JP2008195076A - Method of producing cover member for electromagnetic wave shield, and cover member for electromagnetic wave shield - Google Patents

Method of producing cover member for electromagnetic wave shield, and cover member for electromagnetic wave shield Download PDF

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JP2008195076A
JP2008195076A JP2008068114A JP2008068114A JP2008195076A JP 2008195076 A JP2008195076 A JP 2008195076A JP 2008068114 A JP2008068114 A JP 2008068114A JP 2008068114 A JP2008068114 A JP 2008068114A JP 2008195076 A JP2008195076 A JP 2008195076A
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cover member
injection
electromagnetic wave
shielding cover
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Takefumi Mizushima
武文 水島
Kazuo Hattori
和生 服部
Takahide Suzuki
貴英 鈴木
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of producing a cover member for electromagnetic wave shield which enables the injection molding of a cover part having a thickness of 0.2 mm or less by preventing generation of defective appearance, and to provide the cover member for the electromagnetic wave shield which has the cover part thickness of 0.2 mm or less and can be produced at high yield. <P>SOLUTION: The production method for the cover member 1 for electromagnetic wave shield comprises forming a metal layer 6 on the surface of the cover part 3 of an injection-molded product 2 provided with an electronic parts-housing portion 5 and the cover part 3 for covering the housing portion 5. The method is characterized in that the cover part 3 is injection-molded so as to obtain its thickness of 0.2 mm or less by controlling the injection pressure and injection speed of an injection molding machine to be less than 294 MPa (3,000 kgf/cm<SP>2</SP>) and 500 mm/sec or higher, respectively. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、携帯用ノートパソコン、携帯電話等の小型の携帯機器等に使用される電磁波シールド用カバー部材及びその製造方法に関するものである。   The present invention relates to an electromagnetic wave shielding cover member used for a small portable device such as a portable notebook computer or a mobile phone, and a method for manufacturing the same.

携帯用ノートパソコンや携帯電話等の小型の携帯機器は、軽薄短小化に伴い、内部に装着される電磁波シールドを目的とした電磁波シールド用カバー部材においても、機器に占める体積を少なくするために、その厚みを薄くする努力が行われてきた。   In order to reduce the volume occupied by devices in small-sized portable devices such as portable notebook computers and mobile phones, with the aim of reducing the thinness and size, even in electromagnetic shielding cover members intended for electromagnetic shielding mounted inside, Efforts have been made to reduce the thickness.

従来、電磁波シールド用カバー部材を製造する場合には、樹脂を射出成形して形成した薄肉の射出成形品が使用されていて、肉厚が薄い部分に樹脂を充填するために、射出成形機の射出圧力を２９４ＭＰａ（３０００ｋｇｆ／ｃｍ２）以上に上げて成形することで、０．３ｍｍ程度迄の薄肉の射出成形品が製造されるようになってきている。 Conventionally, when manufacturing a cover member for electromagnetic shielding, a thin injection molded product formed by injection molding of a resin has been used, and in order to fill a resin with a thin wall portion, an injection molding machine By molding with an injection pressure increased to 294 MPa (3000 kgf / cm 2 ) or more, thin injection molded products up to about 0.3 mm have been manufactured.

最近では、小型の携帯機器の多機能化に伴って、内蔵される電子部品の高密度化が進み、それらを覆う電磁波シールド用カバー部材の更なる薄肉化が要求されるようになっている。すなわち、電磁波シールド用カバー部材の体積を小さくするためや、電磁波シールド用カバー部材に備える電子部品収容部の容積を大きくするために、電子部品収容部を覆うカバー部を０．３ｍｍ未満の厚みにすることが強く要求されている。   Recently, with the increase in the number of functions of small portable devices, the density of built-in electronic components has been increased, and further reduction in the thickness of the electromagnetic shielding cover member covering them has been demanded. That is, in order to reduce the volume of the electromagnetic shielding cover member or to increase the volume of the electronic component accommodating portion provided in the electromagnetic shielding cover member, the cover portion covering the electronic component accommodating portion has a thickness of less than 0.3 mm. There is a strong demand to do.

従来行われている高圧射出成形法では、射出される樹脂の圧力で金型がたわみ、このたわみによって発生する隙間に樹脂が入り込み、それがバリとなって成形品の外観が損なわれてしまうという問題があり、電子部品収容部を覆うカバー部を０．３ｍｍ未満の厚みに形成することが困難であった。   In the conventional high-pressure injection molding method, the mold bends due to the pressure of the injected resin, and the resin enters the gap generated by this deflection, which becomes a burr and the appearance of the molded product is impaired. There was a problem, and it was difficult to form a cover portion covering the electronic component housing portion with a thickness of less than 0.3 mm.

また、電磁波シールド用カバー部材では、射出成形で形成した電子部品収容部を覆うカバー部の表面に、金属箔等を貼着して金属層を形成し、電磁波シールドの機能を付与していた。一般に入手可能な金属箔の厚みは１０μｍ以上と厚いため、肉厚の薄い電磁波シールド用カバー部材を得るために、電子部品収容部を覆うカバー部の表面に形成する金属層も、容易に薄い金属層を形成することができる方法で形成した金属層とすることが求められている。   Further, in the electromagnetic wave shielding cover member, a metal layer or the like is adhered to the surface of the cover portion that covers the electronic component housing portion formed by injection molding to form a metal layer, thereby providing an electromagnetic wave shielding function. Since the thickness of generally available metal foil is as thick as 10 μm or more, in order to obtain a thin electromagnetic shielding cover member, the metal layer formed on the surface of the cover portion covering the electronic component housing portion is also easily thin metal There is a demand for a metal layer formed by a method capable of forming a layer.

本発明は上記の事情に鑑みてなされたものであり、電子部品収容部と、この電子部品収容部を覆うカバー部とを備える射出成形品の前記カバー部の表面に金属層を形成してなる電磁波シールド用カバー部材の製造方法であって、前記カバー部を、０．２ｍｍ以下の厚みに外観不良の発生なく射出成形で形成することができる電磁波シールド用カバー部材の製造方法を提供すること、さらには、カバー部の厚みが０．２ｍｍ以下であって、歩留まりよく製造できる電磁波シールド用カバー部材を提供することを本発明の目的としている。   This invention is made | formed in view of said situation, and forms a metal layer on the surface of the said cover part of an injection molded product provided with an electronic component accommodating part and the cover part which covers this electronic component accommodating part. An electromagnetic shielding cover member manufacturing method, comprising: providing an electromagnetic shielding cover member manufacturing method capable of forming the cover part by injection molding without occurrence of poor appearance to a thickness of 0.2 mm or less, Furthermore, it is an object of the present invention to provide an electromagnetic wave shielding cover member that can be manufactured with good yield, with the cover portion having a thickness of 0.2 mm or less.

請求項１に係る発明の電磁波シールド用カバー部材の製造方法は、電子部品収容部と、この電子部品収容部を覆うカバー部とを備える射出成形品の前記カバー部の表面に金属層を形成してなる電磁波シールド用カバー部材を製造する電磁波シールド用カバー部材の製造方法であって、射出成形機の射出圧力を２９４ＭＰａ（３０００ｋｇｆ／ｃｍ２）未満、射出速度を５００ｍｍ／秒以上として成形することにより、前記カバー部を０．２ｍｍ以下の厚みに射出成形で形成していることを特徴とする。 According to a first aspect of the present invention, there is provided a method for producing an electromagnetic wave shielding cover member comprising: forming a metal layer on a surface of the cover portion of an injection molded product including an electronic component housing portion and a cover portion covering the electronic component housing portion. A method for producing an electromagnetic shielding cover member for producing an electromagnetic shielding cover member formed by molding an injection molding machine with an injection pressure of less than 294 MPa (3000 kgf / cm 2 ) and an injection speed of 500 mm / second or more. The cover portion is formed to a thickness of 0.2 mm or less by injection molding.

この請求項１に係る発明の電磁波シールド用カバー部材の製造方法では、射出成形機の射出圧力を２９４ＭＰａ（３０００ｋｇｆ／ｃｍ２）未満、射出速度を５００ｍｍ／秒以上として成形するので、カバー部を０．２ｍｍ以下の厚みに成形しても、バリの発生が防止され、外観不良となる射出成形品を低減することができる。 In the manufacturing method of the electromagnetic wave shielding cover member according to the first aspect of the invention, since the injection pressure of the injection molding machine is less than 294 MPa (3000 kgf / cm 2 ) and the injection speed is 500 mm / second or more, the cover portion is 0 Even if it is molded to a thickness of 2 mm or less, the occurrence of burrs is prevented, and the number of injection molded products that cause poor appearance can be reduced.

請求項２に係る発明の電磁波シールド用カバー部材の製造方法は、請求項１記載の電磁波シールド用カバー部材の製造方法において、前記金属層を、射出成形品にめっき処理を施して形成していることを特徴とする。   According to a second aspect of the present invention, there is provided a method for manufacturing an electromagnetic wave shielding cover member according to the first aspect, wherein the metal layer is formed by subjecting an injection molded product to plating. It is characterized by that.

この請求項２に係る発明の電磁波シールド用カバー部材の製造方法では、金属層を、射出成形品にめっき処理を施して形成しているので、容易に薄い金属層を形成することができる。   In the manufacturing method of the electromagnetic wave shielding cover member according to the second aspect of the invention, since the metal layer is formed by subjecting the injection-molded product to plating, the thin metal layer can be easily formed.

請求項３に係る発明の電磁波シールド用カバー部材は、電子部品収容部と、この電子部品収容部を覆うカバー部とを備える射出成形品の前記カバー部の表面に金属層を形成してなる電磁波シールド用カバー部材であって、前記カバー部の厚みが０．２ｍｍ以下であって、且つ請求項１又は請求項２記載の電磁波シールド用カバー部材の製造方法を用いて製造していることを特徴とする電磁波シールド用カバー部材である。   An electromagnetic wave shielding cover member according to a third aspect of the present invention is an electromagnetic wave formed by forming a metal layer on the surface of the cover part of an injection molded product comprising an electronic component housing part and a cover part covering the electronic component housing part. It is a shielding cover member, The thickness of the said cover part is 0.2 mm or less, and is manufactured using the manufacturing method of the electromagnetic wave shielding cover member of Claim 1 or Claim 2. It is a cover member for electromagnetic wave shielding.

この請求項３に係る発明の電磁波シールド用カバー部材は、請求項１又は請求項２記載の電磁波シールド用カバー部材の製造方法を用いて製造しているので、カバー部を０．２ｍｍ以下の厚みに形成していても、外観不良となる射出成形品の発生が少ないため、歩留まりよく製造できる電磁波シールド用カバー部材となる。   Since the electromagnetic shielding cover member of the invention according to claim 3 is manufactured using the method for manufacturing an electromagnetic shielding cover member according to claim 1 or 2, the cover portion has a thickness of 0.2 mm or less. Even if it is formed, the occurrence of an injection-molded product that causes poor appearance is small, so that the electromagnetic wave shielding cover member can be manufactured with high yield.

請求項１に係る発明の電磁波シールド用カバー部材の製造方法では、射出成形機の射出圧力を２９４ＭＰａ（３０００ｋｇｆ／ｃｍ２）未満、射出速度を５００ｍｍ／秒以上として電磁波シールド用カバー部材に使用する射出成形品を製造するので、カバー部を０．２ｍｍ以下の厚みに成形しても、バリの発生が防止され、外観不良となる射出成形品の発生を低減することができる。 In the manufacturing method of the electromagnetic wave shielding cover member of the invention according to claim 1, the injection used for the electromagnetic wave shielding cover member with an injection pressure of the injection molding machine of less than 294 MPa (3000 kgf / cm 2 ) and an injection speed of 500 mm / second or more. Since the molded product is manufactured, even if the cover portion is molded to a thickness of 0.2 mm or less, the generation of burrs is prevented and the occurrence of injection molded products that cause poor appearance can be reduced.

請求項２に係る発明の電磁波シールド用カバー部材の製造方法では、金属層を、射出成形品にめっき処理を施して形成しているので、請求項１に係る発明の効果に加えて、容易に薄い金属層を形成することができるという効果も奏する。   In the manufacturing method of the electromagnetic wave shielding cover member of the invention according to claim 2, since the metal layer is formed by subjecting the injection-molded product to plating treatment, in addition to the effect of the invention of claim 1, it is easy to There is also an effect that a thin metal layer can be formed.

請求項３に係る発明の電磁波シールド用カバー部材は、請求項１又は請求項２記載の電磁波シールド用カバー部材の製造方法を用いて製造しているので、カバー部を０．２ｍｍ以下の厚みに形成していても、外観不良となる射出成形品の発生が少ないため、歩留まりよく製造できる電磁波シールド用カバー部材となる。   Since the electromagnetic shielding cover member of the invention according to claim 3 is manufactured using the manufacturing method of the electromagnetic shielding cover member according to claim 1 or claim 2, the cover portion has a thickness of 0.2 mm or less. Even if it is formed, there is little occurrence of an injection molded product that causes poor appearance, so that the electromagnetic wave shielding cover member can be manufactured with high yield.

以下に本発明の実施の形態を説明する。   Embodiments of the present invention will be described below.

本発明の電磁波シールド用カバー部材の製造方法では、電磁波シールド用カバー部材を製造するに際し、先ず、射出成形機と、金型とを用いて射出成形品を製造し、次いで、得られた射出成形品が備える電子部品収容部を覆うカバー部の表面に金属層を形成する。   In the method for producing an electromagnetic shielding cover member of the present invention, when producing the electromagnetic shielding cover member, first, an injection molded product is produced using an injection molding machine and a mold, and then the obtained injection molding is performed. A metal layer is formed on the surface of the cover portion covering the electronic component housing portion included in the product.

このようにして製造する、電磁波シールド用カバー部材の一実施形態を図１、図２に示す。図１は電磁波シールド用カバー部材１の斜視図であり、図２はＡ−Ａ線断面図である。この実施形態の電磁波シールド用カバー部材１は、図１、図２に示すように、補強のために形成しているリブ４と、リブ４で支持されるカバー部３とを一体に備えている射出成形品２と、電子部品を収容することが予定される電子部品収容部５を覆うカバー部３の表面に形成している金属層６を備えている。また、リブ４で包囲されているが、カバー部３で覆われずに無蓋空間が形成されている領域も、電子部品を収容することが可能であるが、この領域は電磁波シールド機能の付与が予定されない領域である。そして、電子部品収容部５を覆うカバー部３は射出成形によって０．２ｍｍ以下の厚みに形成し、その表面に金属層６を配設する。   One embodiment of the electromagnetic shielding cover member manufactured in this manner is shown in FIGS. FIG. 1 is a perspective view of the electromagnetic wave shielding cover member 1, and FIG. 2 is a cross-sectional view taken along line AA. As shown in FIGS. 1 and 2, the electromagnetic wave shielding cover member 1 of this embodiment is integrally provided with a rib 4 formed for reinforcement and a cover portion 3 supported by the rib 4. A metal layer 6 formed on the surface of the cover part 3 covering the injection molded product 2 and the electronic part housing part 5 which is expected to house the electronic part is provided. In addition, although the region surrounded by the rib 4 but not covered with the cover portion 3 and having an open space can also accommodate electronic components, this region has an electromagnetic wave shielding function. This is an unplanned area. And the cover part 3 which covers the electronic component accommodating part 5 is formed in the thickness of 0.2 mm or less by injection molding, and the metal layer 6 is arrange | positioned on the surface.

図１、図２に示す電磁波シールド用カバー部材１のための射出成形品２を製造する際には樹脂を使用する。この樹脂としては、例えばポリカーボネート、ポリエステル、ポリオレフィン、ポリエチレンテレフタレート（ＰＥＴ）、ポリブチレンテレフタレート（ＰＢＴ）、アクリロニトリル−ブタジエン−スチレン共重合体（以下ＡＢＳと記す。）、ポリエーテルイミド、ポリエーテルサルフォン、ポリフェニレンサルファイド、液晶ポリマー及びこれらの樹脂のアロイ等が挙げられる。   Resin is used when manufacturing the injection molded product 2 for the electromagnetic wave shielding cover member 1 shown in FIGS. Examples of the resin include polycarbonate, polyester, polyolefin, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), acrylonitrile-butadiene-styrene copolymer (hereinafter referred to as ABS), polyetherimide, polyethersulfone, Examples thereof include polyphenylene sulfide, liquid crystal polymers, and alloys of these resins.

そして、射出成形品２を製造する射出成形条件については、射出成形機の射出圧力を２９４ＭＰａ（３０００ｋｇｆ／ｃｍ２）未満、射出速度を５００ｍｍ／秒以上とすることが重要である。この条件下で射出成形して、電子部品収容部５を覆うカバー部３を０．２ｍｍ以下の厚みに形成することにより、カバー部３を０．２ｍｍ以下の厚みに形成していても、バリの発生が防止されるため、外観不良となる成形品を低減することができる。０．２ｍｍ以下の厚みに形成するカバー部３の面積については、特に制限はないが、０．２５ｃｍ２から５ｃｍ２の範囲内とすることが好ましい。また、射出成形機の射出圧力の下限については、特に制限はないが、２９．４ＭＰａ（３００ｋｇｆ／ｃｍ２）以上とすることが未充填部の発生を防止するために好ましい。射出成形機の射出速度の上限については、特に制限はなく、射出成形機の能力が許す限りの高速度で行うことができる。なお、ここでいう射出速度は、射出成形機のプランジャー等の速度を測定して、射出成形機のシリンダー出口における樹脂の移動速度を算出して表示している、射出成形機のシリンダー出口における射出速度を表している。 As for the injection molding conditions for producing the injection molded product 2, it is important that the injection pressure of the injection molding machine is less than 294 MPa (3000 kgf / cm 2 ) and the injection speed is 500 mm / second or more. Even if the cover 3 is formed to a thickness of 0.2 mm or less by injection molding under these conditions, the cover 3 covering the electronic component housing 5 is formed to a thickness of 0.2 mm or less. Since generation | occurrence | production of is prevented, the molded article used as an external appearance defect can be reduced. The area of the cover portion 3 to be formed in a thickness less than 0.2 mm, is not particularly limited, is preferably in the range of 0.25 cm 2 of 5 cm 2. The lower limit of the injection pressure of the injection molding machine is not particularly limited, but is preferably 29.4 MPa (300 kgf / cm 2 ) or more in order to prevent the occurrence of unfilled parts. The upper limit of the injection speed of the injection molding machine is not particularly limited, and the injection speed can be increased as high as the capacity of the injection molding machine allows. In addition, the injection speed here refers to the speed at the cylinder outlet of the injection molding machine, which measures the speed of the plunger of the injection molding machine and calculates and displays the moving speed of the resin at the cylinder outlet of the injection molding machine. It represents the injection speed.

本発明の電磁波シールド用カバー部材の製造方法では、上記のようにして得た、射出成形品２のカバー部３の表面に、例えばＣｕ、Ｎｉ、Ａｌ等の金属からなる金属層６を形成して、電磁波シールド用カバー部材１を製造する。金属層６の形成方法については、特に限定はないが、射出成形品２にメッキ処理を施して形成すると、厚みが１μｍ以下の薄い金属層６を容易に形成できるので好ましい。   In the method for manufacturing an electromagnetic wave shielding cover member of the present invention, the metal layer 6 made of a metal such as Cu, Ni, Al or the like is formed on the surface of the cover part 3 of the injection molded product 2 obtained as described above. Thus, the electromagnetic shielding cover member 1 is manufactured. The method for forming the metal layer 6 is not particularly limited, but it is preferable to form the injection molded product 2 by plating because a thin metal layer 6 having a thickness of 1 μm or less can be easily formed.

上記で説明した、本発明の電磁波シールド用カバー部材の製造方法で製造した図１、図２に示す電磁波シールド用カバー部材１はカバー部３の厚みが０．２ｍｍ以下であっても、歩留まりよく製造できる電磁波シールド用カバー部材１となる。   The electromagnetic wave shielding cover member 1 shown in FIGS. 1 and 2 manufactured by the method for manufacturing an electromagnetic wave shielding cover member of the present invention described above has a high yield even when the thickness of the cover part 3 is 0.2 mm or less. It becomes the electromagnetic wave shielding cover member 1 that can be manufactured.

図３に、図１に示す電磁波シールド用カバー部材１を使用して、プリント基板７に装着した電子部品８を、電磁波シールド用カバー部材１の電子部品収容部５内に収容している電磁波シールド用カバー部材１の使用例の断面図を示す。   3, the electromagnetic wave shield in which the electronic component 8 mounted on the printed circuit board 7 is accommodated in the electronic component accommodating portion 5 of the electromagnetic wave shielding cover member 1 using the electromagnetic wave shielding cover member 1 shown in FIG. 1. Sectional drawing of the usage example of the cover member 1 for an object is shown.

また、図４に、他の実施形態の電磁波シールド用カバー部材１を使用して、プリント基板７に装着した電子部品８を、電磁波シールド用カバー部材１の電子部品収容部５内に収容している電磁波シールド用カバー部材１の使用例の断面図を示す。この場合の電磁波シールド用カバー部材１は、その両側に電子部品収容部５を備えていて、電磁波シールドが必要な電子部品収容部５を覆うカバー部３の表面に金属層６を配設するようにしている。   Further, in FIG. 4, the electronic component 8 mounted on the printed circuit board 7 is accommodated in the electronic component accommodating portion 5 of the electromagnetic shielding cover member 1 using the electromagnetic shielding cover member 1 of another embodiment. Sectional drawing of the usage example of the cover member 1 for the electromagnetic wave shield which is included is shown. The electromagnetic wave shielding cover member 1 in this case is provided with the electronic component housing portions 5 on both sides thereof, and the metal layer 6 is disposed on the surface of the cover portion 3 that covers the electronic component housing portion 5 that requires the electromagnetic wave shielding. I have to.

以下、本発明を実施例に基づいて、さらに説明する。   Hereinafter, the present invention will be further described based on examples.

（実施例１）
射出成形機は日精樹脂工業（株）製の品番ＵＨ−１５００ＴＭを使用し、樹脂は三菱レーヨン（株）製のＡＢＳ樹脂（品番ＴＭ２０Ｍ）を使用し、図１に示す形状の射出成形品２を成形した。射出成形品２の外形寸法は、長さ７０ｍｍ、幅４２ｍｍ、高さ１．５ｍｍであり、カバー部３の厚さは０．２ｍｍとした。 (Example 1)
The injection molding machine uses part number UH-1500TM manufactured by Nissei Plastic Industry Co., Ltd., and the resin uses ABS resin (part number TM20M) manufactured by Mitsubishi Rayon Co., Ltd. Molded. The external dimensions of the injection-molded product 2 were 70 mm in length, 42 mm in width, and 1.5 mm in height, and the thickness of the cover part 3 was 0.2 mm.

射出成形機の射出圧力を２８４ＭＰａ（２９００ｋｇｆ／ｃｍ２）、射出成形機の射出速度を１０００ｍｍ／秒とし、金型温度７０℃で成形して図１に示す形状の射出成形品２を得た。なお、ここでいう射出速度はプランジャーの速度を測定して、射出成形機に表示された射出成形機のシリンダー出口における樹脂の移動速度を表している。 The injection molding machine 2 was molded at an injection pressure of 284 MPa (2900 kgf / cm 2 ), an injection speed of the injection molding machine of 1000 mm / sec, and a mold temperature of 70 ° C. to obtain an injection molded product 2 having the shape shown in FIG. The injection speed here represents the moving speed of the resin at the cylinder outlet of the injection molding machine displayed on the injection molding machine by measuring the plunger speed.

得られた射出成形品２は、良好な外観のものであり、この射出成形品２のカバー部３の表面に無電解銅めっき処理を施して、厚み１．０μｍのＣｕ層を形成して電磁波シールド用カバー部材１を得ることができた。   The obtained injection-molded product 2 has a good appearance, and the surface of the cover part 3 of the injection-molded product 2 is subjected to electroless copper plating to form a Cu layer having a thickness of 1.0 μm. The shielding cover member 1 could be obtained.

（実施例２）
射出成形機の射出圧力を４９ＭＰａ（５００ｋｇｆ／ｃｍ２）、射出成形機の射出速度を１３００ｍｍ／秒とした以外は実施例１と同様の条件で成形して、図１に示す形状の射出成形品２を得た。 (Example 2)
1 is molded under the same conditions as in Example 1 except that the injection pressure of the injection molding machine is 49 MPa (500 kgf / cm 2 ) and the injection speed of the injection molding machine is 1300 mm / sec. 2 was obtained.

得られた射出成形品２は、良好な外観のものであり、この射出成形品２のカバー部３の表面に無電解銅めっき処理を施して、厚み１．０μｍのＣｕ層を形成して電磁波シールド用カバー部材１を得ることができた。   The obtained injection-molded product 2 has a good appearance, and the surface of the cover part 3 of the injection-molded product 2 is subjected to electroless copper plating to form a Cu layer having a thickness of 1.0 μm. The shielding cover member 1 could be obtained.

（比較例１）
射出成形機の射出圧力を３０４ＭＰａ（３１００ｋｇｆ／ｃｍ２）、射出成形機の射出速度を１０００ｍｍ／秒とした以外は実施例１と同様の条件で成形して、図１に示す形状の射出成形品２を得た。 (Comparative Example 1)
1 is molded under the same conditions as in Example 1 except that the injection pressure of the injection molding machine is 304 MPa (3100 kgf / cm 2 ) and the injection speed of the injection molding machine is 1000 mm / second. 2 was obtained.

得られた射出成形品２は、バリが発生している外観不良のものであり、電磁波シールド用カバー部材１用の材料としては不合格であったため、以降の加工は施さなかった。   The obtained injection-molded product 2 had a poor appearance in which burrs were generated, and was not acceptable as a material for the electromagnetic shielding cover member 1, so the subsequent processing was not performed.

（比較例２）
射出成形機の射出圧力を３０４ＭＰａ（３１００ｋｇｆ／ｃｍ２）、射出成形機の射出速度を４５０ｍｍ／秒とした以外は実施例１と同様の条件で成形して、図１に示す形状の射出成形品２を得た。 (Comparative Example 2)
1 is molded under the same conditions as in Example 1 except that the injection pressure of the injection molding machine is 304 MPa (3100 kgf / cm 2 ) and the injection speed of the injection molding machine is 450 mm / sec. 2 was obtained.

得られた射出成形品２は、未充填部が存在する外観不良のものであり、電磁波シールド用カバー部材１用の材料としては不合格であったため、以降の加工は施さなかった。   The obtained injection-molded product 2 was poor in appearance with an unfilled portion and was unacceptable as a material for the electromagnetic wave shielding cover member 1, so that the subsequent processing was not performed.

以上の結果から、本発明の実施例では、良好な外観の射出成形品２が得られ、従って、有用な電磁波シールド用カバー部材１を歩留まりよく得ることができることが確認された。   From the above results, it was confirmed that in the example of the present invention, the injection molded product 2 having a good appearance was obtained, and therefore the useful electromagnetic shielding cover member 1 could be obtained with a high yield.

本発明の一実施形態を説明するための斜視図である。It is a perspective view for explaining one embodiment of the present invention. 同上のＡ−Ａ線断面図である。It is an AA line sectional view same as the above. 本発明の一実施形態の電磁波シールド用カバー部材の使用例を示す断面図である。It is sectional drawing which shows the usage example of the cover member for electromagnetic wave shield of one Embodiment of this invention. 本発明の他の実施形態の電磁波シールド用カバー部材の使用例を示す断面図である。It is sectional drawing which shows the usage example of the cover member for electromagnetic wave shields of other embodiment of this invention.

符号の説明Explanation of symbols

１ 電磁波シールド用カバー部材
２ 射出成形品
３ カバー部
４ リブ
５ 電子部品収容部
６ 金属層
７ プリント基板
８ 電子部品 DESCRIPTION OF SYMBOLS 1 Cover member for electromagnetic shielding 2 Injection molded product 3 Cover part 4 Rib 5 Electronic component accommodating part 6 Metal layer 7 Printed circuit board 8 Electronic component

Claims (3)

電子部品収容部と、この電子部品収容部を覆うカバー部とを備える射出成形品の前記カバー部の表面に金属層を形成してなる電磁波シールド用カバー部材を製造する電磁波シールド用カバー部材の製造方法であって、射出成形機の射出圧力を２９４ＭＰａ（３０００ｋｇｆ／ｃｍ２）未満、射出速度を５００ｍｍ／秒以上として成形することにより、前記カバー部を０．２ｍｍ以下の厚みに射出成形で形成していることを特徴とする電磁波シールド用カバー部材の製造方法。 Production of an electromagnetic shielding cover member for producing an electromagnetic shielding cover member formed by forming a metal layer on the surface of the cover part of an injection molded product comprising an electronic component housing part and a cover part covering the electronic component housing part In this method, the cover part is formed by injection molding to a thickness of 0.2 mm or less by molding the injection molding machine with an injection pressure of less than 294 MPa (3000 kgf / cm 2 ) and an injection speed of 500 mm / second or more. A method for producing an electromagnetic wave shielding cover member. 前記金属層を、射出成形品にめっき処理を施して形成していることを特徴とする請求項１記載の電磁波シールド用カバー部材の製造方法。   2. The method for manufacturing an electromagnetic shielding cover member according to claim 1, wherein the metal layer is formed by subjecting an injection-molded product to plating. 電子部品収容部と、この電子部品収容部を覆うカバー部とを備える射出成形品の前記カバー部の表面に金属層を形成してなる電磁波シールド用カバー部材であって、前記カバー部の厚みが０．２ｍｍ以下であって、且つ請求項１又は請求項２記載の電磁波シールド用カバー部材の製造方法を用いて製造していることを特徴とする電磁波シールド用カバー部材。 An electromagnetic shielding cover member in which a metal layer is formed on the surface of the cover part of an injection molded product comprising an electronic component housing part and a cover part covering the electronic component housing part, wherein the cover part has a thickness An electromagnetic shielding cover member having a thickness of 0.2 mm or less and manufactured using the method for producing an electromagnetic shielding cover member according to claim 1 or 2.
JP2008068114A 2008-03-17 2008-03-17 Method of producing cover member for electromagnetic wave shield, and cover member for electromagnetic wave shield Pending JP2008195076A (en)

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Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04280518A (en) * 1991-03-08 1992-10-06 Fujitsu Ltd Outer package structure for portable terminal equipment for communication equipment or the like
JPH0760777A (en) * 1992-07-08 1995-03-07 Nippon Telegr & Teleph Corp <Ntt> Ultrathin enclosure for electronic appliance
JPH0987530A (en) * 1995-09-25 1997-03-31 Polyplastics Co Thermoplastic resin composition, method for injection-molding the same and injection molding of the same
JPH10323870A (en) * 1997-05-28 1998-12-08 Sumitomo Chem Co Ltd Molding method for liquid crystal polyester resin
JPH1148290A (en) * 1997-08-04 1999-02-23 Mitsubishi Eng Plast Kk Molding, method for molding it, and mold assembly
JPH11245225A (en) * 1998-03-04 1999-09-14 Kanehiro Metalizing:Kk Article of polyethylene terephthalate
JP2000190347A (en) * 1998-12-25 2000-07-11 Nokia Mobile Phones Ltd Method for compression molding of multi-point thin part and compression molding die of multi-point thin part used for this method
JP2001088165A (en) * 1999-09-21 2001-04-03 Teijin Chem Ltd Molding method for obtaining molded article having layered structure controlled in thickness thinly and molded article
JP2001158930A (en) * 1999-12-03 2001-06-12 Hitachi Ltd HIGH STRENGTH Mg BASE ALLOY, Mg BASE CAST ALLOY AND ARTICLE
JP2001246442A (en) * 1999-12-24 2001-09-11 Hitachi Metals Ltd Casing for portable communication terminal
JP2001277280A (en) * 2000-03-30 2001-10-09 Japan Steel Works Ltd:The Method for injection-molding molded article having ultrathin-walled part
JP2002036315A (en) * 2000-07-25 2002-02-05 Oshimo Sangyo Kk Method for producing material having high mechanical strength
JP2002234950A (en) * 2001-02-09 2002-08-23 Toray Ind Inc Electromagnetic-wave shield moldings and thermoplastic resin composition for electromagnetic wave shield moldings
JP2003127172A (en) * 2001-10-29 2003-05-08 Mitsubishi Materials Corp Injection-molded body with thin-walled part and method for manufacturing it, and mold apparatus for it

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04280518A (en) * 1991-03-08 1992-10-06 Fujitsu Ltd Outer package structure for portable terminal equipment for communication equipment or the like
JPH0760777A (en) * 1992-07-08 1995-03-07 Nippon Telegr & Teleph Corp <Ntt> Ultrathin enclosure for electronic appliance
JPH0987530A (en) * 1995-09-25 1997-03-31 Polyplastics Co Thermoplastic resin composition, method for injection-molding the same and injection molding of the same
JPH10323870A (en) * 1997-05-28 1998-12-08 Sumitomo Chem Co Ltd Molding method for liquid crystal polyester resin
JPH1148290A (en) * 1997-08-04 1999-02-23 Mitsubishi Eng Plast Kk Molding, method for molding it, and mold assembly
JPH11245225A (en) * 1998-03-04 1999-09-14 Kanehiro Metalizing:Kk Article of polyethylene terephthalate
JP2000190347A (en) * 1998-12-25 2000-07-11 Nokia Mobile Phones Ltd Method for compression molding of multi-point thin part and compression molding die of multi-point thin part used for this method
JP2001088165A (en) * 1999-09-21 2001-04-03 Teijin Chem Ltd Molding method for obtaining molded article having layered structure controlled in thickness thinly and molded article
JP2001158930A (en) * 1999-12-03 2001-06-12 Hitachi Ltd HIGH STRENGTH Mg BASE ALLOY, Mg BASE CAST ALLOY AND ARTICLE
JP2001246442A (en) * 1999-12-24 2001-09-11 Hitachi Metals Ltd Casing for portable communication terminal
JP2001277280A (en) * 2000-03-30 2001-10-09 Japan Steel Works Ltd:The Method for injection-molding molded article having ultrathin-walled part
JP2002036315A (en) * 2000-07-25 2002-02-05 Oshimo Sangyo Kk Method for producing material having high mechanical strength
JP2002234950A (en) * 2001-02-09 2002-08-23 Toray Ind Inc Electromagnetic-wave shield moldings and thermoplastic resin composition for electromagnetic wave shield moldings
JP2003127172A (en) * 2001-10-29 2003-05-08 Mitsubishi Materials Corp Injection-molded body with thin-walled part and method for manufacturing it, and mold apparatus for it

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