JP2008231136A - Dip-molding composition and dip-molded article - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dip-molded article excellent in static prevention and suitable as uses such as gloves etc., used in a clean room and a dip-molding composition for obtaining the same. <P>SOLUTION: This dip-molding composition is provided by containing an epihalohydrin polymer. The epihalohydrin polymer may be an epihalohydrin/alkylene oxide copolymer. This dip-molding composition may be a solution or emulsion. The dip-molded article is obtained by dip-molding the dip-molding composition. The dip-molded article has suitably ≤10<SP>10</SP>Ω/square surface electric resistivity. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a dip-molding composition and a dip-molded product. More specifically, the present invention relates to a dip-molded article having excellent antistatic properties suitable for uses such as gloves used in a clean room, and a dip-molding composition for obtaining the same.

As various performance requirements for precision electronic parts become stricter, the level of cleanliness and antistatic properties required for various products used in a clean room in which these are manufactured or used are further increased.
As gloves used when workers handle electronic components in a clean room, rubber gloves that have been dip-molded with natural rubber or acrylonitrile / butadiene copolymer latex have been washed with pure water or ultrapure water to produce dust. Gloves from which dust and dust are removed are used.

  However, natural rubber and acrylonitrile / butadiene copolymer have essentially high electrical insulation properties, and ionic substances having an antistatic effect are removed by washing with pure water or ultrapure water. For this reason, gloves made of these polymers have a problem in that they are charged during work and generate static electricity, which adversely affects precision electronic components and semiconductor components.

  Accordingly, an object of the present invention is to provide a dip having excellent cleanliness and antistatic properties, which is suitable for work in a clean room, which is difficult to be charged even after washing with pure water or ultrapure water in order to improve cleanliness. It is to provide a molded article.

  As a result of intensive studies to achieve the above-mentioned problems, the present inventor has obtained a dip-molded product obtained by dip-molding a composition containing an epihalohydrin polymer, and has a low surface electrical resistivity. It has been found that the use of a molded product can satisfy the above requirements for cleanliness and antistatic properties, and the present invention has been completed based on this finding.

Thus, according to the present invention, there is provided a dip molding composition comprising an epihalohydrin polymer.
In the dip molding composition of the present invention, the epihalohydrin polymer is preferably an epihalohydrin / alkylene oxide copolymer, and in this case, the alkylene oxide is preferably ethylene oxide.
In the dip molding composition of the present invention, the epihalohydrin is preferably epichlorohydrin.
The dip molding composition of the present invention may further contain a crosslinking agent.
The dip molding composition of the present invention may have a solution shape or an emulsion shape.

Moreover, according to this invention, the dip molding product formed by dip-molding the said dip-forming composition of this invention is provided.
The dip-formed product of the present invention preferably has a surface electrical resistivity of 10 ¹⁰ Ω / square or less.

  The dip-molded product obtained from the dip-molding composition of the present invention has a low surface electrical resistivity, so it has excellent antistatic properties and is suitable for use in applications that require cleanliness such as work in a clean room. It is.

The dip molding composition of the present invention comprises an epihalohydrin polymer.
The epihalohydrin polymer is a polymer containing an epihalohydrin unit as an essential constituent monomer unit, and is a homopolymer or copolymer of an epihalohydrin or a copolymer of an epihalohydrin and a monomer copolymerizable therewith. .

Examples of the epihalohydrin include epichlorohydrin, epibromohydrin, epiiodohydrin, 2-methylepichlorohydrin, 2-methylepibromohydrin, 2-ethylepichlorohydrin, and the like.
These epihalohydrins may be used alone or in combination of two or more.
Among the epihalohydrins, epichlorohydrin is preferable.

  Examples of the monomer copolymerizable with epihalohydrin include alkylene oxide and unsaturated epoxide. The alkylene oxide and unsaturated epoxide may have a substituent such as a halogen atom.

Specific examples of the alkylene oxide include ethylene oxide, propylene oxide, 1,2-epoxybutane, 1,2-epoxy-4-chloropentane, 1,2-epoxyhexane, 1,2-epoxyoctane, and 1,2-epoxy. Linear or branched alkylene oxide such as decane, 1,2-epoxyoctadecane, 1,2-epoxyeicosane, 1,2-epoxyisobutane, 2,3-epoxyisobutane; 1,2-epoxychloropentane, 1 , 2-epoxycyclohexane, 1,2-epoxycyclododecane and other cyclic alkylene oxides;
An alkylene oxide may be used individually by 1 type, and may use 2 or more types together.
Of the alkylene oxides, linear alkylene oxides are preferable, ethylene oxide and propylene oxide are particularly preferable, and ethylene oxide is most preferable.

Specific examples of the unsaturated epoxide include unsaturated glycidyl ethers such as vinyl glycidyl ether, allyl glycidyl ether, vinyl cyclohexyl ether, o-allylphenyl glycidyl ether; butadiene epoxide, chloroprene epoxide, 4,5-epoxy-2-pentene, Diene monoepoxides such as epoxy-1-vinylcyclohexene and 1,2-epoxy-5,9-cyclododecadiene; glycidyl acrylate, glycidyl methacrylate, glycidyl crotonate, glycidyl-4-heptenate, glycidyl sorbate, glycidyl linoleate, Such as 3-cyclohexenecarboxylic acid glycidyl ester, 4-methyl-3-cyclohexenecarboxylic acid glycidyl ester, glycidyl-4-methyl-3-pentenate, etc. Glycidyl esters of ethylenic unsaturated carboxylic acids; and the like.
An unsaturated epoxide may be used individually by 1 type, and may use 2 or more types together.
Among the unsaturated epoxides, unsaturated glycidyl ether is preferable, and allyl glycidyl ether is particularly preferable.

  In the epihalohydrin polymer, the content ratio of the epihalohydrin monomer unit to the total monomer units constituting the epihalohydrin polymer is not particularly limited, but is preferably 20 to 100% by weight, more preferably 30 to 87% by weight, particularly preferably. 40 to 80% by weight. If the epihalohydrin monomer unit content is too small, the hygroscopic property of a dip-molded product obtained using this polymer is increased, which may make it unsuitable as a dip-molded product.

  In the epihalohydrin polymer, the content ratio of the alkylene oxide monomer unit to the total monomer units constituting the epihalohydrin polymer is not particularly limited, but is preferably 0 to 80% by weight, more preferably 10 to 60% by weight, and particularly preferably. Is 15 to 50% by weight. By setting the alkylene oxide monomer unit content within the above range, a dip-molded product having an excellent balance between surface electrical resistivity and hygroscopicity can be obtained.

  In the epihalohydrin polymer, the content ratio of the unsaturated epoxide monomer unit to the total monomer units constituting the epihalohydrin polymer is not particularly limited, but is preferably 0 to 30% by weight, more preferably 3 to 25% by weight, particularly Preferably, it is 5 to 20% by weight. By setting the unsaturated epoxide monomer unit content within the above range, a dip-molded product having an excellent balance between strength and elongation can be obtained.

The epihalohydrin polymer preferably has a Mooney viscosity (ML _{1 + 4} , 100 ° C.) of 10 to 200, more preferably 20 to 150.
If the Mooney viscosity is too low, the strength of the molded product is too low, which is not preferable. On the other hand, if the Mooney viscosity is too high, the viscosity at the time of dissolution may increase and the operability may be lowered.

The manufacturing method of an epihalohydrin polymer is not specifically limited.
Examples thereof include a method using a homogeneous catalyst as described in Japanese Patent Publication No. 35-15797 and Japanese Patent Publication No. 56-51171, Japanese Patent Publication No. 43-2945 and Japanese Patent Publication No. 45-7775. And a method using a heterogeneous catalyst as described in Japanese Patent Publication No.
In addition, as an epihalohydrin polymer, what is marketed can also be used.

The dip molding composition of the present invention may contain a crosslinking agent in addition to the epihalohydrin polymer. By containing a crosslinking agent, a dip-molded product having excellent strength can be obtained.
A crosslinking agent will not be specifically limited if it is normally used for bridge | crosslinking of an epihalohydrin polymer. Specific examples thereof include a sulfur compound, a diazine thiol compound, and a triazine thiol compound.

  Specific examples of the sulfur compound include powdered sulfur, sulfur white, precipitated sulfur, colloidal sulfur, surface-treated sulfur, insoluble sulfur and the like. These sulfur compounds may be used alone or in combination of two or more.

  Specific examples of the diazine thiol compound include 1,2-diazine-3,6-dithiol, 1,3-diazine-5,6-dithiol, 1,4-diazine-2,3-dithiol, methylamino-1. , 4-Diazine-2,3-dithiol, S, S-6-methylquinoxaline-2,3-diyldithiocarbonate and the like. These diazine thiol compounds may be used individually by 1 type, and may use 2 or more types together.

  Examples of the triazine thiol compound include derivatives of 1,3,5-triazine thiol. Specific examples thereof include 1,3,5-triazinethiol, 6-anilino-1,3,5-triazine-2,4-dithiol, 6-methylamino-1,3,5-triazine-2,4- Dithiol, 6-propylamino-1,3,5-triazine-2,4-dithiol, 6-butylamino-1,3,5-triazine-2,4-dithiol, 6-dibutylamino-1,3,5 -Triazine-2,4-dithiol, 6-hexylamino-1,3,5-triazine-2,4-dithiol, 6-octylamino-1,3,5-triazine-2,4-dithiol, 6-decylamino -1,3,5-triazine-2,4-dithiol and the like. These triazine thiol compounds may be used individually by 1 type, and may use 2 or more types together.

  In the dip molding composition of the present invention, the content of the crosslinking agent is not particularly limited, but is preferably 0.1 to 10% by weight, more preferably based on the weight of the epihalohydrin polymer in the dip molding composition. Is 0.2 to 5% by weight.

  In addition to the crosslinking agent, the dip-molding composition of the present invention comprises a crosslinking accelerator (carbamic acid compound and its zinc salt, benzothiazole compound, etc.) and a crosslinking assistant (zinc oxide, stearic acid and its Zinc salts, etc.), crosslinking retarders (thioimide compounds, polyvalent carboxylic acid compounds, etc.), anti-aging agents (benzimidazoles, nickel dibutyldithiocarbamate, etc.) and the like.

The dip molding composition of the present invention may be in the form of a solution or an emulsion.
The solvent in the case where the dip-forming composition is in the form of a solution is not particularly limited, but specific examples thereof include aromatic hydrocarbons such as benzene, toluene and xylene; direct solvents such as n-pentane and n-hexane. A chain saturated hydrocarbon; an alicyclic hydrocarbon such as cyclopentane and cyclohexane; and the like. Of these, aromatic solvents are preferable, and toluene is particularly preferable.
A dip-molding composition in the form of a solution can be obtained by dissolving an epihalohydrin polymer in a solvent and dissolving or dispersing various compounding agents used as necessary in the solution.
Moreover, it can obtain also by adding and mixing the various compounding agents used as needed to the epihalohydrin polymer solution obtained by the solution polymerization method.

The dip-molding composition in the form of an emulsion is a known general emulsification method such as forced emulsification method, phase inversion emulsification, or the like, obtained by dissolving an epihalohydrin polymer and various compounding agents used as necessary in a solvent. It can be obtained by emulsification by a method, a membrane emulsification method or the like.
Moreover, it can obtain also by adding and mixing the various compounding agents used as needed to the epihalohydrin polymer emulsion obtained by the emulsification operation.

Specifically, water and an emulsifier are added to a solvent solution of an epihalohydrin polymer, the epihalohydrin polymer is emulsified with strong stirring, and then the solvent is removed by a method such as steam distillation as necessary. One example is the method.
In the case of an epihalohydrin polymer, since an epihalohydrin polymer cannot be obtained directly by an emulsion polymerization method, an emulsion is obtained by this method.
Although the emulsifier used in this emulsification method is not specifically limited, A nonionic emulsifier and an anionic emulsifier are preferable, These emulsifiers may be used individually by 1 type and may use 2 or more types together.

  Examples of the emulsifier include nonionic emulsifiers such as polyoxyethylene alkyl ether, polyoxyethylene alkylphenol ether, polyoxyethylene alkyl ester, polyoxyethylene sorbitan alkyl ester; fatty acids such as myristic acid, palmitic acid, oleic acid, and linolenic acid. Salts, anionic emulsifiers such as alkylbenzene sulfonates such as sodium dodecylbenzenesulfonate, higher alcohol sulfates and alkylsulfosuccinates; cationic emulsifiers such as alkyltrimethylammonium chloride, dialkylammonium chloride and benzylammonium chloride; etc. Is mentioned. Of these, anionic emulsifiers are preferably used. Of these, alkylbenzene sulfonate is preferred. These emulsifiers may be used alone or in combination of two or more.

  The amount of the emulsifier used for the emulsification is usually 0.1 to 15 parts by weight, preferably 0.3 to 10 parts by weight, more preferably 0.5 to 8 parts by weight with respect to 100 parts by weight of the epihalohydrin polymer. . If the amount is too small, a stable emulsion cannot be obtained. If the amount is too large, the obtained emulsion is foamed vigorously and the strength of the resulting dip-molded product is undesirably reduced.

The dip-molded product of the present invention can be obtained by dip molding using the dip molding composition of the present invention.
Although the thickness of the dip-molded product of the present invention is not particularly limited, the thickness of the molding composition layer is preferably 0.05 to 5 mm, and more preferably 0.1 to 3 mm.
The dip-molding method is not particularly limited, and can be obtained, for example, by forming a dip-molded body layer made of the dip-molding composition of the present invention on a dip-molding mold.
In the dip molding, a first dip molding composition layer may be formed on a dip molding mold, and a second dip molding composition layer may be further formed thereon. At this time, the first dip molding composition and the second dip molding composition may be the same or different, and the dip molding composition of the present invention is laminated on the surface. On the other hand, different dip molding compositions may be used. Moreover, the layer of the composition for dip molding may be three or more layers.

The mold for dip molding may be any of porcelain, ceramic, metal, glass, plastic and the like.
When the dip-molded product is a glove, the mold has a shape corresponding to the contour of the human hand, depending on the purpose of use of the glove to be manufactured, from the wrist to the fingertip, from the elbow Various shapes such as a shape up to the fingertip can be used.

The dip-molded product of the present invention is preferably 10 ⁷ to 10 ¹⁰ Ω / square, more preferably 10 ⁸ to 5 when measured in an atmosphere of 20 ° C. and 65% relative humidity after being immersed in ultrapure water for 2 hours. It has a surface resistivity of 10 ¹⁰ Ω / square. Here, ultrapure water means water having a specific resistance at 25 ° C. of 16 MΩ · cm or more.
Since the dip-formed product of the present invention exhibits such a low surface resistivity even after being immersed in ultrapure water, it can be suitably used in the manufacture of precision electronic components and semiconductor components.

Specific examples of dip-molded products include, for example, nipples for baby bottles; medical supplies such as spoids and water pillows; toys and exercise tools such as balloons, dolls and balls; industrial articles such as pressure forming bags and gas storage bags Surgical, household, agricultural, fishery and industrial unsupported gloves and support gloves; finger sack; and the like.
Since the dip-molded product of the present invention has a low surface electrical resistivity, it can be suitably used as a glove for manufacturing precision electronic components and semiconductor components among the above-mentioned dip-molded products, and particularly suitable as a glove for use in a clean room. is there.

The present invention will be described more specifically with reference to the following examples. However, the present invention is not limited to these examples. In the examples, “%” and “parts” are based on weight unless otherwise specified.
Moreover, the evaluation method of each characteristic is as follows.

[Mooney viscosity]
The Mooney viscosity (ML _{1 + 4} , 100 ° C.) is measured according to JIS K6300.

(Ultra pure water cleaning)
A test piece of 10 cm × 10 cm was cut out from the palm of a rubber glove, and this was immersed in 500 ml of ultrapure water having a specific resistance of 18.3 MΩ · cm at 30 ° C. for 2 hours. dry.

[Surface electrical resistivity]
The surface electrical resistivity of the test piece is measured at a measurement voltage of 250 V on a test piece left for 24 hours or more in a constant temperature and humidity chamber at a temperature of 20 ° C. and a relative humidity of 65% according to ASTM D257-93. The measurement limit (upper limit) in this measurement is 5.65 × 10 ¹⁰ Ω / square.

(Production Example 1: Production of NBR latex)
In a polymerization reactor, 28 parts of acrylonitrile, 66 parts of 1,3-butadiene, 6 parts of methacrylic acid, 0.3 part of t-dodecyl mercaptan, 132 parts of ion-exchanged water, 3 parts of sodium dodecylbenzenesulfonate, β-naphthalenesulfonic acid Formalin condensate sodium salt 0.5 part, potassium persulfate 0.3 part and ethylenediaminetetraacetic acid sodium salt 0.05 part were charged, and the polymerization temperature was maintained at 37 ° C. to initiate the polymerization.
When the polymerization conversion reached 60%, 0.15 parts of t-dodecyl mercaptan was added to raise the polymerization temperature to 40 ° C., and then when the polymerization conversion reached 80%, t -0.15 part of dodecyl mercaptan was added to continue the polymerization reaction, and the reaction was continued until the polymerization conversion reached 94%. Thereafter, 0.1 part of sodium dimethyldithiocarbamate was added as a polymerization terminator to terminate the polymerization reaction.
After removing unreacted monomers from the obtained copolymer latex, the pH and solid content concentration of the copolymer latex were adjusted to obtain an NBR latex having a solid content concentration of 40% and a pH of 8.

(Production Example 2: Production of SBR latex)
In a polymerization reactor, 42 parts of styrene, 54 parts of 1,3-butadiene, 4 parts of methacrylic acid, 0.3 part of t-dodecyl mercaptan, 132 parts of ion-exchanged water, 3 parts of sodium dodecylbenzenesulfonate, β-naphthalenesulfonic acid Formalin condensate sodium salt 0.5 part, potassium persulfate 0.3 part and ethylenediaminetetraacetic acid sodium salt 0.05 part were charged, and the polymerization temperature was maintained at 60 ° C. to initiate the polymerization.
When the polymerization conversion reached 60%, 0.15 part of t-dodecyl mercaptan was added to raise the polymerization temperature to 70 ° C., and then when the polymerization conversion reached 80%, t -0.15 part of dodecyl mercaptan was added to continue the polymerization reaction, and the reaction was continued until the polymerization conversion reached 95%. Thereafter, 0.1 part of sodium dimethyldithiocarbamate was added as a polymerization terminator to terminate the polymerization reaction.
After removing unreacted monomers from the obtained copolymer latex, the pH and solid content concentration of the copolymer latex were adjusted to obtain an SBR latex having a solid content concentration of 40% and a pH of 8.

(Example 1)
Epichlorohydrin-allylglycidyl ether copolymer rubber (GCO) (manufactured by Nippon Zeon Co., Ltd., trade name “Zeklon 1100”, chlorine atom content 35.5%, Mooney viscosity (ML _{1 + 4} , 100 ° C.) 58) as a solid content A dip-molding composition in a solution state was obtained by dissolving in toluene so as to have a concentration of 20%. A glove hand mold was immersed in the dip molding composition to form a dip molding composition layer on the hand mold. The dip-molded product was left in an atmosphere of 120 ° C. for 30 minutes to remove toluene, and then removed from the hand mold while being inverted to obtain a rubber glove as a dip-molded product. The rubber gloves were washed with ultrapure water, and then the surface electrical resistivity was measured. The results are shown in Table 1.

(Example 2)
Epichlorohydrin-ethylene oxide-allyl glycidyl ether copolymer (GECO) (manufactured by Nippon Zeon Co., Ltd., trade name “Zeklon 3106”, chlorine atom content instead of epichlorohydrin-allyl glycidyl ether copolymer rubber (GCO) A dip-molding composition in a solution state was obtained in the same manner as in Example 1 except that 21.4% and Mooney viscosity (ML _{1 + 4} , 100 ° C.) 60) were used. A rubber glove as a dip-molded product was prepared from the dip-molding composition, and after washing the rubber glove with ultrapure water, the surface electrical resistivity was measured. The results are shown in Table 1.

(Example 3)
Epichlorohydrin-ethylene oxide-allyl glycidyl ether copolymer rubber (GECO) manufactured by Nippon Zeon Co., Ltd., trade name “Zeklon 3106”, chlorine atom content 21.4%, Mooney viscosity (ML _{1 + 4} , 100 ° C.) 60) It was dissolved in toluene so as to have a partial concentration of 20%. A GECO solution is mixed with a 1.5% aqueous solution of a surfactant (alkylbenzene sulfonate) so that the solid content concentration of the dissolved rubber is 10%, and an emulsifying disperser (trade name “Milder 303V” manufactured by Taiheiyo Kiko Co., Ltd.). )) Was circulated 10 times at 12,000 rpm at room temperature to obtain an emulsion. The obtained emulsion was heated to 80 to 90 ° C. under reduced pressure (−0.01 to −0.08 MPa) to distill off toluene and water, and then concentrated to obtain a solid content concentration of 45%. Thus, a dip-molding composition in an emulsion state was obtained.

  The glove hand mold heated to 60 ° C. was immersed in a 25% calcium nitrate aqueous solution (coagulant solution) and then dried at 60 ° C. for 10 minutes. The hand mold to which the coagulant was adhered was immersed in the dip molding composition in the emulsion state for 10 seconds to form a dip molding composition layer on the hand mold. After drying at 60 ° C. for 10 minutes, it was then washed with ion exchange water at 40 ° C. for 5 minutes and heated at 120 ° C. for 20 minutes. The obtained molded product was removed while being inverted from the hand mold to obtain a rubber glove as a dip-molded product. The rubber gloves were washed with ultrapure water, and then the surface electrical resistivity was measured. The results are shown in Table 1.

Example 4
1 part of sulfur, 0.5 part of 2-mercaptobenzothiazole zinc salt, 1.5 parts of zinc oxide, 1.5 parts of titanium oxide and 4.5 parts of water are dispersed using a dispersing agent to obtain a vulcanizing agent dispersion. Was prepared.
9 parts of the above vulcanizing agent dispersion was added to 200 parts of the dip molding composition in the emulsion state prepared in the same manner as in Example 3 to obtain a dip molding composition in the emulsion state. Using this dip molding composition, a rubber glove as a dip molded article was obtained in the same manner as in Example 3.
The surface electrical resistivity of this rubber glove was measured without washing with ultrapure water. The results are shown in Table 1.

(Example 5)
About the rubber glove as a dip-molded product obtained in the same manner as in Example 4, the surface electrical resistivity was measured after washing with ultrapure water. The results are shown in Table 1.

(Comparative Example 1)
Acrylonitrile-butadiene-methacrylic acid copolymer (NBR) (manufactured by Zeon Corporation, trade name “Nipol 1072J”, acrylonitrile content 27%, Mooney viscosity (ML _{1 + 4} , 100 ° C.) 48) to a solid content concentration of 15%. It melt | dissolved in methyl ethyl ketone and the composition for dip molding was obtained. Using this dip molding composition, rubber gloves were obtained in the same manner as in Example 1. The rubber gloves were washed with ultrapure water, and then the surface electrical resistivity was measured. The results are shown in Table 1.

(Comparative Example 2)
9 parts of a vulcanizing agent dispersion similar to that used in Example 4 was added to 250 parts of NBR latex obtained in Production Example 1 to obtain a dip molding composition. Using this dip molding composition, rubber gloves were obtained in the same manner as in Example 3. The surface electrical resistivity of this rubber glove was measured without washing with ultrapure water. The results are shown in Table 1.

(Comparative Example 3)
About the rubber glove as a dip-molded product obtained in the same manner as in Comparative Example 2, the surface electrical resistivity was measured after washing with ultrapure water. The results are shown in Table 1.

(Comparative Example 4)
A dip-molding composition was obtained in the same manner as in Comparative Example 2, except that the SBR latex obtained in Production Example 2 was used instead of the NBR latex obtained in Production Example 1. Using this dip molding composition, rubber gloves were obtained in the same manner as in Example 3. The rubber gloves were washed with ultrapure water, and then the surface electrical resistivity was measured. The results are shown in Table 1.

(Comparative Example 5)
A dip-molding composition was obtained in the same manner as in Comparative Example 2, except that natural rubber latex (NR latex) (manufactured by Regex Corp., solid content concentration 60%) was used instead of NBR latex. Using this dip molding composition, rubber gloves were obtained in the same manner as in Example 3. The rubber gloves were washed with ultrapure water, and then the surface electrical resistivity was measured. The results are shown in Table 1.

From Table 1, the following can be seen.
The rubber gloves obtained by dip molding using a conventional dip molding composition containing a polymer other than the epihalohydrin polymer of the present invention have a surface electrical resistivity exceeding 10 ¹⁰ Ω / square. (Comparative Examples 1-5).
In contrast, the dip-molded product obtained from the dip-molding composition comprising the epichlorohydrin polymer of the present invention has a surface electrical resistivity of 10 ¹⁰ Ω even when washed with ultrapure water. / Square or less (Examples 1 to 5).

Claims (9)

  A composition for dip molding comprising an epihalohydrin polymer.   The dip-forming composition according to claim 1, wherein the epihalohydrin polymer is an epihalohydrin / alkylene oxide copolymer.   The composition for dip molding according to claim 2, wherein the alkylene oxide is ethylene oxide.   The composition for dip molding according to any one of claims 1 to 3, wherein the epihalohydrin is epichlorohydrin.   Furthermore, the composition for dip shaping | molding of any one of Claims 1-4 formed by containing a crosslinking agent.   The dip molding composition according to any one of claims 1 to 5, which has a solution shape.   The dip-forming composition according to any one of claims 1 to 5, which has a shape of an emulsion.   A dip-molded product obtained by dip-molding the dip-molding composition according to any one of claims 1 to 7. The dip-molded product according to claim 8, which has a surface electrical resistivity of 10 ¹⁰ Ω / square or less.