JP2008147450A - Substrate inversion/transfer device and substrate processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate inversion/transfer device that allows inversion or transfer of a substrate. <P>SOLUTION: A printing plate 32 is placed on the front side of a rotary base 4 of the substrate inversion/transfer device. A component pallet 41 is mounted so as to cover each substrate 35 on the printing plate 32. The rear side of the rotary base 4 is directed upwardly while an elevating plate is lowered after moving it above the rotary base 4. The component pallet 41 is dropped into a tray together with each substrate 35 so as to receive them with the tray. The component pallet 41 is extracted from the tray together with each substrate 35. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate reversal transfer apparatus and a substrate processing method for transferring a substrate from a printing base to a component pallet and mounting it after applying cream solder on the substrate on a printing base.

  As a substrate processing method used for a high-frequency device or the like, there is a method using cream solder. In this processing method, as shown in FIGS. 13A and 13B, a plurality of substrates 102 are arranged and held on the printing base 101, and cream solder is applied to the back surface of each substrate 102 using a printing machine. After that, as shown in FIGS. 14A and 14B, each board 102 is transferred from the printing base 101 to the component pallet 103 and mounted, and the front and back of each board 102 are reversed. Then, each substrate 102 is transported to the next process while being placed on the component pallet 103, and an electronic component is mounted on the surface of each substrate 102.

  By the way, the placement of the substrate 102 from the printing base 101 to the component pallet 103 relies on manual work.

Further, Patent Documents 1 and 2 disclose devices for reversing the front and back of a substrate, and it is conceivable to reverse the substrate 102 using these devices.
Japanese Unexamined Patent Publication No. 6-48554 JP-A-10-236636

  However, as described above, when the placement of the substrate 102 is relied on by manual work, the cream solder applied to the substrate 102 adheres to the operator's hand or becomes too cautious, resulting in a long working time. I did. Further, when the substrate 102 is placed on the component pallet 103, it is necessary to insert the positioning pins 103a of the component pallet 103 into the holes 102a of the substrate 102. The substrate 102 may be mispositioned, and the cream solder of the substrate 102 may adhere to the positioning pins 103a and the like.

  In addition, in the apparatuses such as Patent Documents 1 and 2, even if the substrate can be reversed, it cannot be performed until the substrate is replaced.

  Therefore, the present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a substrate reversal transfer apparatus and a substrate processing method capable of reversing and changing the substrate.

  In order to solve the above problems, the substrate reversal transfer apparatus of the present invention is a substrate reversal transfer apparatus for transferring and mounting a substrate from a printing base to a component pallet, and holding the print base on which the substrate is placed, A rotating base for holding the component pallet superimposed on the substrate on the printing base, a rotating means for rotating the rotating base so that the front and back of the rotating base are reversed, and the front and back of the rotating base are reversed. In this state, there is provided release means for extruding the substrate and the component pallet from the back side of the rotary base through the rotary base and releasing them from the printing base on the front side of the rotary base.

  The rotating base is rotated about an axis passing through the center of the rotating base.

  The printing base includes a printing plate that holds a substrate and a base frame that detachably supports the printing plate.

  Further, the rotating base has a magnet for attracting and holding the printing base, and the printing base has a magnet for attracting and holding the component pallet. In this case, the printing base and the component pallet may include a magnetic body provided at a location attracted by the magnet and a non-magnetic material other than the location.

  The releasing means includes a board pushing pin that pushes out the board and releases it from the printing base together with the component pallet, and a pressing pin for preventing the board from being detached from the component pallet.

  Furthermore, in the substrate processing method using the substrate reversal transfer apparatus of the present invention, a print base on which a substrate is placed on the rotation base front side of the substrate reversal transfer apparatus is held, and the substrate is placed on the print base. A step of holding the stacked component pallets, a step of rotating the rotating base so that the front and back of the rotating base are reversed by the rotating means of the substrate reversing / transferring device, and a releasing means of the substrate reversing / transferring device A step of extruding the substrate and the component pallet from the back side of the rotating base through the rotating base and releasing the printed base from the front side of the rotating base.

  According to such a substrate reversal transfer apparatus of the present invention, the printing base on which the substrate is placed is held on the rotating base, and the component pallet is overlapped and held on the substrate. Accordingly, the printing base, the substrate, and the component pallet are sequentially stacked on the rotating base. Then, after rotating the rotation base so that the front and back of the rotation base are reversed, the substrate and the component pallet are pushed out from the rotation base through the rotation base and released from the printing base. As a result, the substrate is transferred from the printing base to the component pallet and placed thereon, and the front and back of the substrate are reversed.

  Further, since the rotation base is rotated around an axis passing through the center thereof, the rotation space of the rotation base can be minimized and the apparatus can be reduced in size.

  Further, the printing base includes a printing plate that holds the substrate and a base frame that detachably supports the printing plate. In this case, hold the substrate on the printing plate, print the substrate with the printing plate attached to the base frame, remove the printing plate from the base frame, hold only the printing plate on the rotating base, rotate Rotate the base and printing plate. Since the printing plate is smaller than the printing base, the rotation space is smaller than when the printing base is rotated, and the apparatus can be downsized.

  Further, since the respective magnets are provided to attract and hold the printing base and the component pallet, the printing base and the component pallet can be held by a simple and low-cost mechanism.

  In this case, the printing base and the parts pallet can include a magnetic body provided at a location attracted by the magnet of the rotation base and a non-magnetic material other than the location. For example, by applying synthetic resin as a non-magnetic material, most of the printing base and component pallet can be formed of synthetic resin or the like, and the printing base and component pallet can be reduced in weight.

  The release means has a board push pin for pushing the board and releasing it from the printing base together with the parts pallet, and a press pin for preventing the board from being detached from the parts pallet. The substrate can be transferred from the printing base to the component pallet without causing any problems.

  Next, according to the substrate processing method of the present invention, the substrate is transferred from the printing base to the component pallet using the substrate reversal transfer apparatus of the present invention, and the substrate is reversed. Therefore, it is not necessary to rely on manual work for reversal, and the solder paste does not adhere to the operator's hand and peripheral parts, and the work time is not prolonged, and the substrate can be positioned quickly.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1A and FIG. 1B are a plan view and a side view showing an embodiment of a substrate reversal transfer apparatus of the present invention. In the substrate reversing / transferring apparatus 1 of the present embodiment, two bearing columns 3 are arranged on the base 2 so as to face each other, and both ends of the rotating shaft of the rotation base 4 can be rotated by the bearings of the bearing columns 3. I support it. A rotation drive mechanism 5 is provided on the base 2, and an output rotation shaft 5 a of the rotation drive mechanism 5 is connected to one end of the rotation shaft of the rotation base 4. When the rotation drive mechanism 5 is operated and the output rotation shaft 5a is rotated, the rotation base 4 is rotated together with the output rotation shaft 5a.

  In addition, two struts 6 project from both sides of one bearing strut 3 and two struts 7 project from both sides of the other bearing strut 3. A pin 9 is provided on one side of the rotation base 4. The pin 9 abuts on one of the upper ends of the columns 6, the rotation angle of the rotation base 4 is limited to 180 degrees, and the rotation base 4. Is positioned.

  Furthermore, the respective magnets 8 are provided in three recesses on the front side of the rotation base 4, and the surface position of the rotation base 4 and the surface position of each magnet 8 are set to the same height.

  In addition, each of the through holes 4a through which a total of twelve board discharge pins 22 in the elevating plate 17 to be described later pass, and a total of two extrusion rods 23 for extruding a component pallet 41 to be described later pass through the rotary base 4. Through-holes 4b are formed. Further, the rotation base 4 is formed with a fitting hole 4c into which two fitting pins 41b of a component pallet 41 described later are fitted.

  A transport cylinder 11 is provided on the upper side of the base 2, and a tray 12 is supported by the transport cylinder 11 so as to be able to reciprocate between the positions P 1 and P 2. The transfer cylinder 11 may be of any type such as a hydraulic or pneumatic cylinder, a rack and pinion mechanism, a helicoid gear mechanism, or the like.

  A transport cylinder 13 is provided below the base 2, and the transport cylinder 13 supports the substrate discharge mechanism 14 so as to be able to reciprocate. The transfer cylinder 13 may be of any type, such as a hydraulic or pneumatic cylinder, a rack and pinion mechanism, a helicoid gear mechanism, or the like, similar to the transfer cylinder 11.

  As shown in FIGS. 1B and 2, the substrate discharge mechanism 14 is supported by a column 15 connected to the transfer cylinder 13, a lifting unit 16 fixed to the column 15, and a lifting unit 16 so as to be movable up and down. An elevating plate 17 is provided. As with the transport cylinder 11, the lifting unit 16 may be of any type.

  As the column 15 is reciprocated by the transfer cylinder 13, the elevating plate 17 is reciprocated between the positions P1 and P3. When the elevating plate 17 is moved to the position P1, the elevating plate 17 When it is moved to the position P3, it retreats from above the rotation base 4. In addition, the lift plate 17 is moved to the position P1 and is opposed to the rotation base 4, and is lowered by the lift 16 of the support column 15 until it is close to the surface of the rotation base 4 or from the surface of the rotation base 4. Until it is separated.

  Further, a total of twelve substrate discharge pins 22 and a total of two push rods 23 protrude from the elevating plate 17. The positions of the twelve board discharge pins 22 are set so as to coincide with the positions of the positioning pins 41a of the component pallet 41 described later.

  The substrate discharge pin 22 has a presser pin 22a urged so as to protrude downward. The presser pin 22a is movably held inside the cylindrical body 22b so as not to drop off from the cylindrical body 22b, and is urged downward by a spring (not shown) inside the cylindrical body 22b.

  FIGS. 3A and 3B are a plan view and a cross-sectional view showing a printing base placed on the rotating base 4. The printing base 31 includes a printing plate 32 and a base frame 33 that detachably supports the printing plate 32.

  The base frame 33 has a flat plate shape as shown in FIGS. 4A and 4B, and a concave portion 33a for detachably fitting the printing plate 32 is formed on the front side thereof. Cutouts 33b are formed at the four corners of the recess 33a. When the printing plate 32 is taken out from the recess 33a, a finger is put into the notch 33b, and the printing plate 32 is caused.

  The printing plate 32 is made of a flat metal (magnetic material) as shown in FIGS. 5A and 5B, and three pairs of substrate holders 34 are fixed to the front side of the printing plate 32. A single substrate is detachably supported. Further, the substrate is positioned by the plurality of protruding pins 37. Therefore, three substrates are detachably supported and positioned on the printing plate 32.

  Further, four magnets 36 are fixed to the printing plate 32. Further, the printing plate 32 is formed with respective through holes 32a through which a total of twelve substrate discharge pins 22 in the elevating plate 17 pass and respective cutout holes 32b through which a total of two push rods 23 pass. Further, the printing plate 32 is formed with respective through holes 32c through which two fitting pins 41b of the component pallet 41 described below pass.

  FIGS. 6A and 6B are a plan view and a cross-sectional view showing a component pallet superimposed on three substrates positioned and supported on the printing plate 32.

  The component pallet 41 is made of a flat metal (magnetic material), and a total of 12 positioning pins 41a for positioning the three substrates 35 and each through hole 32c of the printing plate 32 are provided on the back side thereof. Two fitting pins 41b that project through the fitting holes 4c of the rotary base 4 are provided.

  Next, a procedure for transferring and mounting each substrate 35 from the printing plate 32 of the printing base 31 to the component pallet 41 using the substrate reversing / transferring apparatus 1 having such a configuration will be described.

  First, as shown in FIGS. 3A and 3B, three substrates 35 (shown in FIGS. 7A to 7D) are placed on the printing plate 32 with the printing plate 32 attached to the base frame 33. ) With the back side facing upward, and the substrates 35 are positioned and supported by the three pairs of substrate holders 34 of the printing plate 32. At this time, each substrate 35 is positioned so that the through-holes 35 a at the four corners of each substrate 35 overlap with the respective through-holes 32 a of the printing plate 32.

  In this state, cream solder is applied to the back surface of each substrate 35 on the printing plate 32 using a printing machine (not shown).

  Thereafter, a finger is put into the notch 33 b of the base frame 33, and the printing plate 32 is lifted from the base frame 33 and removed.

  Next, as shown in FIG. 7A, the printing plate 32 is placed on the front side of the rotating base 4 of the substrate reversal transfer device 1, and the through holes 35 a at the four corners of each substrate 35 and the through holes 32 a of the printing plate 32 are formed. The position of the printing plate 32 is adjusted so as to overlap each through-hole 4a of the rotating base 4. At the same time, adjustment is made so that each cutout hole 32 b of the printing plate 32 overlaps with each through hole 4 b of the rotation base 4. At this time, as shown in FIG. 8, the metal printing plate 32 is attracted and fixed by the magnetic force of each magnet 8 of the rotating base 4.

  Subsequently, as shown in FIGS. 7A and 7B, the component pallet 41 is put on each substrate 35 on the printing plate 32, and each positioning pin 41 a of the component pallet 41 is passed through the through holes 35 a at the four corners of each substrate 35. And the fitting pins 41b of the component pallet 41 are fitted into the fitting holes 4c of the rotary base 4 through the through holes 32c of the printing plate 32, respectively. At this time, as shown in FIG. 8, the metal component pallet 41 is attracted and fixed by the magnetic force of each magnet 36 of the printing plate 32.

  By fitting each fitting pin 41b of the component pallet 41 to each fitting hole 4c of the rotation base 4 via each through hole 32c of the printing plate 32, the component pallet 41 (each substrate 35), the printing plate 32, The positioning base 41 and the rotating base 4 are accurately positioned, and the positioning pins 41a of the component pallet 41 (through holes 35a at the four corners of the substrate 35), the through holes 32a of the printing plate 32, and the through holes of the rotating base 4 are provided. The holes 4a are accurately overlapped, and the notches 32b of the printing plate 32 are also accurately overlapped with the through holes 4b of the rotating base 4.

  After the printing plate 32, each substrate 35, and the component pallet 41 are sequentially stacked on the front side of the rotation base 4 in this manner, the rotation drive mechanism 5 is operated as shown in FIG. Rotate 180 degrees so that the back side of the rotating base 4 faces upward.

  At this time, the component pallet 41 is positioned on the lowermost side, and each substrate 35 is placed thereon, the front and back of each substrate 35 are reversed, and the surface of each substrate 35 faces upward.

  Subsequently, the transport cylinder 11 is operated to move the tray 12 to a position P1 below the rotation base 4. Further, the transport cylinder 13 is operated to move the elevating plate 17 to a position P1 above the rotation base 4 as shown in FIG. At this time, a total of twelve substrate discharge pins 22 on the elevating plate 17 are vertically below each of the through holes 4a of the rotation base 4, each of the through holes 32a of the printing plate 32, and each of the positioning pins 41a of each component pallet 41 (each substrate). The through holes 35a) at the four corners of 35 are located. In addition, the through holes 4 b of the rotation base 4 and the cutout holes 32 b of the printing plate 32 are positioned vertically below the total of the two extrusion rods 23 in the elevating plate 17.

  In this state, as shown in FIG. 7 (d), when the elevating part 16 of the support column 15 is operated and the elevating plate 17 is lowered until it comes close to the back side surface of the rotating base 4, The presser pins 22a of 22 pass through the respective through holes 4a of the rotation base 4 and the respective through holes 32a of the printing plate 32 and come into contact with the respective positioning pins 41a of the component pallet 41. Each positioning pin 41a of the pallet 41 is inserted into the through holes 35a at the four corners of each substrate 35, so that the displacement of each substrate 35 is suppressed. Further, each push rod 23 in the elevating plate 17 contacts the component pallet 41 through each through hole 4b of the rotation base 4 and each notch hole 32b of the printing plate 32, and each push rod 23 moves each component pallet 41 to each other. Press down together with the substrate 35. At this time, since the presser pins 22a of the board discharge pins 22 are movable and retracted, the presser pins 22a are not pulled while being in contact with the positioning pins 41a of the component pallet 41, thereby preventing the push rods 23 from being lowered. Absent.

  When the component pallet 41 is pushed down, each fitting pin 41b of the component pallet 41 is released from each fitting hole 4c of the rotating base 4, and the component pallet 41 is released from the magnetic force of each magnet 36 of the printing plate 32. The component pallet 41 falls with each substrate 35 and is received by the tray 12 below the rotary base 4.

  In the tray 12, each substrate 35 is placed on the component pallet 41, and the surface of each substrate 35 faces upward.

  Thereafter, the lifting / lowering portion 16 of the support column 15 is operated to move the lifting / lowering plate 17 away from the back side surface of the rotating base 4, the transport cylinder 13 is operated, and the lifting / lowering plate 17 is moved to the position P 3 to move above the rotating base 4. The rotation drive mechanism 5 is operated to turn the front side of the rotation base 4 upward. Further, the transport cylinder 11 is operated to move the tray 12 to the position P2.

  The operator takes out the component pallet 41 together with each substrate 35 from the tray 12 and conveys the component pallet 41 to the next process. In the next step, electronic components are mounted on each substrate 35 while each substrate 35 is placed on the component pallet 41. Further, the operator removes the printing plate 32 from the rotation base 4 so that the next printing plate 32 can be attached.

  Thereafter, similarly, the printing plate 32 is placed on the front side of the rotating base 4 of the substrate reversing / transferring apparatus 1, the component pallet 41 is placed on each substrate 35 on the printing plate 32, and the back side of the rotating base 4 faces upward. 17 is moved to the upper side of the rotating base 4 and then lowered, the component pallet 41 is dropped on the tray 12 together with each substrate 35 and received, and the component pallet 41 is taken out together with each substrate 35 from the tray 12.

  Therefore, it is not necessary to rely on the manual process of transferring each substrate 35 from the printing plate 32 to the component pallet 41 and inverting the front and back of each substrate 35, and the cream solder adheres to the operator's hand and peripheral components. In addition, the working time does not become long, and the substrate can be quickly positioned.

  FIGS. 9A and 9B are views showing a substrate processing process using the substrate reversal transfer apparatus 1 of the present embodiment and a conventional manual substrate processing process. As is apparent from the comparison of these processes, in the conventional process, the substrate is directly touched by the hand in the step 63 for removing the substrate from the printing base and the step 64 for attaching to the component pallet. In the printing base take-out step 53 and the component pallet attachment step 54, the substrate is not directly touched by hand, and the cream solder does not adhere to the operator's hand or peripheral parts.

  Further, since the magnets 8 and 36 are used to attract and hold the printing plate 32 and the component pallet 41, the printing plate 32 and the component pallet 41 can be held by a simple and low-cost mechanism. .

  In the case of using a magnet, it is not necessary to make the whole of the printing plate 32 and the parts pallet 41 a magnetic body, and the magnetic body 42 is provided only at the location of the printing plate 32 in contact with the magnet 8 as shown in FIG. The most part other than this part is made of a non-magnetic material such as synthetic resin, or the magnetic body 43 is provided only on the part pallet 41 in contact with the magnet 36, and most parts other than this part are made of non-synthetic resin or the like. A magnetic material may be used. Thereby, weight reduction and cost reduction of the printing plate 32 and the components pallet 41 can be aimed at.

  Further, the print base 31 is exemplified by the print plate 32 and the base frame 33. However, a single print base 31A as shown in FIGS. 11A and 11B may be used. However, in this case, as shown in FIG. 12, a sufficiently large rotating base 4A on which the printing base 31A can be placed is required. In order to secure a rotating space for the rotating base 4A, the substrate inversion transfer apparatus 1 is also large. Turn into. In other words, the size of the rotating base 4 and the substrate reversal transfer device 1 is reduced by removing the smaller printing plate 32 from the printing base 31 and using it.

(A), (b) is the top view and side view which show one Embodiment of the substrate inversion transfer apparatus of this invention. It is a top view which shows the board | substrate discharge | emission mechanism in the board | substrate inversion transfer apparatus of FIG. (A), (b) is the top view and sectional drawing which show the printing base mounted on the rotation base in the board | substrate inversion transfer apparatus of FIG. (A), (b) is the top view and sectional drawing which show the base frame of the printing base of FIG. (A), (b) is the top view and sectional drawing which show the printing plate of the printing base of FIG. (A), (b) is the top view and side view which show the components pallet piled up on each board | substrate on the printing plate of FIG. (A)-(d) is a figure which shows the process sequence of the board | substrate using the board | substrate inversion transfer apparatus of FIG. It is a figure which shows the state which accumulated the rotation base, the printing plate, and the component pallet in the board | substrate inversion transfer apparatus of FIG. (A), (b) is a figure which shows the board | substrate processing process using the board | substrate inversion transfer apparatus of this embodiment, and the board | substrate processing process by the conventional manual work. It is a figure which shows the modification of the printing plate and components pallet in the board | substrate inversion transfer apparatus of FIG. (A), (b) is the top view and side view which show the modification of the printing base in the board | substrate inversion transfer apparatus of FIG. It is a side view which shows the modification of the board | substrate inversion transfer apparatus of FIG. (A), (b) is the top view and side view which show the conventional printing base. (A), (b) is the top view and side view which show the conventional component pallet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate reversal transfer apparatus 2 Base 3 Bearing support | pillar 4 Rotation base 5 Rotation drive mechanism 6, 7 Support | pillar 8, 36 Magnet 9 Pin 11, 13 Conveyance cylinder 12 Receptacle 14 Substrate discharge mechanism 15 Support column 16 Elevating part 17 Elevating plate 22 Substrate Discharge pin 23 Extrusion rod 31 Printing base 32 Printing plate 33 Base frame 34 Substrate holder 35 Substrate 41 Parts pallet 42, 43 Magnetic body

Claims (7)

In the substrate reversal transfer device that transfers the substrate from the printing base to the parts pallet and places it on it,
A rotating base for holding the printing base on which the substrate is placed and holding the component pallet overlaid on the substrate on the printing base;
Rotating means for rotating the rotating base so that the front and back of the rotating base are reversed;
And a release means for extruding the substrate and the parts pallet from the back side of the rotating base through the rotating base and releasing them from the printing base on the front side of the rotating base with the front and back sides of the rotating base reversed. Reverse transfer equipment.   The substrate reversal transfer apparatus according to claim 1, wherein the rotation base is rotated around an axis passing through a center of the rotation base.   The substrate reverse transfer apparatus according to claim 1, wherein the printing base includes a printing plate that holds a substrate and a base frame that detachably supports the printing plate.   2. The substrate according to claim 1, wherein the rotating base has a magnet for attracting and holding the printing base, and the printing base has a magnet for attracting and holding the component pallet. Reverse transfer equipment.   5. The substrate reversal transfer apparatus according to claim 4, wherein the printing base and the component pallet include a magnetic body provided at a location attracted by the magnet and a non-magnetic material other than the location. .   2. The release means includes a board push pin that pushes out the board and releases it from the printing base together with the component pallet, and a press pin for preventing the board from being detached from the component pallet. The substrate reversal transfer apparatus described in 1. In the processing method of the board | substrate using the board | substrate inversion transfer apparatus in any one of Claims 1 thru | or 6,
Holding the printing base on which the substrate is placed on the rotation base front side of the substrate reversal transfer device, and holding the component pallet superimposed on the substrate on the printing base;
Rotating the rotation base so that the front and back of the rotation base are reversed by the rotation means of the substrate reversal transfer device;
A substrate processing method comprising: a step of releasing the substrate and the component pallet from the back side of the rotating base through the rotating base by the releasing means of the substrate reversing / transferring device to release the substrate from the printing base on the front side of the rotating base. .

Images