JP2008172009A - Bonding wire and manufacturing method thereof - Google Patents

Bonding wire and manufacturing method thereof Download PDF

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JP2008172009A
JP2008172009A JP2007003584A JP2007003584A JP2008172009A JP 2008172009 A JP2008172009 A JP 2008172009A JP 2007003584 A JP2007003584 A JP 2007003584A JP 2007003584 A JP2007003584 A JP 2007003584A JP 2008172009 A JP2008172009 A JP 2008172009A
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bonding wire
surfactant
plasmon resonance
concentration
surface plasmon
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JP5023706B2 (en
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Masahito Takamori
雅人 高森
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Sumitomo Metal Mining Co Ltd
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  • Engineering & Computer Science (AREA)
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  • Wire Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding wire where an organic film is adsorbed uniformly and chemically. <P>SOLUTION: By cleaning and heat-treating the bonding wire after a wire drawing machine process, the amount of organic carbon existing on the surface of the bonding wire is set to not more than 1,500 μg/m<SP>2</SP>, and the bonding wire is dipped into a surface active agent where the inclination of concentration to surface tension is -1.00 to -40,000 mN/m/%, thus chemically adsorbing the surface active agent on the surface of the bonding wire in unimolecules. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、集積回路素子上の電極と回路配線基板の導体配線との間を接続するボンディングワイヤおよびその製造方法に関する。   The present invention relates to a bonding wire for connecting an electrode on an integrated circuit element and a conductor wiring of a circuit wiring board and a method for manufacturing the same.

ボンディングワイヤの加工は、伸線加工工程、熱処理工程、巻取工程の各工程からなる。加工中は、摩擦力を低減させたり、傷などの欠陥の発生を防いだりすることを目的として、各工程で、界面活性剤、天然油脂、鉱物油などの希釈液を処理液として、ボンディングワイヤの表面に塗布している。   The processing of the bonding wire includes each process of a wire drawing process, a heat treatment process, and a winding process. During processing, in order to reduce the frictional force and prevent the occurrence of defects such as scratches, bonding wires are used as a processing liquid in each process, using diluted solutions such as surfactants, natural fats and oils, and mineral oils. It is applied to the surface.

使用された処理液は、最終製品の表面にも残留しているが、かかる処理液の存在により、ボンディングワイヤ同士の接合が防止され、良好な繰り出し性が保たれる。また、ボンディング作業中においてもスムーズなボンディングワイヤの供給が行われる。   The used processing liquid remains on the surface of the final product. However, the presence of the processing liquid prevents bonding wires from being bonded to each other, and good drawability is maintained. Further, the bonding wire can be smoothly supplied even during the bonding operation.

必要に応じて、ボンディング作業中におけるスムーズなボンディングワイヤの供給を図るために、ボンディングワイヤの表面上に、意図的に界面活性剤を塗布することもある。この場合、界面活性剤は溶媒を用いて塗布され、溶媒を乾燥により蒸発させることで、界面活性剤をボンディングワイヤの表面に付着させている。   If necessary, a surfactant may be intentionally applied on the surface of the bonding wire in order to smoothly supply the bonding wire during the bonding operation. In this case, the surfactant is applied using a solvent, and the surfactant is attached to the surface of the bonding wire by evaporating the solvent by drying.

しかしながら、ボンディングワイヤの表面に残留した大量の処理液や塗布物が存在していると、ボンディング作業中のボンダーやキャピラリーに転写する量が短時間で増大するため、ワイヤ経路が狭くなり、ループ高さ異常が発生しやすくなってしまう。   However, if there is a large amount of treatment liquid or coating remaining on the surface of the bonding wire, the amount transferred to the bonder or capillary during the bonding operation will increase in a short time, resulting in a narrower wire path and higher loop height. Anomalies are likely to occur.

また、かかる局所的に異常な膜厚を有する有機物の存在が、近年、狭ピッチ化がますます進んでいるデバイスにおいて、ボンディングワイヤ同士の短絡などの原因になっている。   In addition, the presence of such an organic substance having a locally abnormal film thickness causes a short circuit between bonding wires in a device in which the pitch is increasingly narrowed in recent years.

この対策として、処理液の残留量や塗装物の塗布量を規制することがなされてきた。しかし、ボンディングワイヤの表面に有機被膜の形成が不十分であると、ボンディングワイヤ同士が接合し、かかる接合の防止や良好な繰り出し性の確保という効果が十分に得られない。   As countermeasures, it has been possible to regulate the residual amount of processing liquid and the coating amount of a coated product. However, if the formation of the organic film on the surface of the bonding wire is insufficient, the bonding wires are bonded to each other, and the effects of preventing such bonding and ensuring good feedability cannot be sufficiently obtained.

また、簡単な塗布および乾燥という従来の手法では、処理液や塗布物の有機材料が、ボンディングワイヤの表面で凝集してしまう。   Further, in the conventional technique of simple application and drying, the organic material of the treatment liquid and the application object is aggregated on the surface of the bonding wire.

具体的には、特開昭５９−１６７０４４号公報には、ボンディングワイヤの表面上に界面活性剤の被膜を、平均膜厚で５ｎｍ〜０．５ｎｍ塗布する方法が記載されている。しかし、このように薄い膜厚で塗布した場合、物質がボンディングワイヤの表面に化学的に吸着しているのか、または、該表面に単に付着しているだけなのか不明である。単に付着しているだけでは、経時変化や巻き替え工程での金線同士のこすれ合いで、界面活性剤の被膜が、表面から剥がれてしまい、接合防止および良好な繰り出し性という特性を有するボンディングワイヤをユーザーへ安定的に供給することは困難であった。   Specifically, Japanese Patent Application Laid-Open No. 59-167044 describes a method of applying a surfactant film on the surface of a bonding wire in an average film thickness of 5 nm to 0.5 nm. However, when it is applied in such a thin film thickness, it is unclear whether the substance is chemically adsorbed on the surface of the bonding wire or simply adhered to the surface. Bonding wire that has the characteristics of preventing bonding and good feeding properties because the surfactant coating peels off from the surface due to the aging and rubbing of the gold wires in the rewinding process simply by adhering. It has been difficult to provide a stable supply to users.

また、特開平６−１５１４９７号公報には、ボンディングワイヤの表面を洗浄して、ボンディングワイヤの炭素量を低減させる方法が記載されている。しかしながら、かかる場合においても、界面活性剤がボンディングワイヤの表面に化学的に吸着しているのか、単に付着しているだけなのかは不明である。よって、上記の先行技術と同様の問題が生ずる。
特開昭５９−１６７０４４号公報 特開平６−１５１４９７号公報 Japanese Patent Application Laid-Open No. 6-151497 describes a method for reducing the carbon content of a bonding wire by cleaning the surface of the bonding wire. However, even in such a case, it is unclear whether the surfactant is chemically adsorbed on the surface of the bonding wire or simply adhered. Therefore, the same problem as the above prior art occurs.
JP 59-167044 A JP-A-6-151497

本発明は、有機被膜の膜厚が均一で、かつ、高い有機被膜の密着力を有するボンディングワイヤを提供することを目的とする。   It is an object of the present invention to provide a bonding wire having a uniform organic coating film thickness and high organic coating adhesion.

本発明に係るボンディングワイヤの製造方法は、伸線加工工程後のボンディングワイヤを洗浄し、熱処理することにより、該ボンディングワイヤの表面に存在する有機炭素の量を１５００μｇ／ｍ2以下とし、その後、ボンディングワイヤを、濃度と表面張力の傾きが−１．００〜−４００００ｍＮ／ｍ／％の範囲内にある界面活性剤に浸漬することにより、該ボンディングワイヤの表面に界面活性剤を単分子で化学的に吸着させることを特徴とする。 In the method for manufacturing a bonding wire according to the present invention, the amount of organic carbon present on the surface of the bonding wire is reduced to 1500 μg / m 2 or less by washing and heat-treating the bonding wire after the wire drawing step, By immersing the bonding wire in a surfactant whose concentration and surface tension are in the range of −1.00 to −40000 mN / m /%, the surface of the bonding wire is chemically treated as a single molecule. It is characterized by making it adsorb.

表面プラズモン共鳴分光法を用いて、前記浸漬後のボンディングワイヤの表面に存在する前記界面活性剤を分析した場合に、表面プラズモン共鳴角のみを示すように、前記浸漬を行うことが好ましい。   When the surfactant present on the surface of the bonding wire after immersion is analyzed using surface plasmon resonance spectroscopy, the immersion is preferably performed so that only the surface plasmon resonance angle is shown.

本発明に係るボンディングワイヤは、前記製造方法により得られ、表面プラズモン共鳴分光法を用いて、その表面に存在する界面活性剤を分析した場合に、表面プラズモン共鳴角のみを示すことを特徴とする。   The bonding wire according to the present invention is obtained by the above-described manufacturing method and is characterized by showing only a surface plasmon resonance angle when analyzing a surfactant present on the surface using surface plasmon resonance spectroscopy. .

表面プラズモン共鳴分光法を用いて前記界面活性剤の膜厚を測定した場合に、表面の洗浄前後において膜厚に変化がないことが好ましい。   When the thickness of the surfactant is measured using surface plasmon resonance spectroscopy, it is preferable that there is no change in the thickness before and after cleaning the surface.

本発明により、ボンディングワイヤの表面に、界面活性剤を単分子で化学的に吸着させることによって、有機被膜を均一に形成することができる。かかる有機被膜は、膜厚が薄いにもかかわらず、ボンディングワイヤの表面から剥がれることがなく、ボンディングワイヤ同士の接合を防止し、その繰り出し性を良好に維持できる。したがって、ループ異常がなく、かつ、円滑なボンディングを可能とするボンディングワイヤが安定的に供給される。   According to the present invention, an organic coating can be uniformly formed by chemically adsorbing a surfactant with a single molecule on the surface of a bonding wire. Such an organic coating is not peeled off from the surface of the bonding wire even though the film thickness is thin, prevents the bonding wires from being bonded to each other, and can maintain a good feeding property. Therefore, a bonding wire that does not cause a loop abnormality and enables smooth bonding is stably supplied.

本発明に係るボンディングワイヤの製造方法は、伸線加工工程後のボンディングワイヤを洗浄し、熱処理することにより、該ボンディングワイヤの表面に存在する有機炭素の量を１５００μｇ／ｍ2以下とし、その後、ボンディングワイヤを、濃度と表面張力の傾きが−１．００〜−４００００ｍＮ／ｍ／％の範囲内にある界面活性剤に浸漬することにより、該ボンディングワイヤの表面に界面活性剤を単分子で化学的に吸着させることに特徴を有する。 In the method for manufacturing a bonding wire according to the present invention, the amount of organic carbon present on the surface of the bonding wire is reduced to 1500 μg / m 2 or less by washing and heat-treating the bonding wire after the wire drawing step, By immersing the bonding wire in a surfactant whose concentration and surface tension are in the range of −1.00 to −40000 mN / m /%, the surface of the bonding wire is chemically treated as a single molecule. It is characterized by making it adsorb.

ボンディングワイヤの洗浄は、伸線加工工程で使用した界面活性剤、天然油脂、鉱物油などを除去する目的で行われ、アルコール洗浄、超音波洗浄、プラズマ洗浄、電解洗浄、温湯洗浄、フロン洗浄、洗剤洗浄、酸洗浄、アルカリ洗浄、オゾン洗浄、レーザー洗浄など任意の手段を用いることができる。   Bonding wire is cleaned for the purpose of removing surfactants, natural fats and oils, mineral oils, etc. used in the wire drawing process. Alcohol cleaning, ultrasonic cleaning, plasma cleaning, electrolytic cleaning, hot water cleaning, freon cleaning, Arbitrary means such as detergent cleaning, acid cleaning, alkali cleaning, ozone cleaning, and laser cleaning can be used.

ボンディングワイヤの表面に存在する有機炭素の量を１５００μｇ／ｍ2以下とする。表面の有機炭素の量が１５００μｇ／ｍ2を超えると、次工程でボンディングワイヤの表面に界面活性剤が直接吸着することができなくなるからであり、また、洗浄が不十分で表面に界面活性剤などが残存している状態で、界面活性剤にボンディングワイヤを浸漬すると、表面に界面活性剤が凝集した状態で多く残留し、キャピラリーの詰まり、クランパの汚れが発生しやすくなり、作業性が低下するためである。 The amount of organic carbon present on the surface of the bonding wire is set to 1500 μg / m 2 or less. This is because if the amount of organic carbon on the surface exceeds 1500 μg / m 2 , the surfactant cannot be directly adsorbed on the surface of the bonding wire in the next step, and the surface is not sufficiently cleaned and the surfactant is on the surface. If the bonding wire is dipped in the surfactant while remaining, etc., the surfactant remains agglomerated on the surface, and the capillary remains clogged and the clamper is likely to become dirty, resulting in reduced workability. It is to do.

ここで、界面活性剤とは、分子内に、−ＣＯＯＨ（カルボキシ基）、−ＯＨ（水酸化基）などの親水基と、炭化水素などの親油基の部分を持つ物質を意味する。界面活性剤には、イオン性界面活性剤および非イオン（ノニオン）界面活性剤があり、用途に応じて種々の製品が存在する。   Here, the surfactant means a substance having a hydrophilic group such as —COOH (carboxy group) or —OH (hydroxide group) and a lipophilic group such as hydrocarbon in the molecule. Surfactants include ionic surfactants and nonionic (nonionic) surfactants, and various products exist depending on the application.

次に、洗浄後のボンディングワイヤを界面活性剤に浸漬するが、該界面活性剤として、濃度と表面張力の傾きが−１．００〜−４００００ｍＮ／ｍ／％の範囲内にあるものを選択する。具体的には、任意の界面活性剤について、濃度を種々変化させて、各濃度の表面張力を表面張力測定装置で測定して、プロットした場合に、得られたグラフの傾きが上記の数値範囲内にある濃度の界面活性剤を使用する。   Next, the cleaned bonding wire is immersed in a surfactant, and a surfactant having a concentration and a surface tension gradient in the range of −1.00 to −40000 mN / m /% is selected as the surfactant. . Specifically, for any surfactant, the concentration of the obtained graph is in the above numerical range when the concentration is changed variously and the surface tension of each concentration is measured with a surface tension measuring device and plotted. Use a concentration of surfactant within.

かかる濃度と表面張力の傾きは、臨界ミセル濃度を超えている状態にあるのか否かを示し、単分子のみの吸着の指標となるものである。濃度と表面張力の関係は、界面活性剤の種類によって異なる。しかしながら、いずれの界面活性剤であっても、濃度と表面張力の傾きが−１．００ｍＮ／ｍ／％より大きな値になると、ボンディングワイヤの表面で界面活性剤が凝集して、ミセルが形成され、単分子吸着とミセルの付着が混在し、不均一な表面状態になるという問題を生ずる。また、表面張力が一定になってしまう。一方、−４００００ｍＮ／ｍ／％を超えると、界面活性剤の濃度が低すぎて、ボンディングワイヤの表面全体に有機被膜が形成できないという問題がある。好ましくは、−４００００〜−１００ｍＮ／ｍ／％の範囲内、さらに好ましくは、−１５００〜−３００ｍＮ／ｍ／％の範囲内とする。   The gradient of the concentration and the surface tension indicates whether or not the concentration exceeds the critical micelle concentration, and serves as an index for adsorption of only a single molecule. The relationship between concentration and surface tension varies depending on the type of surfactant. However, for any surfactant, if the slope of concentration and surface tension is greater than -1.00 mN / m /%, the surfactant aggregates on the surface of the bonding wire and micelles are formed. Single molecule adsorption and micelle adhesion are mixed, resulting in a non-uniform surface state. Further, the surface tension becomes constant. On the other hand, when it exceeds -40000 mN / m /%, there is a problem that the concentration of the surfactant is too low to form an organic film on the entire surface of the bonding wire. Preferably, it is in the range of −4000 to −100 mN / m /%, more preferably in the range of −1500 to −300 mN / m /%.

浸漬は、上記範囲の界面活性剤について、予め表面プラズモン共鳴分光法により、ボンディングワイヤの表面に界面活性剤が化学的に吸着する条件を得て、該条件に従って行う。すなわち、本発明に係るボンディングワイヤでは、表面プラズモン共鳴分光法を用いて、浸漬後のボンディングワイヤの表面における前記界面活性剤を分析した場合、その結果として、表面プラズモン共鳴角が現れる。しかしながら、反射角４８°付近にサブピークが現れることがない。   Immersion is performed in accordance with the above conditions by obtaining conditions for the surface active agent to be chemically adsorbed on the surface of the bonding wire by surface plasmon resonance spectroscopy. That is, in the bonding wire according to the present invention, when the surfactant on the surface of the bonding wire after immersion is analyzed using surface plasmon resonance spectroscopy, a surface plasmon resonance angle appears as a result. However, no sub-peak appears near the reflection angle of 48 °.

表面プラズモン共鳴分光法の原理は、次の通りである。すなわち、膜厚５０ｎｍ程度の金属薄膜表面にプリズムを介してレーザー光を入射させると、全反射角領域のある一定角度において特有の光の吸収（反射光の減衰)が見られる。この角度のことを表面プラズモン共鳴角という。この現象のことを表面プラズモン共鳴という。この現象は、エバネッセント光のしみだし距離中での媒体の屈折率の変化、すなわち、金属表面への分子の吸着により大きく影響を受けるものである。よって、これをモニターすることにより、表面での分子吸着挙動を高感度に測定することが可能となる。   The principle of surface plasmon resonance spectroscopy is as follows. That is, when laser light is incident on the surface of a metal thin film having a thickness of about 50 nm via a prism, specific light absorption (attenuation of reflected light) is observed at a certain angle in the total reflection angle region. This angle is called the surface plasmon resonance angle. This phenomenon is called surface plasmon resonance. This phenomenon is greatly affected by the change in the refractive index of the medium during the evanescent light penetration distance, that is, the adsorption of molecules onto the metal surface. Therefore, by monitoring this, the molecular adsorption behavior on the surface can be measured with high sensitivity.

すなわち、入射光の角度を変えて反射光強度をモニターすることにより、分子の吸着量を定量化することが可能となり、また、入射光の角度を固定し、反射光強度の時間変化を測定し、分子の吸脱着過程をリアルタイムでモニターすることも可能となる。この測定は、表面プラズモン共鳴分光装置により行うことができる。   That is, by monitoring the reflected light intensity by changing the angle of the incident light, it is possible to quantify the amount of adsorbed molecules. Also, the angle of the incident light is fixed and the time variation of the reflected light intensity is measured. It is also possible to monitor the adsorption / desorption process of molecules in real time. This measurement can be performed with a surface plasmon resonance spectrometer.

すなわち、界面活性剤をボンディングワイヤの表面に吸着させるためには、表面プラズモン共鳴分光法を用いて測定したときの入射角と反射率の関係から得られるＳＰＲカーブにおいて、ＳＰＲカーブの最小反射率を与える入射角角度である共鳴角（表面プラズモン共鳴角）が発生するように、被膜吸着状態を制御することになる。   That is, in order to adsorb the surfactant on the surface of the bonding wire, the minimum reflectance of the SPR curve is set in the SPR curve obtained from the relationship between the incident angle and the reflectance when measured using surface plasmon resonance spectroscopy. The film adsorption state is controlled so that a resonance angle (surface plasmon resonance angle) which is an incident angle angle is generated.

なお、「単分子で化学的に吸着させる」とは、ボンディングワイヤの表面に界面活性剤の分子の一つ一つが層状に並び、界面活性剤の親水基ないし親油基のいずれかが表面の特定の活性部位（金属）との間に強力な不可逆的な化学結合を形成することをいう。   “Chemically adsorbed by a single molecule” means that each of the surfactant molecules is arranged in layers on the surface of the bonding wire, and either the hydrophilic group or the lipophilic group of the surfactant is on the surface. Forming a strong irreversible chemical bond with a specific active site (metal).

具体的には、浸漬に用いる界面活性剤の濃度、浸漬時間、浸漬温度などの条件を制御して、ボンディングワイヤを界面活性剤に浸漬した後、その表面を表面プラズモン共鳴分析装置で測定した場合に、表面プラズモン共鳴角が得られ、かつ、その他にサブピークが現れないようにする。実際の操業においては、予め、当該浸積条件を試験により得て、得られた条件により浸漬を行えばよい。   Specifically, after controlling the conditions such as the concentration of the surfactant used for immersion, the immersion time, and the immersion temperature, and immersing the bonding wire in the surfactant, the surface is measured with a surface plasmon resonance analyzer In addition, a surface plasmon resonance angle is obtained, and other sub-peaks are prevented from appearing. In actual operation, the immersion conditions may be obtained in advance by testing, and immersion may be performed under the obtained conditions.

表面プラズモン共鳴角が検出されない場合には、有機被膜が化学的に吸着しておらず、ボンディングワイヤ表面に単に付着していることを示す。かかる場合には、有機被膜はボンディングワイヤ表面から簡単に剥離脱落してしまう。一方、界面活性剤の濃度が５０ｐｐｍ以上になると、表面プラズモン共鳴角だけでなく、反射角４８°付近にサブピークが現れるようになり、さらに濃度が濃くなるにつれて、該ピークがしっかりと現れるようになる。この現象は、ボンディングワイヤの表面で、界面活性剤が凝集して、ミセルを形成していることを意味する。このようなミセルが生成すると、ボンディングワイヤの表面には、凹凸のある有機被膜が形成され、ボンダー作業中にボンダーやキャピラリーに転写する量が変化するため、不定期にループ高さ異常をおこすという問題が生ずる。   If the surface plasmon resonance angle is not detected, it indicates that the organic coating is not chemically adsorbed and is simply attached to the bonding wire surface. In such a case, the organic coating easily peels off from the bonding wire surface. On the other hand, when the concentration of the surfactant is 50 ppm or more, not only the surface plasmon resonance angle but also a sub-peak appears near the reflection angle of 48 °, and as the concentration further increases, the peak appears more firmly. . This phenomenon means that the surfactant aggregates on the surface of the bonding wire to form micelles. When such micelles are generated, an uneven organic film is formed on the surface of the bonding wire, and the amount transferred to the bonder or capillary changes during the bonder operation, causing irregular loop height irregularities. Problems arise.

本発明においては市販されている種々の界面活性剤を用いることができる。浸漬により、単分子で均一な膜厚の有機被膜を形成するための条件は、それぞれの界面活性剤により異なるが、本発明により、かかる条件を適確に把握することが可能となり、よって、適切な膜厚であり、かつ、剥がれ脱落のない有機被膜をボンディングワイヤの表面に形成することが可能となる。したがって、界面活性剤の種類に制限されることはないが、ノニオン界面活性剤、アニオン界面活性剤、両性界面活性剤のいずれかが、本発明に適用可能である。   In the present invention, various commercially available surfactants can be used. The conditions for forming an organic film having a uniform film thickness with a single molecule by immersion differ depending on the respective surfactants. However, according to the present invention, it is possible to accurately grasp such conditions. It is possible to form an organic film on the surface of the bonding wire that has a sufficient thickness and does not peel off. Therefore, the type of the surfactant is not limited, but any of a nonionic surfactant, an anionic surfactant, and an amphoteric surfactant can be applied to the present invention.

なお、界面活性剤が表面に単分子で化学的に吸着した場合、ボンディングワイヤの表面を洗浄した前後において、吸着の状況に変化はなく、表面プラズモン共鳴法によりその膜厚を測定した場合、洗浄の前後において変化が生じない。すなわち、ボンディングワイヤの表面に均一な有機被膜が形成されていると評価できる。   In addition, when the surfactant is chemically adsorbed on the surface as a single molecule, there is no change in the state of adsorption before and after cleaning the surface of the bonding wire, and when the film thickness is measured by the surface plasmon resonance method, the surface is washed. There is no change before and after. That is, it can be evaluated that a uniform organic film is formed on the surface of the bonding wire.

（有機被膜形成材料の評価）
有機被膜形成材料として、市販のノニオン界面活性剤を用いた。かかるノニオン界面活性剤を溶媒である純水に投入し、濃度と表面張力の傾きが−３３０ｍＮ／ｍ／％となる濃度４０ｐｐｍのものを調製した。なお、表面張力については、表面張力測定装置（Ｋｒｕｓｓ社製、Ｋ１２１）により測定を行った。 (Evaluation of organic film forming materials)
A commercially available nonionic surfactant was used as the organic film forming material. Such a nonionic surfactant was introduced into pure water as a solvent, and a nonionic surfactant having a concentration of 40 ppm at which the gradient between the concentration and the surface tension was −330 mN / m /% was prepared. In addition, about surface tension, it measured with the surface tension measuring apparatus (Kruss company make, K121).

液温２０℃、６０分間の条件で、金板をそれぞれの界面活性剤の溶液に浸漬し、金板の表面に有機被膜を得た。   Under the conditions of a liquid temperature of 20 ° C. for 60 minutes, the metal plate was immersed in each surfactant solution to obtain an organic coating on the surface of the metal plate.

次に、有機被膜が存在する金板の表面を、表面プラズモン共鳴分光法を用いて分析し、評価したところ、図１に示す分析結果のグラフが得られた。該グラフから明らかなように、表面プラズモン共鳴角が現れており、かつ、他の角度におけるサブピークは存在していなかった。   Next, when the surface of the metal plate on which the organic coating was present was analyzed and evaluated using surface plasmon resonance spectroscopy, the analysis result graph shown in FIG. 1 was obtained. As apparent from the graph, a surface plasmon resonance angle appears, and no sub-peaks exist at other angles.

さらに、該金板の表面を、水を流しながら洗浄し、その後、表面プラズモン共鳴分光法を用いて、洗浄の前後の吸着量を測定した。その結果、表面プラズモン共鳴角の高角度側へのシフト量により吸着量を計算した結果、洗浄前後の吸着量が変化していないことがわかった。よって、この状態が化学的に吸着していることを意味することが理解され、かつ、洗浄などによっては、表面の有機被膜が簡単に剥離脱落することなく、吸着状態を維持することも理解される。   Further, the surface of the metal plate was washed while flowing water, and then the adsorption amount before and after washing was measured using surface plasmon resonance spectroscopy. As a result, the amount of adsorption was calculated from the amount of shift of the surface plasmon resonance angle to the high angle side, and as a result, it was found that the amount of adsorption before and after washing did not change. Therefore, it is understood that this state means that it is chemically adsorbed, and it is also understood that the organic film on the surface maintains the adsorbed state without easily peeling off and dropping, depending on cleaning. The

また、浸漬条件を代えて、表面プラズモン共鳴角が現れる条件を検討したところ、濃度と表面張力の傾きが−１１００ｍＮ／ｍ／％である当該ノニオン界面活性剤の場合、同様な結果であった。   Moreover, when the conditions under which the surface plasmon resonance angle appears instead of the immersion conditions were examined, similar results were obtained in the case of the nonionic surfactant having a concentration and a surface tension gradient of −1100 mN / m /%.

（実施例１）
線径２５μｍの金（純度９９．９９％）のボンディングワイヤ（住友金属鉱山株式会社製）を使用し、エタノール洗浄を行った。次に、大気雰囲気で、５００℃、０．５秒の条件で、ボンディングワイヤの熱処理を行なった。ボンディングワイヤの表面に存在する有機炭素の量を極微量炭素分析装置（堀場製作所製、ＥＭＩＡ−Ｕ５１１）で測定したところ、有機炭素の量は１４００μｇ／ｍ2であった。よって、ボンディングワイヤの表面から有機物が十分に除去されていることが確認された。 (Example 1)
Using a gold (purity: 99.99%) bonding wire (manufactured by Sumitomo Metal Mining Co., Ltd.) having a wire diameter of 25 μm, ethanol cleaning was performed. Next, the bonding wire was heat-treated in an air atmosphere at 500 ° C. for 0.5 seconds. When the amount of organic carbon present on the surface of the bonding wire was measured with a trace carbon analyzer (Horiba, EMIA-U511), the amount of organic carbon was 1400 μg / m 2 . Therefore, it was confirmed that organic substances were sufficiently removed from the surface of the bonding wire.

前記界面活性剤を、濃度と表面張力の傾きが−３３０ｍＮ／ｍ／％となるように調製し（濃度０．００４％、表面張力２８．４ｍＮ／ｍ）、前記ボンディングワイヤをかかる界面活性剤の溶液に、液温２０℃、６０分間の条件で浸漬し、その表面に有機被膜を吸着させた。なお、かかる条件は、前記評価試験において、事前に有機被膜を吸着させることを確認したものである。   The surfactant is prepared so that the gradient of concentration and surface tension is −330 mN / m /% (concentration 0.004%, surface tension 28.4 mN / m), and the bonding wire is used for the surfactant. It was immersed in the solution at a liquid temperature of 20 ° C. for 60 minutes to adsorb the organic coating on the surface. This condition was confirmed in advance in the evaluation test to adsorb the organic coating.

次に、得られたボンディングワイヤを、以下のように評価した。   Next, the obtained bonding wire was evaluated as follows.

表面プラズモン共鳴分光法を用いて、得られた有機被膜の吸着量を測定したところ、２ｎｍ〜３ｎｍで、均一な有機被膜が形成されていることを確認した。   When the adsorption amount of the obtained organic film was measured using surface plasmon resonance spectroscopy, it was confirmed that a uniform organic film was formed at 2 nm to 3 nm.

原子間力顕微鏡（ＡＦＭ）を用いて、ボンディングワイヤの表面の観察を行ったところ、界面活性剤が単分子で均一に吸着していることが確認された。その結果を図２に示した。   When the surface of the bonding wire was observed using an atomic force microscope (AFM), it was confirmed that the surfactant was uniformly adsorbed as a single molecule. The results are shown in FIG.

また、得られた有機被膜の洗浄等による影響を調べるために、ボンディングワイヤの表面を水で６０分間洗浄した後、ＡＦＭで観察したが、変化はみられなかった。さらに、表面プラズモン共鳴分光法を用いて、洗浄前後の共鳴角を調べたが、共鳴角に変化はなく、かつ、吸着量も変化していなかった。   Moreover, in order to investigate the influence by washing | cleaning etc. of the obtained organic film, the surface of the bonding wire was washed with water for 60 minutes and then observed with AFM, but no change was observed. Furthermore, the resonance angle before and after washing was examined using surface plasmon resonance spectroscopy, but the resonance angle did not change and the amount of adsorption did not change.

（比較例１）
前記界面活性剤を、濃度と表面張力の傾きが＋２８ｍＮ／ｍ／％となるように調製し（濃度０．０１０％、表面張力２６．９ｍＮ／ｍ）、かかる界面活性剤の溶液を浸漬に用いた以外は、実施例１と同様に各工程を行った。 (Comparative Example 1)
The surfactant was prepared so that the gradient of concentration and surface tension was +28 mN / m /% (concentration 0.010%, surface tension 26.9 mN / m), and the surfactant solution was used for immersion. Each step was performed in the same manner as in Example 1 except that.

表面プラズモン共鳴分光法を用いて観測を行ったが、共鳴角は観測されなかった。その結果を図１に示す。   Observation was performed using surface plasmon resonance spectroscopy, but no resonance angle was observed. The result is shown in FIG.

また、得られた有機被膜の表面をＡＦＭで観察した結果、その表面に３００ｎｍ程度の付着物が観察された。その結果を図３に示した。これは、有機被膜の表面に界面活性剤が凝集してミセルを形成し、ミセルが付着していることを意味する。   Moreover, as a result of observing the surface of the obtained organic coating film with AFM, a deposit of about 300 nm was observed on the surface. The results are shown in FIG. This means that the surfactant aggregates on the surface of the organic coating to form micelles, and the micelles are attached.

さらに、得られたボンディングワイヤの表面の有機被膜を水で洗浄し、ＡＦＭで観察したところ、有機被膜が剥離したことが確認された。その結果を図４に示す。   Furthermore, when the organic film on the surface of the obtained bonding wire was washed with water and observed with AFM, it was confirmed that the organic film was peeled off. The result is shown in FIG.

本発明によるボンディングワイヤは、その表面に有機被膜を化学的に吸着させており、有機物がクランパやキャピラリーに転写することなく、かつ、良好な繰り出し性が維持される。よって、直進性に優れ、狭ピッチのものにも対応することができ、半導体材料の接続用途に好適である。   The bonding wire according to the present invention has the organic film chemically adsorbed on the surface thereof, and the organic matter is not transferred to the clamper or capillary, and a good feeding property is maintained. Therefore, it is excellent in straightness, can cope with a narrow pitch, and is suitable for a semiconductor material connection application.

本実施例で用いたノニオン界面活性剤について、濃度と表面張力の傾きが実施例１における−３３０ｍＮ／ｍ／％の場合および、比較例１における＋２８ｍＮ／ｍ／％とした場合の表面プラズモン共鳴分光法の測定結果を示すグラフである。For the nonionic surfactant used in this example, surface plasmon resonance spectroscopy when the gradient of concentration and surface tension is −330 mN / m /% in Example 1 and +28 mN / m /% in Comparative Example 1 It is a graph which shows the measurement result of a method. 上記濃度と表面張力の傾きが−３３０ｍＮ／ｍ／％のノニオン界面活性剤を用いた場合の表面状態を示すＡＦＭ観察の結果を示す図である。It is a figure which shows the result of the AFM observation which shows the surface state at the time of using the nonionic surfactant whose inclination of the said density | concentration and surface tension is -330 mN / m /%. 上記濃度と表面張力の傾きが＋２８ｍＮ／ｍ／％のノニオン界面活性剤を用いた場合の表面状態を示すＡＦＭ観察の結果を示す図である。It is a figure which shows the result of the AFM observation which shows the surface state at the time of using the nonionic surfactant whose inclination of the said density | concentration and surface tension is +28 mN / m /%. 上記濃度と表面張力の傾きが＋２８ｍＮ／ｍ／％のノニオン界面活性剤を用いた後純水で洗浄した場合の表面状態を示すＡＦＭ観察の結果を示す図である。It is a figure which shows the result of the AFM observation which shows the surface state at the time of wash | cleaning with a pure water after using the nonionic surfactant whose inclination of the said density | concentration and surface tension is +28 mN / m /%.

Claims (4)

伸線加工工程後のボンディングワイヤを洗浄し、熱処理することにより、該ボンディングワイヤの表面に存在する有機炭素の量を１５００μｇ／ｍ2以下とし、その後、ボンディングワイヤを、濃度と表面張力の傾きが−１．００〜−４００００ｍＮ／ｍ／％の範囲内にある界面活性剤に浸漬することにより、該ボンディングワイヤの表面に界面活性剤を単分子で化学的に吸着させることを特徴とするボンディングワイヤの製造方法。 The bonding wire after the wire drawing process is cleaned and heat-treated to reduce the amount of organic carbon present on the surface of the bonding wire to 1500 μg / m 2 or less. A bonding wire characterized in that the surfactant is chemically adsorbed on the surface of the bonding wire as a single molecule by dipping in a surfactant in the range of -1.00 to -40000 mN / m /%. Manufacturing method. 表面プラズモン共鳴分光法を用いて、前記浸漬後のボンディングワイヤの表面に存在する前記界面活性剤を分析した場合に、表面プラズモン共鳴角のみを示すように、前記浸漬を行うことを特徴とする請求項１に記載のボンディングワイヤの製造方法。   The immersion is performed so that only the surface plasmon resonance angle is shown when the surfactant present on the surface of the bonding wire after the immersion is analyzed using surface plasmon resonance spectroscopy. Item 2. A method for producing a bonding wire according to Item 1. 請求項１または２に記載のボンディングワイヤの製造方法により得られ、表面プラズモン共鳴分光法を用いて前記界面活性剤を分析した場合に、表面プラズモン共鳴角のみを示すことを特徴とするボンディングワイヤ。   A bonding wire obtained by the method for producing a bonding wire according to claim 1, wherein when the surfactant is analyzed using surface plasmon resonance spectroscopy, only the surface plasmon resonance angle is shown. 表面プラズモン共鳴分光法を用いて前記界面活性剤の膜厚を測定した場合に、表面の洗浄前後において膜厚に変化がないことを特徴とする請求項３に記載のボンディングワイヤ。   The bonding wire according to claim 3, wherein when the thickness of the surfactant is measured using surface plasmon resonance spectroscopy, the thickness does not change before and after cleaning the surface.
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