TWM614215U - Liquid-cooling burn-in socket and burn-in apparatus - Google Patents

Abstract

The disclosure provides a burn-in apparatus including a pump, at least one liquid-cooling burn-in socket and a reservoir tank. The pump pushes a coolant. The at least one liquid-cooling burn-in socket electrically connects to a circuit board and communicatively couples to the pump to receive the pushed coolant. The reservoir tank communicatively couples to the socket and receives the coolant exhausted from the socket.

Description

Liquid-cooled machine-burning socket and machine-burning device

This creation is about a burn-in socket and burn-in device (such as Burn-in Board) for the device under test (DUT), especially a burn-in base and burn-in device that integrates a liquid cooling mechanism.

In the semiconductor or PCB industry, burn-in is a process of testing wafers or chips. Multiple wafers or chips will be installed on the test socket on the burn-in board to test various parameters. Such as temperature, stress, frequency, etc., detect any failures in the subsequent manufacturing process due to defects in IC design, material, manufacturing process or manufacturing.

The packaged integrated circuit (IC) usually needs to undergo a burn in test for a certain period of time to ensure that the IC product can operate in a harsh environment. The first figure shows a schematic diagram of a known burn-in socket. The packaged chip (100) is accommodated in a base (102) fixed on the circuit board (101) and electrically connected to a plurality of signal contacts (not shown). A cover body (103) with a heat dissipation unit presses the chip (100) and contacts the top of the chip (100) with a contact interface (1031). Generally speaking, the heat dissipation unit of the cover (103) is made up of a plurality of heat dissipation fins (1032) arranged in a specific form, and these heat dissipation fins (1032) are connected to the contact interface (1031), thereby burning the machine run During this period, the heat accumulated on the top of the chip (100) is conducted to the heat dissipation fins (1032) through the contact interface (1031) and released into the air. In known creations, a fan is additionally provided on the heat dissipation fins (1032) to increase convection, or a plurality of ducts to help heat conduction are provided between the contact interface (1031) and the heat dissipation fins (1032), thereby Improve the heat dissipation capacity of the burn-in socket. However, with the advent of the 5G and AI era, the demand for high-power ICs has increased, and the burn-in test for high-power ICs has become more stringent. For example, during the burn-in process, the heat generated by high-power IC chips, such as a heat source greater than 1500 watts, may not be able to meet the test of this type of device with the above creation.

The above-mentioned burn-in socket is electrically connected to a circuit board to form a so-called burn-in board (BIB). It should be understood that there will be other electronic components on the circuit board, which will also generate heat according to the power of the burn-in test signal, and suppress the heat dissipation effect of the above-mentioned poor base, which will eventually lead to an excessively high temperature of the entire burn-in board. It can reach above 60 degrees. Known liquid cooling technology is used in computer products, such as servers, computer processors, and graphics processors, but it has not been integrated into burn-in devices.

Therefore, the development of a burn-in socket and the integration of a burn-in device with liquid cooling technology is an urgent issue to be solved in the field.

The purpose of this creation is to provide a burn-in device, including: a pump, which pushes a coolant; at least one liquid-cooled burn-in socket, which is electrically connected to a circuit board and fluidly coupled to the pump to receive the pump Pushed cooling liquid; and a storage tank fluidly coupled to the liquid-cooled burning machine socket and receiving the cooling liquid discharged from the liquid-cooled burning machine socket.

In a specific embodiment, the burn-in device further includes: a heat exchanger fluidly coupled to the liquid-cooled burn-in socket and receives the cooling liquid discharged from the liquid-cooled burn-in socket.

In a specific embodiment, the liquid-cooled machine-burning socket includes: a base electrically connected to the circuit board and having a accommodating slot for accommodating a device to be tested A top of the device is exposed; and a cover covering the top of the accommodating groove of the base and having a contact interface and a cavity, wherein the contact interface is used to contact the top of the device under test, the cavity and the The contact interface is thermally coupled to and receives the coolant from the pump.

In a specific embodiment, the cover is pivotally connected to the base, the cover further has an outer cover, and the outer cover accommodates the cavity therein.

In a specific embodiment, the housing is provided with an input port and an output port, the input port and the output port are in fluid communication with the cavity, the input port is used for receiving the coolant pushed by the pump, and the output port is used for Drain the coolant from the cavity.

In a specific embodiment, the cavity is connected to the contact interface via at least one heat conducting tube, so that the heat of the contact interface is conducted to the cavity.

100: chip

101: circuit board

102: Pedestal

103: Lid

1031: contact interface

1032: heat sink fins

202: Pump

204: Burn-in socket

2041: contact interface

206: storage tank

208: Heat Exchanger

300: circuit board

301: Frame

302: Pump

304: socket

306: storage tank

308: Heat Exchanger

402: Pedestal

4021: accommodating slot

4022: locking means

404: Lid

4041: Frame

4042: contact interface

4043: outer cover

4044: Cavity

4045: Input port

4046: output port

4047: Heat pipe

D: Device to be tested

T1: The first tube

T2: second tube

T3: third tube

T4: Fourth tube

Refer to the following diagrams and descriptions to further understand this creation. Non-limiting and non-exhaustive examples are described with reference to the following drawings. The components in the drawings do not have to be actual sizes; the focus is on explaining the structure and principles.

The first figure shows a schematic diagram of a known burn-in socket.

The second figure shows the circulation path of the cooling liquid of the burning-in device of the present invention.

The third figure illustrates the configuration of an embodiment of the authoring burning device.

The fourth diagram A and the fourth diagram B respectively show the locked state and the open state of the embodiment of the creative burn-in socket.

Hereinafter, the creation will be explained more fully with reference to the drawings, and specific examples and specific embodiments will be shown by exemplification. However, the claimed subject matter can be implemented in many different forms. Therefore, the construction of the claimed subject matter covered or applied for is not limited to any exemplary specific embodiments disclosed in this specification; the exemplary specific embodiments are only examples. Similarly, this creation is to provide a reasonably broad category for the claimed subject matter applied for or covered. In addition, for example, the claimed subject matter can be embodied as a method, device, or system. Therefore, the specific embodiments may take the form of, for example, hardware, software, firmware, or any combination of these (not known as software).

The term "in one embodiment" used in this specification does not necessarily refer to the same specific embodiment, and the term "in other (some/some) embodiments" used in this specification does not necessarily refer to different specific embodiments. The purpose is, for example, that the claimed subject matter includes all or part of a combination of exemplary embodiments.

The second figure shows the coolant circulation path of the liquid-cooled burn-in device of this invention and the relationship between its components. This creative liquid-cooled burning device mainly includes a pump (202), at least one burning socket (204), a storage tank (206) and a heat exchanger (208), which are connected to each other in fluid communication or Coupled to form a cooling liquid circulation path.

The pump (202) is fluidly connected to the circulation path and is configured to push a coolant along the circulation path in one or more directions (pointed by the arrow in the figure). Although not shown, the pump (202) operates based on an instruction from a controller, so that the pump (202) can continuously or intermittently push the coolant. The controller may be further configured to control the pump (202) based on the sensing result of a temperature sensor, The temperature sensor can be appropriately configured in the cooling liquid circulation path to monitor the temperature change of the device.

The burn-in socket (204) is fluidly connected in the circulation path and configured to be fluidly coupled to the downstream end of the pump (202) to receive the cooling liquid pushed by the pump (202). The burn-in socket (204) can accommodate a device under test (D) and is provided with a plurality of signal contacts (not shown) connected with the device under test (D). The device under test (D) can be an IC chip. The burn-in socket (204) has a contact interface (2041), which is used to contact the device under test (D) accommodated in the burn-in socket (204), so that the device under test (D) generates heat during the test. Can be conducted to the contact interface (2041). Therefore, the contact interface (2041) is usually selected from materials with high thermal conductivity, or a composite structure made of multiple materials, such as a known vapor chamber. The aforementioned temperature sensor can be configured in the burn-in socket (204) in an appropriate manner, so as to realize the temperature monitoring of the device under test (D). Other details about the burn-in socket (204) will be described later.

The storage tank (206) is fluidly connected in the circulation path and configured to be fluidly coupled to the downstream end of the burner socket (204) to receive the coolant discharged from the burner socket (204), which takes away the burner The socket (204) is quite hot. The storage tank (206) should contain sufficient capacity of cooling liquid to ensure that there is sufficient cooling liquid flowing in the circulation path, or can be used to adjust the flow rate of the circulation path.

The heat exchanger (208) is fluidly connected to the circulation path and is configured to hold a considerable volume of cooling liquid. The heat exchanger (208) is fluidly coupled to the downstream end of the storage tank (206) to receive the cooling liquid discharged from the storage tank (206). Although the heat exchanger (208) shown in the figure is located at the downstream end of the storage tank (206), this creation is not limited to this, which means that the heat exchanger (208) can also be located at the upstream end of the storage tank (206) or other Location. The downstream end of the heat exchanger (208) is coupled with a pump (202), thereby forming a closed Cycle path. The heat exchanger (208) mainly has the ability of heat transfer, which means that the heat in the cooling liquid is transferred to the surrounding environment. The heat exchanger (208) can be operated based on the instructions of the aforementioned controller to save power.

The third figure illustrates an embodiment of the liquid-cooled burning device of the present invention. The creative burning device includes a circuit board (300), a pump (302), at least one socket (304), a storage tank (306) and a heat exchanger (308).

The circuit board (300) is basically a printed circuit board, which has a front surface and a back surface and is laid out with circuits composed of various electronic components and conductive paths. For example, the circuit board (300) may be provided with the circuit of the aforementioned controller. The circuit board (300) can also have one or more input ports and output ports. The input port can receive external power and various test signals for burn-in testing, and the output port can transmit the test results to the outside for analysis . Although only a single circuit board (300) is shown, this creation does not exclude that the circuit board (300) can be a combination of a mother board and a daughter board.

In addition, a frame (301) is provided around the circuit board (300), which is used to protect the circuit board (300) and is equipped with a handle for the operator to load the circuit board (300) into a burn-in system. For example, a known burn-in system can accommodate multiple creative burn-in devices in units of layers.

The pump (302) can be fixed on the frame (301) to avoid affecting the layout of the circuit board (300). The pump (302) is connected to the burn-in socket (304) via a first tube (T1) to push the cooling liquid to the burn-in socket (304). In other possibilities, the first pipe (T1) may include a shunting means, thereby controlling the flow of the cooling liquid sent to the burning socket (304).

The circuit board (300) can provide a plurality of connection interfaces, which are respectively used to electrically connect the burn-in socket (304). This embodiment only shows the case of a single burn-in socket (304) to simplify the complicated configuration, which does not mean that the creative burn-in device has only one burn-in socket. The connection interface includes a circuit board (300) The signal contact or fixing mechanism can correspond to the signal contact or fixing mechanism at the bottom of the burn-in socket (304), thereby providing the device under test contained in the signal socket.

The storage tank (306) receives the cooling liquid from the burning socket (304) through a second pipe (T2). Although this embodiment only shows that the storage tank (306) is connected to a single burning socket (304) via the second tube (T2), it does not mean that the storage tank (306) cannot be connected to a larger number of sockets via more tubes. . This creation is also not limited to a single storage tank (306).

The heat exchanger (308) is connected to the downstream end of the storage tank (306) via a third tube (T3) to receive the higher temperature cooling liquid. The heat exchanger (308) can be realized by various known means. For example, the heat exchanger (308) may include a combination of a heat sink and a fan to cool down the coolant located here by creating convection. The heat exchanger (308) supplies the cooled coolant to the pump (302) through a fourth tube (T4) to complete the basic cycle.

The fourth picture A and the fourth picture B respectively show the closed state and the open state of the liquid-cooled burn-in socket of the invention. The creative burn-in socket includes a base (402) and a cover (404), which are connected to each other in a pivotable manner, so that the cover (404) can be selectively covered above the base (402) .

The base (402) has a top and a bottom, wherein the bottom has a plurality of signal contacts, which are correspondingly electrically connected to the connection interface on the circuit board (300) in the third figure. A accommodating groove (4021) is formed on the top of the base (402) for accommodating a device to be tested, such as a wafer. It should be understood that the bottom of the accommodating groove (4021) is provided with a plurality of electrical contacts corresponding to the signal contacts at the bottom of the base (402). In addition, the base (402) can also provide a locking means (4022) for securing the cover (404) to maintain its closed state.

The cover (404) has a frame (4041) and a contact interface (4042) held by the frame (4041). The contact interface (4042) has a contact head for contacting the top of the device under test. The contact head is made of a material with high thermal conductivity, and may also include the heat spreader. Cover body (404) also has An outer cover (4043) is connected with the frame (4041) and defines an accommodating space, so that a cavity (4044) can be accommodated in the accommodating space through a holding means. The outer cover (4043) has two opposite sides, which are respectively provided with an input port (4045) and an output port (4046) connected to the cavity (4044). The input port (4045) is connected to the first tube (T1) as shown in the third figure, and the output port (4046) is connected to the second tube (T2), whereby the cooling liquid can be pushed into the cavity (4044).

The cavity (4044) is thermally coupled to the contact interface (4042), so that the heat accumulated in the contact interface (4042) can be transferred to the cavity (4044). Specifically, the cover (404) also has one or more heat The tube (4047) has one end connected to the contact interface (4042) and the other end connected to the cavity (4044), even extending into the cavity (4044). According to this, the heat of the contact interface (4042) can be removed from the heat pipe ( One end of 4047) is transferred to the other end in the cavity (4042), and the coolant flowing through the cavity (4042) can remove the heat here, and the temperature at the top of the device under test can be effectively reduced.

Although some details have been used to describe the aforementioned creation for a clear understanding, we will understand that specific changes and modifications can be implemented within the scope of the patent application. Therefore, the above embodiments are only for illustration and are not limited, and this creation is not limited to the details described here, but can be modified under the scope of the additional patent application and equivalents.

402: Pedestal

4022: locking means

404: Lid

4041: Frame

4043: outer cover

4044: Cavity

4045: Input port

4047: Heat pipe

Claims (10)

A burn-in device, comprising: a pump for pushing a cooling liquid; at least one liquid-cooled burn-in socket, electrically connected to a circuit board and fluidly coupled to the pump to receive the cooling liquid pushed by the pump; And a storage tank, fluidly coupled to the liquid-cooled burning machine socket and receiving the cooling liquid discharged from the liquid-cooled burning machine socket. The burning device according to claim 1, further comprising: a heat exchanger fluidly coupled to the liquid-cooled burning socket and receiving the coolant discharged from the liquid-cooled burning socket. The burn-in device according to claim 1, wherein the liquid-cooled burn-in socket includes: a base electrically connected to the circuit board and has a accommodating slot for accommodating a standby The test device exposes a top of the device under test; and a cover covering the top of the accommodating groove of the base and having a contact interface and a cavity, wherein the contact interface is used to contact the top of the device under test, The cavity is thermally coupled to the contact interface and receives the cooling liquid from the pump. The burning device according to claim 3, wherein the cover is pivotally connected to the base, the cover further has an outer cover, and the outer cover accommodates the cavity therein. The burning device according to claim 4, wherein the housing is provided with an input port and an output port, the input port and the output port are fluidly connected to the cavity, and the input port is used to receive the coolant pushed by the pump, The output port is used to discharge the coolant from the cavity. The burn-in device according to claim 4, wherein the cavity is connected to the contact interface via at least one heat conduction tube, so that the heat of the contact interface is conducted to the cavity. A liquid-cooled machine-burning socket includes: a base with a containing groove; and a cover, covering the top of the containing groove of the base and having a contact interface and a cavity, wherein the contact interface is used for When contacting a device under test, the cavity is thermally coupled to the contact interface and configured to be fluidly coupled to a pump to receive a cooling liquid. The burn-in socket according to claim 7, wherein the cover is pivotally connected to the base, the cover further has an outer cover, and the outer cover accommodates the cavity. The burn-in socket of claim 8, wherein the housing provides an input port and an output port, the input port and the output port are fluidly connected to the cavity, the input port is used for receiving the coolant, and the output port is used for To discharge the coolant from the cavity. The burn-in socket according to claim 7, wherein the cavity is connected to the contact interface via at least one heat pipe, so that the heat of the contact interface is conducted to the cavity.

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