JP2008239863A - Curable resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a curable resin composition cured at a low temperature and in a short time, and excellent in the adhesiveness to a polyimide and wet heat-resistance. <P>SOLUTION: The thermosetting resin composition comprises a polyester urethane (A) containing a carboxy group in an amount corresponding to ≥5.0 KOH mg/g as an acid value, a radically polymerizable compound (B) and a radical initiator (C). <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a curable resin composition.

In recent years, polyimide films have come to be used in many electronic devices and the like, and the application range has been expanded. On the other hand, thermosetting resins such as epoxy resins have been used as adhesives, but the curing temperature is relatively high and unsuitable for bonding at low temperatures in a short time.
For such problems, Patent Documents 1 to 3 describe materials that can be bonded at a low temperature and in a short time by using a resin capable of radical polymerization.

  Patent Document 4 includes “an adhesive composition that is cured by light or heat and an organic compound having a urethane group and an ester group, and a circuit electrode formed on the substrate and the main surface thereof. "Circuit connection material for connecting circuit members" is described.

JP 2005-285666 A Japanese Patent No. 3587859 Japanese Patent No. 3344886 JP 2006-318990 A

However, even if the materials described in Patent Documents 1 to 3 can be bonded at a low temperature and in a short time, the adhesion to polyimide is not sufficient.
In addition, the circuit connection material described in Patent Document 4 may have a marked decrease in adhesion after being left under high temperature and high humidity. Patent Document 4 describes that sufficient adhesion strength to polyimide can be obtained, but there is room for further improvement in adhesion.

  Therefore, an object of the present invention is to provide a curable resin composition that can be cured at a low temperature and in a short time and that is excellent in adhesion to polyimide and moisture and heat resistance.

  As a result of intensive studies, the present inventor has found that a urethane containing polyester urethane (A) containing a carboxy group with an acid value of 5.0 KOH mg / g or more, a radical polymerizable compound (B), and a radical initiator (C). The present inventors have found that the curable resin composition can be cured at a low temperature and in a short time, and further becomes a curable resin composition having excellent adhesion to polyimide and heat-and-moisture resistance, thereby completing the present invention.

That is, the present invention provides the following (1) to (7).
(1) A curable resin composition containing a polyester urethane (A) containing a carboxy group with an acid value of 5.0 KOH mg / g or more, a radical polymerizable compound (B), and a radical initiator (C).
(2) The curable resin composition according to the above (1), wherein the polyester urethane (A) has a weight average molecular weight exceeding 100,000.
(3) The curable resin composition according to the above (1) or (2), wherein the polyester urethane (A) contains an aromatic dicarboxylic acid residue.
(4) The curable resin composition according to (3), wherein the aromatic dicarboxylic acid residue is a terephthalic acid residue.
(5) The curable resin composition according to the above (1) or (2), wherein the polyester urethane (A) contains a dimethylolbutanoic acid residue and / or a dimethylolpropionic acid residue.
(6) Curable resin composition in any one of said (1)-(5) whose glass transition temperature of the said polyester urethane (A) is 0 degreeC or more.
(7) Curing in any one of said (1)-(6) whose content of the said radically polymerizable compound (B) is 2-200 mass parts with respect to 100 mass parts of said polyester urethanes (A). Resin composition.

  The curable resin composition of the present invention can be cured at a low temperature and in a short time, and is excellent in adhesion to polyimide and heat and humidity resistance.

Hereinafter, the present invention will be described in more detail.
The curable resin composition of the present invention (hereinafter also referred to as “the composition of the present invention”) includes a polyester urethane (A) containing a carboxy group in an acid value of 5.0 KOHmg / g or more, and a radical polymerizable compound (B). And a radical initiator (C).

<Polyester urethane (A)>
The polyester urethane (A) used in the composition of the present invention is a compound obtained by reacting a polyester (a1) having a carboxy group with a polyisocyanate compound (a2).

As polyester urethane (A), the thing containing an aromatic dicarboxylic acid residue is preferable from the point which is excellent in the adhesiveness with respect to a polyimide. In particular, those containing a terephthalic acid residue are more preferred because of their superior adhesion to polyimide.
Moreover, as a polyester urethane (A), what contains a dimethylol butanoic acid residue and / or a dimethylol propionic acid residue is preferable from the point which is excellent in the adhesiveness with respect to a polyimide.
In addition, in this specification, an aromatic dicarboxylic acid residue means the structure remove | excluding the carboxy group from aromatic dicarboxylic acid. A dimethylol butanoic acid residue means a structure obtained by removing a carboxy group and a hydroxy group from dimethylol butanoic acid. The dimethylolpropionic acid residue means a structure obtained by removing a carboxy group and a hydroxy group from dimethylolpropionic acid.
An aromatic dicarboxylic acid refers to a compound having an aromatic ring and two carboxy groups bonded to the aromatic ring.

As said polyester (a1), the compound which has at least 1 carboxy group obtained by reaction of aromatic dicarboxylic acid and a polyol compound is mentioned suitably, for example. Moreover, the compound which has at least 1 carboxy group obtained by reaction of a dimethylol butanoic acid and a polyol compound is also mentioned suitably.
The manufacturing method of the said polyester (a1) is not specifically limited, A well-known method is employable.

  As the aromatic dicarboxylic acid, for example, terephthalic acid, isophthalic acid, metaphthalic acid, naphthalenedicarboxylic acid and the like are preferably mentioned because a composition having excellent adhesion to polyimide can be obtained. These may be used alone or in combination of two or more. Among these, terephthalic acid is preferable because higher adhesiveness can be obtained.

Moreover, you may use together aliphatic dicarboxylic acid, such as adipic acid, sebacic acid, and long-chain dicarboxylic acid, with the said aromatic dicarboxylic acid.
The long-chain dicarboxylic acid is a dicarboxylic acid having 20 or more carbon atoms, and examples thereof include eicosane diacid, docosane diacid, and dimer acid.

As the polyol compound used for the polyester (a1), known polyol compounds used for the production of polyester can be used without particular limitation, and examples thereof include ethylene glycol, propylene glycol, 1,4-butanediol, and long chain glycol. Can be mentioned. These may be used alone or in combination of two or more.
The long chain glycol is a glycol having a weight average molecular weight of 400 to 6000, and examples thereof include polyethylene glycol, poly (1,3-propylene glycol), and polytetramethylene glycol.

  Examples of the polyisocyanate compound (a2) include TDI such as 2,4-tolylene diisocyanate and 2,6-tolylene diisocyanate; MDI such as diphenylmethane-4,4′-diisocyanate; tetramethylxylylene diisocyanate (TMXDI). ), Trimethylhexamethylene diisocyanate (TMHMDI), 1,5-naphthalene diisocyanate, ethylene diisocyanate, propylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI), xylylene diisocyanate (XDI), triphenylmethane Triisocyanate, diisocyanate having a norbornane skeleton (NBDI), and modified products thereof That. These may be used alone or in combination of two or more. Among these polyisocyanate compounds, HDI, XDI, and IPDI are preferable from the viewpoint of excellent heat resistance.

  The method for producing the polyester urethane (A) is not particularly limited, and can be produced according to a known method using the polyester (a1) and the polyisocyanate compound (a2) as raw materials. Preferably, the polyester (a1) and the polyisocyanate compound (a2) are mixed and reacted so that the resulting polyester urethane (A) contains a carboxy group having an acid value of 5.0 KOHmg / g or more.

Polyester urethane (A) contains 5.0 KOHmg / g or more by making a carboxy group into an acid value. Since the acid value of the polyester urethane (A) is in the above range, the composition of the present invention is excellent in adhesion to polyimide, heat and humidity resistance and pigment dispersibility. In view of these characteristics, those containing a carboxy group with an acid value of 10 KOHmg / g or more are preferred, more preferably 15 KOHmg / g or more, and even more preferably 20 KOHmg / g or more.
Moreover, 50 KOHmg / g or less is preferable from the viewpoint of suppressing shrinkage after curing.

The weight average molecular weight of the polyester urethane (A) is preferably more than 100,000 from the viewpoint of excellent bending resistance. In addition, the weight average molecular weight of the polyester urethane (A) is more preferably 150,000 or more, and further preferably 200,000 or more, from the viewpoint of making the coating more tough.
Further, the weight average molecular weight of the polyester urethane (A) is preferably 1,000,000 or less from the viewpoint that compatibility with other components is not impaired.

  Polyester urethane (A) has a glass transition temperature (Tg) of preferably 0 ° C. or higher, more preferably 10 ° C. or higher, from the viewpoint of excellent heat resistance.

Moreover, a commercial item can also be used for polyesterurethane (A). For example, Byron UR (for example, UR3500, UR2300, UR1700) manufactured by Toyobo Co., Ltd. is preferable because it has excellent adhesion to polyimide.
As the polyester urethane (A), Byron UR3500 (acid value: 35 KOHmg / g) is preferable from the viewpoint of obtaining higher adhesiveness, and Byron UR2300 is preferable from the viewpoint of excellent heat resistance, and has an excellent balance between heat resistance and adhesiveness. From the viewpoint, it is preferable to use UR2300 and UR1700 in combination.

<Radically polymerizable compound (B)>
The radically polymerizable compound (B) used in the composition of the present invention is not particularly limited as long as it has a functional group that is polymerized by radicals.
Examples of the radically polymerizable compound (B) include (meth) acrylates and maleimide compounds. The radical polymerizable compound (B) can be used in either a monomer or oligomer state, and a monomer and an oligomer can be used in combination.

Examples of the (meth) acrylate include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylol propane triacrylate, tetramethylol methane tetraacrylate, and 2-hydroxy-1,3. -Diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxypolyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl Examples thereof include acrylate and tris (acryloyloxyethyl) isocyanurate. These may be used alone or in combination of two or more. Among these, a compound having at least one of a dicyclopentenyl group, a tricyclodecanyl group, and a triazine ring is preferable from the viewpoint of excellent heat resistance.
Moreover, you may use together polymerization inhibitors, such as hydroquinone and methyl ether hydroquinones, as needed.

  The maleimide compound is not particularly limited as long as it contains at least two maleimide groups in the molecule. For example, 1-methyl-2,4-bismaleimidebenzene, N, N′-m-phenylenebis Maleimide, N, N′-p-phenylenebismaleimide, N, N′-m-toluylene bismaleimide, N, N′-4,4-biphenylenebismaleimide, N, N′-4,4- (3 3'-dimethyl-biphenylene) bismaleimide, N, N'-4,4- (3,3'-dimethyldiphenylmethane) bismaleimide, N, N'-4,4- (3,3'-diethyldiphenylmethane) bis Maleimide, N, N′-4,4-diphenylmethane bismaleimide, N, N′-4,4-diphenylpropane bismaleimide, N, N′-4,4-di Phenyl ether bismaleimide, N, N′-3,3′-diphenylsulfone bismaleimide, 2,2-bis [4- (4-maleimidophenoxy) phenyl] propane, 2,2-bis [3-s-butyl- 4-8 (4-maleimidophenoxy) phenyl] propane, 1,1-bis [4- (4-maleimidophenoxy) phenyl] decane, 4,4′-cyclohexylidene-bis [1- (4maleimidophenoxy)- 2-cyclohexylbenzene], 2,2-bis [4- (4-maleimidophenoxy) phenyl] hexafluoropropane, and the like. These may be used alone or in combination of two or more.

Moreover, as a radically polymerizable compound (B), the compound which has a (meth) acryloyl group, an aromatic ring, and the carboxy group directly couple | bonded with this aromatic ring from the point from which the composition excellent in the adhesiveness with respect to a polyimide is obtained. Are preferable. As such a compound, for example, a compound represented by the following formula (1) is preferably mentioned because a composition excellent in adhesion to polyimide can be obtained. Further, a compound represented by the following formula (2), a compound represented by the following formula (3), a compound represented by the following formula (4), a bisphenol A type epoxy (meth) acrylate and a urethane (meth) acrylate are also included. From the viewpoint of obtaining a composition having excellent adhesion to polyimide.
The said radically polymerizable compound may be used independently and may use 2 or more types together.

The formula (1), R ¹ is a hydrocarbon group branched divalent may be 1 to 6 carbon atoms, specifically, for example, methylene group, ethylene group, -CH (CH ₃₎ CH ₂ — and the like can be mentioned, and an ethylene group is preferable.
In the above formula (2), R ² represents a hydrogen atom or an acryloyl group.
In the above formula (3), R ³ represents a methyl group or a hydroxy group, and is preferably a methyl group. R ⁴ represents an alkylene group having 2 or 3 carbon atoms, and specific examples include an ethylene group and a propylene group. n represents an integer of 0 to 2.
In said formula (4), r represents the integer of 1-5.

Specific examples of the radical polymerizable compound (B) include those represented by the following formulas (1 ′), (2 ′), (2 ″), or (3-1) to (3-6). And the like. These may be used alone or in combination of two or more.
Examples of the radical polymerizable compound (B) include the following formulas (1 ′), (2 ′), (3-1), compounds represented by the above formula (4), bisphenol A type epoxy (meth) acrylate and urethane ( Preferably, at least one selected from the group consisting of (meth) acrylates is preferable from the viewpoint of obtaining a composition that is superior in adhesion to polyimide.

  Although content of a radically polymerizable compound (B) is not specifically limited, It is preferable that it is 2-200 mass parts with respect to 100 mass parts of said polyester urethanes (A), and it is more preferable that it is 50-150 mass parts. preferable. When the content of the radical polymerizable compound (B) is within this range, the adhesiveness to polyimide is excellent.

As the radical polymerizable compound (B), for example, commercially available products such as Aronix manufactured by Toagosei Co., Ltd. can be used, and those corresponding to the above formula (1) are M-5400; the above formula (2) As applicable, M-215, M-313, M-315; as applicable to the above formula (3), M-309, M-305, M-310, M-320, M-350, M- 360; M-5600 etc. are mentioned as a thing corresponding to the said Formula (4).
In addition, urethane (meth) acrylates such as U-324A, UA-512, and UA-340P manufactured by Shin-Nakamura Chemical Co., Ltd .; bisphenol A type epoxy acrylates such as NK Oligo EA-1020; phenol novolacs such as NK Oligo EA-6320 Type epoxy (meth) acrylate; carboxylic acid anhydride-modified epoxy (meth) acrylate such as NK oligo EA-6340, NK oligo EA-7140, NK oligo EA-7440; NK ester A-BPE-10, NK ester A-BPE -20, NK ester BPE-500 and other ethoxylated bisphenol A di (meth) acrylate; NK ester AMP-20GY, NK ester AMP-60G and other phenoxypolyethylene glycol (meth) acrylate, etc .; Kyoeisha Chemical Co., Ltd. Preferable examples include ester 3000A, epoxy ester 3002M, and epoxy ester 80MFA.

<Radical initiator (C)>
The radical initiator (C) used for the composition of this invention is not specifically limited, A well-known radical initiator can be used.
Examples of the radical initiator (C) include peroxyesters, dialkyl peroxides, hydroperoxides, diacyl peroxides, peroxydicarbonates, peroxyketals, silyl peroxides, and the like. These may be used alone or in combination of two or more. Of these, peroxyesters are preferred because of their high reactivity.

  Specific examples of the peroxyester include cumyl peroxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexyl-1-methylethylperoxy Noedecanoate, t-hexylperoxyneodecanoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl- 2,5-di (2-ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, L-hexylperoxy-2-ethylhexanoate, L-butyl Peroxy-2-ethylhexanoate, t-butylperoxyisobutyrate, 1,1-bis (t-butylper Xyl) cyclohexane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy-3,5,5-trimethylhexanonate, t-butylperoxylaurate, 2,5-dimethyl-2,5-di ( m-toluoyl peroxy) hexane, t-butyl peroxyisopropyl monocarbonate, t-butyl peroxy-2-ethylhexyl monocarbonate, t-hexyl peroxybenzoate, t-butyl peroxyacetate and the like.

  Specific examples of the dialkyl peroxide include α, α′-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butyl). Peroxy) hexane, t-butylcumyl peroxide and the like.

  Specific examples of the hydroperoxide include diisopropylbenzene hydroperoxide and cumene hydroperoxide.

  Specific examples of the diacyl peroxide include isobutyl peroxide, 2,4-dichlorobenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, lauroyl peroxide, stearoyl peroxide. Examples thereof include oxide, succinic peroxide, benzoyl peroxytoluene, and benzoyl peroxide.

  Specific examples of the peroxydicarbonate include di-n-bromoperoxydicarbonate, diisopropyl peroxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate, and di-2- Examples include ethoxymethoxyperoxydicarbonate, di (2-ethylhexylperoxy) dicarbonate, dimethoxybutylperoxydicarbonate, di (3-methyl-3-methodibutylbutyloxy) dicarbonate, and the like.

  Specific examples of the peroxyketal include 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane and 1,1-bis (t-hexylperoxy) cyclohexane. 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1- (t-butylperoxy) cyclododecane, 2,2-bis (t-butylperoxy) decane Etc.

  Specific examples of the silyl peroxide include, for example, t-butyltrimethylsilyl peroxide, bis (t-butyl) dimethylsilyl peroxide, t-butyltrivinylsilyl peroxide, and bis (t-butyl) divinylsilyl peroxide. Examples thereof include oxide, tris (t-butyl) vinylsilyl peroxide, t-butyltriallylsilyl peroxide, bis (t-butyl) diallylsilyl peroxide, and tris (t-butyl) allylsilyl peroxide.

  Although content of a radical initiator (C) is not specifically limited, It is preferable that it is 0.01-10 mass parts with respect to 100 mass parts of polyester urethane (A), and is 0.01-5 mass parts. Is more preferable. When the content of the radical initiator (C) is within this range, it can be cured at a low temperature and in a short time.

  The composition of the present invention is, as necessary, a filler, a reaction retarder, an anti-aging agent, an antioxidant, a pigment (dye), a plasticizer, a thixotropic agent, as long as the effects of the present invention are not impaired. Various additives such as an ultraviolet absorber, a flame retardant, a solvent, a surfactant (including a leveling agent), a dispersant, a dehydrating agent, an adhesion imparting agent, and an antistatic agent can be contained.

  Examples of the filler include organic or inorganic fillers having various shapes. Specifically, for example, fumed silica, calcined silica, precipitated silica, ground silica, fused silica; diatomaceous earth; iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide; calcium carbonate, magnesium carbonate, zinc carbonate; Waxite clay, kaolin clay, calcined clay; carbon black; these fatty acid treated products, resin acid treated products, urethane compound treated products, and fatty acid ester treated products.

Specific examples of the anti-aging agent include hindered phenol compounds.
Specific examples of the antioxidant include butylhydroxytoluene (BHT) and butylhydroxyanisole (BHA).

  Specific examples of the pigment include inorganic pigments such as titanium oxide, zinc oxide, ultramarine, bengara, lithopone, lead, cadmium, iron, cobalt, aluminum, hydrochloride, sulfate, etc .; azo pigment, phthalocyanine pigment, quinacridone Pigment, quinacridone quinone pigment, dioxazine pigment, anthrapyrimidine pigment, ansanthrone pigment, indanthrone pigment, flavanthrone pigment, perylene pigment, perinone pigment, diketopyrrolopyrrole pigment, quinonaphthalone pigment, anthraquinone pigment, thioindigo pigment, benzimidazolone Examples thereof include organic pigments such as pigments, isoindoline pigments, and carbon black.

  Specific examples of the plasticizer include dioctyl phthalate (DOP) and dibutyl phthalate (DBP); dioctyl adipate, isodecyl succinate; diethylene glycol dibenzoate, pentaerythritol ester; butyl oleate, methyl acetylricinoleate; phosphorus Examples include tricresyl acid, trioctyl phosphate; propylene glycol polyester adipate, butylene glycol polyester adipate, and the like.

Specific examples of the thixotropic agent include Aerosil (manufactured by Nippon Aerosil Co., Ltd.), Dispalon (manufactured by Enomoto Kasei Co., Ltd.), and the like.
Specific examples of the adhesion-imparting agent include terpene resins, phenol resins, terpene-phenol resins, rosin resins, xylene resins, and the like.

Specific examples of the flame retardant include chloroalkyl phosphate, dimethyl / methyl phosphonate, bromine / phosphorus compound, ammonium polyphosphate, neopentyl bromide-polyether, brominated polyether, and the like.
Specific examples of the antistatic agent include quaternary ammonium salts; hydrophilic compounds such as polyglycols and ethylene oxide derivatives.

  The production method of the composition of the present invention is not particularly limited. For example, a method in which each of the above essential components and optional components is placed in a reaction vessel and sufficiently kneaded using a stirrer such as a mixing mixer under reduced pressure. Can be used.

The composition of the present invention can be cured at a low temperature for a short time (for example, at 160 ° C. for 10 seconds), and further has excellent adhesion to polyimide and heat and humidity resistance. Moreover, when the weight average molecular weight of polyester urethane (A) exceeds 100,000, it is excellent also in bending resistance.
Therefore, the composition of the present invention is suitably used as an adhesive for bonding polyimide materials together or a polyimide material and another material.

Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to these.
1. Synthesis of polyester urethane (A) (Synthesis Example 1)
100 g of dried polyester polyol (GK680, manufactured by Toyobo Co., Ltd., the same below) is dissolved in 100 g of dehydrated toluene, 1.4 g of dimethylol butanoic acid (manufactured by Nippon Kasei Co., Ltd., the same below), hexamethylene diisocyanate (Duranate, Asahi Kasei Chemicals) 3.17 g (manufactured by the same company, the same shall apply hereinafter) and 0.05 g of dibutyltin dilaurate (manufactured by Kishida Chemical Co., Ltd., the same shall apply hereinafter) as a catalyst were added and reacted at 80 ° C for 5 hours. After completion of the reaction, 56.9 g of dehydrated methyl ethyl ketone was added to obtain polyester urethane (A-1) having a solid content of 40% by mass.
The weight average molecular weight of the obtained polyester urethane was 340,000, and the acid value was 5.07 KOHmg / g.

(Synthesis Example 2)
100 g of the dried polyester polyol was dissolved in 100 g of dehydrated toluene, 1.4 g of dimethylolbutanoic acid, 2.36 g of hexamethylene diisocyanate and 0.05 g of dibutyltin dilaurate as a catalyst were added and reacted at 80 ° C. for 5 hours. After completion of the reaction, 55.6 g of dehydrated methyl ethyl ketone was added to obtain polyester urethane (A-2) having a solid content of 40% by mass.
The obtained polyester urethane had a weight average molecular weight of 80,000 and an acid value of 5.11 KOH mg / g.

(Synthesis Example 3)
100 g of the dried polyester polyol was dissolved in 100 g of dehydrated toluene, 0.7 g of dimethylol butanoic acid, 2.64 g of hexamethylene diisocyanate and 0.05 g of dibutyltin dilaurate as a catalyst were added and reacted at 80 ° C. for 5 hours. After completion of the reaction, 55.0 g of dehydrated methyl ethyl ketone was added to obtain a polyester urethane (A-3) having a solid content of 40% by mass.
The weight average molecular weight of the obtained polyester urethane was 340,000, and the acid value was 2.50 KOHmg / g.

2. Preparation of Curable Resin Composition Each component shown in Table 1 below was mixed at a ratio (parts by mass) shown in Table 1 using a stirrer to obtain each composition shown in Table 1.
About each obtained composition, the adhesiveness (initial stage) with respect to a polyimide, heat-and-moisture resistance, bending resistance, and pigment dispersibility were evaluated by the method shown below.
The results are shown in Table 1.

<Adhesiveness to polyimide (initial)>
Prepare two polyimide films (Kapton (registered trademark), manufactured by Toray DuPont, 25 μm thick), apply each composition obtained on one polyimide film, and dry in an oven at 80 ° C. for 5 minutes. The toluene was removed. Next, the other polyimide film was bonded to the composition-coated surface of this film and bonded by hot pressing for 10 seconds under the conditions of 3 MPa and 160 ° C., and then cut out to a width of 1 cm to prepare a test piece.
The obtained test piece was subjected to a 180 degree peel test with a peel tester (manufactured by Imada Co., Ltd.), and the peel strength was measured. This value was defined as the peel strength (initial).

<Heat and heat resistance>
After leaving the test piece prepared as described above <adhesiveness to polyimide (initial)> for 500 hours under the conditions of 85 ° C. and 85% RH, the peel strength was measured in the same manner as described above.

<Flexibility>
Each obtained composition was applied onto a PET film (Lumirror, manufactured by Toray Industries, Inc., thickness: 100 μm) and dried at 150 ° C. for 20 minutes to form a coating having a thickness of 100 μm to obtain a test piece.
The obtained test piece was bent 180 degrees in 1 to 2 seconds, and the one that had no abnormality on both the front and back sides of the bent portion was marked with “◯”, and at least one of the surfaces had an abnormality such as cracking or peeling. The thing was made into "x".

<Pigment dispersibility>
After adding 50 parts by mass of titanium oxide (JR-310, manufactured by Teika Co., Ltd.) to 100 parts by mass of polyester urethane in each composition and mixing each obtained composition, a bar coater (with a micrometer) was added to the glass plate. A film applicator (manufactured by Sheen) was applied. This was dried at 150 ° C. for 20 minutes to obtain a colored coating film having a thickness of 40 μm.
According to JIS K5400-1990, the 60-degree specular reflectance was measured using a 60-degree specular photometer (handy gloss meter PG-1, manufactured by Nippon Denshoku Industries Co., Ltd.).
It can be said that the higher the reflectance, the higher the glossiness of the surface of the coating film and the better the pigment dispersibility.

The components in Table 1 are as follows.
Polyester urethane (A-4): Polyester urethane containing a structure derived from terephthalic acid, Byron UR3500, manufactured by Toyobo Co., Ltd., acid value 35 KOHmg / g, weight average molecular weight 110,000, glass transition temperature 10 ° C.
Polyester urethane (A-5): Polyester urethane containing a structure derived from terephthalic acid, Byron UR1700, manufactured by Toyobo Co., Ltd., acid value 26 KOH mg / g, weight average molecular weight 360,000, glass transition temperature 92 ° C.
Polyester urethane (A-6): Polyester urethane containing a structure derived from terephthalic acid, Byron UR1400, manufactured by Toyobo Co., Ltd., acid value of less than 1 KOHmg / g, weight average molecular weight 110,000, glass transition temperature 83 ° C.
-Radical polymerizable compound (B-1): Compound represented by the above formula (1 '), M-5400, manufactured by Toagosei Co., Ltd.-Radical polymerizable compound (B-2): represented by the above formula (4) Compound M-5600, manufactured by Toagosei Co., Ltd. Radical polymerizable compound (B-3): Compound represented by the above formula (2 '), M-215, manufactured by Toagosei Co., Ltd. Radical polymerizable compound (B- 4): Compound represented by the above formula (3-1), M-309, manufactured by Toagosei Co., Ltd. Radical polymerizable compound (B-5): Bisphenol A type epoxy acrylate, NK oligo EA-1020, Shin-Nakamura Chemical -Radical polymerizable compound (B-6): Urethane (meth) acrylate, U-324A, Shin-Nakamura Chemical Co., Ltd.-Radical initiator (C): 2,5-dimethyl-2,5-bis ( t-Butylperoxy) hexy -3, perhexine 25B, manufactured by NOF Corporation

As is apparent from the results shown in Table 1 above, the compositions (Comparative Examples 1 and 2) using polyester urethane having an acid value outside the scope of the present invention have insufficient adhesiveness to polyimide, and moist heat aging. After that, the adhesive strength decreased significantly. Also, the pigment dispersibility was not good.
On the other hand, Examples 1 to 4 were excellent in adhesion to polyimide and pigment dispersibility, and surprisingly there was almost no decrease in adhesive strength even after wet heat aging, and extremely excellent in wet heat resistance.
Examples 1, 3 and 4 using polyester urethane having a weight average molecular weight in a specific range were further excellent in bending resistance.

Claims (7)

  A curable resin composition comprising a polyester urethane (A) containing a carboxy group with an acid value of 5.0 KOH mg / g or more, a radical polymerizable compound (B), and a radical initiator (C).   The curable resin composition according to claim 1, wherein a weight average molecular weight of the polyester urethane (A) exceeds 100,000.   The curable resin composition according to claim 1 or 2, wherein the polyester urethane (A) contains an aromatic dicarboxylic acid residue.   The curable resin composition according to claim 3, wherein the aromatic dicarboxylic acid residue is a terephthalic acid residue.   The curable resin composition according to claim 1 or 2, wherein the polyester urethane (A) contains a dimethylolbutanoic acid residue and / or a dimethylolpropionic acid residue.   The glass transition temperature of the said polyester urethane (A) is 0 degreeC or more, The curable resin composition in any one of Claims 1-5.   Content of the said radically polymerizable compound (B) is 2-200 mass parts with respect to 100 mass parts of said polyester urethane (A), The curable resin composition in any one of Claims 1-6.