JP2008189698A - Transparent encapsulation material and transparent encapsulated material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transparent encapsulation material having high reactivity in curing and giving a transparent encapsulated material having excellent physical properties such as heat-resistance, toughness, transparency and color. <P>SOLUTION: The transparent encapsulation material is produced by compounding (A1) 95-40 wt.% alicyclic diepoxy compound comprising 3,4,3',4'-diepoxybicyclohexyl compound expressed by formula (1) and having an isomer content of ≤20%, (A2) 5-60 wt.% alicyclic epoxy resin having a functionality of ≥2 and other than the alicyclic diepoxy compound (A1), 50-150 pts.wt. of a curing agent and 0.1-3.0 pts.wt. of a cure accelerator based on 100 pts.wt. of the epoxy resin composed of the components A1 and A2. In the formula, R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP>, R<SP>4</SP>, R<SP>5</SP>, R<SP>6</SP>, R<SP>7</SP>, R<SP>8</SP>, R<SP>9</SP>, R<SP>10</SP>, R<SP>11</SP>, R<SP>12</SP>, R<SP>13</SP>, R<SP>14</SP>, R<SP>15</SP>, R<SP>16</SP>, R<SP>17</SP>and R<SP>18</SP>are each independently hydrogen atom, halogen atom, oxygen atom, a hydrocarbon group which may have the halogen atom, or an alkoxy group which may have a substituent. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a transparent sealing material containing, as an essential component, an alicyclic diepoxy compound, more specifically, a 3,4,3 ′, 4′-diepoxybicyclohexyl compound having a very low isomer content, and The present invention relates to a transparent encapsulant obtained by curing. The transparent sealing material and the transparent sealing material are excellent in transparency and heat resistance, and are particularly useful in fields such as sealing of light emitting diodes and light receiving and emitting elements, light guide plates, light guide films, optical waveguides, and optical lenses. is there.

  Various types of epoxy compounds having two alicyclic skeletons in the molecule are commercially available. For example, 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate (Daicel Chemical Industries, trade name “CEL-2021P”), 1,2,8,9-diepoxy limonene ( Daicel Chemical Industries, Ltd., trade name “CEL-3000”), and ε-caprolactone oligomer having 3,4-epoxycyclohexylmethanol and 3,4-epoxycyclohexanecarboxylic acid ester-bonded to each end (Daicel Chemical) Kogyo Co., Ltd., trade name “CEL-2081”). A cured product is obtained by reacting these epoxy compounds under various curing agents or curing catalysts. This cured epoxy resin has the heat resistance, transparency, and good dielectric properties that are characteristic of a resin using a compound having an alicyclic skeleton, and is a component of coatings, adhesives, inks, sealants, or pharmaceuticals. It is useful as an intermediate or the like for producing other compounds useful for various end uses including medical supplies.

  However, since 1,2,8,9-diepoxy limonene has a methyl group on the carbon atom constituting the epoxy group, the reactivity is low due to its steric hindrance. Also, 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexanecarboxylate, a compound in which 3,4-epoxycyclohexylmethanol and 3,4-epoxycyclohexanecarboxylic acid are ester-bonded to both ends of an ε-caprolactone oligomer, respectively. Since it has an ester group in the molecule, it has hydrolyzability, and when used under conditions of high temperature and high humidity or when a strong acid is generated, the physical properties of the cured product may be lowered. Therefore, an epoxy compound having an alicyclic skeleton having no ester group in the molecule is desired.

  As an alicyclic epoxy compound having two alicyclic skeletons in the molecule and no ester group in the molecule, JP-A-2004-99467 discloses a bicyclohexyl-3,3'-diene compound. A method of epoxidation with an organic percarboxylic acid to obtain a 3,4,3 ′, 4′-diepoxybicyclohexyl compound is disclosed. In addition, in Russian literature (Neftekhimiya, 1972, 12, 353), a bicyclohexyl-3,3′-diene compound is epoxidized using t-butyl hydroperoxide and a catalytic amount of molybdenum (V) chloride. , 4,3 ', 4'-diepoxybicyclohexyl compounds are disclosed. Japanese Patent Application Laid-Open No. 2004-204228 discloses a curable epoxy resin composition containing a 3,4,3 ′, 4′-diepoxybicyclohexyl compound obtained by the above production method and a cured product thereof. ing. Japanese Patent Application Laid-Open No. 2005-29668 discloses a transparent composite composition comprising a transparent resin and a glass filler, and 3,4,3 ′, 4′-diepoxybicyclohexyl compounds are exemplified as the transparent resin. JP-A-2005-68303 discloses a thermosetting resin composition containing a 3,4,3 ′, 4′-diepoxybicyclohexyl compound. However, the epoxy resin composition containing a 3,4,3 ′, 4′-diepoxybicyclohexyl compound obtained by a conventional production method is not sufficiently reactive during curing, and the cured product is also heat resistant. However, they did not necessarily have satisfactory physical properties in terms of toughness, transparency, hue, and the like. For example, when a transparent material is actually used, the toughness of the cured product is also required, and simple heat resistance alone causes cracks in the cured product, which greatly limits the application as a transparent material. . In addition, when producing a cured product having a certain thickness, hue becomes a problem. However, a cured product of an epoxy resin composition containing a 3,4,3 ′, 4′-diepoxybicyclohexyl compound obtained by a conventional production method is insufficient in terms of this toughness, transparency, and hue. there were.

JP 2004-99467 A JP 2004-204228 A Neftekhimiya, 1972, 12, 353 Japanese Patent Laying-Open No. 2005-29668 JP 2005-68303 A

  The purpose of the present invention is that the physical properties of the cured product do not deteriorate even when used under conditions of high temperature and high humidity or when a strong acid is generated, and the reactivity at the time of curing is high, heat resistance, toughness, It is in providing the transparent sealing material which can obtain the transparent sealing material excellent in physical properties, such as transparency and a hue, and the transparent sealing material obtained by hardening | curing this transparent sealing material.

  As a result of intensive studies to achieve the above object, the present inventors have obtained the following knowledge. That is, when the 3,4,3 ′, 4′-diepoxybicyclohexyl compound obtained by the conventional method is analyzed in detail, in addition to the target 3,4,3 ′, 4′-diepoxybicyclohexyl compound, It was found that isomers having different positions of epoxy groups on the cyclohexane ring were contained in a small amount. Until now, it has not been known that such isomers are contained in a large amount in 3,4,3 ′, 4′-diepoxybicyclohexyl compounds obtained by conventional methods. Since this isomer is close in physical properties such as boiling point to the 3,4,3 ′, 4′-diepoxybicyclohexyl compound, it is difficult to separate it once it is formed. Therefore, as a result of investigating the cause of such isomer contamination, the bicyclohexyl-3,3'-diene compound used as a raw material for epoxidation contains many isomers having different double bond positions. I understood. For example, when a bicyclohexyl-3,3′-diene compound is synthesized by a dehydration reaction of a 4,4′-dihydroxybicyclohexyl compound, this positional isomer is added with water or dehydrated due to the presence of by-product water. It is considered that the separation is repeated and the position of the double bond is generated by moving. Since this isomer is also similar in physical properties such as boiling point to the bicyclohexyl-3,3'-diene compound, it is difficult to separate once produced. As a method for producing a bicyclohexyl-3,3'-diene compound, a method in which hydrogenated biphenol (4,4'-dihydroxybicyclohexyl) is intramolecularly dehydrated in a solvent in the presence of potassium hydrogen sulfate or the like is known. However, in this method, since the solid hydrogenated biphenol is melted and reacted, the by-product water is difficult to escape from the system, and the by-product water stays for a long time. It was found that the amount of isomers and other by-products produced was extremely high. On the other hand, in JP-A-2005-97274, hydrogenated biphenol is subjected to intramolecular dehydration without solvent in the presence of an alkali metal hydrogensulfate such as potassium hydrogensulfate to produce water and bicyclohexyl-3,3'-diene. Is rapidly distilled off from the reactor to obtain bicyclohexyl-3,3'-diene. According to this method, side reaction can be suppressed and bicyclohexyl-3,3'-diene having higher purity can be obtained. However, when the reaction product is analyzed in detail by gas chromatography using a capillary column, Also in the production method, the ratio of bicyclohexyl-3,3'-diene and its isomer was at most 80:20, and it was found that the isomer was considerably contained. Accordingly, various studies were made on the production of bicyclohexyl-3,3'-diene compounds with a low isomer content. When hydrogenated biphenol was subjected to an intramolecular dehydration reaction under specific reaction conditions, the isomer content ratio was reduced. It has been found that very little bicyclohexyl-3,3'-diene can be obtained in a simple and high yield. When bicyclohexyl-3,3′-diene having a very low isomer content ratio is used as a raw material, 3,4,3 ′, 4 ′ having a very low isomer content ratio is obtained. -Diepoxy bicyclohexyl is obtained, and when a curable epoxy resin composition containing such 3,4,3 ', 4'-diepoxy bicyclohexyl is used as a transparent sealing material, heat resistance and toughness It has been found that a cured product can be obtained that is balanced with respect to physical properties, transparency, and hue. The present invention has been completed based on these findings.

（式中、Ｒ¹、Ｒ²、Ｒ³、Ｒ⁴、Ｒ⁵、Ｒ⁶、Ｒ⁷、Ｒ⁸、Ｒ⁹、Ｒ¹⁰、Ｒ¹¹、Ｒ¹²、Ｒ¹³、Ｒ¹⁴、Ｒ¹⁵、Ｒ¹⁶、Ｒ¹⁷及びＲ¹⁸は、同一又は異なって、水素原子、ハロゲン原子、酸素原子若しくはハロゲン原子を有していてもよい炭化水素基、又は置換基を有していてもよいアルコキシ基を示す）
で表される３，４，３′，４′−ジエポキシビシクロヘキシル化合物であって、該３，４，３′，４′−ジエポキシビシクロヘキシル化合物の異性体の含有量が、３，４，３′，４′−ジエポキシビシクロヘキシル化合物とその異性体の総和に対して、ガスクロマトグラフィーによるピーク面積の割合として２０％以下である脂環式ジエポキシ化合物（Ａ１）９５〜４０重量％、及び、前記脂環式ジエポキシ化合物（Ａ１）以外の２官能以上のエポキシ樹脂（Ａ２）５〜６０重量％からなるエポキシ樹脂［（Ａ１）と（Ａ２）の合計は１００重量％］１００重量部に対して、硬化剤５０〜１５０重量部、硬化促進剤０．０５〜３．０重量部を配合した透明封止材料（以下、「第１の透明封止材料」と称することがある）を提供する。 That is, the present invention provides the following formula (1):

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
Wherein the isomer content of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound is 3,4,3 ′, 4′-diepoxybicyclohexyl compound. , 3 ′, 4′-diepoxy bicyclohexyl compound and its isomers, the ratio of the peak area by gas chromatography is 20% or less, and the alicyclic diepoxy compound (A1) is 95 to 40% by weight, And an epoxy resin composed of 5 to 60% by weight of a bifunctional or higher functional epoxy resin (A2) other than the alicyclic diepoxy compound (A1) [total of (A1) and (A2) is 100% by weight] in 100 parts by weight On the other hand, a transparent sealing material containing 50 to 150 parts by weight of a curing agent and 0.05 to 3.0 parts by weight of a curing accelerator (hereinafter sometimes referred to as “first transparent sealing material”) is provided. To do.

（式中、Ｒ¹、Ｒ²、Ｒ³、Ｒ⁴、Ｒ⁵、Ｒ⁶、Ｒ⁷、Ｒ⁸、Ｒ⁹、Ｒ¹⁰、Ｒ¹¹、Ｒ¹²、Ｒ¹³、Ｒ¹⁴、Ｒ¹⁵、Ｒ¹⁶、Ｒ¹⁷及びＲ¹⁸は、同一又は異なって、水素原子、ハロゲン原子、酸素原子若しくはハロゲン原子を有していてもよい炭化水素基、又は置換基を有していてもよいアルコキシ基を示す）
で表されるビシクロヘキシル−３，３′−ジエン化合物であって、該ビシクロヘキシル−３，３′−ジエン化合物の異性体の含有量が、ビシクロヘキシル−３，３′−ジエン化合物とその異性体の総和に対して、ガスクロマトグラフィーによるピーク面積の割合として２０％未満である脂環式ジエン化合物をエポキシ化することにより得られる脂環式ジエポキシ化合物（Ａ１′）９５〜４０重量％、及び、前記脂環式ジエポキシ化合物（Ａ１′）以外の２官能以上のエポキシ樹脂（Ａ２）５〜６０重量％からなるエポキシ樹脂［（Ａ１′）と（Ａ２）の合計は１００重量％）１００重量部に対して、硬化剤５０〜１５０重量部、硬化促進剤０．０５〜３．０重量部を配合した透明封止材料（以下、「第２の透明封止材料」と称することがある）を提供する。 The present invention also provides the following formula (2):

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
A bicyclohexyl-3,3′-diene compound represented by the formula: wherein the isomer content of the bicyclohexyl-3,3′-diene compound is such that the bicyclohexyl-3,3′-diene compound and its isomer 95 to 40% by weight of an alicyclic diepoxy compound (A1 ′) obtained by epoxidizing an alicyclic diene compound having a peak area ratio of less than 20% by gas chromatography with respect to the total body, and 100 parts by weight of an epoxy resin consisting of 5 to 60% by weight of a bifunctional or higher functional epoxy resin (A2) other than the alicyclic diepoxy compound (A1 ′) [the total of (A1 ′) and (A2) is 100% by weight) In contrast, a transparent sealing material (hereinafter, referred to as “second transparent sealing material”) containing 50 to 150 parts by weight of a curing agent and 0.05 to 3.0 parts by weight of a curing accelerator. To provide.

（式中、Ｒ¹、Ｒ²、Ｒ³、Ｒ⁴、Ｒ⁵、Ｒ⁶、Ｒ⁷、Ｒ⁸、Ｒ⁹、Ｒ¹⁰、Ｒ¹¹、Ｒ¹²、Ｒ¹³、Ｒ¹⁴、Ｒ¹⁵、Ｒ¹⁶、Ｒ¹⁷及びＲ¹⁸は、同一又は異なって、水素原子、ハロゲン原子、酸素原子若しくはハロゲン原子を有していてもよい炭化水素基、又は置換基を有していてもよいアルコキシ基を示す）
で表される３，４，３′，４′−ジエポキシビシクロヘキシル化合物であって、該３，４，３′，４′−ジエポキシビシクロヘキシル化合物の異性体の含有量が、３，４，３′，４′−ジエポキシビシクロヘキシル化合物とその異性体の総和に対して、ガスクロマトグラフィーによるピーク面積の割合として２０％以下である脂環式ジエポキシ化合物（Ａ１）９５〜４０重量％、及び、前記脂環式ジエポキシ化合物（Ａ１）以外の２官能以上のエポキシ樹脂（Ａ２）５〜６０重量％からなるエポキシ樹脂［（Ａ１）と（Ａ２）の合計は１００重量％］１００重量部に対して、熱カチオン重合開始剤０．０１〜１２重量部を配合した透明封止材料（以下、「第３の透明封止材料」と称することがある）を提供する。 The present invention further provides the following formula (1):

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
Wherein the isomer content of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound is 3,4,3 ′, 4′-diepoxybicyclohexyl compound. , 3 ′, 4′-diepoxy bicyclohexyl compound and its isomers, the ratio of the peak area by gas chromatography is 20% or less, and the alicyclic diepoxy compound (A1) is 95 to 40% by weight, And an epoxy resin composed of 5 to 60% by weight of a bifunctional or higher functional epoxy resin (A2) other than the alicyclic diepoxy compound (A1) [total of (A1) and (A2) is 100% by weight] in 100 parts by weight On the other hand, the transparent sealing material which mix | blended 0.01-12 weight part of thermal cationic polymerization initiators (henceforth a "3rd transparent sealing material") is provided.

（式中、Ｒ¹、Ｒ²、Ｒ³、Ｒ⁴、Ｒ⁵、Ｒ⁶、Ｒ⁷、Ｒ⁸、Ｒ⁹、Ｒ¹⁰、Ｒ¹¹、Ｒ¹²、Ｒ¹³、Ｒ¹⁴、Ｒ¹⁵、Ｒ¹⁶、Ｒ¹⁷及びＲ¹⁸は、同一又は異なって、水素原子、ハロゲン原子、酸素原子若しくはハロゲン原子を有していてもよい炭化水素基、又は置換基を有していてもよいアルコキシ基を示す）
で表されるビシクロヘキシル−３，３′−ジエン化合物であって、該ビシクロヘキシル−３，３′−ジエン化合物の異性体の含有量が、ビシクロヘキシル−３，３′−ジエン化合物とその異性体の総和に対して、ガスクロマトグラフィーによるピーク面積の割合として２０％未満である脂環式ジエン化合物をエポキシ化することにより得られる脂環式ジエポキシ化合物（Ａ１′）９５〜４０重量％、及び、前記脂環式ジエポキシ化合物（Ａ１′）以外の２官能以上のエポキシ樹脂（Ａ２）５〜６０重量％からなるエポキシ樹脂［（Ａ１′）と（Ａ２）の合計は１００重量％）１００重量部に対して、熱カチオン重合開始剤０．０１〜１２重量部を配合した透明封止材料（以下、「第４の透明封止材料」と称することがある）を提供する。 The present invention further provides the following formula (2):

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
A bicyclohexyl-3,3′-diene compound represented by the formula: wherein the isomer content of the bicyclohexyl-3,3′-diene compound is such that the bicyclohexyl-3,3′-diene compound and its isomer 95 to 40% by weight of an alicyclic diepoxy compound (A1 ′) obtained by epoxidizing an alicyclic diene compound having a peak area ratio of less than 20% by gas chromatography with respect to the total body, and 100 parts by weight of an epoxy resin consisting of 5 to 60% by weight of a bifunctional or higher functional epoxy resin (A2) other than the alicyclic diepoxy compound (A1 ′) [the total of (A1 ′) and (A2) is 100% by weight) In contrast, a transparent sealing material containing 0.01 to 12 parts by weight of a thermal cationic polymerization initiator (hereinafter sometimes referred to as “fourth transparent sealing material”) is provided.

（式中、Ｒ¹、Ｒ²、Ｒ³、Ｒ⁴、Ｒ⁵、Ｒ⁶、Ｒ⁷、Ｒ⁸、Ｒ⁹、Ｒ¹⁰、Ｒ¹¹、Ｒ¹²、Ｒ¹³、Ｒ¹⁴、Ｒ¹⁵、Ｒ¹⁶、Ｒ¹⁷及びＲ¹⁸は、同一又は異なって、水素原子、ハロゲン原子、酸素原子若しくはハロゲン原子を有していてもよい炭化水素基、又は置換基を有していてもよいアルコキシ基を示す）
で表される３，４，３′，４′−ジエポキシビシクロヘキシル化合物であって、該３，４，３′，４′−ジエポキシビシクロヘキシル化合物の異性体の含有量が、３，４，３′，４′−ジエポキシビシクロヘキシル化合物とその異性体の総和に対して、ガスクロマトグラフィーによるピーク面積の割合として２０％以下である脂環式ジエポキシ化合物（Ａ１）を少なくとも含む２官能以上のエポキシ樹脂（Ａ）９５〜４０重量％、及び、ポリオール（Ｂ）５〜６０重量％からなる混合物［（Ａ）と（Ｂ）の合計は１００重量％］１００重量部に対して、硬化剤５０〜１５０重量部、硬化促進剤０．０５〜３．０重量部を配合した透明封止材料（以下、「第５の透明封止材料」と称することがある）を提供する。 The present invention also provides the following formula (1):

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
Wherein the isomer content of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound is 3,4,3 ′, 4′-diepoxybicyclohexyl compound. , 3 ', 4'-diepoxybicyclohexyl compound and its isomers are bifunctional or higher containing at least the alicyclic diepoxy compound (A1) having a peak area ratio of 20% or less by gas chromatography Curing agent for 100 parts by weight of a mixture of 95 to 40% by weight of epoxy resin (A) and 5 to 60% by weight of polyol (B) [total of (A) and (B) is 100% by weight] A transparent sealing material containing 50 to 150 parts by weight and a curing accelerator of 0.05 to 3.0 parts by weight (hereinafter sometimes referred to as “fifth transparent sealing material”) is provided.

（式中、Ｒ¹、Ｒ²、Ｒ³、Ｒ⁴、Ｒ⁵、Ｒ⁶、Ｒ⁷、Ｒ⁸、Ｒ⁹、Ｒ¹⁰、Ｒ¹¹、Ｒ¹²、Ｒ¹³、Ｒ¹⁴、Ｒ¹⁵、Ｒ¹⁶、Ｒ¹⁷及びＲ¹⁸は、同一又は異なって、水素原子、ハロゲン原子、酸素原子若しくはハロゲン原子を有していてもよい炭化水素基、又は置換基を有していてもよいアルコキシ基を示す）
で表されるビシクロヘキシル−３，３′−ジエン化合物であって、該ビシクロヘキシル−３，３′−ジエン化合物の異性体の含有量が、ビシクロヘキシル−３，３′−ジエン化合物とその異性体の総和に対して、ガスクロマトグラフィーによるピーク面積の割合として２０％未満である脂環式ジエン化合物をエポキシ化することにより得られる脂環式ジエポキシ化合物（Ａ１′）を少なくとも含む２官能以上のエポキシ樹脂（Ａ′）９５〜４０重量％、及び、ポリオール（Ｂ）５〜６０重量％からなる混合物［（Ａ′）と（Ｂ）の合計は１００重量％］１００重量部に対して、硬化剤５０〜１５０重量部、硬化促進剤０．０５〜３．０重量部を配合した透明封止材料（以下、「第６の透明封止材料」と称することがある）を提供する。 The present invention further provides the following formula (2):

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
A bicyclohexyl-3,3′-diene compound represented by the formula: wherein the isomer content of the bicyclohexyl-3,3′-diene compound is such that the bicyclohexyl-3,3′-diene compound and its isomer A bifunctional or higher functional group containing at least an alicyclic diepoxy compound (A1 ′) obtained by epoxidizing an alicyclic diene compound having a peak area ratio of less than 20% by gas chromatography with respect to the total body. Curing for 100 parts by weight of a mixture consisting of 95 to 40% by weight of epoxy resin (A ′) and 5 to 60% by weight of polyol (B) [total of (A ′) and (B) is 100% by weight] A transparent sealing material containing 50 to 150 parts by weight of an agent and 0.05 to 3.0 parts by weight of a curing accelerator (hereinafter sometimes referred to as “sixth transparent sealing material”) is provided.

（式中、Ｒ¹、Ｒ²、Ｒ³、Ｒ⁴、Ｒ⁵、Ｒ⁶、Ｒ⁷、Ｒ⁸、Ｒ⁹、Ｒ¹⁰、Ｒ¹¹、Ｒ¹²、Ｒ¹³、Ｒ¹⁴、Ｒ¹⁵、Ｒ¹⁶、Ｒ¹⁷及びＲ¹⁸は、同一又は異なって、水素原子、ハロゲン原子、酸素原子若しくはハロゲン原子を有していてもよい炭化水素基、又は置換基を有していてもよいアルコキシ基を示す）
で表される３，４，３′，４′−ジエポキシビシクロヘキシル化合物であって、該３，４，３′，４′−ジエポキシビシクロヘキシル化合物の異性体の含有量が、３，４，３′，４′−ジエポキシビシクロヘキシル化合物とその異性体の総和に対して、ガスクロマトグラフィーによるピーク面積の割合として２０％以下である脂環式ジエポキシ化合物（Ａ１）を少なくとも含む２官能以上のエポキシ樹脂（Ａ）９５〜４０重量％、及び、ポリオール（Ｂ）５〜６０重量％からなる混合物［（Ａ）と（Ｂ）の合計は１００重量％］１００重量部に対して、熱カチオン重合開始剤０．０１〜１２重量部を配合した透明封止材料（以下、「第７の透明封止材料」と称することがある）を提供する。 The present invention further provides the following formula (1):

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
Wherein the isomer content of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound is 3,4,3 ′, 4′-diepoxybicyclohexyl compound. , 3 ', 4'-diepoxybicyclohexyl compound and its isomers are bifunctional or higher containing at least the alicyclic diepoxy compound (A1) having a peak area ratio of 20% or less by gas chromatography The epoxy resin (A) of 95 to 40% by weight and the polyol (B) 5 to 60% by weight of the mixture [(A) and (B) is 100% by weight in total] 100 parts by weight of the thermal cation A transparent sealing material containing 0.01 to 12 parts by weight of a polymerization initiator (hereinafter sometimes referred to as “seventh transparent sealing material”) is provided.

（式中、Ｒ¹、Ｒ²、Ｒ³、Ｒ⁴、Ｒ⁵、Ｒ⁶、Ｒ⁷、Ｒ⁸、Ｒ⁹、Ｒ¹⁰、Ｒ¹¹、Ｒ¹²、Ｒ¹³、Ｒ¹⁴、Ｒ¹⁵、Ｒ¹⁶、Ｒ¹⁷及びＲ¹⁸は、同一又は異なって、水素原子、ハロゲン原子、酸素原子若しくはハロゲン原子を有していてもよい炭化水素基、又は置換基を有していてもよいアルコキシ基を示す）
で表されるビシクロヘキシル−３，３′−ジエン化合物であって、該ビシクロヘキシル−３，３′−ジエン化合物の異性体の含有量が、ビシクロヘキシル−３，３′−ジエン化合物とその異性体の総和に対して、ガスクロマトグラフィーによるピーク面積の割合として２０％未満である脂環式ジエン化合物をエポキシ化することにより得られる脂環式ジエポキシ化合物（Ａ１′）を少なくとも含む２官能以上のエポキシ樹脂（Ａ′）９５〜４０重量％、及び、ポリオール（Ｂ）５〜６０重量％からなる混合物［（Ａ′）と（Ｂ）の合計は１００重量％］１００重量部に対して、熱カチオン重合開始剤０．０１〜１２重量部を配合した透明封止材料（以下、「第８の透明封止材料」と称することがある）を提供する。 The present invention also provides the following formula (2):

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
A bicyclohexyl-3,3′-diene compound represented by the formula: wherein the isomer content of the bicyclohexyl-3,3′-diene compound is such that the bicyclohexyl-3,3′-diene compound and its isomer A bifunctional or higher functional group containing at least an alicyclic diepoxy compound (A1 ′) obtained by epoxidizing an alicyclic diene compound having a peak area ratio of less than 20% by gas chromatography with respect to the total body. 100 parts by weight of epoxy resin (A ') 95 to 40% by weight and polyol (B) 5 to 60% by weight of a mixture [total of (A') and (B) is 100% by weight] A transparent sealing material containing 0.01 to 12 parts by weight of a cationic polymerization initiator (hereinafter sometimes referred to as “eighth transparent sealing material”) is provided.

  The present invention further provides a transparent encapsulant obtained by curing each of the transparent encapsulating materials.

  According to the transparent sealing material of the present invention, the physical properties of the cured product do not deteriorate even when used under conditions such as use under high temperature and high humidity or generation of strong acid, and obtained by a conventional method. Compared with epoxy resin composition containing 4,3 ', 4'-diepoxybicyclohexyl compound, the reactivity at the time of curing is remarkably improved, and it cures in a short time, and also has heat resistance, transparency, hue, water absorption A cured product having excellent performance in terms of rate, dimensional accuracy, dimensional stability, etc., particularly in terms of heat resistance, transparency, hue, and dimensional stability can be obtained. The transparent encapsulated material of the present invention is remarkably excellent in physical properties such as heat resistance, transparency, hue, and dimensional stability.

[Alicyclic diepoxy compounds (A1) and (A1 ′)]
The alicyclic diepoxy compound (A1) in the present invention is a 3,4,3 ′, 4′-diepoxybicyclohexyl compound represented by the formula (1), which is contained as an impurity. The content of isomers of 4,3 ', 4'-diepoxybicyclohexyl compound is determined by gas chromatography with respect to the sum of 3,4,3', 4'-diepoxybicyclohexyl compound and its isomer. The ratio of the peak area is 20% or less.

In formula (1), the halogen atoms in R ^{1 to} R ¹⁸ include fluorine, chlorine, bromine and iodine atoms. Examples of the hydrocarbon group in the “hydrocarbon group optionally having an oxygen atom or halogen atom” include an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, an aromatic hydrocarbon group, and a group in which two or more of these are bonded. Is mentioned. Examples of the aliphatic hydrocarbon group include linear or branched alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, t-butyl, pentyl, hexyl, octyl and decyl groups (for example, carbon number An alkyl group having 1 to 10 carbon atoms, preferably about 1 to 5 carbon atoms; an alkenyl group such as vinyl or an allyl group (for example, an alkenyl group having 2 to 10 carbon atoms, preferably about 2 to 5 carbon atoms); Alkynyl groups (for example, alkynyl groups having 2 to 10 carbon atoms, preferably about 2 to 5 carbon atoms). Examples of the alicyclic hydrocarbon group include cycloalkyl groups such as cyclopentyl and cyclohexyl groups; cycloalkenyl groups; bridged cyclic groups and the like. Examples of the aromatic hydrocarbon group include phenyl and naphthyl groups. Examples of the hydrocarbon group having an oxygen atom include a group in which an oxygen atom is interposed in the carbon chain of the hydrocarbon group (for example, an alkoxyalkyl group such as a methoxymethyl group or an ethoxymethyl group). . As the hydrocarbon group having a halogen atom, for example, one or more hydrogen atoms of the hydrocarbon group such as chloromethyl group, trifluoromethyl group, chlorophenyl group are halogen atoms (fluorine, chlorine, bromine or iodine atoms). ). The alkoxy group in the “optionally substituted alkoxy group” is an alkoxy group having about 1 to 10 carbon atoms (preferably 1 to 5 carbon atoms) such as a methoxy, ethoxy, propyloxy, isopropyloxy, butyloxy group or the like. Groups and the like. As a substituent of an alkoxy group, the said halogen atom etc. are mentioned, for example.

Among the 3,4,3 ′, 4′-diepoxybicyclohexyl compounds represented by the formula (1), 3,4,3 ′, 4′-diepoxy in which R ^{1 to} R ¹⁸ are all hydrogen atoms Bicyclohexyl is particularly preferred.

Since 3,4,3 ′, 4′-diepoxybicyclohexyl compounds and their isomers have similar physical properties such as boiling point, they cannot often be separated by a general gas chromatography apparatus. Therefore, it is desirable to perform quantitative analysis of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound and its isomers by gas chromatography using a capillary column having higher resolution. Quantitative analysis of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound and its isomer by gas chromatography can be performed under the following measurement conditions. The structure of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound and its isomer can be confirmed by, for example, NMR, GC-MS, GC-IR and the like.
Measuring device: HP6890 (manufactured by Hewlett-Packard Company)
Column: HP-5, length 30 m, film thickness 0.25 μm, inner diameter 0.32 mm
Liquid phase 5% -diphenyl-95% -dimethylpolysiloxane Carrier gas: Nitrogen Carrier gas flow rate: 1.0 ml / min Detector: FID
Inlet temperature: 250 ° C
Detector temperature: 300 ° C
Temperature rise pattern (column): Hold at 100 ° C. for 2 minutes, heat up to 300 ° C. at 5 ° C./minute, hold at 300 ° C. for 10 minutes Split ratio: 100
Sample: 1 μl (epoxy compound: acetone = 1: 40)

  In the alicyclic diepoxy compound (A1), the isomer content of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound contained as an impurity is 3,4,3 ′, 4′-diene. The ratio of the peak area by gas chromatography is 20% or less (preferably 18% or less, more preferably 16% or less) with respect to the sum of the epoxybicyclohexyl compound (main compound) and its isomers. Such an alicyclic diepoxy compound has a markedly faster curing reaction rate than that having a content of the isomer exceeding 20%, and the glass transition temperature of the cured product after curing is significantly increased. Physical properties such as heat resistance, transparency, hue, and dimensional stability are remarkably improved.

Such an alicyclic diepoxy compound (A1) is, for example, a bicyclohexyl-3,3′-diene compound represented by the above formula (2), and the bicyclohexyl-3,3′-diene compound. The content of isomers (isomers with different double bond positions) is less than 20% as a proportion of peak area by gas chromatography with respect to the sum of the bicyclohexyl-3,3'-diene compound and its isomers. It can be produced by epoxidizing an alicyclic diene compound (for example, 19.5% or less, preferably 15% or less). The alicyclic diepoxy compound obtained by this production method is referred to as “alicyclic diepoxy compound (A1 ′)”. In formula (2), R ^{1 to} R ¹⁸ are the same as described above.

（式中、Ｒ¹、Ｒ²、Ｒ³、Ｒ⁴、Ｒ⁵、Ｒ⁶、Ｒ⁷、Ｒ⁸、Ｒ⁹、Ｒ¹⁰、Ｒ¹¹、Ｒ¹²、Ｒ¹³、Ｒ¹⁴、Ｒ¹⁵、Ｒ¹⁶、Ｒ¹⁷及びＲ¹⁸は前記に同じ）
で表される４，４′−ジヒドロキシビシクロヘキシル化合物を、有機溶媒中、脱水触媒の存在下、副生する水を留去しながら脱水反応を行うことにより得られる。 Here, the bicyclohexyl-3,3′-diene compound represented by the formula (2) having a small isomer content used as a raw material is, for example, the following formula (3):

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same as above)
Is obtained by performing a dehydration reaction in an organic solvent while distilling off by-product water in the presence of a dehydration catalyst.

  More specifically, for example, in the presence of a dehydration catalyst that dissolves the 4,4′-dihydroxybicyclohexyl compound represented by the formula (3) in a liquid or reaction solution under the reaction conditions in an organic solvent (i). Heating to a temperature of 130 to 200 ° C. under a pressure exceeding 20 Torr (2.67 kPa), and performing a dehydration reaction while distilling off by-product water, and (ii) following the step (i), The reaction mixture is heated to a temperature of 100 to 220 ° C. under a pressure of 200 Torr (26.7 kPa) or less to distill the produced bicyclohexyl-3,3′-diene compound represented by the formula (2). It can manufacture by passing through a process. This method will be described below.

  A typical example of the compound represented by the formula (3) is 4,4′-dihydroxybicyclohexyl (hydrogenated biphenol).

  The organic solvent used in the step (i) is not particularly limited as long as it is an inert solvent under the reaction conditions, but is preferably a liquid at 25 ° C. and having a boiling point of about 120 to 200 ° C. Typical examples of preferable organic solvents include aromatic hydrocarbons such as xylene, cumene, and pseudocumene; and aliphatic hydrocarbons such as dodecane and undecane. As an organic solvent, in order to easily separate and remove by-product water, an organic solvent that is azeotropic with water and can be separated from water may be used. A solvent that reacts in the presence of an acid such as a ketone or ester is not preferable even if the boiling point is in the above range. Alcohol is not preferred because it may cause a dehydration reaction.

  The amount of the organic solvent used can be appropriately selected in consideration of operability, reaction rate and the like, but is usually about 50 to 1000 parts by weight with respect to 100 parts by weight of the substrate 4,4′-dihydroxybicyclohexyl compound. Yes, preferably about 80 to 800 parts by weight, more preferably about 100 to 500 parts by weight.

  The dehydration catalyst used in the step (i) is not particularly limited as long as it has a dehydration activity and is liquid under the reaction conditions or can be dissolved in the reaction liquid (completely dissolved in the use amount described later). Those having no activity or as low as possible with respect to the reaction solvent are preferable. The dehydration catalyst that is liquid under the reaction conditions is preferably one that is finely dispersed in the reaction solution. As the dehydration catalyst, usually, inorganic acids such as phosphoric acid and sulfuric acid, acids such as sulfonic acids such as p-toluenesulfonic acid, benzenesulfonic acid, and naphthalenesulfonic acid, or salts thereof, in particular, complete with an organic base of the acid. Neutralized or partially neutralized salts are used. A dehydration catalyst can be used individually or in combination of 2 or more types.

  When using a neutralized salt of an acid with an organic base, a neutralized salt (fully or partially neutralized salt) may be isolated and purified from a reaction mixture obtained by reacting an acid with an organic base. However, a reaction mixture obtained by reacting an acid with an organic base (containing a completely neutralized salt and / or a partially neutralized salt) can be used as it is. In the latter case, the reaction mixture may contain free acid. In the latter case, the mixing ratio of the acid and the organic base is, for example, about 0.01 to 1 equivalent, preferably about 0.05 to 0.5 equivalent, more preferably about 1 to 1 equivalent of the acid. Is about 0.1 to 0.47 equivalent. In particular, when a reaction mixture of sulfuric acid and organic base is used, the mixing ratio of sulfuric acid and organic base is preferably 0.02 to 2 mol, more preferably 0.1 to 1 mol of sulfuric acid. The amount is about 1.0 to 1.0 mol, particularly preferably about 0.2 to 0.95 mol. Moreover, when using the neutralized salt by the organic base of an acid, an acid and an organic base may be added separately and the neutralized salt may be formed in a system.

  The organic base may be any organic compound that exhibits basicity. For example, 1,8-diazabicyclo [5.4.0] undecene-7 (DBU), 1,5-diazabicyclo [4.3.0] nonene. -5 (DBN), 1,4-diazabicyclo [2.2.2] octane, piperidine, N-methylpiperidine, pyrrolidine, N-methylpyrrolidine, triethylamine, tributylamine, trioctylamine, benzyldimethylamine, 4-dimethyl Examples include amines such as aminopyridine and N, N-dimethylaniline (particularly tertiary amines); nitrogen-containing aromatic heterocyclic compounds such as pyridine, collidine, quinoline and imidazole; guanidines; hydrazines and the like. Among these, third compounds such as 1,8-diazabicyclo [5.4.0] undecene-7 (DBU), 1,5-diazabicyclo [4.3.0] nonene-5 (DBN), triethylenediamine, triethylamine and the like. Secondary amines (particularly cyclic amines), guanidines and hydrazines are preferred, and DBU, DBN, triethylenediamine and triethylamine are particularly preferred. Moreover, as an organic base, the thing of pKa11 or more is preferable and the thing whose boiling point is 150 degreeC or more is preferable.

  When an alkali metal salt of sulfuric acid such as potassium hydrogen sulfate is used as a dehydration catalyst, the content of the isomer of the bicyclohexyl-3,3'-diene compound is reduced to that of the bicyclohexyl-3,3'-diene compound and its isomer. An area ratio by gas chromatography of less than 20% is not obtained with respect to the sum. When ammonium bisulfate is used as the dehydration catalyst, the content of isomers of the bicyclohexyl-3,3'-diene compound is the sum of the bicyclohexyl-3,3'-diene compound and its isomer. On the other hand, a peak area ratio by gas chromatography of about 19% is obtained.

  Therefore, as a dehydration catalyst, completely neutralized salts or partially neutralized salts of organic acids such as sulfonic acids (p-toluenesulfonic acid, etc.), phosphoric acid, sulfuric acid, sulfonic acids (p-toluenesulfonic acid, etc.), phosphoric acid A completely neutralized salt or a partially neutralized salt with an organic base, and a completely neutralized salt or a partially neutralized salt with an organic base of sulfuric acid are preferred. Of these, sulfonic acids (particularly p-toluenesulfonic acid), completely neutralized salts or partially neutralized salts of organic acids with sulfonic acids, and completely neutralized salts or partially neutralized salts of sulfuric acid with organic bases are particularly preferable. A completely neutralized salt or a partially neutralized salt (particularly a partially neutralized salt) of sulfuric acid with an organic base is preferred.

  The amount of the dehydration catalyst used is, for example, 0.001 to 0.5 mol, preferably 0.001 to 0, per 1 mol of the 4,4′-dihydroxybicyclohexyl compound represented by the formula (3) as the raw material. 0.3 mol, more preferably 0.005 to 0.2 mol.

  The pressure is different between the step (i) and the step (ii). In the reaction solution of step (i), only one of the unreacted 4,4′-dihydroxybicyclohexyl compound and the two cyclohexane rings to which the hydroxyl group in the 4,4′-dihydroxybicyclohexyl compound is bonded. A reaction intermediate converted into a cyclohexene ring by intramolecular dehydration, the target bicyclohexyl-3,3′-diene compound, by-product water, a dehydration catalyst, and a reaction solvent coexist. In this step (i), by-product water is distilled, but at this time, it is not desirable to distill the reaction intermediate from the following points. That is, (1) the reaction intermediate can be converted into the target compound by further intramolecular dehydration, and thus distilling it causes a decrease in the yield of the target compound. (2) The reaction intermediate is generally Since it is a sublimable solid, when using a distillation column, the solid precipitates in the distillation path of by-product water, so that the distillation path is blocked and the pressure inside the reactor is increased, and the reaction vessel Cause troubles such as rupture, breakage, and splashing of the reaction solution. Therefore, in the step (i), the dehydration reaction is performed while distilling off by-product water under a pressure exceeding 20 Torr (2.67 kPa) so that the reaction intermediate is not distilled. The pressure is preferably higher than 20 Torr and lower than normal pressure (higher than 2.67 kPa and lower than 0.1 MPa), more preferably higher than 100 Torr and lower than normal pressure (higher than 13.3 kPa and lower than 0.1 MPa), more preferably higher than 200 Torr. Normal pressure or lower (higher than 26.7 kPa and 0.1 MPa or lower), and normal pressure is particularly preferable from the viewpoint of operability. The temperature (reaction temperature) in the step (i) is 130 to 200 ° C, preferably 140 to 195 ° C, more preferably 150 to 195 ° C. If the temperature is too high, side reactions occur and the yield decreases. If the temperature is too low, the reaction rate becomes slow. The reaction time is, for example, about 1 to 10 hours, preferably about 2 to 6 hours for a synthetic scale of about 3 L.

  On the other hand, in step (ii), the target bicyclohexyl-3,3'-diene compound is distilled from the reaction mixture after distilling by-product water. The reaction mixture obtained in step (i) may be directly used in step (ii), but if necessary, the reaction mixture may be appropriately extracted, washed, adjusted in liquidity, etc. You may use for process (ii) after giving a process. When the boiling point of the organic solvent used in the reaction is lower than the boiling point of the target bicyclohexyl-3,3′-diene compound, the organic solvent is usually distilled off and then bicyclohexyl-3,3′-diene. The compound is distilled off.

  In this step (ii), since the reaction intermediate is hardly present, problems such as clogging of the distillation path do not occur even when the pressure is lowered, and when the pressure is high, it takes time to distill the target compound. Operate at a pressure of 200 Torr (26.7 kPa) or less. The pressure in step (ii) is preferably lower than the pressure in step (i). For example, the difference between the pressure in step (i) and the pressure in step (ii) (the former-the latter) is, for example, 100 Torr or more (13.3 kPa or more), preferably 200 Torr or more (26.7 kPa or more), more preferably 500 Torr or more. (66.7 kPa or more). The pressure in step (ii) is preferably 3 to 200 Torr (0.40 to 26.7 kPa), more preferably 3 to 100 Torr (0.40 to 13.3 kPa), and still more preferably 3 to 20 Torr (0.40 to 0.40). 2.67 kPa). The temperature of process (ii) is 100-220 degreeC, Preferably it is 120-180 degreeC, More preferably, it is about 130-150 degreeC grade. If the temperature is too high, side reactions are liable to occur and the recovery rate of the bicyclohexyl-3,3′-diene compound decreases. On the other hand, if the temperature is too low, the distilling rate becomes slow.

  In order to distill a bicyclohexyl-3,3'-diene compound, etc., for example, when a distillation apparatus is attached to a reactor, etc., a distillation column, an Oldershaw type distillation apparatus, etc. are generally used as the distillation apparatus. Any distillation apparatus having a reflux ratio can be used without particular limitation.

  The bicyclohexyl-3,3′-diene compound distilled in step (ii) can be further purified as necessary. As a purification method, when a very small amount of water is contained, separation using a difference in specific gravity is possible, but purification by distillation is generally preferable.

  According to such a method, by-product water is produced under specific reaction conditions in the presence of a dehydration catalyst that dissolves the raw 4,4'-dihydroxybicyclohexyl compound in an organic solvent in a liquid state or reaction solution under the reaction conditions. After the reaction while distilling off, the produced bicyclohexyl-3,3'-diene compound is distilled off under specific conditions, so that the reaction can be carried out at a relatively low temperature and in a relatively short time. Can prevent side reactions such as conversion, and can prevent loss due to distillation of reaction intermediates and blockage due to sublimation, etc., so that high purity bicyclohexyl-3,3'-diene compound with low impurity content can be easily and high It can be efficiently obtained in a yield. That is, the content of the isomer of the bicyclohexyl-3,3′-diene compound represented by the formula (2) is determined by gas chromatography with respect to the sum of the bicyclohexyl-3,3′-diene compound and its isomer. An alicyclic diene compound having a peak area ratio of less than 20% (for example, 19.5% or less, preferably 15% or less) can be obtained.

  In addition, in the conventional method, for example, the method described in JP-A No. 2000-169399, a long reaction time is required. Therefore, a large amount of undesirable by-products are generated due to side reactions such as isomerization. By-product isomers have physical properties such as boiling point and solvent solubility that are close to those of the target compound, so that once produced, separation becomes extremely difficult. When such a cyclic olefin compound containing a large amount of by-products is epoxidized and used as a curable resin, a cured product having low physical properties such as heat resistance cannot be obtained during curing. Bicyclohexyl-3,3'-diene compounds and their isomers are very similar in physical properties such as boiling point, and therefore cannot be separated by a general gas chromatography apparatus. The yield and purity of the cyclohexyl-3,3'-diene compound are described in a higher manner. The analysis of the bicyclohexyl-3,3'-diene compound and its isomer is preferably carried out by gas chromatography using a capillary column having a high resolution.

The quantitative analysis of the bicyclohexyl-3,3′-diene compound and its isomer by gas chromatography can be carried out under the following measurement conditions. The structure of the bicyclohexyl-3,3′-diene compound and its isomer can be confirmed by, for example, NMR, GC-MS, GC-IR and the like.
Measuring device: HP6890 (manufactured by Hewlett-Packard Company)
Column: HP-5, length 60m, inner diameter 0.32mm
Liquid phase 5% -diphenyl-95% -dimethylpolysiloxane Carrier gas: Nitrogen Carrier gas flow rate: 2.6 ml / min Detector: FID
Inlet temperature: 250 ° C
Detector temperature: 250 ° C
Temperature rise pattern (column): Hold at 60 ° C. for 5 minutes, temperature rise to 300 ° C. at 10 ° C./minute Split ratio: 100
Sample: 1 μl

  The epoxidation method of the bicyclohexyl-3,3′-diene compound is not particularly limited. For example, a method using an organic percarboxylic acid as an oxidizing agent (epoxidizing agent), a hydroperoxide such as t-butyl hydroperoxide, and the like. Although any method using a metal compound such as a molybdenum compound may be used, a method using an organic percarboxylic acid is preferable from the viewpoint of safety, economy, yield, and the like. Hereinafter, this method will be described.

  As the organic percarboxylic acid, for example, performic acid, peracetic acid, perbenzoic acid, perisobutyric acid, trifluoroperacetic acid and the like can be used. Among organic percarboxylic acids, peracetic acid is a preferred epoxidizing agent because of its high reactivity and high stability. Among them, the use of an organic percarboxylic acid substantially free of water, specifically, having a water content of 0.8% by weight or less, preferably 0.6% by weight or less has a high epoxidation rate. This is preferable in that a compound is obtained. The organic percarboxylic acid substantially free of water is produced by air oxidation of aldehydes, for example, acetaldehyde. For example, peracetic acid is disclosed in German Patent Publication No. 1418465 and JP-A 54-30006. Manufactured by the described method. According to this method, it is possible to synthesize organic percarboxylic acid in a large amount continuously, compared with the case where organic percarboxylic acid is synthesized from hydrogen peroxide and extracted with a solvent to produce organic percarboxylic acid. Therefore, it can be obtained substantially inexpensively.

  The amount of the epoxidizing agent is not strictly limited, and the optimum amount in each case depends on the individual epoxidizing agent used, the reactivity of the bicyclohexyl-3,3'-diene compound, and the like. The amount of the epoxidizing agent is, for example, about 1.0 to 3.0 mol, preferably about 1.05 to 1.5 mol with respect to 1 mol of the unsaturated group. From the viewpoint of economy and side reaction, it is usually disadvantageous to exceed 3.0 times mol.

  The epoxidation reaction is carried out by adjusting the presence or absence of a solvent and the reaction temperature according to the apparatus and the physical properties of the raw material. As the solvent, it can be used for the purpose of lowering the viscosity of the raw material, stabilizing by diluting the epoxidizing agent, and in the case of peracetic acid, esters, aromatic compounds, ethers and the like can be used. Particularly preferred solvents are ethyl acetate, hexane, cyclohexane, toluene, benzene and the like, and ethyl acetate is particularly preferred. The reaction temperature is determined by the reactivity of the epoxidizing agent used and the bicyclohexyl-3,3'-diene compound. For example, the reaction temperature when peracetic acid is used is preferably 20 to 70 ° C. If it is less than 20 ° C., the reaction is slow, and if it exceeds 70 ° C., peracetic acid decomposes with heat generation, which is not preferable.

  No special operation is required for the crude liquid obtained by the reaction. For example, the crude liquid may be aged by stirring for 1 to 5 hours. Isolation of the epoxy compound from the obtained crude liquid is an appropriate method, such as a method of precipitating with a poor solvent, a method of pouring the epoxy compound into hot water with stirring and distilling off the solvent, a method of directly removing the solvent, It can be carried out by a method such as isolation by distillation purification.

  Thus, the isomer content (isomer ratio) of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound represented by the formula (1) is represented by the formula (1) 3. , 4,3 ', 4'-diepoxybicyclohexyl compound and its isomers, the peak area ratio by gas chromatography is 20% or less (preferably 18% or less, more preferably 16% or less) An alicyclic diepoxy compound can be obtained.

[Bifunctional or higher epoxy resin (A2)]
In the present invention, the bifunctional or higher functional epoxy resin (A2) [simply referred to as “epoxy resin (A2)”] is a compound having two or more epoxy groups in the molecule, A compound other than the formula diepoxy compound (A1) [or (A1 ′)] is meant. By combining the alicyclic diepoxy compound (A1) or (A1 ′) and the epoxy resin (A2), the strength of the cured product can be improved.

（Ｙは、２価の炭化水素基、カルボニル基、エーテル結合、エステル結合、アミド結合、又はこれらが２以上結合した２価の基を示す。式中に示されるシクロヘキサン環にはアルキル基が結合していてもよい）
で表される化合物が挙げられる。 As the epoxy resin (A2), an alicyclic epoxy resin is preferable. The epoxy group in the alicyclic epoxy resin is not particularly limited, but an alicyclic epoxy group formed by including two carbon atoms constituting the cycloaliphatic skeleton is preferable. As an alicyclic epoxy resin having two or more alicyclic epoxy groups, the following formula (4)

(Y represents a divalent hydrocarbon group, a carbonyl group, an ether bond, an ester bond, an amide bond, or a divalent group in which two or more of these are bonded. An alkyl group is bonded to the cyclohexane ring shown in the formula. May be)
The compound represented by these is mentioned.

  Examples of the divalent hydrocarbon group for Y include linear or branched alkylene groups having 1 to 18 carbon atoms (particularly 1 to 10) such as methylene, ethylene, propylene, trimethylene, tetramethylene, and hexamethylene groups; 1,2-cyclopentylene, 1,3-cyclopentylene, cyclopentylidene, 1,2-cyclohexylene, 1,3-cyclohexylene, 1,4-cyclohexylene, cyclohexylidene groups, etc. And divalent alicyclic hydrocarbon groups such as divalent cycloalkylene groups (including cycloalkylidene groups).

  In the formula (4), examples of the alkyl group that may be bonded to the cyclohexane ring shown in the formula include carbon numbers such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and a t-butyl group. Examples thereof include 1 to 6 linear or branched alkyl groups. Among these, a methyl group is particularly preferable. The number of alkyl groups bonded to each cyclohexane ring is about 0 to 3.

  The following compound is illustrated as a typical example of the alicyclic epoxy resin represented by Formula (4).

  Said m is an integer of 1-30.

  In addition to the above, the epoxy resin (A2) includes two carbons having a cycloaliphatic skeleton and two or more epoxy groups in the molecule, and only one of the two or more epoxy groups constitutes the cycloaliphatic skeleton. An alicyclic epoxy resin formed with an atom (an alicyclic epoxy resin having only one alicyclic epoxy group) or an epoxy group that does not contain a carbon atom constituting a cyclic aliphatic skeleton An alicyclic epoxy resin (an alicyclic epoxy resin having no alicyclic epoxy group, for example, a glycidyl ether compound having a cyclic aliphatic skeleton) or the like can also be used. Specific examples of such alicyclic epoxy resins include the following compounds. Further, as the epoxy resin (A2), an epoxy resin having an aromatic ring and two or more epoxy groups in the molecule, or an epoxy resin having two or more epoxy groups having no cyclic aliphatic skeleton or aromatic ring in the molecule is used. You can also.

  Among the epoxy resins (A2), low-viscosity compounds, for example, alicyclic epoxy resins such as low-viscosity cycloalkylene glycol diglycidyl ether having a viscosity at 25 ° C. of 100 mPa · s or less, serve as reactive diluents. Can also bear. Examples of such alicyclic epoxy resins include cyclohexanedimethanol diglycidyl ether, cyclohexanediol diglycidyl ether, and hydrogenated bisphenol A type epoxy resin. In addition, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, liquid bisphenol A type, F type glycidyl type epoxy resins, glycidyl amine type epoxy resins, etc. are used as reactive diluents. You can also. When a reactive diluent other than the alicyclic epoxy resin is used, the amount of the reactive diluent blended is alicyclic epoxy resin [alicyclic diepoxy compound (A1) or (A1 ′) and other alicyclic type. Total amount of epoxy resin] is 20 parts by weight or less, preferably 15 parts by weight or less with respect to 100 parts by weight. When the amount of the reactive diluent exceeds 20 parts by weight, it is difficult to obtain desired performance.

  In the present invention, the epoxy resin (A2) is preferably a liquid epoxy compound from the viewpoint of improving workability at the time of preparation and casting. In addition, liquid means that it is liquid at normal temperature (25 degreeC). However, even if it is a solid epoxy compound as a simple substance, it can be used as long as the viscosity of the transparent sealing material (composition) after blending each component is 40000 mPa · s or less at 25 ° C. Is possible. The same applies to epoxy compounds other than alicyclic epoxy resins. Examples of usable solid epoxy compounds include solid bisphenol-type epoxy compounds (bisphenol A-type epoxy resins, etc.), novolac-type epoxy compounds, glycidyl esters, triglycidyl isocyanurate, EHPE-3150 [Daicel Chemical Industries ( And epoxidized cyclohexane polyether manufactured by Co., Ltd.]. These solid epoxy compounds may be used alone or in combination of two or more. The solid epoxy compound is preferably a compound not containing an aromatic ring, but may be one having an aromatic ring. The compounding amount of the solid epoxy compound is an amount that does not exceed 40,000 mPa · s at 25 ° C., for example, as the viscosity of the transparent sealing material (composition).

  As commercial products of liquid epoxy compounds, trade names “CEL-2021P”, “CEL-3000”, “CEL-2081” [manufactured by Daicel Chemical Industries, Ltd.], trade names “YX-8000”, “YX -8034 "[manufactured by Japan Epoxy Resin Co., Ltd.], trade names" ST3000 "," YD-128 "[manufactured by Toto Kasei Co., Ltd.], trade names" HBE-100 "," DME-100 " New Nippon Rika Co., Ltd.], epoxidized soybean oil, epoxidized linseed oil and the like. Moreover, as a commercial item of a solid epoxy compound, in addition to the above-mentioned trade name “EHPE-3150”, trade name “YL7170” [manufactured by Japan Epoxy Resin Co., Ltd.], trade name “TEPIC” [manufactured by Nissan Chemical Industries, Ltd.] There is a trade name “ST4000” [manufactured by Toto Kasei Co., Ltd.].

  In the first and third transparent encapsulating materials of the present invention, the ratio of the alicyclic diepoxy compound (A1) to the total amount of the alicyclic diepoxy compound (A1) and the epoxy resin (A2) is 95 to 40% by weight. Preferably, it is 90 to 45% by weight. In the second and fourth transparent encapsulating materials of the present invention, the ratio of the alicyclic diepoxy compound (A1 ′) to the total amount of the alicyclic diepoxy compound (A1 ′) and the epoxy resin (A2) is 95 -40% by weight, preferably 90-45% by weight. If the ratio of the alicyclic diepoxy compound (A1) or (A1 ′) is too small, the heat resistance of the cured product tends to decrease or the dimensional change tends to be large, and conversely if too large, the strength of the cured product tends to decrease.

[Polyol (B)]
In the transparent sealing material of the present invention, various polyols can be blended in order to increase the mechanical strength of the cured product. The above epoxy resin [alicyclic diepoxy compound (A1) or (A1 ′), epoxy resin (A2)] and polyol (B) form a copolymer (cured product) by cationic polymerization. In the present invention, toughness and the like can be improved by adding a polyol component to an epoxy resin having characteristics such as high hardness, adhesion, water resistance, and solvent resistance. A polyol (B) can be used individually or in combination of 2 or more types.

  The number average molecular weight of the polyol (B) is preferably 400 or more (for example, 400 to 30000), more preferably 450 to 25000, still more preferably 500 to 23000, and particularly preferably 600 to 20000. When the number average molecular weight of the polyol (B) is less than 400, the amount of the hydroxyl group of the polyol (B) with respect to the epoxy group of the epoxy resin is relatively large, so that the molecular chain of the molecular chain is formed by cationic polymerization of the cured product. The length is shortened, and the solvent resistance and mechanical strength are likely to decrease. When the number average molecular weight is too large, the miscibility of the epoxy resin and the polyol (B) may be lowered.

  The polyol (B) is not particularly limited, but is preferably liquid at 25 ° C. When the polyol (B) is in a solid state (such as wax), the miscibility with the epoxy resin is poor and the effect of adding the polyol may be reduced. That is, the copolymer composition is biased, and water resistance and solvent resistance may be reduced, or toughness and bending resistance may be locally reduced.

  Examples of the polyol (B) include polyester polyol (B1), polyether polyol (B2), polycarbonate polyol (B3), and polyol (B4) having a main chain composed of carbon-carbon bonds. In these polyols, the molecule may contain two or more of an ester bond, an ether bond and a carbonate bond.

  When the polyol (B) is a polyester polyol (B1), the polyester polyol (B1) is composed of a polyol component and a carboxylic acid component, and is a dehydration esterification reaction, a transesterification reaction, a lactone ring-opening polymerization, or a combination thereof. Can be synthesized. Examples of the polyol component include ethylene glycol, diethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,3-butanediol, 2,3-butanediol, 1,5-pentanediol, 3 -Methyl-1,5-pentanediol, 1,6-hexanediol, 2,6-hexanediol, 1,4-cyclohexanedimethanol, 1,12-dodecanediol, polybutadienediol, neopentyl glycol, tetramethylene glycol, Propylene glycol, dipropylene glycol, glycerin, trimethylolpropane, 1,3-dihydroxyacetone, hexylene glycol, 1,2,6-hexanetriol, ditrimethylolpropane, pentaerythritol, the polyether polyol described below All, such as polycarbonate polyols, and the like.

  As the carboxylic acid component, oxalic acid, adipic acid, sebacic acid, fumaric acid, malonic acid, succinic acid, glutaric acid, azelaic acid, citric acid, 2,6-naphthalenedicarboxylic acid, phthalic acid, isophthalic acid, terephthalic acid, Citralaconic acid, 1,10-decanedicarboxylic acid, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, pyromellitic anhydride, trimellitic anhydride, lactic acid, malic acid Glycolic acid, dimethylolpropionic acid, dimethylolbutanoic acid and the like. Examples of lactones include ε-caprolactone, δ-valerolactone, and γ-butyrolactone.

  Among these, as the polyester polyol (B1), polycaprolactone polyol is particularly preferable. Examples of the polycaprolactone polyol include ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, methylpentanediol, 2, 4-diethylpentanediol, neopentyl glycol, 2-ethyl-1,3-hexanediol, trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, ethylene oxide or propylene oxide adduct of bisphenol A, glycerin, etc. Examples include polycaprolactone polyols obtained by ring-opening addition polymerization of ε-caprolactone in the presence of a known polyhydric alcohol. Among them, particularly preferred are polycaprolactone polyols obtained by ring-opening addition polymerization of ε-caprolactone to trimethylolpropane, and polycaprolactone polyols obtained by ring-opening addition polymerization of ε-caprolactone to pentaerythritol. These can be used alone or in admixture of two or more.

  The number of hydroxyl groups per molecule of the polyester polyol (B1) is preferably 2 or more, more preferably 3 or more from the viewpoint of achieving both toughness, flex resistance, water resistance, and solvent resistance. From the same viewpoint, the molecular weight is preferably 400 or more and 3000 or less, more preferably 600 or more and 2000 or less.

  Examples of the polyester polyol (B1) include, for example, Placel Cell series manufactured by Daicel Chemical Industries, Ltd., “PLAXEL 205, 205H, 205U, 205BA, 208, 210, 210CP, 210BA, 212, 212CP, 220, 220CPB, 220NP1, 220BA, 220ED, 220EB, 220EC, 230, 230CP, 240, 240CP, 210N, 220N, L205AL, L208AL, L212AL, L220AL, L230AL, 220ED, 220EB, 220EC, 205BA, 210BA, 220BA, 303, 305, 308, 312, L312AL, 320, L320AL, L330AL, 410, 410D, 610, P3403, CDE9P, E227, DC2009, DC2016 DC2209 ", is available as a commercial product such as (manufactured by Kuraray Co., Ltd.) of" Kurapol ".

  When the polyol (B) in the present invention is a polyether polyol (B2), examples of the polyether polyol (B2) include polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and copolymers thereof. These are produced by ring-opening polymerization of cyclic ethers such as ethylene oxide, propylene oxide and tetrahydrofuran.

  The number of hydroxyl groups per molecule of the polyether polyol (B2) is preferably 2 or more, more preferably 3 or more from the viewpoint of achieving both toughness, flex resistance, water resistance, and solvent resistance. The molecular weight is preferably 400 or more and 3000 or less, more preferably 600 or more and 2000 or less from the same viewpoint.

  As the polyether polyol (B2), “P-400, P-700, P-1000, P-2000, P-3000, G-300, G-400, G-700, manufactured by Asahi Denka Kogyo Co., Ltd., G-1500, G-3000, G-4000, EDP-450, EDP-550, DG-500, DG-575, SP-600, SP-690SC-800, SC-1000, SC-1001, quadrol ", Japan Polyethylene glycol “PEG # 200, 400, 600, 1000, 1500, 2000, 4000, 6000” manufactured by Yushi Co., Ltd., Bisol “2EN-6, 4EN, 10EN, 2P, 2PN” manufactured by Toho Chemical Industry Co., Ltd. 3PN "," Poly-G 420P, 720PG, 720P, 2020P, 3020P, 630P "manufactured by Asahi Glass Co., Ltd. 1030PG, 1530PG, 2530PG, 3030PG, 4030PG, 5030PG, 210PG, 212PG, 448PG, 412PG, 439PG, 216PG, X-213, X-301, X-302, X-303, 400P, 415P, 419P, 423P, 443P 427P, 441P, 442P, 610PG, 357SA, 465SA, 480SA, 530SA, X-71-531, X-71-532, 375S, RF31, RF-64, RF-66 ", manufactured by Sanyo Chemical Industries “PEG200, PEG300, PEG400, PEG600, PEG1000, PEG1500, PEG1540, PEG2000, PEG4000S, PEG4000N, PEG6000S, PEG6000P”, “Sannicks GP- 200, GE-250, TP-700, TE-700, EP-400, HE-400, HE-560, HE-600, RA-530, RX-401, RX-300, RX-403, RX-500, HR-460A "," Sannik Triol GP-250, GP-400, GP-600, GP-1000, TP-400 "," Sanix Polyol RP-410A, HR-450P, HS-209 "," Sannix "Hexatriol SP-750" and the like are commercially available.

  When the polyol (B) is a polycarbonate polyol (B3), the polycarbonate polyol (B3) uses a phosgene method, or a dialkyl carbonate such as dimethyl carbonate or diethyl carbonate, or diphenyl carbonate in the same manner as the method for producing a normal polycarbonate polyol. This is synthesized by a carbonate exchange reaction (JP-A-62-187725, JP-A-2-175721, JP-A-2-49025, JP-A-3-220233, JP-A-3-252420, etc.).

  Examples of the polyol used in the carbonate exchange reaction together with dialkyl carbonate and the like include 1,6-hexanediol, ethylene glycol, diethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,3-butanediol, 2,3 -Butanediol, 1,5-pentanediol, 3-methyl-1,5-pentanediol, 1,4-cyclohexanedimethanol, 1,12-dodecanediol, polybutadienediol, neopentyl glycol, tetramethylene glycol, propylene glycol , Dipropylene glycol, glycerin, trimethylolpropane, 1,3-dihydroxyacetone, hexylene glycol, 1,2,6-hexanetriol, ditrimethylolpropane, trimethylolethane, Trimethyloloctane, pentaerythritol, esters glycol [manufactured by Mitsubishi Gas Chemical Co., polyester polyols described above, such as polyether polyols.

  Examples of the polycarbonate polyol (B3) include “Placcel CD205, CD205PL, CD205HL, CD210, CD210PL, CD210HL, CD220, CD220PL, CD220HL, CD220EC, CD221T” manufactured by Daicel Chemical Industries, Ltd., Ube Industries, Ltd. "UH-CARB50, UH-CARB100, UH-CARB300, UH-CARB90 (1/3), UH-CARB90 (1/1), UC-CARB100" manufactured by Asahi Kasei Chemicals Corporation "PCDL T4671, T4672 , T5650J, T5651 and T5652 "are commercially available.

  Among the above, the polycarbonate polyol (B3) is represented by a 1,6-hexanediol component and a chemical formula HO—X—OH from the viewpoints of toughness, flexibility, compatibility with epoxy resin, production cost, and the like. Oligomers composed of other diol components and carbonate components are particularly preferred. In the above case, the molar ratio of the 1,6-hexanediol component to the other diol component is preferably 9: 1 to 1: 9, and more preferably 8: 2 to 2: 8. X represents a divalent organic group. The number of carbon atoms in X is, for example, 2 to 14, and may contain oxygen, nitrogen, and sulfur atoms, and may be linear or branched. Furthermore, it may have 1 to 3 cyclic structures, and may contain oxygen, nitrogen, and sulfur atoms in the ring. Among them, X is preferably a C 2-14 divalent hydrocarbon group (particularly an alkylene group, a cycloalkylene group or a group in which these are bonded), in which an oxygen atom may be interposed. The number average molecular weight is preferably 400 to 3000.

  When the polyol (B) is a polyol (B4) having a main chain composed of carbon-carbon bonds, the polyol (B4) has 60% or more of the main chain (however, excluding terminal groups) being carbon atoms. Preferably, 65% or more are carbon atoms, and more preferably, the main chain is composed of only carbon atoms. Preferred examples of the polyol (B4) include saturated or unsaturated linear or branched polyols having 25 to 700 carbon atoms from the viewpoint of molecular weight control. The position of the hydroxyl group is not particularly limited at the end of the main chain and the side chain. Of these, polydiene polyols or polyolefin polyols are preferred as those having hydroxyl groups at both ends of the molecular chain.

  Examples of polydiene polyols having hydroxyl groups at both ends of the molecular chain include polybutadiene and polyisoprene having hydroxyl groups at both ends of the molecular chain, or hydroxyl groups at both ends of the molecular chain, and one of the double bonds of the main chain. A polydiene-based polyol (for example, polybutadiene) whose part is epoxidized is preferable.

  Examples of the polyolefin-based polyol having hydroxyl groups at both ends of the molecular chain include polyethylene and polypropylene having hydroxyl groups at both ends of the molecular chain. Preferably, the polydiene having hydroxyl groups at both ends of the molecular chain described above. What was manufactured by hydrogenating a system polyol is preferable. For example, hydrogenated polybutadiene or polyisoprene having hydroxyl groups at both ends of the molecular chain is preferable.

  As the polyol (B4), in addition to the above, an acrylic polymer obtained by polymerizing a monomer component containing at least a hydroxyl group-containing acrylic monomer such as hydroxyethyl (meth) acrylate [particularly, at least a hydroxyl group-containing acrylic An acrylic polymer obtained by copolymerizing a monomer component containing a monomer and a (meth) acrylic acid alkyl ester], a vinyl ether oligomer having hydroxyl groups at both ends, and the like are also preferable.

  Examples of the polyol (B4) include “Epolide PB3600”, “Cell Top D446” (all manufactured by Daicel Chemical Industries, Ltd.), “TOE-2000H” (manufactured by Kyowa Hakko Chemical Co., Ltd.), and “Poly bd R”. -45HT "," Poly bd R-15HT "," Poly ip "," Epol "(all manufactured by Idemitsu Kosan Co., Ltd.)," Kuraray polyol "(manufactured by Kuraray Co., Ltd.), etc. are commercially available. is there.

  In the fifth and seventh transparent encapsulating materials of the present invention, the blending amount of the polyol (B) is the bifunctional or higher functional epoxy resin (A) containing at least the alicyclic diepoxy compound (A1) and the polyol (B). When the total amount is 100% by weight, it is 5 to 60% by weight, preferably 7 to 45% by weight. In the sixth and eighth transparent encapsulating materials of the present invention, the blending amount of the polyol (B) is a bifunctional or higher functional epoxy resin (A ′) containing at least the alicyclic diepoxy compound (A1 ′) and the polyol (B ) Is 100 to 60% by weight, 5 to 60% by weight, preferably 7 to 45% by weight. If the blending amount of the polyol (B) is too small, the strength of the cured product tends to decrease, and conversely if too large, the heat resistance tends to decrease.

  In the fifth and seventh transparent encapsulating materials of the present invention, the content of the alicyclic diepoxy compound (A1) in the bifunctional or higher functional epoxy resin (A) containing at least the alicyclic diepoxy compound (A1). Is, for example, 5% by weight or more, preferably 10% by weight or more, more preferably 20% by weight or more, and further preferably 40% by weight or more (particularly 45% by weight or more). The upper limit of the content of the alicyclic diepoxy compound (A1) is, for example, 100% by weight, preferably 95% by weight, and more preferably 90% by weight. In the sixth and eighth transparent encapsulating materials of the present invention, the alicyclic diepoxy compound (A1 ′) in the bifunctional or higher functional epoxy resin (A ′) containing at least the alicyclic diepoxy compound (A1 ′). The content of is, for example, 5% by weight or more, preferably 10% by weight or more, more preferably 20% by weight or more, and further preferably 40% by weight or more (particularly 45% by weight or more). The upper limit of the content of the alicyclic diepoxy compound (A1 ′) is, for example, 100% by weight, preferably 95% by weight, and more preferably 90% by weight.

[Curing agent]
In the present invention, an acid anhydride is preferably used as the curing agent. The acid anhydride used as the curing agent can be arbitrarily selected from those generally used as a curing agent for epoxy resins. The acid anhydride is preferably liquid at room temperature. Specific examples include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, dodecenyl succinic anhydride, methylendomethylenetetrahydrophthalic anhydride, and the like. In addition, acid anhydrides that are solid at room temperature, for example, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylcyclohexene dicarboxylic acid anhydride, as long as the impregnation property of the transparent sealing material of the present invention is not adversely affected. Etc. can be used. When an acid anhydride that is solid at room temperature is used, it is preferably dissolved in a liquid acid anhydride at room temperature and used as a liquid mixture at room temperature.

  The acid anhydride has one or two aliphatic or aromatic rings in the molecule and one or two acid anhydride groups, and has 4 to 25 carbon atoms, preferably 8 to 20 carbon atoms. About one acid anhydride is preferred.

  The blending amount of the curing agent is 50 to 150 parts by weight, preferably 100 parts by weight of the total amount of the alicyclic diepoxy compound (A1) and the epoxy resin (A2) in the first transparent sealing material of the present invention. Is 52 to 145 parts by weight, more preferably 55 to 140 parts by weight. In the second sealing material, the total amount of the alicyclic diepoxy compound (A1 ′) and the epoxy resin (A2) is 100 parts by weight. 50 to 150 parts by weight, preferably 52 to 145 parts by weight, more preferably 55 to 140 parts by weight. In the fifth transparent sealing material, the total amount of the epoxy resin (A) and the polyol (B) is 100 weights. 50 to 150 parts by weight, preferably 52 to 145 parts by weight, more preferably 55 to 140 parts by weight, and in the sixth transparent sealing material, the epoxy resin (A ′) and Based on 100 parts by weight of the polyol (B), 50 to 150 parts by weight, preferably 52 to 145 parts by weight, more preferably 55 to 140 parts by weight. Further, the curing agent is an effective amount capable of exhibiting the effect as a curing agent, that is, usually an alicyclic epoxy resin having two or more functions [alicyclic diepoxy resin (A1) or (A1 ′), and epoxy resin ( A2)] is preferably used at a rate such that the acid anhydride equivalent of 0.5 to 1.5 per equivalent of epoxy group.

  When the amount of the curing agent used is too small, the curing rate of the transparent sealing material (epoxy resin composition) becomes slow, the glass transition temperature of the cured product may be lowered, or coloring may be increased. On the other hand, when the amount of the curing agent used is too large, the moisture resistance may decrease.

  Commercially available curing agents include trade names “MH-700”, “HNA-100” [above, manufactured by Shin Nippon Rika Co., Ltd.], trade names “HN-5500E”, “HN-7000” [above, Hitachi. Kasei Kogyo Co., Ltd.], glutaric anhydride (Japan Epoxy Resin Co., Ltd.), succinic anhydride and the like.

[Curing accelerator]
In the present invention, a curing accelerator may be used together with the curing agent. The curing accelerator is a compound having a function of accelerating a curing reaction when the epoxy compound is cured with an acid anhydride. The curing accelerator is not particularly limited as long as it is generally used, but diazabicycloundecene-based curing accelerators (diazabicycloalkenes), phosphoric acid esters, phosphines, and other phosphorus-based curing accelerators, Examples include amine-based curing accelerators such as tertiary amines or quaternary ammonium salts.

  Examples of the diazabicycloundecene-based curing accelerator include 1,8-diazabicyclo [5.4.0] undecene-7 (DBU) and salts thereof. In particular, 1,8-diazabicyclo [ 5.4.0] Organic acid salts such as octylate, sulfonate, orthophthalate, and coalate of undecene-7 are preferred. Specific examples of the other curing accelerator include tertiary amines such as benzyldimethylamine and 2,4,6-tris (dimethylaminomethyl) phenol, 2-ethyl-4-methylimidazole, 1 -Phosphorus compounds (phosphonium salts, etc.) that do not contain aromatics such as imidazoles such as cyanoethyl-2-ethyl-4-methylimidazole, tetra-n-butylphosphonium-O, O-diethyl phosphorodithioate, and tertiary amines Known compounds such as salts, metal salts such as quaternary ammonium salts and tin octylate can be exemplified. Furthermore, a metal organic acid salt can be used in combination with the organic acid salt of the diazabicycloalkenes. Examples of the metal organic acid salt include tin octylate, zinc octylate, tin naphthenate, and zinc naphthenate.

  The curing accelerator is preferably a diazabicycloundecene-based curing accelerator, which may be used alone, or other epoxy resin curing accelerators up to 50% by weight, such as phosphate esters, Mixtures with phosphines, tertiary or quaternary amines may also be used. The diazabicycloundecene-based curing accelerator preferably accounts for at least 50% by weight of the total amount of the curing accelerator. If the ratio of the diazabicycloundecene-based curing accelerator is less than 50% by weight, the hue of the cured product may be deteriorated. In order to maintain a good hue, it is particularly preferably 70% by weight or more.

  In the first transparent encapsulating material of the present invention, the curing accelerator is added in an amount of 0.05 to 3 with respect to 100 parts by weight of the total amount of the alicyclic diepoxy compound (A1) and the epoxy resin (A2). 0 part by weight, preferably 0.1 to 3.0 part by weight, more preferably 0.15 to 2.5 part by weight. In the second sealing material, the alicyclic diepoxy compound (A1 ′) and 0.05 to 3.0 parts by weight, preferably 0.1 to 3.0 parts by weight, more preferably 0.15 to 2.5 parts by weight with respect to 100 parts by weight of the total amount of the epoxy resin (A2). In the fifth transparent sealing material, 0.05 to 3.0 parts by weight, preferably 0.1 to 3.0 parts by weight with respect to 100 parts by weight of the total amount of the epoxy resin (A) and the polyol (B). Part, more preferably 0.15 to 2.5 parts by weight, and a sixth transparent sealing material In this case, 0.05 to 3.0 parts by weight, preferably 0.1 to 3.0 parts by weight, and more preferably 0 to 100 parts by weight of the total amount of the epoxy resin (A ′) and the polyol (B). 15 to 2.5 parts by weight. If the blending amount of the curing accelerator is too small, the curing accelerating effect is insufficient, and conversely if too large, the hue in the cured product tends to deteriorate.

[Thermal cationic polymerization initiator]
The thermal cationic polymerization initiator used in the present invention is a component that releases a substance that initiates cationic polymerization by heating, and functions as a curing catalyst.

  Examples of the thermal cationic polymerization initiator include aryldiazonium salts [for example, PP-33 [manufactured by Asahi Denka Kogyo Co., Ltd.]], aryliodonium salts, arylsulfonium salts [for example, FC-509, FC-520 [or more, Manufactured by 3M Co., Ltd.], UVE1014 [G. E. Manufactured by Co., Ltd.], CP-66, CP-77 [above, manufactured by Asahi Denka Kogyo Co., Ltd.], SI-60L, SI-80L, SI-100L, SI-110L [above, Sanshin Chemical Industry Co., Ltd. Manufactured]], allene-ion complex [for example, CG-24-61 [manufactured by Ciba Geigy Co., Ltd.]] and the like. Furthermore, the system of the chelate compound of metals, such as aluminum and titanium, and an acetoacetate ester or diketones, and silanol or phenols is also included. Examples of the chelate compound include aluminum trisacetylacetonate and aluminum trisacetoacetate ethyl. Examples of silanols or phenols include compounds having silanols such as triphenylsilanol and compounds having acidic hydroxyl groups such as bisphenol S.

  In the third transparent encapsulating material of the present invention, the compounding amount of the thermal cationic polymerization initiator is 0.01 to 100 parts by weight with respect to 100 parts by weight of the total amount of the alicyclic diepoxy compound (A1) and the epoxy resin (A2). 12 parts by weight, preferably 0.05 to 10 parts by weight, more preferably 0.1 to 10 parts by weight. In the fourth sealing material, the alicyclic diepoxy compound (A1 ′) and the epoxy resin (A2) are used. ) To 100 parts by weight of the total amount of 0.01) to 12 parts by weight, preferably 0.05 to 10 parts by weight, more preferably 0.1 to 10 parts by weight. In the seventh transparent sealing material, The total amount of the epoxy resin (A) and the polyol (B) is 100 to 12 parts by weight, preferably 0.05 to 10 parts by weight, more preferably 0.1 to 10 parts by weight. In the eighth transparent sealing material , 0.01 to 12 parts by weight, preferably 0.05 to 10 parts by weight, more preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of the total amount of the epoxy resin (A ′) and the polyol (B). is there. By mix | blending in this range, favorable hardened | cured material, such as heat resistance, transparency, a weather resistance, can be obtained. If the amount of the thermal cationic polymerization initiator is too small, the curability tends to be insufficient, while if too large, the physical properties of the cured product may be lowered.

[Various additives]
In the transparent sealing material of the present invention, the reaction can be allowed to proceed slowly by adding a compound having a hydroxyl group (including a low molecular weight polyol having a number average molecular weight of less than 400) as necessary. Examples of the compound having a hydroxyl group include ethylene glycol, diethylene glycol, and glycerin.

  In addition, various conventional additives can be blended with the transparent sealing material of the present invention within a range that does not adversely affect the viscosity, transparency, and the like. Examples of such additives include silicone-based and fluorine-based antifoaming agents, silane coupling agents such as γ-glycidoxypropyltrimethoxysilane, fillers, flame retardants, colorants, antioxidants (phenols). System, phosphorus system, sulfur system antioxidant, etc.), UV absorber, phosphor, ion adsorbent, dye, pigment, stress reducing agent, flexibility imparting agent, mold release agent, waxes, halogen trapping agent, Leveling agents, wetting improvers and the like can be mentioned. The amount of each of these various additives is 5% or less based on the weight of the transparent sealing material. In addition, oxetane; vinyl ether; thermosetting resin; thermoplastic resin such as acrylic resin having functional group that reacts with carboxylic acid or epoxy group such as hydroxyl group, epoxy group, carboxyl group; synthetic rubber or elastomer; organic or inorganic nano You may mix | blend particle | grains.

[Manufacture of transparent sealing material]
The transparent sealing material of this invention is prepared by stirring and mixing the said alicyclic diepoxy compound and said each component with a mixer etc. like a blender. Although the temperature at the time of stirring and mixing changes also with the kind of hardening | curing agent to mix | blend, the kind of hardening catalyst, etc., it is usually preferable to set to about 10-60 degreeC. If the set temperature at the time of preparation is less than 10 ° C., the viscosity may be too high and uniform stirring and mixing operations may be difficult. Conversely, if the temperature at the time of preparation is too high, a curing reaction will occur and normal epoxy will be used. Since a resin composition may not be obtained, it is not preferable. When stirring and mixing, use a general-purpose device such as a single-screw or multi-screw extruder, kneader, or dissolver equipped with a decompression device. For example, it is prepared by stirring and mixing for about 10 to 30 minutes. Also good.

[Transparent encapsulant]
The transparent sealing material of the present invention can be obtained by curing the transparent sealing material of the present invention. Heat or the like can be used as a curing means. The curing temperature when thermosetting using a thermal cationic polymerization initiator is, for example, 30 to 240 ° C, preferably 35 to 200 ° C. Curing may be performed in two or more stages. For example, when thermosetting using a thermal cationic polymerization initiator, after first curing at a temperature of 30 to 100 ° C (preferably 30 to 80 ° C), 110 to 240 ° C (preferably 120 to 200 ° C). A cured product having good physical properties such as transparency and heat resistance can be obtained by secondarily curing at a temperature of 2 ° C.

  The curing temperature at the time of curing using a curing agent such as an acid anhydride is, for example, 30 to 240 ° C., preferably 50 to 200 ° C. Curing may be performed in two or more stages. For example, after primary curing at a temperature of 30 to 130 ° C. (preferably 50 to 130 ° C.) and then secondary curing at a temperature of 135 to 240 ° C. (preferably 135 to 200 ° C.), transparency and heat resistance are achieved. A cured product having good physical properties such as the above can be obtained.

  The transparent encapsulating material and the transparent encapsulated material of the present invention are useful particularly in the field of LED encapsulation and the like because they have a good balance of heat resistance, toughness, transparency, and hue.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto.

[Measurement method and evaluation method of physical properties]
(1) Gas chromatography (GC analysis) of bicyclohexyl-3,3'-diene and its isomers
Measuring device: HP6890 (manufactured by Hewlett-Packard Company)
Column: HP-5, length 60m, inner diameter 0.32mm
Liquid phase 5% -diphenyl-95% -dimethylpolysiloxane Carrier gas: Nitrogen Carrier gas flow rate: 2.6 ml / min Detector: FID
Inlet temperature: 250 ° C
Detector temperature: 250 ° C
Temperature rise pattern (column): Hold at 60 ° C. for 5 minutes, temperature rise to 300 ° C. at 10 ° C./minute Split ratio: 100
Sample: 1 μl
The ratio of bicyclohexyl-3,3'-diene and its isomer was determined as follows. That is, the GC analysis was performed under the above conditions, and the area of the maximum peak (bicyclohexyl-3,3′-diene) appearing around a retention time of 20.97 minutes and the peak around 20.91 minutes (isomers) appearing just before that ), The content ratio of the isomer to the bicyclohexyl-3,3′-diene was determined. That is, the isomer ratio (%) is calculated as isomer area ÷ (isomer area + bicyclohexyl-3,3′-diene area) × 100.

(2) Gas chromatography (GC analysis) of 3,4,3 ', 4'-diepoxybicyclohexyl and its isomers
Measuring device: HP6890 (manufactured by Hewlett-Packard Company)
Column: HP-5, length 30 m, film thickness 0.25 μm, inner diameter 0.32 mm
Liquid phase 5% -diphenyl-95% -dimethylpolysiloxane Carrier gas: Nitrogen Carrier gas flow rate: 1.0 ml / min Detector: FID
Inlet temperature: 250 ° C
Detector temperature: 300 ° C
Temperature rise pattern (column): Hold at 100 ° C. for 2 minutes, heat up to 300 ° C. at 5 ° C./minute, hold at 300 ° C. for 10 minutes Split ratio: 100
Sample: 1 μl (epoxy compound: acetone = 1: 40)
The ratio of 3,4,3 ', 4'-diepoxybicyclohexyl and its isomer was determined as follows. That is, GC analysis was performed under the above conditions, and the maximum two peaks [3,4,3 ′, 4′-diepoxybicyclohexyl (two peaks are stereoisomeric) appearing at a retention time of about 19.8 minutes to 20.0 minutes. )], And the total area of 3 peaks (isomers) appearing immediately before that in the vicinity of 19.1 to 19.5 minutes, 3,4,3 ′, 4′-di The content ratio of isomers to epoxybicyclohexyl was determined. That is, the isomer ratio (%) is calculated by (total isomer area) / (total isomer area + 3,4,3 ′, 4′-diepoxybicyclohexyl total area) × 100.

(3) GC-MS analysis of 3,4,3 ′, 4′-diepoxybicyclohexyl and its isomers Measuring apparatus: HP 6890 (GC part), 5973 (MS part) manufactured by Hewlett-Packard Company
Column: HP-5MS, length 30 m, film thickness 0.25 μm, inner diameter 0.25 mm
Liquid phase 5% -diphenyl-95% -dimethylpolysiloxane Temperature rising pattern (column): held at 100 ° C. for 2 minutes, heated to 300 ° C. at 5 ° C./minute, held at 300 ° C. for 18 minutes Inlet temperature: 250 ℃
MSD transfer line temperature: 280 ° C
Carrier gas: helium Carrier gas flow rate: 0.7 ml / min (constant flow)
Split ratio: Splitless Sample injection volume: 1.0 μl
Measurement mode: EI
Ion source temperature: 230 ° C
Quadrupole temperature: 106 ° C
MS range: m / z = 25-400
Sample preparation: 0.1 g of sample was dissolved in 3.0 g of acetone. The alicyclic diepoxy compound obtained in Synthesis Example 1 was subjected to GC-MS analysis. The results (gas chromatogram and MS spectrum of each component) are shown in FIGS. Retention times of 17.73 minutes, 17.91 minutes, and 18.13 minutes are the isomer peaks of 3,4,3 ', 4'-diepoxybicyclohexyl, 18.48 minutes, and 18.69 minutes. Are peaks of 3,4,3 ′, 4′-diepoxybicyclohexyl. Since the analysis conditions are slightly different from those in the case of the GC analysis, the retention time of each peak is different, but the appearance order is the same. FIG. 5 is a gas chromatogram and an MS spectrum of a peak having a retention time of 17.73 minutes, and FIG. 6 is an enlarged view thereof. FIG. 7 is an MS spectrum of a gas chromatogram and a peak at a retention time of 17.91 minutes, and FIG. 8 is an enlarged view thereof. FIG. 9 is a gas chromatogram and an MS spectrum of a peak having a retention time of 18.13 minutes, and FIG. 10 is an enlarged view thereof. FIG. 11 is an MS spectrum of a gas chromatogram and a peak at a retention time of 18.48 minutes, and FIG. 12 is an enlarged view thereof. FIG. 13 is a gas chromatogram and an MS spectrum of a peak having a retention time of 18.69 minutes, and FIG. 14 is an enlarged view thereof. According to the MS spectrum, any of the above components has a molecular ion peak of m / z = 194.

(4) Heat resistance test of cured product After first curing the resin compositions (transparent sealing materials) of Examples 1 to 3 and Comparative Examples 1 and 2 prepared according to Table 1 at 45 ° C for 2 hours, at 150 ° C. Samples were prepared by secondary curing for 1 hour. The glass transition point Tg (° C.) of this cured product was measured by TMA (thermomechanical analysis) under the condition of a temperature rising rate of 5 ° C./min. As a measuring device, “TMA / SS6000” (manufactured by Seiko Instruments Inc.) was used. Regarding the dimensional stability, the liquid specific gravity of the resin composition and the specific gravity of the cured product were compared, and the percentage of 1- (specific gravity of the cured product / liquid specific gravity of the resin composition) was defined as the dimensional stability. The thermal decomposition temperature was measured with “TG / DTA6200” (manufactured by Seiko Instruments Inc.) at a temperature increase rate of 3 ° C./min.

(5) Heat resistance test of cured product with curing agent Examples 4-8 prepared according to Table 2 and the resin composition (transparent sealing material) of Comparative Example 3 were primarily cured at 100 ° C for 3 hours, and then 150 ° C. A sample was prepared by performing secondary curing for 3 hours. The glass transition point Tg (° C.) of this cured product was measured by TMA (thermomechanical analysis) under the condition of a temperature rising rate of 5 ° C./min. As a measuring device, “TMA / SS6000” (manufactured by Seiko Instruments Inc.) was used. Regarding the dimensional stability, the liquid specific gravity of the resin composition and the specific gravity of the cured product were compared, and the percentage of 1- (specific gravity of the cured product / liquid specific gravity of the resin composition) was defined as the dimensional stability. The thermal decomposition temperature was measured with “TG / DTA6200” (manufactured by Seiko Instruments Inc.) at a temperature increase rate of 3 ° C./min.

(6) Transparency (light transmittance)
Each resin composition (transparent sealing material) prepared in the examples and comparative examples was thermally cured under the same conditions as in the above (4) or (5) to prepare test pieces (thickness 3 mm). About this, the light transmittance (T%) in wavelength 400nm was measured using the spectrophotometer (Shimadzu Corporation "UV-2450"), and it was set as the parameter | index of transparency.

(7) Bending strength test (flexural modulus and bending strength)
Each resin composition (transparent sealing material) prepared in the examples and comparative examples was thermally cured under the same conditions as the above (4) or (5), respectively, and a test piece (length 80 mm, width 10 mm, thickness) 5 mm). The bending strength test was performed at a bending speed of 1 mm / min according to JIS K 6911 using Tensilon “RTC-1350A” manufactured by Orientec.

で表される水添ビフェノール（＝４，４′−ジヒドロキシビシクロヘキシル）１０００ｇ（５．０５モル）、上記で調製した脱水触媒１２５ｇ（硫酸として０．６８モル）、プソイドクメン１５００ｇを入れ、フラスコを加熱した。内温が１１５℃を超えたあたりから水の生成が確認された。さらに昇温を続けてプソイドクメンの沸点まで温度を上げ（内温１６２〜１７０℃）、常圧で脱水反応を行った。副生した水は留出させ、脱水管により系外に排出した。なお、脱水触媒は反応条件下において液体であり反応液中に微分散していた。３時間経過後、ほぼ理論量の水（１８０ｇ）が留出したため反応終了とした。反応終了液を１０段のオールダーショウ型の蒸留塔を用い、プソイドクメンを留去した後、内部圧力１０Ｔｏｒｒ（１．３３ｋＰａ）、内温１３７〜１４０℃にて蒸留し、７３１ｇのビシクロヘキシル−３，３′−ジエンを得た。ＧＣ分析の結果、得られたビシクロヘキシル−３，３′−ジエン中にはその異性体が含まれており（ＧＣ−ＭＳ分析により確認）、下記式（２ａ）

で表されるビシクロヘキシル−３，３′−ジエンとその異性体の含有比は９１：９であった（図４参照）。
得られたビシクロヘキシル−３，３′−ジエン（異性体を含む）２４３ｇ、酢酸エチル７３０ｇを反応器に仕込み、窒素を気相部に吹き込みながら、かつ、反応系内の温度を３７．５℃になるようにコントロールしながら約３時間かけて３０重量％過酢酸の酢酸エチル溶液（水分率０．４１重量％）２７４ｇを滴下した。過酢酸溶液滴下終了後、４０℃で１時間熟成し反応を終了した。さらに３０℃で反応終了時の粗液を水洗し、７０℃／２０ｍｍＨｇで低沸点化合物の除去を行い、脂環式エポキシ化合物２７０ｇを得た。このときの収率は９３％であった。粘度（２５℃）を測定したところ、８４ｍＰａ・ｓであった。得られた脂環式エポキシ化合物のオキシラン酸素濃度は１５．０重量％であった。また¹Ｈ−ＮＭＲの測定では、δ４．５〜５ｐｐｍ付近の内部二重結合に由来するピークが消失し、δ３．１ｐｐｍ付近にエポキシ基に由来するプロトンのピークの生成が確認され、下記式（１ａ）

で表される３，４，３′，４′−ジエポキシビシクロヘキシルであることが確認された。ＧＣ分析の結果、得られた脂環式エポキシ化合物中には３，４，３′，４′−ジエポキシビシクロヘキシルとその異性体が含まれており、異性体比率は９％であった（図１参照）。なお、異性体比率は次式により算出した。
異性体比率＝（２２６２＋１７１５＋５７０２）÷（２２６２＋１７１５＋５７０２ ＋２８５１４＋７４５８７）×１００＝９％ Synthesis example 1 (isomer ratio 9%)
A dehydration catalyst was prepared by stirring and mixing 70 g (0.68 mol) of 95 wt% sulfuric acid and 55 g (0.36 mol) of 1,8-diazabicyclo [5.4.0] undecene-7 (DBU).
The following formula (3a) was added to a 3 liter flask equipped with a stirrer, a thermometer, and a dehydration pipe and a heated distillation pipe.

1000 g (5.05 mol) of hydrogenated biphenol (= 4,4′-dihydroxybicyclohexyl) represented by the above, 125 g of the dehydration catalyst prepared above (0.68 mol as sulfuric acid), and 1500 g of pseudocumene were added, and the flask was heated. did. The generation of water was confirmed when the internal temperature exceeded 115 ° C. The temperature was further raised to raise the boiling point of pseudocumene (internal temperature 162 to 170 ° C.), and dehydration reaction was carried out at normal pressure. By-product water was distilled off and discharged out of the system through a dehydration tube. The dehydration catalyst was liquid under the reaction conditions and was finely dispersed in the reaction solution. After about 3 hours, almost theoretical amount of water (180 g) was distilled, and the reaction was terminated. Pseudocumene was distilled off using a 10-stage Oldershaw type distillation column, and the reaction-terminated liquid was distilled at an internal pressure of 10 Torr (1.33 kPa) and an internal temperature of 137 to 140 ° C. to obtain 731 g of bicyclohexyl-3. , 3'-diene was obtained. As a result of GC analysis, the obtained bicyclohexyl-3,3′-diene contained the isomer (confirmed by GC-MS analysis), and the following formula (2a)

The content ratio of bicyclohexyl-3,3′-diene represented by the formula (1) and its isomer was 91: 9 (see FIG. 4).
243 g of the obtained bicyclohexyl-3,3′-diene (including isomer) and 730 g of ethyl acetate were charged into the reactor, and nitrogen was blown into the gas phase portion, and the temperature in the reaction system was 37.5 ° C. 274 g of a 30 wt% peracetic acid ethyl acetate solution (water content 0.41 wt%) was added dropwise over a period of about 3 hours. After the peracetic acid solution was dropped, the reaction was terminated by aging at 40 ° C. for 1 hour. Further, the crude liquid at the end of the reaction was washed with water at 30 ° C., and the low boiling point compound was removed at 70 ° C./20 mmHg to obtain 270 g of an alicyclic epoxy compound. The yield at this time was 93%. It was 84 mPa * s when the viscosity (25 degreeC) was measured. The oxirane oxygen concentration of the obtained alicyclic epoxy compound was 15.0% by weight. Further, in the measurement of ¹ H-NMR, the peak derived from the internal double bond in the vicinity of δ4.5 to 5 ppm disappeared, and the generation of a proton peak derived from the epoxy group was confirmed in the vicinity of δ3.1 ppm. 1a)

It was confirmed that it was 3,4,3 ′, 4′-diepoxybicyclohexyl represented by the following formula. As a result of GC analysis, the obtained alicyclic epoxy compound contained 3,4,3 ′, 4′-diepoxybicyclohexyl and its isomer, and the isomer ratio was 9% ( (See FIG. 1). The isomer ratio was calculated by the following formula.
Isomeric ratio = (2262 + 1715 + 5702) ÷ (2262 + 1715 + 5702 + 28514 + 74587) x 100 = 9%

Synthesis example 2 (isomer ratio 14%)
Into a 3 liter flask equipped with a stirrer, a thermometer, a dehydration tube and a heated distillation pipe, hydrogenated biphenol 840 g (4.24 mol), phosphoric acid 170 g (1.73 mol), undecane 2350 g And the flask was heated. The generation of water was confirmed when the internal temperature exceeded 110 ° C. The temperature was further raised to raise the temperature to the boiling point of undecane (internal temperature 189 to 194 ° C.), and a dehydration reaction was carried out at normal pressure. By-product water was distilled off and discharged out of the system through a dehydration tube. In addition, p-toluenesulfonic acid was completely dissolved in the reaction solution under the reaction conditions. After about 5 and a half hours, the reaction was terminated because almost the theoretical amount of water (150 g) was distilled. After the reaction was completed, the undecane was distilled off using a 10-stage Oldershaw type distillation column, and then distilled at an internal pressure of 10 Torr (1.33 kPa) and an internal temperature of 138 to 141 ° C. to obtain 474.2 g of bicyclohexyl. -3,3'-diene was obtained. As a result of GC analysis, the resulting bicyclohexyl-3,3'-diene contained isomers, and the content ratio of bicyclohexyl-3,3'-diene and isomers was 87:13. .
243 g of the obtained bicyclohexyl-3,3′-diene (including isomer) and 730 g of ethyl acetate were charged into the reactor, and nitrogen was blown into the gas phase portion, and the temperature in the reaction system was 37.5 ° C. 274 g of a 30 wt% peracetic acid ethyl acetate solution (water content 0.41 wt%) was added dropwise over a period of about 3 hours. After the peracetic acid solution was dropped, the reaction was terminated by aging at 40 ° C. for 1 hour. Further, the crude liquid at the end of the reaction was washed with water at 30 ° C., and the low boiling point compound was removed at 70 ° C./20 mmHg to obtain 261 g of an alicyclic epoxy compound. The yield at this time was 90%. It was 75 mPa * s when the viscosity (25 degreeC) was measured. The oxirane oxygen concentration of the obtained alicyclic epoxy compound was 15.0% by weight. In ¹ H-NMR measurement, a peak derived from an internal double bond in the vicinity of δ4.5 to 5 ppm disappeared, and a proton peak derived from an epoxy group was confirmed in the vicinity of δ3.1 ppm. , 3 ′, 4′-diepoxybicyclohexyl was confirmed. As a result of GC analysis, the obtained alicyclic epoxy compound contained 3,4,3 ′, 4′-diepoxybicyclohexyl and its isomer, and the isomer ratio was 14% ( (See FIG. 2). The isomer ratio was calculated by the following formula.
Isomeric ratio = (2821 + 2108 + 6988) ÷ (2821 + 2108 + 6988 + 20792 + 54602) × 100 = 14%

Comparative Synthesis Example 1
6 kg of hydrogenated biphenol and 620 g of potassium hydrogen sulfate were added to a 10-liter four-necked flask equipped with a stirrer, a 20-stage distillation column, and a thermometer. Subsequently, the flask was heated to 180 ° C., and after stirring the hydrogenated biphenol, stirring was started. The reaction was continued while distilling by-product water from the top of the distillation column, and after 3 hours, the pressure in the reaction system was reduced to 10 Torr (1.33 kPa), and water and bicyclohexyl-3,3'-diene were distilled. Distilled out of the system continuously from the top of the tower. The water and bicyclohexyl-3,3′-diene distilled off outside the system were separated into two layers with a decanter, and only the upper layer liquid was taken out. Thereafter, the reaction temperature was raised to 220 ° C. over 4 hours, and the reaction was terminated when the distillation of water and bicyclohexyl-3,3′-diene ceased. The yield of the distillate crude liquid of bicyclohexyl-3,3'-diene was 4507 g. 4500 g of the above dicyclohexyl-3,3′-diene distillate was put into a 5 liter four-necked flask equipped with a stirrer, 20-stage distillation column and thermometer, and heated to 180 ° C. with an oil bath. did. Thereafter, the pressure in the reaction system is reduced to 10 Torr (1.33 kPa), and water is distilled off, and then the temperature of the uppermost stage of the distillation column is maintained at 145 ° C., and bicyclohexyl-3, 3'-Diene was purified by distillation to obtain a colorless and transparent liquid. Yield was 4353 g. As a result of performing GC analysis on the liquid, the resulting bicyclohexyl-3,3'-diene contained isomers, and the content ratio of bicyclohexyl-3,3'-diene and isomers was 80. : 20.
243 g of the obtained bicyclohexyl-3,3′-diene (including isomer) and 730 g of ethyl acetate were charged into the reactor, and nitrogen was blown into the gas phase portion, and the temperature in the reaction system was 37.5 ° C. 274 g of a 30 wt% peracetic acid ethyl acetate solution (water content 0.41 wt%) was added dropwise over a period of about 3 hours. After the peracetic acid solution was dropped, the reaction was terminated by aging at 40 ° C. for 1 hour. Further, the crude liquid at the end of the reaction was washed with water at 30 ° C., and the low boiling point compound was removed at 70 ° C./20 mmHg to obtain 267 g of an alicyclic epoxy compound. The yield at this time was 92%. It was 63 mPa * s when the viscosity (25 degreeC) was measured. The obtained alicyclic epoxy compound had an oxirane oxygen concentration of 14.9% by weight. In ¹ H-NMR measurement, a peak derived from an internal double bond in the vicinity of δ4.5 to 5 ppm disappeared, and a proton peak derived from an epoxy group was confirmed in the vicinity of δ3.1 ppm. , 3 ′, 4′-diepoxybicyclohexyl was confirmed. As a result of GC analysis, the obtained alicyclic epoxy compound contained 3,4,3 ', 4'-diepoxybicyclohexyl and its isomer, and the isomer ratio was 21% (Fig. 3). The isomer ratio was calculated by the following formula.
Isomeric ratio = (5404 + 3923 + 13067) ÷ (5404 + 3923 + 130 67 + 23563 + 60859) × 100 = 21%

Examples 1-8, Comparative Examples 1-3
A resin composition (transparent sealing material) was prepared at a blending ratio described in Table 1 and Table 2, and the above physical properties were measured. The blending of each component was carried out by mixing with stirring for 20 minutes at room temperature using “Foam Extracting Taro” manufactured by Shinky Corporation. The results are shown in Tables 1 and 2.

The abbreviations in the table are as follows.
CEL-2021P: “Celoxide 2021P” (3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate) manufactured by Daicel Chemical Industries, Ltd.
EHPE-3150: “EHPE3150” (polyfunctional alicyclic epoxy compound) manufactured by Daicel Chemical Industries, Ltd.
SI-60L: “Sun-Aid SI-60L” (sulfonium salt-based cationic polymerization initiator) manufactured by Sanshin Chemical Industry Co., Ltd.
PCL410D: “Placcel 410D” (polyester polyol) manufactured by Daicel Chemical Industries, Ltd.
YX-8034: “YX-8034” (hydrogenated bisphenol A type epoxy resin) manufactured by Japan Epoxy Resin Co., Ltd.
YD-128: “YD-128” (bisphenol A type epoxy resin) manufactured by Tohto Kasei Kogyo Co., Ltd.
MH-700: “MH-700” (liquid acid anhydride) manufactured by Shin Nippon Rika Co., Ltd.
TBAB: Tetrabutylammonium bromide PX-4ET: “PX-4ET” (phosphorus curing accelerator) manufactured by Nippon Chemical Industry Co., Ltd.

  As shown in Table 1 and Table 2, the cured product obtained by curing the transparent sealing material of the example is more resistant to heat and the cured product obtained by curing the sealing material of the comparative example. It has excellent transparency (light transmittance) and high mechanical strength.

2 is a GC analysis chart of the alicyclic diepoxy compound obtained in Synthesis Example 1. FIG. 3 is a GC analysis chart of the alicyclic diepoxy compound obtained in Synthesis Example 2. FIG. 2 is a GC analysis chart of an alicyclic diepoxy compound obtained in Comparative Synthesis Example 1. FIG. 2 is a GC analysis chart of bicyclohexyl-3,3′-diene obtained in Synthesis Example 1. FIG. It is a gas chromatogram (upper figure) in the GC-MS analysis of the alicyclic diepoxy compound obtained by the synthesis example 1, and MS spectrum (lower figure) of the peak of retention time 17.73 minutes. It is the enlarged view (upper figure) of the gas chromatogram in the GC-MS analysis of the alicyclic diepoxy compound obtained by the synthesis example 1, and the enlarged view (lower figure) of the MS spectrum of the peak of retention time 17.73 minutes. It is a gas chromatogram (upper figure) in GC-MS analysis of the alicyclic diepoxy compound obtained by the synthesis example 1, and MS spectrum (lower figure) of the peak of retention time 17.91 minutes. It is the enlarged view (upper figure) of the gas chromatogram in the GC-MS analysis of the alicyclic diepoxy compound obtained by the synthesis example 1, and the enlarged view (lower figure) of the MS spectrum of the peak of retention time 17.91 minutes. It is a gas chromatogram (upper figure) in GC-MS analysis of the alicyclic diepoxy compound obtained by the synthesis example 1, and MS spectrum (lower figure) of the peak of retention time 18.13 minutes. It is the enlarged view (upper figure) of the gas chromatogram in the GC-MS analysis of the alicyclic diepoxy compound obtained by the synthesis example 1, and the enlarged view (lower figure) of the MS spectrum of the peak of retention time 18.13 minutes. It is a gas chromatogram (upper figure) in GC-MS analysis of the alicyclic diepoxy compound obtained by the synthesis example 1, and MS spectrum (lower figure) of the peak of retention time 18.48 minutes. It is the enlarged view (upper figure) of the gas chromatogram in the GC-MS analysis of the alicyclic diepoxy compound obtained by the synthesis example 1, and the enlarged view (lower figure) of the MS spectrum of the peak of retention time 18.48 minutes. It is a gas chromatogram (upper figure) in GC-MS analysis of the alicyclic diepoxy compound obtained by the synthesis example 1, and MS spectrum (lower figure) of the peak of retention time 18.69 minutes. It is the enlarged view (upper figure) of the gas chromatogram in the GC-MS analysis of the alicyclic diepoxy compound obtained by the synthesis example 1, and the enlarged view (lower figure) of the MS spectrum of the peak of retention time 18.69 minutes.

Claims (9)

Following formula (1)

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
Wherein the isomer content of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound is 3,4,3 ′, 4′-diepoxybicyclohexyl compound. , 3 ′, 4′-diepoxy bicyclohexyl compound and its isomers, the ratio of the peak area by gas chromatography is 20% or less, and the alicyclic diepoxy compound (A1) is 95 to 40% by weight, And an epoxy resin composed of 5 to 60% by weight of a bifunctional or higher functional epoxy resin (A2) other than the alicyclic diepoxy compound (A1) [total of (A1) and (A2) is 100% by weight] in 100 parts by weight On the other hand, the transparent sealing material which mix | blended 50-150 weight part of hardening | curing agents and 0.05-3.0 weight part of hardening accelerators. Following formula (2)

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
A bicyclohexyl-3,3′-diene compound represented by the formula: wherein the isomer content of the bicyclohexyl-3,3′-diene compound is such that the bicyclohexyl-3,3′-diene compound and its isomer 95 to 40% by weight of an alicyclic diepoxy compound (A1 ′) obtained by epoxidizing an alicyclic diene compound having a peak area ratio of less than 20% by gas chromatography with respect to the total body, and 100 parts by weight of an epoxy resin consisting of 5 to 60% by weight of a bifunctional or higher functional epoxy resin (A2) other than the alicyclic diepoxy compound (A1 ′) [the total of (A1 ′) and (A2) is 100% by weight) The transparent sealing material which mix | blended 50-150 weight part of hardening | curing agents and 0.05-3.0 weight part of hardening accelerators with respect to the. Following formula (1)

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
Wherein the isomer content of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound is 3,4,3 ′, 4′-diepoxybicyclohexyl compound. , 3 ′, 4′-diepoxy bicyclohexyl compound and its isomers, the ratio of the peak area by gas chromatography is 20% or less, and the alicyclic diepoxy compound (A1) is 95 to 40% by weight, And an epoxy resin composed of 5 to 60% by weight of a bifunctional or higher functional epoxy resin (A2) other than the alicyclic diepoxy compound (A1) [total of (A1) and (A2) is 100% by weight] in 100 parts by weight On the other hand, the transparent sealing material which mix | blended 0.01-12 weight part of thermal cationic polymerization initiators. Following formula (2)

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
A bicyclohexyl-3,3′-diene compound represented by the formula: wherein the isomer content of the bicyclohexyl-3,3′-diene compound is such that the bicyclohexyl-3,3′-diene compound and its isomer 95 to 40% by weight of an alicyclic diepoxy compound (A1 ′) obtained by epoxidizing an alicyclic diene compound having a peak area ratio of less than 20% by gas chromatography with respect to the total body, and 100 parts by weight of an epoxy resin consisting of 5 to 60% by weight of a bifunctional or higher functional epoxy resin (A2) other than the alicyclic diepoxy compound (A1 ′) [the total of (A1 ′) and (A2) is 100% by weight) The transparent sealing material which mix | blended 0.01-12 weight part of thermal cationic polymerization initiators with respect to this. Following formula (1)

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
Wherein the isomer content of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound is 3,4,3 ′, 4′-diepoxybicyclohexyl compound. , 3 ', 4'-diepoxybicyclohexyl compound and its isomers are bifunctional or higher containing at least the alicyclic diepoxy compound (A1) having a peak area ratio of 20% or less by gas chromatography Curing agent for 100 parts by weight of a mixture of 95 to 40% by weight of epoxy resin (A) and 5 to 60% by weight of polyol (B) [total of (A) and (B) is 100% by weight] The transparent sealing material which mix | blended 50-150 weight part and 0.05-3.0 weight part of hardening accelerators. Following formula (2)

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
A bicyclohexyl-3,3′-diene compound represented by the formula: wherein the isomer content of the bicyclohexyl-3,3′-diene compound is such that the bicyclohexyl-3,3′-diene compound and its isomer A bifunctional or higher functional group containing at least an alicyclic diepoxy compound (A1 ′) obtained by epoxidizing an alicyclic diene compound having a peak area ratio of less than 20% by gas chromatography with respect to the total body. Curing for 100 parts by weight of a mixture consisting of 95 to 40% by weight of epoxy resin (A ′) and 5 to 60% by weight of polyol (B) [total of (A ′) and (B) is 100% by weight] A transparent sealing material containing 50 to 150 parts by weight of an agent and 0.05 to 3.0 parts by weight of a curing accelerator. Following formula (1)

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
Wherein the isomer content of the 3,4,3 ′, 4′-diepoxybicyclohexyl compound is 3,4,3 ′, 4′-diepoxybicyclohexyl compound. , 3 ', 4'-diepoxybicyclohexyl compound and its isomers are bifunctional or higher containing at least the alicyclic diepoxy compound (A1) having a peak area ratio of 20% or less by gas chromatography The epoxy resin (A) of 95 to 40% by weight and the polyol (B) 5 to 60% by weight of the mixture [(A) and (B) is 100% by weight in total] 100 parts by weight of the thermal cation A transparent sealing material containing 0.01 to 12 parts by weight of a polymerization initiator. Following formula (2)

(In the formula, R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ , R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ and R ¹⁸ are the same or different and each represents a hydrogen atom, a halogen atom, an oxygen atom or a hydrocarbon group optionally having a halogen atom, or an alkoxy group optionally having a substituent. )
A bicyclohexyl-3,3′-diene compound represented by the formula: wherein the isomer content of the bicyclohexyl-3,3′-diene compound is such that the bicyclohexyl-3,3′-diene compound and its isomer A bifunctional or higher functional group containing at least an alicyclic diepoxy compound (A1 ′) obtained by epoxidizing an alicyclic diene compound having a peak area ratio of less than 20% by gas chromatography with respect to the total body. 100 parts by weight of epoxy resin (A ') 95 to 40% by weight and polyol (B) 5 to 60% by weight of a mixture [total of (A') and (B) is 100% by weight] A transparent sealing material containing 0.01 to 12 parts by weight of a cationic polymerization initiator.   The transparent sealing material obtained by hardening | curing the transparent sealing material in any one of Claims 1-8.

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