JP2008189727A - Bonded structure, bonding method, liquid droplet discharge head and method for producing liquid droplet discharge head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a bonded structure that relaxes a stress occurring at a bonded interface and has improved adhesion reliability and durability and to provide a bonding method, a liquid droplet discharge head and a method for producing a liquid droplet discharge head. <P>SOLUTION: The bonded structure comprises a nozzle substrate 11 laminated through an adhesion layer 23 to a flow channel forming substrate 12 in which the adhesion layer 23 has a plurality of adhesion parts 23a dispersed and arranged in the adhesion region of the flow channel forming substrate 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an adhesion structure and an adhesion method, a droplet discharge head, and a method for manufacturing a droplet discharge head.

The droplet discharge head discharges the liquid material from the discharge port, and a flow path for supplying the liquid material from the ink tank to the discharge port is formed inside. In general, such a droplet discharge head is formed by adhering a plurality of substrates on which grooves or holes serving as flow paths are formed with an adhesive. That is, the nozzle substrate on which the discharge ports are formed and the flow path forming substrate that forms the pressure generating chamber are bonded together with an adhesive.
Here, the nozzle substrate and the flow path forming substrate are often made of different materials. For this reason, shear stress is generated at the bonding interface between the nozzle substrate and the flow path forming substrate due to the difference in thermal expansion coefficient between the nozzle substrate and the flow path forming substrate. Here, the adhesive strength by the adhesive is the difference between the adhesive strength of the adhesive itself and the generated stress. Therefore, even when bonding is performed using an adhesive having high adhesive strength, high adhesive strength cannot be obtained if the stress generated at the bonding interface is large.
Therefore, droplets are formed by forming slits in the vicinity of the edge of the adhesion area with the nozzle substrate in the flow path forming substrate to form a non-adhesion area that does not adhere to the nozzle substrate, thereby reducing the stress generated at the adhesion interface. A head has been proposed (see, for example, Patent Document 1).
JP 2001-138528 A

  However, the following problems remain in the conventional droplet discharge head. That is, there is a problem that the shear stress is concentrated at the end portion of the non-bonded region provided by the formation of the slit. In addition, since the shear stress generated at the bonding interface increases as the bonding region becomes wider, there is a problem that the stress relaxation effect in the non-bonding region is reduced.

  The present invention has been made in view of the above-described conventional problems. An adhesive structure and an adhesive method, a liquid droplet ejection head, and a liquid that alleviate stress generated at an adhesive interface and improve the reliability and durability of the adhesive. It is an object of the present invention to provide a method for manufacturing a droplet discharge head.

  The present invention employs the following configuration in order to solve the above problems. That is, the adhesive structure according to the present invention is an adhesive structure having a first member and a second member bonded together through an adhesive layer, and the adhesive layer is distributed and arranged in the adhesive region of the first member. And having a plurality of adhesive portions.

  Moreover, the bonding method according to the present invention is a bonding method in which the first and second members are bonded to each other with an adhesive layer, and includes a step of dispersing and arranging a plurality of bonding portions in the bonding region of the first member. It is characterized by.

In this invention, the stress which generate | occur | produces becomes small by disperse | distributing and arrange | positioning an adhesion part and making the adhesion area by each adhesion part small. Thereby, the stress which generate | occur | produces in an adhesion interface is relieve | moderated, and the adhesive reliability and durability between 1st and 2nd members improve. That is, the stress generated in each bonded portion increases as the bonded area by the bonded portion increases. Therefore, by disposing the bonding portions in a distributed manner, the bonding area by one bonding portion is reduced and bonding is performed for each bonding portion, thereby reducing the stress generated in one bonding portion. Thereby, since the stress which generate | occur | produces in each adhesion part is suppressed, the stress which generate | occur | produces as the whole contact bonding layer is suppressed.
Further, by reducing the occurrence of stress at the bonding interface, the adhesive force of the adhesive constituting the bonded portion can be used effectively.

In the bonding structure according to the present invention, it is preferable that the bonding layer has a filling portion that has higher elasticity than the bonding portion and fills a space between the bonding portions.
In this invention, the sealing performance by the adhesive layer is improved by filling the space between the adhesive portions with a highly elastic filling portion. Here, since the filling portion has higher elasticity than the bonding portion, the influence of the stress generated in each bonding portion is prevented from reaching the filling portion.

In the bonding structure according to the present invention, the plurality of bonding portions are preferably arranged in an island shape.
In this invention, since the length of the circumference of each adhesion part is shortened by making the adhesion part into an island shape, the stress generated in each adhesion part can be more reliably suppressed.

A liquid droplet ejection head according to the present invention is a liquid droplet ejection head having an ejection port for ejecting a liquid material, and includes the above-described adhesive structure.
A method for manufacturing a droplet discharge head according to the present invention is a method for manufacturing a droplet discharge head having a discharge port for discharging a liquid material, and includes a bonding step using the bonding method described above. And
In the present invention, as described above, since the stress generated at the bonding interface is relaxed, the bonding reliability and durability can be improved.

  Hereinafter, an embodiment of a droplet discharge head according to the present invention will be described with reference to the drawings. In each drawing used in the following description, the scale is appropriately changed to make each member a recognizable size. 1 is a perspective view of the droplet discharge head, FIG. 2 is an exploded perspective view of FIG. 1, FIG. 3 is a sectional view of FIG. 1, and FIG. 4 is a sectional view and a plan view showing an adhesive layer. In the following description, an XYZ orthogonal coordinate system is used, the one side direction in the horizontal plane of the droplet discharge head 1 having a substantially rectangular parallelepiped shape is the X axis direction, and the direction orthogonal to the X axis in the horizontal plane is the Y axis direction. A vertical direction that is a direction orthogonal to the X-axis and Y-axis directions and is a stacking direction of the substrates is defined as a Z-axis direction. Further, the + Z direction is the upper side, and the −Z direction is the lower side.

[Droplet ejection head]
The droplet discharge head 1 in the present embodiment discharges ink (liquid material) in the form of droplets from a nozzle.
As shown in FIGS. 1 to 3, the droplet discharge head 1 includes a nozzle substrate (second member) 11, a flow path forming substrate (first member) 12 provided on the upper surface of the nozzle substrate 11, and A vibration plate 14 provided on the upper surface of the flow path forming substrate 12 and displaced by driving the piezoelectric element 13, a sealing substrate (first member) 15 provided on the upper surface of the vibration plate 14, and the sealing substrate 15 And a drive circuit unit 16 that drives the piezoelectric element 13.

  The nozzle substrate 11 is made of stainless steel such as SUS. The nozzle substrate 11 is formed with a plurality (six) of nozzle openings (ejection ports) 21 which are through holes and eject ink droplets. Here, the arrangement direction of the nozzle openings 21 is the Y-axis direction. And nozzle opening group 21A-21D is comprised by the several nozzle opening part 21 formed in an array. Here, the nozzle opening groups 21A and 21B are arranged to face each other in the X axis direction, and the nozzle opening groups 21C and 21D are arranged to face each other in the X axis direction. The nozzle opening group 21C is formed on the + Y side with respect to the nozzle opening group 21A, and the nozzle opening group 21D is formed on the + Y side with respect to the nozzle opening group 21B. In FIG. 1, each of the nozzle opening groups 21 </ b> A to 21 </ b> D is shown to be configured by six nozzle openings 21, but actually, for example, is configured by about 720 nozzle openings 21. ing.

  The flow path forming substrate 12 is made of, for example, silicon, and a plurality of through holes and a plurality of partition walls 22 projecting inward from the side walls of the through holes are formed by anisotropic etching. The plurality of partition walls 22 are formed in a substantially comb-like shape in plan view, and define the through holes. Further, as shown in FIG. 4, the nozzle substrate 11 is bonded to the lower surface of the flow path forming substrate 12 via an adhesive layer 23 so as to cover the lower surface side of the through hole.

The adhesive layer 23 includes a plurality of adhesive portions 23a that are dispersed and arranged in an adhesive region with the nozzle substrate 11, and a filling portion 23b that fills the space between the plurality of adhesive portions 23a.
The adhesion part 23a is comprised with the thermosetting adhesive agent which has high rigidity like an epoxy-type resin material, for example. The bonding portions 23a are substantially rectangular in a plan view, and are dispersed in an island shape so as to be separated from other adjacent bonding portions 23a in the bonding region of the flow path forming substrate 12. Here, the bonding portion 23a has a tensile shear bonding strength of, for example, about 30 MPa, a hardness of, for example, D80, and a linear expansion coefficient at 20 ° C. of, for example, 65 × 10 ⁻⁶ / ° C.
The filling portion 23b is made of a thermosetting adhesive having higher elasticity and lower adhesive force than the bonding portion 23a, such as an acrylic resin material. And the filling part 23b is arrange | positioned so that the gap | interval of the adhesion part 23a may be filled up. Here, the filling portion 23b has a tensile strength of, for example, about 6 MPa, a hardness of, for example, A44, and a linear expansion coefficient at 20 ° C. of, for example, about 220 × 10 ⁻⁶ / ° C.

Further, as shown in FIGS. 1 to 3, the through holes formed in the flow path forming substrate 12 are surrounded by the flow path forming substrate 12, the nozzle substrate 11, and the vibration plate 14, so that a plurality of (six) holes are formed. A pressure generation chamber 24 is formed.
A plurality of the pressure generating chambers 24 are formed in the Y-axis direction so as to correspond to the nozzle openings 21 constituting the nozzle opening groups 21A to 21D. The pressure generation chamber group 24A is configured by the plurality of pressure generation chambers 24 corresponding to the nozzle opening group 21A, and the pressure generation chamber is formed by the plurality of pressure generation chambers 24 corresponding to the nozzle opening group 21B. A group 24B is formed, and a plurality of pressure generating chambers 24C are formed by a plurality of pressure generating chambers 24 corresponding to the nozzle opening group 21C, and a plurality of pressure generating chambers 24 are formed corresponding to the nozzle opening group 21D. Thus, the pressure generation chamber group 24D is formed. Here, the pressure generation chamber groups 24A and 24B are arranged to face each other in the X-axis direction, and the pressure generation chamber groups 24C and 24D are arranged to face each other in the X-axis direction.
The end of the pressure generating chamber 24 on the outer edge side of the substrate communicates with a supply path 25 that is a through hole formed in the flow path forming substrate 12, and the flow path forming substrate 12 is connected via the supply path 25. Are communicated with each other by a communication portion 26 which is a through-hole formed in.

  The vibration plate 14 includes an elastic film 27 provided on the upper surface of the flow path forming substrate 12 and a lower electrode film 28 provided on the upper surface of the elastic film 27. The elastic film 27 is made of, for example, silicon dioxide having a thickness of about 1 to 2 μm. The lower electrode film 28 is made of, for example, Pt (platinum) having a thickness of about 0.2 μm. The lower electrode film 28 is an electrode common to the piezoelectric element 13.

2 and 3, the piezoelectric element 13 includes a piezoelectric film 31 provided on the upper surface of the lower electrode film 28, an upper electrode film 32 provided on the upper surface of the piezoelectric film 31, and an upper electrode film. And lead electrodes 33 which are 32 lead wires.
Here, the piezoelectric film 31 is made of, for example, a metal oxide having a thickness of about 1 μm. The upper electrode film 32 is made of, for example, Pt having a thickness of about 0.1 μm. The lead electrode 33 is made of, for example, Au (gold) having a thickness of about 0.1 μm.
A plurality of piezoelectric elements 13 are provided corresponding to each of the plurality of nozzle openings 21 and the pressure generation chamber 24. That is, the piezoelectric element 13 is provided for each nozzle opening 21 (for each pressure generation chamber 24). As described above, the lower electrode film 28 functions as a common electrode for the plurality of piezoelectric elements 13, and the upper electrode film 32 and the lead electrode 33 function as individual electrodes for the plurality of piezoelectric elements 13.

Then, a piezoelectric element group 13A is formed by a plurality of piezoelectric elements 13 provided side by side in the Y-axis direction corresponding to the nozzle openings 21 constituting the nozzle opening group 21A, and provided corresponding to the nozzle opening group 21B. A piezoelectric element group 13B is formed by the piezoelectric element 13, a piezoelectric element group (not shown) is formed by the piezoelectric element 13 provided corresponding to the nozzle opening group 21C, and a piezoelectric element provided corresponding to the nozzle opening group 21D. The element 13 forms a piezoelectric element group (not shown). Here, the piezoelectric element groups 13A and 13B are arranged to face each other in the X-axis direction, and the piezoelectric element group corresponding to the nozzle opening group 21C and the piezoelectric element group corresponding to the nozzle opening group 21D are arranged to face each other in the X-axis direction. .
The piezoelectric element 13 may include a lower electrode film 28 in addition to the piezoelectric film 31, the upper electrode film 32, and the lead electrode 33. That is, the lower electrode film 28 in the present embodiment may be configured to have both the function as the piezoelectric element 13 and the function as the diaphragm 14. In the present embodiment, the diaphragm 14 is configured by the elastic film 27 and the lower electrode film 28, but the elastic film 27 may be omitted and the lower electrode film 28 may have the function of the elastic film 27.

As shown in FIGS. 1 to 3, the sealing substrate 15 is formed of, for example, a silicon single crystal that is the same material as the flow path forming substrate 12. In addition, reservoir portions 35 corresponding to the communication portions 26 are formed on the sealing substrate 15 so as to extend in the Y-axis direction. The reservoir portion 35 and the communication portion 26 described above constitute a reservoir 36. The sealing substrate 15 is formed with introduction paths 37 that are connected to the side walls of the communication portions 26 and introduce ink into the communication portions 26.
A compliance substrate (second member) 41 is bonded to the upper surface of the sealing substrate 15. The compliance substrate 41 includes a sealing film 42 and a fixing plate 43, and is bonded to the sealing substrate 15 by the same bonding structure as that of the adhesive layer 23 described above.

The sealing film 42 is formed of a material having low rigidity and flexibility, such as a polyphenylene sulfide film having a thickness of about 6 μm, for example, and seals the upper portion of the reservoir portion 35.
The fixing plate 43 is formed of a hard material such as a metal such as stainless steel having a thickness of about 30 μm. A region of the fixing plate 43 corresponding to the reservoir 35 is an opening 44 that is completely removed in the thickness direction. Accordingly, since the upper portion of the reservoir portion 35 is sealed only by the flexible sealing film 42, the flexible portion 45 is deformable by a change in internal pressure. In addition, on the compliance substrate 41 outside the reservoir unit 35, a functional liquid introduction port 46 that communicates with the introduction path 37 and supplies the functional liquid to the reservoir unit 35 is formed.

Further, as shown in FIGS. 2 and 3, a groove 47 extending in the Y-axis direction is formed in the central portion of the sealing substrate 15 in the X-axis direction. By this groove 47, the sealing substrate 15 seals the sealing portion 48A for sealing the piezoelectric element group 13A corresponding to the pressure generating chamber group 24A and the sealing for sealing the piezoelectric element group 13B corresponding to the pressure generating chamber group 24B. A stopper 48B, a sealing portion (not shown) for sealing the piezoelectric element group corresponding to the pressure generation chamber group 24C, and a sealing portion (not shown) for sealing the piezoelectric element group corresponding to the pressure generation chamber group 24D. (Not shown).
That is, in the sealing substrate 15, a region facing the piezoelectric element 13 is formed with a piezoelectric element holding portion 49 that can seal the space while ensuring a space that does not hinder the movement of the piezoelectric element 13. ing. The piezoelectric element holding portion 49 is formed in a size that covers each piezoelectric element group such as the piezoelectric element groups 13A and 13B. Of the piezoelectric elements 13, at least the piezoelectric film 31 is sealed in the piezoelectric element holding portion 49.
Of the piezoelectric element 13 sealed by the piezoelectric element holding portion 49, the end portion of the lead electrode 33 on the substrate center side is disposed on the flow path forming substrate 12 exposed in the groove portion 47. Here, a part of the lead electrode 33 located on the flow path forming substrate 12 exposed in the groove portion 47 in this way is an electrical connection portion of the piezoelectric element 13.

The drive circuit unit 16 is disposed on the sealing substrate 15 corresponding to each piezoelectric element group such as the piezoelectric element groups 13A and 13B. The drive circuit unit 16 includes, for example, a semiconductor integrated circuit (IC) including a circuit board or a drive circuit. Further, the drive circuit unit 16 is electrically connected to an external controller (not shown) provided outside the droplet discharge head 1, and the droplet discharge head 1 is controlled by this external controller.
The drive circuit portion 16 is connected to the lead electrode 33 exposed in the groove portion 47 by the wire 51. Although the upper electrode film 32 and the wire 51 of the piezoelectric element 13 are connected via the lead electrode 33, the upper electrode film 32 is exposed at the groove portion 47 without being provided with the lead electrode 33 and is connected to the wire 51. It is good also as a structure.

[Method of manufacturing droplet discharge head]
Next, a method for manufacturing the droplet discharge head 1 having the above configuration will be described. In the present embodiment, there is a feature in the bonding process between the nozzle substrate 11 and the flow path forming substrate 12 and the bonding process between the sealing substrate 15 and the compliance substrate 41. Therefore, this point will be mainly described.
First, the flow path forming substrate 12 and the elastic film 27 are formed. Here, the silicon substrate constituting the flow path forming substrate 12 is subjected to a thermal oxidation process to form the elastic film 27 made of SiO ₂ . Then, the lower electrode film 28 is provided on the elastic film 27 to form the vibration plate 14, and the piezoelectric element 13 is formed on the vibration plate 14. Subsequently, the pressure generating chamber 24, the supply path 25, and the communication portion 26 are formed by performing an etching process on the silicon substrate constituting the flow path forming substrate 12.

  Next, a bonding process is performed in which the flow path forming substrate 12 and the nozzle substrate 11 are bonded by the bonding layer 23. Here, for example, by using a droplet discharge method (inkjet method) or the like, a plurality of adhesion portions 23a are dispersed and arranged in an island shape in the adhesion region with the nozzle substrate 11 on the surface of the flow path forming substrate 12. Then, the space between the bonding portions 23a arranged in an island shape is filled with the filling portion 23b using, for example, a droplet discharge method. Thereafter, the adhesive region of the nozzle substrate 11 is brought into contact with the adhesive layer 23, heat treatment is performed to heat and cure the adhesive portion 23a and the filling portion 23b, and the flow path forming substrate 12 and the nozzle substrate 11 are bonded. At this time, a stress is generated in the bonding portion 23a due to a difference in coefficient of thermal expansion between the nozzle substrate 11 and the flow path forming substrate 12. However, since the bonding portions 23a are distributed in an island shape, the stress is relaxed. Is done. Further, since the filling portion 23b fills between the bonding portions 23a, the nozzle substrate 11 and the flow path forming substrate 12 are bonded to each other with a good sealing property by the bonding layer 23. As described above, the flow path forming substrate 12 provided with the piezoelectric elements 13 is formed.

  On the other hand, the reservoir portion 35, the groove portion 47, and the piezoelectric element holding portion 49 are formed by performing an etching process on the silicon substrate constituting the sealing substrate 15 separately from the flow path forming substrate 12. Next, the sealing substrate 15 and the compliance substrate 41 are bonded with the bonding layer 23 by the same method as the bonding step described above. As described above, the sealing substrate 15 to which the compliance substrate 41 is bonded is formed. Thereafter, the flow path forming substrate 12 and the sealing substrate 15 are bonded, and the drive circuit unit 16 is mounted on the sealing substrate 15. The droplet discharge head 1 is manufactured as described above.

[Operation of droplet discharge head]
In order to eject ink droplets by the droplet ejection head 1 having such a configuration, a functional liquid supply device (not shown) provided outside by the external controller and connected to the functional liquid inlet 46 is driven. To do. The functional liquid sent from the functional liquid supply device is supplied to the reservoir 36 via the functional liquid inlet 46 and then fills the internal flow path of the droplet discharge head 1 up to the nozzle opening 21. .
Further, the external controller transmits, for example, drive power and a command signal to the drive circuit unit 16 and the like mounted on the sealing substrate 15. The drive circuit unit 16 that has received the command signal transmits a drive signal based on the command from the external controller to each piezoelectric element 13. As a result, a voltage is applied between each of the lower electrode film 28 and the upper electrode film 32 corresponding to the pressure generation chamber 24, and displacement occurs in the elastic film 27, the lower electrode film 28, and the piezoelectric film 31. The volume of each pressure generating chamber 24 changes to increase the internal pressure, and droplets are ejected from the nozzle opening 21.

[Droplet discharge device]
The droplet discharge head 1 as described above is provided in a droplet discharge apparatus 100 as shown in FIG. The droplet discharge apparatus 100 is an ink jet recording apparatus including a droplet discharge head 1.
The droplet discharge head 1 constitutes a part of a recording head unit having an ink flow path communicating with an ink cartridge or the like, and is mounted on the droplet discharge device 100. The recording head units 101 and 102 having a droplet discharge head are detachably provided with cartridges 103 and 104 that constitute ink supply means. A carriage 105 on which the recording head units 101 and 102 are mounted is attached to a carriage shaft 107 attached to the apparatus main body 106 so as to be movable in the axial direction.

  For example, the recording head units 101 and 102 eject a black ink composition and a color ink composition, respectively. Then, the driving force of the driving motor 108 is transmitted to the carriage 105 via a plurality of gears (not shown) and a timing belt 109, so that the carriage 105 on which the recording head units 101 and 102 are mounted follows the carriage shaft 107. It is supposed to move. On the other hand, the apparatus main body 106 is provided with a platen 110 along the carriage shaft 107, and a recording sheet 111, which is a recording medium such as paper fed by a paper feed roller (not shown), is placed on the platen 110. It is designed to be transported.

According to the connection structure and the bonding method having the above-described configuration, and the droplet discharge head 1 and the method for manufacturing the droplet discharge head 1, the bonding portion 23a is dispersedly arranged to relieve stress generated at the bonding interface, and the nozzle substrate. 11 and the flow path forming substrate 12 or between the sealing substrate 15 and the compliance substrate 41 can be improved. And the adhesive force of the adhesive agent which comprises the adhesion part 23a can be utilized effectively by reducing generation | occurrence | production of the stress in an adhesion interface.
Further, by filling the space between the bonding portions 23a with the filling portion 23b having higher elasticity than the bonding portion 23a, the sealing property by the bonding layer 23 can be improved.
Further, by arranging the bonding portions 23a in an island shape and shortening the length around each bonding portion 23a, the generation of stress in each bonding portion 23a is more reliably suppressed.

In addition, this invention is not limited to the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, the bonding portion is substantially rectangular in a plan view, but may have another shape as long as adjacent bonding portions are separated from each other. Moreover, although the adhesion part is arrange | positioned at island shape, as long as the stress which generate | occur | produces in an adhesion part can be suppressed, other shapes, such as stripe shape, may be sufficient.
In addition, although the adhesive portion and the filling portion are disposed on the flow path forming substrate and then adhered to the nozzle substrate, the flow passage forming substrate may be adhered after the adhesive portion and the filling portion are disposed on the nozzle substrate.
And although the contact bonding layer has a filling part, it is good also as a structure which does not have a filling part, if sufficient sealing performance can be acquired.
Furthermore, although the adhesive structure of the present invention is applied to the droplet discharge head, the adhesive structure of the present invention may be applied to other members.

It is a perspective view which shows the droplet discharge head of one Embodiment. FIG. 2 is an exploded perspective view of FIG. 1. It is sectional drawing of FIG. An adhesive layer is shown, (a) is sectional drawing, (b) is a top view. It is a perspective view which shows a droplet discharge apparatus provided with a droplet discharge head.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Droplet discharge head, 11 Nozzle substrate (second member), 12 Flow path forming substrate (first member), 15 Sealing substrate (first member), 21 Nozzle opening (discharge port), 23 Adhesive layer, 23a Adhesion part, 23b filling part, 41 Compliance substrate (second member)

Claims (6)

An adhesive structure having first and second members bonded together via an adhesive layer,
The adhesive structure, wherein the adhesive layer has a plurality of adhesive portions arranged in a dispersed manner in the adhesive region of the first member.   The adhesive structure according to claim 1, wherein the adhesive layer has a filling portion that has higher elasticity than the adhesive portion and fills a space between the plurality of adhesive portions.   The bonding structure according to claim 1 or 2, wherein the plurality of bonding portions are arranged in an island shape. An adhesion method in which the first and second members are bonded together with an adhesive layer,
A bonding method comprising a step of dispersing and arranging a plurality of bonding portions in the bonding region of the first member. A droplet discharge head having a discharge port for discharging a liquid material,
A droplet discharge head comprising the adhesive structure according to claim 1. A method of manufacturing a droplet discharge head having a discharge port for discharging a liquid material,
A method for manufacturing a droplet discharge head, comprising a bonding step using the bonding method according to claim 4.

Images