JP2008211519A - Portable electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a portable electronic apparatus that can thin a casing and can suppress damage to a circuit board. <P>SOLUTION: A portable telephone 1 includes: a rear case 31; a frame 44 that is provided in the rear case 31 and has first and second regions 44w and z having each different thickness; a first mounting section 43a in an FPC 43, having a body section 43e laminated at one side of the frame 44 in the first region 44w and an extending section 43f that is extended from an edge at the side of the second region 44z at the body section 43e and is bent to the body section 43e; a first circuit board 45 laminated at one side of the frame 44 in the second region 43z; a first connector 51 provided at the extending section 43f; and a second connector 52 provided on the first circuit board 45 and connected to the first connector 51. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a portable electronic device such as a mobile phone, a PDA (Personal Digital Assistant), and a digital camera.

  In a portable electronic device, a circuit board having a relatively wide area with respect to the size of the casing, such as a circuit board having an area equivalent to the casing, is provided in the casing. Therefore, the circuit board may be damaged due to bending moment or torsional moment due to bending deformation or torsional deformation caused by dropping the casing.

Patent Document 1 discloses a technique in which a metal chassis (frame) laminated on a substrate is provided in the housing, thereby increasing the rigidity of the entire mobile phone and suppressing damage to the substrate. Note that the chassis is connected to the ground line and also functions as a shield. Moreover, the board | substrate laminated | stacked on a chassis is a hard printed circuit board, and has an area equivalent to a chassis.
Japanese Patent Laid-Open No. 2003-249991

  Portable electronic devices are required to be downsized (thinned). However, if the strength of the frame is increased in order to strengthen the protection of the circuit board, the frame has to be thick, and consequently the casing has to be enlarged.

  Here, in the portable electronic device, since various components are arranged, regions having different properties are generated. For example, there are a region where parts that require shielding are arranged and a region where parts that do not require shielding are arranged. Further, for example, there are a region where a load is applied by the user such as an operation unit and a region where a load is not applied by the user such as a display unit. Therefore, it is conceivable to reduce the size of the casing by changing the thickness of the frame for each region according to various circumstances, and further arranging the parts where the frame is thinned.

  However, when a thin region and a thick region are formed on the frame, stress concentration tends to occur at the boundary, and deformation tends to occur. As a result, the substrate may be damaged at the boundary position.

  An object of the present invention is to provide a portable electronic device capable of reducing the thickness of a casing and suppressing breakage of a circuit board.

  The portable electronic device of the present invention has a housing and a second region that is provided in the housing and is thicker than the first region, and a surface on one side of the first region is the first region. A frame formed lower than the one side surface of the two regions, and a substrate constituted by a flexible substrate, the first main body portion laminated on the one side surface in the first region; A first substrate having a first extension extending from an end of the first main body on the second region side and bent with respect to the first main body, and the one surface in the second region A second body portion stacked on the second body portion, and a second extension portion extending from an end portion of the second body portion on the first region side and facing the surface on the one side of the first region. A board, a first connector provided on the first extension of the first board, and the second board. A second connector provided in the second extension, wherein the first extension is folded back in the first region, and the first connector and the second connector are in the first region. Connected at.

  Preferably, the second connector is provided on a surface of the second extension portion facing the one side surface of the first region, and the first connector is provided on the first extension portion of the first extension portion. The first main body and the second connector are provided on a surface continuous with a surface opposite to the surface facing the frame of the first main body, and the first extension portion of the first main body and the second connector is located with respect to the first main body. Are bent in one direction and bent in the opposite direction so that the surface provided with the first connector is opposed to the surface provided with the second connector of the second extension portion. ing.

  Preferably, a plurality of switches are stacked on a back surface of the one side surface of the first region, and a switch substrate on which the plurality of switches are provided and a back surface of the one side surface of the second region. And a stacked display.

  Preferably, the first substrate and the switch substrate are configured by winding one flexible substrate around the frame.

  According to the present invention, the casing is thinned and the circuit board is prevented from being damaged.

  FIG. 1 is a perspective view showing an appearance of a mobile phone 1 as a mobile electronic device according to an embodiment of the present invention.

  The mobile phone 1 is constituted by a so-called flip-type mobile phone. That is, the mobile phone 1 includes a main body 3 and a flip 5 that is foldably connected to the main body 3.

  The main body 3 includes a case 7 and a display unit 9 and an operation unit 11 held by the case 7. The display unit 9 and the operation unit 11 constitute a front surface 3 a of the main body unit 3. The display unit 9 is disposed on the first end 3 c side of the main body 3, and the operation unit 11 is disposed on the second end 3 d side of the main body 3. On the front surface 3 a of the main body 3, a sound emission port 15 of a call speaker 13 (see FIG. 3) and a sound collection port 19 of a call microphone 17 (see FIG. 4) are opened. The sound outlet 15 is disposed on the first end 3 c side of the display unit 9, and the sound collection port 19 is disposed on the second end 3 d side of the operation unit 11. The side surface 3e of the main body 3 is provided with a storage medium insertion port 20 and a connector insertion port (not shown) (not shown).

  FIG. 2 is an exploded perspective view of the mobile phone 1.

  The main body 3 of the cellular phone 1 includes a case 7, an internal assembly 21 having various electric circuits, a packing 23, and predetermined members from the back surface 3b side (the lower side in FIG. 2) of the main body 3. A frame member 25 for fixing, a double-sided tape 27, and a front member group 29 constituting the front surface 3a of the main body 3 are laminated.

  The case 7 includes a rear case 31 and a lid 33 that covers the rear side of the rear case 31. The rear case 31 and the lid 33 are made of, for example, resin. The rear case 31 has a base portion 31a and a peripheral wall portion 31b protruding from the periphery of the base portion 31a toward the front surface 3a. For example, the peripheral wall portion 31b extends along the periphery of the base portion 31a except for the second end 3d side. In the rear case 31, a surface facing the base portion 31a is open, and an open portion 31c is formed. That is, the rear case 31 has a peripheral wall portion 31b that forms an open portion 31c.

  An opening 31d for inserting a battery 34 (see FIG. 7) is formed in the base 31a of the rear case 31. The lid 33 is placed on the back surface of the rear case 31 so as to close the opening 31d, and is fixed to the rear case 31 by a claw or the like. Note that the rear surface 3 b of the main body 3 is configured by the base 31 a and the lid 33 of the rear case 31.

  The planar shape of the case 7 (the shape seen from the front surface 3a or the back surface 3b) is appropriate, but is rectangular, for example. On the first end 3c side of the rear case 31 (on the right side in FIG. 2), a notifying speaker 35 is attached with the sound emitting surface as the base 31a side. A sound outlet 37 (see FIG. 7) of the speaker 35 is opened in the base 31a of the rear case 31. On the second end 3d side (the left side of FIG. 2) of the rear case 31, a recess 31e to which an internal antenna 89 (see FIG. 8) for radio communication using radio waves is attached is formed.

  The internal assembly 21 is configured by attaching various electronic components and circuit boards to the frame 44. For example, a display 53 having a display surface 53 a is attached to the frame 44. Details of the internal assembly 21 will be described later.

  The frame member 25 is made of sheet metal, for example. The frame member 25 is put on the display 53 and the frame 44, and the first fixing portion 25b and the second fixing portion 25c of the frame member 25 are engaged with the screw boss 44t and the engaging portion 44u formed on the side surface 44s of the frame 44. This prevents the display unit 53 from falling off the frame 44.

  The packing 23 is made of an elastic member such as sponge or rubber, for example. The packing 23 is sandwiched between the frame member 25 and the display unit 53 and / or the frame 44 and abuts against these members.

  The front member group 29 includes a translucent plate 65 for protecting the display 53, a covering member 67 for hiding a predetermined gap or member, an operation member 69 for receiving a user operation, and a connecting member 77. is doing. In order to easily understand that these members constitute the front surface 3a of the main body 3, these members are conceptualized as a front member group 29, but these members are directly fixed to each other. I don't mean.

  The translucent plate 65 is formed in a size and shape that fits on the first end 3 c side of the open portion 31 c of the rear case 31. The translucent plate 65 is fixed to the frame member 25 by the double-sided tape 27. The translucent plate 65 may be fixed to the frame member 25 by another adhesive member such as an adhesive instead of the double-sided tape.

  The covering member 67 is made of, for example, resin. The covering member 67 is disposed between the translucent plate 65 and a key top 71 described later of the operation member 69. The covering member 67 is fixed to, for example, a later-described bone member 73 with a double-sided tape or an adhesive.

  The operation member 69 is disposed on the bone member 73, for example, a key sheet 75 that covers the plurality of switches 55, a bone member 73 that presses and fixes the key sheet 75 to the frame 44 side from the lower side in FIG. The key top 71 is bonded to the key sheet 75 through a hole (not shown) formed in the bone member 73. The bone member 73 has a third fixing portion (not shown) hidden from the connecting member 77 and protruding from the edge of the portion arranged on the key sheet to the frame 44 side, and a fourth fixing portion 73c. . The third fixing portion and the fourth fixing portion 73c engage with the screw boss 44t and the engaging portion 44u of the frame 44, similarly to the first fixing portion 25b and the second fixing portion 25c of the frame member 25.

  The flip 5 is connected to the main body 3 in a foldable manner by connecting a connecting member 77 provided in the main body 3 and a connecting part 5 a provided in the flip 5. The connecting member 77 and the connecting part 5a also constitute the front surface 3a of the main body part 3.

  The cellular phone 1 having the above configuration is assembled as follows. As described above, the frame member 25 and the operation member 69 are attached to the inner assembly 21. These are inserted into the rear case 31, and are fitted into the rear case 31 and fixed. Further, in these, screws 79 are inserted into the peripheral wall portion 31 b of the rear case 31, and are inserted into the first fixing portion 25 b of the frame member 25 and the third fixing portion of the bone member 73, and the screw boss 44 t of the frame 44 is inserted. It is fixed to the rear case 31 by being screwed together. The connecting member 77 is fixed to the rear case 31 by screwing a screw (not shown) inserted from the rear surface 3 b side of the rear case 31 into the connecting member 77.

  Next, the outline of the internal assembly 21 will be described.

  FIG. 3 is an exploded perspective view showing a part of the inner assembly 21. 3 is a view seen from the back surface 3b side of the main body 3 of the mobile phone 1. As shown in FIG.

  The internal assembly 21 includes a frame 44, a board assembly 41 and an FPC 43 (flexible printed wiring board, an example of a flexible board) stacked on the frame 44. The substrate assembly 41 is disposed on the front surface 3a side of the second region 44z on the first end 3c side (upper right side in FIG. 3) of the frame 44.

  FIG. 4 is an exploded perspective view showing a part of the inner assembly 21. 4 is a view as seen from the front 3a side (the side opposite to FIG. 3) of the main body 3 of the mobile phone 1. FIG.

  The internal assembly 21 includes a display 53 and a plurality of switches 55 in addition to the configuration described with reference to FIG. The display device 53 is disposed on the back surface 3 b side of the second region 44 z of the frame 44.

  FIG. 5 shows a development view of the FPC 43.

  The FPC 43 includes a first mounting portion 43a (an example of a first substrate), a second mounting portion 43b (an example of a switch substrate), and a connection portion that electrically connects the first mounting portion 43a and the second mounting portion 43b. 43c.

  When the FPC 43 is wound around the frame 44, the first mounting portion 43 a is a first arrangement surface on the back surface 3 b side of the first region 44 w on the second end 3 d side (lower left side in FIG. 3) of the frame 44. 44wa (FIG. 3), and the second mounting portion 43b is arranged on the second arrangement surface 44wb (FIG. 4) on the front surface 3a side of the first region 44w of the frame 44. The plurality of switches 55 (FIG. 4) are provided in the second mounting portion 43b. All these electronic components are reflow mounted on the same surface.

  Details of the internal assembly 21 will be described below.

  As shown in FIG. 3, the board assembly 41 is configured, for example, by laminating a first circuit board 45 (an example of a second board), a shield member 47, and a second circuit board 49. The first circuit board 45 and the second circuit board 49 are constituted by, for example, rigid boards based on hard resin. Various electronic components are mounted on the mounting surfaces of the first circuit board 45 and the second circuit board 49, and various electric circuits are configured on the board assembly 41. Further, a reference potential layer 41a (only part of which is shown) constituting a reference potential line is formed on the mounting surface of the first circuit board 45 and the second circuit board 49. The board assembly 41 may be constituted by a single circuit board.

  The FPC 43 is a so-called single-sided FPC, and an electronic component or the like is mounted only on one surface (mounting surface 43d). Of the mounting surface 43d, the portion of the first mounting portion 43a is referred to as the first mounting surface 43da (FIG. 3), and the portion of the second mounting portion 43b is referred to as the second mounting surface 43db (FIG. 4). The FPC 43 is wound around the frame 44 as described above with the back side of the mounting surface 43d facing the frame 44 side. Therefore, the first mounting portion 43a is stacked on the frame 44 so that the back surface of the first mounting surface 43da faces the first arrangement surface 44wa of the first region 44w of the frame 44, and the second mounting portion 43b 2 The back surface of the mounting surface 43db is stacked on the frame 44 so as to face the second arrangement surface 44wb of the first region 44w of the frame 44.

  As shown in FIGS. 3 and 4, the first mounting portion 43a and the second mounting portion 43b are formed in a rectangular shape having an area equivalent to that of the first region 44w, for example. As shown in FIG. 3, the first mounting portion 43a is provided with a slot portion 50 for inserting, for example, a microphone 17 or a memory card (not shown). As shown in FIG. 4, the second mounting unit 43 b includes a plurality of LEDs 61 for illuminating the operation unit 11 and a plurality of resistors 63 for adjusting current in addition to the switch 55 described above. 55 is provided.

  The display 53 shown in FIG. 4 is configured by, for example, a liquid crystal display or an organic EL display. The display 53 has a display surface 53a for displaying various information. The external shape of the display 53 is configured as a rectangular plate, for example. The display unit 53 is electrically connected to the substrate assembly 41 via an FPC 59 extending from the display unit 53.

  The plurality of switches 55 shown in FIG. 3 are provided on the front surface 3 a side of the main body 3 in the second mounting portion 43 b of the FPC 43. The plurality of switches 55 are configured by pressing switches such as dome switches. When the switch 55 is pressed, a predetermined signal is generated and output to the substrate assembly 41 via the FPC 43.

  The frame 44 has conductivity on the surface or the entire surface. The frame 44 is made of a material having higher rigidity than the case 7. For example, the frame 44 is made of metal.

  As shown in FIGS. 3 and 4, the frame 44 is formed in a plate shape, for example. As described above, the frame 44 includes the first region 44w on the second end 3d side of the main body 3 (the lower left side in FIG. 3 and FIG. 4) and the first end 3c side of the main body 3 (FIG. 3). And a second region 44z on the upper right side of FIG. 4).

  In the first region 44w, most of the surface on the back surface 3b side (surface shown in FIG. 3) and the surface on the front surface 3a side (surface shown in FIG. 4) are formed flat. That is, the first region 44w is formed in a flat plate shape. The first placement surface 44wa on which the first mounting portion 43a is stacked is formed by the flat surface on the back surface 3b side of the first region 44w, and the second mounting portion 43b is formed by the flat surface opposite to the first placement surface 44wa. A second arrangement surface 44wb to be stacked is formed. The thickness of the first region 44w (the thickness from the first arrangement surface 44wa to the second arrangement surface 44wb, the first thickness) is, for example, 1 to 3 mm.

  In the second region 44z, a plurality of ribs 44a are formed over most of the surface on the back surface 3b side (the surface shown in FIG. 3). The plurality of ribs 44a extend vertically and horizontally and intersect each other. The arrangement pattern of the plurality of ribs 44a is, for example, the same pattern as the reference potential layer 41a formed on the surface of the first circuit board 45 on the frame 44 side. It abuts on the reference potential layer 41a. Thereby, the frame 44 is electrically connected to the reference potential line of the substrate assembly 41.

  A first contact surface 44za on which the first circuit board 45 is stacked is formed on the back surface 3b side of the second region 44z by the top surfaces of the plurality of ribs 44a. The contact surface 44za is located on the back surface 3b side (the upper left side in FIG. 3) with respect to the first arrangement surface 44wa of the first region 44w. That is, a step is formed on the surface on the back surface 3b side of the frame 44 so that the second region 44z is higher than the first region 44w.

  A concave portion 44f into which the display unit 53 is fitted is formed on the front surface 3a side (fourth surface) of the second region 44z. The recess 44f occupies most of the area of the second region 44z. A second contact surface 44zb on which the display 53 is stacked is formed by the bottom surface of the recess 44f.

  The thickness of the second region 44z (the thickness from the first contact surface 44za to the second contact surface 44zb, the second thickness) is thicker than the thickness of the first region 44w. For example, of the thickness of the second region 44z, the thickness obtained by subtracting the protruding amount of the rib 44a (thickness of the plate-like portion) is substantially equal to the thickness of the first region 44w, and the second region 44z is The protruding amount of the rib 44a is thicker than the first region 44w. For example, the thickness of the second region 44z is 3 to 8 mm. Therefore, due to the difference in thickness and the presence of ribs, the second region 44z is formed with higher bending rigidity and torsional rigidity than the first region 44w. In the second region 44z, the peripheral wall portion 44g forming the recess 44f is configured to surround the second region 44z, and contributes to the improvement of the bending rigidity and torsional rigidity of the second region 44z. The thickness of the second region 44z may include the height of the peripheral wall portion 44g.

  For example, as shown in FIG. 3, the frame 44 and the board assembly 41 are fixed by screwing screws 81 inserted through the first circuit board 45 into female screw portions 44 j formed in the frame 44. . The substrate assembly 41 may be fixed to the frame 44 only by being sandwiched between the rear case 31 and the frame 44. The first mounting portion 43a and the second mounting portion 43b and the frame 44 are fixed by an adhesive member such as a double-sided tape or an adhesive.

  The speaker 13 is sandwiched between the first circuit board 45 and the frame 44 on the first end 3 c side of the main body 3. The speaker 13 is arranged with the sound emitting surface 13c facing the frame 44 side. The frame 44 has a hole 44 h for guiding the sound output from the speaker 13 to the front surface 3 a side of the main body 3 at a position where the sound emitting surface 13 c of the speaker 13 faces.

  The microphone 17 is provided on the tongue piece M provided on the second end 3d side of the main body 3 in the first mounting portion 43a of FIG. The microphone 17 is fitted into a notch 44e provided at the edge of the frame 44 on the second end 3d side when the tongue piece M is bent. As shown in FIG. 3, the microphone 17 is arranged with the sound collection surface 17 a facing the front surface 3 a of the main body 3.

  FIG. 6 is a diagram illustrating a method for connecting the board assembly 41 and the FPC 43. 6A is a perspective view showing the first circuit board 45 of the board assembly 41 and the FPC 43 attached to the frame 44, and FIG. 6B is an enlarged view of a region VIb in FIG. 6A. It is.

  As shown in FIG. 6A, the first circuit board 45 includes a main body portion 45a (an example of a second main body portion) stacked on the second region 44z of the frame 44, and the first region 44w side of the main body portion 45a. And an extension portion 45b (an example of a second extension portion) extending from the end portion (see also FIG. 3). As described with reference to FIG. 3, the first contact surface 44za of the second region 44z of the frame 44 on which the first circuit board 45 is stacked is similar to that of the frame 44 on which the first mounting portion 43a of the FPC 34 is stacked. It is formed to be higher than the first arrangement surface 44wa of the first region 44z (located on the direction side (upper side in FIG. 6) facing these surfaces). Therefore, the mounting surface 45d (FIG. 6B) on the frame 44 side of the extension 45b faces the first arrangement surface 44wa of the first region 44w of the frame 44 at a predetermined interval.

  As shown in FIG. 6B, the mounting surface 45d on the frame 44 side of the first circuit board 45 is provided with a second connector 52 for electrically connecting the first circuit board 45 and the FPC 43. Yes.

  On the other hand, the first mounting portion 43a of the FPC 43 has a main body portion 43e (an example of a first main body portion) arranged with the back surface of the first mounting surface 43da facing the first arrangement surface 44wa of the first region 44w of the frame 44. And an extension 43f (an example of a first extension) that extends from the end of the main body 43e on the second region 44z side and is bent with respect to the main body 43e (FIGS. 3 and 5 also). reference).

  The extension portion 43f is bent in one direction and then bent in the opposite direction. That is, the extension 43f is bent in a Z shape. Accordingly, in the extension portion 43f, the first mounting surface 43da is oriented in the same direction as the first mounting surface 43da in the main body portion 43e. The first mounting surface 43da in the extension portion 43f faces the second connector 52. A first connector 51 that can be connected to the second connector is provided on the first mounting surface 43da of the extension 43f. The first connector 51 and the second connector 52 are disposed in a direction opposite to the extension 45b and the first arrangement surface 44wa between the extension 45b of the first circuit board 45 and the first arrangement surface 44wa in the first region 44w. Are fitted and connected. As a result, the FPC 43 is electrically connected to the first circuit board 45 so as to absorb the height difference of the frame 44.

  Note that the types of the first connector 51 and the second connector 52 may be appropriately selected. For example, the first connector 51 and the second connector 52 are not particularly illustrated, for example, one is a so-called male connector, has a plurality of terminals around the protrusion, and the other is a so-called female connector, A plurality of terminals are provided on the inner peripheral surface of the recess into which the protrusion is fitted.

  FIG. 7 is a diagram for explaining the arrangement position of the battery 34 in the mobile phone 1. FIG. 7A is a perspective view of a part of the internal assembly 21, and FIG. 7B is a perspective view showing the mobile phone 1 with the lid 33 removed. Both FIG. 7A and FIG. 7B are perspective views from the back surface 3 b side of the mobile phone 1.

  As shown in FIG. 7A, the second region 44z of the frame 44 is thicker than the first region 44w, and the first contact surface 44za on which the first circuit board 45 is stacked is the first mounting portion of the FPC 43. 43a is formed higher than the first arrangement surface 44wa on which it is stacked (located on the back surface 3b side (the upper side in FIG. 7A)), and therefore the second end 3d side of the internal assembly 21 A recess 21b is formed on the lower right side of FIG.

  Then, as shown in FIG. 7B, the battery 34 is inserted from the opening 31d on the second end 3d side of the rear case 31 and disposed in the recess 21b. The battery 34 has, for example, a thin rectangular parallelepiped shape. The battery 34 is disposed in a stacked manner with respect to the first region 44w.

  FIG. 8 is a block diagram showing the configuration of the signal processing system of the mobile phone 1.

  The cellular phone 1 includes a CPU 85, a memory 86, a communication processing unit 87, an acoustic processing unit 91, and an image processing unit 93. Each of these parts is constituted by an IC provided on the substrate assembly 41, for example.

  The CPU 85 and the memory 86 function as a control unit that performs predetermined calculations based on signals from various units such as the operation unit 11 and controls various units such as the image processing unit 93.

  The communication processing unit 87 includes a high frequency circuit. The communication processing unit 87 modulates various data such as acoustic data and image data processed by the CPU 85 and transmits the data via the antenna 89 in order to perform long-distance wireless communication using radio waves. Further, the communication processing unit 87 demodulates the signal received via the antenna 89 and outputs the demodulated signal to the CPU 85.

  The acoustic processing unit 91 converts the acoustic data from the CPU 85 into an electrical signal and outputs the electrical signal to the speaker 13 for calling and the speaker 35 for notifying incoming calls. The speaker 13 and the speaker 35 convert the electric signal from the sound processing unit 91 into sound and output the sound. On the other hand, the microphone 17 converts the input sound into an electrical signal and outputs it to the sound processing unit 91. The acoustic processing unit 91 converts the electrical signal from the microphone 17 into acoustic data and outputs it to the CPU 85.

  The image processing unit 93 converts the image data from the CPU 85 into an image signal and outputs it to the display unit 9. Further, the imaging signal (image data) output from the predetermined camera module 95 is converted into image data of a predetermined format and output to the CPU 85.

  According to the above embodiment, in the mobile phone 1, the frame 44 has the first region 44 w and the second region 44 z having different thicknesses, and the first placement surface 44 wa of the first region 44 w of the frame 44 has The first mounting portion 43a formed of a flexible substrate is disposed, and the first circuit board 45 is disposed on the first contact surface 44zb of the second region 44z of the frame 44 and is bent at the first mounting portion 43a. The first circuit board 45 and the first mounting part 43a are electrically connected by the first connector 51 provided in the extended part 43f and the second connector 52 provided in the first circuit board 45. On the back surface 3b side of the frame 44, different substrates are disposed in the thin first region 44w and the thick second region 44z. Therefore, even if bending deformation occurs between the first region 44w and the second region 44z, there is no possibility that the substrate is damaged as in the case where one substrate is disposed over the entire frame 44. In addition, since the first circuit board 45 and the first mounting portion 43a are electrically connected using the flexibility of the first mounting portion 43a, the configuration is simple. Then, the housing can be reduced in size by, for example, arranging parts in a portion where the frame 44 is thinned.

  The first region 44w is thinner than the second region 44z, the first arrangement surface 44wa of the first region 44w is lower than the first contact surface of the second region 44z, and the first circuit board 45 is composed of the main body 45a. The extension portion 45b extends from the first region 44w and faces the first arrangement surface 44wa of the first region 44w, and the extension portion 43f of the first mounting portion 43a is Z-shaped with respect to the main body portion 43e of the first mounting portion 43a. The first connector 51 and the second connector 52 are bent so that the surface provided with the first connector 51 is opposed to the surface provided with the second connector 52 of the extension 45b of the first circuit board 45. Therefore, the arrangement space for the first connector 51 and the second connector 52 is secured using the step between the first region 44w and the second region 44z, and the housing can be downsized. In addition, since the extended portion 43f of the Z-shaped first mounting portion 43a is arranged at the step, the extended portion 45b of the first circuit board 45 is changed to the first portion by bending at the boundary between the first region 44w and the second region 44z. Even if it is close to or separated from one region 44w, the change can be absorbed by the Z-shaped deformation, and disconnection is also suppressed. Further, the mounting surface (first mounting surface 43da) on which the first connector 51 is arranged is continuous with the mounting surface (first mounting surface 43da) of the main body 43e of the first mounting portion 43a. One-sided mounting of the portion 43a is also realized.

  In the first area 44w, a second mounting section 43b in which a plurality of switches 55 are disposed is stacked on the back surface of the surface on which the first mounting section 43a is stacked, and the first circuit board in the second area 44w. Since the display 53 is laminated on the back of the surface on which the 45 is laminated, the first area 44w is more easily loaded and deformed than the second area 44z by the user's pressing. However, since the first mounting portion 43a disposed in the first region 44w is a flexible substrate, there is no possibility of damage due to bending of the first region 44w.

  Since the first mounting portion 43a and the second mounting portion 43b are configured by winding one flexible substrate around the frame 44, the number of components can be reduced. In addition, the mounting surfaces can be simplified by simplifying the mounting process.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  The mobile electronic device is not limited to a mobile phone. For example, the portable electronic device may be a digital camera or a PDA. The portable electronic device is not limited to a flip-type device. For example, the portable electronic device may be a straight type device that does not have a flip, or may be a foldable type device in which two housings are connected so as to be openable and closable.

  The first region and the second region may be formed such that the surface of any region is higher than the surface of the other region on the side where the first substrate and the second substrate are stacked in the frame. In the embodiment, the case where the first connector and the second connector are arranged at a position overlapping the first area is exemplified, but the first connector and the second connector may be arranged at a position overlapping the second area. The extension part of the first substrate (flexible substrate) is not limited to one that is bent in a Z shape. For example, it may be bent only once or may be bent three or more times.

The perspective view which shows the external appearance of the mobile telephone of embodiment of this invention. The disassembled perspective view of the mobile telephone of FIG. FIG. 2 is an exploded perspective view of a part of the internal assembly of the mobile phone of FIG. 1. FIG. 4 is an exploded perspective view of a portion of the inner assembly as viewed from the opposite side of FIG. 3. FIG. 4 is an exploded view of the FPC of the internal assembly of FIG. 3. The figure explaining the connection method of the circuit board and FPC of the internal assembly of FIG. FIG. 3 is a diagram illustrating a battery arrangement position of the mobile phone in FIG. 1. The block diagram which shows the structure of the signal processing system of the mobile telephone of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mobile phone (mobile electronic device), 7 ... Housing | casing, 44 ... Frame, 44w ... 1st area | region, 44z ... 2nd area | region, 43a ... 1st mounting part (1st board | substrate), 43e ... Main-body part (1st Main body part), 43f ... Extension part (first extension part), 45 ... First circuit board (second board), 51 ... First connector, 52 ... Second connector.

Claims (4)

A housing,
A first region and a second region that is thicker than the first region are provided in the housing, and a surface on one side of the first region is formed lower than a surface on the one side of the second region. The frame being
A substrate composed of a flexible substrate, the first body portion laminated on the one surface in the first region, and extending from the end of the first body portion on the second region side, A first substrate having a first extension bent with respect to the first body portion;
A second main body portion stacked on the one side surface in the second region, and an end portion on the first region side of the second main body portion, facing the one side surface of the first region. A second substrate having a second extension to
A first connector provided on the first extension of the first substrate;
A second connector provided on the second extension of the second substrate;
With
A portable electronic device in which the first extension portion is folded in the first region, and the first connector and the second connector are connected in the first region. The second connector is provided on a surface of the second extension that faces the surface on the one side of the first region,
The first connector is provided on a surface of the first extension portion that is continuous with a surface opposite to the surface of the first main body portion facing the frame;
The first connector and the second connector have a surface in which the first extension portion is bent in one direction with respect to the first main body portion and is bent in the opposite direction to the first main body portion. The portable electronic device according to claim 1, wherein the two are connected to each other by facing the surface of the second extension portion on which the second connector is provided. Multiple switches,
A switch board provided on the back surface of the one side of the first region and provided with the plurality of switches;
An indicator stacked on the back surface of the one side surface of the second region;
The portable electronic device according to claim 1, comprising: The portable electronic device according to claim 3, wherein the first substrate and the switch substrate are configured by winding one flexible substrate around the frame.

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