JP2008151593A - Testing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a space in a testing apparatus occupied by a cooling section for cooling a plurality of circuit boards. <P>SOLUTION: The testing apparatus for testing a device under test comprises: a test head having a plurality of circuit boards for generating a test signal applied to the device under test in accordance with an input control signal and for receiving an output signal of the device under test; the cooling section for accommodating and cooling the plurality of circuit boards; and a connecting section for interfacing signals between the device under test and the circuit boards. The cooling section comprises: a cooling case which accommodates the plurality of circuit boards and has apertures in its upper plane and lower plane; a surface side print circuit board which seals one aperture of the cooling section and interfaces signals between the plurality of circuit boards and the connecting section; a rear face side print circuit board which seals the other aperture of the cooling case and supplies control signals to the plurality of circuit boards; and a cooling medium supplying section for circulating a cooling liquid inside the cooling case. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a test apparatus for testing a device under test. In particular, the present invention relates to a test apparatus including a cooling unit that cools a circuit board of the test apparatus.

  In a test apparatus for testing a device under test, a cooling apparatus that cools a circuit board of the test apparatus is known (for example, see Patent Document 1). The test apparatus may have a plurality of circuit boards. In this case, it can be considered that each circuit board is individually stored in a metal shield case and cooled. In this case, in order to connect the circuit board and the device under test, the connector of the circuit board is exposed outside the shield case. For example, when the connector is provided at the end of the circuit board and the circuit part is provided inside the circuit board, the shield case is provided so as to cover the circuit part of the circuit board. It is also possible to efficiently cool the entire circuit board by individually storing each circuit board in a shield case and providing a partition wall for circulating the refrigerant on the circuit board to generate a refrigerant flow path. It is done.

JP-A-10-511169

  However, it may be undesirable to individually cool each circuit board. For example, since the circuit boards are individually stored in the shield case, when a large number of circuit boards are cooled, the space for mounting the circuit boards may be increased due to the thickness of the shield case. For this reason, when the space for mounting the circuit board is limited, it is not necessarily preferable to individually cool a large number of circuit boards. Further, since the shield case is provided so as to cover a part of the circuit board and the connector and the like are exposed to the outside, it is difficult to cool the plurality of circuit boards with one shield case.

  In addition, it may be undesirable to provide a partition wall on the circuit board. For example, since the partition walls are provided on the circuit board, the space for arranging the circuit elements is compressed. For this reason, when arranging many circuit elements on a circuit board, it is not necessarily desirable to provide a partition on a circuit board.

  Therefore, an object of one aspect of the present invention is to provide a test apparatus that solves the above problems. This object is achieved by a combination of features described in the independent claims. The dependent claims define further advantageous specific examples of the present invention.

  In order to solve the above problems, in a first aspect of the present invention, a test apparatus for testing a device under test generates a test signal to be supplied to the device under test in accordance with a given control signal. A test head having a plurality of circuit boards for receiving the output signals of the test device, a cooling unit for storing and cooling the plurality of circuit boards, and a device to be tested are placed between the device under test and the circuit boards. A cooling unit that houses a plurality of circuit boards therein, seals one opening of the cooling case, and a plurality of circuits. A front-side printed circuit board that passes signals between the circuit board and the connection section, a back-side printed circuit board that seals the other opening of the cooling housing and supplies control signals to a plurality of circuit boards, and a cooling housing Refrigerant that circulates cooling liquid inside Providing a test device having a feeding portion.

  According to a second aspect of the present invention, there is provided a test apparatus for testing a device under test, which generates a test signal to be supplied to the device under test according to a given control signal and receives an output signal of the device under test. A test head having a circuit board, a cooling part for storing and cooling a plurality of circuit boards, and a connection part for placing a device under test and passing a signal between the device under test and the circuit board The cooling unit includes a cooling housing that stores a plurality of circuit boards therein, a holding unit that holds the surfaces of adjacent circuit boards facing each other inside the cooling housing, and a cooling unit that cools the inside of the cooling housing. Provided for each inter-substrate flow path formed by the adjacent circuit board in the coolant supply section for circulating the liquid and the cooling housing, and adjusts the flow rate of the cooling liquid flowing through the corresponding inter-substrate flow path With bulkhead Providing a test device having.

  The above summary of the invention does not enumerate all the necessary features of the present invention, and sub-combinations of these feature groups can also be the invention.

  Hereinafter, the present invention will be described through embodiments of the invention. However, the following embodiments do not limit the invention according to the scope of claims, and all combinations of features described in the embodiments are included. It is not necessarily essential for the solution of the invention.

  FIG. 1 is a diagram illustrating an example of a configuration of a test apparatus 100 according to an embodiment of the present invention. The test apparatus 100 is an apparatus for testing a device under test 200 such as a semiconductor chip, and includes a connection unit 10, a test head 30, a cooling unit 40, and a main frame 20.

  The main frame 20 controls the test head 30 to test the device under test 200. For example, the main frame 20 supplies a control signal to the test head 30 to cause the test head 30 to generate a test signal and supply it to the device under test 200. Further, the main frame 20 may receive a test result of the device under test 200 in the test head 30.

  The test head 30 generates a test signal to be supplied to the device under test 200 according to a control signal given from the main frame 20 and supplies the test signal to the device under test. For example, the test head 30 may generate a test signal having a predetermined logic pattern. The test head 30 receives the output signal of the device under test 200 and determines whether the device under test 200 is good or bad. For example, the test head 30 may determine pass / fail of the device under test 200 by comparing the logic pattern of the output signal with a logic pattern of a predetermined expected value.

  The test head 30 has a plurality of circuit boards 80. The circuit board 80 may generate a test signal according to the control signal and determine whether the device under test 200 is good or bad based on the output signal of the device under test 200. Further, the test signal may be generated using two or more circuit boards 80, and the quality of the device under test 200 may be determined using two or more circuit boards 80. The circuit board 80 is provided in a replaceable manner according to the test contents, the type of the device under test 200, and the like.

  The cooling unit 40 stores and cools the plurality of circuit boards 80. In this example, the cooling unit 40 is provided in the test head 30. The connection unit 10 passes signals between the device under test 200 and the circuit board 80. For example, the connection unit 10 may be a socket board that places the device under test 200 and is electrically connected to the device under test 200. The connection unit 10 may be a probe card that is provided to face the device under test 200 and is electrically connected to the device under test 200 by probe pins.

  FIG. 2 shows an example of a perspective view of the cooling unit 40. The cooling unit 40 includes a cooling housing 42, a front surface side printed circuit board 50, a back surface side printed circuit board 60, a supply pipe 44, a discharge pipe 46, and a refrigerant supply unit 48. The cooling housing 42 stores a plurality of circuit boards 80 therein. Moreover, the cooling housing | casing 42 has opening in an upper surface and a lower surface. For example, the cooling housing 42 has a hexahedral shape, and may have an opening on any two opposing surfaces. Further, the side surfaces of the cooling casing 42 other than the opened upper and lower surfaces may be formed of, for example, a metal material.

  The front surface side printed circuit board 50 seals the opening on the upper surface of the cooling housing 42. That is, the front side printed circuit board 50 has an area larger than the opening on the upper surface of the cooling housing 42 and is provided so as to cover the entire opening. A connector 52 is provided on the surface exposed to the outside of the front surface side printed board 50. The connector 52 is electrically connected to a circuit board 80 stored inside the cooling casing 42 via a transmission path such as a through hole provided in the front surface side printed board 50. The connector 52 is electrically connected to the connection unit 10. With such a configuration, it is possible to electrically connect the circuit board 80 stored in the cooling housing 42 and the connection unit 10.

  The back side printed circuit board 60 seals the opening on the lower surface of the cooling housing 42. The configuration of the back side printed board 60 may be the same as that of the front side printed board 60. For example, the back side printed circuit board 60 has an area larger than the opening on the lower surface of the cooling housing 42, and may have a connector 52, a through hole, and the like. The back side printed circuit board 60 electrically connects the circuit board 80 stored in the cooling housing 42 and the main frame.

  The supply pipe 44 and the discharge pipe 46 are provided on either side of the cooling housing 42. That is, the supply pipe 44 and the discharge pipe 46 are provided on a surface different from the surface on which either the front surface side printed circuit board 50 or the back surface side printed circuit board 60 is provided in the cooling housing 42. The refrigerant supply unit 48 cools the plurality of circuit boards 80 by circulating the cooling liquid inside the cooling housing 42.

  For example, the refrigerant supply unit 48 supplies the cooling liquid to the inside of the cooling housing 42 via the supply pipe 44. Further, the refrigerant supply unit 48 receives the cooling liquid from the inside of the cooling housing 42 via the discharge pipe 46. The refrigerant supply unit 48 dissipates the heat accumulated in the received cooling liquid and circulates it inside the cooling casing 42. The supply pipe 44 and the discharge pipe 46 may be provided in the vicinity of two diagonal points among the apexes of the cooling housing 42.

  According to the cooling unit 40 in this example, since the upper surface and the lower surface of the cooling housing 42 are sealed with the printed circuit board, without exposing the connectors of the circuit board 80 to the outside of the cooling housing 42, The connection unit 10 and the main frame 20 can be electrically connected. That is, since the entire circuit boards 80 can be stored in the cooling housing 42, a plurality of circuit boards 80 can be cooled together. For this reason, even when many circuit boards 80 are cooled, the space where the cooling housing 42 and the circuit boards 80 should be provided can be reduced.

  FIG. 3 is a diagram illustrating an example of the AA ′ cross section illustrated in FIG. 2 in the cooling unit 40. FIG. 4 is a diagram showing an example of the BB ′ cross section shown in FIG. The circuit board 80 is provided with circuit elements on the front surface and the back surface thereof shown in FIG.

  As shown in FIGS. 3 and 4, one end of each circuit board 80 is provided to face the front surface side printed board 50, and the other end of each circuit board 80 is provided to face the back side printed board 60. Each circuit board 80 can be electrically connected to the surface-side printed board 50 by a spring pin 82 or the like provided at one end of each circuit board 80. Further, each circuit board 80 can be electrically connected to the back side printed circuit board 60 by a connector 84 provided at the other end of each circuit board 80.

  The front-side printed circuit board 50 is provided with a hole wiring 54 that transmits a signal between the inside and the outside of the cooling housing 42. In addition, the back side printed circuit board 60 is provided with a hole wiring 64 for transmitting a signal between the inside and the outside of the cooling housing 42.

  For example, the hole wiring 54 and the hole wiring 64 are formed between the surface of the front surface side printed board 50 or the back surface side printed board 60 that is exposed inside the cooling casing 42 and the surface that is exposed outside the cooling casing 42. And a conductive material filled in the through hole. Moreover, the opening of the through hole of the hole wiring 54 and the hole wiring 64 may be sealed with a conductive material. For example, the hole wiring 54 and the hole wiring 64 may have a pad that covers the opening of the through hole.

  Further, at least one of the hall wiring 54 and the hall wiring 64 is provided for each circuit board 80. For example, the hole wiring 54 is provided corresponding to the spring pin 82 provided on each circuit board 80. Pads inside the cooling housing 42 of the hole wiring 54 and the corresponding spring pins 82 are electrically connected.

  Each spring pin 82 is provided so as to protrude from one end of the corresponding circuit board 80 toward the front surface side printed board 50 from the end face of the circuit board 80. The spring pin 82 is a pin that expands and contracts according to the pressing force in the direction from the front surface side printed board 50 to the spring pin 82. The front surface side printed circuit board 60 has hole wirings 54 at positions corresponding to the respective spring pins 82.

  The connector 52 electrically connects the hole wiring 54 and the connection portion 10 on the surface of the front surface side printed board 50. For example, the connector 52 may include a terminal that contacts the pad of the hole wiring 54 and a terminal that contacts the cable from the connection unit 10. The connector 52 may be provided for each circuit board 80. With such a configuration, each circuit board 80 can be electrically connected to the connection portion 10.

  A connector 84 provided at the other end of the circuit board 80 electrically connects the corresponding hole wiring 64 and the circuit board 80. For example, the connector 84 may include a terminal that contacts the pad provided inside the cooling housing 42 of the hole wiring 64 provided on the back surface side printed board 60 and a terminal that contacts the wiring of the circuit board 80. The connector 84 may be a card edge connector provided at the end of the circuit board 80. Further, the connector 84 may be a right angle connector that is fitted to a connector provided on the back surface side printed circuit board 60 by being inserted in a substantially horizontal direction with the back surface side printed circuit board 60.

  The connector 84 may function as a holding unit that fixes the circuit board 80 to the cooling housing 42. As shown in FIG. 4, the connector 84 is held inside the cooling housing 42 so that the surfaces of the adjacent circuit boards 80 face each other. Further, as shown in FIG. 4, the connector 84 holds the circuit boards 80 substantially in parallel.

  The hole wiring 64 is electrically connected to a spring pin 92 provided on the mother board 90 by a pad outside the cooling housing 42. The motherboard 90 is a substrate that electrically connects the cooling unit 40 and the main frame 20, for example. With such a configuration, each circuit board 80 can be electrically connected to the main frame 20.

  Further, it is preferable that a sealing material such as a rubber packing for improving the sealing degree is provided at a connection portion between the cooling casing 42 and the front surface side printed circuit board 50 and the rear surface side printed circuit board 60. According to the cooling unit 40 in this example, the inside of the cooling housing 42 can be sealed, and the inside and the outside of the cooling housing 42 can be electrically connected. For this reason, the plurality of circuit boards 80 can be cooled together.

  FIG. 5 is a diagram illustrating an example of the configuration of the hole wiring 54. The hole wiring 54 includes a first pad 56, a first via hole 66, a wiring layer 70, a second via hole 68, and a second pad 58. Also, the hole wiring 64 may have the same configuration as the hole wiring 54.

  The first pad 56 is provided on the surface of the front side printed circuit board 50. The second pad 58 is provided on the back surface of the front surface side printed board 50. The wiring layer 70 is provided inside the front surface side printed board 50. For example, the wiring layer 70 is provided in a substantially intermediate layer between the front surface and the back surface of the front surface side printed board 50.

  The first via hole 66 is provided so as to penetrate from the first pad 56 provided on the surface side printed circuit board 50 to the wiring layer 70. A conductive material is formed on at least the inner wall of the first via hole. Thereby, the first pad 56 and the wiring layer 70 are electrically connected.

  The second via hole 68 is provided so as to penetrate from the second pad 58 provided on the back surface of the front surface side printed board 50 to the wiring layer 70. A conductive material is formed on at least the inner wall of the second via hole. Thereby, the second pad 58 and the wiring layer 70 are electrically connected. That is, the first pad 56 and the second pad 58 are electrically connected. The wiring layer 70 may be provided independently for each hole wiring 54. The second via hole 68 is provided on a straight line different from the corresponding first via hole 66. With such a configuration, the sealing degree in the hole wiring 54 can be improved, and the cooling liquid can be prevented from leaking from the inside of the cooling casing 42.

  FIG. 6 shows an example of the reinforcing material 72 provided on the surface of the front surface side printed board 50. In this example, the connector 52 is omitted. FIG. 6A shows an example of a surface view of the front surface side printed board 50. FIG. 6B shows an example of a CC ′ cross section in FIG.

  The reinforcing material 72 is provided for each predetermined board area of the front surface side printed board 50. For example, the reinforcing material 72 may be provided in a lattice shape as shown in FIG. The area of each lattice may be substantially the same. The reinforcing material 72 may be provided so that the physical strength per unit area of the front-side printed circuit board 50 is substantially the same as the physical strength per unit area of the cooling housing 42. For example, the reinforcing material 72 is made of substantially the same material as that of the cooling housing 42, and the thickness of the reinforcing material 72 in the direction perpendicular to the surface of the front surface side printed circuit board 50 is set on each side surface of the cooling housing 42. It may be larger than the thickness. Further, a similar reinforcing material 72 may be provided on the back side printed board 60.

  The test apparatus 100 may be electrically connected to the device under test 200 by rotating the test head 30. Even in such a case, the strength of the front surface side printed circuit board 50 and the back surface side printed circuit board 60 is reinforced to the same degree as the strength of the cooling housing 42, and therefore the breakage of the cooling unit 40 can be prevented. .

  FIG. 7 shows another example of a perspective view of the cooling unit 40. The cooling unit 40 in this example is different from the cooling unit 40 shown in FIG. 2 in that the supply pipe 44 and the discharge pipe 46 are provided on the same surface of the cooling housing 42. The other configuration may be the same as that of the cooling unit 40 shown in FIG. For example, the supply pipe 44 and the discharge pipe 46 may be provided in the vicinity of the diagonal on either the front surface or the back surface of the cooling housing 42. Here, the front surface or the back surface of the cooling housing 42 is any two surfaces of the cooling housing 42 that face each other out of the four surfaces on which the front surface side printed circuit board 50 and the back surface side printed circuit board 60 are not provided. .

  FIG. 8 is a diagram illustrating an example of the internal structure of the cooling housing 42. In this example, the figure which looked at the inside of the cooling housing | casing 42 from the direction of the surface side printed circuit board 50 is shown. The cooling unit 40 in this example further includes a partition wall 74 with respect to the cooling unit 40 shown in FIGS. 2 to 5, and the supply pipe 44 and the discharge pipe 46 are on the same surface of the cooling housing 42. It is different from the cooling unit 40 described in FIGS. 2 to 5 in that it is provided. Other configurations may be the same as those of the cooling unit 40 described with reference to FIGS.

  As described above, the respective circuit boards 80 are held substantially in parallel by the holding portions in the cooling housing 42 so that the surfaces of the adjacent circuit boards 80 face each other. The holding unit holds each circuit board 80 so that the surface of the circuit board 80 and the surface of the cooling housing 42 on which the supply pipe 44 and the discharge pipe 46 are provided are substantially parallel to each other. Thereby, an inter-substrate flow path through which the cooling liquid flows is formed between adjacent circuit boards 80. Further, between the circuit boards 80 among the plurality of circuit boards 80, an inter-substrate flow path through which the cooling liquid similarly flows is formed between the circuit boards 80 provided at both ends and the front and back surfaces of the cooling housing 42.

  In addition, the holding unit contacts each circuit board 80 with the upper surface of the cooling housing 42 (in this example, the front surface side printed circuit board 50) and the lower surface of the cooling housing 42 (in this example, the back surface side printed circuit board 60). Let hold. For example, the spring pin 82 of each circuit board 80 contacts the upper surface of the cooling housing 42. Further, the connector 84 of each circuit board 80 contacts the lower surface of the cooling housing 42.

  The holding unit holds each circuit board 80 without bringing it into contact with a surface other than the upper surface and the lower surface of the cooling housing 42. Thus, the cooling liquid is provided between the side surface of the cooling housing 42 (in this example, two surfaces other than the top surface, the bottom surface, the front surface, and the back surface among the six surfaces of the cooling housing 42) and the circuit board 80. An outer flow path through which the gas flows is formed.

  With such a configuration, the cooling liquid supplied from the supply pipe 44 flows into the first outer flow path 102 along the side surface of the cooling casing 42 inside the cooling casing 42. In addition, the cooling liquid flows from the first outer channel 102 to each inter-substrate channel 104 that is substantially orthogonal. Then, the cooling liquid that has passed through each inter-substrate flow path 104 flows into the second outer flow path 106 along the side surface of the cooling housing 42 and is discharged from the discharge pipe 46. With such a configuration, it is possible to circulate the cooling liquid inside the cooling housing 42 and cool the respective circuit boards 80.

  However, the inter-substrate flow path 104 having a large distance from the surface of the cooling housing 42 where the supply pipe 44 and the discharge pipe 46 are provided has a smaller cooling liquid flow rate than the inter-substrate flow path 104 having a smaller distance. It is also possible. For this reason, the cooling unit 40 provides a partition for each inter-substrate flow path 104 and adjusts the flow rate of the cooling liquid flowing through the corresponding inter-substrate flow path 104 to be substantially equal.

  Each partition wall 74 is provided between the side surface of the cooling housing 42 and the circuit board 80 so as to correspond to each inter-substrate flow path 104. For example, each partition wall 74 may be provided so as to form an opening 76 through which the cooling liquid passes from the first outer channel 102 to the corresponding inter-substrate channel 104. Each partition wall 74 may be provided so as to form an opening 76 through which the cooling liquid passes from the corresponding inter-substrate channel 104 to the second outer channel 106.

  For example, the partition wall 74 is formed from the upper surface to the lower surface of the cooling housing 42. In this example, the partition wall 74 is fixed to the surface of the back side printed circuit board 60 that is exposed inside the cooling casing 42, and the surface that is exposed to the inside of the cooling casing 42 of the front surface side printed circuit board 50. Provided in contact. The partition wall 74 may be provided so as to extend substantially parallel to the side surface of the cooling housing 42.

  Further, the partition walls 74 may be provided in the vicinity of the end portions of the respective circuit boards 80 so as to be substantially perpendicular to the circuit boards 80. Each partition 74 may be formed integrally or may be formed separately. When formed separately, the cooling liquid passes through the openings 76 formed by the gaps between the partition walls 74.

  The partition walls 74 may be provided so that the area of each opening 76 is an area corresponding to the distance from the supply pipe 44 and the discharge pipe 46. For example, by reducing the area of each partition wall 74 according to the distance from the supply pipe 44 and the discharge pipe 46, the area of each opening 76 is substantially proportional to the distance from the supply pipe 44 and the discharge pipe 46. You can make it bigger.

  The partition wall 74 may be provided so as to adjust the area of the opening 76 in accordance with the power consumption of the corresponding circuit board 80. For example, the area of the opening 76 where the power consumption of the corresponding circuit board 80 is larger may be increased. The partition wall 74 may be provided in a replaceable manner according to the power consumption of the circuit board 80. For example, each partition 74 may be fixed to the back side printed circuit board 60 so as to be exchangeable with another partition 74 having a different area.

  The cooling unit 40 may further include an opening control unit that controls the area of each opening 76 according to the power consumption of the corresponding circuit board 80. For example, each partition wall 74 has a fixed portion fixed to the back surface side printed circuit board 60 and a slide portion provided so as to be slidable with respect to the fixed portion, and the opening control portion includes the slide portion. The area of the opening 76 may be adjusted by sliding. With such a configuration, it is possible to adjust the flow rate of the cooling liquid flowing in each inter-substrate flow path. For this reason, each circuit board 80 can be efficiently cooled.

  FIG. 9 is a diagram illustrating another example of the configuration of the test head 30. The test head 30 in this example includes a plurality of cooling units 40. As shown in FIG. 7, by providing the supply pipe 44 and the discharge pipe 46 on the same surface of the cooling housing 42, a plurality of cooling units 40 can be mounted side by side. That is, a plurality of cooling units 40 can be mounted side by side by adjoining the surfaces of the cooling units 40 where the supply pipe 44 and the discharge pipe 46 are not provided. For this reason, the space where the cooling unit 40 is installed can be reduced.

  FIG. 10 is a diagram illustrating an example of the configuration of the circuit board 80. The circuit board 80 includes a circuit element 86, a Peltier element 88, a temperature detection unit 96, and an individual temperature control unit 98. The Peltier element 88 is provided on the surface of a predetermined circuit element 86 among the circuits provided on the circuit board 80. For example, the Peltier element 88 may be provided in a circuit element 86 having a large characteristic variation with respect to a temperature variation, such as a delay element. The Peltier element 88 is an element that moves the amount of heat of one surface to the other surface when a voltage is applied.

  The temperature detection unit 96 detects the temperature of the circuit element 86 provided with the Peltier element 88. For example, the temperature detection unit 96 may detect the temperature of the circuit element 86 by detecting the resistance of a thermocouple, thermistor, or the like provided in the circuit element 86.

  The individual temperature control unit 98 controls the corresponding Peltier element 88 based on the temperature of the circuit element 86 detected by the temperature detection unit 96. For example, the individual temperature control unit 98 adjusts the voltage applied to the Peltier element 88 so that the circuit element 86 maintains a predetermined temperature. With such a configuration, the circuit board 80 can be operated with high accuracy even when the cooling by the cooling liquid varies.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

It is a figure which shows an example of a structure of the test apparatus 100 which concerns on one embodiment of this invention. It is a figure which shows an example of the perspective view of the cooling unit. It is a figure which shows an example of the AA 'cross section shown in FIG. It is a figure which shows an example of the BB 'cross section shown in FIG. 3 is a diagram illustrating an example of a configuration of a hole wiring 54. FIG. An example of the reinforcing material 72 provided on the surface of the front surface side printed circuit board 50 is shown. FIG. 6A shows an example of a surface view of the front surface side printed board 50. FIG. 6B shows an example of a CC ′ cross section in FIG. The other example of the perspective view in the cooling unit 40 is shown. 3 is a diagram illustrating an example of an internal structure of a cooling housing 42. FIG. 4 is a diagram illustrating another example of the configuration of the test head 30. FIG. 3 is a diagram illustrating an example of a configuration of a circuit board 80. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Connection part, 20 ... Main frame, 30 ... Test head, 40 ... Cooling part, 42 ... Cooling housing, 44 ... Supply pipe, 46 ... Discharge pipe, 48 ... Refrigerant supply unit, 50 ... Front side printed circuit board, 52 ... Connector, 54 ... Hall wiring, 56 ... First pad, 58 ... Second pad, 60 ... Back side printed circuit board, 64 ... hole wiring, 66 ... first via hole, 68 ... second via hole, 70 ... wiring layer, 72 ... reinforcing goods, 74 ... partition wall, 76 ..Opening part, 80 ... circuit board, 82 ... spring pin, 84 ... connector, 86 ... circuit element, 88 ... Peltier element, 90 ... motherboard, 92 ... spring Pin, 96 ... temperature detector, 98 ... individual temperature control , 100 ... test apparatus, 102 ... first outer channel, 104 ... substrate inter-channel, 106 ... second outer channel, 200 ... device under test

Claims (19)

A test apparatus for testing a device under test,
A test head having a plurality of circuit boards for generating a test signal to be supplied to the device under test in response to a given control signal and receiving an output signal of the device under test;
A cooling unit for storing and cooling the plurality of circuit boards;
A mounting part for placing the device under test and passing a signal between the device under test and the circuit board;
The cooling part is
A plurality of circuit boards stored therein, and a cooling housing having openings on the upper surface and the lower surface;
Sealing one opening of the cooling housing, and a surface-side printed board that passes signals between the plurality of circuit boards and the connection part,
Sealing the other opening of the cooling housing and supplying the control signal to the plurality of circuit boards;
A test apparatus comprising: a refrigerant supply unit configured to circulate a cooling liquid inside the cooling casing. The test apparatus according to claim 1, wherein a hole wiring for transmitting a signal between the inside and the outside of the cooling housing is provided on the front surface side printed board and the back surface side printed board. The test apparatus according to claim 2, wherein the opening of the hole wiring is sealed with a conductive material. The test apparatus according to claim 2, wherein at least one hole wiring is provided for each circuit board. The plurality of circuit boards are provided such that one end of each circuit board faces the front surface side printed board and the other end of each circuit board faces the back surface side printed board,
Each of the circuit boards has a spring pin provided so as to protrude from the end face of the circuit board toward the front surface side printed board from the one end.
The test apparatus according to claim 2, wherein the surface-side printed board has the hole wiring at a position corresponding to each of the spring pins. The test apparatus according to claim 5, wherein each of the circuit boards has a connector connected to the hole wiring of the back printed circuit board at the other end. The hole wiring is
A wiring layer provided inside the substrate;
A first via hole provided from the surface of the substrate to the wiring layer;
The test apparatus according to claim 2, further comprising: a second via hole provided from the back surface of the substrate to the wiring layer. The test apparatus according to claim 1, wherein the front surface side printed board and the back surface side printed board are provided with a reinforcing material for each predetermined board area. The cooling part is
Inside the cooling housing, a holding part that holds the adjacent circuit board faces to face each other,
A coolant supply section for circulating a cooling liquid inside the cooling housing;
A partition that is provided for each inter-substrate flow path formed by the adjacent circuit boards inside the cooling housing and adjusts the flow rate of the cooling liquid flowing through the corresponding inter-substrate flow path. The test apparatus according to claim 1. A test apparatus for testing a device under test,
A test head having a plurality of circuit boards for generating a test signal to be supplied to the device under test in response to a given control signal and receiving an output signal of the device under test;
A cooling unit for storing and cooling the plurality of circuit boards;
A mounting part for placing the device under test and passing a signal between the device under test and the circuit board;
The cooling part is
A cooling housing for storing the plurality of circuit boards therein;
Inside the cooling housing, a holding part that holds the adjacent circuit board faces to face each other,
A coolant supply section for circulating a cooling liquid inside the cooling housing;
A test provided in each of the inter-substrate flow paths formed by the adjacent circuit boards in the cooling casing, and a partition for adjusting the flow rate of the cooling liquid flowing in the corresponding inter-substrate flow path. apparatus. The test apparatus according to claim 10, wherein the holding unit holds the circuit boards substantially in parallel. The holding unit holds each circuit board in contact with the upper surface and the lower surface of the cooling housing and without contacting the other surfaces other than the upper surface and the lower surface of the cooling housing;
The partition is formed from the upper surface to the lower surface of the cooling housing between a side surface substantially perpendicular to the circuit board of the other surfaces of the cooling housing and the circuit board. The test apparatus according to claim 11. The partition wall includes an outer channel formed along the side surface of the cooling housing at a position corresponding to each inter-substrate channel, and an inter-substrate channel formed by the adjacent circuit board. The test apparatus according to claim 12, further comprising openings for adjusting the flow rate of the cooling liquid flowing therebetween. The test apparatus according to claim 13, further comprising an opening control unit that controls an area of each opening according to power consumption of the corresponding circuit board. The refrigerant supply unit has a supply pipe for supplying the cooling liquid to the inside of the cooling casing, either on a front surface or a rear surface of the cooling casing facing the surface of the circuit board, and the cooling liquid The test apparatus according to claim 13, wherein both the discharge pipes that discharge to the outside of the cooling housing are connected. The supply pipe is connected to either one of the front or back of the cooling housing, near any vertex,
The test apparatus according to claim 15, wherein the discharge pipe is connected to a position diagonal to the supply pipe on either the front surface or the back surface of the cooling housing. 17. The test apparatus according to claim 16, wherein each opening of the partition wall has an area corresponding to a distance from the front surface or the back surface of the cooling housing to which the supply pipe and the discharge pipe are connected. The test apparatus according to claim 13, wherein the partition wall is provided to be exchangeable with another partition wall having a different area. The circuit board is
A temperature detecting unit for detecting a temperature of a predetermined circuit element;
A Peltier element for cooling the circuit element;
The test apparatus according to claim 10, further comprising: an individual temperature control unit that controls the corresponding Peltier element based on the temperature of the circuit element detected by the temperature detection unit.

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