JP2008192952A - Method and apparatus for forming conductive pattern - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conductive pattern forming method capable of accurately forming a fine conductive pattern with a sufficient film thickness, without the use of photosensitive resist, or the like, and without reducing the productivity, and to provide a substrate manufacturing apparatus. <P>SOLUTION: The conductive pattern forming method comprises: a groove forming process for forming a groove by irradiating a substrate 1 with laser light 12 via a mask 11 on which a pattern corresponding to a conductive pattern is formed; a liquid-repellent treatment process for repelling liquid from the substrate 1 after the groove forming process; a treatment process for making the groove of the substrate 1 lyophilic, which is liquid-repelled by the liquid-repellent treatment process; and a conductor forming process for forming a conductive pattern, by discharging a liquid drop of a conductive material liquid into the groove of the substrate 1 made lyophilic by the lyophilic treatment process. In the lyophilic treatment process, the groove is irradiated with a laser light 12 via the mask 11. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method and an apparatus for forming a conductive pattern.

2. Description of the Related Art Conventionally, a method for forming a conductive pattern is known in which fine wirings and the like are formed on a substrate using an inkjet method. As a method for forming such a conductive pattern, a bank is formed on a substrate by a photolithography method, a transfer method, or a printing method, and a concave formed by a conductive material liquid discharged by an ink jet method between the bank and the substrate. What is housed in is known. (For example, refer to Patent Document 1). Further, there is known a technique in which a groove pattern is formed on a substrate by laser light irradiation, and a conductive material liquid is disposed along the groove pattern (for example, see Patent Document 2). In these conductive pattern forming methods, in order to efficiently arrange the conductive material liquid, the former makes the surface of the substrate on which the conductive material liquid is placed lyophilic and the liquid repellent treatment is performed on the surface of the bank. In FIG. 2, the groove pattern in which the conductive material liquid is disposed is subjected to lyophilic treatment and the substrate surface is subjected to lyophobic treatment.
JP 2003-317945 A JP 2006-135090 A

  However, in the conventional method for forming a conductive pattern, the former requires the use of a resist such as a photosensitive resist when a bank is formed on a substrate. When a resist is used, there is a problem that Ag or the like dispersed in the conductive material liquid causes migration to the resist, thereby reducing the reliability of the wiring board. Further, the latter is excellent in that grooves can be formed by laser light without using a resist, but so-called debris such as scattered matter generated by laser processing of the substrate at the time of forming the grooves are formed on the substrate surface. There is a problem that the liquid repellency of the substrate surface is lowered. When the liquid repellency of the substrate surface is lowered, the conductive material liquid accommodated in the groove overflows the substrate surface, and it is difficult to accurately form a conductive pattern such as a fine wiring with a sufficient film thickness.

  Accordingly, the present invention provides a method for forming a conductive pattern and a conductive pattern that can accurately form a fine and sufficient conductive pattern without using a photosensitive resist or the like and without reducing productivity. A forming apparatus is provided.

In order to solve the above problems, a conductive pattern forming method of the present invention is a conductive pattern forming method for forming a conductive pattern on a substrate, and a pattern in which the shape of the conductive pattern is drawn is provided. By irradiating the substrate with a laser beam through the formed mask, a groove forming step for forming a groove having the shape of the conductive pattern, and the substrate on which the groove is formed in the groove forming step is made liquid repellent Lyophobic treatment step, lyophilic treatment step of lyophilizing the groove of the substrate lyophobic in the lyophobic treatment step by irradiating the laser beam through the mask, and the lyophilic treatment step And forming a conductive pattern by discharging a droplet of a conductive material liquid into the groove that has been made lyophilic.
By doing so, even if the liquid repellency of the substrate surface is lowered in the groove forming step, the liquid repellency of the substrate surface can be recovered by the subsequent liquid repellency treatment. In addition, the lyophilicity of the groove processed by laser light is lost by the lyophobic treatment, but the lyophilicity of the groove is restored by irradiating the groove with laser light in the lyophilic process following the lyophobic process. can do. As a result, when the conductive material liquid is stored in the groove in the conductor forming step, the conductive material liquid in the groove is wet and spread due to the lyophilic property inside the groove, and the conductive property liquid is formed due to the liquid repellency of the substrate surface. It is possible to prevent the material liquid from overflowing to the substrate surface. Therefore, the conductive pattern can be accurately formed in the groove with a sufficient film thickness. Also, in the groove lyophilic process, the groove is irradiated with laser light by using the mask used at the time of forming the groove. Therefore, using the same mask as in the groove forming process, the lyophilic process is performed only inside the groove. Compared with the case where the groove is newly made lyophilic by another method, the groove lyophilic treatment can be easily performed without lowering the productivity. In addition, since the groove is made lyophilic by irradiating laser light using the same mask as that used for forming the groove, there is less shift in lyophilicity with respect to the groove pattern than before, and the substrate surface in the vicinity of the groove is Liquid repellency is not impaired. Therefore, since the conductive material liquid is prevented from overflowing to the substrate surface, the formation accuracy of the conductive pattern is improved, and a highly accurate conductive pattern can be formed.

Moreover, in this method invention, it is desirable that the power density of the laser beam in the lyophilic process step is smaller than the power density of the laser beam in the groove forming step.
By doing so, it is possible to remove only the liquid repellent layer formed in the liquid repellent process and prevent the substrate from being processed by the laser beam, thereby preventing the occurrence of debris and improving the liquid repellency of the substrate surface. The groove can be lyophilic without loss.

Moreover, in this method invention, it is desirable to have the washing process which wash | cleans the said board | substrate before the said liquid-repellent treatment process.
By doing so, it is possible to clean the substrate and remove debris attached to the substrate when the grooves are formed. Further, in the lyophobic treatment step subsequent to the cleaning step, the lyophobic treatment can be performed on the substrate that has been cleaned and debris is removed, so that the lyophobic property of the substrate can be recovered and the lyophobic property can be further improved.

Moreover, in this method invention, it is desirable to have a pre-liquid repellency treatment step of performing the liquid repellency treatment of the substrate before the groove forming step.
By doing in this way, it can suppress that a debris adheres to the substrate surface at the time of groove formation. Further, debris adhering to the substrate surface can be more easily removed in the cleaning process.

In addition, the conductive pattern forming apparatus of the present invention includes a laser irradiation unit that irradiates laser light, a plasma processing unit that performs plasma surface treatment, a droplet discharge unit that discharges droplets of a conductive material liquid, and the substrate. And a substrate fixing unit for fixing the substrate, wherein the substrate fixing unit is movably provided between the laser irradiation unit, the plasma processing unit, and the droplet discharge unit.
With this configuration, first, a groove is formed in the substrate by laser light in the laser irradiation unit, and then debris adhering to the substrate surface is cleaned in the plasma processing unit, and then the substrate is made liquid repellent in the same plasma processing unit. The substrate is fixed by performing a series of steps in which the groove is made lyophilic with the laser beam again in the laser irradiation unit, and then the droplet of the conductive material liquid is discharged into the groove of the substrate in the droplet discharge unit. The substrate fixing unit can be continuously performed by moving the substrate fixing unit to each processing unit. Therefore, productivity can be remarkably improved as compared with the case where each apparatus is provided separately when each process is performed and the movement and fixation of the substrate are repeated.

Moreover, the wiring board of the present invention is characterized by including a conductive pattern formed by the above-described method for forming a conductive pattern.
With this configuration, the conductive pattern is formed with a sufficient film thickness inside the groove on the substrate, so that a high-performance wiring substrate can be obtained by reducing the electrical resistance of the wiring. Further, since a highly accurate conductive pattern is formed, a wiring board having a high wiring density can be obtained. Moreover, since the productivity at the time of forming the conductive pattern can be improved, the productivity of the wiring board can be improved and the manufacturing cost can be reduced.

<First embodiment>
Next, embodiments of the present invention will be described with reference to the drawings. In each drawing used for the following description, the scale of each member is appropriately changed to make each member a recognizable size.
As shown in FIG. 1, the substrate 1 is a circuit board such as an FPC (flexible printed wiring) substrate used for an electro-optical device or the like, and is an input for inputting a signal to a drive circuit 2 such as a display device. The wiring 3 and the output wiring 4 for outputting a signal from the drive circuit 2 to the display device or the like are formed. A relatively wide signal wiring is used as the input wiring 3, but the output wiring 4 has a fine pattern with a very narrow line width and wiring interval. Here, the line width and wiring interval of the output wiring 4 are each about 7 μm or less, for example. The substrate 1 is formed of a resin material such as polyimide, epoxy, or liquid crystal polymer, and the input wiring 3 and the output wiring 4 are formed of a conductive material such as gold, silver, copper, palladium, or nickel. ing.

[Conductive pattern forming device]
As shown in FIG. 2, the conductive pattern forming apparatus 100 includes a laser irradiation unit 10 that irradiates laser light, a plasma processing unit 20 that performs plasma surface treatment, and a droplet that discharges a droplet of a conductive material liquid. The discharge part 30 is provided adjacently. The table 41 of the substrate fixing unit 40 is provided with a substrate fixing mechanism (not shown) that fixes the substrate 1. A base portion 42 of the substrate fixing portion 40 is screwed into a screw provided on the drive shaft 43. The drive shaft 43 can be freely controlled by a drive device such as a motor (not shown) and a control unit. A rail 44 is provided below the substrate fixing unit 40 along the installation direction of the laser irradiation unit 10, the plasma processing unit 20, and the droplet discharge unit 30. The substrate fixing unit 40 is supported on the rail 44 by a support unit 45 provided to be slidable on the rail 44, and can freely move among the laser irradiation unit 10, the plasma processing unit 20, and the droplet discharge unit 30. Is provided. The rail 44 is in a grounded state.

  The laser irradiation unit 10 is configured to be able to irradiate the laser beam 12 through the mask 11 toward the substrate 1 fixed to the opposing substrate fixing unit 40 as shown in FIG. The mask 11 is formed with an enlarged pattern of the fine wiring pattern of the output wiring 4 shown in FIG. Here, the mask 11 is formed of, for example, quartz or the like, and the pattern is formed of chromium or the like. A reduction optical system is provided on the substrate 11 side of the mask 11. The reduction optical system includes a 4 × imaging lens 13 that can reduce the projected pattern to, for example, ¼. Further, the laser irradiation unit 10 is provided with an X-axis direction drive axis and a Y-axis direction drive axis in each of the mask 11 and the laser irradiation unit 10 so that the laser beam spot 14 can scan the substrate 1 in the X direction and the Y direction. Are provided so as to be movable in the X direction and the Y direction, respectively. In addition, the laser irradiation unit 10 includes a control device that controls the power density of the laser light 12.

The plasma processing unit 20 shown in FIG. 2 includes an application-side electrode unit that is connected to a power source and is capable of applying a voltage. Further, the table 41 of the opposing substrate fixing part 40 is electrically connected to a grounded rail 44 via a base part 42 and a support part 45, and functions as an earth side electrode part. A cover and an exhaust device (not shown) are movably provided between the substrate fixing unit 40 and the plasma processing unit 20. A gas that supplies O ₂ gas as a processing gas or a mixed gas in which He is used as a carrier gas and a fluorine-containing compound gas such as CF ₄ , C ₂ F ₆ , CClF ₃ , or SF ₆ is mixed with the He gas. A supply device is provided.

  The droplet discharge unit 30 includes a droplet discharge head that discharges droplets toward the opposing substrate fixing unit 40. The droplet discharge head is provided with an X-direction drive axis and a Y-direction drive axis, and is provided so as to be freely movable along the X-direction drive axis and the Y-direction drive axis. In addition, a conductive material for supplying a conductive material liquid in which fine particles of a conductive material such as gold, silver, copper, palladium, nickel and the like are dispersed in a dispersion medium is supplied to the droplet discharge head inside the droplet discharge unit 30. A property material liquid supply unit is provided. Further, a heater for heating the substrate 1 is provided inside the droplet discharge unit 30.

[Method of forming conductive pattern]
Next, a method for forming a conductive pattern using the conductive pattern forming apparatus 100 will be described. As shown in FIG. 2, when the drive shaft 43 is rotated, the board fixing unit 40 moves on the rail 44 along the installation direction of the rail 44. At this time, by controlling the rotation of the motor connected to the drive shaft 43 by the control unit, the board fixing unit 40 can be freely moved to an arbitrary position on the rail 44 and positioned. Here, a substrate 1 that has been subjected to a liquid repellent treatment in advance and on which a liquid repellent layer is formed is used. The substrate 1 is fixed on the table 41 of the substrate fixing unit 40 by a substrate fixing mechanism.

(Groove formation process)
First, by rotating the drive shaft 43, the substrate fixing unit 40 is moved to a position where the substrate 1 faces the laser irradiation unit 10. Next, after positioning the substrate 1, for example, the laser beam 12 of an excimer laser having a wavelength of 196 nm is irradiated from the laser irradiation unit 10 through the mask 11 as shown in FIG. To do. The laser beam 12 emitted from the laser irradiation unit 10 corresponds to the output wiring 4 of the substrate 1 shown in FIG. 1, and the irradiation area 15a in which the pattern formed on the mask 11 shown in FIG. Then, the light is reduced to ¼ by the 4 × imaging lens 13 of the reduction optical system, and irradiated onto the irradiation area 5 a of the substrate 1. The size of the irradiation area 5a of the substrate 1 shown in FIG. 1 is, for example, about 2 mm × 2 mm. 3A to 3D, the irradiation areas 15a to 15h formed on the mask 11 and the irradiation areas 5a to 5h of the substrate 1 are partially omitted for convenience of illustration.

That is, one irradiation area 5a of the substrate 1 shown in FIG. 1 corresponds to one irradiation area 15a formed on the mask 11, and the pattern formed on the irradiation area 15a of the mask 11 is reduced to ¼. It is formed in the irradiation area 5 a of the substrate 1 as a groove pattern for forming the output wiring 4. At this time, the power density of the laser beam 12 is, for example, about 1 J / cm ² and 20 shots are continuously irradiated. As a result, as shown in FIG. 4, the liquid repellent layer 6 on the surface of the substrate 1 can be removed, and a groove 7 having a depth d of about 8 μm can be formed in the substrate 1. At this time, debris 8 generated by the processing of the grooves 7 adheres to the surface of the substrate 1. Further, the formed groove 7 has a shape in which the bottom width W1 is as narrow as about 7 μm, the width W2 of the opening is as wide as about 12 μm, and the upper portion is slightly widened.

  Next, as shown in FIG. 3B, the laser irradiation unit 10 and the mask 11 are moved by the distance D / 4 in the −X direction while the substrate 1 is fixed, and then only the mask is moved by the distance D in the −X direction. Then, a laser beam 12 is irradiated through a pattern formed in the next irradiation area 15 b of the mask 11 to form a groove corresponding to the output wiring 4 of the substrate 1 in the next irradiation area 5 b of the substrate 1. As shown in FIGS. 3C and 3D, this process is repeated, and when the formation of the groove 7 in the irradiation area 5h in the X direction is completed, the laser irradiation unit 10 and the mask 11 are fixed to + Y while the substrate 1 is fixed. After moving the distance D / 4 in the direction, only the mask 11 is moved in the + Y direction by the distance D, and similarly, the irradiation area 16h of the mask 11 is irradiated with the laser beam 12 to form the groove 7 in the irradiation area 6h of the substrate 1. To do. Then, the laser irradiation unit 10 and the mask 11 are repeatedly moved in the + X direction, respectively, while the substrate 1 is fixed, and the laser beam spot 14 is moved in the + X direction of the substrate 1 while moving the laser beam spot 14 in the + X direction. A groove 7 is formed for each of the irradiation areas 6h to 6a. By repeating this, all the patterns formed on the mask 11 are reduced and formed as the pattern of the grooves 7 on the substrate 1 side.

(Washing process)
Next, as shown in FIG. 2, the substrate fixing unit 40 is moved to a position where the substrate 1 on which the groove 7 is formed faces the plasma processing unit 20 (arrow A). Next, the cover is moved between the plasma processing unit 20 and the substrate 1, O ₂ gas is supplied as a processing gas from the gas supply device, a voltage is applied to the application side electrode unit, and the table 41 of the substrate fixing unit 40 is moved. Plasma is discharged in the atmosphere as an earth side electrode part. As a result, as shown in FIG. 5, the surface of the substrate 1 can be cleaned and the debris 8 attached to the surface of the substrate 1 can be removed. At the same time, the liquid repellent layer 6 on the surface of the substrate 1 is also removed. The plasma surface treatment conditions at this time are, for example, a plasma power of 100 to 800 kW, an O ₂ gas flow rate of 50 to 100 ml / min, and a substrate temperature of 70 to 90 ° C. Further, unnecessary gas generated by the discharge of plasma is exhausted by an exhaust device provided in the cover.

(Liquid repellency treatment process)
Next, as shown in FIG. 2, while the purge gas such as He gas is supplied by the gas supply device of the plasma processing unit 20, the gas is exhausted by the exhaust device to purge between the substrate 1 and the plasma processing unit 20. After that, a gas supply device supplies a mixed gas in which a fluorine-containing compound gas such as CF ₄ , C ₂ F ₆ , CClF ₃ , SF ₆ is mixed to He gas, applies a voltage to the application side electrode section, and fixes the substrate Plasma is discharged in the air atmosphere using the table 41 of the unit 40 as the ground side electrode unit. Thereby, as shown in FIG. 6, a new liquid repellent layer 6 'is formed on the surface of the substrate 1 where the grooves 7 are formed and cleaned, and the surface of the substrate 1 is made liquid repellent. At this time, the inside of the groove 7 is also lyophobic. Moreover, the conditions of the plasma surface treatment at this time are, for example, a plasma power of 100 to 800 kW, a mixed gas flow rate of 50 to 100 ml / min, and a substrate temperature of 70 to 90 ° C. Further, unnecessary gas generated by the discharge of plasma is exhausted by an exhaust device provided in the cover.

(Liquidification process)
Next, as shown in FIG. 2, the substrate fixing unit 40 is moved to a position where the substrate 7 on which the groove 7 is formed and the liquid repellent treatment is opposed to the laser irradiation unit 10 is positioned (arrow B). Next, as in the groove forming step, as shown in FIGS. 3A to 3D, the laser irradiation unit 10 and the mask 11 are moved while the substrate 1 is fixed, and the laser irradiation unit 10, for example, The laser light 12 of an excimer laser having a wavelength of 196 nm is sequentially irradiated onto the irradiation areas 5a, 5b... Of the substrate 1 through the irradiation areas 15a, 15b. Thereby, as shown in FIG. 7, the liquid repellent layer 6 ′ inside the groove 7 is removed, and the inside of the groove 7 is made lyophilic. At this time, the power density of the laser beam 12 is, for example, about 0.1 J / cm ² and two shots are continuously irradiated. As described above, the power density of the laser beam 12 in the lyophilic process step is smaller than the power density (about 1 J / cm ² ) of the laser beam 12 in the groove forming step, and the number of shots is adjusted. Only the liquid repellent layer 6 'can be removed. Therefore, it is possible to prevent the generation of the debris 8 generated by processing the substrate 1 and make the inside of the groove 7 lyophilic without impairing the liquid repellency of the surface of the substrate 1.

(Conductor formation process)
Next, as shown in FIG. 2, the substrate 1 whose surface has been subjected to lyophobic treatment and the inside of the groove 7 has been made lyophilic, moves and positions the substrate fixing unit 40 to a position facing the droplet discharge unit 30. (Arrow C). Next, while moving the droplet discharge head of the droplet discharge unit 30 along the pattern of the groove 7 formed on the substrate 1, the droplet discharge head is directed toward the groove 7 of the substrate 1 as shown in FIG. 8. A droplet 21 of conductive material liquid is discharged. At this time, since the inside of the groove 7 is made lyophilic, the liquid droplet 21 arranged inside the groove 7 can easily spread along the groove 7. Thereby, as shown in FIG. 9, the conductive material liquid can be uniformly arranged along the groove 7. Furthermore, since the surface of the substrate 1 is made liquid repellent by the liquid repellent layer 6 ′, the conductive material liquid 22 can be prevented from overflowing to the surface of the substrate 1. Thereby, the conductive material liquid 22 can be disposed in the groove 7 with a sufficient film thickness T.

  Next, the substrate 1 is heated by a heater provided inside the droplet discharge unit 30 to evaporate the dispersion medium of the conductive material liquid 22 and dry it. After the dispersion medium evaporates and dries, the conductive material fine particles left inside the grooves 7 are further heated and baked, thereby forming a conductive pattern as a continuous film as shown in FIGS. 23 can be formed. Here, the film thickness of the formed conductive pattern 23 is about 1 μm, for example.

As described above, according to the present embodiment, since the groove 7 is formed in the substrate 1 by the laser beam 12, it is not necessary to use a photosensitive resist or the like. Therefore, migration can be prevented and a highly reliable substrate 1 can be obtained.
Further, by forming the groove 7 with the laser beam 12, the deep groove 7 can be easily formed as compared with a method using a resist. In addition, the groove 7 is formed in a shape with a narrow width W1 at the bottom and a wide width W2 at the top. Furthermore, since the surface of the substrate 1 is made liquid repellent, the conductive material liquid 22 can be prevented from overflowing to the surface of the substrate 1. As a result, a larger amount of the conductive material liquid 22 can be held in the groove 7. Therefore, the conductive pattern 23 having a larger thickness can be formed, the resistance value of the conductive pattern 23 can be reduced, and the quality can be improved.

Further, since the reduction optical system is used to form the groove 7, a pattern in which the fine conductive pattern 23 formed on the substrate 1 is enlarged is formed on the mask 11, and the pattern is reduced to form the substrate 1 on the substrate 1. Can be transferred. Therefore, a fine groove 7 pattern can be formed on the substrate 1 with high accuracy.
Further, since the groove 7 is formed in such a shape that the width W2 at the top is wider than the width W1 at the bottom, the droplet 21 of the conductive material liquid 22 discharged by the droplet discharge portion can be easily put inside the groove 7. Can be accommodated. Further, since the width W1 of the bottom portion of the groove 7 is narrowed, the width of the conductive pattern 23 after firing whose volume is reduced is substantially equal to the width W1 of the bottom portion of the groove 7 and the width W2 of the upper portion of the groove 7. The width of the conductive material liquid 22 is substantially smaller than the width of the conductive material liquid 22. Therefore, the interval between the conductive patterns 23 can be secured, and the reliability of the substrate 1 can be improved. In addition, it is not necessary to use a chamber or form a vacuum when forming the groove. Therefore, the process can be simplified, the productivity can be improved, and the manufacturing cost can be reduced.

  Further, in the lyophilic step of the groove 7, only the groove 7 can be made lyophilic by the same procedure as that for forming the groove 7 by using the laser irradiation unit 10 used for forming the groove 7. Therefore, compared with the case where the groove 7 is newly made lyophilic with another device or method, the increase in the number of steps can be suppressed and the groove 7 can be made lyophilic more easily. Further, since the groove 7 is made lyophilic by irradiating the laser beam 12 using the same mask 11 as that used for forming the groove 7, the shift in lyophilicity with respect to the pattern of the groove 7 is less than that in the prior art. The liquid repellency of the surface of the substrate 1 in the vicinity of 7 is not impaired. Accordingly, since the conductive material liquid 22 is prevented from overflowing to the surface of the substrate 1, the formation accuracy of the conductive pattern 23 is improved, and the highly accurate conductive pattern 23 can be formed.

  In addition, by using the conductive pattern forming apparatus 100 described in the present embodiment, a series of steps for forming the conductive pattern 23 is performed using the substrate fixing unit 40 to which the substrate 1 is fixed as each processing unit 10, 20, By moving it to 30 as appropriate, it can be carried out continuously. Therefore, productivity can be remarkably improved as compared with the case where each apparatus is provided separately when performing each process and the movement and fixation of the substrate 1 are repeated.

  Therefore, according to the present embodiment, the conductive pattern 23 having a fine and sufficient thickness can be accurately formed without using a photosensitive resist or the like and without reducing the productivity.

<Second embodiment>
Next, a second embodiment of the present invention will be described with reference to FIGS. In the first embodiment described above, a substrate whose surface has been subjected to a liquid repellency treatment in advance is used. However, in the present embodiment, a substrate that has not been subjected to a liquid repellency treatment is used, and the groove forming step described in the first embodiment described above is used. It differs in that it has a pre-liquid repellency treatment process for lyophobic the substrate before. Since the other points are the same as in the first embodiment, the same parts are denoted by the same reference numerals and description thereof is omitted.

(Pre-liquid repellency treatment process)
First, as shown in FIG. 2, the substrate fixing unit 40 that fixes the substrate 1 on the table 41 by the substrate fixing mechanism is rotationally controlled by the drive shaft 43, so that the substrate 1 is positioned at a position facing the plasma processing unit 20. Move and position. Next, in the same manner as the liquid repellency treatment process described in the first embodiment, the gas supply device is used to mix He gas with fluorine-containing compound gas such as CF ₄ , C ₂ F ₆ , CClF ₃ , SF _6. Gas is supplied, a voltage is applied to the application side electrode portion, and the table 41 of the substrate fixing portion 40 is used as the ground side electrode portion to discharge plasma in the atmosphere. As a result, the liquid repellent layer 6 is formed on the surface of the substrate 1. Thereafter, similarly to the first embodiment, the conductive pattern 23 is formed on the substrate 1 through a groove forming process, a cleaning process, a lyophobic process, a lyophilic process, and a conductive pattern forming process.

  As a result, not only the same effects as those of the first embodiment described above can be obtained, but also the pre-liquid repellency treatment step before the groove forming step of the substrate 1 is incorporated as a series of steps for forming the conductive pattern 23 on the substrate 1. be able to. Therefore, it is possible to use the substrate 1 that has not been subjected to the liquid repellent treatment in advance without reducing productivity unnecessarily. Therefore, the cost of the substrate 1 can be reduced. Further, since the surface of the substrate 1 is made liquid repellent, it is possible to prevent the debris 8 from adhering to the surface of the substrate 1 as compared with the case of processing a substrate that has not been subjected to the liquid repellent treatment in the groove forming step. Can do. Further, since the surface of the substrate 1 is made liquid repellent, the debris 8 can be easily removed in the cleaning process of the substrate 1.

The present invention is not limited to the above-described embodiment, and scrub cleaning or the like may be performed using a liquid such as ethanol in the substrate cleaning process. The solvent used for cleaning the substrate may be water, IPA, or the like as long as it does not dissolve the substrate. Further, the substrate may be cleaned by ultrasonic cleaning. Further, the substrate cleaning step may be omitted if sufficient liquid repellency is obtained on the substrate surface in the liquid repellency treatment step after the groove forming step.
Alternatively, a substrate that has not been subjected to the liquid repellency treatment without performing the liquid repellency treatment step may be used. In this case, debris easily adheres to the substrate surface, but the debris can be removed by a cleaning process. Alternatively, the liquid repellency of the substrate surface can be recovered by the liquid repellency process.

In the above-described embodiment, the substrate is fixed and the laser irradiation unit and the mask are moved to irradiate the substrate with laser light. However, the laser irradiation unit may be fixed and the substrate and the mask may be moved. The laser light is not limited to the excimer laser, and a YAG laser, a semiconductor laser, a CO ₂ laser, or the like may be used.
Further, the material of the substrate is not limited to polyimide, and substrates of other materials such as glass can be used. When quartz glass is used as the substrate, for example, a groove can be formed in the substrate using an F2 laser having a wavelength of 157 nm.

It is a top view of the board | substrate in 1st embodiment of this invention. It is a block diagram of the electroconductive pattern manufacturing apparatus in 1st embodiment of this invention. It is explanatory drawing of the groove | channel formation process in 1st embodiment of this invention. It is explanatory drawing of the groove | channel formation process in 1st embodiment of this invention. It is explanatory drawing of the washing | cleaning process in 1st embodiment of this invention. It is explanatory drawing of the liquid-repellent treatment process in 1st embodiment of this invention. It is explanatory drawing of the lyophilic process in 1st embodiment of this invention. It is explanatory drawing of the conductor formation process in 1st embodiment of this invention. It is explanatory drawing of the conductor formation process in 1st embodiment of this invention. It is explanatory drawing of the conductor formation process in 1st embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate, 7 groove | channel, 10 Laser irradiation part, 11 Mask, 12 Laser beam, 20 Plasma processing part, 21 Droplet, 22 Conductive material liquid, 23 Conductive pattern, 30 Droplet discharge part, 40 Substrate fixing | fixed part, 100 Conductive pattern forming device

Claims (6)

A method of forming a conductive pattern for forming a conductive pattern on a substrate,
A groove forming step of forming a groove having the shape of the conductive pattern by irradiating the substrate with a laser beam through a mask on which a pattern in which the shape of the conductive pattern is drawn is formed;
A lyophobic treatment process for lyophobic the substrate on which the grooves are formed in the groove forming process;
A lyophilic process step of lyophilicizing the groove of the substrate that has been made liquid-repellent in the liquid-repellent process step by irradiating the laser light through the mask;
A conductor forming step of forming a conductive pattern by discharging a droplet of a conductive material liquid into the groove lyophilic in the lyophilic treatment step;
A method for forming a conductive pattern, comprising:   2. The method for forming a conductive pattern according to claim 1, wherein a power density of the laser beam in the lyophilic process step is smaller than a power density of the laser beam in the groove forming step.   The method for forming a conductive pattern according to claim 1, further comprising a cleaning step of cleaning the substrate before the liquid repellency treatment step.   The method for forming a conductive pattern according to any one of claims 1 to 3, further comprising a pre-liquid repellent treatment step of performing a liquid repellent treatment of the substrate before the groove forming step. A laser irradiation unit that irradiates laser light, a plasma processing unit that performs plasma surface treatment, a droplet discharge unit that discharges droplets of a conductive material liquid, and a substrate fixing unit that fixes the substrate,
The conductive pattern forming apparatus, wherein the substrate fixing unit is movably provided between the laser irradiation unit, the plasma processing unit, and the droplet discharge unit.   A wiring board comprising a conductive pattern formed by the method for forming a conductive pattern according to claim 1.

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