JP2008244116A - Filter parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide filter parts with a lower ESL value. <P>SOLUTION: A notch 17a is formed at a second side surface which is a packaging side of a sword-guard portion 15, and a chip capacitor 50 is accommodated in the notch 17a. A portion of almost horseshoe-shaped character which is a part of the sword-guard portion 15 constituting the notch 17a forms an accommodation portion. With respect to the chip capacitor 50, near parts of a pair of sides constituting both ends of a lower surface 50B are supported by an element support 42B in the Y direction. When a common mode choke coil 1 is packaged on a circuit board, the element support 42B and the lower surface 50B of the chip capacitor 50 are separated from a front surface of the circuit board. An accommodation portion notch 15a is formed near a portion which is a part of the accommodation portion constituting the notch 17a and constitutes an aperture of the notch 17a at the second side surface. On account of this, the part of the accommodation portion constituting the aperture of the notch 17a is prevented from contacting with the chip capacitor 50. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a filter component, in particular, a conductive wire is wound around a core portion that couples a pair of flanges, and one end or the other end of the conductive wire is electrically connected to a terminal electrode provided on the flange, The present invention relates to a filter component having a capacitive element electrically connected to the terminal electrode.

2. Description of the Related Art Conventionally, a filter component that is configured by winding a conductive wire around a core portion that connects a pair of flange portions and has a capacitive element has been known. Japanese Patent Laid-Open No. 3-194908 (Patent Document 1) describes a coil filter component having this configuration. The filter component has a coil bobbin having a pair of flange portions and a core portion connecting the pair of flange portions, and a conductive wire is wound around the core portion. One end or the other end of the conducting wire is electrically connected to a terminal electrode provided on the collar portion. In addition, the flange portion has a mounting surface disposed opposite to the electrode pattern on the circuit board and an anti-mounting surface facing the mounting surface, and a chip capacitor as a capacitive element is disposed on the anti-mounting surface. It is electrically connected to the terminal electrode.
Japanese Patent Laid-Open No. 3-194908

  However, the conventional filter component described in the above publication requires a filter component having a high ESL (equivalent series inductance) value and a low ESL value. Therefore, an object of the present invention is to provide a filter component having a lower ESL value.

  In order to achieve the above object, the present invention provides a pair of collars, a core part that connects the pair of collars to each other, at least one conductor wound around the core part, and the pair A terminal electrode provided in a number corresponding to the number of each of the conductive wires, and one terminal end or the other end of the conductive wire fixed and electrically connected, and an element terminal electrode electrically connected to the terminal electrode are provided. A filter element comprising a capacitive element having a mounting surface disposed substantially opposite to the extending direction of the core portion and facing the electrode pattern on the circuit board; and on the mounting surface side There is provided a filter component having an accommodating portion for accommodating the capacitive element.

  Since the flange portion has a housing portion that houses the capacitive element on the mounting surface side, the vicinity of the portion that forms the user electrode that is a portion of the terminal electrode and is electrically connected to the electrode pattern on the circuit board The element terminal electrode of the capacitive element can be electrically connected to the portion. For this reason, the distance from the user electrode to the element terminal electrode of the capacitive element can be extremely shortened, the impedance component and the inductance component can be reduced, and the filter component having an extremely low ESL value that deteriorates the high frequency characteristics can do. As a result, it is possible to obtain a filter component having a high insertion loss even in a high frequency region due to low ESL.

  Here, the capacitive element and the portion of the terminal electrode to which the element terminal electrode of the capacitive element is electrically connected are arranged at a position retracted from the mounting surface to the side opposite to the mounting surface. It is preferable.

  Since the capacitive element and the portion of the terminal electrode to which the element terminal electrode of the capacitive element is electrically connected are disposed at a position retracted from the mounting surface to the side opposite to the mounting surface, the filter component is a circuit. When placed on the substrate, the capacitive element and the portion of the terminal electrode to which the element terminal electrode of the capacitive element is electrically connected can be separated from the surface of the circuit board facing the mounting surface. it can. For this reason, it is possible to prevent the capacitive element from being directly affected by the deflection of the circuit board, and even when the circuit board is bent, the capacitive element is prevented from cracking due to the stress caused by the deflection. be able to. Further, since the element terminal electrode of the capacitive element and the portion of the terminal electrode to which the element terminal electrode of the capacitive element is electrically connected do not contact the surface of the circuit board, it is not necessary to consider the flatness (coplanarity).

  In addition, a notch that opens in the mounting surface is formed in the accommodating portion, the capacitive element is accommodated in the notch, and the portion of the accommodating portion that defines the opening of the notch includes the It is preferable that an accommodation portion notch that forms a gap between the capacitive element and the accommodation portion is formed.

  The housing part has a notch that opens in the mounting surface, the capacitive element is housed in the notch, and the part of the housing part that defines the opening of the notch is between the capacitive element and the housing part. Since the housing portion notch that forms a gap is formed in the capacitor element, the capacitive element can be separated from the portion of the housing portion that defines the opening of the notch. In an environment where the capacitive element is placed on a circuit board and used, the capacitive element may be exposed to heat and repeatedly expand and contract. Even in such a case, the accommodating portion that defines the opening of the notch. Since this portion does not contact the capacitive element, it is possible to prevent the capacitive element from being cracked by the contact.

  Further, at the end portion of the flange portion in the extending direction of the winding core portion, the portion of the terminal electrode where the element terminal electrode of the capacitive element and the element terminal electrode of the capacitive element are electrically connected Is preferably exposed in a direction away from the core portion.

  The element terminal electrode of the capacitive element and the portion of the terminal electrode to which the element terminal electrode of the capacitive element is electrically connected are separated from the core part at the end of the flange part in the extending direction of the core part. Since it is exposed toward the direction, it can be visually confirmed whether the element terminal electrode of the capacitive element and a part of the terminal electrode are electrically connected.

  As described above, the present invention can provide a filter component having a lower ESL value.

  A filter component according to an embodiment of the present invention will be described with reference to FIGS. Specifically, the filter component is a common mode choke coil 1 that constitutes a π-type filter for reducing common mode noise and differential noise that are folded on a power source or the like in an electronic device or the like. As shown in FIG. 1, 1 includes a core 10, a winding 30, a terminal electrode 40, and a cover 60.

  The core 10 is made of a magnetic material (for example, ferrite). As shown in FIG. 2, the core 10 includes first and second core portions 11 and 12 and a pair of flange portions 15. Hereinafter, the axial direction of the first and second core parts 11 and 12 is orthogonal to the X-axis direction, and the arrangement direction of the first and second core parts 11 and 12 is orthogonal to the Y-axis direction, the X-axis direction, and the Y-axis direction. The direction is defined as the Z-axis direction.

  The first and second core parts 11 and 12 are arranged in parallel to each other and have a substantially columnar shape. The first and second core parts 11 and 12 have an upper surface 13 and a lower surface 14 (FIG. 4) that face each other in the Z-axis direction. The upper surface 13 has a substantially arc shape that is convex from the axis of the first and second core parts 11 and 12 toward the Z-axis upward direction. The lower surface 14 has a substantially arc shape that protrudes downward from the axis of the first and second core portions 11 and 12 in the Z-axis downward direction.

  As shown in FIG. 2, the pair of flange portions 15 are provided at both ends of the core portions 11 and 12 in the X-axis direction. The flange portion 15 is formed integrally with the first and second core portions 11 and 12. The collar portion 15 has a substantially rectangular parallelepiped shape and has first to sixth side surfaces 16 to 21. The first side surface 16 and the second side surface 17 (FIG. 4) face each other in the Z-axis direction. The third side surface 18 and the fourth side surface 19 of the flange portion 15 face each other in the Y-axis direction. Further, as shown in FIG. 2, the fifth side surface 20 and the sixth side surface 21 face each other in the X-axis direction.

  The first side surface 16 is a surface facing a cover 60 described later. The first side surface 16 is provided with two recesses (not shown). A recess (not shown) is formed at a position corresponding to the first and second core parts 11 and 12 in the Y-axis direction. The opening end of the recess (not shown) extends from the midway position in the X-axis direction of the first side surface 16 to the end of the fifth side surface 20 on the first side surface 16 side. The not-shown recess serves to guide a not-shown protrusion included in the first electrode portion 41 described later.

  When mounting the common mode choke coil 1 on a circuit board (not shown), the second side surface 17 is a mounting surface that faces the surface of the circuit board (not shown) having an electrode pattern formed on the surface. It is configured to be parallel to the surface of a circuit board (not shown). The first side surface 16 corresponds to the anti-mounting surface. The second side surface 17 is provided with two recesses (not shown). A recess (not shown) is formed at a position corresponding to the first and second core parts 11 and 12 in the Y-axis direction. The opening end of the recess (not shown) extends from the midway position in the X-axis direction of the second side surface 17 to the end of the fifth side surface 20 on the second side surface 17 side. The not-shown recess serves to guide a not-shown protrusion provided on the second electrode portion 42 described later.

  The sixth side surface 21 is a surface on which the first and second core portions 11 and 12 are provided. In the Z-axis direction, the upper surfaces 13 of the first and second core portions 11 and 12 are higher than the first side surface 16. In the Z-axis direction, the distance between the lower surface 14 of the first and second core parts 11 and 12 and the second side surface 17 is larger than the diameter of the winding 30 described later. Further, as shown in FIG. 2 and the like, a groove 24 is formed in the sixth side surface 21. The groove portion 24 is provided between the first core portion 11 and the second core portion 12 in the Y-axis direction, and the second side surface 17 from the end on the first side surface 16 side in the Z-axis direction. It is formed so as to cross over the side edge. As shown in FIG. 4 and the like, the groove 24 has a bottom surface 25. The bottom surface 25 faces the second side surface 80 of a partition portion 78 included in the cover 60 described later.

  As shown in FIG. 2, guide portions 26 are formed between the first side surface 16 and the third side surface 18, and between the first side surface 16 and the fourth side surface 19, respectively. . The guide portion 26 plays a role of guiding a locking claw 68 of the cover 60 to the second side surface 17 side of the flange portion 15 when a cover 60 described later is attached to the core 10. The guide part 26 has the 1st plane 26a and the inclined surface 26b. The first flat surface 26 a is located between the first side surface 16 and the third side surface 18 and between the first side surface 16 and the fourth side surface 19. The inclined surface 26b is located between the first side surface 16 and the first plane 26a, and a step is formed between the first side surface 16, the inclined surface 26b, and the first plane 26a.

  As shown in FIG. 4, locking receiving portions 27 are formed between the second side surface 17 and the third side surface 18 and between the second side surface 17 and the fourth side surface 19. ing. The latch receiving portion 27 has a second flat surface 27a and an inclined surface 27b. The second plane 27 a is located between the second side surface 17 and the third side surface 18 and between the second side surface 17 and the fourth side surface 19. The inclined surface 27b is located between the second side surface 17 and the second plane 27a, and a step is formed between the first side surface 16, the inclined surface 27b, and the second plane 27a.

  As shown in FIG. 2 and the like, windings 30 are wound around the first and second core parts 11 and 12, respectively. As the winding 30, for example, an insulating coated copper wire that is a conductive wire having an insulating coating around the periphery can be used. The windings 30 wound around the first and second core parts 11 and 12 are electrically insulated from each other and magnetically coupled to each other.

  Further, a notch 17a is formed in the flange portion 15. The notch 17 a is formed at the second side surface 17 (FIG. 4) at a substantially central position in the Y-axis direction of the flange portion 15, and is approximately from the second side surface 17 toward the first side surface 16. It is formed in a rectangular parallelepiped shape. Therefore, the notch 17a is opened at substantially the center of the second side surface 17, the fifth side surface 20, and the sixth side surface 21 as the mounting surface, and is a part of the flange portion 15 that defines the notch 17a. The substantially U-shaped portion forms an accommodating portion 15A (FIG. 4) for accommodating a chip capacitor 50 as a capacitive element described later on the mounting surface side of the flange portion 15.

  A chip capacitor 50 is accommodated in the notch 17a. The chip capacitor 50 has a substantially rectangular parallelepiped shape slightly smaller than the notch 17a having a substantially rectangular parallelepiped shape, and element terminal electrodes 51 are respectively provided on a pair of surfaces defining the substantially rectangular parallelepiped shape and in the vicinity thereof. . The element terminal electrode 51 is electrically connected to a connecting portion 42A (FIG. 3 etc.) of the terminal electrode 40 described later via a solder fillet (not shown). As a result, the chip capacitor 50 and the winding 30 constitute a π-type filter as shown in FIG.

  Since the flange portion 15 has a housing portion 15A for housing the chip capacitor 50 on the mounting surface side, the user is a part of the terminal electrode 40 and is electrically connected to an electrode pattern on a circuit board (not shown). The element terminal electrode 51 of the chip capacitor 50 can be electrically connected to a connecting portion 42A which is a portion in the vicinity of a second electrode portion 42 which will be described later. For this reason, a distance from a second electrode portion 42, which will be described later as a user electrode, to an element terminal electrode 51 of the chip capacitor 50 can be extremely shortened, impedance components and inductance components can be reduced, and high frequency characteristics are deteriorated. It is possible to obtain a filter component having an extremely low ESL value. As a result, it is possible to obtain a filter component having a high insertion loss even in a high frequency region due to low ESL.

  The pair of surfaces on which the element terminal electrodes 51 of the chip capacitor 50 are provided are respectively opposed to the side surfaces of the notches 17a, and the upper surface 50A of the chip capacitor 50 is the housing portion 15A that defines the upper surface of the notches 17a. The lower surface 50B faces the portion 15B via a predetermined gap, and the lower surface 50B is in the negative direction of the Z-axis direction below the common mode choke coil 1 shown in FIG. 1 (the direction opposite to the direction of the arrow indicating the Z-axis direction in the figure). ) Is partially exposed as shown in FIG. The lower surface 50B is supported in the vicinity of a pair of sides that define both ends of the lower surface 50B in the Y-axis direction by an element support portion 42B of the terminal electrode 40 described later. As shown in FIG. 3, an element support portion 42B, which will be described later, that supports the lower surface 50B of the chip capacitor 50 and a lower surface 50B of the chip capacitor 50 are respectively mounted from the second side surface 17 serving as the mounting surface to the flange portion 15. When the common mode choke coil 1 is mounted and mounted on a circuit board (not shown), the chip capacitor is disposed from the surface of the circuit board (not shown). The element support portion 42B that supports the lower surface 50B of the chip 50 and the lower surface 50B of the chip capacitor 50 are configured to be separated from each other.

  For this reason, it is possible to prevent the chip capacitor 50 from being directly affected by the deflection of the circuit board, and even when the circuit board (not shown) is bent, the chip capacitor 50 is not cracked by the stress due to the deflection. Can be. Further, since the element terminal electrode 51 of the chip capacitor 50 and the portion of the connecting portion 42A to which the element terminal electrode 51 of the chip capacitor 50 is electrically connected do not contact the surface of the circuit board (not shown), flatness (coplanarity) It is not necessary to consider.

  An accommodating portion notch 15a is formed in a portion of the accommodating portion 15A that defines the notch 17a and in the vicinity of a portion that defines the opening of the notched portion 17a on the second side surface 17. As shown in FIG. 3, the accommodating portion notch 15 a is formed in a portion of the accommodating portion 15 </ b> A that faces a substantially half portion near the lower surface 50 </ b> B of the pair of surfaces on which the element terminal electrodes 51 of the chip capacitor 50 are provided. Therefore, a gap is formed between a substantially half portion of the pair of surfaces near the lower surface 50B and the portion of the accommodating portion 15A.

  In an environment where the chip capacitor 50 is placed on a circuit board (not shown) and used, the chip capacitor 50 may be exposed to heat and repeatedly expand and contract. However, even in such a case, the opening of the notch 17a is defined. Since the portion of the accommodating portion 15A formed does not contact the chip capacitor 50, it is possible to prevent the chip capacitor 50 from being cracked by the contact.

  As shown in FIG. 2 and the like, two terminal electrodes 40 are provided on each flange portion 15 of the core 10. Each terminal electrode 40 includes a first electrode portion 41, a second electrode portion 42, and a conductor portion 43. As shown in FIG. 2 and the like, the first electrode portions 41 are respectively located on the first side surfaces 16 of the flange portions 15. On the lower surface in the Z-axis direction of the first electrode portion 41 (the surface facing the first side surface 16), a convex portion (not shown) is provided.

  As shown in FIG. 4, the second electrode portions 42 are respectively located on the second side surfaces 17 of the flange portions 15. A convex portion (not shown) is provided on the upper surface in the Z-axis direction of the second electrode portion 42 (the surface facing the second side surface 17). As shown in FIG. 2 and the like, the first electrode portion 41 and the second electrode portion 42 are connected via a conductor portion 43 provided along the fifth side surface 20. The first electrode portion 41, the second electrode portion 42, and the conductor portion 43 are formed by bending a metal plate.

  Moreover, as FIG. 2 etc. show, the 1st electrode part 41 is the connection part which makes the one end or the other end of the coil | winding 30 wound by the 1st, 2nd core parts 11 and 12. It is connected. A pair of unillustrated extending portions extending in the Z-axis direction and extending upward in FIG. 1 are provided on the pair of edge portions in the Y-axis direction of the first electrode portion 41, respectively. The extended portion and one end or the other end of the winding 30 are electrically connected and connected. Such connection (connection) between the first electrode portion 41 and the winding 30 is performed by soldering. The distance between the second side surface 17 of the flange portion 15 in the Z-axis direction and the uppermost portion of the connecting ball 30A generated by soldering, the second side surface 17 of the flange portion 15 in the Z-axis direction, and the first The distance between the uppermost part of the winding 30 wound around the second core parts 11 and 12 is substantially the same.

  A conductor portion notch 43a is formed in the lower portion of the conductor portion 43 shown in FIG. 3 in the Z-axis direction. As shown in FIG. 3, the conductor part notch 43a is formed in a shape and positional relationship that coincides with the accommodation part notch 15a in a front view, and the element support part 42B and the second electrode part 42 described later. 42A, the element terminal electrode 51 of the capacitor element, and the solder fillet are visible. In FIG. 3, the solder fillet is not shown for convenience of explanation.

  The second electrode portion 42 is provided with a connecting portion 42A that extends in a direction in which a pair of terminal electrodes 40 provided on each flange portion 15 are connected to each other, as shown in FIG. It is bent in the Z-axis direction and upward as shown in FIG. 3 in the direction connecting the opposing conductor portions 43. At the extending end of the connecting portion 42A, there is provided a substantially U-shaped element support portion 42B that opens in the Z-axis direction and upward as shown in FIG. That is, the lowermost portion shown in FIG. 3 in the Z-axis direction of the element support portion 42B is integrally connected to the connecting portion 42A. Therefore, the element support portion 42B is connected to the second electrode portion 42 by the connecting portion 42A. The chip capacitor 50 is supported by the element support part 42B so as to be inserted into the substantially U-shaped element support part 42B opening in the Z-axis direction and shown in FIG. .

  Further, since the notch 17a is opened not only on the second side surface but also on the fifth side surface 20 as described above, it is an end portion of the flange portions 15 and 15 in the extending direction of the core portions 11 and 12. In the fifth side surface 20, the element terminal electrode 51 of the chip capacitor 50 and the connecting portion 42 </ b> A that is a portion of the terminal electrode 40 to which the element terminal electrode 51 is electrically connected are in the X-axis direction and the core portion 11. , 12 are exposed in a direction away from the center. Further, the exposed portion is widened in combination with the formation of the accommodating portion notch 15a and the conductor portion notch 43a as described above. For this reason, it can be very easily visually confirmed whether or not the element terminal electrode 51 of the chip capacitor 50 and the connecting portion 42A are electrically connected.

  As shown in FIG. 1, a cover 60 is attached to the core 10. The cover 60 is made of a nonmagnetic material such as a liquid crystal polymer resin. As shown in FIG. 2 and the like, the cover 60 includes a lid portion 61, leg portions 66 and 67, and side wall portions 69 and 70. The cover part 61, the leg parts 66 and 67, and the side wall parts 69 and 70 are integrally formed.

  The lid portion 61 is provided so as to cover the upper surface of the core 10 across the first side surface 16 of the one flange portion 15 and the first side surface 16 of the other flange portion 15. The upper surface of the lid 61 has a flat plate shape. By flattening the upper surface of the lid 61 in this way, the common mode choke coil 1 can be sucked by a suction nozzle of an automatic mounting machine (not shown). Four recesses 65 are formed in the vicinity of each corner of the lid 61 as shown in FIG. These recesses 65 are provided to facilitate the removal of the cover 60 from the mold when the cover 60 is formed by molding, for example.

  As shown in FIG. 2 and the like, the leg portions 66 and 67 extend from the lid portion 61 along the Z-axis direction. The leg portion 66 is provided along the third side surface 18 of each flange portion 15 when the cover 60 is attached to the core 10. Further, the leg portion 67 is provided along the fourth side surface 19 of each flange portion 15 when the cover 60 is attached to the core 10. That is, each heel part 15 is sandwiched between the leg parts 66 and 67. The leg portion 66 has a width equivalent to that of the third side face 18, and the leg portion 67 has a width equivalent to that of the fourth side face 19.

  As shown in FIG. 4, locking claws 68 are integrally formed at the ends of the leg portions 66 and 67, respectively. Each locking claw 68 protrudes from the flange 15 side so as to be locked by the locking receiving portion 27 of the flange 15 when the cover 60 is attached to the core 10. Further, as shown in FIG. 3, the locking claw 68 is provided so as to be positioned above the second electrode portion 42 in the Z-axis direction when the cover 60 is attached to the core 10. By providing the locking claw 68 at such a position, it is possible to prevent the circuit board and the locking claw 68 from coming into contact when the common mode choke coil 1 is mounted on a circuit board (not shown).

  As shown in FIG. 1 and the like, the side wall 69 is provided so as to cross between the leg 66. Moreover, the side wall part 70 is provided so that it may cross between the leg part 67 and the leg part 67, as FIG. 4 shows. As shown in FIG. 1 and the like, when the cover 60 is attached to the core 10, the lower edge 71 of the side wall 69 is more than the outermost position of the winding 30 wound around the first core 11. Located on the lid 61 side in the Z-axis direction. Similarly, the lower edge 73 (FIG. 4) of the side wall portion 70 is located closer to the lid portion 61 in the Z-axis direction than the outermost position of the winding 30 wound around the second core portion 12. By setting the lower edges 71 and 73 of the side wall portions 69 and 70 in such positions, the side wall portions 69 and 70 and the winding 30 can be brought into non-contact. Further, in the Y-axis direction, the side walls 69 and 70 can be provided on the inner side of the outermost position of the winding 30.

  As shown in FIG. 4 and the like, a pair of convex portions 76 are formed on the back surface of the lid portion 61. As shown in FIG. 1, when the cover 60 is attached to the core 10, the convex portion 76 is provided so that the bottom surface 77 of the convex portion 76 contacts the first side surface 16 of each flange 15. . The contact position is between the two first electrode portions 41 in the Y-axis direction. That is, the length of the convex portion 76 is shorter than the length of each flange 15 in the X-axis direction, and the length of the convex portion 76 is longer than the length between the first electrode portions 41 in the Y-axis direction. Is also shorter. Further, the length of the convex portion 76 in the Z-axis direction is such that when the cover 60 is attached to the core 10, the back surface of the lid portion 61 and the upper surface of the winding 30 wound around the core 10 are not in contact with each other. Length. By providing such a convex portion 76, a connecting ball 30A composed of one end or the other end of the winding 30 wound around the core 10 and the first electrode portion 41 soldered, and a lid portion Contact with 61 can be prevented.

  As shown in FIG. 4, a partition portion 78 is formed between the convex portions 76. The partition part 78 has a flat plate shape extending in the X-axis direction. The partition part 78 is located between the first core part 11 and the second core part 12 in the Y-axis direction when the cover 60 is attached to the core 10, and both ends thereof in the X-axis direction. The portion is provided so as to enter the groove portion 24 of each of the flange portions 15 described above. The partition part 78 has a first side surface 79 that faces in the Y-axis direction and a second side surface 80 that faces in the X-axis direction. The first side surface 79 faces the bottom surface 25 of the groove portion 24. The second side surface 80 faces the winding 30 wound around the first and second core parts 11 and 12. Further, the length of the partition portion 78 in the Z-axis direction is shorter than the leg portions 66 and 67. By setting the partition portion 78 to such a length, contact between a circuit board (not shown) and the partition portion 78 can be prevented.

  When such a cover 60 is placed on the core 10, the locking claw 68 of the cover 60 is guided to the second side surface 17 side by the guide portions 26 provided on the flange portions 15. At the same time, the partition portion 78 of the cover 60 is guided to the second side surface 17 side by the groove portion 24 provided in each flange portion 15. The locking claw 68 advances downward along the third and fourth side surfaces 18 and 19 in the Z-axis direction and is locked by a locking receiving portion 27 formed on the third and fourth side surfaces 18 and 19. On the other hand, the partition part 78 advances in the Z-axis downward direction along the groove part 24, and when the bottom surface 77 of the convex part 76 provided on the cover 60 comes into contact with the first side surface 16 of each flange part 15, the partition part 78. The positions are fixed in a state where both ends of the are inserted into the groove 24. When the locking claw 68 is locked to the locking receiving portion 27 and the position of the partition portion 78 is fixed, the leg portions 66 and 67 of each cover 60 are respectively connected from the third and fourth side surfaces 18 and 19 side. The flange 15 is sandwiched. In this way, the attachment of the cover 60 to the core 10 is completed.

  In the present embodiment, the chip capacitor 50 is accommodated in the accommodating portion 15A provided on the mounting surface side of the flange portion 15, but the accommodating portion is provided on the anti-mounting surface side of the flange portion, and the anti-mounting surface is provided. A chip capacitor may be provided on the side.

  As a specific configuration, for example, a notch is formed on the first side surface of the collar portion at a substantially central position in the Y-axis direction of the collar portion. The notch is formed in a substantially rectangular parallelepiped shape from the first side surface to the second side surface. Accordingly, the notch is opened in the center of the first side surface, which is the anti-mounting surface, in the Z-axis direction and in a direction corresponding to the upper side of FIG. A housing part for housing the chip capacitor is formed on the mounting surface side of the part.

  A chip capacitor is accommodated in the notch. Similar to the present embodiment, the chip capacitor has a substantially rectangular parallelepiped shape slightly smaller than the substantially rectangular parallelepiped cutout, and element terminal electrodes are respectively disposed on and near the pair of surfaces forming the substantially rectangular parallelepiped shape. Is provided. The element terminal electrodes are electrically connected to the second electrode portions of the terminal electrodes, respectively, via solder fillets. Thus, a π-type filter as shown in FIG. 5 is constituted by the chip capacitor and the winding.

  The pair of surfaces provided with the element terminal electrodes of the chip capacitor are respectively opposed to the side surfaces of the notch, and the lower surface is opposed to the portion of the housing portion that defines the lower surface of the notch through a predetermined gap. The upper surface is partially exposed in the + direction of the Z-axis direction corresponding to the upper side of the common mode choke coil shown in FIG. The lower surface of the chip capacitor is supported in the vicinity of a pair of sides defining the lower surface by an element support portion of a terminal electrode described later. Similar to the lower surface of the chip capacitor, the element support portion that supports the lower surface of the chip capacitor faces the accommodating portion that defines the lower surface of the notch with a predetermined gap therebetween. The predetermined gap is formed by an extension end of a second partition portion, which will be described later, coming into contact with a portion of the accommodating portion that defines the lower surface of the notch.

  When the chip capacitor is arranged on the side opposite to the mounting surface in this way, the chip capacitor and the element support part that supports the chip capacitor should be arranged close to the part of the winding wound around the core part. Therefore, it is necessary to ensure insulation between the chip capacitor, the element support portion that supports the chip capacitor, and the winding portion. For this reason, a substantially plate-like second partition portion (not shown) extending from the lid portion in the Z-axis direction and extending in the same direction as the leg portion extends from the lid portion is provided on the lid portion.

  The 2nd partition part is comprised from nonmagnetic materials, such as liquid crystal polymer resin which is the same material as the cover part 61 of this Embodiment. By this second partition part, the chip capacitor, the element support part that supports the chip capacitor, and the part of the winding wound around the core part are not contacted with the second partition part interposed therebetween. can do. For this reason, even when a common mode choke coil is used as a power supply filter component through which a large current flows, the chip capacitor, the element support portion that supports the chip capacitor, and the winding wound around the core portion Insulation can be reliably ensured from this part.

  The first electrode portion is provided with a connecting portion that extends in a direction that connects a pair of terminal electrodes provided on each flange, and the connecting portion extends in an extending direction that connects the terminal electrodes to each other. It is bent in the Z-axis direction and corresponding to the downward direction shown in FIG. At the extending end of the connecting portion, there is provided a substantially U-shaped element support portion that opens in the Z-axis direction and corresponds to the upward direction shown in FIG.

  The lowermost portion of the element support portion in the Z-axis direction is integrally connected to the connecting portion. Therefore, the element support portion is connected to the first electrode portion by the connecting portion. The chip capacitor is supported by the element support portion so as to be inserted from above into a substantially U-shaped element support portion that opens in a direction corresponding to the upper direction shown in FIG. 2 in the Z-axis direction. Yes. The element terminal electrode of the chip capacitor is electrically connected to the connecting portion via a solder fillet.

  The extended end of the second partitioning portion comes into contact with the portion of the housing portion that defines the lower surface of the notch, so that the element support portion that supports the lower surface of the chip capacitor, the lower surface of the chip capacitor, and the lower surface of the notch Since a gap is formed between the defining portion of the accommodating portion, it is possible to prevent the flange portion and the chip capacitor from coming into contact with each other. Furthermore, the lid portion of the cover made of liquid crystal polymer resin is bent by the lid portion being pressed by a suction nozzle of an automatic mounting machine (not shown) from the upper direction to the lower direction on the Z axis in FIG. Even in this case, since the extending end of the second partition portion is in contact with the portion of the housing portion that defines the lower surface of the notch, the cover can be prevented from contacting the chip capacitor. For this reason, it is possible to prevent breakage such as an unexpected force acting on the chip capacitor to cause a crack.

  The filter component according to the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made within the scope described in the claims. For example, in the present embodiment, the core 10 is made of a magnetic material such as ferrite, but is not limited thereto. For example, a nonmagnetic material such as ceramic or resin may be used.

  In the present embodiment, the chip capacitor 50 is used as the capacitive element, but the present invention is not limited to this, and other types of capacitors, varistors, and the like may be used.

  Moreover, although the two windings 30 were provided, it is not limited to this number, One may be sufficient and three or more may be sufficient. Similarly, although two chip capacitors 50 are provided, the number is not limited to this number, and may be one or three or more. For example, in the case of one winding and one chip capacitor, a known L-type filter is configured instead of the π-type filter as shown in FIG. The number of terminal electrodes is provided in a number corresponding to the number of windings on each of the pair of flanges, and one end or the other end of the winding is connected to each other and electrically connected. Therefore, when the number of windings is one, one terminal electrode is provided on each of the pair of flanges.

  Moreover, although the terminal electrode 40 was formed by bending a metal plate, it is not limited to this structure. Further, the connection (connection) between the first electrode portion 41 and the winding 30 is performed by soldering, but is not limited thereto. For example, laser welding, ultrasonic bonding, thermocompression bonding, welding, or caulking may be performed.

  The filter component of the present invention is particularly useful in the field of filter components used for power supplies and the like through which a large current flows.

The perspective view which shows the filter component by embodiment of this invention. The disassembled perspective view which shows the filter component by embodiment of this invention. The front view which shows the filter component by embodiment of this invention. The bottom view which shows the filter component by embodiment of this invention. The circuit diagram which shows the filter component by embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Common mode choke coil, 10 ... Core, 11, 12 ... Core part, 15 ... Eaves part, 15A ... Housing part, 15a ... Housing part notch, 16 ... 1st side surface, 17 ... 2nd side surface, 17a ... Notch, 30 ... Winding, 40 ... Terminal electrode, 42A ... Connection part, 42B ... Element support part, 50 ... Chip capacitor, 51 ... Element terminal electrode

Claims (4)

A pair of buttocks,
A winding core for connecting the pair of flanges to each other;
At least one conducting wire wound around the winding core;
A terminal electrode provided in a number corresponding to the number of the conductive wires on the pair of flanges, and one end or the other end of the conductive wire fixed and electrically connected;
A filter component comprising a capacitive element having an element terminal electrode electrically connected to the terminal electrode,
The flange portion includes a mounting surface that is substantially parallel to the extending direction of the core portion and is disposed to face the electrode pattern on the circuit board, and a housing portion that houses the capacitive element on the mounting surface side. Filter parts characterized by   The capacitive element and the portion of the terminal electrode to which the element terminal electrode of the capacitive element is electrically connected are disposed at a position retracted from the mounting surface to the side opposite to the mounting surface of the flange portion. The filter component according to claim 1.   The accommodating portion is formed with a notch that opens in the mounting surface, the capacitive element is accommodated in the notch, and the capacitive portion is formed in the portion of the accommodating portion that defines the opening of the notch. The filter component according to claim 1, wherein a housing portion notch that forms a gap between the element and the housing portion is formed.   At the end of the flange in the extending direction of the core, the element terminal electrode of the capacitive element and the portion of the terminal electrode to which the element terminal electrode of the capacitive element is electrically connected The filter component according to any one of claims 1 to 3, wherein the filter component is exposed in a direction away from the core portion.

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