JP2008217215A - Non-contact ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC card with an organic EL light emission panel for performing display corresponding to information stored in a memory of an IC chip of a non-contact IC card in communication with an external non-contact reader/writer to enable visually confirming the display from a card surface. <P>SOLUTION: A non-contact IC card 1 includes an IC chip 3 provided with a memory, a control circuit and a transmission/reception circuit, and an antenna coil 11 electrically connected to the IC chip 3, in a thin-plate shaped card base substance 10. In the IC card 1 having an organic EL light emission panel 20 connected to an output port of the IC chip 3 and controlled by the IC chip, the base substance 10 further includes an antenna coil 12 supplying operation electric power to the panel 20, and a chip 4 for organic EL control. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a non-contact IC card incorporating an organic EL (electroluminescence) light emitting panel. Specifically, two IC circuits comprising an antenna coil and an integrated circuit (IC chip) are mounted on one IC card. One IC circuit functions as a circuit of a normal non-contact IC card, and the other one IC. The circuit relates to a non-contact IC card that functions as a circuit for supplying power to the organic EL light emitting panel.

  Non-contact IC cards have come to be used widely because they have a much larger storage capacity than conventional magnetic cards and have a high anti-counterfeit effect. In particular, non-contact IC cards that do not require contact communication with a reader / writer have been widely adopted for various applications including transportation due to the ease of maintenance of the device and the convenience of quick communication.

  However, the non-contact IC card itself may be inconvenient because there is no display device that allows the user to visually confirm the information content of the IC card at that time. In particular, when non-contact IC cards are used as “Osaifu-Keitai (registered trademark)” in the future, it is considered that there is an increasing demand for checking the balance. At the time of using the non-contact IC card, a display device can be provided on the corresponding non-contact reader / writer side to display it, but it may be inconvenient because it may be seen by others. In some cases, a rewrite recording layer is provided on the surface of the non-contact IC card to display information (Patent Document 4, etc.). In this case as well, printing is performed on the rewrite recording layer after being inserted into a reader / writer. There is a problem that the reader / writer without a recording device cannot be used.

In general, since a display device consumes a large amount of power, a battery is usually mounted on an IC card with a display device, and there are not many examples where the display device is provided without a battery. For example, normally used liquid crystal display devices have high power consumption, so it is indispensable to have a lithium battery or a solar battery, and a non-contact IC card cannot provide stable display only with power obtained from an antenna coil. Is normal.
In general, many display devices are formed on a rigid substrate as a whole. However, an IC card that requires flexibility requires a highly flexible display device.

Therefore, in the present invention, by using an organic EL light emitting panel that consumes less electricity among display devices, at least when a non-contact IC card communicates with an external non-contact terminal, information is displayed without a battery. Focusing on an organic EL light emitting panel with high flexibility, and mounting and using the display device are problems.
Prior art related to the present application includes Patent Documents 1 to 3 and the like. Patent Document 1 is a technology related to a light-emitting display panel using an organic EL. Patent Document 2 describes an IC card using an organic EL light emitting panel. Patent Document 3 describes an information display method for an IC card.

JP 2006-147190 A JP 2006-99289 A JP 2004-265176 A JP 2003-346111 A

  An object is to allow an IC card user to visually confirm the information content by displaying the information content of the IC card using an organic EL light emitting panel on the non-contact IC card. Another object is to prevent breakage of the IC card using a flexible display device. Further, conventionally, it has been essential to use a battery power supply for an IC card with a practical display function. However, a non-contact IC with a display device is advantageous in terms of the environment, since it does not use a battery power supply and consumes less energy. The realization of the card is an issue.

  The gist of the present invention that solves the above problems includes an IC chip including a memory, a control circuit, and a transmission / reception circuit, and an antenna coil electrically connected to the IC chip in a thin card base. In a non-contact IC card that is connected to an output port of the IC chip and incorporates an organic EL light emitting panel controlled by the IC chip, operating power is supplied to the organic EL light emitting panel in the card base. The contactless IC card further includes an antenna coil and an organic EL control chip.

  In the non-contact IC card, if the organic EL light emitting panel is formed by forming an organic light emitting part on a transparent resin film and the total thickness is less than 300 μm, the entire IC card can be formed flat. In addition, the organic EL light emitting panel has a plurality of different light emission color portions, and the display corresponding to the memory information of the IC chip can be performed by the light emission color, and the organic EL light emission panel has a plurality of different light emission color characters. And the display corresponding to the memory information of the IC chip can be made by the emission color character portion.

The non-contact IC card of the present invention operates an organic EL light-emitting panel by generating electromotive force by electromagnetic induction from electromagnetic waves generated by the non-contact reader / writer device when held over at least an external non-contact reader / writer device. Therefore, the display corresponding to the information content held in the memory of the IC chip can be visually confirmed.
Since the non-contact IC card of the present invention employs a highly flexible organic EL light emitting panel as a display device, a relatively large area display portion is provided in the IC card, and external force is applied to the card. However, since the organic EL light emitting panel is deformed with a flexibility equal to or greater than that of the IC card base, there is no problem of protruding from the base and damaging the IC card.

Since the non-contact IC card of the present invention employs an organic EL light emitting panel for information display, the color selection range is wide and rich information display can be performed.
Since the non-contact IC card of the present invention can change the color according to the memory information of the IC chip, it can be used for various game applications.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a diagram showing an external appearance of a contactless IC card of the present invention, FIG. 2 is a diagram showing a circuit configuration of the contactless IC card of the present invention, FIG. 3 is a diagram showing an arrangement example of antenna coils, and FIG. FIG. 5 is a diagram showing a cross-sectional structure of a non-contact IC card, FIG. 5 is a diagram showing a display example of an organic EL light emitting panel, and FIG. 6 is a diagram showing another display example of the organic EL light emitting panel.

  The non-contact IC card of the present invention is an IC card that can be suitably used for Osaifu-Keitai, various game applications, or transportation applications. Therefore, as shown in FIG. 1, it is preferable to provide a display 6 and a design indicating usage, and the back side may be provided with printed precautions and the like on the back surface. Although the antenna coil 11 and the IC chip 3 are illustrated by broken lines, they are not embedded in the card base 100 and thus do not actually appear in the appearance. The organic EL light emitting panel 20 is also in the card substrate 100 through a transparent sheet, but the light emission state can be visually recognized from the card surface.

The non-contact IC card of the present invention is characterized in that, for example, an organic EL light emitting panel 20 that displays the remaining amount is provided. In the case of FIG. 1A, the remaining amount is displayed in “Osaifu-Keitai” (Money Card). For example, in a 10,000 yen card, when the remaining amount is less than 5000 yen, the organic EL element 5 in the display column emits light.
Similarly, at less than 3000 yen and less than 1000 yen, the organic EL element 5 emits light in a circular shape. In FIG. 1A, the 3000 yen portion emits light. When the amount display 7 is on the IC card surface, the same emission color may be used, but there is a feature that the display can be enriched with different emission colors. You may display by different luminescent color, without providing the money amount display 7. FIG. For example, in the case of green, it can be determined and displayed as less than 5000 yen, blue is less than 3000 yen, and red is less than 1000 yen.

The organic EL element 5 may be displayed in characters. In the case of FIG. 1B, the remaining amount is displayed in green as “less than 5000 yen”. Similarly, it is possible to display with a light emission color different from “less than 3000 yen” or less than “1000 yen”. In FIG. 1B, less than “5000 yen” emits light. Although not only the amount of money but also a sentence expression can be displayed, for the sake of simplicity, an example of displaying only the amount of money is shown. It is easy to provide the characters “less than” by printing or the like.
In the non-contact IC card 1 of the present invention, each organic EL element 5 of the organic EL light emitting panel 20 emits light at different positions in different light emission colors, so that the same light emitting elements have different colors at the same light emission position. It cannot be made to emit light.
The organic EL light emitting panel 20 includes a plurality of organic EL elements 5 of light emitting color portions that emit light in different colors. The emission color portion can have a number of about 3 to 10.

  FIG. 2 is a diagram showing a circuit configuration of the contactless IC card of the present invention. The non-contact IC card 1 of the present invention has an IC chip 3 and an antenna coil 11 electrically connected to the IC chip 3 in a thin card base 100, and further operates power to the organic EL panel 20. It has an organic EL control IC chip 4 that also supplies and an antenna coil 12 connected to the IC chip 4. The IC chip 3 is an IC chip for a non-contact IC card including a memory, a processor (CPU), a control circuit, a transmission / reception circuit, and the like, but has a control signal output port 31 for controlling the organic EL light emitting panel 20. There is. The output port 31 is connected to the input port 41 of the IC chip 4.

  The control signal is calculated and generated by the CPU of the IC chip 3 according to the memory contents. That is, for example, if the balance of “Osaifu-Keitai” is less than 5000 yen and is 3000 yen or more, the green circuit of the organic EL element 5 is “ON” and if it is less than 3000 yen, When the blue circuit of the organic EL element is “ON” and the price is less than 1000 yen, a control signal for switching is generated to turn on the red circuit of the organic EL element. Of course, other emission colors are “OFF”.

  The IC chip 4 is an organic EL control chip. Operating power for driving the organic EL light emitting panel 20 is obtained by a power supply circuit including an LC circuit, a rectifier circuit, and a constant voltage circuit. The IC chip 4 incorporates a drive circuit for the organic EL element 5. Thus, by obtaining power independently of the power for operating the IC chip 3, it is possible to reduce the influence on the processor of the IC chip 3 when the organic EL light emitting panel 20 emits light. In FIG. 2, the two antenna elements of the antenna coil 11 and the antenna coil 12 are arranged in parallel. However, actually, the arrangement is not limited to this, and various arrangement methods can be adopted.

  FIG. 3 is a diagram illustrating an arrangement example of antenna coils. As shown in FIG. 3 (A), the antenna coils 11 and 12 may be formed so as to overlap each other, and as shown in FIG. The antenna coil 12 may be incorporated. In the case of overlapping, it is preferable to form on the front and back of one antenna sheet in order to prevent a short circuit. Even when the antenna is formed by etching, a protrusion of 20 μm to 40 μm is formed from the surface of the antenna sheet. The organic EL light emitting panel 20 is connected to the port 42 of the IC chip 4. Although simplified in FIG. 3, wirings corresponding to the number of organic EL elements 5 are connected by the wiring parts 13, respectively.

In general, when the non-contact IC card 1 communicates with an external non-contact reader / writer at a distance of 2 cm to 3 cm, the IC card is related to the output of the non-contact reader / writer. An induced electromotive force of about ˜6 mA) can be obtained. When it is in direct contact with the non-contact reader / writer, an induced electromotive force of about 20 to 25 V (30 mA) can be obtained. Therefore, the power of the organic EL light emitting panel 20 that emits light at about 5V to 10V is sufficient.
Since the non-contact IC card 1 of the present invention is premised on being placed on an external non-contact reader / writer and used in a contact manner, power sufficient to display the organic EL light emitting panel 20 with a small display area is obtained. be able to.

  In general, a non-contact IC card has a configuration in which core sheets on both sides are laminated on both sides of an antenna sheet having an IC chip 3 mounted on an antenna coil 11 via a spacer sheet or an adhesive sheet. The non-contact IC card 1 of the present invention can be configured in the same manner, but has a feature that the organic EL light emitting panel 20 is included in addition to the IC chip 3 and the like.

  FIG. 4 is a diagram showing a cross-sectional structure of the non-contact IC card 1. It is illustrated in a state where the respective layers are separated. The antenna sheet 101 is a sheet in which the antenna coil 11, the antenna coil 12, and the wiring portion 13 to the organic EL light emitting panel 20 are formed in advance, but illustration of them is omitted. The IC chip 3 is attached to the end of the antenna coil 11, and the IC chip 4 is attached to the end of the antenna coil 12. The wiring part 13 forms a connection circuit from each organic EL element 5 of the organic EL light emitting panel 20 to the IC chip 4.

  In general, since the IC chips 3 and 4 have a considerable thickness (150 μm to 300 μm), the spacer sheets 102 and 103 are used to prevent the uneven shape from appearing on the card surface. The organic EL light-emitting panel 20 can be formed to a thickness equal to or less than that of the IC chips 3 and 4 (for example, a thickness of 100 μm to 150 μm depending on the specification in which a sealing layer is not provided). A device to prevent it from appearing is necessary. The thickness of the organic EL light emitting panel 20 is preferably less than 300 μm in consideration of the thickness of the IC chip. A transparent core sheet 104 is used on the surface side so that the light emitted from the organic EL light-emitting panel 20 is transmitted. A transparent sheet is also used for the oversheet 108 on the outermost surface, but a concealing print 110 by transfer printing is provided so as to conceal parts other than the organic EL light emitting panel 20. For the concealment printing 110, a printing ink containing a concealment material obtained by pulverizing an aluminum foil is used. A white core sheet 105 is usually used on the bottom surface of the IC card.

  Through holes H1 to H4 are provided in at least the surface of the spacer chips 102 and 103 and the adhesive sheets 106 and 107 on the side where the protrusions of the IC chips 3 and 4 are provided so as to absorb the thickness of the IC chip. The same applies to the spacer sheet 103 and the adhesive sheet 106 of the organic EL light emitting panel 20 portion. The through holes H1 to H4 of the IC chips 3 and 4 are provided only in the spacer sheets 102 and 103, and the through holes H may not be provided in the adhesive sheets 106 and 107. The through holes H1 and H3 may be provided only in the spacer sheet 103 and the adhesive sheet 106, and the through holes may not be provided in the spacer sheet 102 and the adhesive sheet 107. These are appropriately selected depending on the thickness of the IC chip and the like. In the present invention, it is preferable that the organic EL light-emitting panel 20 is formed to a thickness equal to or less than that of the IC chips 3 and 4 and similarly the through hole H5 is formed to finish the contactless IC card 1 having a smooth surface.

Due to environmental problems, a polyethylene terephthalate (PET) sheet or an amorphous polyester resin (PET-G) sheet is often used for the card substrate 100 avoiding vinyl chloride. A PET-G sheet is generally a dehydration condensation product of an aromatic dicarboxylic acid and a diol, and is a sheet made of a substantially non-crystalline aromatic polyester having a particularly low crystallinity among copolyesters. Say. The PET-G sheets have heat fusion properties, but a hot-melt adhesive sheet, a room temperature curable adhesive, or the like is used for bonding between the PET sheet and the PET-G sheet. Adhesion between the transparent core sheet 104 and the spacer sheet 103 and between the core sheet 105 and the spacer sheet 102 is adhesion between the PET-G sheets, and thus no adhesive sheet is used. Adhesive ink is used on the transparent core sheet 104 side of the oversheet 108.
For the antenna sheet 101, a material obtained by laminating an aluminum foil on a PET sheet is used, and the antennas 11 and 12 are often formed by etching the aluminum foil.

  FIG. 5 is a diagram illustrating an example of an organic EL light emitting panel. First, an example in which light is emitted in a circular shape in FIG. 1A will be described. FIG. 5A is a plan view thereof, and FIG. 5B is a schematic diagram showing an enlarged cross-sectional structure taken along the line AA of FIG. 5A. The organic EL light emitting panel 20 displays a pattern by a combination of a light emitting region and a non-light emitting region. In the example of FIG. 5A, a green light emitting region RG, a blue light emitting region RB, a red light emitting region RR, Three circles are simply displayed by the combination of the non-light emitting regions NR. Each light emitting region is composed of a transparent electrode on the surface, an organic light emitting portion, and a back electrode. In the IC card 1 of the present invention, it is necessary to turn the light emission “ON” and “OFF” for each light emitting area. Front and back electrodes are provided for each light emitting area, and each electrode is connected to the IC chip 4. Yes. However, the transparent electrode 23 may be a common electrode. In the present invention, the entire substrate of the light emitting region is referred to as “organic EL light emitting panel”, and the unit of each light emitting region is referred to as “organic EL element”.

  As shown in FIG. 5 (B), the organic EL light emitting panel 20 includes a transparent substrate 21 having flexibility, a transparent electrode 23 formed on one surface in the thickness direction of the transparent substrate 21, An electrical insulating layer 25 formed on the transparent electrode 23, and organic light emitting portions 27g, 27b, 27r formed on the electrical insulating layer 25 and on the transparent electrode 23 exposed without being covered by the electrical insulating layer 25. And back electrodes 29g, 29b, 29r formed on the organic light emitting portions 27g, 27b, 27r, a printing layer 22 and a color filter layer 28 formed on the other surface in the thickness direction of the transparent substrate 21. Have. The non-light emitting region NR is formed by the cooperation of the electrical insulating layer 25 described later and the printed layer 22.

  The transparent electrode 23 is used as an anode of the organic EL element, and is formed on the transparent substrate 21 so as to cover both the light emitting regions RG, RB, RR and the non-light emitting region NR. As the material of the transparent electrode 23, inorganic transparent conductive oxides such as indium tin oxide (ITO), indium oxide, and indium zinc oxide (IZO), and organic conductive materials such as polyaniline can be used. ITO or IZO is preferably used. The film thickness of the transparent electrode 23 can be appropriately selected within a range of about 0.005 to 0.5 μm.

  From the viewpoint of preventing the deformation of the transparent base material 21 by minimizing the residual stress in the transparent base material 21 caused by the formation of the transparent electrode 23, the transparent electrode 23 is formed by a vacuum deposition method, an ion plating method, It is preferably formed by a printing method. When the transparent electrode 23 is formed by a printing method, a conductive ink or a conductive paste is applied to a predetermined shape by a method such as screen printing, flexographic printing, or offset printing, and then the coating film is formed. Is subjected to heat treatment to form a transparent electrode 23.

The green light emitting region RG and the blue light emitting region RB are partitioned by a partition wall 26a, and the blue light emitting region RB and the red light emitting region RR are partitioned by a partition wall 26b. The partition walls 26a and 26b are formed on the transparent electrode 23 using a resin material. The partition walls 26a and 26b can be formed by a method such as thick film printing, photolithography, or electron beam lithography.
As a material for forming such a partition, a photocurable resin such as a photosensitive polyimide resin or an acrylic resin, a thermosetting resin, an inorganic material, or the like can be used.

  The electrical insulating layer 25 locally insulates the transparent electrode 23 and the back electrode 29 so that the organic light emitting unit 27 emits light only in the light emitting regions RG, RB, RR. It is formed on a region corresponding to the light emitting region NR. Such an electrical insulating layer 25 is formed by, for example, applying a photocurable resin composition (including an ultraviolet curable resin composition) or an electron beam curable resin composition to form a coating film. It can be obtained by patterning a film into a predetermined shape by photolithography or electron beam lithography. The thickness of the electrical insulating layer 25 is set to 0. 0 depending on the material of the electrical insulating layer 25, the driving voltage of the organic EL light-emitting panel, etc. so that the transparent electrode 23 and the back electrode 29 can be locally insulated. It is appropriately selected in the range of about 5 to 7.0 μm.

  The organic light emitting units 27g, 27b, and 27r constitute an organic EL element together with the transparent electrode 23 and the back electrode 29, and at least the green light emitting region RG, the blue light emitting region RB, and the red light emitting region RR of the transparent electrode 23. It is formed on the area | region corresponding to. In the organic EL light emitting panel 20, organic light emitting portions 27g, 27b, and 27r are formed on the surface of the electrical insulating layer 25 and on the transparent electrode 23 that is exposed without being covered by the electrical insulating layer 25.

  The organic light emitting portions 27g, 27b, and 27r include, for example, (1) a single layer structure made of only an organic light emitting material, (2) a hole transport layer made of a hole transport material, and an organic light emitting material layer made of an organic light emitting material. Are laminated in this order from the transparent electrode 3 side. (3) An organic light emitting material layer made of an organic light emitting material and an electron transport layer made of an electron transport material were laminated in this order from the transparent electrode 23 side. A two-layer structure or (4) a three-layer structure in which a hole transport layer, an organic light emitting material layer, and an electron transport layer are laminated in this order from the transparent electrode 23 side can be used.

  Further, (5) a two-layer structure in which a hole transport layer and an organic light emitting material layer having the properties of an electron transport layer are laminated in this order from the transparent electrode 23 side, (6) the properties of the hole transport layer A two-layer structure in which the organic light-emitting material layer and the electric transport layer are stacked in this order from the transparent electrode 3 side, or (7) the properties of the organic light-emitting material layer, the properties of the hole transport layer, and electron transport A single-layer structure composed of only an organic mixture layer having at least one of the properties of the layer may be employed.

  The organic light-emitting material layer, the hole transport layer, the electron transport layer, and the organic mixture layer each use various organic light-emitting materials, hole transport materials, or electron transport materials known as materials for organic EL elements. Can be formed. These layers can be formed by, for example, a vacuum deposition method or a wet method. In the wet method, a coating composition containing an organic light emitting material, a hole transport material, or an electron transport material is applied by a method such as an inkjet method, a spin coating method, a printing method, or a dispenser method in which a dispenser is dropped using a dispenser. An organic light emitting material layer, a hole transport layer, an electron transport layer, or an organic mixture layer is formed by forming a coating film and curing or solidifying the coating film by a method such as vacuum heat treatment.

  The color filter layer 28 is applied to obtain a desired emission color when the organic light emitting layer emits white light. For the color filter layers 28g, 28b, 28r, an appropriate dye having excellent transparency and a finer pigment can be used. Therefore, when the organic light emitting unit 27 itself exhibits a desired emission color, it is not necessary to provide the color filter layers 28g, 28b, and 28r.

As a material for forming the organic light emitting layer, a dye light emitting material, a metal complex light emitting material, or a polymer light emitting material can be generally used.
Examples of dye-based light emitting materials include cyclopentadiene derivatives, tetraphenylbutadiene derivatives, triphenylamine derivatives, oxadiazole derivatives, pyrazoloquinoline derivatives, distyrylbenzene derivatives, distyrylarylene derivatives, silole derivatives, thiophene ring compounds, pyridine rings Examples thereof include compounds, perinone derivatives, perylene derivatives, oligothiophene derivatives, trifumanylamine derivatives, coumarin derivatives, oxadiazole dimers, pyrazoline dimers, and the like.

  Metal complex light emitting materials include aluminum quinolinol complex, benzoquinolinol beryllium complex, benzoxazole zinc complex, benzothiazole zinc complex, azomethyl zinc complex, porphyrin zinc complex, europium complex, iridium metal complex, platinum metal complex, etc. The metal has Al, Zn, Be, Ir, Pt, etc., or a rare earth metal such as Tb, Eu, Dy, etc., and the ligand has an oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, quinoline structure, etc. A metal complex etc. can be mentioned. Specifically, tris (8-quinolinolato) aluminum complex (Alq3) can be used.

  In addition, polymer light emitting materials include polyparaphenylene vinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polysilane derivatives, polyacetylene derivatives, polyvinylcarbazole derivatives, polyfluorenone derivatives, polyfluorene derivatives, polyquinoxaline derivatives, polydialkylfluorene derivatives. , And copolymers thereof. Moreover, what polymerized the said pigment-type luminescent material and metal complex type | system | group luminescent material is also mentioned.

  Among the above, the light emitting material used in the present embodiment is preferably a metal complex light emitting material or a polymer light emitting material, and more preferably a polymer light emitting material. Of the polymer light emitting materials, a conductive polymer having a π-conjugated structure is preferable. Examples of the conductive polymer having such a π-conjugated structure include polyparaphenylene vinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polysilane derivatives, polyacetylene derivatives, polyfluorenone derivatives, polyfluorene derivatives, polyquinoxaline derivatives as described above. , Polydialkylfluorene derivatives, and copolymers thereof.

  Among the light-emitting materials, examples of materials that emit blue light include polymer materials such as polyvinylcarbazole derivatives, polyparaphenylene derivatives, and polyfluorene derivatives. Examples of materials that emit green light include polymer materials such as polyparaphenylene vinylene derivatives and polyfluorene derivatives. Examples of the material that emits red light include polymer materials such as polyparaphenylene vinylene derivatives, polythiophene derivatives, and polyfluorene derivatives.

  The thickness of the light emitting portion is not particularly limited as long as it can provide a function of emitting light by providing a recombination field between electrons and holes, and may be, for example, about 1 nm to 200 nm. it can.

  Further, a dopant that emits fluorescence or phosphorescence may be added to the light emitting portion for the purpose of improving the light emission efficiency and changing the light emission wavelength. Examples of such dopants include perylene derivatives, coumarin derivatives, rubrene derivatives, quinacridone derivatives, squalium derivatives, porphyrin derivatives, styryl dyes, tetracene derivatives, pyrazoline derivatives, decacyclene, phenoxazone, quinoxaline derivatives, carbazole derivatives, fluorene derivatives, and the like. Can be mentioned.

  The method for forming the organic light emitting unit 27 is not particularly limited as long as it is a method capable of high-definition patterning. For example, vapor deposition method, printing method, ink jet method, spin coating method, casting method, dipping method, bar coating method, blade coating method, roll coating method, gravure coating method, flexographic printing method, spray coating method and the like can be mentioned. . Among these, it is preferable to use a vapor deposition method, a spin coating method, and an ink jet method. Further, when patterning the light emitting portion, it may be applied separately by a masking method of pixels having different light emission colors, or a partition may be formed between the light emitting portions 27.

  In the present invention, since a plurality of colors are displayed by the light emitting regions RG, RB, and RR, it is preferable to prepare a plurality of types of organic light emitting materials having different emission colors and to form the organic light emitting portions at desired locations. The film thickness of the organic light emitting portion 27 in the light emitting region is in the range of about 0.1 to 2.5 μm from the viewpoint of forming a high-brightness organic EL element while preventing a short circuit between the transparent electrode 23 and the back electrode 29. It is preferable to select appropriately.

  The back electrodes 29g, 29b, and 29r are formed on the organic light emitting unit 27 and used as the cathode of the organic EL element. From the viewpoint of obtaining a back electrode suitable as a cathode of an organic EL device, a work function such as an alkali metal, an alkaline earth metal, an alloy containing an alkali metal as a component, an alloy containing an alkaline earth metal as a component, etc. It is preferable to form the back electrode 29 using a metal or alloy having a small thickness. At this time, the back electrodes 29g, 29b, and 29r can have a single-layer structure, but alkali metals and alloys thereof, and alkaline earth metals and alloys thereof have high chemical activity. As shown, the first back electrode 29x made of an alkali metal or an alloy thereof, or an alkaline earth metal or an alloy thereof is made of a conductive material such as silver (Ag), gold (Au), or aluminum (Al) having a low chemical activity. A laminated structure protected by a second back electrode 29y made of a material is preferable.

Regardless of whether the back electrode 29 has a single-layer structure or a stacked structure, the back electrodes 29g, 29b, and 29r can be formed only in regions corresponding to the light emitting regions RG, RB, and RR, or the light emitting region RG. , RB, RR and the non-light emitting region NR can be formed, and the film thickness can be appropriately selected within a range of about 0.005 to 1 μm.
When the back electrode 29 has a laminated structure, the thickness of each of the first back electrode 29x and the second back electrode 29y is preferably selected as appropriate within a range of about 0.005 to 0.5 μm. The back electrode 29 can be formed by, for example, a vacuum evaporation method.

  Although not shown, it is preferable to provide a gas barrier layer between the transparent substrate 21 and the transparent electrode 23 and a sealing layer over the entire surface of the back electrode 29. This is because the characteristics of the organic light-emitting material used in the organic EL element are deteriorated by oxygen and moisture, and therefore a sealing process for preventing the entry of oxygen and moisture into the organic light-emitting portion is necessary.

  The print layer 22 is configured to limit the light emitting area to the light emitting areas RG, RB, and RR and shield the other portions. In the organic EL light emitting panel 20, a printing layer 22 made of light shielding ink is formed corresponding to the non-light emitting region NR. The printing layer 22 can be formed on the transparent substrate 21 by various methods such as gravure printing, offset printing, flexographic printing, and screen printing. The thickness of the printing layer 22 is several μm or less.

  In the above, a transparent resin film can be used as the transparent substrate 21. Transparent resin films include fluororesin, polyethylene, polypropylene, polyvinyl chloride, polyvinyl fluoride, polystyrene, ABS resin, polyamide, polyacetal, polyester, polycarbonate, modified polyphenylene ether, polysulfone, polyarylate, polyetherimide, polyamideimide Polyimide, polyphenylene sulfide, liquid crystalline polyester, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyoxymethylene, polyethersulfone, polyetheretherketone, polyacrylate and the like are preferable. If the film thickness of the transparent resin film is less than about 50 μm, the organic EL light emitting panel 20 is likely to be deformed during the manufacturing process. The upper limit of the film thickness of the transparent resin film can be appropriately selected within the range of about 50 μm to 200 μm depending on the intended use of the organic EL light emitting panel 20 and the flexibility required for the organic EL light emitting panel. It is. A transparent resin film is more preferable as it is excellent in solvent resistance, heat resistance, light resistance, and gas barrier properties (meaning barrier properties against water vapor and oxygen, the same shall apply hereinafter).

  The organic EL light emitting panel 20 can display patterns of characters, figures, symbols, and the like by a combination of a light emitting region and a non-light emitting region. In the example of the light emitting panel of FIG. 6, a character string “5000 yen” is displayed by a combination of five light emitting regions R1 to R5 and six non-light emitting regions NR1 to NR6. Obviously, corresponding electrical insulation layers 25 and print layers 22 need to be formed according to the non-light emitting regions NR1 to NR6. It can be easily estimated by those skilled in the art that other characters or sentences can be similarly formed. In FIG. 6, the non-light emitting regions NR1 to NR6 are hatched for easy identification.

  In the following examples, only the embedding of the organic EL light-emitting panel in the non-contact IC card substrate was experimentally performed. The non-contact card IC chip 3 and the organic EL element driving IC chip (IC chip 4) that generate the control signal are not available on the market at this time.

<Preparation of organic EL light emitting panel>
First, a commercially available conductive film in which an ITO film having a film thickness of 0.1 μm was formed on one side of a polyethersulfone film (having a film thickness of 100 μm) was prepared. The polyether sulfone film in this conductive film corresponds to the transparent substrate 21, and the ITO film corresponds to the transparent electrode 23. Next, on the surface opposite to the surface on which the ITO film is formed in the conductive film, the periphery is shielded by a gravure printing machine so that the light emitting portion has a predetermined circular pattern (diameter 5 mm). A printing layer 22 was provided.

  Next, a photoresist is spin-coated on the transparent electrode 23 to form a coating film. After the coating film is pre-baked, it is selectively exposed using an exposure mask having a predetermined shape, post-baked and then subjected to development processing. The electrical insulating layer 25 having a predetermined pattern was formed. The thickness of the electrical insulating layer 25 on the transparent electrode 23 is 2 μm. Next, partition walls 26 a and 26 b for partitioning the light emitting region were formed on the electrical insulating layer 25. For this purpose, the ultraviolet curable resin material was applied in a linear form by a dispenser so that the thickness after curing was 5 μm, and then irradiated and cured with ultraviolet rays to form partition walls 26a and 26b.

  Next, Bayer P (trade name) manufactured by Bayer Co., Ltd. was prepared as a coating composition for forming a hole transport layer between the partition walls 26a and 26b, and this coating composition was applied onto the electrical insulating film and the transparent electrode 23. Worked to form a coating film. And this coating film was hardened by heat processing of 150 degreeC, and the positive hole transport layer with a film thickness of 0.08 micrometer (however, the film thickness on a transparent electrode is meant) was formed.

  Further, as a coating composition for forming the organic light emitting part 27, a mixture of 70 parts by weight of polyvinylcarbazole, 30 parts by weight of oxydiazole, 1 part by weight of a cyanomethylenephyrane derivative and 4700 parts by weight of monochlorobenzene (for green, 3 types for blue and red) were prepared, and this coating composition was applied onto the hole transport layer by an ink jet printing method to form a coating film. And this coating film was hardened by the heat processing of 150 degreeC, and the organic light emission part 27 with a film thickness of 0.07 micrometer was formed. As a result, a light-emitting portion having a two-layer structure including the hole transport layer and the organic light-emitting portion 27 was obtained.

  Metal calcium (Ca) is deposited on the organic light emitting portion 27 by a vacuum deposition method to form a 0.008 μm-thick calcium layer, and then silver (Ag) is deposited on the calcium layer by a vacuum deposition method. A silver layer having a thickness of 0.5 μm was deposited to form a back electrode 29 having a two-layer structure including a first back electrode 29x made of a calcium layer and a second back electrode 29y made of a silver layer.

  Thereafter, a sealing layer is laminated so as to cover the exposed surface of the transparent electrode 23, the outer side surface of the electrical insulating layer 25, the side surface of the organic light emitting unit 27, and the outer surface of the back electrode, and is the same as illustrated in FIG. The organic EL light emitting panel 20 was obtained. In the sealing layer, a silicon oxynitride gas barrier layer having a film thickness of 0.1 μm is formed on the entire surface of a base material made of a polyethersulfone film having a film thickness of 60 μm, and on the inner edge of the surface. A bonding agent layer having a film thickness of 40 μm made of an acrylic resin-based ultraviolet curable resin composition is formed. After being laminated in a nitrogen gas atmosphere with the bonding agent layer facing inward, a predetermined amount is applied to the bonding agent layer. The adhesive layer is cured while being irradiated with ultraviolet rays having a wavelength and adhered to the base.

  Through the above steps, an organic light emitting EL panel 20 having a thickness of about 210 μm and a unit size of 8 mm × 24 mm was obtained. It was confirmed that each organic EL element 5 emitted light by applying a voltage of 5 V to the organic light emitting panel 20 with a DC power supply device.

<Manufacture of non-contact IC cards>
As antenna sheet 101, 20 μm thick aluminum foil is bonded to both sides of a 50 μm thick PET sheet with an adhesive, and this aluminum foil is etched to form antenna coil 11, antenna coil 12, and wiring portion. did. In addition, the antenna coil 12 and the wiring part were formed in the side surface in which the organic electroluminescent light emission panel 20 of the antenna sheet 101 is mounted, and the antenna coil 11 was formed in the opposite side surface. As shown in FIG. 3A, the antenna coil 11 and the antenna coil 12 have a slightly overlapping positional relationship in plan view.

  The organic EL light emitting panel 20 was fixed to the inside of the antenna coil 12 with an adhesive sheet, and the transparent electrode 23 and each back electrode were connected using a conductive adhesive. Further, an antenna sheet 101 was completed by mounting an ordinary IC chip for a non-contact IC card (thickness 250 μm) on both ends of the antenna coil 11. For this purpose, two small holes were made in the antenna sheet 101 and filled with a conductive adhesive so as to connect both terminals of the IC chip 3.

The layer structure of the card base is such that the adhesive sheet 106, 107 having a thickness of 50 μm is formed on the front and back of the antenna sheet 101, the spacer sheet 102, 103 made of PET-G having a thickness of 100 μm on the outside, and the PET having a thickness of 200 μm on the outside A transparent core sheet 104 made of -G and a white core sheet 105 made of PET-G were overlapped to form an oversheet 108 having a concealed print 110 on the outermost surface, so that an eight-layer structure was obtained.

  A polyester hot melt adhesive (melt viscosity 2000 poise: 190 ° C.) is used for the adhesive sheets 106 and 107 in consideration of the adhesion between the PET film of the antenna sheet 101 and the PET-G of the spacer sheets 102 and 103. did. The adhesive sheets 106 and 107 and the spacer sheets 102 and 103 on both sides of the antenna sheet 101 are slightly more than the IC chip 3 and the IC chip 4 in advance so that the IC chip 3 and the IC chip 4 mounted on the antenna sheet are accommodated in advance. Large through-holes H1, H2, H3, and H4 (about 4 mm × 4 mm) were punched out. Similarly, the adhesive sheet 106 and the spacer sheet 103 at the position where the organic EL light emitting panel 20 is mounted are also formed by punching a through hole H5 having a slightly larger size (about 10 mm × 26 mm) than the organic EL light emitting panel 20. .

Further, the concealment print 110 was previously transferred and printed on the oversheet 108 which is the outermost surface side of the IC card. For the concealing printing 110, printing ink containing a concealing material obtained by pulverizing aluminum foil was used. Moreover, although not shown in figure, the adhesive medium ink ink was printed on the transparent core sheet 104 surface side of the oversheet 108 including the concealment printing 110 surface.
The laminate composed of the above 8 layers was fitted into a pin, aligned, placed on a hot plate of a press machine, and press laminated. The conditions of the pressing process were as follows: hot plate temperature 120 ° C, pressure 2.0 MPa, molding (heating) time 20 min. I went to set.

  In this way, a non-contact IC card having a total thickness of 0.78 mm and incorporating the organic EL light emitting panel 20 was completed. Since the total thickness of the used material was 820 μm, the entire sheet was contracted by about 10%. The entire non-contact IC card 1 was finished flat, and it was confirmed that the flexibility including the organic EL light emitting panel 20 portion was practically sufficient.

  Although the above embodiment has been described only in the case of using a non-contact IC chip, it can be applied to an IC card using a dual interface IC chip having both a contact type and a non-contact type function. It will be obvious to those skilled in the art.

It is a figure which shows the external appearance of the non-contact IC card of this invention. It is a figure which shows the circuit structure of the non-contact IC card of this invention. It is a figure which shows the example of arrangement | positioning of an antenna coil. It is a figure which shows the cross-section of a non-contact IC card. It is a figure which shows the example of a display of an organic electroluminescent light emission panel. It is a figure which shows the other example of a display of an organic electroluminescent light emission panel.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact IC card 3 IC chip 4 IC chip 5 Organic EL element 6 Display 7 Amount display 11 Antenna coil 12 Antenna coil 13 Wiring part 20 Organic EL light emitting panel 21 Transparent base material 22 Print layer 23 Transparent electrode 25 Electrical insulation layer 26a, 26b Partition wall 27 Organic light emitting section 28 Color filter layer 29 Back electrode 31 Output port 41 Input port 100 Card base 101 Antenna sheet 102, 103 Spacer sheet 104 Transparent core sheet 105 Core sheet 106, 107 Adhesive sheet 108 Over sheet 110 Hidden printing H, H1-H5 through hole

Claims (4)

In a thin plate-like card base, it has an IC chip having a memory, a control circuit, and a transmission / reception circuit, and an antenna coil electrically connected to the IC chip, and is connected to an output port of the IC chip, In the non-contact IC card incorporating the organic EL light emitting panel controlled by the IC chip, the card base further includes an antenna coil for supplying operating power to the organic EL light emitting panel and an organic EL control chip. Non-contact IC card characterized by the above. 2. The non-contact IC card according to claim 1, wherein the organic EL light-emitting panel has an organic light-emitting portion formed on a transparent resin film, and has a total thickness of less than 300 [mu] m. 3. The non-contact IC card according to claim 1, wherein the organic EL light-emitting panel has a plurality of different light emission color portions and performs display corresponding to the memory information of the IC chip by the light emission color. 3. The non-contact IC card according to claim 1, wherein the organic EL light emitting panel has a plurality of different light emission color character portions, and displays corresponding to the memory information of the IC chip by the light emission color characters. .

Images