JP2008171616A - Emi-prevention contact, and emi-prevention structure using the emi-prevention contact - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an EMI-prevention contact and an EMI-prevention structure applicable to a structure, such as USB and IEEE1394, into which a component constituting an EMI-prevention contact cannot be interposed, and capable of reducing the number of components to thereby reduce a variety of costs, simplify the structure, and facilitate the component management. <P>SOLUTION: A connector ground contacting section 11 contacting with a connector ground B, a frame ground contacting section 12 contacting with a frame ground C, and a fixing section 13 fixed to a substrate 3 for holding the connector ground contacting section 11 and the frame ground contacting section 12 to the substrate 3 are formed in a unified manner. When the connector ground contacting section 11 and the frame ground contacting section 12 respectively receive biasing forces in directions of enhancing contacting forces with the grounds corresponding to the respective contacting sections, reaction forces against the biasing forces act on the grounds, and the biasing force against one of the contacting sections acts on the other of the contacting sections in a direction of enhancing the contacting force with the ground corresponding to the contacting section. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a contact for EMI prevention and an EMI prevention structure suitable for measures against EMI (Electromagnetic Interference).

As prior art document information related to the present invention, for example, there are the following Patent Document 1 and Patent Document 2.
Japanese Patent No. 3349732

  The invention disclosed in Patent Document 1 is provided with a pair of grounding springs sandwiching a printed board functioning as a capacitor for high-frequency grounding of a housing (frame ground) and a connector ground, and the housing and the connector, respectively. An EMI (Electromagnetic Interference) prevention structure is constituted by the structure brought into contact with the EMI.

However, the EMI prevention structure disclosed in Patent Document 1 is applied only to a structure that includes a flange portion such as a BNC connector, for example, so that the housing and the connector overlap when viewed from the cable connection port side of the connector. It cannot be applied to a structure such as a USB connector or an IEEE 1394 connector that does not overlap the housing and the connector when viewed from the cable connection port side.
In the case of a network interface using USB or IEEE 1394, since the transfer speed is high, it is desirable to configure an EMI prevention structure on the connector side. This is not a structure that can be configured by sandwiching parts between a housing and a connector, and another measure is required.
Therefore, at present, as shown in FIG. 10, the escutcheon 100 provided so as to surround the USB connector or the IEEE1394 connector is used to contact the connector 101 and the panel (not shown) 2. Contact members 102 and 103, which are different types of members, are screwed to the substrate 104 and the escutcheon 100, or a locking piece for locking the contactor to the substrate 104 and the escutcheon 100 is provided. It is locked and fixed by.
However, in the structure shown in FIG. 10, the escutcheon 100, the two types of contacts 102, 103, the contact fixing screw 105, the locking piece provided on the escutcheon 100 or the substrate 104, etc. Therefore, the present situation is that the cost of parts is increased due to the number of parts, the number of assembly processes is increased, the assembly cost is increased due to a complicated structure, and further, parts management is complicated.

  The present invention can be applied to a structure such as USB or IEEE 1394 in which a part constituting the contact for preventing EMI cannot be sandwiched between the housing and the connector, and the contact for preventing EMI or the structure for preventing EMI. The purpose is to provide an EMI prevention contactor and an EMI prevention structure that solve this problem by reducing the number of parts that make up the product, reducing various costs, simplifying the structure, and facilitating parts management. To do.

  In order to achieve the above-mentioned object, the technical means adopted by the present invention is to provide an EMI prevention contact for an interface connector used for connection to another electronic device, with respect to a connector ground on the connector side mounted on the board. A connector ground contact portion having conductivity that contacts, a frame ground contact portion having conductivity that contacts a frame ground provided in a housing having an opening through which the cable connection portion of the connector is exposed, and a substrate. On the other hand, by fixing using a fixing agent, the connector ground contact part and the fixed part that holds the frame ground contact part with respect to the substrate are integrally formed, and the connector ground contact part and the frame ground contact part are: When a biasing force in the direction that increases the contact force with the ground corresponding to each contact portion acts on both contact portions A reaction force acting against the biasing force acts, and the biasing force with respect to one contact portion acts as a biasing force in a direction to increase the contact force with the ground corresponding to the contact portion with respect to the other contact portion. This is a contact for preventing EMI, which is characterized in that the contact is made.

Also, an EMI prevention structure using the EMI prevention contact,
The contact for EMI prevention is attached by fixing the fixed part to the substrate,
In the mounted state, the connector ground contact portion is held at a position where it can contact the connector ground, and the frame ground contact portion is held at a position where it can contact the frame ground. In this state, when an urging force in the direction of increasing the contact force is applied to the contact portions with the ground corresponding to the respective contact portions, a reaction force against the urging force is applied. EMI is characterized in that the urging force for one contact portion is made to act on the other contact portion as an urging force in a direction to increase the contact force with the ground corresponding to the contact portion. This is a contact for prevention.

An EMI prevention structure using the EMI prevention contact according to claim 1,
The EMI prevention contact is attached to the substrate supported by the housing by fixing the fixing portion. In the attached state, the connector ground contact portion is in contact with the connector ground, and the frame The ground contact portion is in contact with the frame ground, and an urging force that increases the contact force acts on both contact portions due to contact with the ground corresponding to each contact portion. As a biasing force in a direction in which a reaction force against the biasing force acts and the biasing force with respect to one contact portion increases the contact force with the ground corresponding to the contact portion with respect to the other contact portion. The EMI prevention structure is characterized in that it is in a working state.

  The casing referred to in the present invention is a casing itself containing various substrates, electronic components, or the like, or a member that constitutes a part of the casing and has an opening through which the cable connection portion of the connector is exposed. Examples of the member include a metal panel member that supports the substrate to be attached to the housing.

In the EMI prevention contact according to the present invention, the connector ground contact portion, the frame ground contact portion, and the fixed portion are integrated, and at least the connector ground contact portion and the frame ground contact portion have electrical conductivity and are urged. Any structure can be used as long as the reaction force acts against it. For example, a thin metal material is cut and bent into a predetermined shape, or a thin and hard synthetic resin material is formed into a predetermined shape. In addition, there is a configuration in which electrical conductivity is ensured by cutting and bending, and metal plating on the connector ground contact portion and the frame ground contact portion.
Further, the fixing agent referred to in the present invention is not particularly limited as long as it can fix the fixing portion to the substrate, and examples thereof include solder and adhesive. If so, soldering is performed using solder, and if the contact member for preventing EMI is thin and is a hard synthetic resin material, it is fixed using an adhesive.

  According to the present invention, the present invention can be applied to a structure such as USB or IEEE 1394 in which a part constituting the contact for preventing EMI is not sandwiched between the housing and the connector. By reducing the number of various parts constituting the prevention structure, various costs can be reduced, the structure can be simplified, and the ease of parts management can be improved.

The best mode for carrying out the EMI prevention contactor and the EMI prevention structure according to the present invention will be described below with reference to the drawings.
FIGS. 1-8 shows the 1st form of the contact for EMI prevention and EMI prevention structure of this invention, and FIG. 9 shows the 2nd form of the contact for EMI prevention of this invention.
The contact for EMI prevention (hereinafter referred to as “contact”) 1 exemplified in this embodiment exemplifies that formed by cutting and bending into a predetermined shape using a thin metal material. The EMI prevention structure illustrated in FIG. 1 is an example in which the substrate 3 to which the connector 2 is attached is configured in a substrate unit A that is supported by a metal panel member 4 that is an example of a housing.

Hereafter, each common component of the contact for EMI prevention of the 1st form and 2nd form and EMI prevention structure concerning the present invention is explained.
The board unit A exemplified in this embodiment is an IEEE 1394 interface unit to the panel member 4, and includes the contact 1, a connector (1394 connector) 2, an interface electronic component (not shown) and a circuit (see FIG. The substrate 3 provided with a not shown) is fixed by screwing.

As shown in FIGS. 1 to 3, the contact 1 exemplified in this embodiment is configured by integrally forming a connector ground contact portion 11, a frame ground contact portion 12, and a fixing portion 13, as shown in FIG. 6. In the state where the fixing portion 13 is fixed to the substrate, the connector ground contact portion 11 is located between the surface of the substrate 3 and the bottom surface side of the connector 2 (the surface facing the substrate 3), while the frame ground contact portion 12 is positioned between the panel member 4 and the edge of the substrate 3.
In this embodiment, the bottom side of the connector 2 (the side facing the substrate 3) is a connector ground. In the following description, the bottom side of the connector 2 is described as a connector ground. Add “B”.
Further, in this embodiment, the panel member 4 also serves as a frame ground. In the following description, a portion where the frame ground contact portion of the panel member 4 contacts is described as a frame ground. ".

The contact 1 has elasticity by being composed of a thin metal material, and in a state where the fixing portion 13 is fixed to the substrate 3 in a cantilevered state (state shown in FIG. 4 described later), the frame ground contact When an urging force is applied to the portion 12 in the arrow direction (direction approaching the substrate, the arrow direction shown in FIG. 2), the urging force causes the connector ground contact portion 11 to move in the arrow direction (direction in contact with the connector, FIG. 2). It is made to act as an urging force to be displaced (in the state shown in FIG. 6 described later).
Conversely, when an urging force in the direction opposite to the arrow direction is applied to the connector ground contact portion 11, the urging force acts as an urging force that displaces the frame ground contact portion 12 in the direction opposite to the arrow direction. (Not shown).
That is, the contact 1 of the present embodiment is configured so that the urging force applied to one contact portion of the connector ground contact portion 11 and the frame ground contact portion 12 in the state where the fixing portion 13 is fixed to the substrate 3 in a cantilevered manner. It is made to act as a biasing force in a direction in which the contact portion is brought into contact with the ground corresponding to the contact portion.
In the figure, reference numeral 11A is a contact surface that contacts the connector ground B, and reference numeral 12A is a contact surface that contacts the frame ground C.

As shown in FIGS. 4 and 5, the connector 2 exemplified in this embodiment is built in a chassis 21 that constitutes a connector ground B, and an engagement piece 22 projecting from the chassis 21 is provided on the substrate 3 from its surface. The engaging piece 22 inserted and protruded from the back surface is fixed to the substrate 3 by soldering.
Further, as shown in FIGS. 6 and 8, the connector 2 slightly protrudes from the edge of the board 3 so that the cable connection portion 23 is exposed from the opening 41 opened in the panel member 4. The projecting portion is inserted into the opening 41.

  As shown in FIGS. 7 and 8, the support structure for the panel member 4 of the substrate 3 exemplified in this embodiment is formed on the surface of the panel member 4 on the screwing portion 31 provided on the panel member side of the surface of the substrate 3. This is a well-known structure in which the substrate 3 is supported with respect to the panel member 4 by screwing a screw 43 or the like from the opened screw hole 42.

As described above, the connector 2 is fixed to the board 3, and the board 3 is supported by the panel member 4, so that the connector ground contact portion 11 is connected to the surface of the board 3 and the connector 2 as shown in FIG. It is located so as to be sandwiched between the connector grounds B.
The frame ground contact portion 12 is positioned between the frame ground C and the edge of the substrate 3 and is positioned so that a biasing force in the direction of the substrate 3 is applied by the panel member 4. The ground contact portion 12 is elastically deformed toward the substrate 3.
At this time, a reaction force that resists the elastic deformation acts on the frame ground contact portion 12, and the contact surface 12A comes into contact with the frame ground C by this reaction force.
Further, the biasing force in the direction of the board 3 with respect to the frame ground contact portion 12 acts as a biasing force for displacing the connector ground contact portion 11 in the direction of the connector 2 as described above. Touch to be pressed.
Further, as described above, when the biasing force in the direction opposite to the arrow direction is applied to the connector ground contact portion 11, the biasing force causes the frame ground contact portion 12 to be displaced in the direction opposite to the arrow direction. Therefore, when the contact surface 11A comes into contact with the ground B so as to be pressed, a biasing force in the direction of the board 3 acts on the connector ground contact portion 11, and the biasing force is This acts as an urging force in the direction of increasing the reaction force in the direction of pressing the frame ground contact portion 12 against the frame ground.
Therefore, the urging force in the direction of the board 3 acting on the frame ground contact portion 12 causes the reaction force for bringing the contact surface 12A into contact with the frame ground C and the contact surface 11A in contact with the connector ground B. Further, the contact force can act as an urging force for increasing the reaction force for bringing the contact surface 12A into contact with the frame ground C, so that the frame of the frame ground contact portion 12 can be operated. The contact state with respect to the ground C and the contact state with respect to the connector ground B of the connector ground contact portion 11 can be reliably held.
In this embodiment, the connector ground contact portion 11 is in a non-contact state with respect to the connector ground B when no biasing force is applied to the frame ground contact portion 12, and the biasing force is applied to the frame ground contact portion 12. However, in the present invention, the connector ground contact portion 11 may be brought into contact with the connector ground B from the beginning (not shown).

Next, the configuration of the contact 1 according to the first embodiment will be specifically described with reference to FIGS.
The connector ground contact part 11 of the contact 1 of this embodiment is provided with two independently in the left-right parallel form in FIG. 1, and as shown in FIG. 4 and FIG. It is inserted between the connector ground B of the two fixed connectors 2 and the substrate 3.
The connector ground contact portion 11 has a contact surface 11A parallel to the connector ground B. When the connector ground contact portion 11 is positioned between the connector ground B, the entire contact surface 11A is connected to the connector ground B. The contact surface 11 </ b> A is elastically brought into contact with the connector ground B by the displacement of the connector ground contact portion 11 due to the urging force with respect to the frame ground contact portion 12.

The frame ground contact portion 12 of this embodiment is configured to connect the connector ground contact portion 11 across the two left and right connector ground contact portions 11.
The frame ground contact portion 12 is formed by bending the end portion of the connector ground contact portion 11 downward in FIGS. 2 and 3 so that the contact surface 12A has a frame ground C in the panel member 4 as shown in FIGS. It is formed to face.
The frame ground contact portion 12 is formed in an inclined shape in a direction approaching the frame ground C from the upper end portion (folded portion) of the frame ground contact portion 12 toward the lower end portion.
That is, when the frame ground contact portion 12 having the above-described configuration is positioned between the panel member 4 and the edge of the substrate 3, the panel member 4 causes the frame ground contact portion 12 to be in a direction opposite to the inclination direction (substrate In such a state that the frame ground contact portion 12 is pressed, a biasing force that deforms the frame ground contact portion 12 acts, and a reaction force is generated from the deformation to return to the panel member 4 direction. Thus, the contact state of the contact surface 12A with the frame ground C is maintained.

Similarly to the connector ground contact portion 11, the fixed portion 13 of the present embodiment is provided with two independently in the left-right parallel form, and as shown in FIGS. 4 and 5, is in contact with the back surface of the substrate 3. I have to.
Further, the fixed portion 13 has a contact surface 13A parallel to the back surface of the substrate 3, and when the fixed portion 13 is positioned on the back surface of the substrate 3, the entire contact surface 13A contacts the back surface of the substrate 3. It has become.
That is, since the entire contact surface 13A can be soldered in a state where it is in contact with the back surface of the substrate 3, the fixing portion 13 can be fixed securely.

Reference numeral 13B denotes a notch for avoiding the engagement piece 22 of the connector 2, and when the fixing part 13 is positioned on the back surface of the substrate 3, the connector 2 is engaged with the notch 13B. It is formed at a position where the piece 22 passes.
That is, when the engaging piece 22 of the connector 2 is soldered, the fixing portion 13 can also be soldered and fixed by simultaneously soldering the edge portion of the notch portion 13B.
Further, the fixing portion 13 is formed by bending the end portion of the connector ground contact portion 11 in the same inclination direction as that of the frame ground contact portion 12 in FIGS. 2 and 3, and facing portion 13 </ b> C facing the frame ground B in the panel member 4. Further, the lower end portion of the facing portion 13C is bent in the direction of the substrate 3 to form the contact surface 13A.

Reference numeral 13D denotes a connecting portion that connects the frame ground contact portion 12 and the facing portion 13C, and is formed to have a width smaller than the width of the facing portion 13C. It is easy to transmit to the connector ground contact portion 11 and difficult to transmit to the fixed portion 13, and the biasing force is applied to the connector ground contact portion without affecting the fixed portion 13. .
As shown in FIGS. 2 and 6, the urging force causes the connector ground contact portion 11 to move substantially circularly (counterclockwise in the drawing) with the connecting portion between the fixed portion 13 and the facing portion 13C as a fulcrum. The connector ground contact portion 11 is displaced and brought into contact with the connector ground B, and the contact state of the contact surface 11A with the connector ground B is maintained.

As described above, according to the contact 1 of the present embodiment, an EMI prevention structure can be configured by one contact 1.
Further, the present invention can also be applied to a structure in which a conventional component constituting a contact is not sandwiched between the panel member 4 and the connector 2, such as the board unit A using USB or IEEE1394.
By reducing the number of various parts, it is possible to greatly contribute to the reduction of various costs, the simplification of the structure, and the improvement of the ease of parts management.
Moreover, according to the EMI prevention structure using the contact 1, the number of parts can be reduced, and the cost can be greatly reduced, the structure can be simplified, and the ease of parts management can be greatly improved. 1 can reliably hold the contact state between the connector ground contact portion 11 and the connector ground B, and the frame ground contact portion 12 and the frame ground C.

Next, the configuration of the contact 1 according to the second embodiment will be described in detail with reference to FIG. 9, but the description of the same parts as those in the first embodiment will be omitted by giving the same reference numerals.
The contact 1 of this embodiment is configured such that the fixing portion 13 is flush with the connector ground contact portion 11 and is fixed to the surface of the substrate 3.
The fixing portion 13 is provided with an engaging piece 13E for fixing the fixing portion 13, and the engaging piece 13E is connected to the engaging piece 22 in the connector 2 with respect to the surface of the substrate 3. Together with the engagement piece 22 inserted in the same position and protruding from the back surface of the substrate 3, it is fixed to the substrate 3 by soldering.

Also in the contact 1 of this embodiment, as in the contact 1 of the first embodiment, the urging force (shown in FIG. 2) is applied to the frame ground contact portion 12 in a state where the fixing portion 13 is fixed to the substrate 3 in a cantilever manner. When an arrow) is given, the biasing force acts as a biasing force that displaces the connector ground contact portion 11 in the direction of the arrow (the arrow in the direction of contact with the connector shown in FIG. 2). In contrast, when a biasing force in the direction opposite to the arrow direction is applied, the biasing force acts as a biasing force that displaces the frame ground contact portion 12 in the direction opposite to the arrow direction.
That is, also in the contact 1 of this embodiment, in the state where the fixing portion 13 is fixed to the substrate 3 in a cantilever manner, the biasing force with respect to one contact portion of the connector ground contact portion 11 and the frame ground contact portion 12 is The other contact portion can act as an urging force in a direction in which the contact portion is brought into contact with the ground corresponding to the contact portion.
Further, as described above, when the biasing force in the direction opposite to the arrow direction is applied to the connector ground contact portion 11, the biasing force causes the frame ground contact portion 12 to be displaced in the direction opposite to the arrow direction. Therefore, when the contact surface 11A comes into contact with the ground B so as to be pressed, a biasing force in the direction of the board 3 acts on the connector ground contact portion 11, and the biasing force is The frame ground contact portion 12 can act as an urging force in the direction of increasing the reaction force in the direction of pressing to the frame ground.
With this configuration, the contact state of the contact surface 11A with the connector ground B and the contact state of the contact surface 12A with the frame ground C can be reliably held.

As described above, even with the contact 1 of this embodiment, an EMI prevention structure can be configured by a single contact 1.
Further, the present invention can also be applied to a structure in which a conventional component constituting a contact is not sandwiched between the panel member 4 and the connector 2, such as the board unit A using USB or IEEE1394.
By reducing the number of various parts, it is possible to greatly contribute to the reduction of various costs, the simplification of the structure, and the improvement of the ease of parts management.
Moreover, according to the EMI prevention structure using the contact 1, the number of parts can be reduced, and the cost can be greatly reduced, the structure can be simplified, and the ease of parts management can be greatly improved. 1 can reliably hold the contact state between the connector ground contact portion 11 and the connector ground B, and the frame ground contact portion 12 and the frame ground C.

It should be noted that the present invention is not limited to the illustrated embodiments, and can be implemented with configurations within a range that does not deviate from the contents described in the respective claims.
For example, the illustrated contactor is formed by cutting and bending into a predetermined shape using a thin metal material, but in the present invention, a thin and hard synthetic resin material is predetermined. It is good also as a contact of the form formed by cutting and bending into a shape, and further metal-plating the connector ground contact portion and the frame ground contact portion to ensure conductivity.
The contact is a shape in which the connector ground contact is positioned between the connector and the surface of the board. In the present invention, when a biasing force is applied to the frame ground contact portion, The shape of the connector ground contact portion is not limited as long as the contact ground portion can be reliably brought into contact and the contact state can be reliably maintained.
That is, the connector gland exemplified in this embodiment is set on the front surface side of the chassis holding the board, but as described above, the connector gland is set in accordance with the shape of the contact.
Further, the EMI prevention structure exemplified in this embodiment is configured as a board unit in which a board to which a connector is attached is supported by a metal panel member which is an example of a housing. May be directly supported by the housing, and a frame ground may be provided on the housing, and the frame ground contact portion may be brought into contact with the housing on the frame ground side.

The top view of the contact of the 1st form which concerns on this invention. Same side view. Same as above, front view. The side view of the state which attached the contactor to the board | substrate. FIG. The principal part sectional view of the substrate unit provided with the EM1 prevention structure using the contact of the 1st form. The top view of a board | substrate unit. The front view of a board | substrate unit. The perspective view of the contact of the 1st form which concerns on this invention. The perspective view which shows the conventional EM1 prevention structure.

Explanation of symbols

1: Contact (EMI prevention contact)
2: Connector 3: Board 4: Panel member (housing)
11: Connector ground contact portion 12: Frame ground contact portion 13: Fixed portion B: Connector ground C: Frame ground 11A: Contact surface 12A: Contact surface 13D: Connection portion 13E: Engagement piece

Claims (4)

In the EMI prevention contact for the interface connector used for connection with other electronic devices,
A connector ground contact portion having conductivity to contact the connector ground on the connector side mounted on the board;
A frame ground contact portion having electrical conductivity that comes into contact with a frame ground provided in a housing having an opening through which the cable connection portion of the connector is exposed;
The connector ground contact portion and the frame ground contact portion are integrally formed with the substrate by fixing the substrate to the substrate using a fixing agent.
The connector ground contact portion and the frame ground contact portion are subjected to a reaction force against the biasing force when a biasing force in a direction to increase the contact force with the ground corresponding to each contact portion is applied to both contact portions. And the urging force applied to one contact portion is applied to the other contact portion as an urging force in a direction to increase the contact force with the ground corresponding to the contact portion. Contact for EMI prevention. An EMI prevention structure using the EMI prevention contact according to claim 1,
The contact for EMI prevention is attached by fixing the fixed part to the substrate,
In the mounted state, the connector ground contact portion is held at a position where it can contact the connector ground, and the frame ground contact portion is held at a position where it can contact the frame ground.
And both contact parts are in the state where the board is supported by the case, and when the urging force in the direction of increasing the contact force is applied to both contact parts by contact with the ground corresponding to each contact part. A reaction force acting against the biasing force acts, and the biasing force with respect to one contact portion is used as a biasing force in a direction in which the contact force with the ground corresponding to the contact portion is increased with respect to the other contact portion. A contact for preventing EMI, wherein the contact is made to act. An EMI prevention structure using the EMI prevention contact according to claim 1,
The EMI prevention contact is attached to the substrate supported by the casing by fixing the fixing portion.
In the mounted state, the connector ground contact portion is in contact with the connector ground, the frame ground contact portion is in contact with the frame ground,
In addition, an urging force in the direction of increasing the contact force is applied to both contact portions by contact with the ground corresponding to each contact portion, and a reaction force against the urging force is applied. EMI is characterized in that the urging force with respect to the contact portion is acting as an urging force in the direction of increasing the contact force with the ground corresponding to the contact portion with respect to the other contact portion. Prevention structure.   4. The EMI prevention contact according to claim 1 and the EMI prevention structure according to claim 2, wherein the casing includes a panel member that supports the substrate. 5.

Images