JP2008204768A - Miniature relay, transceiver, measuring instrument, and personal digital assistant - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a miniature relay which has a high isolation characteristic and can be easily produced by minimizing a capacity coupling component between contacts without requiring high alignment precision. <P>SOLUTION: The miniature relay includes a movable substrate including a movable electrode and a fixation substrate placed facing the movable substrate and including a fixed electrode, in which a part of the movable substrate is joined to the fixation substrate and elastically supported, movable contacts are placed on a side opposed to the fixation substrate of the movable substrate, a pair of signal wires of which the ends serve as fixed contacts are placed on the side opposed to the movable substrate of the fixation substrate so as to make the ends face each other, and the movable contacts and the fixed contacts can contact with or separate from each other, wherein a recess is disposed in at least a part of areas with which the movable contacts and fixed contacts abut in at least one fixed contact. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a micro relay radio apparatus, a measuring apparatus, and a portable information terminal in which an opening / closing operation between contacts is performed by a minute mechanical operation.

  As a conventional technique, there is a micro relay disclosed in Patent Document 1. FIG. 1A is an external perspective view of the conventional micro relay, and FIG. 1B is a top view. 2A is an enlarged top view schematically showing the contact portion, and FIG. 2B is an AA ′ sectional view of FIG. 2A.

  The fixed substrate 10 has a fixed electrode 12, and the movable substrate 20 has a movable electrode 23. The movable substrate 20 is supported on the fixed substrate via the first elastic support portion 22. A movable contact 28 is provided on the fixed substrate side of the movable substrate 20 via an insulating film. When an electrostatic attractive force is generated between the fixed electrode 12 and the movable electrode 23, the movable electrode is attracted to the fixed electrode side, and the end portions of the two signal lines 13 and 14 formed on the fixed substrate 10 by the movable contact 28. Are in contact with fixed contacts 13a and 14a, respectively. On the other hand, in a state where no electrostatic attractive force is generated between the movable electrode 23 and the fixed electrode 12, the movable contact 28 is separated from the fixed contacts 13a and 14a. In this way, the micro relay electrically opens and closes the signal line. In addition, the fixed electrode 12 is provided at equal distances on both sides along the longitudinal direction of the signal lines 13 and 14, and is configured to be shared with the high-frequency GND electrode.

  According to this configuration, the characteristic impedance can be determined by the ratio of the signal line width and the distance between the fixed electrode (GND electrode) arranged in the same plane as the signal line and the dielectric constant of the fixed substrate. Thus, good high frequency characteristics can be obtained, and application to wireless communication devices, portable information terminals, and the like is expected. Moreover, the manufacturing method is manufactured using a MEMS process. That is, an electrode, a fixed contact, a movable contact, and the like are formed by photolithography on a wafer to be a fixed substrate (for example, a glass wafer) and a wafer to be a movable substrate (for example, a silicon wafer), and the wafers are bonded by anodic bonding or the like. . Thereafter, the bonded wafers are divided by dicing or the like to obtain a large number of microrelays at the same time, which are manufactured by a method suitable for mass production.

JP 2000-113792 A

  As described above, in the conventional micro relay, the fixed substrate and the movable substrate are arranged so that the fixed contact and the movable contact face each other, and when the micro relay is viewed in plan from the movable substrate side, the contact portions overlap each other. (Hereinafter referred to as overlap region B).

  In such a conventional microrelay, even when the overlap region B forms a capacitor structure and the microrelay is in an OFF state, as shown in FIG. 2C, capacitive coupling (C1) is established between the fixed contact and the movable contact. , C2). This capacitive coupling degrades the isolation characteristics when the microrelay is in the OFF state. Therefore, it is necessary to reduce the capacitive coupling in order to improve the isolation characteristics.

In general, when the distance between the contacts is d, the area of the overlap region B is S, and the dielectric constant of the substance between the contacts is ε, the capacitive coupling magnitude C can be expressed as in Equation (1). .
C = εS / d (Formula 1)
That is, it can be seen that the magnitude C of the capacitive coupling is inversely proportional to the distance d between the contacts and proportional to the area S of the portion where the contacts overlap. Accordingly, there is a method of increasing the distance d between the contacts as a first method for reducing the magnitude of capacitive coupling.

  However, when the distance between the contacts is increased, the distance between the movable electrode and the fixed electrode is also increased in the conventional micro relay. When the distance between the movable electrode and the fixed electrode is increased, the electrostatic attractive force between the two electrodes is decreased. Therefore, it is necessary to increase the driving voltage (operating voltage) or increase the area of the electrode. This goes against the demand for low-voltage driving and miniaturization required for current micro relays.

  As another method for reducing the capacitive coupling, there is a method for reducing the area S of the overlap region B.

  However, with this method, high-precision alignment is required in the work of bonding the fixed substrate and the movable substrate, and the allowable range of deviation during alignment is reduced. In particular, when manufacturing using the MEMS process, deviation is likely to occur during photolithography, bonding, and dicing of the wafer, making it difficult to ensure contact between the contacts, which may lead to a decrease in yield. there were.

  Therefore, the conventional technology has a problem that a small micro relay that has good isolation characteristics and is driven at a low voltage cannot be realized.

  An object of the present invention is to provide a micro relay that has high isolation characteristics and can be easily manufactured by reducing the capacitive coupling component between the contacts as much as possible without requiring a high degree of alignment accuracy. is there.

  The microrelay according to the present invention includes a movable substrate having a movable electrode and a fixed substrate disposed opposite to the movable substrate and having a fixed electrode, and a part of the movable substrate is disposed on the fixed substrate. Bonded and elastically supported, a movable contact is disposed on the side of the movable substrate facing the fixed substrate, and an end of the movable substrate is fixed on the side of the fixed substrate facing the movable substrate. In a micro relay in which a pair of signal lines as contacts are arranged so that the end portions are opposed to each other, and the movable contact and the fixed contact can be separated from each other, at least one of the fixed contacts, the movable contact and the A recess is provided in at least a part of the place where the fixed contact abuts. According to the above configuration, since the concave portion is provided in at least a part of the position where the movable contact and the fixed contact come into contact with each other in at least one of the fixed contacts, in the part of the overlap region between the movable contact and the fixed contact, It is possible to provide a region where the distance between the movable contact and the fixed contact is larger than that. Therefore, the capacitive coupling component can be made smaller than that of the conventional micro relay, and the isolation characteristics can be improved. Moreover, since it is not necessary to make it larger than the distance between conventional contacts, it is not necessary to increase the distance between the movable electrode and the fixed electrode. Therefore, it is possible to improve the isolation characteristics without increasing the size of the micro relay and increasing the driving voltage.

  In the micro relay according to the present invention, the width of the fixed contact may be larger than the width of the movable contact. In the microrelay according to the present invention, the width of the opening of the recess may be larger than the width of the movable contact. When the fixed substrate and the movable substrate are bonded by anodic bonding or the like, a micro relay with good isolation characteristics can be manufactured without requiring a high degree of alignment accuracy.

  In the microrelay according to the present invention, when the movable contact and the fixed contact are closed, the end of the movable contact is at the opening of the recess, and the end of the movable contact is in contact with the fixed contact. It may be characterized by not touching. According to the above configuration, it is possible to manufacture a micro relay with better isolation characteristics.

In the microrelay of the present invention, the concave portion may be a through portion. According to the above configuration, it is possible to manufacture a micro relay with better isolation characteristics.

  In the microrelay of the present invention, the movable electrode is formed on the movable substrate, and the fixed electrode is formed on the fixed substrate, and the movable substrate is fixed between the movable electrode and the fixed electrode. It may be a micro relay driven by an electric attractive force.

A radio device according to the present invention includes the micro relay so as to open and close an electric signal between an antenna and an internal circuit.
The measuring device of the present invention is characterized in that the micro relay is provided so as to open and close an electric signal between a measurement object and an internal circuit.
A portable information terminal according to the present invention includes the micro relay so as to open and close an internal electrical signal.

  In addition, the component demonstrated above of this invention can be combined arbitrarily as much as possible.

  As described above, according to the microrelay of the present invention, a small-sized microrelay having good isolation characteristics can be easily manufactured.

  Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 3 is a diagram showing the structure of a microrelay that is an embodiment of the present invention. FIG. 3A is an exploded perspective view of the microrelay according to the present embodiment, and FIG. 3B is a top view. 4A is a top view of a schematic enlarged contact portion of the microrelay according to the present embodiment, and FIG. 4B is a cross-sectional view along AA ′.

  In the micro relay of this embodiment, the movable substrate 20 is integrated with the upper surface of the fixed substrate 10. The fixed substrate 10 is provided with a fixed electrode 12 and two signal lines 13 and 14 on the upper surface of a glass substrate 10a. The signal lines 13 and 14 are formed by sequentially stacking Ru and Au from the surface side of the fixed substrate 10. The surface of the fixed electrode 12 is covered with an insulating film 17 and connected to connection pads 12b1, 12b2, 12b3, 12b4, 12b5, and 12b6 via wirings 12a1, 12a2, 12a3, and 12a4, respectively. The signal lines 13 and 14 are arranged on the same straight line. One end of each signal line 13, 14 is fixed contact 13a, 14a provided at a predetermined interval, and the other end of each signal line 13, 14 is connected to connection pads 13b, 14b. The fixed electrode 12 is disposed on both sides of the signal lines 13 and 14, is formed so as to be the same distance from the signal line, and also serves as a high-frequency GND electrode to constitute a coplanar structure. The fixed electrodes 12 located on both sides of the signal lines 13 and 14 are formed so as to be connected to each other between the fixed contacts 13a and 14a. As a result, the lines of electric force generated by the open / close signal are terminated at the high-frequency GND electrode between the fixed contacts 13a and 14a. The fixed electrode 12 is formed at a position lower than the signal lines 13 and 14. The fixed contacts 13a and 14a are provided with recesses 18 and 19, respectively.

  The movable substrate 20 is a substantially rectangular semiconductor (for example, silicon) substrate, and the movable electrodes 23 are elastically supported by the anchors 21a and 21b via the first elastic support portions 22, and a second elastic member is provided at the center thereof. The movable contact portion 25 is elastically supported through the support portion 24.

  The anchors 21a and 21b are erected on two places on the upper surface of the fixed substrate 10 and are electrically connected to the connection pads 15b and 16b via wirings 15a and 16a provided on the upper surface of the fixed substrate 10, respectively. The first elastic support portion 22 is formed by slits 22a provided along both side edges of the movable substrate 20, and the anchors 21a and 21b are integrated on the lower surface of the end portion.

  The movable electrode 23 faces the fixed electrode 12 and is attracted to the fixed electrode 12 by electrostatic attraction generated by applying a voltage between the electrodes 12 and 23 via the connection pad 15b (or 16b). Further, the movable electrode 23 has portions 26a and 26b facing the signal lines 13 and 14 except for the movable contact portion facing the fixed contact. Thus, the signal lines 13 and 14 are not connected by the movable electrode. The remaining portions become the second elastic support portion 24 and the movable contact portion 25. The second elastic support portion 24 is a narrow beam connecting the movable electrode 23 and the movable contact portion 25, and is configured to obtain a larger elastic force than the first elastic support portion 22 when the contact is closed. Has been. The movable contact portion 25 is obtained by providing a movable contact 28 on the lower surface of the flat portion 25 a supported by the second elastic support portion 24 via an insulating film 27. The movable contact 28 faces the fixed contacts 13a and 14a, and is electrically connected to the signal lines 13 and 14 by closing the fixed contacts 13a and 14a.

Concave portions 18 and 19 are provided at the ends of the signal lines 13 and 14 arranged on the fixed substrate in a straight line so as to be adjacent to each other with a space therebetween, that is, at the fixed contacts 13a and 14a. As shown in FIG. 4B, the recess does not completely penetrate to the fixed substrate, and is formed in a state where a part of the signal line is left on the bottom surface of the recess. The ends of the movable contact 28 are arranged so as to face the recesses 18 and 19 provided in the fixed contacts 13a and 14a, respectively. Accordingly, in the overlap region B, there are a region that actually contacts the movable contact (hereinafter referred to as an actual contact portion B1) and a region that does not actually contact (hereinafter referred to as an apparent contact portion B2). . That is, when the contact portion is viewed from the top side of the movable substrate side, the area of the overlap region B of the movable contact and the fixed contact is the same as that of the conventional electrostatic micro relay, but in reality, the movable contact is of the recesses 18 and 19. The contact is made between the edge and the end of the fixed contact, that is, only at the actual contact, and not at the apparent contact. Therefore, the area of the overlap region B and the distance between the contacts in the actual contact portion are the same as those of the conventional electrostatic micro relay, but the distance between the contacts in the apparent contact portion is the same as that of the conventional electrostatic micro relay. It is larger than the distance.
In this embodiment, the concave portions are provided in both the fixed contact portions 13a and 14a. However, the concave portions may be formed in only one of the fixed contact portions.

  Hereinafter, capacitive coupling in the contact portion of the electrostatic micro relay according to the present embodiment will be described.

  FIG. 6A is a diagram schematically showing a capacitive coupling component generated between an apparent contact portion and an actual contact portion in the electrostatic micro relay according to the present embodiment.

In the electrostatic micro relay according to the present embodiment, as shown in the figure, capacitive coupling components C3b and C4b are formed at the apparent contact portion, and capacitive coupling components C3a and C4b are formed at the actual contact portion. At this time, if the capacitive coupling components formed in the overlap region are C3 and C4,
C3 = C3a + C3b
C4 = C4a + C4b
It can be expressed as.

In the electrostatic micro relay according to the present embodiment, the distance between the contacts in the apparent contact portion is larger than the distance between the contacts in the actual contact portion, so that the capacitive coupling components C3b and C4b formed in the recesses
C3b <C3a
C4b <C4a
Become

  Therefore, the capacitive coupling component formed between the contacts of the electrostatic micro relay according to the present embodiment is reduced, and the isolation characteristics are improved.

  In the electrostatic micro relay according to the present embodiment, since it is not necessary to reduce the size of the movable contact and the area of the overlap region, high accuracy is not required for alignment. Therefore, it is possible to easily manufacture a micro relay having excellent isolation characteristics without causing a decrease in yield due to insufficient alignment accuracy.

  Next, a micro relay according to another embodiment of the present invention different from the embodiment will be described.

  FIG. 5A is a top view of the macro relay contact portion of the present embodiment, which is schematically enlarged, and FIG. 5B is a cross-sectional view of AA ′. 4A and 4B, all of the components of the movable substrate 20 are omitted except for the movable contact 28.

  In the first embodiment, the recess does not penetrate and a part of the signal line remains, whereas in this embodiment, the recess penetrates to the surface of the fixed substrate, and the signal line remains on the bottom surface of the recess. There are no differences. In this example, the recessed portions are provided in both the fixed contact portions 13a and 14a. However, a recessed portion that penetrates only one of the fixed contact portions may be formed.

  In the electrostatic micro relay according to the present embodiment, no signal line is left on the bottom surface of the concave portion provided in the fixed contact portions 13a and 14b, and the structure is penetrated. Thus, the capacitive coupling component at the apparent contact portion is not generated, and only the capacitive coupling components C5 and C6 generated at the actual contact portion are generated. Therefore, the electrostatic micro relay according to the first embodiment can further reduce the capacitive coupling component and improve the isolation characteristics.

  Hereinafter, the high frequency characteristics when the shape of the concave portion in the embodiment of the present invention is changed will be described based on simulation results.

FIG. 7A is a schematic cross-sectional view of a simulation model, and FIG. 7B is a schematic top view. In addition, the schematic diagram shown in the figure has a ratio different from the actual size for easy viewing.

  As shown in the figure, the parameters for determining the shape of the recess were D as the depth of the recess, W as the width of the recess in the top view, and L as the length extending in the longitudinal direction of the signal lines 13 and 14. However, for convenience of explanation, only the periphery of the contact is highlighted. The width W of the recess is a length extending in a direction substantially orthogonal to the longitudinal direction of the signal lines 13 and 14 arranged on a straight line.

  FIG. 13 shows the relationship between isolation and insertion loss when the depth D, width W, and length L of the recesses are changed.

  In all simulation models, the width of the movable contact, the distance between the movable contact and the fixed contact, and the distance between the signal lines are the same. The material of the fixed substrate is glass, and the material of the movable substrate is silicon.

  Type 1 is a conventional electrostatic micro relay in which no concave portion is provided in the fixed contact portion, and Type 2 and 3 indicate the high frequency characteristics of the electrostatic micro relay according to the first embodiment. Although the apparent contact area of Type 2 and Type 3 is the same, Type 3 has a larger opening of the recess than Type 2, and the actual contact area is different. Comparing the results, it can be seen that the isolation characteristics are improved when the opening of the recess is enlarged and the area of the actual contact portion is reduced.

  Type 5 to Type 9 indicate the high frequency characteristics of the electrostatic micro relay according to the second embodiment. In Type 5 to Type 7, the apparent contact portions, the areas of the actual contact portions and the L of the recesses have the same value, but only the value of W is changed. In Type 8 and 9, the apparent contact portions, the areas of the actual contact portions and the L of the concave portions have the same value, but only the value of W is different.

  Type 2 and Type 4 and Type 3 and Type 5 have the same size of the opening of the recess and the area of the actual contact portion, but in Type 2 and 3, the signal line remains on the bottom of the recess and does not penetrate In Type 4 and 5, no signal line is left on the bottom surface of the recess, and the signal line penetrates. Therefore, although both have the same actual contact area, Type 4 and 5 do not generate a capacitive coupling component in the apparent contact, so Type 4 and 5 have better isolation characteristics than Type 2 and 3, respectively. I understand that.

  Further, when comparing the types 4 to 7 through which the bottom surface of the same recess penetrates, it can be seen that the isolation value is more excellent as the value of W is larger and the actual contact area is smaller.

  FIG. 8A is a graph showing the relationship between the isolation characteristic and the actual area of the contact portion, focusing attention only on the area of the actual contact portion. Also from this graph, it can be seen that when the concave portion is enlarged and the actual area of the contact portion is reduced, the area of the overlapping portion of the contacts that contribute to capacitive coupling is reduced, so that the isolation characteristics are improved.

  Note that the capacitive coupling component is generated not only between the contacts but also between the fixed contact and the movable substrate. Therefore, the effect can be further improved by increasing the opening of the recess.

  Also, it can be seen that the insertion loss characteristic, which is an index of the insertion loss of the signal, hardly changes with any type as shown in FIG. Therefore, with the micro relay of the present invention, it is possible to improve the isolation characteristics without deteriorating the insertion loss characteristics.

  In the above embodiment, the case where the concave portion is rectangular is shown, but the present invention is not limited to this. FIG. 9 shows various recess shapes applicable to the present invention. For example, as shown in FIG. 9A, there may be a cut in the recess, and the area of the overlapping portion of the contacts can be reduced, and the isolation characteristics are improved. Moreover, the shape of the recessed part provided in two fixed contacts does not necessarily need to be symmetrical (FIG.9 (b)). The shape of the opening of the recess may be an ellipse instead of a rectangle. (FIG. 9 (c)) Further, the shape of the contact having no concave portion may be a pointed shape or a convex shape. (Fig. 9 (d))

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 10 shows a schematic configuration of the wireless communication device 41 of the present embodiment. In the wireless communication device 41, a micro relay 42 is connected between the internal processing circuit 43 and the antenna 44. By turning the micro relay 42 on and off, the internal processing circuit 43 can be switched between a state where transmission or reception is possible through the antenna 44 and a state where transmission or reception is impossible. In this example, the micro relay 1 described in the first or second embodiment is used as the micro relay 42. Thereby, since the micro relay 42 has excellent isolation characteristics, leakage of a high frequency signal when the internal processing circuit 43 is turned off can be suppressed.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 10 shows a schematic configuration of the wireless communication device 41 of the present embodiment. In the wireless communication device 41, a micro relay 42 is connected between the internal processing circuit 43 and the antenna 44. By turning the micro relay 42 on and off, the internal processing circuit 43 can be switched between a state where transmission or reception is possible through the antenna 44 and a state where transmission or reception is impossible. In this example, the micro relay 1 described in the first or second embodiment is used as the micro relay 42. Thereby, since the micro relay 42 has excellent isolation characteristics, leakage of a high frequency signal when the internal processing circuit 43 is turned off can be suppressed.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 11 shows a schematic configuration of the measuring instrument 51 of the present embodiment. In the measuring instrument 51, a plurality of micro relays 52 are respectively connected in the middle of a plurality of signal lines 57 extending from one internal processing circuit 56 to a plurality of measurement objects 58. By turning each micro relay 52 on and off, the measurement object 58 to be transmitted or received by the internal processing circuit 56 can be switched.

  In this example, the microrelay 1 described in the first or second embodiment is used as the microrelay 52. Thereby, since the micro relay 52 has excellent isolation characteristics, leakage of high frequency signals when the internal processing circuit 56 is off can be suppressed.

  Next, another embodiment of the present invention will be described with reference to FIG. FIG. 12 shows a main configuration of the portable information terminal 61 of the present embodiment. In the portable information terminal 61, two micro relays 62a and 62b are used. One micro-relay 62a functions to switch between the internal antenna 63 and the external antenna 64, and the other micro-relay 62b changes the signal flow between the power amplifier 65 on the transmission circuit side and the low noise amplifier 66 on the reception circuit side. And can be switched to.

  In this example, the microrelay 1 described in the first or second embodiment is used for the microrelays 62a and 62b. Thereby, since the micro relays 62a and 62b have excellent isolation characteristics, leakage of a high frequency signal when the power amplifier 65 or the low noise amplifier 66 is off can be suppressed.

FIG. 1A is an external perspective view of a conventional micro relay. FIG. 1B is a top view of a conventional micro relay. FIG. 2A is a top view schematically showing an enlarged contact portion of a conventional micro relay. FIG. 2B is a cross-sectional view taken along line AA ′ of FIG. FIG. 2C is a diagram schematically showing capacitive coupling in the contact portion. FIG. 3A is an exploded perspective view of a micro relay according to an embodiment of the present invention. FIG. 3B is a top view of a microrelay that is an embodiment of the present invention. FIG. 4A is a top view schematically showing a contact portion of a micro relay according to one embodiment of the present invention. FIG. 4B is a view showing a cross section taken along the line AA ′ in FIG. FIG. 5A is a top view schematically showing a contact portion of a micro relay according to one embodiment of the present invention. FIG. 5B is a view showing a cross section taken along the line AA ′ of FIG. FIG. 6A and FIG. 6B are diagrams schematically showing capacitive coupling generated between an apparent contact portion and an actual contact portion in the electrostatic micro relay according to the embodiment of the present invention. FIG. 7A is a schematic diagram showing a cross section of the contact portion of the micro relay used in the simulation. FIG. 7B is a top view of FIG. FIG. 8A is a graph showing the relationship between the actual contact area and the isolation characteristics. FIG. 8B is a graph showing the relationship between the shape of the recess provided in the contact portion and the insertion loss. FIG. 9 is a diagram showing an example of the shape of the contact concave portion of the contact applicable to the present invention. FIG. 10 is a diagram illustrating a schematic configuration of a wireless communication device including a micro relay according to an embodiment of the present invention. FIG. 11 is a diagram illustrating a schematic configuration of a measuring instrument including a micro relay according to an embodiment of the present invention. FIG. 12 is a diagram showing a main configuration of a portable information terminal including a micro relay according to an embodiment of the present invention. FIG. 13 shows the relationship between isolation and insertion loss when the depth D, width W, and length L of the recesses are changed.

Explanation of symbols

10 fixed substrate 10a glass substrate,
12 Fixed electrode 12a1, 12a2, 12a3, 12a4 Wiring 12b1, 12b2, 12b3, 12b4, 12b5, 12b6 Connection pad 13, 14 Signal line 13a, 14a Fixed contact 18, 19 Recess 20 Movable substrate 21a, 21b Anchor 22 First elastic support Part 23 Movable electrode 24 Second elastic support part 25 Movable contact part 25a Flat part 28 Movable contact 41 Wireless communication device 42 Micro relay 43 Internal processing circuit 44 Antenna 51 Measuring instrument 52 Micro relay 56 Internal processing circuit 58 Measurement object 61 Portable information Terminal 62a, 62b Micro relay 63 Internal antenna 64 External antenna 65 Power amplifier 66 Low noise amplifier

Claims (9)

A movable substrate with movable electrodes;
The fixed substrate is disposed opposite to the movable substrate and includes a fixed electrode,
A part of the movable substrate is bonded to the fixed substrate and elastically supported;
A movable contact is arranged on the side of the movable substrate facing the fixed substrate,
On the side of the fixed substrate facing the movable substrate, a pair of signal lines whose end portions are fixed contacts are arranged so as to oppose the end portions,
In the micro relay in which the movable contact and the fixed contact can be contacted and separated,
At least one of the fixed contacts is provided with a recess in at least a part of a portion where the movable contact and the fixed contact abut. 2. The micro relay according to claim 1, wherein a width of the fixed contact is larger than a width of the movable contact. The micro relay according to claim 1, wherein a width of the opening of the recess is larger than a width of the movable contact. The end of the movable contact is in the opening of the recess when the movable contact and the fixed contact are closed, and the end of the movable contact does not contact the fixed contact. The micro relay according to 1. The micro relay according to claim 1, wherein the concave portion is a through portion. The micro relay according to claim 1, wherein a movable electrode is formed on the movable substrate, and a fixed electrode is formed on the fixed substrate,
The electrostatic micro relay according to claim 1, wherein the movable substrate is driven by an electrostatic attractive force between the movable electrode and the fixed electrode. A wireless device comprising the micro relay according to claim 1 so as to open and close an electric signal between an antenna and an internal circuit. A measuring device comprising the micro relay according to claim 1 so as to open and close an electric signal between a measurement object and an internal circuit. A portable information terminal comprising the micro relay according to claim 1 so as to open and close an internal electrical signal.

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