JP2008223110A5 - - Google Patents

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Publication number
JP2008223110A5
JP2008223110A5 JP2007066112A JP2007066112A JP2008223110A5 JP 2008223110 A5 JP2008223110 A5 JP 2008223110A5 JP 2007066112 A JP2007066112 A JP 2007066112A JP 2007066112 A JP2007066112 A JP 2007066112A JP 2008223110 A5 JP2008223110 A5 JP 2008223110A5
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JP
Japan
Prior art keywords
module
processing apparatus
film processing
cathode
sputtering chamber
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Granted
Application number
JP2007066112A
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Japanese (ja)
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JP2008223110A (en
JP5034578B2 (en
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Publication date
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Priority to JP2007066112A priority Critical patent/JP5034578B2/en
Priority claimed from JP2007066112A external-priority patent/JP5034578B2/en
Publication of JP2008223110A publication Critical patent/JP2008223110A/en
Publication of JP2008223110A5 publication Critical patent/JP2008223110A5/ja
Application granted granted Critical
Publication of JP5034578B2 publication Critical patent/JP5034578B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (5)

スパッタ室と、ターゲットを保持するカソードと、前記カソードに接続された電源と、前記スパッタ室と隣接しかつ気密的に仕切るバルブ機構を介して設けられたロードロック室と、前記スパッタ室内に配置されかつ複数のワークを保持可能な機構を有すると共に着脱可能なモジュールと、前記モジュールを前記スパッタ室とロードロック室との間で搬送する搬送機構とで構成される薄膜処理装置であって、
前記モジュールは前記カソードと対向して配置されかつ複数のワークをそれぞれ自公転させる回転ギヤ機構を具備し、前記スパッタ室は前記モジュールを保持する保持機構を有すると共に前記ワークを自公転させる回転駆動を伝達可能な回転機構を具備し、かつ、モジュールの幅長は、カソードのうちターゲットを保持する面の幅長と略同一であり、前記モジュールの中心と前記カソードの中心とがずれて構成されること
を特徴とする薄膜処理装置。 A sputtering chamber, a cathode for holding a target, a power source connected to the cathode, a load lock chamber provided via a valve mechanism that is adjacent to the sputtering chamber and hermetically partitions, and is disposed in the sputtering chamber. And a thin film processing apparatus comprising a module that has a mechanism capable of holding a plurality of workpieces and is removable, and a transport mechanism that transports the module between the sputtering chamber and the load lock chamber,
The module is disposed to face the cathode and includes a rotation gear mechanism that revolves and revolves a plurality of workpieces, and the sputtering chamber has a holding mechanism that holds the module and rotates and revolves the workpieces. It has a transmission mechanism that can transmit , and the width of the module is substantially the same as the width of the surface of the cathode that holds the target, and the center of the module is shifted from the center of the cathode. it <br/> film processing apparatus according to claim. モジュールは固定ステージ側に外輪ギヤ、ワーク搭載側に内輪ギヤを具備すること
を特徴とする請求項１に記載の薄膜処理装置。 2. The thin film processing apparatus according to claim 1, wherein the module includes an outer ring gear on the fixed stage side and an inner ring gear on the workpiece mounting side. モジュールのワークホルダ部に絶縁部材が用いられること
を特徴とする請求項１または２に記載の薄膜処理装置。 Film processing apparatus according to claim 1 or 2, characterized in insulating member be used in the work holder of the module. モジュールのワークを保持する表面はアルマイト処理が施されていること
を特徴とする請求項１〜３の何れか一項に記載の薄膜処理装置。 The thin film processing apparatus according to any one of claims 1 to 3 , wherein the surface for holding the workpiece of the module is anodized. モジュールはワークの公転半径または自公転比をワークの自公転回転機構のみ交換可能であること
を特徴とする請求項１〜４の何れか一項に記載の薄膜処理装置。 Module film processing apparatus according to any one of claims 1-4, characterized in that the interchangeable revolution radius or revolving ratio of the work only revolving rotation mechanism of the workpiece.
JP2007066112A 2007-03-15 2007-03-15 Thin film processing equipment Expired - Fee Related JP5034578B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007066112A JP5034578B2 (en) 2007-03-15 2007-03-15 Thin film processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007066112A JP5034578B2 (en) 2007-03-15 2007-03-15 Thin film processing equipment

Publications (3)

Publication Number Publication Date
JP2008223110A JP2008223110A (en) 2008-09-25
JP2008223110A5 true JP2008223110A5 (en) 2009-05-28
JP5034578B2 JP5034578B2 (en) 2012-09-26

Family

ID=39842063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007066112A Expired - Fee Related JP5034578B2 (en) 2007-03-15 2007-03-15 Thin film processing equipment

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JP (1) JP5034578B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011016549A1 (en) * 2009-08-07 2013-01-17 綜研化学株式会社 Resin mold for imprint and manufacturing method thereof
JP5727073B1 (en) * 2014-06-03 2015-06-03 株式会社シンクロン Portable rotating apparatus and film forming apparatus
CN112992690B (en) * 2021-02-08 2024-03-19 杭州航鹏机电科技有限公司 Integrated circuit manufacturing process
CN113086641B (en) * 2021-03-16 2023-01-10 深圳市华星光电半导体显示技术有限公司 Conveying device
CN114232061B (en) * 2021-11-25 2024-02-09 太仓市金鹿电镀有限公司 Homogenizing plastic electroplating production line and working method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0356668A (en) * 1989-07-24 1991-03-12 Ricoh Co Ltd Sputtering device
JPH0487331A (en) * 1990-07-31 1992-03-19 Tokyo Electron Ltd Treatment apparatus
JPH0673538A (en) * 1992-05-26 1994-03-15 Kobe Steel Ltd Arc ion plating device
JP3160229B2 (en) * 1997-06-06 2001-04-25 日本エー・エス・エム株式会社 Susceptor for plasma CVD apparatus and method for manufacturing the same
JP4656744B2 (en) * 2000-03-09 2011-03-23 キヤノンアネルバ株式会社 Sputtering equipment
JP2001254171A (en) * 2000-03-13 2001-09-18 Nissin Electric Co Ltd Arc-type ion plating apparatus
JP4421103B2 (en) * 2000-12-27 2010-02-24 東京エレクトロン株式会社 Etching method

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