JP2008151957A - Optical communication module and optical sub-assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical communication module with which leakage of an electromagnetic wave is suppressed, and to provide an optical sub-assembly. <P>SOLUTION: The optical communication module 100 is equipped with: a receptacle portion 106 into which an optical connector plug 20 is to be inserted; a casing portion 102 to be connected to the receptacle portion 106 and to contain a circuit board 104; and an optical transmitting sub-assembly 108 and an optical receiving sub-assembly 112 optically coupled to the optical connector plug 20 and electrically connected to the circuit board 104. At least a part of the receptacle portion 106, at least a part of the casing portion 102, at least a part of the optical transmitting sub-assembly 108, or at least a part of the optical receiving sub-assembly 112 is composed of a resin containing an additive having an electromagnetic wave absorption property. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical communication module and an optical subassembly.

The optical communication module includes an optical transmission subassembly, an optical reception subassembly, a circuit board, a receptacle, and a housing. The optical transmission subassembly has a light emitting element that generates light, and the optical reception subassembly has a light receiving element for receiving light. The circuit board is mounted with a driver IC and the like, and is electrically connected to the light emitting element and the light receiving element. The housing is provided so as to cover the optical transmission subassembly, the optical reception subassembly, and the circuit board. The receptacle has an opening for optically coupling the optical fiber to each of the light emitting element and the light receiving element. An optical connector plug holding an optical fiber is inserted into the opening of the receptacle. In such an optical communication module, a metal casing is used in order to prevent electromagnetic waves from being emitted to the outside. Such a technique is disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-212709.
JP 2004-212709 A

  However, in the above-described optical communication module, since a metal casing is produced by combining a plurality of metal plates, electromagnetic waves leak from the gaps between the metal plates.

  Therefore, an object of the present invention is to provide an optical communication module and an optical subassembly that can suppress leakage of electromagnetic waves.

  The optical communication module of the present invention is optically coupled to a receptacle part for inserting an optical connector plug, a housing part connected to the receptacle part for accommodating a circuit board, and the optical connector plug, An optical subassembly electrically connected to the circuit board, wherein at least a part of the receptacle part, at least a part of the housing part, or at least a part of the optical subassembly has electromagnetic wave absorptivity. It consists of resin containing the additive which has.

  The optical communication module of the present invention is optically coupled to a receptacle part for inserting an optical connector plug, a casing part connected to the receptacle part for accommodating a circuit board, and the optical connector plug. And an optical subassembly that is electrically connected to the circuit board, and a holding unit that holds the optical subassembly in the casing unit or the receptacle unit, wherein at least a part of the receptacle unit, the housing At least a part of the body part, at least a part of the optical subassembly, or at least a part of the holding part is made of a resin containing an additive having electromagnetic wave absorptivity.

  In the optical communication module of the present invention, since an easily processable resin is used, a gap between members constituting the optical communication module can be narrowed. Therefore, according to the optical communication module of the present invention, electromagnetic waves leaking from the gap can be suppressed.

  Moreover, it is preferable that resin containing the said additive absorbs electromagnetic waves with a frequency of 1 GHz or more and 50 GHz or less. In this case, radiation noise from the optical communication module can be effectively suppressed.

  Moreover, it is preferable that the said additive is the fine powder which consists of iron, iron oxide, carbon, or stainless steel. The additive is preferably a fine powder composed of two or more materials of iron, aluminum, cobalt, and silicon. The additive may be fine powder made of aluminum, cobalt, or silicon.

  The resin is preferably a polyamide resin, a PBT resin, a PPS resin, an LCP resin, or a PEEK resin. In this case, a member having an electromagnetic wave absorption function can be provided at low cost by injection molding.

  The optical subassembly of the present invention includes a photoelectric conversion element and a housing that accommodates the photoelectric conversion element, and at least a part of the housing is made of a resin containing an additive having electromagnetic wave absorptivity.

  In the optical subassembly of the present invention, since an easily processable resin is used, in the optical communication module, a gap between the optical subassembly and a member other than the optical subassembly can be narrowed. Therefore, according to the optical subassembly of the present invention, electromagnetic waves leaking from the gap can be suppressed.

  ADVANTAGE OF THE INVENTION According to this invention, the optical communication module and optical subassembly which can suppress the leakage of electromagnetic waves are provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are used for the same or equivalent elements, and duplicate descriptions are omitted.

  FIG. 1 is a perspective view schematically showing an optical communication device including the optical communication module according to the present embodiment. The optical communication device 10 illustrated in FIG. 1 includes an optical communication module 100 and an optical connector plug 20 that is inserted into the opening 106a or the opening 106b of the receptacle 106 of the optical communication module 100. For example, two optical connector plugs 20 are inserted into the opening 106a and the opening 106b, respectively. As the optical communication module 100, for example, an optical transceiver can be used. An optical transmission subassembly 108 (optical subassembly: OSA) that is optically coupled to the optical connector plug 20 is disposed in the opening 106a. An optical receiving subassembly 112 (optical subassembly) that is optically coupled to the optical connector plug 20 is disposed in the opening 106b.

  The optical connector plug 20 is for transmitting an optical signal from the optical communication module 100 or transmitting an optical signal from the outside to the optical communication module 100. The optical connector plug 20 may be any of an SC type optical connector plug, an MU type optical connector plug, and an LC type optical connector plug. The optical connector plug 20 includes a housing 22, a ferrule 24 housed in the housing 22, and an optical fiber housed in the ferrule 24. The ferrule 24 protrudes from the housing 22 toward the optical communication module 100 side. A cable that is optically coupled to the optical fiber is connected to the housing 22.

  FIG. 2 is an exploded perspective view schematically showing the optical communication module according to the present embodiment. FIG. 3 is a plan view schematically showing the inside of the optical communication module according to the present embodiment.

  The optical communication module 100 shown in FIGS. 1 to 3 includes a receptacle 106 for inserting the optical connector plug 20, a housing 102 connected to the receptacle 106 and accommodating the circuit board 104, and an optical connector plug. 20 and an optical transmission subassembly 108 and an optical reception subassembly 112 that are optically coupled to the circuit board 104 and electrically connected to the circuit board 104. Further, the optical communication module 100 includes a holding unit 110 that holds the optical transmission subassembly 108 in the casing unit 102 or the receptacle unit 106, and a holding unit 114 that holds the optical receiving subassembly 112 in the casing unit 102 or the receptacle unit 106. With.

  The casing 102 includes a box part 102b that accommodates the circuit board 104 and a lid part 102a that closes an opening of the box part 102b.

  The circuit board 104 is an electronic circuit board on which, for example, a driver IC for driving a light emitting element is mounted. Since the circuit board 104 is electrically connected to the optical transmission subassembly 108 and the optical reception subassembly 112, the optical communication module 100 generates electromagnetic waves from elements or wirings therein.

  The optical transmission subassembly 108 is a device that outputs an optical signal, and includes a light emitting element such as a semiconductor laser. The optical receiving subassembly 112 is a device that receives an optical signal, and includes a light receiving element such as a photodiode. Therefore, the optical transmission subassembly 108 and the optical reception subassembly 112 generate electromagnetic waves from elements or wirings therein.

  One end of the optical transmission subassembly 108 is inserted into the opening 110 a of the holding unit 110 and optically coupled to the optical connector plug 20. The holding unit 110 has, for example, a cylindrical shape. The other end of the optical transmission subassembly 108 is inserted into an opening 116 formed in the side surface of the box portion 102 b of the housing portion 102 and is electrically connected to the circuit board 104. One end of the optical receiving subassembly 112 is inserted into the opening 114 a of the holding unit 114 and optically coupled to the optical connector plug 20. The holding part 114 is, for example, cylindrical. The other end of the optical receiving subassembly 112 is inserted into an opening 118 formed on the side surface of the box portion 102 b of the housing portion 102 and is electrically connected to the circuit board 104.

  The receptacle 106 has two openings 106a and 106b. The two openings 106a and 106b accommodate an optical transmission subassembly 108 and an optical reception subassembly 112, respectively. The optical connector plug 20 is fitted into the openings 106 a and 106 b of the receptacle 106. As a result, the optical connector plug 20 is optically coupled to the light emitting element of the optical transmission subassembly 108 or the light receiving element of the optical reception subassembly 112.

  In the present embodiment, at least a part of the receptacle part 106, at least a part of the housing part 102, at least a part of the optical transmission subassembly 108, at least a part of the optical reception subassembly 112, and at least one of the holding parts 110 and 114. The part is made of a resin containing an additive having electromagnetic wave absorbability. Preferably, receptacle section 106, casing section 102, and holding sections 110 and 114 are made of a resin containing the additive. One or more parts of the receptacle part 106, the casing part 102, and the holding parts 110 and 114 may be made of a resin containing the additive. Further, two or more portions of the receptacle unit 106, the casing unit 102, and the holding units 110 and 114 may be integrated.

  The member made of the resin containing the additive can be obtained, for example, by cutting a bulk material into a predetermined shape, or by molding using a mold, for example. Moreover, in order to form a part of member from resin containing the said additive, insert molding can be used, for example.

  When the casing 102 is made of a resin containing an additive having electromagnetic wave absorbability, most of the electromagnetic waves generated from the circuit board 104 can be absorbed. Further, when the holding unit 110 is made of the resin containing the additive, most of the electromagnetic waves generated from the circuit board 104 and the optical transmission subassembly 108 can be absorbed. When the holding unit 114 is made of a resin containing the additive, it can absorb most of the electromagnetic waves generated from the circuit board 104 and the optical receiving subassembly 112. When the receptacle 106 is made of a resin containing the additive, the electromagnetic waves generated from the optical transmission subassembly 108 and the optical reception subassembly 112 can be prevented from diffusing to the surroundings. Further, when a part of the optical transmission subassembly 108 is made of a resin containing the additive, most of the electromagnetic waves generated from the circuit board 104 and the optical transmission subassembly 108 can be absorbed. When a part of the optical receiving subassembly 112 is made of a resin containing the above-described additive, most of the electromagnetic waves generated from the circuit board 104 and the optical receiving subassembly 112 can be absorbed.

  The resin is preferably used as a main raw material. Such resins include polyamide resin, PBT resin (polybutylene terephthalate resin), PPS resin (polyphenylene sulfide resin), LCP resin (liquid crystal polyester resin), PEEK resin (polyether ether ketone resin), epoxy resin, acrylate resin Etc. are exemplified. In particular, when a polyamide resin, a PBT resin, a PPS resin, an LCP resin, or a PEEK resin is used as the resin, a member having an electromagnetic wave absorption function can be provided at low cost by injection molding. Further, when an acrylate resin having fluidity is used as the resin, an electromagnetic wave absorption layer can be formed on the surface of an arbitrary member by coating.

  As the additive, fine powder made of iron, fine powder made of aluminum, fine powder made of cobalt, fine powder made of silicon, fine powder made of iron oxide, fine powder made of carbon, or fine powder made of stainless steel can be used. . Moreover, the fine powder of the alloy which consists of two or more materials among iron, aluminum, cobalt, and silicon can also be used as an additive. These additives can absorb electromagnetic waves by converting the electromagnetic waves into heat.

  The resin containing the additive preferably absorbs electromagnetic waves having a frequency of 1 GHz to 50 GHz. In this case, radiation noise from the optical communication module can be effectively suppressed.

  In the optical communication module 100 of the present embodiment, a resin that can be easily processed is used, so that a gap between members constituting the optical communication module 100 can be narrowed. Therefore, according to the optical communication module 100, electromagnetic waves leaking from the gap can be suppressed. In addition, since a resin that can be easily processed is used, the degree of freedom in design can be improved.

  FIG. 4 is a cross-sectional view schematically showing the optical subassembly according to the present embodiment. The optical subassembly 30 shown in FIG. 4 can be used as the optical transmission subassembly 108 or the optical reception subassembly 112 described above. The optical subassembly 30 includes a photoelectric conversion element 32 and a casing 31 that houses the photoelectric conversion element 32.

  The photoelectric conversion element 32 is electrically connected to the element body 54 through the substrate 50, the element main body 54 provided on the substrate 50, the lens 56 provided on the element main body 54, and the inside of the substrate 50. The pin 52 is provided. When the element body 54 is a light emitting element, the optical subassembly 30 is an optical transmission subassembly. When the element body 54 is a light receiving element, the optical subassembly 30 is an optical receiving subassembly.

  The housing 31 includes a housing portion 34 that surrounds the element main body 54 and the lens 56 on the substrate 50. The housing part 34 has a cylindrical shape, for example. The housing part 34 is formed with an opening disposed to face the lens 56. The end of the optical fiber 36 is disposed in the opening. Thereby, for example, the light emitted from the lens 56 enters the end of the optical fiber 36. For example, light emitted from the end of the optical fiber 36 enters the lens 56.

  The housing 31 includes a stub 38 that holds the optical fiber 36, a stub holder 40 that holds one end of the stub 38 in the housing portion 34, a sleeve 42 provided at the other end of the stub 38, and a sleeve that houses the sleeve 42. A case 44 is further provided. The stub 38, the sleeve 42, and the sleeve 42 are, for example, cylindrical.

  In the present embodiment, at least a part of the housing 31 is made of a resin containing an additive having electromagnetic wave absorptivity. Preferably, at least a part of the housing portion 34, at least a part of the stub 38, at least a part of the stub holder 40, at least a part of the sleeve 42, or at least a part of the sleeve case 44 contains the above-mentioned additive. Consists of. The housing | casing part 34, the stub 38, and the stub holder 40 may consist of metal. The sleeve 42 may be made of ceramic. The sleeve case 44 may be made of metal or resin. One or more portions of the housing portion 34, the stub 38, the stub holder 40, the sleeve 42, and the sleeve case 44 may be made of a resin containing the additive. Further, two or more portions of the housing portion 34, the stub 38, the stub holder 40, the sleeve 42, and the sleeve case 44 may be integrated.

  In the optical subassembly 30 of the present embodiment, an easily processable resin is used, and therefore, in the optical communication module 100, a gap between the optical subassembly 30 and a member other than the optical subassembly 30 (for example, the housing portion 102) is narrowed. can do. Therefore, according to the optical subassembly 30 of the present embodiment, electromagnetic waves leaking from the gap can be suppressed. In addition, since a resin that can be easily processed is used, the degree of freedom in design can be improved.

  FIG. 5 is a cross-sectional view schematically showing an optical subassembly according to another embodiment. The optical subassembly 30a shown in FIG. 5 can be used as the optical transmission subassembly 108 or the optical reception subassembly 112 described above.

  The optical subassembly 30 a includes a housing 31 a having a housing portion 34 and a sleeve case 44 a connected to the housing portion 34 instead of the housing 31 of the optical subassembly 30. The sleeve case 44a also serves as a sleeve. The sleeve case 44a is, for example, cylindrical.

  In the present embodiment, at least a part of the casing 31a is made of a resin containing the additive. Preferably, at least a part of the housing part 34 or at least a part of the sleeve case 44a is made of a resin containing the additive. The sleeve case 44a may be made of metal, resin, or ceramic. The inner peripheral surface of the sleeve case 44a may be made of ceramic. Note that one or more portions of the housing portion 34 and the sleeve case 44a may be made of a resin containing the additive. Moreover, the housing | casing part 34 and the sleeve case 44a may be integrated.

  In the optical subassembly 30a of the present embodiment, the same effects as the optical subassembly 30 can be obtained. The optical subassembly 30a does not require an optical fiber.

  The present invention is not limited to the above-described embodiment, and various modifications can be made. For example, the optical communication module 100 may not include the holding units 110 and 114. In that case, at least a part of the receptacle part 106, at least a part of the housing part 102, at least a part of the optical transmission subassembly 108, or at least a part of the optical reception subassembly 112 is made of an additive having electromagnetic wave absorption properties. It consists of resin to contain. Even in this case, since the gap between the members constituting the optical communication module 100 can be narrowed, electromagnetic waves leaking from the gap can be suppressed.

It is a perspective view which shows typically an optical communication apparatus provided with the optical communication module which concerns on this embodiment. 1 is an exploded perspective view schematically showing an optical communication module according to the present embodiment. It is a top view which shows typically the inside of the optical communication module which concerns on this embodiment. It is sectional drawing which shows typically the optical subassembly which concerns on this embodiment. It is sectional drawing which shows typically the optical subassembly which concerns on another embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 20 ... Optical connector plug, 30, 30a ... Optical subassembly, 31, 31a ... Housing, 32 ... Photoelectric conversion element, 102 ... Housing part, 104 ... Circuit board, 106 ... Receptacle part, 108 ... Optical transmission subassembly ( Optical subassembly), 100... Optical communication module, 110, 114... Holding unit, 112... Optical receiving subassembly (optical subassembly).

Claims (6)

A receptacle for inserting an optical connector plug;
A housing portion connected to the receptacle portion and containing a circuit board;
An optical subassembly optically coupled to the optical connector plug and electrically connected to the circuit board;
With
An optical communication module, wherein at least a part of the receptacle part, at least a part of the housing part, or at least a part of the optical subassembly is made of a resin containing an additive having electromagnetic wave absorption. A receptacle for inserting an optical connector plug;
A housing portion connected to the receptacle portion and containing a circuit board;
An optical subassembly optically coupled to the optical connector plug and electrically connected to the circuit board;
A holding part for holding the optical subassembly in the housing part or the receptacle part;
With
At least a part of the receptacle part, at least a part of the housing part, at least a part of the optical subassembly, or at least a part of the holding part is made of a resin containing an additive having electromagnetic wave absorptivity, Optical communication module.   The optical adapter according to claim 1, wherein the additive is a fine powder made of iron, iron oxide, carbon, or stainless steel.   The optical adapter according to claim 1, wherein the additive is a fine powder made of two or more materials of iron, aluminum, cobalt, and silicon.   The optical adapter according to claim 1, wherein the resin is a polyamide resin, a PBT resin, a PPS resin, an LCP resin, or a PEEK resin. A photoelectric conversion element;
A housing for housing the photoelectric conversion element;
With
At least a part of the casing is an optical subassembly made of a resin containing an additive having electromagnetic wave absorptivity.

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