JP2008141055A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a multi-finger structure and capable of improving heat dissipation. <P>SOLUTION: The semiconductor device includes a plurality of cells 5, each of which is provided with a predetermined number of gate electrodes 1, and source electrodes 3 and drain electrodes 4 alternately formed by respectively interposing the gate electrodes 1, wherein a cell 5 is arranged to be shifted from a neighboring other cell 5'. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a semiconductor device such as a field effect transistor (hereinafter referred to as an FET) having a multi-finger structure.

  In recent years, with higher functionality of inverter circuits and switching elements, higher output is required in FETs.

  As the output of such an FET increases, securing heat dissipation becomes a problem. Therefore, in a conventional device using a GaAs substrate, the low thermal conductivity of the material itself called GaAs governs the heat dissipation, so that the heat dissipation is ensured by thinning the substrate to about 30 μm. It was.

  However, in FETs using SiC and GaN, which are semiconductor materials replacing GaAs, the power density is several times to several tens of times that of the conventional one, and accordingly, the heat generation density is also increasing. Generally, these FETs using SiC and GaN use SiC as a supporting substrate. SiC has a higher thermal conductivity than GaAs and has a value close to that of a metal material. However, since the heat generation density further increases, it is difficult to improve the heat dissipation only by thinning the substrate.

Therefore, since the heat generation region concentrates on the finger-shaped gate electrode and source / drain electrode portions, a heat radiation electrode connected to the source / drain electrodes is provided to incline the width of the source / drain electrodes at the center and the end. (See, for example, Patent Document 1 [Claim 1], [Claim 3], etc.). However, since the electrode area is increased or a new manufacturing process is provided, there is a problem that it is difficult to reduce the size and cost of the element.
JP-A-7-283996

  An object of the present invention is to provide a semiconductor device capable of improving heat dissipation in a multi-finger structure.

  According to one aspect of the present invention, a plurality of cells each including a predetermined number of gate electrodes formed on a semiconductor substrate and source and drain electrodes formed alternately with each gate electrode interposed therebetween are provided. Is provided with a shifted arrangement with respect to other adjacent cells.

  According to one embodiment of the present invention, in a semiconductor device having a multi-finger type structure, it is possible to disperse and arrange heat generating regions to improve heat dissipation.

  Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1)
FIG. 1 shows a plan view of electrode cells (for two cells) in the FET element of this embodiment. As shown in the figure, on a substrate (not shown) made of a compound semiconductor such as SiC in which an operation region is formed, for example, six finger-shaped gate electrodes 1 and 1 'having a width of 100 μm are formed, and each of them has a gate. The wirings 2 and 2 'are connected. Then, four similar source electrodes 3 and 3 ′ and three drain electrodes 4 and 4 ′ are alternately formed across the gate electrodes 1 and 1 ′ to constitute cells 5 and 5 ′.

  The cell 5 is arranged to be shifted by the cell width in the gate width direction with respect to the other adjacent cell 5 ′. The gate lines 2 and 2 'are connected to the gate pad 7 for bonding to the outside through the bus lines 6 and 6', and the length of the bus lines 6 and 6 'is supplied to the gate electrode at an equal distance. A and B are arranged to be equal. Then, an L-shaped drain pad 8 connected to each of the drain electrodes 4 and 4 ′ so as to be equidistant from each other, and two source electrodes 3 and 3 ′, respectively, are connected by an air bridge or the like, and a contact 9 is provided. Two source pads 10, 10 'are arranged.

  FIG. 2 shows a layout of such an electrode cell. As shown in the figure, the cells 5 and the source pads 10 'are alternately arranged, and the source pads 10 and the gate pads 7 are alternately arranged. The cells 5 'and a part of the drain pad 8 are alternately arranged, that is, the drain pad 8 is disposed between the two cells 5'.

  In this way, by disposing the cells of the electrode serving as the heat generation source by shifting the cell width, the heat generation region can be dispersed. And in this embodiment, about 20% of thermal resistance can be reduced with respect to the thermal resistance in the conventional electrode arrangement as shown in FIG. Further, by making the lengths of the bus lines 6 and 6 'equal, generation of a phase difference on the input side is suppressed, and by connecting the drain electrodes 4 and 4' and the drain pad 8 at equal distances, Generation of a phase difference can be suppressed.

(Embodiment 2)
FIG. 4 shows a plan view of electrode cells (for two cells) in the FET element of this embodiment. Although it is the same as that of Embodiment 1, it differs in the point by which the contact 19 is provided in each source electrode 13 and 13 '. That is, as shown in the figure, on a substrate (not shown) made of a compound semiconductor such as SiC in which an operation region is formed, six finger-type gate electrodes 11, 11 ′ having a width of 100 μm, for example, are formed. The gate lines 12 and 12 ′ are connected to each other. Then, four similar source electrodes 13 and 13 ′ and 13 drain electrodes 4 and 4 ′ are alternately formed across the gate electrodes 11 and 11 ′, thereby constituting cells 15 and 15 ′.

  Similar to the first embodiment, the cell 15 is arranged so as to be shifted by the cell width in the gate width direction with respect to another adjacent cell 15 ′. The gate wirings 12 and 12 'are connected to the gate pad 17 for bonding to the outside via the bus lines 16 and 16', and the bus lines 16 and 16 'are long in order to supply power to the gate electrode at an equal distance. A 'and B' are arranged to be equal. Then, an L-shaped drain pad 18 connected so as to be equidistant from the drain electrode 14 ′ is disposed.

  FIG. 5 shows a layout of such an electrode cell. As shown in the drawing, the cells 15 and part of the gate pads 17 are alternately arranged. The cells 15 ′ and part of the drain pad 18 are alternately arranged, that is, the drain pad 18 is disposed between the two cells 15 ′.

  In this way, by disposing the cells of the electrode serving as the heat generation source by shifting the cell width, the heat generation region can be dispersed. And in this embodiment, about 20% of thermal resistance can be reduced with respect to the thermal resistance in the conventional electrode arrangement as shown in FIG. In addition, by making the lengths of the bus lines 16 and 16 'equal, the occurrence of a phase difference on the input side is suppressed, and the drain electrodes 14 and 14' and the drain pad 18 are connected at equal distances, so that on the output side. Generation of a phase difference can be suppressed.

  In these embodiments, each of the cells 5 and 15 is arranged so as to be shifted by the cell width in the gate width direction with respect to the adjacent cells 5 ′ and 15 ′, but the shift width is not necessarily equal to the cell width. Absent. Although it depends on the driving conditions and the like, it is only necessary to shift to a certain extent to disperse the heat generation region. For example, the effect can be obtained by shifting about half the width of the cell.

  The gate electrodes 1, 1 ′, 11, 11 ′ are connected to the bus lines 6, 6 ′, 16, 16 ′ by the gate lines 2, 2 ′, 12, 12 ′, respectively. It is preferable that the distance between the connecting portion of the line and the gate electrode is equal, and the gate wiring may be arranged so as to be obliquely connected to the bus line from each gate electrode instead of the common gate wiring as in each embodiment. Good.

  In addition, although the drain pads 8 and 18 are formed in an L shape, as shown in FIG. 7, electrode connection regions 28a and 28a ′ connected to the drain electrodes and external connection regions for connecting to the outside. 28b and connection portions 28c and 28c ′ for connecting the electrode connection regions 28a and 28a ′ to the external connection region 28b may be formed. With such a structure, the drain pad area can be reduced, and the capacitance component can be reduced.

  In these embodiments, a SiC substrate is used, but the substrate is not particularly limited, and a GaN layer may be formed on the SiC substrate, and a compound semiconductor substrate such as a GaAs substrate may be used. it can.

  Such a configuration can be applied to HEMT (High Electron Mobility Transistor), MESFET (Metal Semiconductor Field Effect Transistor), MISFET (Metal Insulator Semiconductor, etc.).

  In addition, this invention is not limited to embodiment mentioned above. Various other modifications can be made without departing from the scope of the invention.

FIG. 3 is a plan view of an electrode cell according to one embodiment of the present invention. The layout of the cell of FIG. The figure which shows the conventional electrode arrangement | positioning. FIG. 3 is a plan view of an electrode cell according to one embodiment of the present invention. The arrangement | positioning figure of the cell of FIG. The figure which shows the conventional electrode arrangement | positioning. FIG. 9 illustrates a shape of a drain pad in one embodiment of the present invention.

Explanation of symbols

  1, 1 ', 11, 11' ... gate electrode, 2, 2 ', 12, 12' ... gate wiring, 3, 3 ', 13, 13' ... source electrode, 4, 4 ', 14, 14' ... drain Electrode 5, 5 ', 15, 15' ... cell, 6, 6 ', 16, 16' ... bus line, 7, 17 ... gate pad, 8, 18 ... drain pad, 9, 19 ... contact, 10, 10 '... source pad, 28a, 28a' ... electrode connection region, 28b ... external connection region, 28c, 28c '... connection portion

Claims (6)

A plurality of cells composed of a predetermined number of gate electrodes formed on a semiconductor substrate and source and drain electrodes formed alternately with each gate electrode interposed therebetween,
The semiconductor device is characterized in that the cell is shifted with respect to other adjacent cells. A gate wiring connecting a predetermined number of the gate electrodes in the cell;
A gate pad for external connection;
The gate pad is connected to the gate wiring and includes a bus line provided for each cell,
The semiconductor device according to claim 1, wherein the bus lines have the same length.   3. The semiconductor device according to claim 1, wherein the cell is arranged to be shifted in a gate width direction of the gate electrode. When the cell is a first cell, and among the other neighboring cells, the cell connected to the gate pad connected to the first cell is a second cell,
3. The semiconductor device according to claim 2, further comprising a drain pad connected to the drain electrode of the first cell and the drain electrode of the second cell. When a cell connected to a gate pad different from the gate pad connected to the first cell among the other adjacent cells is a third cell,
The semiconductor device according to claim 4, wherein at least a part of the drain pad is disposed between the second cell and the third cell.   The semiconductor device according to claim 4, wherein the drain pad is connected to the drain electrode of the first cell and the drain electrode of the second cell at equal distances.

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