JP2008158013A5 - - Google Patents

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JP2008158013A5
JP2008158013A5 JP2006343644A JP2006343644A JP2008158013A5 JP 2008158013 A5 JP2008158013 A5 JP 2008158013A5 JP 2006343644 A JP2006343644 A JP 2006343644A JP 2006343644 A JP2006343644 A JP 2006343644A JP 2008158013 A5 JP2008158013 A5 JP 2008158013A5
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Prior art keywords
substrate
optical element
structures
resist pattern
tracks
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JP2006343644A
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JP2008158013A (en
JP5081443B2 (en
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Claims (13)

凸部または凹部からなる構造体が可視光の波長以下の微細ピッチで基体表面に多数配置されてなる光学素子であって、
上記構造体は、隣接する3列のトラック間において準六方格子パターンを構成し、
上記構造体は、頂部の傾きが緩やかで中央部から底部に徐々に急峻な傾きの楕円錐形状または楕円錐台形状を有していることを特徴とする光学素子。
An optical element in which a large number of structures composed of convex portions or concave portions are arranged on a substrate surface with a fine pitch equal to or smaller than the wavelength of visible light,
The above structure constitutes a quasi-hexagonal lattice pattern between adjacent three rows of tracks,
The optical element according to claim 1, wherein the structure has an elliptical cone shape or an elliptical truncated cone shape with a gentle top slope and a gradually steep slope from the center to the bottom.
上記構造体は、上記基体表面において複数列の円弧状トラックをなすように配置されていることを特徴とする請求項1記載の光学素子。   2. The optical element according to claim 1, wherein the structure is arranged so as to form a plurality of rows of arc-shaped tracks on the surface of the base. 同一トラック内における上記構造体の配置ピッチP1は、隣接する2つのトラック間における上記構造体の配置ピッチP2よりも長いことを特徴とする請求項1記載の光学素子。   2. The optical element according to claim 1, wherein the arrangement pitch P1 of the structures in the same track is longer than the arrangement pitch P2 of the structures between two adjacent tracks. 上記構造体は、上記円弧状トラックの円周方向に長軸方向をもつ楕円錐形状または楕円錐台形状であり、上記楕円錐形状または楕円錐台形状は、頂部の傾きが緩やかで中央部から底部に徐々に急峻な傾きに形成されていることを特徴とする請求項記載の光学素子。 The structure has an elliptical cone shape or an elliptical truncated cone shape having a major axis direction in the circumferential direction of the arc-shaped track. 3. The optical element according to claim 2 , wherein the optical element is formed with a gradually steep slope at the bottom. 上記円弧状トラックの円周方向における上記構造体の高さ(深さ)は、上記円弧状トラックの径方向における上記構造体の高さ(深さ)よりも小さいことを特徴とする請求項記載の光学素子。 The height of the structures in the circumferential direction of the arc-shaped track (depth), claim 2, wherein the height of the arcuate track the structures in the radial (depth) smaller than The optical element described. 凸部または凹部からなる構造体が可視光の波長以下の微細ピッチで基板表面に多数配置されてなる光学素子作製用複製基板であって、
上記構造体は、隣接する3列のトラック間において準六方格子パターンを構成し、
上記構造体は、頂部の傾きが緩やかで中央部から底部に徐々に急峻な傾きの楕円錐形状または楕円錐台形状を有していることを特徴とする光学素子作製用複製基板。
A replica substrate for producing an optical element in which a large number of structures consisting of convex portions or concave portions are arranged on the substrate surface at a fine pitch below the wavelength of visible light,
The above structure constitutes a quasi-hexagonal lattice pattern between adjacent three rows of tracks,
A replica substrate for producing an optical element, wherein the structure has an elliptical cone shape or an elliptical truncated cone shape having a gentle slope at the top and a gradually steep slope from the center to the bottom.
凸部または凹部からなる構造体が可視光の波長以下の微細ピッチで基板表面に多数配置されてなる光学素子作製用複製基板の製造方法であって、
表面にレジスト層が形成された基板を準備する第1の工程と、
上記基板を回転させるとともに、レーザ光を上記基板の回転半径方向に相対移動させながら、上記レジスト層にレーザ光を間欠的に照射して、可視光の波長よりも短いピッチで潜像を形成する第2の工程と、
上記レジスト層を現像して、上記基板の表面にレジストパターンを形成する第3の工程と、
上記レジストパターンをマスクとするエッチング処理を施すことで、上記基板の表面に凹凸構造を形成する第4の工程と、
上記基板の凹凸構造を転写して複製基板を作製する第5の工程と
を有し、
上記第2の工程では、隣接する3列のトラック間において準六方格子パターンを構成するように上記潜像を形成することを特徴とする光学素子作製用複製基板の製造方法。
A method for producing a replica substrate for producing an optical element, wherein a large number of structures comprising convex portions or concave portions are arranged on the substrate surface at a fine pitch below the wavelength of visible light,
A first step of preparing a substrate having a resist layer formed on the surface;
While rotating the substrate and relatively moving the laser beam in the rotational radius direction of the substrate, the resist layer is intermittently irradiated with the laser beam to form a latent image at a pitch shorter than the wavelength of visible light. A second step;
A third step of developing the resist layer to form a resist pattern on the surface of the substrate;
A fourth step of forming an uneven structure on the surface of the substrate by performing an etching process using the resist pattern as a mask;
Possess a fifth step of preparing a duplicate substrate by transferring an uneven structure of the substrate,
In the second step, the latent image is formed so as to form a quasi-hexagonal lattice pattern between adjacent three rows of tracks .
上記第4の工程では、上記レジストパターンをマスクとするエッチング処理と上記レジストパターンに対するアッシング処理とを繰り返し行うと共に、エッチング処理時間を徐々に長くすることを特徴とする請求項記載の光学素子作製用複製基板の製造方法。 8. The optical element fabrication according to claim 7, wherein in the fourth step, an etching process using the resist pattern as a mask and an ashing process on the resist pattern are repeated, and the etching process time is gradually increased. Method for manufacturing a replication substrate. 上記第5の工程では、上記基板の表面に光硬化樹脂層を形成した後、該光硬化樹脂層を剥離し、上記凹凸構造が転写された複製基板を作製することを特徴とする請求項記載の光学素子作製用複製基板の製造方法。 In the fifth step, claims, characterized in that after forming a photocurable resin layer on the surface of the substrate, peeling the photocurable resin layer to produce a duplicate substrate that the uneven structure is transferred 7 The manufacturing method of the replication substrate for optical element preparation of description. 凸部または凹部からなる構造体が可視光の波長以下の微細ピッチで基板表面に多数配置されてなる光学素子の製造方法であって、
表面にレジスト層が形成された基板を準備する第1の工程と、
上記基板を回転させるとともに、レーザ光を上記基板の回転半径方向に相対移動させながら、上記レジスト層にレーザ光を間欠的に照射して、可視光波長よりも短いピッチで潜像を形成する第2の工程と、
上記レジスト層を現像して、上記基板の表面にレジストパターンを形成する第3の工程と、
上記レジストパターンをマスクとするエッチング処理を施すことで、上記基板の表面に凹凸構造を形成する第4の工程と、
上記基板の複製基板を作製し、上記複製基板の凹凸構造の上に金属メッキ層を形成する第5の工程と、
上記金属メッキ層を上記複製基板から剥離して、上記凹凸構造が転写された成形金型を作製する第6の工程と、
上記成形金型を用いて上記凹凸構造が表面に形成された透明基体を成形する第7の工程と
を有し、
上記第2の工程では、隣接する3列のトラック間において準六方格子パターンを構成するように上記潜像を形成することを特徴とする光学素子の製造方法。
A method of manufacturing an optical element in which a large number of structures composed of convex portions or concave portions are arranged on a substrate surface with a fine pitch below the wavelength of visible light,
A first step of preparing a substrate having a resist layer formed on the surface;
While rotating the substrate and relatively moving the laser light in the rotational radius direction of the substrate, the resist layer is intermittently irradiated with the laser light to form a latent image at a pitch shorter than the visible light wavelength. Two steps;
A third step of developing the resist layer to form a resist pattern on the surface of the substrate;
A fourth step of forming an uneven structure on the surface of the substrate by performing an etching process using the resist pattern as a mask;
A fifth step of producing a replica substrate of the substrate and forming a metal plating layer on the concavo-convex structure of the replica substrate;
A sixth step of peeling the metal plating layer from the replica substrate to produce a molding die to which the concavo-convex structure is transferred;
Possess a seventh step of the concavo-convex structure is formed a transparent substrate formed on the surface by using the molding die,
In the second step, the latent image is formed so as to form a quasi-hexagonal lattice pattern between adjacent three rows of tracks .
上記第7の工程の後、上記透明基体を所定サイズに切り出す第8の工程をさらに有する
ことを特徴とする請求項10記載の光学素子の製造方法。
The method of manufacturing an optical element according to claim 10 , further comprising an eighth step of cutting the transparent substrate into a predetermined size after the seventh step.
上記第4の工程では、上記レジストパターンをマスクとするエッチング処理と上記レジストパターンに対するアッシング処理とを繰り返し行うと共に、エッチング処理時間を徐々に長くすることを特徴とする請求項10記載の光学素子の製造方法。 11. The optical element according to claim 10, wherein in the fourth step, an etching process using the resist pattern as a mask and an ashing process on the resist pattern are repeatedly performed, and the etching process time is gradually increased. Production method. 上記第5の工程では、上記基板の表面に光硬化樹脂層を形成した後、該光硬化樹脂層を剥離し、上記凹凸構造が転写された複製基板を作製することを特徴とする請求項10記載の光学素子の製造方法。 In the fifth step, claims, characterized in that after forming a photocurable resin layer on the surface of the substrate, peeling the photocurable resin layer to produce a duplicate substrate that the uneven structure is transferred 10 The manufacturing method of the optical element of description.
JP2006343644A 2006-12-20 2006-12-20 OPTICAL ELEMENT AND ITS MANUFACTURING METHOD, OPTICAL ELEMENT MANUFACTURING REPLICATION BOARD AND ITS MANUFACTURING METHOD Active JP5081443B2 (en)

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WO2010008091A1 (en) * 2008-07-16 2010-01-21 ソニー株式会社 Optical element
JP5111305B2 (en) * 2008-08-29 2013-01-09 富士フイルム株式会社 Pattern forming body and manufacturing method thereof
JP5439783B2 (en) 2008-09-29 2014-03-12 ソニー株式会社 Optical element, optical component with antireflection function, and master
JP4968953B2 (en) * 2008-11-17 2012-07-04 修司 岩田 Functional substrate having antireflection function and manufacturing method thereof
JP5257066B2 (en) * 2008-12-26 2013-08-07 ソニー株式会社 Optical element, display device, optical component with antireflection function, and master
JP2011053495A (en) * 2009-09-02 2011-03-17 Sony Corp Optical element and method for producing the same
JP2012208526A (en) * 2009-09-02 2012-10-25 Sony Corp Optical element, and display unit
JP5075234B2 (en) * 2009-09-02 2012-11-21 ソニー株式会社 Optical element and display device
US20120307368A1 (en) 2010-03-02 2012-12-06 Panasonic Corporation Optical element and method of manufacturing optical elements
JP6252047B2 (en) * 2013-09-03 2017-12-27 大日本印刷株式会社 Transmittance anisotropic member, method for manufacturing transmittance anisotropic member, and display device

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