JP2008192874A - Light receiving package for optical sensor, and same optical sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the noise proof of an optical sensor, and facilitate its development into other kinds of devices, and further, reduce the necessary time and cost of the development. <P>SOLUTION: A bare chip 3 whereinto a photo diode, amplifying circuit, and oscillating circuit are integrated, a coupling capacitor 4 connected with the amplifying circuit, and a resistance 5 for oscillating frequencies whereby the oscillating frequency of the oscillating circuit is specified are so mounted on a packaging substrate 2 and they are so sealed by a transparent resin as to constitute out of them a light receiving package 1 for the optical sensor and as to mount it on a secondary mounting substrate 9. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light receiving package for an optical sensor incorporating a light receiving element, and an optical sensor using the same.

  In recent years, optical sensors, for example, photoelectric sensors, that use photo ICs in the light receiving circuit are frequently used with higher functionality and smaller size (for example, see Patent Document 1).

  Such a photo IC generally includes a photodiode as a light receiving element, an amplifier circuit that amplifies a light reception signal from the photodiode, a comparator that compares the output of the amplifier circuit with a threshold value, and the presence / absence of an object based on the output of the comparator And a signal processing circuit that controls the timing of light projection, an oscillation circuit that generates a reference clock, an output circuit that provides sensor output, and a light projection signal generator.

  The amplifier circuit includes a first-stage amplifier and a second-stage amplifier. These amplifiers function as a low-pass filter. A coupling capacitor is connected to the amplifier circuit to form a high-pass filter. The noise component contained in is removed. The oscillation frequency of the oscillation circuit that generates the reference clock is defined by an oscillation frequency resistor connected to the oscillation circuit.

  As described above, in the photo IC, a coupling capacitor for forming a high-pass filter and an oscillation frequency resistor that defines the oscillation frequency of the oscillation circuit are required.

  If the coupling capacitor is to be built in the photo IC, the chip size is increased due to its capacitance, resulting in a decrease in yield and an increase in cost. In addition, when a resistor is provided in an IC, since the polysilicon is grown and an impurity is doped to obtain a desired resistance value, the resistance value varies greatly depending on the thickness variation of the polysilicon and the diffusion amount of the impurity. There is a difficulty that becomes.

Therefore, in a conventional photoelectric sensor using a photo IC, as shown in FIG. 24, a package 51 containing a photo IC 50, a coupling capacitor 52, an oscillation frequency resistor 53, and other peripheral circuit components 54 are It is mounted on the secondary mounting board 55.
JP 2005-303264 A

  Conventionally, as described above, since the package 51 including the photo IC 50 and the coupling capacitor 52 and the oscillation frequency resistor 53 are mounted on the secondary mounting substrate 55, the package 51 is a bare chip in the package 51. The wiring length between the electrode of the photo IC 50 and the terminal of the coupling capacitor 52 and the oscillation frequency resistor 53 is long, and the noise resistance is lowered. Therefore, as shown in FIG. 25, the shield 56 is provided. .

  Further, even when the same photo IC is used, there is a problem that noise resistance changes due to the influence of surrounding parts.

  For example, from the structure of FIG. 26A obtained by the optimum noise resistance design, for example, as shown in FIG. 26B, a wiring 57 can be added to change the wiring pattern, or as shown in FIG. If the constants of the peripheral circuit components 54-1 and 54-2 are changed as described above, or if the component positions and wiring patterns are changed as shown in FIG. 26 (d), the noise resistance changes. Evaluation is required.

  For this reason, conventionally, as shown in FIG. 27, after circuit design and board design, noise resistance evaluation with an actual machine is performed, and when the noise resistance evaluation cannot be satisfied, the component constants and wiring patterns are changed again. Therefore, it is necessary to carry out circuit design and board design to evaluate noise resistance. Therefore, even if the same photo IC is used, it is necessary to design optimum noise resistance for each model of photoelectric sensor. In short, there is a problem that the cost becomes high.

  The present invention has been made in view of the above-described points, and improves noise resistance and is easy to deploy to other models of optical sensors, reducing the time and cost required for development. The purpose is to be able to.

  (1) In the light receiving package for an optical sensor of the present invention, a bare chip containing a light receiving element and an amplification circuit for amplifying a light reception signal obtained from the light receiving element, and a capacitor connected to the amplification circuit are provided on the package substrate. Mounted and sealed with resin, at least a light receiving optical path portion of the light receiving element of the resin has light transmittance, and the light receiving element receives light based on light projection of the light projecting element. The capacitor constitutes a frequency filter that allows a signal having a frequency corresponding to a light projection signal for driving the light projecting element to pass through the light reception signal.

  A light receiving package for an optical sensor.

  The bare chip includes at least a light receiving element and an amplifier circuit that amplifies a signal from the light receiving element.

  The light receiving element receives light based on the light projected from the light projecting element, and may receive light projected from the light projecting element or may receive the reflected light. Good.

  It is preferable that the amplifier circuit is constituted by a two-stage amplifier, the amplifier has a function as a low-pass filter, and a high-pass filter is constituted by a capacitor connected to the amplifier circuit.

  The low-pass filter passes a low-frequency component including a signal having a frequency corresponding to the light projection signal that drives the light projecting element to the light reception signal from the light receiving element. It is preferable to pass a high frequency component including a signal having a frequency corresponding to the signal.

  The package substrate is a bare chip package substrate incorporating a light receiving element and an amplifier circuit, and can also be referred to as an interposer or a primary mounting substrate.

  According to the light receiving package for an optical sensor of the present invention, a capacitor such as a coupling capacitor connected to an amplifier circuit is mounted on the same package substrate (primary mounting substrate) as the substrate on which the bare chip is mounted. Compared to the conventional example in which a coupling capacitor is mounted on a secondary mounting board on which a package incorporating a bare chip is mounted, the wiring length between the bare chip and the coupling capacitor can be shortened, and noise resistance is improved. improves.

  In addition, a coupling capacitor for constructing a frequency filter that removes noise from the received light signal is integrated with the bare chip for light reception into the bare chip package, that is, the photo IC package, and the filter function has good noise resistance. Therefore, the light receiving package for an optical sensor having such a filter function can be used in common for each model of the optical sensor, and the development to other models is facilitated.

  (2) In one embodiment of the light receiving package for an optical sensor of the present invention, the bare chip incorporates an oscillation circuit, and the package substrate is connected to the oscillation circuit to define an oscillation frequency of the oscillation circuit. Resistor to be mounted.

  According to this embodiment, the oscillation frequency resistor that defines the oscillation frequency of the oscillation circuit built in the bare chip is mounted on the same package substrate (primary mounting substrate) as the substrate on which the bare chip is mounted. Compared to the conventional example in which the oscillation frequency resistor is mounted on the secondary mounting board on which the package containing the bare chip is mounted, the wiring length between the bare chip and the oscillation frequency resistor can be shortened. Noise characteristics are further improved.

  In addition, a resistor that defines the oscillation frequency of the oscillation circuit built in the bare chip, that is, the frequency serving as a reference for the operation of the circuit built in the bare chip, is provided in the bare chip package, that is, the photo IC package together with the bare chip. In combination with the filter function, the light receiving package for the optical sensor must be used in common for each model of the optical sensor. This makes it easier to deploy to other models.

  In addition, the filter function and oscillation frequency generation function are more resistant to noise than conventional examples in which coupling capacitors and oscillation frequency resistors are mounted on a secondary mounting board that is separate from the package board (primary mounting board). As the function is completed within the light receiving package for the optical sensor, the noise-resistant design when deploying to other models of optical sensors can be simplified compared to the previous model. Time and cost can be reduced.

  (3) In the embodiment of (2), an output resistor connected to the amplifier circuit is mounted on the package substrate.

  (4) In the above embodiment (2) or (3), at least one of the capacitor and the resistor is embedded and mounted on the package substrate.

  According to this embodiment, the noise resistance can be improved by incorporating a capacitor and a resistor in the package substrate.

  (5) In any one of the embodiments (2) to (4), the electrode terminal of the bare chip and the electrode terminal of the package substrate are connected by a bonding wire, and the resin is a light transmissive resin.

  According to this embodiment, light can be received by the light receiving element built in the bare chip with the upper surface of the bare chip sealed with the light-transmitting resin as the light receiving surface.

  (6) In any one of the above embodiments (2) to (4), the package substrate is formed with a through-hole serving as a light receiving optical path of the light receiving element, and the bare chip has a light receiving region of the light receiving element. Flip chip mounting is performed so as to face the through hole, and the light receiving optical path portion is sealed with a light-transmitting underfill resin.

  According to this embodiment, the light receiving region on the lower surface of the bare chip that is flip-chip mounted on the package substrate can be received from the through hole of the package substrate.

  (7) In any one of the embodiments (2) to (6), the package substrate has a terminal depending on whether or not at least one of the capacitor and the resistor mounted on the package substrate can be used. Wiring is formed so that can be selected.

  According to this embodiment, a connection terminal may be selected depending on whether or not a resistor or a capacitor mounted on a package substrate is used. It is possible to use the variable resistance of the secondary mounting board instead of the resistance that is provided.

  (8) The optical sensor of the present invention includes a mounting substrate on which the light receiving package for optical sensors according to the present invention is mounted.

  According to the optical sensor of the present invention, noise resistance is improved as compared with the conventional example, and the development to other models becomes easy.

  According to the present invention, since the coupling capacitor and the oscillation frequency resistor can be mounted on the same package substrate (primary mounting substrate) as the substrate on which the bare chip is mounted, and integrated in the package, Compared to the conventional example in which the coupling capacitor and the oscillation frequency resistor are mounted, the wiring length between the bare chip and the coupling capacitor and the oscillation frequency resistor can be shortened, and the noise resistance is improved.

  In addition, a coupling capacitor for configuring a frequency filter that removes noise from the received light signal or an oscillation frequency resistor that defines an oscillation frequency that is a reference of a circuit built in the bare chip is integrated in the package. Therefore, the light receiving package for optical sensors having a filter function and an oscillation frequency generating function with good noise resistance can be used in common for each model of the optical sensor, and it is easy to deploy to other models, Noise-resistant design is simplified.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
FIG. 1 is a perspective view showing a light receiving package for an optical sensor according to one embodiment of the present invention.

  In the light receiving package 1 for an optical sensor of this embodiment, not only a photo IC 3 that is a bare chip but also a capacitor 4 and a resistor 5 that are surface mount components are mounted on an interposer 2 as a package substrate. Sealed with resin 6. For example, the light transmissive resin 6 has a characteristic that the transmittance of light in the wavelength region of 400 nm to 900 nm is 60% or more.

  The photo IC 3 incorporates a photodiode as a light receiving element, and a light receiving region 3 a is formed on the upper surface of the photo IC 3.

  The capacitor 4 is a coupling capacitor that is connected to an amplifier circuit (described later) built in the photo IC 3 to constitute a high-pass filter.

  The resistor 5 is a resistor that is connected to an oscillation circuit described later built in the photo IC 3 and defines the oscillation frequency of the oscillation circuit.

  The electrode pads of the interposer 2 and the electrode terminals of the photo IC 3 are connected by bonding wires 7, and the capacitor 4 and the resistor 5 are mounted on the interposer 2 by, for example, solder. In addition, you may join not only using solder but using another metal materials, such as a silver paste.

  FIG. 2 is a diagram showing a manufacturing process of the light receiving package 1 for an optical sensor.

  First, solder is printed on the interposer 2 (S1), the capacitor 4 and the resistor 5 are mounted on the interposer 2 (S2), and joined by reflow (S3).

  Next, the photo IC 3 is die-bonded to the interposer 2 (S4), the electrode terminals of the photo IC 3 and the electrode pads of the interposer 2 are connected with bonding wires (S5), and molded with a transparent sealing resin (S6). Then, dicing into individual packages and inspection are performed to complete the light receiving package for the optical sensor (S7 to S9).

As shown in FIG. 3, the light receiving package 1 for an optical sensor is mounted on a secondary mounting substrate 9 on which peripheral circuit components 8 are mounted via an interposer 2 that is a primary mounting substrate.
In FIG. 3, the secondary mounting board 9 shows an example of single-sided mounting, but it may be double-sided mounting as shown in FIG.

  That is, as shown in FIG. 5, solder is printed on one surface (surface A) of the secondary mounting substrate 9 (S1), and the peripheral circuit component 8 such as a capacitor and a resistor and the light receiving package 1 for the optical sensor are mounted. Then (S2), joining by reflow (S3), appearance inspection is performed, and A-side mounting is completed (S4).

Next, solder is printed on the other surface (B surface) of the secondary mounting substrate 9 (S5), the peripheral circuit component 8 such as a capacitor and a resistor and the package component 26 are mounted (S6), and joined by reflow. (S7) The appearance inspection is performed, the B-side mounting is completed, and the double-sided mounting is completed (S9).
As shown in FIG. 6, the secondary mounting substrate 9 mounted on one side or both sides as described above is soldered with the cord 27, inserted into the front and rear cases 28 and 29, and integrally formed with the lens 30.

  FIG. 7 is a block diagram of the photoelectric sensor 10 of the present invention including the light receiving package 1 for an optical sensor, and portions corresponding to the above-described configuration are denoted by the same reference numerals.

  The photoelectric sensor 10 of this embodiment includes a light projecting unit 11 and a light receiving package 1 for an optical sensor. As described above, the photo IC 3, the capacitor 4, and the resistor 5 are included in the light receiving package 1 for the optical sensor. Built in.

  The photo IC 3 includes a photodiode 12 as a light receiving element that receives transmitted light or reflected light from the light projecting element 21, a preamplifier 13 and a main amplifier 14 that amplify a light reception signal from the photodiode 12, and a main amplifier 14. A comparator 15 that compares the output of the signal and a threshold value, a signal processing circuit 16 that determines a light projection timing, a light reception timing, and a comparator output based on a reference clock pulse, and an oscillation that generates the reference clock pulse Based on the output of the signal processing circuit 16, a light projection signal generation unit 18 that receives a signal from the circuit 17, receives a signal from the signal processing circuit 16, and sends a light projection timing pulse to the light projection circuit 20 of the light projection unit 11. An output circuit 19 for providing an output is incorporated. The light projecting circuit 20 drives the LED 21.

  The capacitor 4 built in the light receiving package 1 for the optical sensor is interposed between the preamplifier 13 and the main amplifier 14 of the photo IC 3 via the wiring 31 of the secondary mounting substrate 9 of FIG. A high-pass filter is configured with a resistor, and the light-receiving signal pulse shown in FIG. 8 is obtained by amplifying a light-receiving signal pulse of a specific frequency by the amplifiers 13 and 14 having a function as a low-pass filter and the high-pass filter. is there.

  The resistor 5 incorporated in the light receiving package 1 for the photosensor is connected to the oscillation circuit 17 of the photo IC 3 via the wiring of the interposer 2 and defines the frequency of the reference clock pulse generated by the oscillation circuit 17.

  Based on the reference clock pulse, the signal processing circuit 16 determines the light projection timing, the light reception timing, and the comparator output processing. The signal processing circuit 16 performs the light projection timing shown in FIG. The determination is made by comparing the timing of the optical signal pulse and the timing of the received light signal pulse in FIG.

  In all types of photoelectric sensors equipped with the same photo IC 3, a capacitor 4 that is a coupling capacitor and a resistor 5 that defines an oscillation frequency are required. In this embodiment, the capacitor 4 and the resistor 5 are Since it is incorporated in the light receiving package 1 for optical sensors, it is easy to mount the light receiving package 1 for optical sensors as a common component on other models.

  In addition, by integrating the capacitor 4 and the resistor 5 together with the photo IC 3 into a single package, a light receiving signal having a specific frequency in the light received by the photodiode 12, that is, a light receiving signal having a frequency of a light projecting signal pulse for driving the LED 21. The function of separating the signals and sending them to the signal processing circuit 16 and the function of defining the drive oscillation frequency of the signal processing circuit 16 can be completed by the light receiving package 1 for photosensors.

  Furthermore, in the above-described conventional example of FIG. 24, since the capacitor 52 and the resistor 53 are mounted on the mounting substrate (secondary mounting substrate) 55, the electrode of the bare chip 50 of the photo IC, the capacitor 52 or the resistor 53, The wiring length between the terminals is long, and the noise resistance is lowered. As described above, it is necessary to evaluate the noise resistance for each model.

  That is, in the conventional example, as shown in FIG. 10, the wiring length from the electrode of the bare chip 50 of the photo IC to the terminal of the capacitor 52 or the resistor 53 is the wire length of the bonding wire 60, the wiring length of the interposer 61, and the interposer 61. The height of the solder ball 62 between the mounting board 55 and the wiring length of the mounting board 55 is added, and is about 2 mm, for example. In the embodiment shown in FIG. Alternatively, since the resistor 5 is built in the light receiving package 1 for an optical sensor, the wiring length from the electrode of the bare chip 3 of the photo IC to the capacitor 4 or the terminal of the resistor 5 is set to the wiring length of the interposer 2 to the wire length of the bonding wire 7. For example, it becomes as short as about 1 mm.

  Since the wiring length is shortened in this way, the antenna ratio is lowered and the parasitic capacitance is also reduced, so that the noise resistance is improved. As a result, the conventionally required shield can be eliminated, the mounting volume can be reduced and the size can be reduced, and the assembly process of the shield is not required, and the cost can be reduced.

  Conventionally, the optical axes of the light receiving lens and the light receiving surface of the light receiving element built in the photo IC are adjusted for the photo IC package, coupling capacitor, and oscillation frequency mounted on the secondary mounting board. Whereas it is necessary to carry out through a shield arranged so as to cover the resistor, in this embodiment, since a shield is unnecessary, it is possible to directly attach a light receiving lens to a light receiving package for an optical sensor. Therefore, the optical axis can be adjusted with high accuracy.

  In addition, since the conventional photoelectric sensor has a photo IC which is a one-chip package, a coupling capacitor, and an oscillation frequency resistor mounted on a secondary mounting board, the above-described FIG. As shown in Fig. 2, it was necessary to design by repeating the noise evaluation.

  In contrast, in this embodiment, the coupling capacitor and the oscillation frequency resistor are integrated in the package, and the filter function using the coupling capacitor and the oscillation frequency generating function using the oscillation frequency resistor are integrated in the package. In addition, the noise design can be completed by improving the noise resistance of both functions, and as shown in FIG. 12, the development to other models becomes easy without considering the noise resistance. Accordingly, in the development of a new optical sensor, the development time can be shortened and the cost can be reduced by diverting this package.

  In the optimum design of the light receiving package for the optical sensor, for example, as shown in FIG. 13A, it is preferable to place the capacitor 4 and the resistor 5 near the pad of the photo IC 3 and design with the shortest wiring. If it is not possible to arrange them, it is preferable to design the wiring 32 on the back surface of the photo IC 3 serving as the ground so that the shield function works as shown in FIG.

  Further, in this embodiment, inspections such as a continuity test of the capacitor 4 and the resistor 5 mounted on the interposer 2 are performed using terminals 35, 36, 37, and 38 provided on the back surface of the interposer 2, as shown in FIG. It is configured so that it can be done.

(Embodiment 2)
14 is a perspective view of a light receiving package 1-1 for an optical sensor according to another embodiment of the present invention. FIG. 15 is a cross-sectional view thereof, and the same reference is made to the portion corresponding to the above-described embodiment. A sign is attached.

  In the light receiving package 1-1 for an optical sensor of this embodiment, a through hole 2-1a is formed in the interposer 2-1. The interposer 2-1 is flip-chip mounted on the photo IC 3-1 so that the light receiving region 3-1a on the lower surface thereof faces the through-hole 2-1a. Similarly to the above-described embodiment, the capacitor 4 The resistor 5 is mounted on the interposer 2-1, and is sealed with the light-transmitting resin 6 and the light-transmitting underfill resin 22.

  FIG. 16 is a diagram illustrating a manufacturing process of the light receiving package 1-1 for the optical sensor.

  First, solder is printed on the interposer 2-1 (S1), the capacitor 4, the resistor 5 and the photo IC 3-1 are mounted on the interposer 2-1 (S2) and joined by reflow (S3).

  Next, underfill resin 22 is applied (S4), molded with transparent sealing resin 6 (S5), diced into individual packages and inspected to complete light receiving package 1-1 for optical sensors ( S6-S8).

  As shown in FIG. 17, the light receiving package 1 for an optical sensor is mounted on a secondary mounting board 9-1 via an interposer 2-1 that is a primary mounting board. The secondary mounting substrate 9-1 is also formed with a through hole 23 that serves as a light receiving optical path of the light receiving region 3-1a of the photo IC 3-1. Other configurations are the same as those of the above-described embodiment.

  In this embodiment, the photo IC 3 is not mounted on the interposer 2 by wire bonding as in the above-described embodiment, but is flip-chip mounted. Therefore, from the electrode of the photo IC 3-1 to the terminal of the capacitor 4 or the resistor 5. The wiring length can be further shortened, the noise resistance can be further improved, and the size of the light receiving package for the optical sensor can be reduced.

  As another embodiment, only the underfill resin 22 serving as the light receiving light path of the light receiving region 3-1a of the photo IC 3-1 may be a light transmissive resin, and a resin that is not light transmissive may be used instead of the light transmissive resin 6. Good.

(Embodiment 3)
FIG. 18 is a block diagram of a photoelectric sensor including a light receiving package 1-2 for an optical sensor according to still another embodiment of the present invention, and parts corresponding to those in FIG.

  In each of the embodiments described above, the capacitor 4 and the resistor 5 are incorporated in the light receiving package for the optical sensor. However, in this embodiment, an output resistor 24 is further incorporated.

  Thus, by incorporating the output resistor 24 in the light receiving package 1-2 for the photosensor, the wiring length can be shortened and the noise resistance can be improved.

  As another embodiment, as shown in FIG. 19, it may be adjusted by a variable resistor 25 of the secondary mounting board. In this case, as shown in FIG. 20, the power of the received light signal can be changed.

  Further, as shown in FIG. 21, the resistance value such as a resistor for defining the oscillation frequency is adjusted by laser trimming using laser light, or the circuit pattern is changed by cutting the wiring pattern of the interposer 2 with a laser. You may do it.

  Thus, by cutting the resistance value and the wiring pattern with the laser, the same light receiving package for the optical sensor can be used for different models.

(Embodiment 4)
FIG. 22 is a perspective view of a light receiving package for an optical sensor according to another embodiment of the present invention, and FIG. 23 is a sectional view thereof.

  In this embodiment, the capacitor 4 and the resistor 5 are embedded in the interposer 2-3, that is, built-in. Other configurations are the same as those of the above-described embodiment.

(Other embodiments)
As another embodiment, a shield may be added to the light receiving package for an optical sensor. In this case, the conventional shield needs to cover the photo IC package, the coupling capacitor, and the oscillation frequency resistor mounted on the secondary mounting substrate, whereas in the present invention, only the light receiving package for the photosensor is used. Anything can be used as long as it is covered, and space can be saved.

  The present invention is useful as a package of an optical sensor such as a photoelectric sensor.

It is a perspective view of the light receiving package for optical sensors according to the present invention. It is a figure which shows the manufacturing process of the light reception package for optical sensors of FIG. It is a perspective view which shows the state which mounted the light reception package for optical sensors of FIG. 1 in the secondary mounting board | substrate. It is a side view which shows a double-sided mounting substrate. It is a figure which shows the manufacturing process of the double-sided mounting board | substrate of FIG. It is a figure which shows the assembly process of a photoelectric sensor. It is a block diagram of a photoelectric sensor provided with the light reception package for optical sensors. It is a wave form diagram of a received light signal. It is a wave form diagram of a light projection signal and a light reception signal. It is a figure for demonstrating the wiring length of a prior art example. It is a figure for demonstrating the wiring length of embodiment. It is a figure which shows the design procedure of embodiment. It is a figure for demonstrating wiring design. It is a perspective view of the light reception package for optical sensors of other embodiments of the present invention. It is sectional drawing of the light reception package for optical sensors of FIG. It is a figure which shows the manufacturing process of the light reception package for optical sensors of FIG. It is sectional drawing of the state which mounted the light reception package for optical sensors of FIG. 14 in the secondary mounting board | substrate. It is a block diagram of other embodiments of the present invention. FIG. 19 is a block diagram corresponding to FIG. 18 illustrating another connection example. It is a wave form diagram which shows the change of the received light signal by adjustment of received light sensitivity. It is a figure which shows laser trimming. It is a perspective view of the light reception package for optical sensors of further another embodiment of the present invention. It is sectional drawing of the light reception package for optical sensors of FIG. It is a perspective view of a prior art example. It is a perspective view of a prior art example. It is a figure for demonstrating the subject of a prior art example. It is a figure which shows the design procedure of a prior art example.

Explanation of symbols

1,1-1,1-2,1-3 light receiving package for optical sensor 2,2-1,2-3 interposer 3 photo IC
4 Capacitor 5 Resistance 6 Light transmissive resin 7 Bonding wire 9,9-1 Secondary mounting board

Claims (8)

A bare chip containing a light receiving element and an amplifier circuit for amplifying a light reception signal obtained from the light receiving element, and a capacitor connected to the amplifier circuit are mounted on a package substrate and sealed with a resin, and at least the resin The light receiving optical path portion of the light receiving element has light transmittance,
And the said light receiving element receives the light based on the light projection of a light projection element, Comprising: The said capacitor | condenser is a signal of the frequency according to the light projection signal which drives the said light projection element with respect to the said light reception signal A frequency filter that passes through
A light receiving package for an optical sensor.   The light receiving package for an optical sensor according to claim 1, wherein the bare chip includes an oscillation circuit, and a resistor that is connected to the oscillation circuit and defines an oscillation frequency of the oscillation circuit is mounted on the package substrate.   The light receiving package for an optical sensor according to claim 2, wherein an output resistor connected to the amplifier circuit is mounted on the package substrate.   The light receiving package for an optical sensor according to claim 2, wherein at least one of the capacitor and the resistor is embedded and mounted in the package substrate.   5. The light receiving package for an optical sensor according to claim 2, wherein an electrode terminal of the bare chip and an electrode terminal of the package substrate are connected by a bonding wire, and the resin is a light transmissive resin.   The package substrate is formed with a through-hole serving as a light-receiving optical path of the light-receiving element, the bare chip is flip-chip mounted so that a light-receiving region of the light-receiving element faces the through-hole, and the light-receiving optical path portion is The light receiving package for an optical sensor according to any one of claims 2 to 4, which is sealed with a light-transmitting underfill resin.   The wiring is formed on the package substrate so that a terminal can be selected depending on whether or not at least one of the capacitor and the resistor mounted on the package substrate can be used. 2. A light receiving package for an optical sensor according to item 1.   An optical sensor comprising a mounting substrate on which the light receiving package for an optical sensor according to any one of claims 1 to 7 is mounted.

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