissipation device can be improved.

  And in the said package for light-emitting devices, thermal conductivity is better than each ceramic board | substrate 10a, 10b, 10c on the mounting position of each light emitting element 3,8,9 at least one part on the 2nd recessed part 10d. A (large) metallized (metal) layer 12 is formed. The metallized layer 12 is not particularly limited as long as it has excellent light reflectivity and good thermal conductivity, and examples thereof include those formed by silver (Ag) plating.

  The metallized layer 12 preferably has a light reflectivity that reflects 50% or more of incident light, more preferably 70% or more. In each embodiment, the metallized layer 12 is formed over the entire surface of the second recess 10d as much as possible. It is desirable that

  Further, the metallized layer 12 is formed in a hem shape, a flange shape, or a radial shape that extends outward on the inner surface of the first recess 10e as long as the metallization layer 12 can maintain electrical insulation by being separated from each wiring pattern 11a. May be. The other metallized layers described below are the same as those of the metallized layer 12 unless otherwise specified.

  In the light emitting device of the present invention using such a package for a light emitting device, as shown in FIGS. 5 and 6, each light emitting element 3, 8, 9 is heated on the metallized layer 12 on the second recess 10 d. It is fixed and mounted with a conductive adhesive (not shown) having good conductivity and electrical conductivity.

  At this time, each of the light emitting elements 3, 8, and 9 has a light irradiation direction from the ceramic substrate 10a to the ceramic substrate 10b and a direction along the thickness direction thereof, that is, an opening direction of the second recess 10d. Thus, the light emitting device package of the present invention is mounted so as to be in the direction of the light irradiation port.

  In addition, in the present embodiment, each electrode for power supply in each light emitting element 3, 8, 9 is a surface other than the surface fixed (mounted) to the metallized layer 12 of each light emitting element 3, 8, 9; More desirably, the light emitting elements 3, 8, and 9 are formed on the same light emitting surface, which is a surface on which light is irradiated.

  In the light emitting device, the electrodes of the light emitting elements 8 and 9 and the corresponding wiring patterns 11a are connected by gold (Au) wires 4, respectively. Instead of the Au wire 4, a wire of silver, copper, aluminum, or an alloy of these and gold can also be used.

  Therefore, the mounting surface of each light emitting element 8, 9 is formed on a different surface from the formation surface of each wiring pattern 11 a, that is, on the inner bottom surface of the second recess 10 d which is a surface below the formation surface of each wiring pattern 11 a. Will be.

  Further, the second recess 10d and the first recess 10e are filled with a transparent resin portion 14 made of, for example, an acrylic resin having excellent light transmittance so as to be flush with the surface of the ceramic substrate 10c.

  In the above light emitting device, each of the ceramic substrates 10a, 10b, and 10c, particularly the ceramic substrates 10a and 10b, and the metallized layer 12 having good thermal conductivity are provided, so that the light emitting elements 3, 8, and 9 emit light. Even if heat is generated, the generated heat can be quickly taken out to the outside through the metallized layer 12 having good thermal conductivity and the ceramic substrates 10a and 10b. , 9 can suppress the instability of the operation caused by the temperature rise.

  In addition, since the metallized layer 12 has light reflectivity, the ceramic substrates 10a and 10b are thinly formed to exhibit light transmissivity, and light emitted from the light emitting elements 3, 8, and 9 is transparent resin portions. 14 is reflected by the metallized layer 12 as stray light toward the ceramic substrates 10a and 10b as a result of reflection on the surface of the light 14, and can be reflected in the irradiation direction of the light from the light emitting elements 3, 8, and 9. Use efficiency can be improved.

(Second embodiment)
However, even in the case of the first embodiment, as shown in FIG. 5, the light 13 emitted from each light-emitting element 3, 8, 9 seals each light-emitting element 3, 8, 9 and the Au wire 4. The light reflected from the surface of the transparent resin portion 14 may return to the light emitting elements 3, 8, 9, and may escape as stray light in directions other than the light emitting front surface.

  As a means for further preventing the stray light, in the second embodiment of the present invention, in addition to the metallized layer 12, as shown in FIG. 7 and FIG. A metallized layer 15 having light reflectivity and heat conductivity is provided so as to extend further integrally to the wiring layers 11a and the positions facing the wiring patterns 11a in the thickness direction.

  The metallized layer 15 may be formed so as to reach and be exposed to the peripheral end of the ceramic substrate 10b other than the peripheral end of the ceramic substrate 10b from which the respective wiring patterns 11a are exposed. It may be formed to extend to the inner wall surface of the ceramic substrate 10c other than the inner wall surface of the ceramic substrate 10c having a contact point with each wiring pattern 11a that can maintain electrical insulation with the wiring pattern 11a.

  In order to provide such a metallized layer 15 while maintaining electrical insulation between each wiring pattern 11a, a ceramic substrate 10f is provided as an insulating layer between the metallized layer 15 and each wiring pattern 11a. .

  In the first and second embodiments, each terminal pattern 11b is formed from the ceramic substrate 10c to the end surface of the ceramic substrate 10b. However, as shown in FIGS. 9 and 10, each terminal pattern 11b is replaced with each terminal pattern 11b. Each terminal pattern 16 may be formed so as to extend from each end face of each ceramic substrate 10f, 10b to the periphery of the ceramic substrate 10a, extending in the opposite direction to each terminal pattern 11b.

  In the second embodiment, as shown in FIGS. 11 and 12, the light 13 reflected from the surface of the transparent resin portion 14 for sealing and returned to the ceramic substrate 10a, 10b side again becomes the inside. The light is reflected by the metallized layer 15 that also functions as a reflective layer and emitted toward the front side, and the light utilization efficiency can be further improved.

  As a modified example of the second embodiment characterized in that the metallized layer extends to a position facing each wiring pattern 11a, as shown in FIGS. 13 and 14, each of the light emitting elements 3, 8, and 9 is provided. The case where the metallized layer 17 formed so that it may extend also between each ceramic substrate 10a, 10b which becomes the same surface as a mounting surface is provided as a light reflection layer and a heat conductive layer.

  In the above case, the light transmission distance in the ceramic substrate is longer than that in the structure of FIG. 9, and a certain amount of light attenuation can be considered. However, since it can be configured without increasing the number of layers of the ceramic substrate, it is advantageous in terms of material cost. It is.

(Third embodiment)
In the third embodiment of the light emitting device package according to the present invention, as shown in FIGS. 15 and 16, in addition to the first embodiment, the inner portion of the first recess 10e serving as the Au wire wiring surface On the wall surface, a reflection portion 18 that reflects light to a place other than the wiring pattern 11a is formed by printing.

  In the third embodiment, by providing the reflective portion 18 that reflects light at a place other than the wiring pattern 11a, light emission to the light emitting device other than the front side can be suppressed, and the light use efficiency can be improved. In addition to the first embodiment described above, the third embodiment may be combined with the second embodiment described above or each of the following embodiments in any way to improve the light use efficiency from the light emitting element. it can.

(Fourth embodiment)
In the fourth embodiment of the light emitting device package according to the present invention, as shown in FIGS. 17 and 18, in addition to the first embodiment, it is enclosed along the periphery of the opening of the second recess 10d. As described above, the dam portion 19 is formed on the first recess 10e serving as the Au wire wiring surface so as to protrude along the thickness direction of the ceramic substrate 10b by printing. The dam part 19 is provided as a dam-shaped restraining part so that it does not flow and spread to inconvenient places when resin is applied to a flat part, and can exhibit the same effect as a silicon dam. is there.

  In the light-emitting device using the light-emitting device package of the fourth embodiment, as shown in FIGS. 19 and 20, each light-emitting element 3, 8, 9 is mounted, and each light-emitting element 3, 8 is formed by Au wire 4. , 9 and each wiring pattern 11a are connected, and then, for example, a white resin 20 for light reflection is applied to a portion outside the region where each light-emitting element 3, 8, 9 is located with the dam portion 19 as a boundary. Mold.

  In this case, it is preferable that the white resin 20 is formed on the wiring pattern 11a surface and the side surface. And the mounting part of each light emitting element 3,8,9 which is a part other than is sealed with the transparent resin part 14. FIG.

  As a result, in the fourth embodiment, the light-reflecting white resin 20 can be stably and accurately formed by the dam portion 19, and light emission to the side other than the front side of the light emitting device package can be suppressed to use light. Efficiency can be improved. The fourth embodiment of the present invention may be combined with the first to third embodiments of the present invention and each of the following embodiments in the same manner, and similarly, the utilization efficiency of light from the light emitting element can be improved.

(Fifth embodiment)
Next, a light emitting device package having an additional function will be described as a fifth embodiment of the present invention. Some light-emitting elements do not have high electrostatic withstand voltage. When the light-emitting elements are used, as shown in FIG. For example, the light emitting elements 3 and 9 may be added in parallel. A light-emitting device using such a package for a light-emitting device is shown in FIGS.

  In the light emitting device package, the ceramic substrate is opposite to the surface on which the capacitor 22 is mounted, as shown in FIGS. 25 and 26, based on the second embodiment shown in FIG. It is set on the ceramic substrate 10a side which becomes the surface. In the fifth embodiment, members having the same functions as those in the first to fourth embodiments are assigned the same member numbers and are not described here.

  That is, first, a ceramic substrate 10g, which is an electrical insulator, is laminated between the ceramic substrate 10a and the ceramic substrate 10b so as to be thinner than the ceramic substrate 10a and the ceramic substrate 10b. In addition, a number of third through holes corresponding to the number of capacitive elements 22 to be added are formed in the ceramic substrate 10a from the surface of the ceramic substrate 10a in the thickness direction. Therefore, in the light emitting device package, the third recess 21 is formed as a region on which the capacitive element 22 is mounted by the third through hole and the ceramic substrate 10g.

  Furthermore, each wiring pattern 11c for electrical connection with the capacitive element 22 is formed between the ceramic substrate 10g and the ceramic substrate 10a. Each wiring pattern 11c is connected to each terminal pattern 11b corresponding to the light emitting elements 3 and 9 connected in parallel to the capacitive element 22.

  In the light emitting device using such a package for the light emitting device, as shown in FIGS. 22 to 24, the capacitive element 22 is electrically connected to each wiring pattern 11c in the third recess 21 using the conductive adhesive 24. It is fixed while connected to.

  Thus, since the light emitting device incorporates each wiring pattern 11c and the capacitive element 22 is mounted in the third recess 21, the capacitive element 22 can be mounted without substantially increasing the external dimensions of the light emitting device. The operation of the light emitting element can be stabilized.

  Of course, as long as even the area of the third recess 21 can be secured, there is no problem in forming the third recess 21 on the same surface as the light emitting surface and mounting the capacitive element 22 in the third recess 21. In the case of the fifth embodiment, the content is such that two capacitive elements 22 are mounted, but the case of one or three can naturally be realized by the same method.

(Sixth embodiment)
Moreover, in each embodiment mentioned above, each light emitting element 3, 8, and 9 was electrically connected using each two Au wires 4, and each two electrodes were formed in the same surface, respectively. Although it was described on the premise, naturally, even when a light-emitting element that is electrically connected by one Au wire having electrodes formed on the opposite side is used, the same light emission as the invention described in each of the above embodiments The device can be realized.

  An example of such a light emitting device will be described below as a sixth embodiment of the present invention. As shown in FIG. 27, the light emitting device package of the light emitting device is a case where the mounting surface of each light emitting element 23 and the wiring pattern 11g for connecting the Au wire 4 are on the same surface.

  In this case, a light reflecting metallized layer 26 is formed below the surface on which the light emitting element 23 is mounted via a ceramic substrate 10h which is an insulating layer. In the case of the light emitting element 23 that is electrically connected using one Au wire 4, the mounting surface needs to be electrically separated from the other light emitting elements 23. A metallized layer 26 as a light reflecting layer is provided below.

  The ceramic substrate 10h is preferably thin as long as electrical insulation can be ensured. As a result, the metallized layer 26 is disposed in close proximity to the light emitting element 23. Due to the good thermal conductivity of the ceramic substrate 10h, As in the above-described embodiments, excellent heat dissipation can be exhibited.

  Further, on the ceramic substrate 10h, each wiring pattern 11d for fixing each light emitting element 23 while being electrically connected to an electrode formed on a contact surface with the mounting surface of each light emitting element 23 by a conductive adhesive. Each wiring pattern 11e connected to the Au wire 4 from each light emitting element 23 is formed. Each wiring pattern 11d, 11e is electrically connected to each corresponding terminal pattern 11b.

  In order to increase the light utilization efficiency, a metallized layer 25 having light reflectivity similar to that of the metallized layer 12 is provided on the inner wall surface of the second recess 10d and the inner wall surface and inner bottom surface of the first recess 10e. It is preferable to provide it.

  When the metallized layer 25 is provided, in order to ensure electrical insulation between the metallized layer 25 and the wiring patterns 11d and 11e, the ceramic substrate 10b, the ceramic substrate 10h, and the wiring patterns 11d and 11e It is desirable to provide a laminated ceramic substrate 10i therebetween.

  The ceramic substrate 10i is formed so as to protrude inward from the inner wall surface of the second recess 10d on the inner bottom surface of the second recess 10d in order to ensure the electrical insulation more reliably. It is preferable.

  As a modification of the sixth embodiment of the present embodiment, as shown in FIG. 28, the connection wiring pattern 11 f of the Au wire 4 is connected to a surface that is not the same surface as the mounting surface of the light emitting element 23. Similarly, the metallized layer 27 as the light reflecting layer is provided under the mounting surface of the light emitting element 23. However, since the Au wire 4 is connected to a different surface from the light emitting element 23, the cup structure of the second recess 10d is reduced. It is possible to improve the luminous efficiency.

  As for the internal connection of the light emitting elements, each of the above embodiments is of an internal connection that does not have independent commons even when there are a plurality of light emitting elements. As shown, some light-emitting devices have a plurality of light-emitting elements 45 and connect either the anode side or the cathode side as a common.

  FIGS. 30 and 31 show such light emitting elements 45 applied to the present invention. Although the anode side is common in the figure, the cathode side may be common. In this case, the metallization layer 30 for reflecting light in a cup shape can be realized by being connected to the terminal pattern 11b via the wiring pattern 11e.

  An example of an electronic device in which the light emitting element of each embodiment is mounted will be described below using the second embodiment. In the electronic device, as shown in FIG. 32, the light emitting devices 8 and 9 are mounted on the light emitting device package described in the second embodiment, connected by the Au wires 4, and the transparent resin portion 14. The light emitting device encapsulated in (1) is attached while the light irradiation port is aligned with the light emitting window of the wiring substrate with the light emitting window 34 and electrically connected by the conductive adhesive 31, and the back side of the light emitting device (the above irradiation) A heat radiating device 33 is attached from the opposite side of the mouth.

  In the above electronic device, in order to prevent an electrical short circuit with the heat radiating device 33 made of aluminum or the like, an electrical pattern is not formed on the surface in contact with the heat radiating device 33, and electrical connection is performed on the light emitting surface side. Yes. The wiring board 34 on which the light emitting device is mounted can be dealt with by providing a light emitting window for preventing light emission.

  According to the present invention, heat generated from the light emitting elements 8 and 9 is directly transmitted to the heat radiating device 33 through the metallized layer 12 and the ceramic substrates 10a and 10b having high thermal conductivity without passing through a conventional resin substrate or the like. Therefore, heat dissipation can be improved. As a result, the electronic device can be driven with a large current to increase the luminous intensity, and the reliability can be improved by reducing thermal stress on the light emitting elements 8 and 9 such as LED chips. It became possible.

  In each of the above embodiments, the light emitting element 3 used has its light emitting direction set along the thickness direction of the ceramic substrate, that is, perpendicular to the surface direction of the ceramic substrate 10. The light emitting direction can be parallel to the surface direction of the ceramic substrate 10.

  In this case, as shown in FIG. 3, the metallized layer is also formed as a light reflecting layer on the inner wall surface inclined with respect to the surface direction of the second recess 10d, or separately irradiated with light. It suffices if a reflective protrusion that reflects in the mouth direction is provided.

  Further, when a metallized layer is used as the light reflecting layer, the inner wall surface of the second recess 10d may be formed into a concave mirror shape corresponding to the emission angle of light emitted from the light emitting element 3 or the like. Thereby, the angle of the light which goes to an irradiation port is controlled, reflection of the light in interfaces, such as the transparent resin part 14, can be suppressed, and the utilization efficiency of light can be improved further.

  The light emitting device according to the present invention can be suitably used as a light source such as a backlight light source for an LED (LCD) or an illumination light source.

1 is a perspective view of a first embodiment according to a light emitting device of the present invention. It is a circuit diagram of each light emitting element of the light emitting device. It is sectional drawing of the package for light-emitting devices used for the said light-emitting device. It is another cross-sectional view of the light emitting device package used in the light emitting device. It is sectional drawing which shows each optical path from each light emitting element of the said light-emitting device. It is another sectional view showing each optical path from each light emitting element of the light emitting device. It is sectional drawing which shows 2nd Embodiment which concerns on the package for light-emitting devices of this invention. It is another sectional view showing the second embodiment. It is sectional drawing which shows one modification of the said 2nd Embodiment. It is another sectional view showing a modification of the second embodiment. It is sectional drawing which shows each optical path from each light emitting element of the light-emitting device using the said 2nd Embodiment. It is another sectional view showing each optical path from each light emitting element of the light emitting device using the second embodiment. It is sectional drawing which shows the other modification in the said 2nd Embodiment. It is other sectional drawing which shows the other modification in the said 2nd Embodiment. It is sectional drawing which shows 3rd Embodiment which concerns on the package for light-emitting devices of this invention. It is another sectional view of the third embodiment. It is sectional drawing which shows 4th Embodiment which concerns on the package for light-emitting devices of this invention. It is another sectional view in the fourth embodiment. It is sectional drawing which shows the optical path from each light emitting element of the light-emitting device using the said 4th Embodiment. It is other sectional drawing which shows the optical path from each light emitting element of the light-emitting device using the said 4th embodiment. It is a circuit diagram of each light emitting element and each capacitive element used in the fifth embodiment of the light emitting device according to the present invention. It is sectional drawing of the light-emitting device in the said 5th Embodiment. It is a top view of the said light-emitting device. It is a rear view of the said light-emitting device. It is sectional drawing of the package for light-emitting devices used for the said light-emitting device. It is another cross-sectional view of the light emitting device package used in the light emitting device. It is sectional drawing which shows 6th Embodiment based on the light-emitting device of this invention. It is sectional drawing which shows one modification of the said 6th Embodiment. It is a circuit diagram of each light emitting element used for the sixth embodiment. It is sectional drawing which shows the other modification in the said 6th Embodiment. It is a top view which shows the other modification in the said 6th Embodiment. It is principal part sectional drawing of the electronic apparatus provided with the light-emitting device of this invention. It is a perspective view of the conventional light-emitting device. It is sectional drawing of the said conventional light-emitting device. It is a perspective view of the other conventional light-emitting device. It is sectional drawing of the said other conventional light-emitting device. It is sectional drawing which shows the optical path from the light emitting element of the said conventional light-emitting device. It is sectional drawing which shows the optical path from the light emitting element of the said other conventional light-emitting device. It is sectional drawing which shows mounting to the wiring board of the said conventional light-emitting device, and mounting | wearing of the heat radiating device. It is sectional drawing which shows mounting to the wiring board of the said other conventional light-emitting device, and mounting | wearing of the heat radiating device.

Explanation of symbols

3, 8, 9 Light-emitting element 4 Au wire 10 Ceramic substrate 10d Second recess 10e First recess 11a Wiring pattern 11b Terminal pattern 12 Metallized layer 14 Transparent resin portion

Claims (11)

A ceramic substrate having optical transparency;
A light emitting device mounted on the surface of the ceramic substrate;
A wiring pattern for supplying power to the light emitting element;
A metallized layer made of a metal having light reflectivity,
The light emitting device, wherein the metallized layer is formed inside the ceramic substrate so as to reflect light emitted from the light emitting element. A ceramic substrate having light transparency and having a recess formed thereon;
A light emitting element mounted in the recess of the ceramic substrate;
A pattern wiring functioning as an anode and a pattern wiring functioning as a cathode formed on the ceramic substrate surface;
A metallized layer made of a light-reflective metal, which is formed so as to cover the surface of the recess, and extends to the inside of the ceramic substrate.
The light emitting device, wherein the metallized layer also serves as a part of either a pattern wiring functioning as the anode or a pattern wiring functioning as the cathode.   3. The ceramic substrate has a plurality of the light emitting elements mounted thereon, and wiring patterns for supplying power to each of the light emitting elements are formed apart from each other. The light emitting device according to 1.   4. The light emitting device according to claim 1, wherein the metallized layer is made of a material that reflects 70% or more of incident light. 5.   The light emitting device according to claim 1, wherein the metallized layer is made of a silver plating layer.   6. The light emitting device according to claim 1, wherein the metallized layer has a heme shape, a flange shape, or a radial shape.   The light emitting device according to any one of claims 1 to 6, wherein the metallized layer is formed on the entire inside of the ceramic substrate. The wiring pattern extends to the side surface of the ceramic substrate,
3. The metallized layer is extended to a side surface portion of the ceramic substrate so as not to contact a wiring pattern that functions as a pole different from a wiring pattern that also serves as a part. Light-emitting device.   The light emitting device according to any one of claims 1 to 8, wherein the ceramic substrate is made of any one of silicon carbide, alumina, and aluminum nitride.   The light emitting device according to claim 1, wherein the ceramic substrate includes a single ceramic layer. The ceramic substrate is formed by laminating a plurality of ceramic layers,
The light emitting device according to any one of claims 1 to 9, wherein the metallized layer extends to an interface of the laminated ceramic layers.

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