JP2008218575A - Electronic controller - Google Patents

Electronic controller Download PDF

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JP2008218575A
JP2008218575A JP2007051910A JP2007051910A JP2008218575A JP 2008218575 A JP2008218575 A JP 2008218575A JP 2007051910 A JP2007051910 A JP 2007051910A JP 2007051910 A JP2007051910 A JP 2007051910A JP 2008218575 A JP2008218575 A JP 2008218575A
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Prior art keywords
hole
electronic circuit
terminal
resin substrate
control device
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JP4914247B2 (en
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Toshikazu Shigyo
俊和 執行
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Hitachi Ltd
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Hitachi Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic controller with a small number of components, with less assembling processes, with high production efficiency, and at the high degree of freedom in design. <P>SOLUTION: The electronic controller includes: an electronic circuit sealing member which is obtained by covering an electronic circuit part and a terminal, electrically connected to the electronic circuit part and having a press fit part, through the use of a sealing material so as to expose a part of the terminal; and a resin board with an inner layer pattern arranged therein. The resin board includes a first through-hole, to which the press fit part of the terminal is press-fitted, and a second through-hole to be connected to an external load. The first through-hole is connected to the second through-hole with the use of the inner layer pattern. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子制御装置に関し、例えば、油中環境下で使用される自動車用電子制御装置に関する。   The present invention relates to an electronic control device, for example, an automotive electronic control device used under an oil-in-water environment.

例えば、自動車用電子制御装置、特にオートマチックトランスミッションの制御装置は、油中環境下で使用されるものがある。このような電子制御装置は、油による影響を防ぐために、電子回路部を樹脂で覆う必要がある。例えば、ベース部材に搭載された電子回路部とターミナルを接続させた後、当該ターミナルの一部を露出させるように封止材で覆って電子回路封入部材を形成し、同ターミナルとセンサ等の外部負荷への配線部とを電気的に接続する。このような電子制御装置においてセンサ等の外部負荷に接続するための配線構造として、特許文献１が知られている。この従来構造は、電子回路封入部材から延びるターミナルと、開口部を有するコネクタとをインサートモールドによって一体成形し、このコネクタにおいてターミナルと外部負荷との接続を行うようになっている。さらに、この従来構造では、電子回路封入部材が備える配線材にバスバーによる配線板を溶接で接続して電気的に接続させる構成としている。   For example, there are electronic control devices for automobiles, particularly control devices for automatic transmissions, which are used under an oil-in-water environment. Such an electronic control apparatus needs to cover an electronic circuit part with resin in order to prevent the influence by oil. For example, after connecting an electronic circuit unit mounted on a base member and a terminal, an electronic circuit enclosing member is formed by covering the terminal with a sealing material so that a part of the terminal is exposed, Electrical connection to the wiring to the load. Patent Document 1 is known as a wiring structure for connecting to an external load such as a sensor in such an electronic control device. In this conventional structure, a terminal extending from an electronic circuit enclosing member and a connector having an opening are integrally formed by insert molding, and the terminal and an external load are connected in this connector. Furthermore, in this conventional structure, the wiring board provided with the electronic circuit enclosing member is connected to the wiring board by the bus bar by welding to be electrically connected.

特開２００４−０６３３６６号公報JP 2004-063366 A

上述した特許文献１の構造においては、配線材と開口部を有するコネクタとを一体成形したコネクタモジュールの基材部に回路基板を接着し、回路基板と配線材とを電気的に接続した後、回路基板と、配線材と回路基板の接続部とを、二重成形により樹脂封止した構成をとっている。このため、電子回路封入部材のコネクタに嵌合する相手側のコネクタと、外部負荷と接続するためのコネクタを有したハーネスとが必要となり、さらに、外部負荷側にもコネクタを設ける必要があるため、部品点数が多くなり、したがって組立工程も増えるという問題があった。ハーネスは多量の銅を使用するため高価で重く、タイムラグや、ノイズなどの問題もあった。また、使用されるコネクタやハーネスは、油中環境で使用できる防水性又は耐油性仕様のものが必要となるため、材料のグレードを高くしなければならず、コストが高くなるという問題もあった。また、二重成形をしなければならないので、樹脂成形の設備を二種類準備するために生産設備投資のコストが高くなると共に、２回成形しなければならないために生産効率が低下するという問題もあった。また、負荷の位置が変わるたびに形状が変わるので、そのつど金型を変える必要があり、設計自由度が低いという問題もあった。   In the structure of Patent Document 1 described above, after bonding the circuit board to the base part of the connector module formed integrally with the wiring member and the connector having the opening, and electrically connecting the circuit board and the wiring member, The circuit board, the wiring material, and the connection part of the circuit board are sealed with resin by double molding. For this reason, a mating connector that fits into the connector of the electronic circuit enclosing member and a harness that has a connector for connecting to an external load are required, and a connector must also be provided on the external load side. There is a problem that the number of parts increases, and therefore the assembly process also increases. Since the harness uses a large amount of copper, it is expensive and heavy, and there are problems such as time lag and noise. In addition, the connectors and harnesses used must be waterproof or oil-proof specifications that can be used in an oil-in-water environment, so there is a problem that the material grade must be increased and the cost is increased. . In addition, since double molding is required, the cost of investment in production equipment is increased to prepare two types of resin molding equipment, and production efficiency is reduced because molding is performed twice. there were. In addition, since the shape changes each time the load position changes, there is a problem that the mold needs to be changed each time and the degree of freedom in design is low.

本発明は、上述した点に鑑み、部品点数が少なく、組立工程が少なくて生産効率が高く、設計自由度が高い電子制御装置を提供することを目的とする。   In view of the above-described points, an object of the present invention is to provide an electronic control device having a small number of parts, a small number of assembly steps, high production efficiency, and high design freedom.

上記課題を解決するため、本発明の電子制御装置は、電子回路部と、前記電子回路部と電気的に接続され、プレスフィット部を有するターミナルとを、前記ターミナルの一部が露出するように封止材で覆って成る電子回路封入部材と、内層パターンが設けられた樹脂基板とを備え、前記樹脂基板は、前記ターミナルのプレスフィット部が圧入される第１のスルーホールと、外部負荷に接続される第２のスルーホールとを有し、前記第１のスルーホールと第２のスルーホールとを前記内層パターンによって接続したことを特徴とする。スルーホールへの圧入と内層パターンにより配線を行うため、外部負荷に接続するためのコネクタやハーネスが不要になり、部品点数を少なくでき、樹脂成形は１回で済むため、組立工程を簡素化でき、生産効率を向上させることができる。   In order to solve the above-described problems, an electronic control device according to the present invention provides an electronic circuit unit and a terminal that is electrically connected to the electronic circuit unit and has a press-fit unit so that a part of the terminal is exposed. An electronic circuit encapsulating member that is covered with a sealing material and a resin substrate provided with an inner layer pattern, the resin substrate having a first through hole into which a press-fit portion of the terminal is press-fitted, and an external load And a second through hole to be connected, wherein the first through hole and the second through hole are connected by the inner layer pattern. Wiring is done by press-fitting into the through hole and the inner layer pattern, eliminating the need for connectors and harnesses for connecting to external loads, reducing the number of parts, and requiring only one resin molding, simplifying the assembly process , Production efficiency can be improved.

さらに、樹脂基板の内層パターンで配線するため、油中環境下での夾雑物によるショートの危険性が減少する。   Furthermore, since wiring is performed with the inner layer pattern of the resin substrate, the risk of short-circuiting due to contaminants in an oil-in-water environment is reduced.

本発明によれば、部品点数が少なく、組立工程が少なくて生産効率が高く、設計自由度が高い電子制御装置が実現する。   According to the present invention, an electronic control device with a small number of parts, a small assembly process, high production efficiency, and high design freedom is realized.

以下、本発明の実施の形態を、図面を参照して説明する。
先ず、第１の実施の形態を図１及び２を参照して説明する。図１は、本発明の電子制御装置の第１の実施の形態を示す斜視図であり、図２はその断面図である。本電子制御装置は、電子回路封入部材１と、樹脂基板４と、固定部材５とを備える。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, a first embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing a first embodiment of an electronic control device of the present invention, and FIG. 2 is a sectional view thereof. The electronic control device includes an electronic circuit enclosing member 1, a resin substrate 4, and a fixing member 5.

電子回路封入部材１は、電子回路部３１をベース部材３上に配置し、電子回路部の端子をワイヤボンディングによってターミナル２に電気的に接続したものを、エポキシ樹脂等の封止材によってターミナル２の一部とベース部材３の一部を露出させて被覆して形成したものである。ターミナル２は、銅等の導電性の材料から成り、油等による腐食を防ぐため、金等のめっきが施されており、先端近くには弾性部位（プレスフィット部）２１が設けられている。ターミナル２は、ベース部材３の電子回路部搭載面に平行に延び、途中の所定の位置で前記電子回路部搭載面に垂直方向に折り曲げられる。ターミナル２のプレスフィット部２１は、後述する樹脂基板４の第１のスルーホール４１に圧入され、電気的に接続される。ベース部材は、後述する固定部材５への取り付けのためと、放熱のためのフランジとしての機能も有する。オートマチックトランスミッション用の電子制御装置等の場合、電子回路封入部材１が大型なため、特にこれが必要となる。電子回路封入部材１が小さい場合や用途によっては必要ない場合もある。   In the electronic circuit encapsulating member 1, an electronic circuit portion 31 is arranged on the base member 3, and the terminals of the electronic circuit portion are electrically connected to the terminal 2 by wire bonding, and the terminal 2 is sealed with a sealing material such as epoxy resin. And a part of the base member 3 are exposed and covered. The terminal 2 is made of a conductive material such as copper and is plated with gold or the like to prevent corrosion due to oil or the like. An elastic part (press fit part) 21 is provided near the tip. The terminal 2 extends in parallel with the electronic circuit portion mounting surface of the base member 3 and is bent in the vertical direction on the electronic circuit portion mounting surface at a predetermined position in the middle. The press-fit portion 21 of the terminal 2 is press-fitted into a first through hole 41 of the resin substrate 4 described later and is electrically connected. The base member also has a function as a flange for attaching to the fixing member 5 described later and for radiating heat. In the case of an electronic control device or the like for an automatic transmission, this is particularly necessary because the electronic circuit enclosing member 1 is large. The electronic circuit enclosing member 1 may not be necessary depending on the case or the application.

樹脂基板４は、例えばガラスエポキシ樹脂から成り、銅等の材料による内層パターン４３が形成されている。樹脂基板４には、内層パターン４３がある位置において第１のスルーホール４１及び第２のスルーホール４２が設けられている。第１及び第２のスルーホール４１及び４２の内壁は銅等から成り、内層パターン４３と電気的に接続されており、油等による腐食を防ぐため、金等のめっきが施されている。第１のスルーホール４１は、ターミナル２の先端に対応する位置に設けられており、上述したようにターミナル２のプレスフィット部２１が圧入される。第２のスルーホール４２は、外部負荷７を取り付けるためのものである。さらに樹脂基板４には、後述するねじ６によって固定部材５と固定するための穴４４が設けられている。   The resin substrate 4 is made of, for example, glass epoxy resin, and has an inner layer pattern 43 formed of a material such as copper. The resin substrate 4 is provided with a first through hole 41 and a second through hole 42 at a position where the inner layer pattern 43 is present. The inner walls of the first and second through holes 41 and 42 are made of copper or the like, and are electrically connected to the inner layer pattern 43, and are plated with gold or the like to prevent corrosion due to oil or the like. The first through hole 41 is provided at a position corresponding to the tip of the terminal 2, and the press-fit portion 21 of the terminal 2 is press-fitted as described above. The second through hole 42 is for attaching the external load 7. Further, the resin substrate 4 is provided with a hole 44 for fixing to the fixing member 5 with a screw 6 described later.

固定部材５は、樹脂基板４をオートマチックトランスミッションのオイル槽等に固定するためのものである。固定部材５には、ねじ穴５１が設けられている。固定部材５の材質は、ねじ穴５１を設けるためのタップ加工を行えるならば、金属でも樹脂でもかまわない。   The fixing member 5 is for fixing the resin substrate 4 to an oil tank or the like of an automatic transmission. The fixing member 5 is provided with a screw hole 51. The material of the fixing member 5 may be metal or resin as long as tapping for providing the screw holes 51 can be performed.

ターミナル２のプレスフィット部２１が樹脂基板４の第１のスルーホール４１に圧入された状態で、ベース部材３と樹脂基板４は、ねじ６によって固定部材５に固定される。   The base member 3 and the resin substrate 4 are fixed to the fixing member 5 with screws 6 in a state where the press-fit portion 21 of the terminal 2 is press-fitted into the first through hole 41 of the resin substrate 4.

外部負荷７は、樹脂基板４の第２のスルーホール４２に圧入される。これにより、電子回路３１と外部負荷７とは、ターミナル２、第１のスルーホール４１、内層パターン４３、第２のスルーホール４２を介して電気的に接続される。外部負荷７は、例えば、センサ、スイッチ、ソレノイド、ランプ、リレー等である。   The external load 7 is press-fitted into the second through hole 42 of the resin substrate 4. Thereby, the electronic circuit 31 and the external load 7 are electrically connected through the terminal 2, the first through hole 41, the inner layer pattern 43, and the second through hole 42. The external load 7 is, for example, a sensor, a switch, a solenoid, a lamp, or a relay.

本実施の形態によれば、電子回路封入部材１との配線で、防水性又は耐油正を備えた高価で重いコネクタやハーネスを介した外部負荷７への接続配線を設ける必要がなく、樹脂基板４とターミナル２を接続させる簡単な構造なので、部品点数が削減され、組立工程が簡単になり、生産効率が高くなる。また、内層パターン４３を用いることで、設計自由度を高くすることができる。   According to the present embodiment, it is not necessary to provide a connection wiring to the external load 7 via an expensive and heavy connector or harness having waterproofness or oil resistance, and wiring with the electronic circuit encapsulating member 1. The simple structure connecting the terminal 4 and the terminal 2 reduces the number of parts, simplifies the assembly process, and increases the production efficiency. Further, the use of the inner layer pattern 43 can increase the degree of freedom in design.

立体配線の内層パターン４３を設けることができる積層構造の樹脂基板４を用いれば、クロス配線ができ、さらに設計自由度を上げることができる。   If the resin substrate 4 having a laminated structure in which the inner layer pattern 43 of the three-dimensional wiring can be provided, the cross wiring can be performed and the design flexibility can be further increased.

次に、第２の実施の形態を図３及び４を参照して説明する。図３は、本発明の電子制御装置の第２の実施の形態の構成を示す斜視図であり、図４はその断面図である。この第２の実施の形態の基本的な構成は第１の実施の形態と同様である。第１の実施の形態と異なる点は、第１の実施の形態において、ベース部材３の電子回路部搭載面に平行に延びたターミナル２が、所定の位置において前記電子回路部搭載面に垂直方向に折り曲げらる、すなわち、ターミナル２の先端が１本の直線上に並ぶのに対し、第２の実施の形態では、ベース部材３の電子回路部搭載面に平行に延びたターミナル２が、交互に前記電子回路封入部材からの距離が異なった位置において前記電子回路部搭載面に垂直方向に折り曲げられる、すなわち、ターミナル２の先端が複数の直線上に並ぶ点である。樹脂基板４の第１のスルーホール４１も、これに対応した位置に設ける。このような千鳥形状を取ることによって、ターミナル２と樹脂基板４との接続部において隣り合うターミナル２間の沿面距離を長くすることができ、金属片等の夾雑物によってターミナル２がショートする危険性を減らすことができる。なお、図においてはターミナル２が曲がる位置は２つだが、３つ以上にしてもよい。   Next, a second embodiment will be described with reference to FIGS. FIG. 3 is a perspective view showing a configuration of the second embodiment of the electronic control device of the present invention, and FIG. 4 is a sectional view thereof. The basic configuration of the second embodiment is the same as that of the first embodiment. The difference from the first embodiment is that, in the first embodiment, the terminal 2 extending parallel to the electronic circuit portion mounting surface of the base member 3 is perpendicular to the electronic circuit portion mounting surface at a predetermined position. In other words, in the second embodiment, the terminals 2 extending in parallel with the electronic circuit portion mounting surface of the base member 3 are alternately arranged. Further, the electronic circuit portion mounting surface is bent in a direction perpendicular to the electronic circuit portion mounting surface at a position where the distance from the electronic circuit enclosing member is different, that is, the tip of the terminal 2 is aligned on a plurality of straight lines. The first through hole 41 of the resin substrate 4 is also provided at a position corresponding to this. By adopting such a staggered shape, the creeping distance between adjacent terminals 2 can be increased at the connection portion between the terminal 2 and the resin substrate 4, and there is a risk that the terminal 2 will be short-circuited by foreign objects such as metal pieces. Can be reduced. In the figure, the terminal 2 is bent at two positions, but may be three or more.

次に、第３の実施の形態を図５を参照して説明する。図５は、本発明の電子制御装置の第３の実施の形態の構成を示す断面図である。この第２の実施の形態の基本的な構成は第１及び２の実施の形態と同様である。第１及び２の実施の形態と異なる点は、ターミナル２のプレスフィット部を樹脂基板４の第１のスルーホール４１に圧入し、樹脂基板４をねじ６によって固定部５に固定した状態で、樹脂基板４の裏側に突き出た複数のターミナル２の部分を互いに分離する穴部５１を固定部５に設けた点である。これにより、ターミナル２と固定部５との間の絶縁を保つことができる。さらに、これらの穴部５１を設けることにより、樹脂基板４と固定部５との間の空間にラビリンス構造を形成することができ、夾雑物の侵入を防ぐことができる。固定部材５の厚さが厚いほど、ラビリンス構造を確保することができる。穴部５１のサイズは、第１のスルーホール４１の断面積よりサイズが大きいことが望ましい。穴部５１は任意の形状でよく、円形でも矩形でもよい。   Next, a third embodiment will be described with reference to FIG. FIG. 5 is a sectional view showing the configuration of the third embodiment of the electronic control unit of the present invention. The basic configuration of the second embodiment is the same as that of the first and second embodiments. The difference from the first and second embodiments is that the press-fit portion of the terminal 2 is press-fitted into the first through hole 41 of the resin substrate 4 and the resin substrate 4 is fixed to the fixing portion 5 with the screws 6. The fixing portion 5 is provided with holes 51 for separating the portions of the plurality of terminals 2 protruding from the back side of the resin substrate 4. Thereby, the insulation between the terminal 2 and the fixing | fixed part 5 can be maintained. Furthermore, by providing these hole portions 51, a labyrinth structure can be formed in the space between the resin substrate 4 and the fixing portion 5, and entry of foreign matters can be prevented. The labyrinth structure can be secured as the fixing member 5 is thicker. The size of the hole 51 is preferably larger than the cross-sectional area of the first through hole 41. The hole 51 may have an arbitrary shape, and may be circular or rectangular.

本発明は、電子制御装置に利用可能であり、特にオートマチックトランスミッション用の電子制御装置に利用可能である。   The present invention can be used for an electronic control device, and in particular, can be used for an electronic control device for an automatic transmission.

本発明の電子制御装置の第１の実施形態の構成を示す斜視図である。It is a perspective view which shows the structure of 1st Embodiment of the electronic control apparatus of this invention. 本発明の電子制御装置の第１の実施形態の構成を示す断面図である。It is sectional drawing which shows the structure of 1st Embodiment of the electronic control apparatus of this invention. 本発明の電子制御装置の第２の実施形態の構成を示す斜視図である。It is a perspective view which shows the structure of 2nd Embodiment of the electronic control apparatus of this invention. 本発明の電子制御装置の第２の実施形態の構成を示す断面図である。It is sectional drawing which shows the structure of 2nd Embodiment of the electronic control apparatus of this invention. 本発明の電子制御装置の第３の実施形態の構成を示す断面図である。It is sectional drawing which shows the structure of 3rd Embodiment of the electronic control apparatus of this invention.

符号の説明Explanation of symbols

１ 電子回路封入部材
２ ターミナル
３ ベース部材
４ 樹脂基板
５ 固定部材
６ ねじ
７ 外部負荷
２１ プレスフィット部
３１ 電子回路部
４１ 第１のスルーホール
４２ 第２のスルーホール
４３ 内層パターン
４４ 穴
５１ ねじ穴 DESCRIPTION OF SYMBOLS 1 Electronic circuit enclosure member 2 Terminal 3 Base member 4 Resin board 5 Fixing member 6 Screw 7 External load 21 Press fit part 31 Electronic circuit part 41 First through hole 42 Second through hole 43 Inner layer pattern 44 Hole 51 Screw hole

Claims (9)

電子回路部と、前記電子回路部と電気的に接続され、プレスフィット部を有するターミナルとを、前記ターミナルの一部が露出するように封止材で覆って成る電子回路封入部材と、
内層パターンが設けられた樹脂基板とを備え、
前記樹脂基板は、前記ターミナルのプレスフィット部が圧入される第１のスルーホールと、外部負荷に接続される第２のスルーホールとを有し、前記第１のスルーホールと第２のスルーホールとを前記内層パターンによって接続したことを特徴とする電子制御装置。 An electronic circuit enclosing member that is electrically connected to the electronic circuit portion and a terminal having a press-fit portion and is covered with a sealing material so that a part of the terminal is exposed;
A resin substrate provided with an inner layer pattern,
The resin substrate has a first through hole into which the press-fit portion of the terminal is press-fitted and a second through hole connected to an external load, and the first through hole and the second through hole. Are connected by the inner layer pattern. ベース部材と、ベース部材に搭載された電子回路部と、前記電子回路部と電気的に接続され、プレスフィット部を有するターミナルとを、前記ターミナルの一部と前記ベース部材の一部が露出するように封止材で覆って成る電子回路封入部材と、
内層パターンが設けられた樹脂基板とを備え、
前記樹脂基板は、前記ターミナルのプレスフィット部が圧入される第１のスルーホールと、外部負荷に接続される第２のスルーホールとを有し、前記第１のスルーホールと第２のスルーホールとを前記内層パターンによって接続したことを特徴とする電子制御装置。 A base member, an electronic circuit portion mounted on the base member, and a terminal electrically connected to the electronic circuit portion and having a press-fit portion, a part of the terminal and a part of the base member are exposed. An electronic circuit encapsulating member covered with a sealing material,
A resin substrate provided with an inner layer pattern,
The resin substrate has a first through hole into which the press-fit portion of the terminal is press-fitted and a second through hole connected to an external load, and the first through hole and the second through hole. Are connected by the inner layer pattern. 前記ターミナルは、前記ベース部材の前記電子回路部搭載面に平行に延び、途中の所定の位置で前記電子回路部搭載面に垂直方向に折り曲げられていることを特徴とする請求項２記載の電子制御装置。   3. The electronic device according to claim 2, wherein the terminal extends in parallel with the electronic circuit unit mounting surface of the base member, and is bent in a direction perpendicular to the electronic circuit unit mounting surface at a predetermined position in the middle. Control device. 前記ターミナルは、交互に前記電子回路封入部材からの距離が異なる位置において折り曲げられていることを特徴とする請求項３記載の電子制御装置。   4. The electronic control device according to claim 3, wherein the terminals are alternately bent at positions at different distances from the electronic circuit enclosing member. 前記樹脂基板を固定する固定部材をさらに備えることを特徴とする請求項２乃至４のいずれか１項に記載の電子制御装置。   The electronic control device according to claim 2, further comprising a fixing member that fixes the resin substrate. 前記ベース部材は、前記電子回路封入部材から露出した部分において前記樹脂基板と共に前記固定部材にねじによって固定されることを特徴とする請求項５記載の電子制御装置。   6. The electronic control device according to claim 5, wherein the base member is fixed to the fixing member together with the resin substrate by a screw at a portion exposed from the electronic circuit sealing member. 前記固定部材は、前記樹脂基板と固定された状態で、前記樹脂基板から突き出た前記ターミナルを互いに分離する穴部を有することを特徴とする請求項５又は６に記載の電子制御装置。   The electronic control device according to claim 5, wherein the fixing member has a hole portion that separates the terminals protruding from the resin substrate while being fixed to the resin substrate. 前記樹脂基板はガラスエポキシ樹脂から成ることを特徴とする請求項１乃至７のいずれか１項に記載の電子制御装置。   The electronic control device according to claim 1, wherein the resin substrate is made of glass epoxy resin. オートマチックトランスミッション用であることを特徴とする請求項１乃至８のいずれか１項に記載の電子制御装置。   9. The electronic control device according to claim 1, wherein the electronic control device is for an automatic transmission.
JP2007051910A 2007-03-01 2007-03-01 Electronic control device Expired - Fee Related JP4914247B2 (en)

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Cited By (1)

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JPS6169195A (en) * 1984-09-13 1986-04-09 株式会社東芝 Method of mounting integrated circuit device
JP2004134491A (en) * 2002-10-09 2004-04-30 Fujitsu Ten Ltd Electronic control device
JP2004356180A (en) * 2003-05-27 2004-12-16 Nissan Motor Co Ltd Press-fit pin mounting board and press-fit pin connection inspecting method

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JPS6169195A (en) * 1984-09-13 1986-04-09 株式会社東芝 Method of mounting integrated circuit device
JP2004134491A (en) * 2002-10-09 2004-04-30 Fujitsu Ten Ltd Electronic control device
JP2004356180A (en) * 2003-05-27 2004-12-16 Nissan Motor Co Ltd Press-fit pin mounting board and press-fit pin connection inspecting method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017028195A (en) * 2015-07-27 2017-02-02 三菱電機株式会社 Semiconductor device
CN106409794A (en) * 2015-07-27 2017-02-15 三菱电机株式会社 Semiconductor device
US11323041B2 (en) 2015-07-27 2022-05-03 Mitsubishi Electric Corporation Semiconductor device

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