JP2008177390A - Method and system for manufacturing semiconductor device, as well as semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and system for manufacturing a semiconductor device, as well as the semiconductor device manufactured thereby, in which production management is easy and the occurrence of assembly failures can be prevented without the enlargement of an apparatus by division by rank. <P>SOLUTION: After dicing a wafer, a clip ring is attached to a mount tape. While the mount tape is expanded so as to set apart individualized semiconductor chips mutually, the semiconductor chips of rank A are die-bonded according to map data among the semiconductor chips on the mount tape. A plurality of mount rings in which die bonding of rank A chips is finished are housed in a carrier magazine while the clip ring is mounted. In response to the assembly request of rank B chips, the mount ring is retrieved from the carrier magazine, the semiconductor chips of rank B are die-bonded according to map data among the semiconductor chips on the mount tape. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a semiconductor device manufacturing method and a semiconductor device, and more particularly to a manufacturing method and system for efficiently assembling a semiconductor device, and a semiconductor device manufactured thereby.

  In a conventional method of manufacturing a semiconductor device, first, after forming a large number of semiconductor circuits on a wafer by a wafer process, the electrical characteristics of each semiconductor circuit are measured in the wafer state, and defective semiconductor circuits are marked with ink. . Next, dicing (scribing) is performed in a state where the wafer is attached to a mount tape (also referred to as dicing tape or expanded tape) to divide each semiconductor circuit into individual semiconductor chips (dies). The entire mounting tape is stretched (expanded) so that the semiconductor chips are separated from each other, and only non-defective products without ink marks are selected (pickup) and bonded (bonded to the lead frame or package to be bonded). Individual semiconductor devices are obtained by performing assembly and assembly.

  In the above manufacturing method, assembly is performed based only on pass / fail judgment. However, in order to realize lean and highly profitable productivity, each semiconductor chip is based on predetermined characteristic values obtained by electrical tests. It is effective to classify them into a plurality of ranks (ranking) and assemble them for each rank. For example, when the semiconductor circuit is a microprocessor or a memory, ranking is performed based on the operating speed and power consumption as characteristic values. In addition, when the semiconductor circuit is an image sensor, ranking is performed based on the number of defective pixels and smear characteristics. Techniques relating to this ranking are disclosed in Patent Documents 1 to 3.

  Patent Document 1 discloses a technique in which a plurality of conveyance rails for conveying a lead frame are prepared, and die bonding is performed while semiconductor chips picked up from a mount tape are distributed to the respective conveyance rails according to ranks.

  In Patent Document 2, a chip stocker is prepared, and a semiconductor chip is picked up from a mount tape and die-bonded immediately according to the rank, and once it is stored in the chip stocker and then die-bonded to another lead frame. A technique for sorting out what to do is disclosed.

In Patent Document 3, after picking up a semiconductor chip of a desired rank from the mount tape and performing die bonding, the remaining semiconductor chip is stored on the mount tape, and when performing die bonding of another rank, A technique for picking up a semiconductor chip from the mount tape is disclosed again.
JP-A-7-193093 JP 2004-214453 A JP-A-8-97258

  However, in the method described in Patent Document 1, it is necessary to prepare as many transport rails as the number of ranks, and there is a problem that the apparatus becomes large. Further, in the method described in Patent Document 2, since the number of chips for each rank in one wafer is not constant, it is necessary to prepare a large-capacity chip stocker. There is a problem that production management is not easy such as mixing. In the method described in Patent Document 3, the above-mentioned problem does not occur, but the expansion of the mounting tape is performed by what is called an expanding device. A semiconductor chip remaining after die bonding of a semiconductor chip of a desired rank is used. When storing while attached to the mounting tape, the expansion by the expanding device is released and the mounting tape loosens, so that adjacent semiconductor chips come into contact with each other and chip chipping or foreign matter adhesion occurs, resulting in assembly failure There is.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and a semiconductor device manufacturing method that can easily manage production and prevent the occurrence of assembly failures without increasing the size of the device by ranking. It is an object to provide a system and a semiconductor device manufactured thereby.

  In order to achieve the above object, a method of manufacturing a semiconductor device according to the present invention performs a characteristic inspection on a plurality of semiconductor circuits formed on a wafer, and at least a first rank and a first rank of each semiconductor circuit with respect to a predetermined characteristic value. A wafer test process for generating map data in which the rank and coordinate position of each semiconductor circuit are associated with each other, and a wafer mount for attaching the wafer on a mount tape held by a mount ring A dicing step of dicing the wafer on the mounting tape to divide each semiconductor circuit into individual semiconductor chips, and mounting a clip ring on the mounting tape so that the semiconductor chips are separated from each other. Based on the mount tape expansion process for expanding the mount tape and the map data, the map A first die bonding step of die-bonding a first rank semiconductor chip among the semiconductor chips on the tape, and a plurality of the mounting rings after the first die bonding step are mounted on a carrier magazine while the clip ring is mounted. A mount ring accommodating step of accommodating, and a second die bonding step of taking out the mount ring from the carrier magazine and die-bonding a second rank semiconductor chip among the semiconductor chips on the mount tape based on the map data; , Including.

  In addition, it is preferable that the said clip ring consists of two large and small rings which differ in a diameter and fit mutually.

  In the mount ring accommodation step, the carrier magazine is preferably stored in a nitrogen atmosphere.

  In the first and second die bonding processes, the semiconductor chip is peeled by penetrating a plurality of needles from the back side of the mount tape, and the peeled semiconductor chip is sucked by an adsorber to be used as a lead frame or a package. It is preferable to transfer it upward.

  Moreover, it is preferable that the said semiconductor circuit is a solid-state image sensor.

  The semiconductor device of the present invention is manufactured by any one of the above manufacturing methods.

  In order to achieve the above object, a semiconductor device manufacturing system according to the present invention performs a characteristic inspection on a plurality of semiconductor circuits formed on a wafer, and at least a first rank and a first rank of each semiconductor circuit with respect to a predetermined characteristic value. A wafer test apparatus that generates map data that is classified into two ranks and associates the rank and coordinate position of each semiconductor circuit, a wafer mount apparatus that adheres the wafer onto a mount tape, and the mount tape A dicing apparatus for dicing the wafer above to divide each semiconductor circuit into individual semiconductor chips, and a mount for attaching the clip ring to the mount tape and extending the mount tape so that the semiconductor chips are separated from each other The clip ring is mounted based on the tape expansion device and the map data A pickup device for picking up the semiconductor chip on the serial mount tape, the mount tape, characterized in that it comprises a mounting tape holding devices to be accommodated in the carrier magazine while wearing the clip ring.

  Preferably, the mount tape storage device stores the mount tape in the carrier magazine between the pickup for the first rank semiconductor chip and the pickup for the second rank semiconductor chip by the pickup device. .

  The carrier magazine can accommodate a plurality of mount tapes, and the pickup for the first rank semiconductor chip is continuously performed on the plurality of mount tapes, and the second rank It is preferable that pick-up for the semiconductor chip is continuously performed for the plurality of mount tapes.

  According to the present invention, after die bonding of the first rank semiconductor chip is completed, the clip is attached to the carrier magazine while holding the expansion of the mount tape, so that the semiconductor chips on the mount tape do not contact each other. Chip chipping and adhesion of foreign matter are prevented, and die bonding of the second rank semiconductor chip can be performed while maintaining the quality. That is, according to the present invention, the production management is easy and the occurrence of assembly failure can be prevented without increasing the size of the apparatus by ranking.

  In FIG. 1, a wafer 10 is made of a silicon single crystal substrate, and a plurality of semiconductor circuits 10a are formed on the surface thereof in a lattice shape by a wafer process. The mount ring 11 is an annular metal plate. The mount tape 12 is a circular film having elasticity and having an adhesive surface 12a formed on one surface.

  The mount tape 12 covers the frame of the mount ring 11 and is bonded so that the outer edge portion of the adhesive surface 12a is in contact with the back surface side of the mount ring 11. The central portion of the adhesive surface 12a is attached to the back surface side of the wafer 10 (non- Device surface) is attached. The wafer 10 is diced while being held by the mount tape 12 and the mount ring 11.

  In FIG. 2, a wafer 10 is held by a mount tape 12 and a mount ring 11, and a semiconductor circuit 10a is separated into individual semiconductor chips 10b by dicing. The small ring 13 and the large ring 14 constitute a clip ring (expansion holding means) for holding the semiconductor chip 10b in a stretched state so as to be separated from each other. The small ring 13 and the large ring 14 are plastic annular rings. The inner diameter of the small ring 13 is larger than the outer shape of the wafer 10, and the inner diameter of the large ring 14 is substantially the same as the outer diameter of the small ring 13. Further, the outer diameter of the large ring 14 is smaller than the inner diameter of the mount ring 11.

  The small ring 13 is arranged on the back surface side of the mount tape 12, the large ring 14 is arranged on the front surface side (adhesive surface 12a side) of the mount tape 12, and the small ring 13 is expanded with the expansion device not shown. By fitting 13 and the large ring 14, the mount tape 12 can be held in an expanded state. As shown in FIG. 3, a concave portion 13 a is formed on the outer surface of the small ring 13, and a convex portion 14 a corresponding to the concave portion 13 a is formed on the inner surface of the large ring 14. When fitting the small ring 13 and the large ring 14, the concave portion 13 a and the convex portion 14 a are engaged via the mount tape 12, and the engagement force between the small ring 13 and the large ring 14 is increased.

  Next, a method for manufacturing a semiconductor device according to the present invention will be described with reference to the flowchart of FIG. The wafer 10 on which the semiconductor circuit 10a is formed by the wafer process is subjected to an electrical test (characteristic inspection) by a wafer test apparatus (not shown), and each semiconductor circuit 10a is determined based on a predetermined characteristic value obtained by the test. , A rank product (excellent), B rank product (good), or defective product. As shown in FIG. 5, the test result is map data in which the rank (1: A rank product, 2: B rank product, 0: defective product) of each semiconductor circuit 10a is associated with the coordinate position (XY position). Is recorded in the server together with the identification information of the wafer 10 (step S1). The identification information of the wafer 10 is written at the end of the wafer 10.

  Next, the wafer 10 is mounted and attached on the adhesive surface 12a of the mount tape 12 held by the mount ring 11 (step S2). In this state, the mount ring 11 is set in a dicing apparatus (not shown) and dicing is performed (step S3). In this dicing, the wafer 10 is cut along scribe lines between the semiconductor circuits 10a, and each semiconductor circuit 10a is separated (separated) into semiconductor chips 10b. FIG. 6A shows the state after dicing, and the semiconductor chip 10b remains attached to the mount tape 12. FIG.

  Next, the mount ring 11 is removed from the dicing apparatus, and the small ring 13 and the large ring 14 are fitted around the wafer 10 via the mount tape 12 with the mount tape 12 expanded as described above. As shown in FIG. 6B, the mount tape 12 is held in an expanded state (step S4). As a result, the semiconductor chips 10b on the mounting tape 12 are separated from each other.

  Next, with this state maintained, the mount ring 11 is set in the die bonding apparatus, and the semiconductor chip 10b corresponding to the A rank product is picked up based on the map data corresponding to the wafer 10 to perform die bonding (step S5). ). In this die bonding apparatus, as shown in FIG. 6C, the mount ring 11 and the clip rings 13 and 14 are sandwiched by the ring holding mechanism 20 and correspond to the A rank product by the needle 21a provided in the lifting mechanism 21. The semiconductor chip 10b is lifted from the back side. At this time, the needle 21 a penetrates the mount tape 12. The semiconductor chip 10b lifted by the needle 21a is adsorbed by an adsorber (not shown) called a collet, transferred onto a lead frame or package (not shown) to be bonded, and bonded.

  When all the rank A die bonding is completed, the mount ring 11 is removed from the die bonding apparatus, and the mount ring 11 is expanded with the clip tapes 13 and 14 while the mount tape 12 is expanded as shown in FIG. ) 22 (step S6). In the carrier magazine 22, a plurality of (for example, 24 pieces per lot) mount rings 11 that have finished die bonding of A rank products are sequentially accommodated. The carrier magazine 22 is stored in a nitrogen atmosphere to prevent oxidation of the semiconductor chip 10b.

  Next, when there is a request for assembling the B rank product (Yes in step S7), the mount ring 11 accommodated in the carrier magazine 22 is taken out (step S8). Then, the mount ring 11 taken out from the carrier magazine 22 is set in a die bonding apparatus, and similarly, a semiconductor chip 10b corresponding to a rank B product is picked up based on the map data and die bonding is performed (step S9). Thereafter, the mount ring 11 is removed from the die bonding apparatus, and defective products remaining on the mount tape 12 are appropriately discarded.

  As described above, in the manufacturing method described above, after the die bonding of the rank A product is completed, the mount ring 11 is accommodated in the carrier magazine 22 while the expansion of the mount tape 12 is held by the clip rings 13 and 14. The semiconductor chips 10b on the mounting tape 12 do not come into contact with each other, chip chipping or adhesion of foreign matter is prevented, and B rank die bonding can be performed while maintaining quality.

  Further, in the above manufacturing method, since there is no need to prepare a plurality of lead frame or package transport rails and a chip stocker as in the conventional case, the die bonding apparatus does not increase in size, and production Easy to manage. Furthermore, in the above manufacturing method, since the mount ring 11 is a normal one, it is possible to use a normal die bonding apparatus when ranking is not performed, and it is necessary to newly prepare a dedicated apparatus for ranking. Absent.

  The above manufacturing method is more effective when a CCD type or CMOS type solid-state imaging device (image sensor) is applied as the semiconductor circuit 10a. This is because a light-receiving surface is formed on the surface of the solid-state imaging device, and it is necessary to particularly prevent foreign matter adhesion due to chip chipping or the like.

  In the above embodiment, the case where the non-defective semiconductor chip 10b is classified into two ranks, that is, an A rank product and a B rank product is illustrated. However, the present invention is not limited to this, and the rank is 3 ranks. It is also possible to perform ranking as described above. In this case, the mount tape 12 is kept expanded by the clip rings 13 and 14 until the final rank die bonding is completed.

  Further, the above embodiment may be applied to a system that picks up a predetermined number of semiconductor chips 10b and accommodates the wafer 10 in the carrier magazine 22 between them.

  Further, when picking up the semiconductor chip 10b, alignment information may be generated from the map data, and alignment may be performed based on the alignment information. In this case, the alignment information can be shared by not removing the clip rings 13 and 14 between the pickup of the A rank semiconductor chip 10b and the pickup of the B rank semiconductor chip 10b. The alignment process may be performed based on the position of the clip rings 13, 14 or the mount ring 11, or may be performed based on the position of the wafer 10.

  In the above embodiment, the wafer 10 is transported and accommodated in the carrier magazine 22 by holding the mount ring 11, but may be performed by holding the clip rings 13, 14 or the mount tape 12. Good.

  In the above embodiment, the clip rings 13 and 14 are separate from the mount ring 11, but one of the clip rings 13 and 14 may be integrated with the mount ring 11.

It is a perspective view which shows a wafer, a mounting ring, and a mounting tape. It is a perspective view which shows the clip ring which consists of a large and small ring. It is an expanded sectional view of a clip ring. 3 is a flowchart showing a method for manufacturing a semiconductor device. It is a figure which shows map data. It is sectional drawing of the mount ring in a manufacturing process, (A) is the state after dicing, (B) is the state where the mount tape was expanded, (C) shows the state at the time of die bonding. It is sectional drawing of the carrier magazine which accommodated the mount ring.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Wafer 10a Semiconductor circuit 10b Semiconductor chip 11 Mount ring 12 Mount tape 12a Adhesive surface 13 Small ring 13a Recess 14 Large ring 14a Protrusion 20 Ring holding mechanism 21 Lifting mechanism 21a Needle 22 Carrier magazine

Claims (9)

Characteristic inspection is performed on a plurality of semiconductor circuits formed on a wafer, and each semiconductor circuit is classified into at least two ranks of a first rank and a second rank with respect to a predetermined characteristic value, and the rank and coordinate position of each semiconductor circuit A wafer test process for generating map data corresponding to
A wafer mounting step of adhering the wafer on a mounting tape held by a mounting ring;
A dicing step of dicing the wafer on the mount tape to divide each semiconductor circuit into individual semiconductor chips;
A mounting tape extending step of attaching a clip ring to the mounting tape and expanding the mounting tape so that the semiconductor chips are separated from each other;
A first die bonding step of die-bonding a first rank semiconductor chip among the semiconductor chips on the mounting tape based on the map data;
A plurality of mount rings for which the first die bonding process has been completed; a mount ring accommodating process for accommodating the plurality of mount rings in a carrier magazine with the clip ring attached;
Taking out the mount ring from the carrier magazine, and based on the map data, a second die bonding step of die-bonding a second rank semiconductor chip among the semiconductor chips on the mount tape;
A method for manufacturing a semiconductor device, comprising:   2. The method of manufacturing a semiconductor device according to claim 1, wherein the clip ring includes two large and small rings having different diameters and fitted to each other.   3. The method of manufacturing a semiconductor device according to claim 1, wherein the carrier magazine is stored in a nitrogen atmosphere in the mount ring housing step.   In the first and second die bonding steps, the semiconductor chip is peeled off by penetrating a plurality of needles from the back side of the mounting tape, and the peeled semiconductor chip is sucked by an adsorber and placed on the lead frame or the package. 4. The method of manufacturing a semiconductor device according to claim 1, wherein the semiconductor device is transferred.   The method of manufacturing a semiconductor device according to claim 1, wherein the semiconductor circuit is a solid-state imaging device.   A semiconductor device manufactured by the method for manufacturing a semiconductor device according to claim 1. Characteristic inspection is performed on a plurality of semiconductor circuits formed on a wafer, and each semiconductor circuit is classified into at least two ranks of a first rank and a second rank with respect to a predetermined characteristic value, and the rank and coordinate position of each semiconductor circuit A wafer test apparatus for generating map data corresponding to
A wafer mount device for attaching the wafer on a mount tape;
A dicing apparatus for dicing the wafer on the mount tape to divide each semiconductor circuit into individual semiconductor chips;
A mounting tape expansion device that attaches a clip ring to the mounting tape and expands the mounting tape so that the semiconductor chips are separated from each other;
Based on the map data, a pickup device that picks up a semiconductor chip on the mount tape on which the clip ring is mounted;
A mount tape storage device for storing the mount tape in a carrier magazine with the clip ring attached;
A semiconductor device manufacturing system comprising:   The mount tape storage device stores the mount tape in the carrier magazine between the pickup for the first rank semiconductor chip and the pickup for the second rank semiconductor chip by the pickup device. 8. A semiconductor device manufacturing system according to claim 7. The carrier magazine can accommodate a plurality of the mount tapes,
Pickup for the first rank semiconductor chip is continuously performed for the plurality of mount tapes, and pickup for the second rank semiconductor chip is continuously performed for the plurality of mount tapes. The semiconductor device manufacturing system according to claim 8.

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