JP2008146758A - Optical head device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical head device which can facilitate exchange of a photoelectric element or an optical element than before. <P>SOLUTION: The optical head device 10 comprises a laser light sources 12 and 16, a front monitor 17 which receives the outgoing beam from the laser light source 12 and 16, a frame 20 on which the front monitor 17 is mounted, and a hard substrate 18 which mounts the front monitor 17 on its face 18a. The hard substrate 18 which is elastically deformed and supported by the frame 20 with repulsion due to the elastic deformation for the reason that the face 18a has contact with the frame 20 at both edges 18c and 18d with respect to the front monitor 17 as its center and the face 18b opposite to the face 18a has contact with the frame 20 at the inside part 18e inner to the edges 18c and 18d. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical head device used for recording and reproducing information on an optical recording disk such as a CD (Compact Disk) or a DVD (Digital Versatile Disk).

In an optical head device having a laser light source, a light receiving element on which light emitted from the laser light source is incident, a prism for guiding light emitted from the laser light source to the light receiving element, and a device frame on which the prism is mounted, On the other hand, what fixes a prism to a flame | frame with the adhesives with which peeling is difficult, such as UV (Ultra Violet) hardening type adhesives, is known (for example, refer patent document 1).
JP 2005-43434 A

  However, in the conventional optical head device, since the prism is fixed to the device frame with an adhesive that is difficult to peel off, it is difficult to remove the prism from the device frame. Therefore, the conventional optical head device has a problem that it is difficult to remove the prism from the device frame and replace the prism.

  The present invention has been made to solve the conventional problems, and an object of the present invention is to provide an optical head device capable of facilitating replacement work of optical elements constituting an optical system such as a prism. .

  The optical head device of the present invention includes a laser light source, a photoelectric element to which light emitted from the laser light source is incident, an optical element that guides light emitted from the laser light source to the photoelectric element, the photoelectric element, and the optical element. In an optical head device having a frame on which an element is mounted, the optical head device includes a reinforcing plate on which the photoelectric element or the optical element is mounted on one surface, and the reinforcing plate includes the one surface and the one surface. Either one of the other surface and the other surface is in contact with the frame at both ends of the photoelectric element or the optical element, and either the one surface or the other surface. The other side is elastically deformed by coming into contact with the frame at the inner side inside the both ends, and is held by the frame by a restoring force due to the elastic deformation.

  With this configuration, the optical head device of the present invention can remove the reinforcing plate from the frame more easily than before, so that the replacement work of the photoelectric element or optical element mounted on the reinforcing plate can be made easier than before. Can do.

  Further, the one side of the optical head device of the present invention is the one surface, and the inner part is located at a position off the center of the photoelectric element or the optical element in the width direction on the reinforcing plate. Is preferred.

  With this configuration, the optical head device according to the present invention has an elastic deformation of the reinforcing plate as compared with the case where the inner portion of the reinforcing plate in contact with the frame is the center of the reinforcing plate in the width direction of the photoelectric element or the optical element. Since the deformation of the photoelectric element or the optical element can be suppressed, it is possible to suppress the deterioration of the optical characteristics of the photoelectric element or the optical element. Moreover, when the photoelectric element is mounted on the reinforcing plate, the optical head device of the present invention can suppress the stress applied to the solder connecting portion between the reinforcing plate and the photoelectric element due to the elastic deformation of the reinforcing plate. it can.

  Moreover, it is preferable that the reinforcing plate of the optical head device of the present invention is mounted with an FPC conductively connected to the photoelectric element.

  With this configuration, the optical head device of the present invention removes the expensive and high added value reinforcing plate mounted with the FPC from the frame when there is a defect in the portion other than the reinforcing plate and the FPC, such as a defective frame. Can be reused.

  The reinforcing plate of the optical head device of the present invention is preferably a hard substrate having a conductive pattern formed on the surface.

  With this configuration, the optical head device of the present invention is fixed to the frame in comparison with the configuration in which the reinforcing plate is fixed to the frame by sandwiching both ends of the reinforcing plate from both sides in the thickness direction of the reinforcing plate and press-fitting into the frame. Since the allowable range of the thickness of the reinforcing plate that can be performed is large, even if the processing accuracy of the thickness of the hard substrate is low, it can be dealt with.

  ADVANTAGE OF THE INVENTION According to this invention, the optical head apparatus which can make the replacement | exchange operation | work of a photoelectric element or an optical element easier than before can be provided.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  First, the configuration of the optical head device according to the present embodiment will be described.

  FIG. 1 is a plan view of an optical head device 10 according to the present embodiment. FIG. 2 is a plan view of a part of the optical head device 10 and is a view in the vicinity of the front monitor 17.

  As shown in FIGS. 1 and 2, the optical head device 10 according to the present embodiment includes laser light sources 12 and 16 that emit laser light for reading information from an optical recording disk (not shown), and a laser light source 12. The laser beam emitted from the laser beam is reflected by the half mirror 13 that is an optical element that transmits the reflected light reflected by the optical recording disk, and the laser beam reflected by the laser light source 12 that has reached through the half mirror 13 and the laser beam. A half mirror 14 that is an optical element that transmits outgoing light emitted from the light source 16 and an optical element that reaches the half mirror 14 via the half mirror 13 and raises the laser light reflected by the half mirror 14. The raising mirror 15 and the laser beam raised by the raising mirror 15 are condensed on the recording surface of the optical recording disk. An objective lens (not shown) that is a scientific element, and a detection photoelectric element 11 that is a photoelectric element that detects a laser beam that is reflected by the optical recording disk and reaches the objective lens, the rising mirror 15 and the half mirror 14, A front monitor 17 that is a photoelectric element that detects laser light that reaches the half mirror 14 through the half mirror 13 and passes through the half mirror 14 for feedback control of the laser light sources 12 and 16, and the front monitor 17 on one side. A hard board 18 made of glass epoxy resin, which is a reinforcing plate mounted on the surface 18a and having a conductive pattern formed on the surface thereof, and an FPC (Flexible) electrically connected to the laser light sources 12, 16, the detection photoelectric element 11 and the front monitor 17. Printed Circuit) 19 and laser light sources 12, 16, half Ra 13 and 14, raising mirror 15, and objective lens, photoelectrically detecting element 11, a front monitor 17, a frame 20 equipped with a hard board 18, FPC 19.

  The hard substrate 18 has a frame 18a at one end 18c, 18d, which is one end of the one side 18a and the other side 18b opposite to the surface 18a. 20 abuts. Further, the hard substrate 18 is in contact with the frame 20 at the inner side portion 18e inside the end portions 18c and 18d, the surface 18b which is the other side of the surface 18a and the surface 18b. The hard substrate 18 is elastically deformed by contacting the frame 20 at the end portions 18c and 18d and the inner portion 18e, and is held by the frame 20 by a restoring force due to the elastic deformation. The inner portion 18e is located on the hard substrate 18 at a position near the end portion 18c outside the outer shape of the front monitor 17.

  The FPC 19 is conductively connected to the surface 18 a of the hard substrate 18.

  FIG. 3 is a plan view of a part of the frame 20. FIG. 4 is a perspective view of a part of the frame 20.

  As shown in FIGS. 3 and 4, the frame 20 has wall surfaces 20a, 20b facing each other and a wall surface 20a for alignment in the width direction orthogonal to the thickness direction of the hard substrate 18 (see FIG. 2). , 20b orthogonal to the end face 18c, 18d (see FIG. 2) of the surface 18a (see FIG. 2) of the hard substrate 18, and the direction in which the wall surfaces 20c, 20d are facing. Has an arcuate protrusion 20e that projects in the opposite direction and abuts against the inner portion 18e (see FIG. 2) of the surface 18b (see FIG. 2) of the hard substrate 18. The arc-shaped protrusion 20e is a semi-cylindrical protrusion that extends in a direction parallel to both the wall surfaces 20a and 20b and the wall surfaces 20c and 20d. A distance 20g between the wall surface 20c, 20d in the protruding direction indicated by the arrow 20f of the arc-shaped protrusion 20e and the arc-shaped protrusion 20e is shorter than the thickness of the hard substrate 18.

  Note that the end portions 18c and 18d of the hard substrate 18 and the wall surfaces 20c and 20d of the frame 20 are fixed by an easily peelable adhesive.

  Next, attachment of the hard board 18 to the frame 20 will be described.

  The hard substrate 18 on which the front monitor 17 and the FPC 19 are mounted is aligned in the width direction by the wall surfaces 20a and 20b of the frame 20, and in a direction parallel to both the wall surfaces 20a and 20b and the wall surfaces 20c and 20d. It is moved and press-fitted between the wall surfaces 20c and 20d and the arcuate protrusion 20e.

  Here, since the distance 20g between the wall surface 20c, 20d in the protruding direction indicated by the arrow 20f of the arc-shaped projection 20e and the arc-shaped projection 20e is shorter than the thickness of the hard substrate 18, the hard substrate 18 is an end portion of the surface 18a. 18c, 18d abuts against the wall surfaces 20c, 20d of the frame 20 and abuts against the arc-shaped protrusion 20e of the frame 20 at the inner portion 18e of the surface 18b, so that the surface 18a side is elastically deformed so as to be convex, and its elasticity It is held on the frame 20 by the restoring force due to the deformation.

  The end portions 18c and 18d of the hard substrate 18 and the wall surfaces 20c and 20d of the frame 20 are fixed with an easily peelable adhesive.

  Next, the removal of the hard board 18 from the frame 20 will be described.

  The hard substrate 18 is moved in a direction parallel to both the wall surfaces 20a and 20b and the wall surfaces 20c and 20d, and is pulled out from between the wall surfaces 20c and 20d of the frame 20 and the arcuate protrusion 20e.

  Here, since the adhesive that fixes the end portions 18c and 18d of the hard substrate 18 and the wall surfaces 20c and 20d of the frame 20 can be easily peeled off, the removal of the hard substrate 18 from the frame 20 is hindered. It will not be.

  As described above, in the optical head device 10, since the hard substrate 18 is held by the frame 20 by the restoring force due to the elastic deformation of the hard substrate 18, the hard substrate 18 can be removed from the frame 20 more easily than before. Is possible. Therefore, the optical head device 10 can make the replacement work of the front monitor 17 mounted on the hard substrate 18 easier than before. As a result, the optical head device 10 can reduce the work time required for the replacement of the front monitor 17 as compared with the prior art, so that the manufacturing cost can be reduced as compared with the prior art.

  In the optical head device 10, the hard substrate 18 is held by the frame 20 by the restoring force due to the elastic deformation of the hard substrate 18, so that the front monitor 17 is peeled off from the frame 20 by a UV curable adhesive or the like as in the prior art. Compared to the configuration in which it is difficult to fix the front monitor 17 with an adhesive, the work time required to fix the front monitor 17 to the frame 20 can be shortened. Therefore, the optical head device 10 can reduce the manufacturing cost as compared with the related art.

  Further, since the optical head device 10 does not use a UV curable adhesive for fixing the front monitor 17 to the frame 20, it is not necessary to prepare a UV irradiator for fixing the front monitor 17 to the frame 20. Therefore, the optical head device 10 can reduce the manufacturing cost as compared with the configuration in which the UV curable adhesive is used for fixing the front monitor 17 to the frame 20.

  Further, in the optical head device 10, the inner portion 18 e of the hard substrate 18 that is in contact with the frame 20 is at a position off the center 17 a (see FIG. 2) in the width direction of the front monitor 17 on the hard substrate 18. Compared with the case where the inner portion 18e is the center 17a in the width direction of the front monitor 17 on the hard substrate 18, the deformation of the front monitor 17 due to the elastic deformation of the hard substrate 18 can be suppressed. The deterioration of characteristics can be suppressed. Moreover, the optical head device 10 can suppress stress from being applied to the front monitor 17 and the solder connection portion 21 (see FIG. 2) between the hard substrate 18 due to elastic deformation of the hard substrate 18.

  Further, since the optical substrate 10 has the FPC 19 mounted on the hard substrate 18, the FPC 19 is expensive when the FPC 19 is mounted when there is a defect in a portion other than the hard substrate 18 or the FPC 19, such as a defect in the frame 20. The hard substrate 18 having a large added value can be removed from the frame 20 and reused.

  Further, the optical head device 10 is compared with a configuration in which the hard substrate 18 is fixed to the frame 20 by sandwiching the end portions 18c and 18d of the hard substrate 18 from both sides in the thickness direction of the hard substrate 18 and press-fitting into the frame 20. Since the allowable range of the thickness of the hard substrate 18 that can be fixed to the frame 20 is large, it is possible to cope with the case where the processing accuracy of the thickness of the hard substrate 18 is low.

  In the present embodiment, the hard substrate 18 is in contact with the frame 20 at the end portions 18c and 18d, which are both ends of the front monitor 17 centered on the front monitor 17, and the surface 18b is on the inner side of the end portions 18c and 18d. It is elastically deformed by coming into contact with the frame 20 at the inner part 18e of the lens, and is held by the frame 20 by the restoring force due to the elastic deformation. While abutting, the surface 18a may be elastically deformed by abutting against the frame 20 at the inner side inside both ends, and may be held by the frame 20 by a restoring force due to the elastic deformation.

  Moreover, although the FPC 19 is mounted on the hard substrate 18 in the present embodiment, the FPC may not be mounted.

  The reinforcing plate is the hard substrate 18 in the present embodiment, but may be other than the hard substrate 18. For example, the reinforcing plate may be a plate on which no conductive pattern is formed.

  In addition, the reinforcing plate is mounted with the front monitor 17 which is a photoelectric element in the present embodiment, but instead of the front monitor 17, a photoelectric element other than the front monitor 17 may be mounted, a lens or the like. The optical element may be mounted.

1 is a plan view of an optical head device according to an embodiment of the present invention. FIG. 2 is a plan view of a part of the optical head device shown in FIG. 1 and is a view in the vicinity of a front monitor. FIG. 2 is a plan view of a part of the frame of the optical head device shown in FIG. 1. FIG. 2 is a perspective view of a part of a frame of the optical head device shown in FIG. 1.

Explanation of symbols

10 Optical Head Device 11 Detection Photoelectric Element (Photoelectric Element)
12, 16 Laser light source 13, 14 Half mirror (optical element)
15 Raising mirror (optical element)
17 Front monitor (photoelectric element)
17a Center 18 Hard board (Reinforcement plate)
18a side (one side, one side)
18b surface (the other surface, the other side)
18c, 18d end (both ends)
18e inner part 19 FPC
20 frames

Claims (4)

A laser light source; a photoelectric element on which light emitted from the laser light source is incident; an optical element that guides light emitted from the laser light source to the photoelectric element; and a frame on which the photoelectric element and the optical element are mounted. In an optical head device having
A reinforcing plate having the photoelectric element or the optical element mounted on one surface;
In the reinforcing plate, either one of the one surface and the other surface opposite to the one surface is in contact with the frame at both ends of the photoelectric element or the optical element. At the same time, either one of the one surface and the other surface is elastically deformed by abutting the frame at the inner portion inside the both end portions, and the return force due to the elastic deformation causes the frame to be deformed. An optical head device that is held. The one side is the one surface,
2. The optical head device according to claim 1, wherein the inner portion is located at a position off the center of the photoelectric element or the optical element in the width direction of the reinforcing plate.   3. The optical head device according to claim 1, wherein the reinforcing plate includes an FPC that is conductively connected to the photoelectric element. 4. 4. The optical head device according to claim 1, wherein the reinforcing plate is a hard substrate having a conductive pattern formed on a surface thereof.

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