JP2008184669A - Clip, and manufacturing method therefor - Google Patents

Clip, and manufacturing method therefor Download PDF

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JP2008184669A
JP2008184669A JP2007020264A JP2007020264A JP2008184669A JP 2008184669 A JP2008184669 A JP 2008184669A JP 2007020264 A JP2007020264 A JP 2007020264A JP 2007020264 A JP2007020264 A JP 2007020264A JP 2008184669 A JP2008184669 A JP 2008184669A
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plating
clip
plating layer
microns
laser processing
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JP5130727B2 (en
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Hidetoshi Kodama
英俊 小玉
Akinori Furuichi
明典 古市
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Pentel Co Ltd
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Pentel Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a clip which shows a decorative effect without being limited by a design pattern even when having a three-dimensional shape, and has corrosion resistance (durability). <P>SOLUTION: The clip (A) is manufactured by forming multiple metal-plated layers on a substrate and also applying laser working to a plated layer except the surface plated-layer. Specifically, the manufacturing method comprises the steps of: forming a first metal-plated layer on the substrate; forming a decoration pattern having fine unevenness on the surface of the first plated layer through a laser working step; then, activating the surface of the first plated layer; and plating the substrate as a post-process. Thereby manufactured clip has corrosion resistance and shows the highly decorative effect. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、美麗で装飾的な金属めっきを形成したクリップ、およびクリップに均一で美麗で装飾的なかつ耐久性の高い金属めっきを形成する方法に関するものである。   The present invention relates to a clip formed with a beautiful and decorative metal plating, and a method for forming a uniform, beautiful, decorative and highly durable metal plating on the clip.

筆記具のクリップは、基材材料として主に炭素工具鋼やステンレス、リン青銅を用いている。これら材質の板状基材をプレス成形で曲げたり、カシメたりして所定の形状に成形し、その後、これらの金属は単独では錆びてしまうことから金属めっきを行い、耐食性の付与および装飾を行っていた。   The writing instrument clip mainly uses carbon tool steel, stainless steel, or phosphor bronze as a base material. The plate-like base material of these materials is formed by pressing or crimping into a predetermined shape, and then these metals rust by themselves, so metal plating is performed to give corrosion resistance and decoration. It was.

さらに、筆記具のクリップは、衣服のポケットに差してかがんだときに自重でポケットから滑り落ちないような適度な弾力が必要であり、弾力が弱すぎても強すぎても使い勝手が悪いものである。また、手帳等に差し込むときには、手帳の厚みに対応できるように適度な開きの変位が必要である。例えば、クリップが軸筒から3ミリ以上開いたときにクリップが折れたり、弾力が著しく小さくなってしまったりするなどの不具合があってはならないものである。   In addition, the clip of the writing instrument must have an appropriate elasticity that prevents it from slipping out of the pocket due to its own weight when bent over a pocket of clothes, and it is inconvenient whether it is too weak or too strong. . In addition, when inserting into a notebook or the like, an appropriate opening displacement is necessary so as to correspond to the thickness of the notebook. For example, there should be no inconvenience such as when the clip is opened 3 mm or more from the shaft tube, the clip is broken or the elasticity is remarkably reduced.

一方、商品の高付加価値化を目的に金やパラジウムなどの貴金属めっきを形成する場合、鉄素材などは、素材の耐食性が悪いことからめっき層を厚くしたり、多層構造にしたりすることによって耐食性を付与していた。   On the other hand, when precious metal plating such as gold or palladium is formed for the purpose of adding high value to products, the corrosion resistance of iron materials is poor due to the poor corrosion resistance of the materials, so that the plating layer is made thicker or a multilayer structure. Was granted.

また、素材にブラスト加工を行い、ベロア調の表面形態にする場合、光沢な表面にくらべ微細な凹凸を有する面が、耐食性が小さくなることが知られている。これは基材の表面に結晶学的な構造欠陥ができ、被めっき金属の析出が阻害され、結果的に均一なめっき層が形成されないため(ピンホール等の存在)と考えられている。
特に、耐食性の小さい鉄合金などは、物理的な加工(彫刻,刻印,ブラスト等)が工程に入った場合、耐食性を持たせるためめっきを厚くするだけではなく、様々な防食対策が必要であった。また、前記ブラスト加工にあっては、部分的にパターンを形成しようとした場合、加工部以外の範囲にマスキング処理を施す必要があった。そのため他の物理的な加工方法よりもコストがアップする傾向があった。
In addition, it is known that when a material is blasted into a velor-like surface form, a surface having fine unevenness compared to a glossy surface has a low corrosion resistance. This is considered to be because crystallographic structural defects are formed on the surface of the base material, the deposition of the metal to be plated is inhibited, and as a result, a uniform plating layer is not formed (existence of pinholes or the like).
In particular, for iron alloys with low corrosion resistance, when physical processing (engraving, engraving, blasting, etc.) enters the process, it is necessary not only to thicken the plating but also to take various anti-corrosion measures in order to provide corrosion resistance. It was. Further, in the blasting process, when a pattern is to be partially formed, it is necessary to perform a masking process in a range other than the processed part. Therefore, the cost tends to be higher than other physical processing methods.

前記のように、防食対策で最も効果的で実施の容易な手段としてめっき厚さを大きくする方法があるが、めっきを厚くすることによりせっかく施した物理加工面がめっき皮膜で埋まってしまい、所望の装飾効果が得られなくなってしまうという問題があった。   As mentioned above, there is a method of increasing the plating thickness as the most effective and easy means of anti-corrosion measures, but by physically increasing the plating, the physical processing surface that has been applied is filled with a plating film, which is desired. There is a problem that the decoration effect of can not be obtained.

また、クリップ部材としては、めっきが厚くなることにより曲げ弾性が得られる部分にもめっきが厚く付いてしまうことから、クリップが硬くなり結局弾力が大きすぎて持ち上げにくいという問題もあった。   Further, as the clip member, since the plating is thickly attached to the portion where the bending elasticity is obtained as the plating becomes thick, there is a problem that the clip becomes hard and eventually has too much elasticity and is difficult to lift.

さらに、めっきを厚くしすぎる弊害として、クリップの弾性変形部分において、繰り返しの持ち上げにより弾性発現部分の基材とめっき皮膜に応力が集中し、一度めっき面にクラックが入ると簡単に折れやすくなってしまうという問題もあった。   In addition, as an adverse effect of making the plating too thick, stress is concentrated on the base material and plating film of the elastically appearing portion due to repeated lifting in the elastically deformed portion of the clip, and once the plated surface cracks, it becomes easy to break. There was also a problem of end.

クリップに装飾を行う方法は、別部材となる装飾部材を取り付ける方法(特許文献1,2)とクリップ基材にあらかじめ刻印(特許文献3)を形成し、その後、めっき処理などを行う方法があった。
しかしながら、別部材を取り付ける方法(特許文献1,2)は、取り付ける部材が後で取れてしまったり、出っ張りがあることにより衣服に引っかかったりするという不具合があった。また部材を取り付けるという工程が別途必要になり、コストアップにもつながっていた。
一方、クリップ基材にあらかじめ刻印を施す方法(特許文献3)は、最も簡便な方法であるが、刻印の深さによっては、めっき後に刻印が見えにくくなってしまうという問題があった。これは、めっきが刻印の凹部にも付着するため凹部がめっき皮膜により埋められてしまうためである。これを防止するためにめっき厚さを薄くするという方法があるが、特に耐食性の小さい鉄基材を用いた場合は、めっきを薄くしてしまうと、耐食性(耐久性)に問題があり、後に赤さびが発生してしまうという問題があった。これはめっき皮膜に存在するピンホールにより基材が腐食して赤さびがピンホールから表面に出てくる現象である。一般的にめっきを厚くするとピンホールが少なくなり、耐食性が向上すると考えられている。
また、クリップ基材に凹部を形成する刻印は、作製の性質上文字の大きさや細さあるいはパターンの複雑さに制約あり、形成できる装飾パターンが限られてしまうという問題があった。
更に刻印は、クリップ基材が平らな状態でないと均一に深く凹部を形成することが出来ない。作製工程は、平らな状態で刻印を行い、その後曲げ加工やカシメ加工を行っている。よって、刻印は、曲げやカシメ部分に形成することが出来ず、限られた部分にのみしか形成出来なかった。刻印による装飾部分を大きくするには、クリップの平らな面積を大きくするしか方法がなく、よってクリップ形状デザイン自由度が小さくなるという問題があった。尚、刻印にあっては、めっき後に加工を行う方法も考えられるが、刻印は圧縮によって基材を変形させてパターン形成するため、その圧縮作用によってめっき層が割れてしまう危険性があった。めっき層が割れると耐食性が著しく損なわれるだけでなく、基材の破断の原因にもなり好ましくないものである。
特開平10−278483号公報。(飾り部材を取り付ける,寿) 特開2002−225492号公報(樹脂よりなる装飾体をつける,パイロット) 特開2001−96980号公報 (刻印,小さなドットでパターン形成,ぺんてる)
There are two methods for decorating the clip: a method of attaching a decorative member as a separate member (Patent Documents 1 and 2) and a method of forming a stamp (Patent Document 3) on the clip base material in advance and then performing a plating process or the like. It was.
However, the method of attaching another member (Patent Documents 1 and 2) has a problem in that the member to be attached is removed later or is caught on clothes due to a protrusion. Moreover, the process of attaching a member was separately required, leading to an increase in cost.
On the other hand, the method of applying the marking to the clip base material in advance (Patent Document 3) is the simplest method. However, depending on the depth of the marking, there is a problem that the marking becomes difficult to see after plating. This is because the plating adheres also to the concave portion of the stamp, and the concave portion is filled with the plating film. In order to prevent this, there is a method of reducing the plating thickness, but when using an iron base with low corrosion resistance, if the plating is thinned, there is a problem in corrosion resistance (durability). There was a problem that red rust would occur. This is a phenomenon in which the base corrodes due to pinholes existing in the plating film and red rust comes out from the pinholes to the surface. In general, thicker plating is considered to reduce pinholes and improve corrosion resistance.
In addition, the engraving for forming the recesses on the clip base material has a problem in that the size and thinness of characters or the complexity of the pattern are limited due to the properties of production, and the decorative pattern that can be formed is limited.
Further, in the engraving, the concave portions cannot be formed uniformly deep unless the clip base material is flat. In the manufacturing process, marking is performed in a flat state, and then bending or caulking is performed. Therefore, the stamp could not be formed in a bent or crimped part, but only in a limited part. The only way to increase the decorative portion by engraving is to increase the flat area of the clip, and there is a problem that the degree of freedom in designing the clip shape is reduced. In addition, although the method of processing after plating can also be considered for the marking, since the marking forms a pattern by deforming the base material by compression, there is a risk that the plating layer may be broken by the compression action. If the plating layer is cracked, not only the corrosion resistance is remarkably impaired but also the substrate is broken, which is not preferable.
Japanese Patent Application Laid-Open No. 10-278483. (Attaching decorative elements, longevity) JP 2002-225492 A (A pilot with a decorative body made of resin) JP 2001-96980 A (engraved, pattern formation with small dots, pentel)

本発明は、めっきを形成した基材の腐食や、金属めっきのはく離を防止し、3次元形状の基材に対して、複雑なパターンでも装飾が可能で長年にわたり装飾効果が保持できるクリップを提供することを目的とした。   The present invention provides a clip that can prevent corrosion of a base material on which plating is formed and peeling of metal plating, and can decorate a three-dimensional base material with a complex pattern, and can maintain a decoration effect for many years. Aimed to do.

本発明は、基材に金属めっきを多層形成すると共に、その表面めっき層以外のめっき層にレーザー加工を施したことを特徴とするクリップを第1の要旨とし、基材に金属めっきを形成する方法において、多層めっき層を形成する複数のめっき工程間にレーザー加工工程を入れることを特徴とするクリップの製造方法を第2の要旨とするものである。   The present invention has a first feature of a clip characterized in that a metal plating is formed in multiple layers on a base material, and a plating layer other than the surface plating layer is subjected to laser processing, and the metal plating is formed on the base material. In the method, a second manufacturing method of the clip is characterized in that a laser processing step is inserted between a plurality of plating steps for forming a multilayer plating layer.

本発明は、既に成形されたクリップのめっき工程の途中で部品を乾燥し、そのめっき工程の途中にレーザー加工工程を入れることにより、基材形状によらず複雑なパターンや細かいパターンが形成できることを見いだした。また、レーザー加工の後は、レーザーの熱と圧力により微細な凹凸が形成されていることを確認し、この微細な凹凸と周りのめっき面の表面状態の違いにより、形成されたパターンがより鮮明になることを見いだし、本発明を完成させたものである。
また、レーザー加工は、ある程度の焦点深度を持つことから、ある程度のアール形状、曲げ形状面でも加工が可能であり、更に、クリップ基材を自由に回転させることにより、最大限の装飾面を形成出来るという利点も有する。よって、より高い装飾性を有しかつ耐久性の高いクリップを提供することができる。
The present invention can form a complex pattern or a fine pattern regardless of the substrate shape by drying the part in the middle of the plating process of the already formed clip and putting a laser processing process in the middle of the plating process. I found it. In addition, after laser processing, it is confirmed that fine irregularities are formed by the heat and pressure of the laser, and the formed pattern becomes clearer due to the difference between the fine irregularities and the surface condition of the surrounding plating surface. The present invention has been completed.
In addition, since laser processing has a certain depth of focus, it is possible to process even a certain amount of rounded and bent surfaces, and furthermore, the maximum decorative surface can be formed by freely rotating the clip base material. It also has the advantage that it can be done. Therefore, it is possible to provide a clip having higher decorativeness and higher durability.

本発明は、基材上に銅あるいはニッケルよりなる下地めっき層を形成し、一旦、めっき処理を中断し、レーザー加工工程を介在させることにより、基材の形状によらず装飾面の大きさや装飾のパターンの制約を受けないクリップを得ることができた。そして、長期にわたり装飾効果を保持するというクリップを、少ないコストで実現した。   In the present invention, a base plating layer made of copper or nickel is formed on a base material, the plating process is temporarily interrupted, and a laser processing step is interposed. We were able to obtain a clip that was not subject to any pattern restrictions. And the clip that keeps the decoration effect for a long time was realized at a low cost.

図1は、本発明の1実施例の断面図であって、参照符号1は基材、2は下地めっき層、3はレーザー加工層、4はニッケルめっき層、5は装飾めっき層である。   FIG. 1 is a cross-sectional view of an embodiment of the present invention. Reference numeral 1 is a substrate, 2 is a base plating layer, 3 is a laser processing layer, 4 is a nickel plating layer, and 5 is a decorative plating layer.

基材1は、鉄および鉄合金、銅および銅合金からなる。具体的には、加工のし易さやめっきのし易さ、材料の単価などから鉄の場合は、炭素工具鋼、バネ鋼など、銅の場合は、リン青銅などである。
また、基材1は、切削やプレス加工、射出成形などを用いて所定の形状に作製・加工される。この作製後、加工のバリを取ったり、表面の光沢や荒さを調整するため、バレル研磨やバフ研磨、ブラスト処理などが行われる。次いで、溶剤などを用いて脱脂処理を行い、めっき工程へ供される。
The substrate 1 is made of iron and an iron alloy, copper and a copper alloy. Specifically, in terms of ease of processing, ease of plating, unit price of materials, etc., in the case of iron, carbon tool steel, spring steel, etc., in the case of copper, phosphor bronze.
Moreover, the base material 1 is produced and processed into a predetermined shape using cutting, pressing, injection molding, or the like. After this fabrication, barrel polishing, buffing, blasting, etc. are performed in order to deburr the processing and adjust the gloss and roughness of the surface. Next, degreasing treatment is performed using a solvent or the like, and the resultant is subjected to a plating process.

下地めっき層2は、本例においては銅あるいはニッケルであるが、各々それぞれの合金であっても何ら差し支えない。また、下地めっき層2は、電気めっき、或いは、無電解めっきにより基材1の表面に形成される。その下地めっき層2の厚さは、10ミクロンから50ミクロンが好ましい。また、銅めっき後にニッケルめっきを形成し、2層重なった下地めっき層としても何ら差し支えない。下地めっき層の厚さが10ミクロン未満の場合、レーザー加工条件によっては、下地めっき層が取れてしまい基材が露出し、耐食性が悪くなるという問題がある。50ミクロンを超えるとクリップの弾性反発部分が変形しにくくなり硬いクリップになり使い勝手の悪いものになるという問題がある。更にめっき処理のコストアップにもなってしまうという問題があった。   The base plating layer 2 is copper or nickel in this example, but it may be any alloy. Moreover, the base plating layer 2 is formed on the surface of the substrate 1 by electroplating or electroless plating. The thickness of the underlying plating layer 2 is preferably 10 to 50 microns. Moreover, nickel plating is formed after copper plating, and there is no problem even if it is a base plating layer in which two layers are overlapped. When the thickness of the base plating layer is less than 10 microns, depending on the laser processing conditions, there is a problem that the base plating layer is removed, the base material is exposed, and the corrosion resistance is deteriorated. If it exceeds 50 microns, there is a problem in that the elastic repulsion part of the clip is difficult to deform and becomes a hard clip, resulting in poor usability. Furthermore, there is a problem that the cost of the plating process is increased.

レーザー加工層3は、市販のYAGあるいは炭酸ガスレーザーマーキング装置を用いて形成する。レーザー加工条件は、希望する凹凸の深さや基材形状等により適宜選択されるものであり限定されるものではない。
レーザー加工は、レーザー光線をめっき表面にドット状に当てて網点を形成したり、線状に走査して文字を形成したり、線状の走査を複数回行うことによりパターンを形成し行う。
レーザー加工面は、熱により最表面の金属が一時的に溶融し、そして凝固することから微細な凹凸が形成される。この微細な凹凸と加工部以外の周りの表面状態とのコントラストによりパターンが鮮明に確認することが出来る。加工部の断面をよく観察すると、レーザー光線の軌跡に沿って、溶融し凹部となった部分の両側のめっき金属が表面より盛り上がっていることが確認できた。すなわち、レーザ加工部の凹凸断面は、めっき表面を中心にサインカーブを描くように形成されていた。よってレーザー加工部の凹凸の高低差は、山の頂点と谷の底の距離を云うものである。
レーザー加工の凹凸の高低差は、特に限定されるものではないが0.5〜20ミクロンが好ましい。これは、高低差が0.5ミクロン未満だと微細な凹凸が小さすぎて装飾パターンが認識しづらいこと、また20ミクロンを超えると下地めっき層2が取れてしまい、耐食性が悪くなったり、加工時間が長くなりコストアップになるからである。
The laser processing layer 3 is formed using a commercially available YAG or carbon dioxide laser marking device. The laser processing conditions are appropriately selected depending on the desired uneven depth, substrate shape, etc., and are not limited.
Laser processing is performed by forming a pattern by applying a laser beam to the plated surface in the form of dots, forming dots by scanning in a line, forming characters, or performing a plurality of line scans.
On the laser processed surface, the metal on the outermost surface is temporarily melted by heat and solidifies, so that fine irregularities are formed. The pattern can be clearly confirmed by the contrast between the fine irregularities and the surrounding surface state other than the processed part. When the cross section of the processed part was observed closely, it was confirmed that the plated metal on both sides of the melted concave part was raised from the surface along the locus of the laser beam. That is, the concavo-convex cross section of the laser processed portion is formed so as to draw a sine curve around the plating surface. Therefore, the height difference of the irregularities in the laser processed portion refers to the distance between the peak of the mountain and the bottom of the valley.
The height difference of the irregularities in laser processing is not particularly limited, but is preferably 0.5 to 20 microns. This is because if the height difference is less than 0.5 microns, the fine irregularities are too small to recognize the decoration pattern, and if it exceeds 20 microns, the base plating layer 2 can be removed, resulting in poor corrosion resistance or processing. This is because time is increased and costs are increased.

ニッケルめっき層4は、上記のレーザー加工工程を経た後、電気めっきにより形成される。下地めっき層2の表面形態をそのまま生かしたい場合は、無光沢または半光沢のニッケルめっきを形成する。金属光沢感が必要な場合は、光沢ニッケルめっきを形成する。ニッケルめっき層4の厚さは、3ミクロン以上が好ましい。
またニッケルめっき層4は、単独光沢のめっきでも何ら差し支えないが、無光沢、半光沢、光沢のめっきを3層形成しても良いし、3つの内2つを選択して形成しても良い。但し、耐食性の観点から、めっきを形成する順序としては、無光沢、半光沢、光沢の順であり、これを逆転させてはならない。
ニッケルめっき層4は、レーザー加工工程を経た後行うことから、加工表面の金属酸化物や金属スラッジを除去するため活性化が必要である。アルカリによる脱脂、酸活性の後ストライク銅あるいはストライクニッケルめっきを行った後、前記のニッケルめっき層を形成するのが好ましい。
The nickel plating layer 4 is formed by electroplating after the above laser processing step. When the surface form of the base plating layer 2 is desired to be used as it is, a matte or semi-glossy nickel plating is formed. When a metallic luster is required, bright nickel plating is formed. The thickness of the nickel plating layer 4 is preferably 3 microns or more.
The nickel plating layer 4 may be a single gloss plating, but three layers of matte, semi-gloss and gloss may be formed, or two of the three may be selected and formed. . However, from the viewpoint of corrosion resistance, the plating is formed in the order of matte, semi-gloss, and gloss and should not be reversed.
Since the nickel plating layer 4 is performed after the laser processing step, activation is necessary to remove metal oxide and metal sludge on the processed surface. The nickel plating layer is preferably formed after degreasing with an alkali and acid activation followed by strike copper or strike nickel plating.

前記装飾めっき層5は、金やパラジウム、プラチナ(白金)等の貴金属めっき、及び、クロム、スズ−ニッケル合金等、現在装飾で用いられているめっきを形成すれば良い。特に貴金属めっきを形成する場合は、貴金属めっきを行った後に電解クロメート処理を行うのが好ましい。   The decorative plating layer 5 may be formed of a noble metal plating such as gold, palladium, or platinum (platinum), or a plating that is currently used for decoration, such as chromium or tin-nickel alloy. In particular, when forming noble metal plating, it is preferable to perform electrolytic chromate treatment after the noble metal plating.

本発明は、筆記具の軸はもちろん装飾品などのクリップ部品に使用できる。   The present invention can be used for clip parts such as ornaments as well as shafts of writing instruments.

(実施例1)
炭素工具鋼の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ1ミリサイズで断面形状が五角形で正面から見ると真ん中に稜線がある剣型のクリップを作製した。加工のバリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、銅めっきを10ミクロン、次にニッケルめっきを15ミクロン形成した。水洗・乾燥の後、前記ニッケルめっき層の表面を線状に複数回レーザー光線を走査し、稜線を挟んで両側の斜面にパターン状にレーザー加工を行った。このときの凹凸の高低差は10ミクロンであった。その後、公知の方法でめっき前処理・活性化を行い、ストライクニッケルめっきを形成し、半光沢ニッケルめっき層を5ミクロン形成後、パラジウムめっき層を1ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
(Example 1)
A carbon tool steel plate was pressed to produce a sword-shaped clip with a length of 40 mm, a width of 3 mm, and a thickness of 1 mm, a pentagonal cross-sectional shape and a ridge line in the middle when viewed from the front. Barrel polishing was performed for deburring and polishing of the surface, and this was used for plating. After performing a known plating pretreatment, a copper plating was formed to 10 microns, and then a nickel plating was formed to 15 microns. After washing and drying, the surface of the nickel plating layer was scanned linearly with a laser beam several times, and laser processing was performed in a pattern on both slopes across the ridgeline. At this time, the height difference of the unevenness was 10 microns. Thereafter, plating pretreatment and activation were performed by a known method to form strike nickel plating, a semi-bright nickel plating layer was formed to 5 microns, and then a palladium plating layer was formed to 1 micron. Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(実施例2)
リン青銅の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ1ミリサイズで断面形状がかまぼこ型のクリップを作製した。加工のバリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、ニッケルめっきを10ミクロン形成した。水洗・乾燥の後、前記ニッケルめっき層の表面を線状に複数回レーザー光線を走査し、かまぼこのアール形状部のアール全面にパターン状にレーザー加工を行った。このときの凹凸の高低差は5ミクロンであった。その後、公知の方法でめっき前処理・活性化を行い、ストライクニッケルめっきを形成し、光沢ニッケルめっき層を5ミクロン形成後、金めっき層を1ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
(Example 2)
A phosphor bronze plate was pressed to produce a kamaboko-shaped clip having a length of 40 mm, a width of 3 mm, and a thickness of 1 mm. Barrel polishing was performed for deburring and polishing of the surface, and this was used for plating. After performing known plating pretreatment, nickel plating was formed to 10 microns. After washing with water and drying, the surface of the nickel plating layer was scanned linearly with a laser beam a plurality of times, and laser processing was performed in a pattern on the entire surface of the round shape portion of the kamaboko. At this time, the height difference of the unevenness was 5 microns. Thereafter, plating pretreatment and activation were performed by a known method to form strike nickel plating, a bright nickel plating layer was formed to 5 microns, and then a gold plating layer was formed to 1 micron. Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(実施例3)
炭素工具鋼の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ1ミリサイズで断面形状が五角形で正面から見ると真ん中に稜線がある剣型のクリップを作製した。加工のバリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、銅めっきを10ミクロン、次にニッケルめっきを20ミクロン形成した。水洗・乾燥の後、前記ニッケルめっき層の表面を線状に複数回レーザー光線を走査し、稜線を挟んで両側の斜面にパターン状にレーザー加工を行った。このときの凹凸の高低差は20ミクロンであった。その後、公知の方法でめっき前処理・活性化を行い、ストライクニッケルめっきを形成し、無光沢、半光沢の純にそれぞれニッケルめっき層を5ミクロン形成後、プラチナめっき層を0.5ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
(Example 3)
A carbon tool steel plate was pressed to produce a sword-shaped clip with a length of 40 mm, a width of 3 mm, and a thickness of 1 mm, a pentagonal cross-sectional shape and a ridge line in the middle when viewed from the front. Barrel polishing was performed for deburring and polishing of the surface, and this was used for plating. After performing a known plating pretreatment, a copper plating was formed to 10 microns, and then a nickel plating was formed to 20 microns. After washing and drying, the surface of the nickel plating layer was scanned linearly with a laser beam several times, and laser processing was performed in a pattern on both slopes across the ridgeline. At this time, the height difference of the unevenness was 20 microns. Then, plating pretreatment and activation were performed by a known method to form a strike nickel plating, and after forming a nickel plating layer of 5 microns for matte and semi-glossy pure, a platinum plating layer of 0.5 microns was formed. . Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(実施例4)
リン青銅の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ1ミリサイズで断面形状がかまぼこ型のクリップを作製した。加工のバリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、ニッケルめっきを50ミクロン形成した。水洗・乾燥の後、前記ニッケルめっき層の表面を線状に複数回レーザー光線を走査し、かまぼこのアール形状部のアール全面にパターン状にレーザー加工を行った。このときの凹凸の高低差は0.5ミクロンであった。その後、公知の方法でめっき前処理・活性化を行い、ストライクニッケルめっきを形成し、無光沢ニッケルめっき層を3ミクロン形成後、パラジウムめっき層を1ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
Example 4
A phosphor bronze plate was pressed to produce a kamaboko-shaped clip having a length of 40 mm, a width of 3 mm, and a thickness of 1 mm. Barrel polishing was performed for deburring and polishing of the surface, and this was used for plating. After performing known plating pretreatment, nickel plating was formed to 50 microns. After washing with water and drying, the surface of the nickel plating layer was scanned linearly with a laser beam a plurality of times, and laser processing was performed in a pattern on the entire surface of the round shape portion of the kamaboko. At this time, the height difference of the unevenness was 0.5 microns. Thereafter, plating pretreatment and activation were performed by a known method to form strike nickel plating, a matte nickel plating layer was formed to 3 microns, and then a palladium plating layer was formed to 1 micron. Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(実施例5)
炭素工具鋼の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ1ミリサイズで断面形状が五角形で正面から見ると真ん中に稜線がある剣型のクリップを作製した。加工のバリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、銅めっきを10ミクロン、次にニッケルめっきを40ミクロン形成した。水洗・乾燥の後、前記ニッケルめっき層の表面を線状に複数回レーザー光線を走査し、稜線を挟んで両側の斜面にパターン状にレーザー加工を行った。このときの凹凸の高低差は20ミクロンであった。その後、公知の方法でめっき前処理・活性化を行い、ストライクニッケルめっきを形成し、無光沢、半光沢、光沢の純にそれぞれニッケルめっき層を3ミクロン形成後、パラジウムめっき層を1ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
(Example 5)
A carbon tool steel plate was pressed to produce a sword-shaped clip with a length of 40 mm, a width of 3 mm, and a thickness of 1 mm, a pentagonal cross-sectional shape and a ridge line in the middle when viewed from the front. Barrel polishing was performed for deburring and polishing of the surface, and this was used for plating. After performing a known plating pretreatment, a copper plating was formed to 10 microns, and then a nickel plating was formed to 40 microns. After washing and drying, the surface of the nickel plating layer was scanned linearly with a laser beam several times, and laser processing was performed in a pattern on both slopes across the ridgeline. At this time, the height difference of the unevenness was 20 microns. Then, plating pretreatment and activation were performed by a known method to form strike nickel plating, and after forming a nickel plating layer of 3 microns for matte, semi-glossy and glossy, a palladium plating layer was formed of 1 micron. . Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(実施例6)
炭素工具鋼の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ1ミリサイズで断面形状が五角形で正面から見ると真ん中に稜線がある剣型のクリップを作製した。加工のバリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、銅めっきを5ミクロン形成した。水洗・乾燥の後、前記銅めっき層の表面を線状に複数回レーザー光線を走査し、稜線を挟んで両側の斜面にパターン状にレーザー加工を行った。このときの凹凸の高低差は5ミクロンであった。その後、公知の方法でめっき前処理・活性化を行い、ストライクニッケルめっきを形成し、半光沢ニッケルめっき層を3ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
(Example 6)
A carbon tool steel plate was pressed to produce a sword-shaped clip with a length of 40 mm, a width of 3 mm, and a thickness of 1 mm, a pentagonal cross-sectional shape and a ridge line in the middle when viewed from the front. Barrel polishing was performed for deburring and polishing of the surface, and this was used for plating. After performing a known plating pretreatment, a copper plating of 5 microns was formed. After rinsing and drying, the surface of the copper plating layer was scanned with a laser beam a plurality of times in a linear manner, and laser processing was performed in a pattern on both slopes across the ridgeline. At this time, the height difference of the unevenness was 5 microns. Thereafter, plating pretreatment and activation were performed by a known method to form strike nickel plating, and a semi-bright nickel plating layer was formed to 3 microns. Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(実施例7)
リン青銅の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ1ミリサイズで断面形状がかまぼこ型のクリップを作製した。加工のバリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、ニッケルめっきを60ミクロン形成した。水洗・乾燥の後、前記ニッケルめっき層の表面を線状に複数回レーザー光線を走査し、かまぼこのアール形状部のアール全面にパターン状にレーザー加工を行った。このときの凹凸の高低差は0.5ミクロンであった。その後、公知の方法でめっき前処理・活性化を行い、ストライクニッケルめっきを形成し、パラジウムめっき層を1ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
(Example 7)
A phosphor bronze plate was pressed to produce a kamaboko-shaped clip having a length of 40 mm, a width of 3 mm, and a thickness of 1 mm. Barrel polishing was performed for deburring and polishing of the surface, and this was used for plating. After performing known plating pretreatment, nickel plating was formed to 60 microns. After washing with water and drying, the surface of the nickel plating layer was scanned linearly with a laser beam a plurality of times, and laser processing was performed in a pattern on the entire surface of the round shape portion of the kamaboko. At this time, the height difference of the unevenness was 0.5 microns. Thereafter, plating pretreatment and activation were performed by a known method to form strike nickel plating, and a palladium plating layer was formed to 1 micron. Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(実施例8)
炭素工具鋼の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ1ミリサイズで断面形状が五角形で正面から見ると真ん中に稜線がある剣型のクリップを作製した。加工のバリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、銅めっきを20ミクロン、次にニッケルめっきを50ミクロン形成した。水洗・乾燥の後、前記銅めっき層の表面を線状に複数回レーザー光線を走査し、稜線を挟んで両側の斜面にパターン状にレーザー加工を行った。このときの凹凸の高低差は2ミクロンであった。その後、公知の方法でめっき前処理・活性化を行い、ストライクニッケルめっきを形成し、半光沢ニッケルめっき層を1ミクロン形成後、パラジウムめっき層を1ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
(Example 8)
A carbon tool steel plate was pressed to produce a sword-shaped clip with a length of 40 mm, a width of 3 mm, and a thickness of 1 mm, a pentagonal cross-sectional shape and a ridge line in the middle when viewed from the front. Barrel polishing was performed for deburring and polishing of the surface, and this was used for plating. After performing a known plating pretreatment, a copper plating was formed to 20 microns, and then a nickel plating was formed to 50 microns. After rinsing and drying, the surface of the copper plating layer was scanned with a laser beam a plurality of times in a linear manner, and laser processing was performed in a pattern on both slopes across the ridgeline. At this time, the height difference of the unevenness was 2 microns. Thereafter, plating pretreatment and activation were performed by a known method to form strike nickel plating, a semi-bright nickel plating layer was formed to 1 micron, and then a palladium plating layer was formed to 1 micron. Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(比較例1)
炭素工具鋼の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ0.8ミリサイズの板状のクリップを作製した。生地の平板の状態で刻印を行い、刻印の深さは0.5ミリであった。その後曲げ加工などのプレス成形を行い、クリップ形状とした。バリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、銅めっきを10ミクロン、次に光沢ニッケルめっきを15ミクロン、最後にパラジウムめっき層を1ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
(Comparative Example 1)
A plate of carbon tool steel was pressed to produce a plate-like clip having a length of 40 mm, a width of 3 mm, and a thickness of 0.8 mm. Stamping was performed in the state of a flat plate of fabric, and the depth of the stamping was 0.5 mm. Thereafter, press forming such as bending was performed to obtain a clip shape. Barrel polishing was performed for deburring and surface polishing, and plating was performed. After performing a known plating pretreatment, copper plating was formed to 10 microns, then bright nickel plating was formed to 15 microns, and finally a palladium plating layer was formed to 1 micron. Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(比較例2)
炭素工具鋼の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ0.8ミリサイズの板状のクリップを作製した。生地の平板の状態で刻印を行い、刻印の深さは0.5ミリであった。その後曲げ加工などのプレス成形を行い、クリップ形状とした。バリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、銅めっきを5ミクロン、次に光沢ニッケルめっきを3ミクロン、最後にパラジウムめっき層を1ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
(Comparative Example 2)
A plate of carbon tool steel was pressed to produce a plate-like clip having a length of 40 mm, a width of 3 mm, and a thickness of 0.8 mm. Stamping was performed in the state of a flat plate of fabric, and the depth of the stamping was 0.5 mm. Thereafter, press forming such as bending was performed to obtain a clip shape. Barrel polishing was performed for deburring and surface polishing, and plating was performed. After performing a known plating pretreatment, copper plating was formed to 5 microns, then bright nickel plating was formed to 3 microns, and finally a palladium plating layer was formed to 1 micron. Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(比較例3)
炭素工具鋼の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ0.8ミリサイズの板状のクリップを作製した。生地の平板の状態で刻印を行い、刻印の深さは0.5ミリであった。その後曲げ加工などのプレス成形を行い、クリップ形状とした。バリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、銅めっきを20ミクロン、次に光沢ニッケルめっきを100ミクロン、最後にパラジウムめっき層を1ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
(Comparative Example 3)
A plate of carbon tool steel was pressed to produce a plate-like clip having a length of 40 mm, a width of 3 mm, and a thickness of 0.8 mm. Stamping was performed in the state of a flat plate of fabric, and the depth of the stamping was 0.5 mm. Thereafter, press forming such as bending was performed to obtain a clip shape. Barrel polishing was performed for deburring and surface polishing, and plating was performed. After performing a known plating pretreatment, copper plating was formed to 20 microns, then bright nickel plating was formed to 100 microns, and finally a palladium plating layer was formed to 1 micron. Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(比較例4)
リン青銅の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ0.8ミリサイズの板状のクリップを作製した。生地の平板の状態で刻印を行い、刻印の深さは0.5ミリであった。その後曲げ加工などのプレス成形を行い、クリップ形状とした。バリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、光沢ニッケルめっきを80ミクロン、最後にパラジウムめっき層を1ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
(Comparative Example 4)
A phosphor bronze plate was pressed to produce a plate-like clip having a length of 40 mm, a width of 3 mm, and a thickness of 0.8 mm. Stamping was performed in the state of a flat plate of fabric, and the depth of the stamping was 0.5 mm. Thereafter, press forming such as bending was performed to obtain a clip shape. Barrel polishing was performed for deburring and surface polishing, and plating was performed. After performing a known plating pretreatment, bright nickel plating was formed to 80 microns, and finally a palladium plating layer was formed to 1 micron. Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(比較例5)
リン青銅の板をプレス加工し、長さ40ミリ、幅3ミリ、厚さ0.8ミリサイズの板状のクリップを作製した。生地の平板の状態で刻印を行い、刻印の深さは0.3ミクロンであった。その後曲げ加工などのプレス成形を行い、クリップ形状とした。バリ取りと表面の研磨のためバレル研磨を行い、めっきに供した。公知のめっき前処理を行った後、光沢ニッケルめっきを10ミクロン、最後にパラジウムめっき層を1ミクロン形成した。次に、電解クロメート処理を行い、純水で洗浄後乾燥した。
(Comparative Example 5)
A phosphor bronze plate was pressed to produce a plate-like clip having a length of 40 mm, a width of 3 mm, and a thickness of 0.8 mm. Stamping was performed in the state of a flat plate of the fabric, and the depth of the stamping was 0.3 microns. Thereafter, press forming such as bending was performed to obtain a clip shape. Barrel polishing was performed for deburring and surface polishing, and plating was performed. After performing a known plating pretreatment, a bright nickel plating was formed to 10 microns, and finally a palladium plating layer was formed to 1 micron. Next, an electrolytic chromate treatment was performed, washed with pure water and dried.

(クリップの評価結果)
パターンの鮮明さは、目視で観察しパターンが良く認識できるものを良好、パターンが不鮮明なものを不鮮明と表現した。
クリップ弾力は、600グラム±100グラムを最適値とし、これより小さいものを柔らかい、大きいものを硬いと表現した。柔らかいものであると、クリップの挟持物に対する挟持力が弱く、直ぐに離脱してしまい、硬いものであると、挟持させる際に、クリップを軸筒から離脱させることが困難となる。
めっきクラックは、クリップを軸筒より3ミリの高さまで持ち上げ、その後外観をルーペで観察し、クラックの発生の有無を確認した。
耐食性は、塩水噴霧試験(JISZ2371(2000))を用いて評価した。
評価方法は、24時間ごとに腐食の発生状況を目視で確認した。最長で96時間まで実施した。その結果を表1に示す。
(Clip evaluation result)
The sharpness of the pattern was expressed as good when the pattern was recognized by visual observation, and that when the pattern was unclear was expressed as unclear.
The clip elasticity was expressed as 600 grams ± 100 grams as an optimum value, and smaller ones were expressed as soft and larger ones were expressed as hard. If it is soft, the clamping force of the clip against the sandwiched object is weak and will be released immediately. If it is hard, it will be difficult to remove the clip from the shaft tube when clamping.
As for the plating crack, the clip was lifted to a height of 3 mm from the shaft tube, and then the appearance was observed with a loupe to confirm the presence or absence of the crack.
Corrosion resistance was evaluated using a salt spray test (JISZ2371 (2000)).
The evaluation method visually confirmed the occurrence of corrosion every 24 hours. The maximum time was 96 hours. The results are shown in Table 1.

Figure 2008184669

※1 ただしクリップの変位耐久試験10,000回でクリップが折れてしまった。
Figure 2008184669

* 1 However, the clip broke after 10,000 displacement endurance tests.

本発明のクリップの正面図。The front view of the clip of this invention. 図1の斜視図。The perspective view of FIG. 図2の要部断面拡大図。The principal part cross-sectional enlarged view of FIG. 本発明を示す断面図(模式図)。Sectional drawing (schematic diagram) showing the present invention.

符号の説明Explanation of symbols

A クリップ
1 金属基材
2 下地めっき層(レーザー加工層)
3 レーザー領域
4 ニッケルめっき層
5 装飾めっき層
A clip 1 metal base 2 ground plating layer (laser processed layer)
3 Laser region 4 Nickel plating layer 5 Decorative plating layer

Claims (5)

基材に金属めっきを多層形成すると共に、その表面めっき層以外のめっき層にレーザー加工を施したことを特徴とするクリップ。 A clip characterized in that metal plating is formed in multiple layers on a base material, and laser processing is applied to a plating layer other than the surface plating layer. 基材に金属めっきを形成する方法において、多層めっき層を形成する複数のめっき工程間にレーザー加工工程を入れることを特徴とするクリップの製造方法。 A method for producing a clip, comprising: forming a metal plating on a substrate; and inserting a laser processing step between a plurality of plating steps for forming a multilayer plating layer. 前記基材が鉄および鉄合金または銅および銅合金であることを特徴とする請求項1、或いは、請求項2記載のクリップ、及び、そのクリップの製造方法。 The clip according to claim 1 or 2, wherein the base material is iron and an iron alloy, or copper and a copper alloy, and a method for manufacturing the clip. 前記レーザー加工を行うめっき層が銅またはニッケルであることを特徴とする請求項1〜請求項3の何れかに記載のクリップ、及び、そのクリップの製造方法。 The clip according to any one of claims 1 to 3, wherein the plating layer for performing laser processing is copper or nickel, and a method for manufacturing the clip. 前記レーザー加工を行うめっき層の厚さが10ミクロン以上50ミクロン以下であることを特徴とする請求項1〜請求項4の何れかに記載のクリップ、及び、そのクリップの製造方法。 The clip according to any one of claims 1 to 4, and a manufacturing method of the clip, wherein the thickness of the plating layer on which the laser processing is performed is 10 microns or more and 50 microns or less.
JP2007020264A 2007-01-31 2007-01-31 clip Expired - Fee Related JP5130727B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019011503A (en) * 2017-06-30 2019-01-24 三菱マテリアル株式会社 Anticorrosion terminal material, manufacturing method thereof, anticorrosion terminal and wire terminal part structure
JP2019011504A (en) * 2017-06-30 2019-01-24 三菱マテリアル株式会社 Anticorrosion terminal material, manufacturing method thereof, anticorrosion terminal and wire terminal part structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02115390A (en) * 1988-10-24 1990-04-27 Casio Comput Co Ltd Plated synthetic resin member and its plating method
JPH0442123A (en) * 1990-06-07 1992-02-12 Hakko:Kk Satin surface forming method of spectacle frame made of metal by using irradiation method with laser
JPH07118890A (en) * 1993-10-19 1995-05-09 Dainippon Printing Co Ltd Production of embossing pattern for wood grain pattern
JPH11301190A (en) * 1998-04-21 1999-11-02 Kawai Kako:Kk Decorative part and its manufacture
JP2002146592A (en) * 2000-11-14 2002-05-22 Toto Ltd Display method for mark and its product

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02115390A (en) * 1988-10-24 1990-04-27 Casio Comput Co Ltd Plated synthetic resin member and its plating method
JPH0442123A (en) * 1990-06-07 1992-02-12 Hakko:Kk Satin surface forming method of spectacle frame made of metal by using irradiation method with laser
JPH07118890A (en) * 1993-10-19 1995-05-09 Dainippon Printing Co Ltd Production of embossing pattern for wood grain pattern
JPH11301190A (en) * 1998-04-21 1999-11-02 Kawai Kako:Kk Decorative part and its manufacture
JP2002146592A (en) * 2000-11-14 2002-05-22 Toto Ltd Display method for mark and its product

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019011503A (en) * 2017-06-30 2019-01-24 三菱マテリアル株式会社 Anticorrosion terminal material, manufacturing method thereof, anticorrosion terminal and wire terminal part structure
JP2019011504A (en) * 2017-06-30 2019-01-24 三菱マテリアル株式会社 Anticorrosion terminal material, manufacturing method thereof, anticorrosion terminal and wire terminal part structure

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