JP2008238515A - Cooling device of laminated molded article - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device capable of obtaining uniform and excellent cooling while keeping the surface state of a film shaped laminated article well. <P>SOLUTION: The cooling device 1 for cooling a film-shaped laminated article is equipped with a temperature controlled rectangular cooling board 3 and a pressing plate 4 which is connected by a hinge 5 on one side of the cooling board 3 and has honeycomb structure. The pressing plate 4 can be approached to and separated from the cooling board 3, and is provided so that the distance from the cooling board 3 in positioning adjacent to the cooling board 3 can be variably set. The cooling device 1 is equipped with a locking device for holding the position in turning and opening of the pressing plate 4, and the hinge 5 has a damper function for generating a resistance force with respect to the turning closing movement of the pressing plate 4. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a cooling device for cooling a molded product laminated in a film shape.

  As a prior art in this technical field, for example, there is Patent Document 1. Patent Document 1 is a vacuum press method for laminating and embedding a film-like material on a substrate and further flattening the film-like material on the substrate, and the substrate holding the film-like material on the surface is a first vacuum. A step of laminating and embedding a film-like material on the surface of the substrate by heating and pressurizing in a reduced pressure atmosphere in a press device, and a substrate laminated and embedded with the film-like material on the surface into a second vacuum press device Flattening the outer surface of the film-like material by heating and pressurizing in a reduced-pressure atmosphere, and placing the film-like material on the surface between the laminating and embedding step and the flattening step. The present invention relates to a vacuum pressing method in which a step of forcibly cooling a laminated and embedded substrate is provided.

  However, since the cooling device in Patent Document 1 directly or indirectly brings the cooling medium into contact with the film-like material, the degree of cooling is adjusted when the cooling medium is a fluid such as air. It is difficult to cool the entire surface of the film-like material uniformly. Further, when the cooling medium is a solid medium cooled to an ambient temperature or lower and pressed against both sides of the film material directly or indirectly, the film material based on the pressing force Deformation and transfer occur, causing the quality of the molded product to deteriorate.

JP 2005-334902 A

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a cooling device that can realize uniform and good cooling while maintaining the surface state of a film-like laminate.

  The present invention is a cooling device that cools a molded product laminated in a film shape, and includes a temperature-controlled rectangular cooling plate and a press plate having a honeycomb structure connected to one side of the cooling plate with a hinge. The present invention relates to a cooling device.

  According to the cooling device of the present invention, uniform and good cooling can be carried out while maintaining the surface state of the film-shaped laminate.

  Embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a front view of the cooling device of the present invention. FIG. 2 is a left side view of the cooling device of the present invention. FIG. 3 is a plan view of the cooling device of the present invention.

  The cooling device 1 is suitably used for forming a build-up type multilayer wiring board. The cooling device 1 improves a carrier film from a molded product obtained by flattening an intermediate molded product having unevenness on a surface obtained by laminating and forming a circuit-formed substrate and a film-like resin with a vacuum laminator. Installed in the downstream process of the flattening press for peeling. The molded product having a flat surface formed in this way is subjected to the next lamination molding by the vacuum laminating apparatus again after the circuit is formed. The cooling device 1 may be installed between the vacuum laminator and the flattening press so as not to generate bubbles or voids in the flattened molded product.

  The cooling device 1 is a relatively thick rectangular flat plate fixed to the gantry 2, a cooling plate 3 having a plurality of cooling water passages 16, and a relatively thin presser plate 4 having substantially the same shape as the upper surface of the cooling plate 3. And a mounting rod 6 that is attached to one side of the cooling plate 3 via a pneumatic cylinder 10 with a hinge 5 on one side of the presser plate 4, and a pneumatic cylinder near the other side that faces one side of the cooling plate 3. 10 and a pneumatic cylinder 10 fixed to the gantry 2 by driving the mounting rods 6 and 7 up and down at their longitudinal center portions.

  The presser plate 4 has a configuration in which thin plates with smooth surfaces are bonded to both surfaces of a honeycomb plate having through holes in the plate thickness direction. The material of the honeycomb plate and the thin plate is aluminum. Therefore, the presser plate 4 is light and has high rigidity.

  The up-and-down movement of the mounting rods 6 and 7 by the pneumatic cylinder 10 is guided by a guide pin 8 erected downward at both ends of the lower surface of the mounting rods 6 and 7 and a guide seat 9 into which the guide pin 8 is inserted. The ascending distance of the mounting rods 6 and 7 is determined by the protrusion limit of the rod of the pneumatic cylinder 10, and a molded product can be easily formed between the holding plate 4 that makes contact with the mounting rods 6 and 7 and the cooling plate 3. A gap that can be inserted is formed. Further, the lower limit position of the mounting rods 6 and 7 is determined and set by an adjusting screw 11 that adjusts the retraction stop position of the rod of the pneumatic cylinder 10, and the proximity positioning position of the presser plate 4 to the cooling panel 3 is determined by the presser. It can be arbitrarily set according to the thickness of the molded product within a range of a distance 3 mm away from the position where the plate 4 is in close contact with the cooling plate 3. Note that urethane rubber is baked and bonded to the contact surfaces of the mounting rods 6 and 7 with the presser plate 4 in order to absorb the impact.

  The cooling panel 3 is controlled in temperature by supplying cooling water having a predetermined temperature from the cooling water inlet 17 and discharging it from the cooling water outlet 18. The cooling water inlet 17 and the cooling water outlet 18 are one opening of the cooling water passage 16, and the other opening is connected to the opening of the other cooling water passage 16 by a hose or the like. A passage 16 communicates from the cooling water inlet 17 to the cooling water outlet 18.

  Next, the operation of the cooling device 1 will be described. The molded product laminated in the form of a film to be cooled is a state in which the presser plate 4 is most separated from the cooling panel 3 by the pneumatic cylinder 10 or a state in which the presser plate 4 is further swung upward as shown in FIG. 1 is inserted in a direction perpendicular to the paper surface in FIG.

  By the way, the turning opening and closing of the presser plate 4 is also performed at the time of maintenance and inspection in addition to the above-described molded product mounting process. In order to make the work at that time safe and easy, a locking device is provided for holding the presser plate 4 at the position when the turning is released. The locking device includes a semi-annular locking portion 13 provided on the upper surface of the presser plate 4 and a snatch lock 14 that holds and holds the locking portion 13 above the presser plate 4. A proximity switch 15 for checking the locked state of the presser plate 4 and prohibiting other operations is provided in the vicinity of the snatch lock 14. When releasing the engagement with the engaging portion 13 of the snatch lock 14 and closing the presser plate 4, there is no problem if the handle 12 is gently operated with a hand attached, but the presser plate 4 is naturally dropped and swiveled. When closed, the presser plate 4 and the molded product may be damaged. In order to prevent this, the hinge 5 has a damper function for generating a resistance force against the swivel closing movement of the presser plate 4.

  When the molded product is cooled, compressed air is supplied to the pneumatic cylinder 10 to lower the mounting rods 6 and 7. Then, the presser plate 4 is closed by its own weight and comes into contact with or comes into contact with the mounting rods 6 and 7 and / or the molded product. Therefore, the molded product comes into contact with the cooling board 3 with a very low pressing force and is uniformly cooled without being excessively deformed or shaped.

  When a predetermined cooling time has elapsed, compressed air is supplied to the pneumatic cylinder 10 to raise the mounting rods 6 and 7. Since a gap sufficiently larger than the thickness of the molded product is generated between the cooling plate 3 and the presser plate 4, the cooled molded product is carried out of the cooling device 1 by the carrier film and from other devices. The molded product before cooling is carried in.

  The present invention is not limited to the embodiments described above, and various modifications can be added and implemented without departing from the spirit of the invention.

It is a front view of the cooling device of the present invention. It is a left view of the cooling device of the present invention. It is a top view of the cooling device of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cooling device 2 Base 3 Cooling board 4 Holding plate 5 Hinge 6,7 Mounting rod 8 Guide pin 9 Guide seat 10 Pneumatic cylinder 11 Adjustment screw 12 Handle 13 Locking part 14 Snatch lock 15 Proximity switch 16 Cooling water passage 17 Cooling water Inlet 18 Cooling water outlet

Claims (3)

A cooling device for cooling a molded product laminated in a film shape,
A cooling device comprising: a rectangular cooling plate that is temperature-controlled; and a presser plate that is connected to one side of the cooling plate with a hinge and has a honeycomb structure.   2. The presser plate according to claim 1, wherein the presser plate is provided so as to be able to approach and separate from the cooling plate and to be able to variably set a distance from the cooling plate when positioned close to the cooling plate. Cooling system.   The cooling device includes a locking device that holds a position of the holding plate when the holding plate is swung open, and the hinge has a damper function that generates a resistance force against the closing movement of the holding plate. 2. The cooling device according to 2.

Images