JP2008236014A - Antenna structure and wireless communication equipment with same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To strengthen the bonding of a radiation electrode and a dielectric substrate while suppressing enlargement. <P>SOLUTION: In the antenna structure 1 provided with a configuration that the radiation electrode 3(4) composed of a conductor plate for performing an antenna operation is provided integrally on the upper surface of the electric substrate 2 by an insertion molding technique, the radiation electrode 3(4) includes through-parts 12 and 13 composed of at least one of a through hole and a through groove part reaching the dielectric substrate 2 from the surface of the radiation electrode 3(4). A dielectric material constituting the dielectric substrate 2 is made to enter, filled and formed inside the through-parts 12 and 13 during insertion molding from the dielectric substrate side, the through-parts 12 and 13 and the dielectric material of the dielectric substrate 2 are bonded, and thus the bonding of the radiation electrode 3(4) and the dielectric substrate 2 is strengthened. The dielectric material which enters the through-parts 12 and 13 is not projected from the through-parts 12 and 13 to the surface of the radiation electrode. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an antenna structure having a configuration in which a radiation electrode for performing an antenna operation is formed on an upper surface of a dielectric substrate, and a wireless communication apparatus including the antenna structure.

  FIG. 6A shows a structural example of an antenna structure (see, for example, Patent Document 1) in a schematic perspective view, and FIG. 6B shows a schematic disassembly of the antenna structure in FIG. 6A. FIG. 6 (c) shows a schematic cross-sectional view of the AA portion of FIG. 6 (a). The antenna structure 30 includes a dielectric substrate 31, a radiation electrode 32 disposed on the upper surface of the dielectric substrate 31, and a power feeding terminal connected to a predetermined power feeding portion Q of the radiation electrode 32. The electrode 33 and a grounding terminal electrode 34 connected to a predetermined grounding portion G of the radiation electrode 32 are provided.

  The radiation electrode 32 is composed of a conductor plate and functions as an antenna by a resonance operation. The radiation electrode 32 is formed with a slit 36 for adjusting the resonance frequency of the radiation electrode 32 so as to have a predetermined resonance frequency. The radiation electrode 32 is formed with a through hole 37 that reaches the dielectric substrate 31 from the surface of the radiation electrode 32.

  The power feeding terminal electrode 33 and the ground grounding terminal electrode 34 are each composed of a conductor plate that is common to the conductor plate constituting the radiation electrode 32, and the power feeding terminal electrode 33 and the ground grounding terminal electrode 34. Are arranged along the side surface of the dielectric substrate 31 with a space therebetween. The dielectric substrate 31 on which the radiation electrode 32, the power feeding terminal electrode 33, and the grounding terminal electrode 34 are formed is fixed, for example, at a set antenna arrangement position on the circuit board 38 of the wireless communication apparatus. Thereby, the power supply terminal electrode 33 is electrically connected to, for example, a radio communication circuit (high frequency circuit) 40 provided on the circuit board 38, and the grounding terminal electrode 34 is provided on the radio communication device. It is grounded to the ground part.

  In the configuration of the antenna structure 30, the radiation electrode 32, the feeding terminal electrode 33, and the grounding terminal electrode 34 are integrally joined to the dielectric substrate 31 at the same time as the dielectric substrate 31 is molded by the insert molding technique. During the insert molding, the dielectric material constituting the dielectric substrate 31 enters a part of the slit 36 or the through hole 37 of the radiation electrode 32 from the dielectric substrate 31 side, and the surface of the radiation electrode 32 through the slit 36 or the through hole 37. It protrudes to the side, and the protrusion part 42 is comprised. As shown in the cross-sectional view of FIG. 6C, a part of the protrusion 42 protrudes from the formation region of the through hole 37 and the formation region of the slit 36 onto the surface of the radiation electrode 32 to form the slit edge. The radiation electrode portion constituting the portion and the through hole opening edge portion is held by the dielectric substrate 31. Further, during insert molding, the dielectric material constituting the dielectric substrate 31 rises along the end surfaces of the radiation electrode 32, the power supply terminal electrode 33, and the grounding terminal electrode 34, and the radiation electrode 32 and the power supply terminal electrode. 33 and the surface of the grounding terminal electrode 34. As a result, the protrusions 43 are formed at the edge portions of the radiation electrode 32, the power supply terminal electrode 33, and the grounding terminal electrode 34. Similarly to the projecting portion 42, a part of the projecting portion 43 presses the edge portions of the radiation electrode 32, the power feeding terminal electrode 33, and the grounding terminal electrode 34 to the dielectric substrate 31. The radiating electrode 32, the power feeding terminal electrode 33, and the grounding terminal electrode 34 are firmly joined to the dielectric substrate 31 by the protrusions 42 and 43 as described above.

JP 2005-64945 A JP 2003-115718 A

  However, the protrusions 42 and 43 for firmly joining the radiation electrode 32, the power supply terminal electrode 33, and the grounding terminal electrode 34 to the dielectric substrate 31 are provided on the radiation electrode 32, the power supply terminal electrode 33, and the grounding ground. Since it protrudes from the electrode surface of the terminal electrode 34, there is a problem that the antenna structure 30 is increased in size by the protrusion. In other words, when the size of the antenna structure 30 is the same as that of the configuration in which the protruding portions 42 and 43 are not provided, the size of the dielectric base (that is, the antenna volume) is reduced. Therefore, there is a problem that the antenna characteristics become inferior.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an antenna structure capable of strengthening the bonding between a radiation electrode and a dielectric substrate without causing an increase in size or deterioration of antenna characteristics, and an antenna structure including the antenna structure. Another object of the present invention is to provide a wireless communication device.

In order to achieve the above object, the present invention has the following configuration as means for solving the above problems. That is, the antenna structure of the present invention is
In an antenna structure having a configuration in which a radiation electrode composed of a conductor plate that performs antenna operation is integrally provided on the upper surface of a dielectric substrate by insert molding technology,
The radiation electrode is provided with a through portion including at least one of a through hole and a through groove portion that reaches the dielectric substrate from the surface of the radiation electrode, and the dielectric constituting the dielectric substrate is formed in the through portion. A structure in which the bonding between the radiation electrode and the dielectric substrate is strengthened by the material entering from the dielectric substrate side during the insert molding and filling and forming, and the penetration portion and the dielectric material of the dielectric substrate are bonded. And
The dielectric material that has entered the penetrating portion does not protrude from the penetrating portion to the surface of the radiation electrode. In addition, the wireless communication apparatus of the present invention is characterized in that an antenna structure having a configuration specific to the present invention is provided.

  According to the present invention, the radiation electrode is provided with a through portion, and the inside of the through portion is filled with a dielectric material constituting the dielectric substrate, thereby strengthening the bonding between the radiation electrode and the dielectric substrate, In addition, the dielectric material that has entered the penetrating portion does not protrude from the penetrating portion to the surface of the radiation electrode. Therefore, it is possible to enhance the bonding between the radiation electrode and the dielectric substrate while preventing the antenna structure from being enlarged due to the dielectric material of the dielectric substrate protruding outward from the surface of the radiation electrode. . In other words, as long as the size of the antenna structure is the same as that of the dielectric material of the dielectric substrate having a protruding portion protruding outward from the surface of the radiation electrode, the characteristic configuration of the present invention In addition to strengthening the bonding between the radiation electrode and the dielectric substrate, the dielectric substrate can be enlarged by the amount that it is not necessary to provide the protrusion. For this reason, it becomes easy to improve the antenna characteristics such as widening the frequency band of wireless communication and increasing the gain of the antenna.

  In addition, the radiation electrode has a drooping electrode portion that extends in a direction along the side surface of the dielectric substrate. A penetrating portion is also formed in the drooping electrode portion, and the dielectric material of the dielectric substrate is formed in the penetrating portion. The sagging electrode portion is an anchor of the radiation electrode by providing a configuration in which the sacrificial electrode portion has a constricted portion in which the electrode width narrows in the middle from the upper surface side of the dielectric substrate toward the extending tip side. Thus, it is possible to further strengthen the bonding between the radiation electrode and the dielectric substrate while suppressing an increase in the size of the antenna structure. For example, when there is an impact such as a drop, the radiation electrode can be more reliably avoided from being peeled off from the dielectric substrate or from being displaced.

  Further, when the grounding terminal electrode and the power feeding terminal electrode which are formed to extend in the direction along the side surface of the dielectric substrate are connected to the radiation electrode, one of the ground grounding terminal electrode and the power feeding terminal electrode Alternatively, a grounding terminal electrode or a power supply terminal electrode provided with a through portion is also provided by providing a structure in which a through portion is formed in both and the through portion is filled with a dielectric material of a dielectric substrate. Functions as an anchor for the radiating electrode to enhance the bonding between the radiating electrode and the dielectric substrate. Further, it is possible to prevent the grounding terminal electrode or the power feeding terminal electrode itself from being peeled off from the dielectric substrate when there is an impact such as dropping.

  Further, when the antenna structure is surface-mounted on the circuit board of the wireless communication device, for example, by solder or the like, the conductor plate portion exposed on the bottom surface of the dielectric substrate and the conductor plate portion to the inside of the dielectric substrate. The antenna mounting member having a conductor plate portion extending toward the antenna structure is provided in the antenna structure, so that the antenna mounting member is exposed on the bottom surface of the dielectric substrate. By joining the conductor plate portion to the circuit board with solder or the like, the bonding between the antenna structure and the circuit board can be strengthened. Further, by providing a structure in which a conductor plate portion disposed inside the dielectric substrate of the antenna mounting member is provided with a through portion and the through portion is filled with a dielectric material of the dielectric substrate, Bonding between the antenna mounting member and the dielectric substrate can be strengthened, and problems such as cracking of the dielectric substrate at the position where the antenna mounting member is disposed when there is an impact such as dropping can be prevented. .

  As described above, since the antenna structure of the present invention has a strengthened bond between the radiation electrode and the dielectric substrate, the wireless communication device including the antenna structure of the present invention has high reliability with respect to the strength of the antenna structure. Can be obtained. In addition, since the antenna structure of the present invention can be downsized while strengthening the bonding between the radiation electrode and the dielectric substrate, the wireless communication device provided with the antenna structure of the present invention can reduce the size of the antenna structure. Accordingly, it is possible to reduce the size. Furthermore, since the antenna structure of the present invention can improve both strength and antenna characteristics, the wireless communication apparatus equipped with the antenna structure of the present invention has reliability with respect to both the strength and antenna characteristics of the antenna structure. Can be increased.

  Embodiments according to the present invention will be described below with reference to the drawings.

  FIG. 1A shows a schematic perspective view of the antenna structure of the first embodiment, and FIG. 1B schematically shows an example of the antenna structure viewed from the lower side of FIG. Has been shown. The antenna structure 1 according to the first embodiment includes a dielectric substrate 2, and a feeding radiation electrode 3 and a parasitic radiation electrode 4 that are radiation electrodes provided on the dielectric substrate 2. FIG. 1C schematically shows a state where the dielectric substrate 2 is removed from the antenna structure 1.

  The feed radiation electrode 3 is composed of a conductor plate and performs wireless communication by an antenna operation (resonance operation). The feed radiation electrode 3 is joined to the upper surface of the dielectric substrate 2. In the first embodiment, the feed radiation electrode 3 has a quadrangular shape, and a feed portion Q is set on one side of the square feed radiation electrode 3, and on the side where the feed portion Q is set. The opposite side 3K of the opposite feed radiation electrode 3 forms an open end. That is, the feed radiation electrode 3 is a λ / 4 type antenna in which one end side is a feed portion and the other end side is an open end.

  A power supply terminal electrode 6 is joined to the power supply portion Q of the power supply radiation electrode 3. In the first embodiment, the power supply terminal electrode 6 is exposed on the portion embedded in the dielectric substrate 2 and extending in the direction along the side surface of the dielectric substrate 2 and on the bottom surface of the dielectric substrate 2. And a portion on the extended distal end side that is formed. In the power supply terminal electrode 6, the extended tip side portion exposed on the bottom surface of the dielectric substrate 2 is electrically joined to, for example, a predetermined joint portion on the circuit board of the wireless communication device, for example, by solder or the like. For example, the wireless communication circuit 7 is electrically connected to the wireless communication circuit 7. The power supply terminal electrode 6 is composed of a common conductive plate with the power supply radiation electrode 3, and the conductive plate portion serving as a joining position (boundary position) between the power supply radiation electrode 3 and the power supply terminal electrode 6 is defined as a power supply terminal. By bending the electrode 6 along the side surface of the dielectric substrate 2, the power supply terminal electrode 6 is formed.

  The ground electrode terminal 8 is connected to the feed radiation electrode 3 via the feed terminal electrode 6. The grounding terminal electrode 8 is disposed adjacent to the power feeding terminal electrode 6 with a gap from the power feeding terminal electrode 6. The ground grounding terminal electrode 8 is embedded in the dielectric base 2 and extends in a direction along the side surface of the dielectric base 2, and an extended tip exposed on the bottom surface of the dielectric base 2. Side part. The grounded terminal electrode 8 is electrically bonded to a predetermined joint portion of the circuit board of the wireless communication device, for example, by solder, for example, at a portion of the extended tip side exposed on the bottom surface of the dielectric substrate 2. By doing so, it is grounded to the ground part provided in the wireless communication apparatus. Similarly to the power supply terminal electrode 6, the ground grounding terminal electrode 8 is also composed of a conductor plate common to the power supply radiation electrode 3.

  The parasitic radiation electrode 4 is composed of a conductor plate, and is formed on the upper surface of the common dielectric substrate 2 adjacent to the feeding radiation electrode 3 with a gap from the feeding radiation electrode 3. The parasitic radiation electrode 4 is configured to electromagnetically couple with the feeding radiation electrode 3 and to resonate with the antenna operation (resonance operation) of the feeding radiation electrode 3 to create a double resonance state. A ground ground portion G is set at an end portion of the parasitic radiation electrode 4, and a ground ground terminal electrode 10 is connected to the ground ground portion G. In the first embodiment, the grounding terminal electrode 10 is embedded in the dielectric substrate 2 and extends in the direction along the side surface of the dielectric substrate 2 in the same manner as the grounding terminal electrode 8 of the feeding radiation electrode 3. It has a part that is formed to be elongated and a part on the side of the extended tip that is exposed on the bottom surface of the dielectric substrate 2. For example, a portion on the extended distal end side exposed on the bottom surface of the dielectric substrate 2 is electrically joined to a predetermined joining portion of the circuit board of the wireless communication device, for example, by solder or the like. The terminal electrode 10 is grounded to the ground part of the wireless communication device. The grounding terminal electrode 10 is composed of a conductor plate common to the parasitic radiation electrode 4. In the first embodiment, the grounding terminal electrode 10 is disposed adjacent to the feeding terminal electrode 6 of the feeding radiation electrode 3 with a gap therebetween.

  In the first embodiment, the feed radiation electrode 3 and the parasitic radiation electrode 4 are respectively provided with a through portion 12 having a through hole shape reaching the dielectric substrate 2 from the electrode surface, and the dielectric substrate 2 from the electrode surface. And a penetrating portion 13 having a shape of a penetrating groove portion (slit) reaching the surface. As a method of forming the through portions 12 and 13 in the conductor plate constituting the feed radiation electrode 3 and the conductor plate constituting the non-feed radiation electrode 4, there are various methods such as press working, laser processing, and etching processing. Here, any of the methods may be used. The cross-sectional shape of the penetration parts 12 and 13 becomes a shape according to a processing method. For example, FIGS. 2A to 2F show examples of cross sections of the through portions 12 and 13, respectively.

  The dielectric substrate 2 is made of a resin, which is a dielectric material. By the insert molding technique, the feeding radiation electrode 3, the parasitic radiation electrode 4, the feeding terminal electrode 6, the grounding terminal electrode 8, 10 is manufactured by being integrally molded. In the first embodiment, the dielectric material (resin) constituting the dielectric substrate 2 is inserted into each of the through-holes 12 and 13 of the feed radiation electrode 3 and the non-feed radiation electrode 4 during insert molding from the dielectric substrate 2 side. The inside is filled and formed. As a result, the coupling between the feeding radiation electrode 3 and the dielectric substrate 2 and the bonding between the parasitic radiation electrode 4 and the dielectric substrate 2 are strengthened. In the first embodiment, as shown in FIGS. 2A to 2F, the dielectric material that has entered the through portions 12 and 13 passes from the through portions 12 and 13 to the surfaces of the radiation electrodes 3 and 4. Therefore, the antenna structure 1 is prevented from being enlarged.

  In the embodiment shown in FIG. 1, a recess 11 is formed on the bottom surface side of the dielectric substrate 2. In addition, the dielectric material constituting the dielectric substrate 2 may be a resin alone, or a dielectric constant adjusting material such as ceramic powder may be contained in the resin to increase the dielectric constant, for example. Furthermore, the through-groove part (slit) 13 provided in the feed radiation electrode 3 or the parasitic radiation electrode 4 may have a function of adjusting the resonance frequency of the feed radiation electrode 3 or the parasitic radiation electrode 4.

  Further, in the example shown in FIG. 1, the dielectric substrate 2 is provided with a fixing electrode 15. The fixing electrode 15 includes a conductor plate portion embedded in the dielectric substrate 2 and a conductor plate portion exposed on the bottom surface of the dielectric substrate 2. The dielectric substrate 2 is bonded to the circuit board by bonding the conductor plate portion exposed on the bottom surface of the body substrate 2 to, for example, a predetermined bonding portion of the circuit board of the wireless communication device by using, for example, solder. The fixing electrode 15 is a dedicated member for joining the antenna structure 1 to the circuit board. A through-hole 16 is formed in a conductor plate portion embedded in the dielectric substrate 2 in the fixing electrode 15, and a dielectric material constituting the dielectric substrate 2 is also formed in the through-hole 16. Filled and formed. With this configuration, the bonding between the fixing electrode 15 and the dielectric substrate 2 can be strengthened, and the occurrence of a situation in which the portion of the dielectric substrate 2 in which the fixing electrode 15 is embedded is cracked can be prevented. Can do.

  The second embodiment will be described below. In the description of the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and duplicate descriptions of common portions are omitted.

  3A is a schematic perspective view showing the antenna structure of the second embodiment, and FIG. 3B is a schematic view showing the antenna structure as viewed from the lower side of FIG. 3A. FIG. 3C schematically shows a state example in which the dielectric base of the antenna structure is omitted.

  In the second embodiment, a feeding radiation electrode 3 and a parasitic radiation electrode 4 made of a conductor plate are arranged adjacent to each other with a gap on the upper surface of the dielectric substrate 2 as in the first embodiment. Yes. Each of the feed radiation electrode 3 and the non-feed radiation electrode 4 is formed with through portions 12 and 13 each having the form of a through hole or a through groove, and the through portions 12 and 13 have dielectrics constituting the dielectric substrate 2. The body material is filled and formed. The dielectric material does not protrude from the penetrating portions 12 and 13 to the electrode surfaces of the feed radiation electrode 3 and the parasitic radiation electrode 4. In addition, a power supply terminal electrode 6 is joined to the power supply portion Q of the power supply radiation electrode 3, and a grounding terminal electrode 8 is connected to the power supply radiation electrode 3 via the power supply terminal electrode 6.

  In the second embodiment, a through-hole 12 is formed in the grounding terminal electrode 8, and the through-holes 12 and 13 of the feed radiation electrode 3 and the non-feed radiation electrode 4 are formed in the through-hole 12. Similarly, the dielectric material constituting the dielectric substrate 2 is filled and formed during the insert molding of the dielectric substrate 2.

  Further, in the second embodiment, the feed radiation electrode 3 and the parasitic radiation electrode 4 are each a drooping electrode portion that extends from the top surface of the dielectric substrate 2 along the side surface of the dielectric substrate 2. 18. A penetrating portion 12 having a shape of a through hole is formed in the drooping electrode portion 18, and the dielectric substrate in the feed radiation electrode 3 and the parasitic radiation electrode 4 is also inside the penetrating portion 12 of the drooping electrode portion 18. Similarly to the through portions 12 and 13 formed on the upper surface of the dielectric substrate 2, the dielectric material constituting the dielectric substrate 2 is filled and formed during insert molding of the dielectric substrate 2. The sagging electrode portion 18 of the feed radiation electrode 3 is disposed on the side surface of the dielectric substrate facing the side surface of the dielectric substrate 2 on which the sagging electrode portion 18 of the parasitic radiation electrode 4 is formed.

  Other configurations of the antenna structure of the second embodiment are the same as those of the first embodiment.

  The third embodiment will be described below. In the description of the third embodiment, the same components as those in the first and second embodiments are denoted by the same reference numerals, and duplicate descriptions of the common portions are omitted.

  FIG. 4A schematically shows the antenna structure of the third embodiment as viewed from below, and FIG. 4B schematically shows the AA portion of FIG. 4A. A schematic cross-sectional view is shown. In the third embodiment, in addition to the configurations of the first and second embodiments, the dielectric substrate 2 is provided with a power supply terminal electrode 6 and ground grounding terminal electrodes 8 and 10. The antenna mounting member 20 is provided at an intermediate position from the one end side to the opposite end side. The antenna mounting member 20 includes a conductor plate portion 21 that is exposed on the bottom surface of the dielectric substrate 2, and a conductor plate portion 22 that extends from the conductor plate portion toward the inside of the dielectric substrate 2. Have The antenna mounting member 20 has a dielectric substrate 2 (antenna structure 1) formed by bonding a conductor plate portion 21 exposed on the bottom surface of the dielectric substrate 2 to a circuit board of a wireless communication device using, for example, solder. Is joined (mounted) to the circuit board, and is a dedicated member for joining (mounting) the antenna structure 1 to the circuit board. Since the antenna structure 1 is bonded and fixed to the circuit board not only by the fixing electrode 15 but also by the antenna mounting member 20, the bonding between the dielectric substrate 2 and the circuit board can be strengthened. In the third embodiment, the antenna mounting member 20 is formed with a through portion 23 having a through hole shape in the conductor plate portion 22 disposed inside the dielectric substrate 2. In the penetrating portion 23, similarly to the penetrating portion 12, the dielectric material constituting the dielectric substrate 2 is filled and formed during the insert molding of the dielectric substrate 2.

  In the embodiment shown in FIG. 4, the conductor plate portion 22 disposed inside the dielectric substrate 2 in the antenna mounting member 20 has a recess 11 (11 a, 11 b) formed on the bottom surface side of the dielectric substrate 2. However, of course, the conductor plate portion 22 of the antenna mounting member 20 may be embedded in the dielectric substrate 2.

  The fourth embodiment will be described below. The fourth embodiment relates to a wireless communication device, and the wireless communication device of the fourth embodiment is any one of the antenna structures 1 of the first to third embodiments. An antenna structure 1 is provided. There are various configurations other than the configuration related to the antenna structure in the wireless communication apparatus, and any configuration may be adopted here, and the description thereof is omitted. Moreover, since the structure of the antenna structure 1 was also mentioned above, the description is abbreviate | omitted.

  In addition, this invention is not limited to the form of each 1st-4th embodiment, Various embodiment can be taken. For example, in each of the first to fourth embodiments, the feed radiation electrode 3 and the parasitic radiation electrode 4 are each provided with a through portion 12 in the form of a through hole and a through portion 13 in the form of a through groove. However, only one of the through part (through hole) 12 and the through part (through groove part) 13 may be provided. In each of the first to fourth embodiments, the dielectric substrate 2 is provided with the feeding radiation electrode 3 and the non-feeding radiation electrode 4. However, only the feeding radiation electrode 3 is provided on the dielectric substrate 2. It is good also as a structure provided. Furthermore, although only one feeding radiation electrode 3 is provided on the dielectric substrate 2, a configuration in which a plurality of feeding radiation electrodes 3 are provided on the dielectric substrate 2 may be adopted. When a plurality of feeding radiation electrodes 3 are provided in this way, at least one feeding radiation electrode 3 is provided with one or both of a through part (through hole) 12 and a through part (through groove part) 13, The penetration portion is filled with the dielectric material of the dielectric substrate 2. Further, in each of the first to fourth embodiments, the through portions 12 and 13 are provided in both the feeding radiation electrode 3 and the parasitic radiation electrode 4, but for example, the feeding radiation electrode 3 and the parasitic radiation electrode. 4, through portions 12 and 13 are provided only on one side of the radiation electrode that is assumed to have a small electrode area and a low bonding strength with the dielectric substrate 2, and the dielectric of the dielectric substrate 2 is provided in the through portion. The body material may be filled and formed. Furthermore, in each of the first to fourth embodiments, the feed radiation electrode 3 and the parasitic radiation electrode 4 are provided with a plurality of through portions (through holes) 12. The number of through-holes 12 is appropriately determined in consideration of the bonding strength between the feeding radiation electrode 3 and the parasitic radiation electrode 4 and the dielectric substrate 2, the antenna characteristics of the feeding radiation electrode 3 and the parasitic radiation electrode 4, and the like. A good number. Further, the size of the penetrating portion 12 is the same, and an appropriate size may be used.

  Furthermore, in each of the second to fourth embodiments, both the feed radiation electrode 3 and the parasitic radiation electrode 4 have the drooping electrode portion 18, but one of the feed radiation electrode 3 and the parasitic radiation electrode 4. Only the sagging electrode portion 18 may be provided. Further, the feeding radiation electrode 3 and the parasitic radiation electrode 4 have a plurality of drooping electrode portions 18, but the feeding radiation electrode 3 and the parasitic radiation electrode 4 have only one dripping electrode portion 18. Also good. Furthermore, each of the feed radiation electrode 3 and the non-feed radiation electrode 4 has a plurality of drooping electrode portions 18, and all the drooping electrode portions 18 are disposed along the side surface of the dielectric substrate 2. All of the sagging electrode portions 18 may be embedded in the dielectric base 2, or some of the sagging electrode portions 18 are embedded in the dielectric base 2, and the remaining sagging electrode portions are embedded. 18 may be arranged along the side surface of the dielectric substrate 2.

  Furthermore, in each of the second to fourth embodiments, the sagging electrode portion 18 has an equal electrode width from the upper surface side of the dielectric substrate 2 to the extending tip side. As shown in FIG. 5, a constricted portion 24 in which the electrode width is narrowed may be provided on the way from the upper surface side of the dielectric substrate 2 to the extending tip side. Further, for example, the sagging electrode portion 18 embedded in the dielectric substrate 2 has a constricted portion 24 without providing the through portion 12, and the constricted portion 24 provides an anchor function to the sagging electrode portion 18. You may have it.

  Further, in each of the second to fourth embodiments, the drooping electrode portion 18 is provided with the penetrating portion 12 in the form of a through hole. However, the dripping electrode portion 18 includes the penetrating portion (through hole) 12. Instead, the through portion 13 in the form of the through groove portion may be provided, or both the through portion (through hole) 12 and the through portion (through groove portion) 13 may be provided. Further, in each of the second to fourth embodiments, the penetrating portions 12 (13) are provided in all the drooping electrode portions 18, but only a part of the drooping electrode portions 18 selected in advance have penetrating portions. 12 (13) may be provided.

  Further, in each of the first to fourth embodiments, the concave portion 11 is formed on the bottom surface side of the dielectric substrate 2, but for example, in consideration of the strength enhancement of the dielectric substrate 2, It is good also as a structure in which the recessed part 11 is not provided. Furthermore, although the dielectric substrate 2 has a rectangular parallelepiped shape, the shape of the dielectric substrate 2 is not limited to a rectangular parallelepiped shape, and can take various shapes such as a cylindrical shape and a polygonal column shape. Moreover, although the opening shape of the penetration part (through-hole) 12 was circular shape, other shapes other than circular shapes, such as an ellipse shape, a square shape, and a polygon shape more than a pentagon, may be sufficient. Furthermore, the shapes of the feeding radiation electrode 3 and the non-feeding radiation electrode 4 can also take an appropriate shape, and are not limited to the shapes shown in FIGS.

  Furthermore, in each of the first to fourth embodiments, the portions extending in the direction along the side surface of the dielectric substrate 2 in each of the power supply terminal electrode 6 and the ground ground terminal electrodes 8 and 10 are dielectric. Although embedded in the body substrate 2, at least one of the power supply terminal electrode 6 and the ground ground terminal electrodes 8 and 10 is formed to extend in a direction along the side surface of the dielectric substrate 2. A configuration may be adopted in which the portion is exposed along the side surface of the dielectric substrate 2. Further, in each of the first to fourth embodiments, the feeding radiation electrode 3 is a λ / 4 type radiation electrode. However, in the present invention, the radiation electrode other than the λ / 4 type radiation electrode is a dielectric substrate. The present invention can also be applied to an antenna structure having a configuration formed on the upper surface.

It is a figure for demonstrating the antenna structure of the example of 1st Embodiment. It is a figure showing the cross-sectional example of the penetration part provided in the radiation electrode of the antenna structure of 1st Embodiment. It is a figure for demonstrating the antenna structure of the example of 2nd Embodiment. It is a figure for demonstrating the antenna structure of the example of 3rd Embodiment. It is a model figure showing the other example of a form of the drooping electrode part. It is a figure for demonstrating one example of a conventional antenna structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Antenna structure 2 Dielectric base | substrate 3 Feeding radiation electrode 4 Parasitic radiation electrode 6 Feeding terminal electrode 8, 10 Grounding terminal electrode 12, 13, 16, 23 Through part 18 Dripping electrode part 20 Antenna mounting member 24 Constriction part

Claims (6)

In an antenna structure having a configuration in which a radiation electrode composed of a conductor plate that performs antenna operation is integrally provided on the upper surface of a dielectric substrate by insert molding technology,
The radiation electrode is provided with a through portion including at least one of a through hole and a through groove portion that reaches the dielectric substrate from the surface of the radiation electrode, and the dielectric constituting the dielectric substrate is formed in the through portion. A structure in which the bonding between the radiation electrode and the dielectric substrate is strengthened by the material entering from the dielectric substrate side during the insert molding and filling and forming, and the penetration portion and the dielectric material of the dielectric substrate are bonded. And
The antenna structure according to claim 1, wherein the dielectric material that has entered the penetration portion does not protrude from the penetration portion to the surface of the radiation electrode.   The radiation electrode has a drooping electrode portion that extends from the upper surface of the dielectric substrate along with the side surface of the dielectric substrate or is bent inside the dielectric substrate, and the drooping electrode portion. Is provided with a through portion comprising at least one of a through hole and a through groove portion, and the inside of the through portion is filled with a dielectric material that constitutes the dielectric substrate to form a radiation electrode and a dielectric substrate. The antenna structure according to claim 1, wherein the bonding of the antenna is strengthened.   The radiation electrode has a drooping electrode portion that extends from the upper surface of the dielectric substrate along with the side surface of the dielectric substrate or is bent inside the dielectric substrate, and the drooping electrode portion. 3. The antenna structure according to claim 1, wherein the antenna structure has a constricted portion in which the electrode width becomes narrower in the middle from the upper surface side of the dielectric substrate toward the extending tip side.   A power supply terminal electrode extending in a direction along the side surface of the dielectric substrate is joined to a predetermined power supply portion of the radiation electrode, and the power supply terminal electrode is formed in a direction along the side surface of the dielectric substrate. A ground grounding terminal electrode extending through a gap is connected to the radiation electrode, and one or both of the power feeding terminal electrode and the ground grounding terminal electrode include a through hole and a through groove portion. At least one penetrating portion is provided, and the inside of the penetrating portion is filled with a dielectric material constituting the dielectric substrate, thereby strengthening the bonding between the radiation electrode and the dielectric substrate. The antenna structure according to claim 1, claim 2, or claim 3.   An antenna mounting member having a conductor plate portion exposed on the bottom surface of the dielectric substrate and a conductor plate portion extending from the conductor plate portion toward the inside of the dielectric substrate; A conductor plate portion disposed inside the dielectric base of the antenna mounting member is formed with a through portion including at least one of a through hole and a through groove, and the dielectric base is provided in the through portion. The antenna structure according to any one of claims 1 to 4, wherein the dielectric material is formed and filled.   A wireless communication apparatus comprising the antenna structure according to any one of claims 1 to 5.

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