JP2008164816A5 - - Google Patents

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Publication number
JP2008164816A5
JP2008164816A5 JP2006352878A JP2006352878A JP2008164816A5 JP 2008164816 A5 JP2008164816 A5 JP 2008164816A5 JP 2006352878 A JP2006352878 A JP 2006352878A JP 2006352878 A JP2006352878 A JP 2006352878A JP 2008164816 A5 JP2008164816 A5 JP 2008164816A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2006352878A
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Japanese (ja)
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JP5419324B2 (en
JP2008164816A (en
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Priority to JP2006352878A priority Critical patent/JP5419324B2/en
Priority claimed from JP2006352878A external-priority patent/JP5419324B2/en
Publication of JP2008164816A publication Critical patent/JP2008164816A/en
Publication of JP2008164816A5 publication Critical patent/JP2008164816A5/ja
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Publication of JP5419324B2 publication Critical patent/JP5419324B2/en
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JP2006352878A 2006-12-27 2006-12-27 Photosensitive resin composition Active JP5419324B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006352878A JP5419324B2 (en) 2006-12-27 2006-12-27 Photosensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006352878A JP5419324B2 (en) 2006-12-27 2006-12-27 Photosensitive resin composition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011264176A Division JP5419952B2 (en) 2011-12-02 2011-12-02 Photosensitive resin composition

Publications (3)

Publication Number Publication Date
JP2008164816A JP2008164816A (en) 2008-07-17
JP2008164816A5 true JP2008164816A5 (en) 2010-01-28
JP5419324B2 JP5419324B2 (en) 2014-02-19

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ID=39694433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006352878A Active JP5419324B2 (en) 2006-12-27 2006-12-27 Photosensitive resin composition

Country Status (1)

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JP (1) JP5419324B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6270372B2 (en) * 2013-08-14 2018-01-31 旭化成株式会社 Photosensitive resin composition, method for producing cured relief pattern, semiconductor device and display device
CN106462061B (en) 2014-05-09 2019-11-26 住友电木株式会社 Photosensitive polymer combination, cured film, protective film, insulating film and electronic device
JP5672403B1 (en) * 2014-05-26 2015-02-18 住友ベークライト株式会社 Photosensitive resin composition and electronic device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0743899A (en) * 1993-07-28 1995-02-14 Japan Synthetic Rubber Co Ltd Radiation sensitive resin composition
JP3422704B2 (en) * 1997-12-16 2003-06-30 住友ベークライト株式会社 Positive photosensitive resin composition
JP4462679B2 (en) * 1999-03-30 2010-05-12 旭化成イーマテリアルズ株式会社 Silicon coupling agent and its use
KR20060023520A (en) * 2003-03-11 2006-03-14 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. Novel photosensitive resin compositions
JP2005026394A (en) * 2003-07-01 2005-01-27 Sumitomo Bakelite Co Ltd Method for removing cured film of positive photosensitive resin composition, and semiconductor device employing the method
JP2006119271A (en) * 2004-10-20 2006-05-11 Toray Ind Inc Adhesion improver and substrate treating liquid using the same
JP4655882B2 (en) * 2004-10-29 2011-03-23 Ｊｓｒ株式会社 Positive photosensitive insulating resin composition and cured product thereof

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