JP2008186835A - Light-emiting device and its fabrication process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emiting device in which an upper/lower electrode type light-emiting diode having an upper electrode and a lower electrode is mounted on a heat sink substrate with fins, and also to provide its fabrication process. <P>SOLUTION: At least two heat sink substrates with fins are integrated while being insulated from each other by thermosetting adhesive. The lower electrode of the upper/lower electrode type light-emiting diode is bonded to the upper surface of one heat sink substrate with fins. The upper electrode of the upper/lower electrode type light-emiting diode is connected to the other heat sink substrate with fins by a conductive connection member. Since the conductive connection member is made planar, it is not cut even if a high current is fed and since the bonding area, and the heat dissipation area is increased, a highly reliable light-emiting device is provided. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting device in which an upper and lower electrode type light emitting diode having an upper electrode and a lower electrode is mounted on a finned heat sink substrate, and a method for manufacturing the light emitting device. In particular, according to the present invention, when a large current is passed through the upper and lower electrode type light emitting diodes, the finned heat sink substrate can efficiently dissipate heat, and expansion and contraction due to thermal stress inside the upper and lower electrode type light emitting diodes. The present invention relates to a light emitting device and a method for manufacturing the light emitting device.

In the method of manufacturing a copper integrated heat sink described in Japanese Patent Application Laid-Open No. 2005-72180, heat dissipation fins are formed by extruding copper or a copper alloy through a die. In addition, a heat sink processing composite material and a heat sink manufacturing method described in Japanese Patent Laid-Open No. 2001-332669 are disclosed in which fins are cut into an aluminum-based material of a heat sink made of a composite material of a copper-based material and an aluminum-based material. Yes.
JP-A-2005-72180 JP 2001-332669 A

  The conventional finned heat sink is attached to a device that generates heat to radiate heat. That is, the conventional heat sink with fins and the device for generating heat are different. For this reason, the apparatus for generating heat requires a space for incorporating the finned heat sink and its labor, and there is a problem that the cost cannot be kept low. Light emitting diodes have been developed with high brightness despite their small size. The light emitting diode needs to emit heat generated by a large current in order to obtain high luminance.

  In order to solve the above-described problems, an object of the present invention is to provide a light-emitting device with high heat dissipation and a method for manufacturing the light-emitting device by directly attaching upper and lower electrode type light-emitting diodes to a heat sink substrate with fins. To do. The present invention provides an inexpensive light-emitting device and a method for manufacturing the light-emitting device because the heat sink with fins itself is a mounting substrate for the upper and lower electrode type light-emitting diodes, which is excellent in mass productivity and withstands a large current and thermal stress. For the purpose.

(First invention)
A light emitting device according to a first aspect of the present invention includes at least two separated heat sink substrates with fins, upper and lower electrode type light emitting diodes having a lower electrode joined to one of the finned heat sink substrates, and upper electrodes of the upper and lower electrode type light emitting diodes. A conductive connection member that connects the heat sink substrate with fins to the other, a cylindrical resin member that molds a part of the heat sink substrate with fins, and a sealing material filled in the cylindrical resin member It is characterized by comprising at least.

(Second invention)
A light emitting device according to a second aspect of the present invention is a cylindrical resin member molded so that a slit is formed in at least two finned heat sink substrates, and upper and lower electrodes in which a lower electrode is joined to one of the finned heat sink substrates. Type light emitting diode, a conductive connection member for connecting the upper electrode of the upper and lower electrode type light emitting diode and the other of the finned heat sink substrate, and a sealing material filled in the cylindrical body. It is characterized by being.

(Third invention)
In the light emitting device of the third invention, in the first invention or the second invention, n upper and lower electrode type light emitting diodes and (n + 1) finned heat sink substrates are connected in series by a conductive connecting member. Characteristic (where n = 2, 3,...).

(Fourth invention)
In the light emitting device of the fourth invention, in the first invention to the third invention, at least two of the upper and lower electrode type light emitting diodes are connected in parallel to the two finned heat sink substrates by the conductive connection member. Features.

(Fifth invention)
The light emitting device according to a fifth invention is the light emitting device according to the first to fourth inventions, wherein one of the finned heat sink substrates and the lower electrode are joined, the upper electrode and the conductive connecting member are joined, and the conductive connecting member. In addition, eutectic solder is used for joining the heat sink substrate with fins to the other of the finned heat sink substrates.

(Sixth invention)
A light emitting device according to a sixth invention is characterized in that, in the first to fifth inventions, one and / or the other of the finned heat sink substrate protrudes from the cylindrical resin member to be a terminal.

(Seventh invention)
The light emitting device of the seventh invention is the light emitting device of the first invention to the sixth invention, wherein the direction of the fins provided on the finned heat sink substrate is aligned in either the direction in which the finned heat sink substrate is arranged or the direction perpendicular to the direction. It is characterized by being.

(Eighth invention)
The light emitting device according to an eighth aspect of the present invention is characterized in that, in the first to seventh aspects, silver and / or gold plating is applied to the upper surface of the finned heat sink substrate.

(9th invention)
The light-emitting device according to a ninth aspect of the present invention is the light-emitting device according to any one of the first to eighth aspects, wherein a phosphor-containing film body is provided on the surface or inside of the sealing material. 8. The light-emitting device described in any one of 7 above.

(10th invention)
According to a tenth aspect of the present invention, there is provided a light emitting device manufacturing method comprising: an insert molding step of molding at least two insulated heat sink substrates with fins with a resin and molding a cylindrical resin member on an upper surface of the finned heat sink substrate; A eutectic solder is used to join one of the heat sink substrates with the upper electrode and the lower electrode of the upper and lower electrode light emitting diodes, and to join the upper electrode of the upper and lower electrode light emitting diodes with the other of the finned heat sink substrate by the conductive connecting member. And a step of filling the cylindrical resin member with a sealing material and sealing the upper and lower electrode type light emitting diodes.

(11th invention)
According to an eleventh aspect of the invention, there is provided a light emitting device manufacturing method comprising: an insert molding step of molding one tubular heat sink substrate with a resin and molding the tubular resin member on an upper surface of the finned heat sink substrate; and the tubular resin member. A step of cutting the finned heat sink substrate from the lower surface of the finned heat sink substrate inserted by a cutter into at least two parts, and one of the separated finned heat sink substrates and an upper and lower electrode type Bonding with the lower electrode of the light emitting diode and bonding of the upper electrode of the upper and lower electrode type light emitting diode with the other of the finned heat sink substrate by a conductive connecting member using eutectic solder; and the cylindrical shape A resin material is filled with a sealing material to seal the upper and lower electrode type light emitting diodes. Characterized in that it is at least composed of a degree.

(Twelfth invention)
A method for manufacturing a light emitting device according to a twelfth aspect is characterized in that a phosphor-containing film body is provided on the surface of the sealing material according to the tenth aspect or the eleventh aspect.

  According to the present invention, since the finned heat sink substrate itself is a mounting substrate for the upper and lower electrode type light emitting diodes, not only is it excellent in heat dissipation, it is also excellent in mass productivity, and an inexpensive light emitting device is obtained. be able to.

  According to the present invention, a plurality of upper and lower electrode type light emitting diodes can be connected in series and / or in parallel by a finned heat sink substrate and a conductive connecting member made of, for example, a metal plate. A planar light source can be easily obtained.

  According to the present invention, a plurality of upper and lower electrode type light emitting diodes are connected in series to form a single linear light source, which can be arranged in series and / or in parallel to obtain a light source of any shape. Ideal as a backlight for advertising.

  According to the present invention, the upper electrode of the upper and lower electrode type light emitting diode connected to one finned heat sink substrate and the other finned heat sink substrate are connected by, for example, a plate-like conductive connecting member. Not only can an electric current flow, it is excellent in heat dissipation and can be relaxed even if thermal stress occurs. In particular, according to the present invention, when eutectic solder is used for each connection portion, it is possible to obtain a light emitting device composed of upper and lower electrode type light emitting diodes without vibrations applied to the joint portion and / or the light emitting layer and free from defective products. I can do it now.

  According to the present invention, since wire bonding is not used for connection between the upper electrode of the upper and lower electrode type light emitting diode and the heat sink substrate with fins, the heat sink substrate with fins and the conductive connection member even if a large current is passed over a long period of time. And / or a light emitting device with high reliability in which the light emitting layer is not damaged.

  According to the present invention, the upper and lower electrode type light emitting diode can be easily converted into a desired color only by changing the kind of the phosphor-containing film body.

(First invention)
In the first invention, at least two finned heat sink substrates are insulated and integrated with each other by, for example, a thermosetting adhesive. The lower electrode of the upper and lower electrode type light emitting diode is bonded to one upper surface of the finned heat sink substrate. The upper electrode of the upper and lower electrode type light emitting diode is connected to the other of the finned heat sink substrate by a conductive connecting member. The conductive connecting member is, for example, plate-shaped so that it will not be cut even when a large current is passed, and a large bonding area and heat dissipation area can be obtained, so that a highly reliable light-emitting device is obtained. Can do.

  The at least two finned heat sink substrates can be integrally held with a strength that does not separate from each other by being molded with a cylindrical resin member. The inside of the cylindrical resin member is filled with a sealing material. The cylindrical resin member may be a circular member, an elliptical member, a rectangular member, or a long member having a U-shaped cross section with an open upper surface. Moreover, the inside of the said cylindrical resin member can improve the light reflection efficiency by shape | molding an inclined surface and giving silver and / or gold plating.

  Since the upper and lower electrode type light emitting diodes mounted on the heat sink substrate with fins can easily dissipate heat through the fins, heat dissipation efficiency is good and a large current can flow. Further, at least two heat sink substrates with fins are inserted by an injection molding machine and joined by a cylindrical resin member so as to be held integrally with sufficient strength.

(Second invention)
In the second invention, at least two finned heat sink substrates are different from the first invention in that they are molded and integrated so that a slit is formed by a cylindrical resin member. Since the at least two finned heat sink substrates and the cylindrical resin member are insert-molded by an injection molding machine, they can be easily integrated while maintaining a predetermined slit. The upper / lower electrode type light emitting diode, the conductive connection member, and the sealing material are provided in the same manner as in the first invention.

  In the first or second invention, the upper and lower electrode type light emitting diode is preferably a gallium nitride based upper and lower electrode type light emitting diode. The gallium nitride based upper and lower electrode type light emitting diode includes, for example, a bottom electrode, a substrate, an n-type gallium nitride based light emitting layer, a quantum well structure type active layer, a p type gallium nitride based light emitting layer, and an upper electrode from bottom to top. And at least. The gallium nitride upper / lower electrode type light emitting diode generates little heat and can obtain a high luminance by flowing a large current, for example, 350 mmA or more.

(Third invention)
In the light emitting device of the third invention, n upper and lower electrode type light emitting diodes are connected in series with (n + 1) finned heat sink substrates by a conductive connecting member (where n = 2, 3,...). ). The light emitting device is suitable for a linear light source having a desired number. Moreover, the said linear light-emitting device also becomes a surface light source by arranging two or more in parallel.

(Fourth invention)
In the light emitting device of the fourth invention, at least two upper and lower electrode type light emitting diodes are connected in parallel by a conductive connecting member on two finned heat sink substrates. The light emitting device can obtain a high luminance because a large current can flow in parallel to the upper and lower electrode type light emitting diodes.

(Fifth invention)
In the light emitting device according to the fifth aspect of the invention, eutectic solder is placed on the heat sink substrate with fins, the lower and upper electrodes of the upper and lower electrode type light emitting diodes, and the joint portion of the conductive connecting member, and is heated and bonded to each other. Bonding with the eutectic solder does not melt at the melting temperature of the solder when the control circuit or the wiring board is bonded with ordinary solder. Therefore, the conductive connection member in the upper and lower electrode type light emitting diode of the light emitting device, etc. Never leave.

(Sixth invention)
In the light emitting device of the sixth invention, one and / or the other of the finned heat sink substrates protrudes from the cylindrical resin member to serve as terminals. The terminal can connect a plurality of light emitting devices in series and / or in parallel. Therefore, the light emitting device can be easily assembled as a linear light source having a desired length and a surface light source having a desired area.

(Seventh invention)
In the light emitting device of the seventh invention, the direction of the fins provided on the heat sink substrate with fins can be aligned in an arbitrary direction. A plurality of finned heat sink substrates are arranged in a line in the direction in which the wind in the light emitting device easily passes. For example, even if a large number of upper and lower electrode type light emitting diodes are arranged, the direction of fins is aligned in the same direction, so that the heat radiation efficiency can be improved. Further, the direction of the fin of the heat sink substrate with fins is set to be perpendicular to the direction of the two separated metal substrates, whereby the strength of the substrate can be increased.

(Eighth invention)
In the light emitting device according to the eighth aspect of the invention, silver and / or gold plating is applied to the upper surface of the finned heat sink substrate and / or the inner surface of the cylindrical resin member. The finned heat sink substrate can reflect light at a portion other than the upper and lower electrode type light emitting diodes and the conductive connection member, and exhibit a heat dissipation effect. Moreover, the said cylindrical resin member reflects the light of the said upper-and-lower electrode type light emitting diode efficiently outside by the said plating given to the inner surface. The silver and / or gold plating can improve the wettability of the eutectic solder.

(9th invention)
When a blue light-emitting diode is used, the light-emitting device of the ninth invention uses a phosphor that emits yellow light and emits yellow light to obtain white light, or emits green light by exciting with blue light. And a phosphor emitting red light. Further, when a near-ultraviolet light-emitting diode is used, three kinds of phosphors that are excited by near-ultraviolet light and emit blue light, phosphors that emit green light, and phosphors that emit red light are used in combination. The phosphor-containing film body made of the phosphor is provided on the surface of the sealing material, and can convert the color of light from the upper and lower electrode type light emitting diodes into a desired color.

(10th invention)
According to a tenth aspect of the present invention, there is provided a method of manufacturing a light emitting device, wherein in the first step, at least two heat sink substrates with fins are molded by insert molding so as to be insulated from each other by a thermosetting resin, for example. A cylindrical resin member is molded on the upper surface of the substrate. In the second step, one of the finned heat sink substrate and the lower electrode of the upper and lower electrode type light emitting diode are eutectic, and the upper electrode of the upper and lower electrode type light emitting diode and the other of the finned heat sink substrate are eutectic. Joined by solder. Each said joining can be achieved by putting a eutectic solder in the location which should be joined, and letting it pass through a reflow furnace. In the third step, the cylindrical resin member is filled with a sealing material to seal the upper and lower electrode type light emitting diodes.

  The cylindrical resin member is filled with, for example, a transparent sealing material. The transparent sealing material employs an elastomer having a hardness of Shore A (rubber hardness) of 15 to 85, preferably 20 to 80. The transparent sealing material having the hardness has a hardness capable of absorbing thermal stress generated when a large current is passed from one of the electrode portions to the other of the electrode portions.

(11th invention)
The method for manufacturing a light emitting device according to the eleventh aspect of the invention differs from the tenth aspect of the second step in the second step. That is, in the second step, after the cylindrical resin member is insert-molded on the finned heat sink substrate, the finned heat sink substrate is cut into at least two parts by a cutter from the lower surface so that they are insulated from each other. Yes. Therefore, according to the eleventh aspect, the mold for molding can be made inexpensive.

(Twelfth invention)
In the luminescent device manufacturing method according to the twelfth aspect, the phosphor-containing film body is provided on the surface of the sealing material, whereby the color emitted from the upper and lower electrode type light emitting diodes can be converted into a desired color.

  FIGS. 1A to 1C show a first embodiment of the present invention, where FIG. 1A is a plan view, FIG. 1B is a cross-sectional view, and FIG. 1A to 1C, the light emitting device 11 of the first embodiment is joined or insulated by one finned heat sink substrate 12 and the one finned heat sink substrate 12 by a thermosetting adhesive 14. The other finned heat sink substrate 13 insert-molded together with the member, the upper and lower electrode type light emitting diode 15 having the lower electrode (not shown) joined on the one finned heat sink substrate 12, and the upper and lower electrode type light emitting diode 15 A plate-like conductive connecting member 16 that joins the upper electrode (without reference numeral) and the other finned heat sink substrate 13 and the finned heat sink substrates 12 and 13 are connected to each other. A cylindrical resin member 17 for irradiating light to the outside, and a transparent sealing filled in the cylindrical resin member 17 The color of the light from the upper and lower electrode type light emitting diodes 15 provided on the surface of the material 172, the irregular reflection member 18 for irregularly reflecting the light provided if necessary, and the surface of the irregular reflection member 18 as desired is desired. And at least a phosphor-containing film body 19 that converts the color of the phosphor.

  The finned heat sink substrates 12 and 13 have a large number of fins formed at the lower portion, and the upper portion is a conductive substrate on which the upper and lower electrode type light emitting diodes 15 are placed. The finned heat sink substrates 12 and 13 are joined together by, for example, a thermosetting adhesive mainly composed of a one-component or two-component epoxy resin, or an adhesive 14 made of a silicone resin. By bonding the adhesive 14 into part of the fins of the heat sink substrates 12 and 13 with fins, the bonding between them can be made stronger.

  The upper surfaces of the finned heat sink substrates 12 and 13 are plated with silver and / or gold as necessary. The silver and / or gold plating not only improves the wettability when the electrodes of the upper and lower electrode type light emitting diodes 15 and the conductive connection member 16 are joined by eutectic solder, but also reflects light efficiently. The silver and / or gold plating formed on the upper surfaces of the finned heat sink substrates 12 and 13 can simultaneously achieve three things: improvement in current conductivity, light reflectivity, and wettability of the joint. The upper and lower electrode type light emitting diode 15 has an opening for emitting light to the upper electrode, and a large area portion where the arm-like connection portions 161 and 162 of the conductive connection member 16 are easily joined.

  The conductive connecting member 16 is made of a plate-like conductive member, has two arm-shaped connecting portions 161 and 162, and an opening is formed between the arm-shaped connecting portions 161 and 162. The light radiated from the side portion of the upper and lower electrode type light emitting diode 15 is radiated to the outside through an opening formed between the arm-shaped connecting portions 161 and 162, and the light is efficiently emitted. Radiates outside. The cylindrical resin member 17 has an inclined portion 173 that reflects light inside, and the surface thereof is subjected to silver and / or gold plating to efficiently reflect light emitted from the upper and lower electrode type light emitting diodes 15.

  The shape of the cylindrical resin member 17 can be linear, circular, square, rectangular, elliptical or the like. The cylindrical resin member 17 can be insert-molded when the finned heat sink substrates 12 and 13 are injection-molded. Moreover, the said insert molding can improve the joining strength of the heat sink board | substrates 12 and 13 with a fin by making it bite into a part of fin. The cylindrical resin member 17 is filled with a transparent sealing material 172. The transparent sealing material 172 may be an elastomer type. The elastomer type resin preferably has a Shore A (rubber hardness) of 15 to 85, preferably 20 to 80. Furthermore, the transparent sealing material 172 is preferably an elastomer made of a silicon resin.

  A phosphor-containing film body 18 is provided on the surface of the transparent sealing material 172. The phosphor-containing film body 18 is selected depending on the upper and lower electrode type light emitting diode 15 to be used and the desired color of light. Further, if necessary, a diffuse reflection member 19 is disposed between the transparent sealing material 172 and the phosphor-containing film body 18 so that light from the upper and lower electrode type light emitting diodes 15 is effectively emitted in a desired direction. The In the light emitting device 11, the end portions 123 and 132 of the finned heat sink substrates 12 and 13 can serve as power terminals.

  2A and 2B show a second embodiment of the present invention, in which FIG. 2A is a sectional view of the light emitting device, and FIG. 2B is a side view. In the second embodiment, the direction of the fins 221 of the heat sink substrate 22 with fins is 90 degrees different from the first embodiment. It is desirable that the direction of the fins 221 coincide with the direction in which the wind easily passes. In the second embodiment, the cylindrical resin member 27 is insert-molded on the finned heat sink substrates 22 and 23, and then the upper and lower electrode type light emitting diodes 15 and the conductive connecting members 16 are formed on the finned heat sink substrates 22 and 23. Is attached, and the opening of the cylindrical resin member 27 is closed with the lens 24 and the phosphor-containing film body 19, and then the transparent sealing material 272 is filled from the slits 222 in the heat sink substrates 22 and 23 with fins.

  As another method, the transparent sealing material 272 may be formed by attaching the upper and lower electrode type light emitting diodes 15 and the conductive connection member 16 to the finned heat sink substrates 22 and 23 and plugging the slit 222. Filled from. Thereafter, the lens 24 and the phosphor-containing film body 19 are provided on the upper surface of the transparent sealing material 272. Since the end portions 223 and 232 of the heat sink substrates 22 and 23 with fins protrude from the cylindrical resin member 27, they can be connected to a power source or connected to other light emitting devices as power terminals.

  3A and 3B show a third embodiment of the present invention, in which FIG. 3A is a plan view of the light emitting device, and FIG. 3B is a cross-sectional view. The third embodiment differs from the first and second embodiments in that at least two upper and lower electrode type light emitting diodes are connected in parallel to two finned heat sink substrates. The finned heat sink substrates 32 and 33 are bonded with a thermosetting adhesive or bonded to each other with a cylindrical resin member 37.

  Lower electrodes of upper and lower electrode type light emitting diodes 15-1, 15-2, and 15-3 are joined to the finned heat sink substrate 32 by eutectic solder. The upper electrodes of the upper and lower electrode type light emitting diodes 15-1, 15-2 and 15-3 and the heat sink substrate 33 with fins are composed of conductive connecting members 16-1, 16-2 and 16-3 as eutectic solder. It is joined by. The cylindrical resin member 37 is elliptical in FIG. 3, but may be rectangular or square. Further, the transparent sealing material 372, the irregular reflection member 18, and the phosphor-containing film body 19 are provided in the same manner as in the first and second embodiments.

  4A and 4B show a fourth embodiment of the present invention. FIG. 4A is a cross-sectional view of the light emitting device, and FIG. 4B is a side view. The fourth embodiment is different from the first to third embodiments in that at least n upper and lower electrode type light emitting diodes are connected in series to (n + 1) finned heat sink substrates. . The cylindrical resin member 47 has, for example, a rectangular shape, and includes at least two upper and lower electrode type light emitting diodes, one of finned heat sink substrates joined to the lower electrode of the upper and lower electrode type light emitting diodes, and the upper and lower electrode type light emitting elements. A conductive connecting member that joins the upper electrode of the diode and the other of the finned heat sink substrate is accommodated. In the light emitting device 41, an electric current enters from the end 43 of the finned heat sink substrate 42-1, passes through the upper and lower electrode type light emitting diodes and the conductive connection member one after another, and the end of the finned heat sink substrate 42-4. 44 is reached.

  The light emitting device of the fourth embodiment can be a linear light source in which a plurality of upper and lower electrode type light emitting diodes are connected in series. Further, the direction of the fin of the heat sink substrate with fins can be any direction, but is preferably the same as the direction in which the upper and lower electrode type light emitting diodes are arranged in series. Since the cooling air can pass from one of the fins to the other, the heat dissipation effect can be improved.

  FIG. 5 is a plan view of a fifth embodiment of the present invention in which a plurality of upper and lower electrode type light emitting diodes are connected in series. In FIG. 5, the light emitting device includes three finned heat sink substrates 52-1, 52-2 and 52-3, two upper and lower electrode type light emitting diodes 15-1 and 15-2, a conductive connection member 16-1 It is connected in series via 16-2. The upper and lower electrode type light emitting diodes 15-1 and 15-2 are arranged so as to be point-symmetric with respect to the center point of the circular cylindrical resin member 57. The light emitting device having such an arrangement can have a high luminance as a point light source. The ends of the two finned heat sink substrates protruding from the cylindrical resin member 57 serve as power connection terminals.

  The electrodes of the upper and lower electrode type light emitting diodes have openings, and light is efficiently irradiated from above to the upper part. The opening can be variously modified in addition to the square shape, such as a square shape, a Japanese character shape, and a U shape. The size of the upper and lower electrode type light emitting diode is about 1.0 mm × 1.0 mm and the thickness is about 0.1 mm. The upper and lower electrode type light emitting diode of this embodiment can be a gallium nitride based upper and lower electrode type light emitting diode. The GaN-based upper / lower electrode type light emitting diode includes a lower electrode, a substrate formed on the lower electrode, an n-type gallium nitride-based light emitting layer formed on the substrate, and an n-type gallium nitride-based light emitting layer. The quantum well structure type active layer formed above, the p-type gallium nitride based light emitting layer formed on the quantum well structure type active layer 113-2, and formed on the p type gallium nitride based light emitting layer And an upper electrode.

  The gallium nitride upper / lower electrode type light emitting diode is characterized in that the upper electrode is provided directly on the p-type gallium nitride light emitting layer without providing a transparent conductive film. In the light emitting device, for example, the length of the heat sink substrate with fins is 90 mm, and the distance between the heat sink substrate with fins and the heat sink substrate with fins is 0.5 mm. For example, a light emitting device composed of three gallium nitride upper / lower electrode type light emitting diodes and four finned heat sink substrates is a linear light source having a length of about 300 mm. The linear light source can produce a long linear light source or a surface light source by connecting terminals in the length direction or the horizontal direction. Also, the length of the finned heat sink substrate at both ends of the light emitting device can be about half of the length of the internal finned heat sink substrate.

  FIGS. 6 (a) to 6 (e) are the sixth embodiment of the present invention, (a) is a cross-sectional view in which a cylindrical resin member is molded on a heat sink substrate, (b) is a side view of (a), and (c). (A) is a bottom view of (a), (d) is a view for explaining a state where a heat sink substrate is separated, and (e) is a completed sectional view of the light emitting device. 6 (a) to 6 (c), the finned heat sink substrate 61 includes a large number of fins 611 and a heat dissipation substrate 612 provided integrally with the fins 611. In the heat sink 61, a cylindrical resin member 62 is integrally molded by insert molding.

  In FIG. 6D, the finned heat sink substrate 61 molded by the cylindrical resin member cuts the fin 611 and the heat dissipation substrate 612 with a cutter, forms a groove 63, and two metal substrates separated from each other are formed. It is formed. Thereafter, the lower electrode of the upper and lower electrode type light emitting diode 64 is bonded to one of the metal substrates by eutectic solder. The upper electrode of the upper and lower electrode type light emitting diode 64 and the other metal substrate are joined to the plate-like conductive connecting member 65 by eutectic solder. Next, the cylindrical resin member 62 is filled with a transparent resin material 66, and if necessary, a lens 67 and / or a phosphor-containing film body 68 is provided as shown.

Comparative example

  The conventional gallium nitride upper / lower electrode type light emitting diode in which gold wires are connected by ultrasonic waves and the gallium nitride upper / lower electrode type light emitting diode of the present invention joined by eutectic solder and a metal member will be compared. In the conventional example, two gold wires with a diameter of 30 μm are used, and the failure of light emission is prevented by ultrasonic vibration of a wire bonder in which the upper electrode of the gallium nitride based upper and lower electrode type light emitting diode and the other of the package electrode are connected by ultrasonic wire bonding. About 10% of non-defective products were generated. Furthermore, when 350 mA was energized, burning due to an energization abnormality of about 4% occurred. In the examples of the present invention, no defective product was generated even in the connection step and in the energization of 350 mA to 500 mA.

  As mentioned above, although the Example of this invention was explained in full detail, this invention is not limited to the said Example. The present invention can be modified in various ways without departing from the scope of the claims. The connection of the upper and lower electrodes, metal substrate, metal member, etc. of the gallium nitride based upper and lower electrode type light emitting diode of the present invention is eutectic solder, eutectic solder paste, eutectic solder and flux, gold-tin eutectic solder paste, indium Known or well-known materials such as eutectic solder can be used. The eutectic solder includes, for example, gold and tin (20%), gold and tin (90%), gold and silica (3.15%), gold and germanium (12%), and others, tin-copper-nickel system , Tin-silver, tin-silver-copper, tin-silver-bismuth-indium, and tin-zinc eutectic solder. As the gallium nitride upper / lower electrode type light-emitting diode, cylindrical resin member, and finned heat sink substrate of the present invention, known or well-known ones can be used.

(A) to (c) are the first embodiment of the present invention, (a) is a plan view, (b) is a sectional view, and (c) is a back view. Example 1 (A) and (B) are the second embodiment of the present invention, (A) is a sectional view of the light emitting device, and (B) is a side view. (Example 2) (A) and (B) are the third embodiment of the present invention, (A) is a plan view of the light emitting device, and (B) is a sectional view. (Example 3) (A) and (B) are the fourth embodiment of the present invention, (A) is a sectional view of the light emitting device, and (B) is a side view. Example 4 In the 5th example of the present invention, it is a top view of an example which connected a plurality of upper and lower electrode type light emitting diodes in series. (Example 5) (A) to (E) are the sixth embodiment of the present invention, (A) is a front view in which a cylindrical resin member is molded on a heat sink substrate, (B) is a side view of (A), and (C) is ( (B) is a completed front view of the light emitting device. (Example 6)

Explanation of symbols

11, 21, 31, 41, 51 ... Light emitting device 12, 22, 32, 42-1 ... Heat sink substrate with fins (one side)
13, 23, 33, 42-2 ... Finned heat sink substrate (the other)
121, 221, 321, 421... Fins 131, 231, 331, 422... Fins 123, 132, 223, 232... Power supply terminal 14 .. thermosetting adhesive (silicone resin adhesive)
15, 15-1, 15-2, 15-3... Upper and lower electrode type light emitting diode (gallium nitride based upper and lower electrode type light emitting diode)
16, 16-1, 16-2, 16-3 ... conductive connecting member 161, 162 ... arm-like connecting part 17, 27, 37, 47, 57 ... cylindrical resin member 18 ... Diffuse reflection member 19 ... phosphor-containing film body

Claims (12)

At least two finned heat sink substrates separated;
Upper and lower electrode type light emitting diodes having a lower electrode joined to one of the finned heat sink substrates;
A conductive connecting member for connecting the upper electrode of the upper and lower electrode type light emitting diode and the other of the finned heat sink substrate;
A cylindrical resin member for molding a part of the finned heat sink substrate;
A sealing material filled in the cylindrical resin member;
A light emitting device comprising: A cylindrical resin member molded so that a slit is formed for at least two finned heat sink substrates;
Upper and lower electrode type light emitting diodes having a lower electrode joined to one of the finned heat sink substrates;
A conductive connecting member for connecting the upper electrode of the upper and lower electrode type light emitting diode and the other of the finned heat sink substrate;
A sealing material filled in the cylindrical body;
A light emitting device comprising:   3. The light emitting device according to claim 1, wherein n of the upper and lower electrode type light emitting diodes and (n + 1) finned heat sink substrates are connected in series by a conductive connecting member. (However, n = 2, 3,...).   4. The device according to claim 1, wherein at least two of the upper and lower electrode type light emitting diodes are connected in parallel to the two finned heat sink substrates by a conductive connection member. 5. The described light emitting device.   The bonding between one of the finned heat sink substrates and the lower electrode, the bonding between the upper electrode and the conductive connecting member, and the bonding between the conductive connecting member and the other of the finned heat sink substrate are eutectic solder. The light emitting device according to claim 1, wherein the light emitting device is used.   6. The light-emitting device according to claim 1, wherein one of the finned heat sink substrates and / or the other protrudes from a cylindrical resin member to serve as a terminal.   The direction of the fin provided in the said heat sink board | substrate with a fin is arrange | positioned in either the direction which arranges the said heat sink board | substrate with a fin, or the direction at right angles to the said direction. A light-emitting device according to claim 1.   The light emitting device according to any one of claims 1 to 7, wherein silver and / or gold plating is applied to an upper surface of the finned heat sink substrate.   8. The light emitting device according to claim 1, wherein a phosphor-containing film body is provided on a surface or inside of the sealing material. 9. An insert molding step in which at least two insulated heat sink substrates with fins are molded with resin to form a cylindrical resin member on the upper surface of the finned heat sink substrate;
Eutectic solder includes bonding of one of the heat sink substrates with fins to the lower electrode of the upper and lower electrode type light emitting diodes, and bonding of the upper electrode of the upper and lower electrode type light emitting diodes to the other of the finned heat sink substrates by a conductive connecting member. Bonding using
Filling the cylindrical resin member with a sealing material and sealing the upper and lower electrode type light emitting diodes;
A method for manufacturing a light-emitting device, comprising: An insert molding process in which one finned heat sink substrate is molded with resin to mold the cylindrical resin member on the upper surface of the finned heat sink substrate;
A step of cutting the finned heat sink substrate from the lower surface of the inserted finned heat sink substrate at the internal position of the cylindrical resin member with a cutter so as to be separated into at least two;
Bonding between one of the separated finned heat sink substrates and the lower electrode of the upper and lower electrode type light emitting diodes, and bonding between the upper electrode of the upper and lower electrode type light emitting diodes and the other of the finned heat sink substrate by a conductive connecting member, Bonding with eutectic solder;
Filling the inside of the cylindrical resin member with a sealing material, and sealing the upper and lower electrode type light emitting diodes;
A method for manufacturing a light-emitting device, comprising:   The method for manufacturing a light emitting device according to claim 10, wherein a phosphor-containing film body is provided on a surface of the sealing material.

Images