JP2008211117A - Reinforcing device for printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To unfailingly mount a sub-board on a main board so as to prevent the sub-board from being peeled off from the main board. <P>SOLUTION: A reinforcing device has a structure in which a protrusion 2a of a sub-board 2 is inserted into a longitudinal hole 3 of a main board 1, thereby connecting the sub-board 2 to the main board 1 in a perpendicular state, and a reinforcing plate 12 engaged with guiding holes 14 formed at the side edge of the sub-board 2 so as to be movable within a predetermined range is provided, wherein a stopper 19 formed on the main board 1 and protruding from the inner side edge of a positioning hole 18 toward to the inside of the positioning hole 18 along the longitudinal hole 3 is provided, a slit 13 is formed at the reinforcing plate 12 oppositely to the stopper 19, the protrusion 2a of the sub-board 2 is inserted into the longitudinal hole 3 and the end 12a of the reinforcing plate 12 is inserted into the positioning hole 18, the reinforcing plate 12 is moved along the guiding holes 14 so that the slit 13 of the reinforcing plate 12 is fixed to the stopper 19, and soldering is applied between the end 12a of the reinforcing plate 12 and the main board 1 and between the protrusion 2a of the sub-board 2 and the main board 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a reinforcing device for a printed wiring board composed of a main board and a sub board, such as a liquid crystal television, for example. In particular, the sub board can be securely attached without being separated from the main board.

Conventionally, as an example of this type of device, there is one described in Patent Document 1, which is shown in FIGS. 7 and 8, where FIG. 7 is a perspective view, and FIG. FIG. 8B is a DD arrow view.

As shown in FIGS. 7 and 8, a printed wiring board including a main board 1 and a sub board 2 on which electronic components (not shown) are mounted is provided, and the sub board 2 is formed in the vertical hole 3 of the main board 1. By inserting the protrusions 2 a with lands 4, the sub-board 2 is connected to the main board 1 in an orthogonal state, and a pair of reinforcing plates 5 are provided between the sub-board 2 and the main board 1. .

The reinforcing plate 5 has a rectangular plate shape, and an end portion 5a with a land 4 is integrally projected on one end side thereof, and a slit 6 is formed on the other end side.

Concave steps 7 are formed on both side edges of the sub-board 2 so as to face the slit 6, and lateral holes 8 are formed in the main board 1 so as to face the end 5 a of the reinforcing plate 5.

Explaining the assembly procedure, the reinforcing plates 5 are attached to both sides of the sub-board 2 by engaging the slits 6 of the reinforcing plates 5 with the respective concave steps 7 of the sub-board 2. Subsequently, simultaneously with the insertion of the protruding portion 2 a of the sub-board 2 into the vertical hole 3, the end portion 5 a of each reinforcing plate 5 is inserted into each of the horizontal holes 8, and the protruding portion 2 a of the sub-board 2 and the reinforcing plate 5 Soldering 9 between the end 5a and the main board 1
Apply.
JP-A-9-148700

In the conventional configuration, as shown in FIG. 7, a lateral external force P substantially parallel to the main substrate 1.
Even if 1 is applied to the front and rear surfaces of the sub-board 2, since the sub-board 2 is reinforced by the two reinforcing plates 5 so that the sub-board 2 does not tilt against the lateral external force P1, the lateral external force P1 is soldered. The soldering 9 is not directly peeled off and the soldering 9 is not peeled off. However, upward external force P
When 2 is applied to the sub-board 2, the end portions 5a of both reinforcing plates 5 are only inserted into the horizontal holes 8 from above, so that the reinforcing plates 5 cannot counter the upward external force P2, The board 2 is pulled up away from the main board 1, and an upward external force P2 is directly applied to the soldering 9, and the soldering 9 may be peeled off.

An object of the present invention is to provide a reinforcing device for a printed wiring board in which a sub-board can be securely attached so as not to be separated from a main board in view of the above-mentioned conventional drawbacks.

In order to achieve the above object, an invention according to claim 1 has a printed wiring board composed of a main board and a sub board, and the sub board is inserted into the vertical hole of the main board, thereby inserting the sub board. In a printed wiring board reinforcing apparatus in which a board is connected in a state orthogonal to the main board and a reinforcing board is provided between the sub board and the main board, the reinforcing board is separated from the main board or the sub board. A cross-shaped slit made of a substrate and having a vertical slit portion extending from the center of the end portion of the reinforcing plate and a horizontal slit portion crossing the center of the vertical slit portion is formed in the reinforcing plate, and the side edge of the sub-board A guide hole comprising: an inlet hole extending along the longitudinal direction of the sub-board; and a back-side hole that is bent from the back of the inlet hole toward the protruding portion and extends toward the center of the sub-board in parallel with the inlet hole A pair of stoppers that are formed and that are opposed to the back side hole and that are formed with a positioning hole that communicates with the end of the vertical hole in the main substrate and project into the positioning hole along the vertical hole from the inner edge of the positioning hole The vertical slit portion of the reinforcing plate is fitted to the sub-board, the reinforcing plate is moved along the inlet hole to the back side hole, and the protruding portion of the sub-board is inserted into the vertical hole, By inserting the end of the reinforcing plate into the positioning hole and moving the reinforcing plate along the back side hole, the lateral slit portion of the reinforcing plate is fitted to each stopper portion, and the end of the reinforcing plate and the sub It is characterized in that soldering is performed between the protruding portion of the substrate and the main substrate.

Invention of Claim 2 has a printed wiring board which consists of a main board | substrate and a sub board | substrate,
By inserting the protrusion of the sub-board into the vertical hole of the main board, the sub-board is connected to the main board in a state of being orthogonal to the main board, and the reinforcing plate is provided between the sub-board and the main board. In the reinforcing device for a wiring board, the reinforcing plate is movably engaged with a guide hole formed in a side edge of the sub-board, and a positioning hole is formed in the main board so as to face the guide hole. A stopper portion that protrudes into the positioning hole along the vertical hole from the edge is provided,
A slit is formed in the reinforcing plate so as to face the stopper portion, and the protruding portion of the sub-board is inserted into the vertical hole, and the end portion of the reinforcing plate is inserted into the positioning hole, and the reinforcing plate is moved along the guide hole. The slits of the reinforcing plate are fitted into the stopper portions by being moved, and soldering is performed between the end portion of the reinforcing plate and the protruding portion of the sub board and the main board.

According to a third aspect of the present invention, in the invention of the second aspect, the guide hole extends from a side edge of the sub-board along the longitudinal direction of the sub-board, and from the back of the inlet hole. It consists of a back side hole that bends to the protruding part side and extends to the center side of the sub-board in parallel with the inlet hole. The reinforcing plate is moved along the inlet hole to the back side hole, and the protruding part of the sub-board is a vertical hole. At the same time as inserting into
By inserting the end of the reinforcing plate into the positioning hole and moving the reinforcing plate along the back side hole,
The feature is that the slit of the reinforcing plate is fitted to the stopper portion.

According to a fourth aspect of the present invention, in the third aspect of the present invention, the slit is formed into a cross shape by a vertical slit portion extending from the center of the end portion of the reinforcing plate and a horizontal slit portion crossing the center of the vertical slit portion. By engaging the vertical slit portion with the sub-board, the reinforcing plate is movably engaged from the inlet hole to the back side hole, and the end portion of the reinforcing plate is inserted into the positioning hole. By moving the reinforcing plate along the back side hole, the lateral slit portion of the reinforcing plate is fitted to the stopper portion.

According to a fifth aspect of the present invention, in the invention according to the second to fourth aspects, the reinforcing plate is a discarded substrate separated from the main substrate or the sub substrate.

The invention according to claim 1 corresponds to one embodiment (see FIGS. 1 to 6), and according to this, a lateral external force substantially parallel to the main board is applied to the front and rear surfaces of the sub board. Even if it is applied, it is reinforced with a reinforcing plate so that the sub-board does not tilt against the lateral external force, so the lateral external force is not directly applied to the soldering and the soldering is not peeled off. Can be protected.

Further, when an upward external force is applied to the sub board, the reinforcing board is engaged with the guide hole and the lateral slit portion of the reinforcing board is fitted to the stopper part of the main board so that the sub board faces upward from the main board. Therefore, the upward external force is not directly applied to the soldering, and the soldering can be protected from being peeled off.

Furthermore, the guide hole of the sub-board is formed in a two-stage fold shape by the entrance hole and the back side hole. By moving the reinforcement plate along the entrance hole to the back side hole, the reinforcement plate becomes the positioning hole. Since they are positioned facing each other, the end of the reinforcing plate can be inserted into the positioning hole at the same time as the protruding portion of the sub-board is inserted into the vertical hole, and the reinforcing plate is moved along the back side hole. Thus, the lateral slit portion of the reinforcing plate can be fitted into the stopper portion, and the assembling work can be performed efficiently.

Furthermore, a vertical slit portion for engaging the reinforcing plate with the guide hole movably by simply forming a cross-shaped slit in the reinforcing plate, and a horizontal stopper portion for engaging the reinforcing plate with the stopper portion. Can be formed at once.

In addition, since the reinforcing plate is formed of a discarded substrate separated from the main substrate or the sub substrate, the manufacturing cost of the reinforcing plate is unnecessary and economical.

The invention according to claim 2 corresponds to the basic form. According to this, even if a lateral external force substantially parallel to the main board is applied to the front and rear surfaces of the sub-board, the lateral external force is applied. Since the sub-board is reinforced by the reinforcing plate so as not to tilt, the lateral external force is not directly applied to the soldering, and the soldering can be protected from being peeled off.

When an upward external force is applied to the sub board, the reinforcing board is engaged with the guide hole, and the slit of the reinforcing board is fitted to the stopper portion of the main board so that the sub board is spaced upward from the main board. Therefore, the upward external force is not directly applied to the soldering, and the soldering can be protected from being peeled off.

According to the third aspect of the present invention, the guide hole of the sub-board is formed in a two-stage fold shape by the inlet hole and the rear side hole, and the reinforcing plate is moved along the inlet hole to the rear side hole. By
Since the reinforcing plate is positioned to face the positioning hole, the protruding portion of the sub-board can be inserted into the vertical hole, and at the same time, the end of the reinforcing plate can be inserted into the positioning hole. By moving along the side hole, the slit of the reinforcing plate can be fitted to the stopper portion, and the assembling work can be performed efficiently.

According to the fourth aspect of the present invention, the vertical slit portion for movably engaging the reinforcing plate with the guide hole only by forming the cross-shaped slit in the reinforcing plate, and the reinforcing plate as the stopper portion. The lateral stopper for engaging can be formed at a time.

According to the invention described in claim 5, since the reinforcing plate is formed of the discarded substrate separated from the main substrate or the sub substrate, the manufacturing cost of the reinforcing plate is unnecessary and economical.

1 to 6 show a printed wiring board reinforcing apparatus according to an embodiment of the present invention. FIG. 1 is a perspective view thereof, FIG. 2A is a longitudinal sectional view thereof, and FIG. ) Is an AA arrow view, FIG. 3 is B
FIG. 4 is an exploded perspective view, FIGS. 5A and 5B are longitudinal sectional views showing the assembly procedure,
FIG. 6A is a longitudinal sectional view showing a modification, and FIG. 6B is a view taken along the line CC.

As shown in FIG. 4, a rectangular plate-shaped reinforcing plate 12 is formed by making a cut 11 in an unnecessary portion of the main board 1 (or sub board 2), and an uncut portion 11a of the cut 11 is formed.
Is cut off from the main board 1.

As shown in FIG. 3, the reinforcing plate 12 includes a vertical slit portion 13a extending from the center of the end portion 12a with the land 4 formed at one end portion of the reinforcing plate 12, and a horizontal slit crossing the center of the vertical slit portion 13a. A cross-shaped slit 13 composed of a portion 13b is formed, and both the vertical and horizontal slit portions 1 are formed.
The widths t1 of 3a and 13b are set to be the same as or slightly larger than the thickness t2 of the main board 1 and the sub board 2.

As shown in FIGS. 1 to 4, an inlet hole 14 a extending from one side edge of the sub-board 2 along the longitudinal direction of the sub-board 2, and an inlet hole bent from the inner part of the inlet hole 14 a to the protruding portion 2 a side. 14a
A guide hole 14 is formed which includes a rear hole 14b extending in the center of the sub-substrate 2 in parallel with the width n1 of the guide hole 14 (14a, 14b). It is set to be the same as or slightly larger than the width n2 of the central portion 12b between the slit portion 13a. Moreover, the entrance side edge 15 of the back side hole 14b is made to correspond with the edge 16 of the protrusion part 2a.

A positioning hole 18 communicating with the end of the vertical hole 3 is formed in the main substrate 1 so as to face the back side hole 14b, and the lateral width k1 of the positioning hole 18 is the same as the width k2 of the end 12a of the reinforcing plate 12 or While being set slightly larger, the vertical width s1 of the positioning hole 18 is the length s2 of the back side hole 14b.
Is provided with a pair of stopper portions 19 that project from the inner edge of the positioning hole 18 along the vertical hole 3 into the positioning hole 18, and each stopper portion 19 is fitted into the horizontal slit portion 13 b. It is made possible. Since the configuration other than the above is substantially the same as the configuration shown in FIGS. 7 and 8, the same parts are denoted by the same reference numerals and the description thereof is omitted.

The assembly procedure will be described. As shown in FIG. 5A, the vertical slit portion 13a of the reinforcing plate 12 is fitted to the sub-board 2, and the central portion 12b of the reinforcing plate 12 is inserted into the inlet hole 14a. The reinforcing plate 12 is moved along the inlet hole 14a to the back side hole 14b to contact or approach the inlet side edge 15 of the back side hole 14b. Subsequently, as shown in FIG. 5B, the protruding portion 2a of the sub-board 2 is inserted into the vertical hole 3, and at the same time, the end 12a of the reinforcing plate 12 is inserted into the positioning hole 18,
By moving the reinforcing plate 12 along the back side hole 14b, the lateral slit portion 13b of the reinforcing plate 12 is fitted to each stopper portion 19, and the end portion 12a of the reinforcing plate 12 and the protruding portion of the sub-board 2 are fitted. Soldering 9 is performed between 2a and the main board 1 (see FIG. 3).

According to the above configuration, as shown in FIG. 1, the lateral external force P <b> 1 that is substantially parallel to the main substrate 1.
Is applied to the front and rear surfaces of the sub-board 2, the sub-board 2 is opposed to the lateral external force P1.
Since it is reinforced by the reinforcing plate 12 so as not to tilt, the lateral external force P1 is not directly applied to the soldering 9, and the soldering 9 can be protected from being peeled off.

As shown in FIG. 1, when the upward external force P <b> 2 is applied to the sub-board 2, the reinforcing plate 12 is engaged with the guide hole 14, and the lateral slit portion 13 b of the reinforcing plate 12 is used as a stopper of the main board 1. Since the sub-board 2 is reinforced so as not to be separated upward from the main board 1 by being fitted to the portion 19, the upward external force P2 is not directly applied to the soldering 9, and the soldering 9 is not peeled off. Can be protected.

Furthermore, the guide hole 14 of the sub-substrate 2 is formed in a two-stage bent shape by the inlet hole 14a and the back side hole 14b, and by moving the reinforcing plate 12 along the inlet hole 14a to the back side hole 14b, Since the reinforcing plate 12 is positioned to face the positioning hole 18, the protruding portion 2 a of the sub-board 2 is inserted into the vertical hole 3 and at the same time, the end 12 a of the reinforcing plate 12 is inserted into the positioning hole 18.
In addition, by moving the reinforcing plate 12 along the back side hole 14b, the lateral slit portion 13b of the reinforcing plate 12 can be fitted into the stopper portion 19, and the assembling work can be efficiently performed. Can be done well.

Furthermore, a vertical slit portion 13a for movably engaging the reinforcing plate 12 with the guide hole 14 only by forming the cross-shaped slit 13 in the reinforcing plate 12, and the reinforcing plate 12 with the stopper portion 19 are engaged. It is possible to form the horizontal slit portion 13b for combining them at a time.

In addition, since the reinforcing plate 12 is formed of a discarded substrate separated from the main substrate 1 (or the sub substrate 2), the manufacturing cost of the reinforcing plate 12 is unnecessary and economical.

In the above embodiment, the guide hole 1 in which one reinforcing plate 12 is formed on one side edge of the sub-board 2.
4 has been described as an example, but the present invention is not limited to this.
As shown in (b), two reinforcing plates 12 may be engaged with guide holes 14 formed on both side edges of the sub-board 2 respectively. In this case, the sub-board 2 can be reinforced and connected to the main board 1 more firmly.

It is a perspective view which shows the reinforcement apparatus of the printed wiring board which is one Embodiment of this invention. (A) is the longitudinal cross-sectional view, (b) is an AA arrow view. It is a BB expansion arrow line view of Drawing 2 (a). It is the same exploded perspective view. (A) (b) is a longitudinal cross-sectional view which shows the assembly procedure. (A) is a longitudinal cross-sectional view which shows a modification, (b) is CC arrow line view. It is a perspective view which shows a prior art example. (A) is the longitudinal cross-sectional view, (b) is a DD arrow view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Main board | substrate 2 Sub board | substrate 2a Projection part 3 Sub hole 3 Reinforcement board 12a End part of reinforcement board 13 Cross-shaped slit 13a Vertical slit part of cross-shaped slit 13b Horizontal slit part of cross-shaped slit 14 Guide hole 14a Inlet hole 14b Back side hole 18 Positioning hole 19 Stopper part

Claims (5)

Having a printed wiring board composed of a main board and a sub board, and inserting the protruding portion of the sub board into the vertical hole of the main board, the sub board is connected to the main board in an orthogonal state. In the printed circuit board reinforcement device in which a reinforcement plate is provided between the substrate and the main substrate, the reinforcement plate is a discarded substrate separated from the main substrate or the sub substrate,
A cross-shaped slit comprising a vertical slit portion extending from the center of the end portion of the reinforcing plate and a horizontal slit portion crossing the center of the vertical slit portion is formed in the reinforcing plate, and the sub substrate is formed from a side edge of the sub substrate. A guide hole is formed which includes an inlet hole extending along the longitudinal direction of the substrate and a rear hole that is bent from the inner portion of the inlet hole toward the protruding portion and extends to the center side of the sub-substrate in parallel with the inlet hole. A positioning hole that communicates with the end of the vertical hole is formed in the main substrate so as to face the side hole, and a pair of stopper portions that project from the inner edge of the positioning hole along the vertical hole into the positioning hole are provided. The vertical slit portion of the reinforcing plate is fitted to the sub-board, the reinforcing plate is moved to the back side hole along the inlet hole, and the protruding portion of the sub-board is inserted into the vertical hole, and at the same time, the end of the reinforcing plate Is inserted into the positioning hole, and the reinforcing plate is The lateral slit portion of the reinforcing plate is fitted to each stopper portion by moving the reinforcing plate, and soldering is performed between the end portion of the reinforcing plate and the protruding portion of the sub-board and the main board. Reinforcing device for printed wiring boards. Having a printed wiring board composed of a main board and a sub board, and inserting the protrusion of the sub board into the vertical hole of the main board, the sub board is connected to the main board in an orthogonal state. In a printed circuit board reinforcing apparatus in which a reinforcing plate is provided between the board and the main board, the reinforcing plate is movably engaged with a guide hole formed in a side edge of the sub-board, and is opposed to the guide hole. A positioning hole is formed in the main substrate, a stopper portion is provided in the positioning hole along the vertical hole from the inner edge of the positioning hole, and a slit is formed in the reinforcing plate so as to face the stopper portion. In addition to inserting the protruding portion of the sub-board into the vertical hole, inserting the end of the reinforcing plate into the positioning hole, and moving the reinforcing plate along the guide hole, the slit of the reinforcing plate becomes the stopper portion. Engaged thereby, reinforcement device of a printed wiring board, characterized in that subjected to soldering between the projecting portion of the end and the sub-board and the main board of the reinforcing plate. The guide hole extending from the side edge of the sub-board along the longitudinal direction of the sub-board; and
The back hole is bent from the back part of the inlet hole to the protruding part side and extends to the center side of the sub-board in parallel with the inlet hole, and the reinforcing plate is moved along the inlet hole to the back side hole. At the same time as inserting the protruding part of the board into the vertical hole, insert the end of the reinforcing plate into the positioning hole, and move the reinforcing plate along the back side hole, so that the slit of the reinforcing plate fits into the stopper part The apparatus for reinforcing a printed circuit board according to claim 2, wherein: The slit is formed in a cross shape by a vertical slit portion extending from the center of the end of the reinforcing plate and a horizontal slit portion crossing the center of the vertical slit portion, and by fitting the vertical slit portion to the sub-board The reinforcing plate is movably engaged from the inlet hole to the back side hole, and the reinforcing plate is moved along the back side hole with the end of the reinforcing plate inserted into the positioning hole. 4. The printed wiring board reinforcing device according to claim 3, wherein the lateral slit portion is fitted into the stopper portion. 5. The printed wiring board reinforcing device according to claim 2, wherein the reinforcing plate is a discarded board separated from a main board or a sub board.

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